CN104600015A - Chip conveying device - Google Patents
Chip conveying device Download PDFInfo
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- CN104600015A CN104600015A CN201510073744.0A CN201510073744A CN104600015A CN 104600015 A CN104600015 A CN 104600015A CN 201510073744 A CN201510073744 A CN 201510073744A CN 104600015 A CN104600015 A CN 104600015A
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- chip
- rotating disk
- pick
- station
- transmitting device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
Abstract
The invention provides a chip conveying device comprising a chip circular conveying mechanism, a first chip fetching and arranging mechanism, a second chip fetching and arranging mechanism and a detecting mechanism. The chip circular conveying mechanism comprises a rotary disc and a drive motor driving the rotary disc to rotate; the rotary disc is provided with a plurality of stations for accommodating chips; a chip arranged in a first position of one station is moved to a second position from the first position through the rotation of the rotary disc; the first chip fetching and arranging mechanism is used for fetching and arranging a chip into the first position of the station of the rotary disc; the second chip fetching and arranging mechanism is used for fetching the chip in the second position of the station of the rotary disc; the detecting mechanism is used for detecting whether the surface of the chip of the chip circular conveying mechanism has defects or not. The chip conveying device is capable of implementing long-distance precision chip conveying and improving the conveying efficiency of chips.
Description
Technical field
The present invention relates to field of semiconductor package, especially relate to a kind of chip transmitting device.
Background technology
Along with developing rapidly of global electronic information technology, chip package increasing market is large, and market competition is also more and more fierce, improves packaging efficiency and becomes the important means that a lot of encapsulation enterprise seizes market.The large wafer last time can do more chip, and in order to improve chip package efficiency, large wafer is more and more appears at encapsulation market.Nowadays semiconductor packages has entered 12 cun of epoch, will occur 18 cun of sealed in units future.Developing rapidly of large wafer proposes challenge to existing Electronic Encapsulating Technology, and one of them topmost difficult problem is exactly the remote precise delivery of chip.When order the first two workbench is apart from each other, adopt leading screw or the linear electric motors mode of long-distance transportation.Remote chip operation technique is widely used in electronic packaging industry production, for realizing harmless precise delivery and the bonding of IC chip, as sealed in units such as die Bonder, arranging machine and flip-chips.Remote chip transmission operation is a critical process process in Electronic Packaging, and the efficiency of transmission operation directly has influence on the efficiency of sealed in unit.
Summary of the invention
In order to the remote precise delivery of chip can be realized, improve the efficiency of transmission of chip, the invention provides a kind of chip transmitting device.
To achieve these goals, the invention provides a kind of chip transmitting device, wherein, this chip transmitting device comprises:
Chip circle transmission mechanism, described chip circle transmission mechanism comprises: rotating disk and the drive motors driving described rotating disk to rotate, and described rotating disk is provided with multiple station for chip placement; By the rotation of described rotating disk, the chip on a station disposed therein moves to second position from first position;
First chip pick-and-place mechanism, is placed on the station described rotating disk being positioned at described first position after pick-up chip by described chip;
Second chip pick-and-place mechanism, takes out for the chip that will described rotating disk be positioned on the station of described second position;
For detecting the whether defective chip detecting system in surface of the described chip in described chip circle transmission mechanism.
Optionally, described chip transmitting device also comprises table mechanism, described table mechanism comprises loading working table and blankers' station, wherein, described first chip pick-and-place mechanism is placed on described rotating disk after pick-up chip described loading working table, and the chip picked up from described rotating disk is placed in described blankers' station by described second chip pick-and-place mechanism.
Optionally, described chip transmitting device also comprises: after on the station described chip being placed on described rotating disk, in the rotation process of described rotating disk, to the heating module that described chip heats, described heating module is positioned at the periphery of described rotating disk.
Optionally, the mode of heating of described heating module is radiant heating pattern or direct mode of heating.
Optionally, described chip circle transmission mechanism also comprises: for the motor fixing seat of fixing described drive motors; For connecting the motor connecting axle of described drive motors and described rotating disk; For the rotating disk holder of fixing described rotating disk; And between described rotating disk holder and described rotating disk, for supporting bearing that described rotating disk rotates, for the bearing inner race retainer ring of fixing described bearing inner race and the bearing outer ring retainer ring for fixing described bearing outer ring.
Optionally, described chip circle transmission mechanism also comprises vacuum suction structure, described vacuum suction structure comprises multiple vacuum tube joint, described multiple vacuum tube joint is positioned on the outer circumference surface of described rotating disk, and multiple vacuum tube joint is corresponding one by one with the station on described rotating disk, by described vacuum tube joint, described station adopts vacuum suction mode to fix described chip.
Optionally, described vacuum suction structure also comprises: for the swivel joint be connected with vacuum generating device, and described swivel joint is positioned at the below of described rotating disk, and described swivel joint is synchronous with the velocity of rotation of described rotating disk; The multiple vacuum be connected with described swivel joint by vacuum tube divide pipeline connector, be arranged at the position between described rotating disk and described swivel joint, and described multiple vacuum divides pipeline connector also by connection that vacuum tube is corresponding one by one with described multiple vacuum tube joint.
Optionally, described first chip pick-and-place mechanism and described second chip pick-and-place mechanism include: for picking up the swing arm of described chip, the one end for picking up described chip in described swing arm is provided with vacuum absorption device; Described swing arm is driven to make the electric rotating machine of crankmotion and drive described swing arm to make the linear electric motors pumped; The shaft coupling be connected with described swing arm and described electric rotating machine respectively, wherein, described electric rotating machine controls described swing arm by described shaft coupling and does rotary reciprocating motion; First base, described swing arm, described shaft coupling and described electric rotating machine are assembled on described first base; Second base, is arranged on described second base wherein said first base sliding, and described linear electric motors, by controlling described first base relative to described second base sliding, control described swing arm and pump.
Optionally, described first chip pick-and-place mechanism and described second chip pick-and-place mechanism include: X direction guiding rail; On described X direction guiding rail, the X of movement is to motion holder; Be positioned at described X to the Z-direction pick-up head on motion holder, described Z-direction pick-up head is provided with vacuum absorption device for the one end of picking up described chip, described Z-direction pick-up head can move along Z-direction in kinematic nest at described X.
Optionally, described chip detecting system comprises: for detecting the position of described chip on described rotating disk, the upper surface of angular deflection and described chip whether defectively overlooks camera, described in overlook the top that camera is positioned at the station described rotating disk being in first position; Whether defective left detection camera, right detection camera, front detection camera and rear detection camera on the side surface detecting described chip, the view-finder of described left detection camera and the view-finder of right detection camera are oppositely arranged and all towards the 3rd position, the view-finder of described front detection camera and the view-finder of rear detection camera are oppositely arranged and all towards described 3rd position, wherein, described 3rd position is the position on described rotating disk.
Optionally, described rotating disk is discoid rotating disk or polygon-shaped rotating disk.
The invention has the beneficial effects as follows:
Chip transmitting device provided by the invention, together with chip circle transmission mechanism, the first chip pick-and-place mechanism, the second chip pick-and-place mechanism are matched with chip detecting system, in the process of chip transmitting device transmission chip, first chip pick-and-place mechanism is placed on rotating disk after being picked up by chip and is positioned on the station of first position, drive motors drives rotating disk to rotate, when chip turns to second position with rotating disk, chip takes out from rotating disk by the second chip pick-and-place mechanism; In the process that chip rotates with rotating disk, the surface of chip detecting system to chip is detected, and checks the surface whether defectiveness of chip.The first chip pick-and-place mechanism in chip transmitting device, chip circle transmission mechanism and the second chip pick-and-place mechanism, make multiple chip can rotate together along with rotating disk, improve the efficiency of transmission of chip; Chip detecting system makes this chip transmitting device have chip detection function, has adapted to the encapsulation of high-end chip.
Accompanying drawing explanation
Fig. 1 represents the structural representation of the front view of embodiments of the invention chips transmitting device;
Fig. 2 represents the structural representation of the vertical view of embodiments of the invention chips transmitting device;
Fig. 3 represents the structural representation of embodiments of the invention chips circle transmission mechanism;
Fig. 4 represents one of structural representation of the first chip pick-and-place mechanism and the second chip pick-and-place mechanism in embodiments of the invention;
Fig. 5 represents the structural representation two of the first chip pick-and-place mechanism and the second chip pick-and-place mechanism in embodiments of the invention; And
Fig. 6 represents the structural representation of rotating disk in embodiments of the invention chips transport sector.
Wherein in figure: 1, rotating disk; 2, drive motors; 3, frame; 4, the first chip pick-and-place mechanism; 5, the second chip pick-and-place mechanism; 6, camera is overlooked; 7, left detection camera; 8, right detection camera; 9, front detection camera; 10, rear detection camera; 11, loading working table; 12, blankers' station; 13, heating module; 14, motor fixing seat; 15, motor connecting axle; 16, rotating disk holder; 17, bearing; 18, bearing inner race retainer ring; 19, bearing outer ring retainer ring; 20, vacuum tube joint; 21, swivel joint; 22, vacuum divides pipeline connector; 23, swivel joint holder; 24, base; 25, swing arm; 26, electric rotating machine; 27, linear electric motors; 28, shaft coupling; 29, the first base; 30, the second base; 31, X direction guiding rail; 32, X is to motion holder; 33, Z-direction pick-up head; 34, X is to straight-line guide rail slide block; 35, X is to linear motor rotor; 36, X is to linear motor stator electric; 37, Z-direction straight-line guide rail slide block; 38, Z-direction linear motor rotor; 39, Z-direction line slideway; 40, Z-direction linear motor stator electric.
Embodiment
Below with reference to accompanying drawings exemplary embodiment of the present disclosure is described in more detail.Although show exemplary embodiment of the present disclosure in accompanying drawing, however should be appreciated that can realize the disclosure in a variety of manners and not should limit by the embodiment set forth here.On the contrary, provide these embodiments to be in order to more thoroughly the disclosure can be understood, and complete for the scope of the present disclosure can be conveyed to those skilled in the art.
As depicted in figs. 1 and 2, in one embodiment of the invention, chip transmitting device comprises chip circle transmission mechanism, the first chip pick-and-place mechanism 4, second chip pick-and-place mechanism 5 and chip detecting system.Wherein, chip circle transmission mechanism mainly realizes the long-distance transmissions of chip, it is the major part of whole chip transmitting device, the drive motors 2 that this chip circle transmission mechanism mainly comprises rotating disk 1 and drives rotating disk 1 to rotate, concrete, chip circle transmission mechanism can be fixed in stable frame 3.
Chip can be carried out the movement of X-direction and Y-direction in horizontal plane by the first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5, the movement of Z-direction and the rotary motion of self on vertical plane, wherein, first chip pick-and-place mechanism 4 is for being placed on station rotating disk 1 being positioned at first position by chip after pick-up chip, second chip pick-and-place mechanism 5 takes out for the chip that will rotating disk 1 be positioned on the station of second position, concrete, in order to improve the efficiency of transmission of chip circle transmission mechanism, first position and second position can be two positions at the diameter two ends of rotating disk 1, namely rotating disk 1 rotates to the second place after primary importance revolves turnback, put to make the first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 to pick up firmly, accurately to chip, the first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 all have Incision Machine's.
The surface of the chip of chip detecting system in detection chip circle transmission mechanism whether defectiveness, concrete, chip detecting system can comprise overlooks camera 6, left detection camera 7, right detection camera 8, five cameras such as front detection camera 9 and rear detection camera 10, wherein, overlook the top that camera 6 can be positioned at station rotating disk 1 being in first position, when chip to be placed on station rotating disk 1 being positioned at first position by the first chip pick-and-place mechanism 4, overlooking camera 6 not only can the position of detection chip on rotating disk 1 and angular deflection situation, the upper surface of detection chip whether can also have defect, if the upper surface defectiveness of chip detected, then using this chip as waste chips process, the view-finder of left detection camera 7 and the view-finder of right detection camera 8 are oppositely arranged and all towards the 3rd position, the view-finder of front detection camera 9 and the view-finder of rear detection camera 10 are oppositely arranged and all towards the 3rd position, and the 3rd position is the position on rotating disk 1, namely on rotating disk 1, the two ends of the circumferentially perpendicular diameter of a position are respectively fixed with left detection camera 7, right detection camera 8, front detection camera 9 and rear detection camera 10, when the station rotary being placed with chip is to primary importance, left detection camera 7, right detection camera 8, the left surface of front detection camera 9 and rear detection camera 10 difference detection chip, right surface, front surface and rear surface whether defectiveness.
Concrete, chip transmitting device can also comprise table mechanism and heating module 13.Wherein, table mechanism comprises loading working table 11 and blankers' station 12, and loading working table 11 can be used for placing LED or IC chip, and chip can, after pick-up chip loading working table 11, be placed on rotating disk 1 by the first chip pick-and-place mechanism 4; Blankers' station 12 can be used for placing wafer, substrate or lead frame, and the chip that the second chip pick-and-place mechanism 5 can pick up from rotating disk 1 is placed in blankers' station 12; Preferably, conveniently the first chip pick-and-place mechanism 4 from pick-up chip loading working table 11 and conveniently the second chip pick-and-place mechanism 5 by pickup after chip be placed in blankers' station 12, loading working table 11 and blankers' station 12 are all fixed in frame 3, and the working face of the working face of loading working table 11, blankers' station 12 and the working face of rotating disk 1 are in same level.Heating module 13 in the transmitting procedure of chip, can heat the chip be placed on rotating disk 1, and heating-up temperature can reach 300 DEG C; In order to improve the utilance of heating module 13, heating module 13 can be fixed in the frame 3 of the periphery of rotating disk 1, and the mode of heating of heating module 13 can be radiant heating pattern or direct mode of heating, wherein, radiant heating pattern is, by by heat radiation to the chip on rotating disk 1, chip is heated; Direct mode of heating is utilize heating source to heat the chip on rotating disk 1.
Fig. 3 is in embodiments of the invention, the structural representation of described chip circle transmission mechanism, in one embodiment of the invention, chip circle transmission mechanism also comprises motor fixing seat 14, motor connecting axle 15, rotating disk holder 16, bearing 17, bearing inner race retainer ring 18 and bearing outer ring retainer ring 19.Wherein, motor fixing seat 14 is connected with drive motors 2, plays the effect of fixed drive motor 2, and preferably, motor fixing seat 14 is positioned at the below of drive motors 2; Motor connecting axle 15 is connected with rotating disk 1 with drive motors 2 respectively, plays the effect of connection; Rotating disk holder 16 is connected with rotating disk 1, plays the effect of fixing rotating disk 1, and preferably, rotating disk holder 16 is positioned at the below of rotating disk 1; Bearing 17, between rotating disk holder 16 and rotating disk 1, plays the effect supporting rotating disk 1 and rotate, and reduces frictional resistance when rotating disk 1 rotates; Bearing inner race retainer ring 18 and bearing outer ring retainer ring 19 lay respectively at inner ring and the outer ring of bearing 17, serve the effect of rigid bearing inner ring and bearing outer ring respectively.
Continue see Fig. 3, chip circle transmission mechanism also comprises vacuum adsorption mechanism, and this vacuum adsorption mechanism comprises multiple vacuum tube joint 20, swivel joint 21 and multiple vacuum and divides pipeline connector 22.Wherein, multiple vacuum tube joint 20 is positioned on the outer circumference surface of rotating disk 1, and multiple vacuum tube joint 20 is corresponding one by one with the station on rotating disk 1, and by vacuum tube joint 20, station adopts vacuum suction mode fixed chip, swivel joint 21 is positioned at the below of rotating disk 1, vacuum divides the position of pipeline connector 22 between rotating disk 1 and swivel joint 21, one end of swivel joint 21 is connected with vacuum generating device, the other end divides pipeline connector 22 to be connected by vacuum tube and multiple vacuum, and multiple vacuum divides pipeline connector 22 by the vacuum tube connection corresponding one by one with multiple vacuum tube joint 20, concrete, rotate together with rotating disk 1 with the vacuum tube of vacuum tube joint 20 to make to connect swivel joint 21, one end that swivel joint 21 is connected with vacuum generating device is fixed, one end that swivel joint 21 is connected with multiple vacuum tube joint 20 can be rotated, and divide the vacuum tube of pipeline connector 22 can rotate together with rotating disk 1 to make to connect swivel joint 21 with multiple vacuum, swivel joint 21 is synchronous with the velocity of rotation of rotating disk 1, preferably, swivel joint 21 can be fixed on swivel joint holder 23, a base 24 can also be set in the below of swivel joint holder 23, play the effect supporting whole chip circle transmission mechanism, same, base 24 can be fixed in frame 3.
In the process that the rotating disk 1 being placed with chip rotates, vacuum generating device works, by swivel joint 21, extract and be connected with swivel joint 21 and vacuum divides pipeline connector 22, vacuum divides air in the vacuum tube of pipeline connector 22 and vacuum tube joint 20, make the station place corresponding with vacuum tube joint 20 produce suction, thus the chip at station place on rotating disk 1 is fixed in absorption.In the process, namely can control separately each the road vacuum passage communicated with station, also can control all vacuum passages simultaneously.
Be the schematic diagram of the first enforcement structure of the first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 in the present invention as Fig. 4, in the present embodiment, the first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 can be rotary swinging arm formula.In the present embodiment, the first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 include swing arm 25, electric rotating machine 26, linear electric motors 27, shaft coupling 28, first base 29 and the second base 30.Wherein, electric rotating machine 26 is connected with swing arm 25 by shaft coupling 28, and swing arm 25, shaft coupling 28 and electric rotating machine 26 are assembled on the first base 29, and electric rotating machine 26 can control swing arm 25 by shaft coupling 28 and do crankmotion; What the first base 29 slided is arranged on the second base 30, and linear electric motors 27 are slided relative to the second base 30 by control first base 29, thus control swing arm 25 pumps.Preferably, in order to make the swing arm 25 carrying chip in the process of rotating, chip can not be made to drop, and the one end for pick-up chip in swing arm 25 is provided with vacuum absorption device, and this vacuum absorption device can make swing arm 25 firmly can adsorb chip.
Be the schematic diagram of the second enforcement structure of the first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 in the present invention as Fig. 5, in the present embodiment, the first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 can be straight line driving.First chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 include X direction guiding rail 31, X to motion holder 32 and Z-direction pick-up head 33.Wherein, X can do linear reciprocating motion to motion holder 32 on X direction guiding rail 31; Preferably, X can be fixed with to the below of motion holder 32 to straight-line guide rail slide block 34 and X to linear motor rotor 35 at X, X is combined with X to linear motor stator electric 36 to linear motor rotor 35, concrete, X to straight-line guide rail slide block 34 X to linear motor rotor 35 and X under the cooperation of linear motor stator electric 36, drive X do straight reciprocating motion to motion holder 32.Z-direction pick-up head 33 is positioned at X on motion holder 32; Preferably, Z-direction pick-up head 33 is connected with Z-direction straight-line guide rail slide block 37 and Z-direction linear motor rotor 38, on motion holder 32, Z-direction line slideway 39 is provided with at X, Z-direction linear motor rotor 38 is combined with Z-direction linear motor stator electric 40, concrete, Z-direction straight-line guide rail slide block 37, under the cooperation of Z-direction linear motor rotor 38 and Z-direction linear motor stator electric 40, drives Z-direction pick-up head 33 on motion holder 32, to do Z-direction straight reciprocating motion at X; Preferably, in order to make the Z-direction pick-up head 33 carrying chip in the process of motion, chip can not be made to drop, and the one end for pick-up chip on Z-direction pick-up head 33 is provided with vacuum absorption device, and this vacuum absorption device can make Z-direction pick-up head 33 firmly can adsorb chip.
As the structural representation that Fig. 6 is rotating disk 1 in embodiments of the invention chips transport sector, in the present embodiment, rotating disk 1 can be disc-like transport sector also can be other polygon circle transmission mechanisms.
Below, the course of work of whole chip transmitting device is made an explanation.
In the process of chip transport sector transmission chip, drive motors 2 drives rotating disk 1 to rotate, first chip pick-and-place mechanism 4 is after pick-up chip loading working table 11, being positioned over by chip on rotating disk 1 is positioned on a station of first position, now, whether defectiveness detects for the position overlooking camera 6 pairs of chips in chip detecting system, angle and upper surface, if the upper surface defectiveness of chip, then this chip is as waste chips process, if the upper surface of this chip does not have defect, then this chip rotates together along with rotating disk 1.In the process of rotating together along with rotating disk 1 at chip, on the one hand, vacuum generating device works, and by swivel joint 21, extract and be connected with swivel joint 21 and vacuum divides pipeline connector 22, vacuum divides air in the vacuum tube of pipeline connector 22 and vacuum tube joint 20, the station place corresponding with vacuum tube joint 20 is made to produce suction, the chip at station place on fixing rotating disk 1, in the process, namely each the road vacuum passage communicated with station can be controlled separately, also all vacuum passages can be controlled simultaneously, on the other hand, when station rotary rotating disk 1 being adsorbed with chip is to the 3rd position, left detection camera 7 in chip detecting system, right detection camera 8, front detection camera 9 and rear detection camera 10 are respectively to the left surface of chip, right surface, front surface and rear surface are detected, same, if one of them surperficial defectiveness, then this chip is as waste chips process, if all surface does not all have defect, then this chip is rotated further along with rotating disk 1, until when this station rotary is to second position, chip picks up from station by the second chip pick-and-place mechanism 5, till when being placed in blankers' station 12, wherein, the second chip pick-and-place mechanism 5 by chip from station pickup before, heating module 13 pairs of chips heat.
The present invention, by chip circle transmission mechanism, the first chip pick-and-place mechanism and the second chip pick-and-place mechanism being combined, significantly improves the efficiency of transmission of chip, and ensure that the remote transmission precision of chip; Meanwhile, in the process of chip transmission, heating module heats chip, shortens the packaging time of hot type chip, improves production efficiency; In addition, by the chip detecting system be made up of five cameras, make this chip transmitting device have chip multiaspect measuring ability, adapt to the encapsulation of high-end chip.
Above-described is the preferred embodiment of the present invention; should be understood that the ordinary person for the art; can also make some improvements and modifications not departing under principle prerequisite of the present invention, these improvements and modifications are also in protection scope of the present invention.
Claims (11)
1. a chip transmitting device, is characterized in that, comprising: chip circle transmission mechanism, and described chip circle transmission mechanism comprises: rotating disk and the drive motors driving described rotating disk to rotate, and described rotating disk is provided with multiple station for chip placement; By the rotation of described rotating disk, the chip on a station disposed therein moves to second position from first position;
First chip pick-and-place mechanism, is placed on the station described rotating disk being positioned at described first position after pick-up chip by described chip;
Second chip pick-and-place mechanism, takes out for the chip that will described rotating disk be positioned on the station of described second position;
For detecting the whether defective chip detecting system in surface of the described chip in described chip circle transmission mechanism.
2. chip transmitting device according to claim 1, it is characterized in that, described chip transmitting device also comprises table mechanism, described table mechanism comprises loading working table and blankers' station, wherein, described first chip pick-and-place mechanism is placed on described rotating disk after pick-up chip described loading working table, and the chip picked up from described rotating disk is placed in described blankers' station by described second chip pick-and-place mechanism.
3. chip transmitting device according to claim 1, it is characterized in that, described chip transmitting device also comprises: after on the station described chip being placed on described rotating disk, in the rotation process of described rotating disk, to the heating module that described chip heats, described heating module is positioned at the periphery of described rotating disk.
4. chip transmitting device according to claim 3, is characterized in that, the mode of heating of described heating module is radiant heating pattern or direct mode of heating.
5. chip transmitting device according to claim 1, is characterized in that, described chip circle transmission mechanism also comprises:
For the motor fixing seat of fixing described drive motors;
For connecting the motor connecting axle of described drive motors and described rotating disk;
For the rotating disk holder of fixing described rotating disk; And
Between described rotating disk holder and described rotating disk, for supporting bearing that described rotating disk rotates, for the bearing inner race retainer ring of fixing described bearing inner race and the bearing outer ring retainer ring for fixing described bearing outer ring.
6. chip transmitting device according to claim 1, it is characterized in that, described chip circle transmission mechanism also comprises vacuum suction structure, described vacuum suction structure comprises multiple vacuum tube joint, described multiple vacuum tube joint is positioned on the outer circumference surface of described rotating disk, and multiple vacuum tube joint is corresponding one by one with the station on described rotating disk, by described vacuum tube joint, described station adopts vacuum suction mode to fix described chip.
7. chip transmitting device according to claim 6, is characterized in that, described vacuum suction structure also comprises:
For the swivel joint be connected with vacuum generating device, described swivel joint is positioned at the below of described rotating disk, and described swivel joint is synchronous with the velocity of rotation of described rotating disk;
The multiple vacuum be connected with described swivel joint by vacuum tube divide pipeline connector, be arranged at the position between described rotating disk and described swivel joint, and described multiple vacuum divides pipeline connector also by connection that vacuum tube is corresponding one by one with described multiple vacuum tube joint.
8. chip transmitting device according to claim 1, is characterized in that, described first chip pick-and-place mechanism and described second chip pick-and-place mechanism include:
For picking up the swing arm of described chip, the one end for picking up described chip in described swing arm is provided with vacuum absorption device;
Described swing arm is driven to make the electric rotating machine of crankmotion and drive described swing arm to make the linear electric motors pumped;
The shaft coupling be connected with described swing arm and described electric rotating machine respectively, wherein, described electric rotating machine controls described swing arm by described shaft coupling and does rotary reciprocating motion;
First base, described swing arm, described shaft coupling and described electric rotating machine are assembled on described first base;
Second base, is arranged on described second base wherein said first base sliding, and described linear electric motors, by controlling described first base relative to described second base sliding, control described swing arm and pump.
9. chip transmitting device according to claim 1, is characterized in that, described first chip pick-and-place mechanism and described second chip pick-and-place mechanism include:
X direction guiding rail;
On described X direction guiding rail, the X of movement is to motion holder;
Be positioned at described X to the Z-direction pick-up head on motion holder, described Z-direction pick-up head is provided with vacuum absorption device for the one end of picking up described chip, described Z-direction pick-up head can move along Z-direction in kinematic nest at described X.
10. chip transmitting device according to claim 1, is characterized in that, described chip detecting system comprises:
For detecting the position of described chip on described rotating disk, the upper surface of angular deflection and described chip whether defectively overlooks camera, described in overlook the top that camera is positioned at the station described rotating disk being in first position;
Whether defective left detection camera, right detection camera, front detection camera and rear detection camera on the side surface detecting described chip, the view-finder of described left detection camera and the view-finder of right detection camera are oppositely arranged and all towards the 3rd position, the view-finder of described front detection camera and the view-finder of rear detection camera are oppositely arranged and all towards described 3rd position, wherein, described 3rd position is the position on described rotating disk.
11. chip transmitting devices according to claim 1, is characterized in that, described rotating disk is discoid rotating disk or polygon-shaped rotating disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510073744.0A CN104600015B (en) | 2015-02-11 | 2015-02-11 | A kind of chip transmitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510073744.0A CN104600015B (en) | 2015-02-11 | 2015-02-11 | A kind of chip transmitting device |
Publications (2)
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Cited By (10)
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| CN105261581A (en) * | 2015-11-20 | 2016-01-20 | 王敕 | Chip packaging equipment suitable for 12inch wafer |
| CN106005991A (en) * | 2016-06-23 | 2016-10-12 | 吴天宝 | IC material disc conveying device |
| CN106373914A (en) * | 2016-11-10 | 2017-02-01 | 北京中电科电子装备有限公司 | Chip bonding device |
| CN106711079A (en) * | 2017-02-24 | 2017-05-24 | 爱立发自动化设备（上海）有限公司 | Picking and placing device |
| CN108766909A (en) * | 2018-05-24 | 2018-11-06 | 上海集成电路研发中心有限公司 | The device and method of dew condensation phenomenon in a kind of improvement cryogenic implantation |
| CN109516179A (en) * | 2018-11-09 | 2019-03-26 | 青岛时间河智能科技有限公司 | Film automatic charging device and the automatic deflesher of rubber plug |
| CN109545732A (en) * | 2018-12-13 | 2019-03-29 | 天津力矩自动化科技有限公司 | A kind of negative pressure structure for chip arranging machine |
| CN110625832A (en) * | 2019-09-16 | 2019-12-31 | 武汉新芯集成电路制造有限公司 | Wafer cutting device and wafer cutting method |
| CN111383972A (en) * | 2018-12-29 | 2020-07-07 | 上海微电子装备（集团）股份有限公司 | Bonding device and bonding method |
| WO2021026957A1 (en) * | 2019-08-09 | 2021-02-18 | 苏州艾科瑞思智能装备股份有限公司 | High-precision large panel-level micro-assembly device |
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| CN101852687A (en) * | 2009-04-03 | 2010-10-06 | 京元电子股份有限公司 | Rotary test module and test system thereof |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105261581A (en) * | 2015-11-20 | 2016-01-20 | 王敕 | Chip packaging equipment suitable for 12inch wafer |
| CN105261581B (en) * | 2015-11-20 | 2018-11-02 | 王敕 | Chip encapsulating device suitable for 12 cun of wafers |
| CN106005991A (en) * | 2016-06-23 | 2016-10-12 | 吴天宝 | IC material disc conveying device |
| CN106373914B (en) * | 2016-11-10 | 2020-03-24 | 北京中电科电子装备有限公司 | Chip bonding device |
| CN106373914A (en) * | 2016-11-10 | 2017-02-01 | 北京中电科电子装备有限公司 | Chip bonding device |
| CN106711079A (en) * | 2017-02-24 | 2017-05-24 | 爱立发自动化设备（上海）有限公司 | Picking and placing device |
| CN106711079B (en) * | 2017-02-24 | 2020-06-26 | 爱立发自动化设备（上海）有限公司 | Taking and placing device |
| CN108766909A (en) * | 2018-05-24 | 2018-11-06 | 上海集成电路研发中心有限公司 | The device and method of dew condensation phenomenon in a kind of improvement cryogenic implantation |
| CN108766909B (en) * | 2018-05-24 | 2021-05-18 | 上海集成电路研发中心有限公司 | Device and method for improving dew phenomenon in low-temperature ion implantation |
| CN109516179A (en) * | 2018-11-09 | 2019-03-26 | 青岛时间河智能科技有限公司 | Film automatic charging device and the automatic deflesher of rubber plug |
| CN109545732A (en) * | 2018-12-13 | 2019-03-29 | 天津力矩自动化科技有限公司 | A kind of negative pressure structure for chip arranging machine |
| CN111383972A (en) * | 2018-12-29 | 2020-07-07 | 上海微电子装备（集团）股份有限公司 | Bonding device and bonding method |
| WO2021026957A1 (en) * | 2019-08-09 | 2021-02-18 | 苏州艾科瑞思智能装备股份有限公司 | High-precision large panel-level micro-assembly device |
| CN110625832A (en) * | 2019-09-16 | 2019-12-31 | 武汉新芯集成电路制造有限公司 | Wafer cutting device and wafer cutting method |
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