TWI676584B - Chip pick-and-place apparatus and chip pick-and-place and detection system - Google Patents

Abstract

The invention discloses a wafer pick-and-place device and a wafer pick-and-place and detection system. The wafer pick-and-place device includes a rotating component, a plurality of suction components, and a driving component. There is an inclined track on the outer periphery of the rotating component. A plurality of suction components are arranged on the rotating component in a circle, and each of the suction components includes a movable element movably disposed on the rotating component and a suction element movably disposed on the movable element. A mouth element, the movable element moving along the inclined track. A driving component is suspended and adjacent to one of the suction components, and the driving component includes a movable pushing element corresponding to one of the suction components.

Description

Wafer pick-up device and wafer pick-up and detection system

The present invention relates to a pick-and-place device and a transfer system, and in particular to a wafer pick-and-place device and a wafer pick-and-place and detection system that can sequentially and continuously pick and place and transport wafer components.

A wafer is a thin sheet of semiconductor material (for example, silicon) that is used in the manufacture of integrated circuits or various electronic components. Its diameter ranges from several inches to tens of inches. Wafers are used as carriers for microelectronic components. After undergoing processing steps such as photosensitizer coating, exposure, development, etching, penetration, or evaporation, they are finally tested, cut, and packaged to produce integrated circuits or electronic components. . In these processes, wafers need to be fixed, moved, rotated, or flipped in accordance with processing steps. Therefore, in order to meet the process requirements, wafer clamps are provided to hold wafers during processing.

However, in the prior art wafer manufacturing process, a single mechanical wafer holder is used to reciprocate to hold and transport wafers. Therefore, the wafer transport speed is greatly reduced, and the productivity is reduced.

The technical problem to be solved by the present invention is to provide a wafer pick-and-place device and a wafer pick-and-place and detection system in response to the shortcomings of the prior art, so as to solve the lack of existing techniques.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a wafer pick-and-place device, which includes a rotating component, a plurality of suction components, and a driving component. There is an inclined rail on the outer periphery of the rotating component. Multiple suction component rings Each of the suction components includes a movable element movably disposed on the rotary component and a suction nozzle element interlockedly disposed on the movable component. The movable element moves along the inclined track. A driving assembly is adjacent to the rotating assembly, and the driving assembly includes a movable pushing element.

Preferably, the rotation component includes a base element, a rotation element, and a heat dissipation element. The inclined rail is provided on an outer periphery of the base member. A rotating element is rotatably disposed in the base element, and a plurality of the suction components are disposed around the rotating element. A heat radiating element is provided on the rotating element. The heat radiating element has a groove portion and a penetrating channel. One end of the penetrating channel is connected to an external air end, and the other end of the penetrating channel is in communication with the groove portion.

Preferably, each of the nozzle elements includes a suction member movably disposed on the movable member, an abutment member sleeved on the suction member, and a penetrating member connected to the rotating member and connected to the rotating member. The transfer member of the suction member is described. Wherein, the suction member corresponding to the nozzle element of the groove portion communicates with the groove portion through the transmission member.

Preferably, each of the suction components further includes a reset member disposed on the movable element, the reset member has a plurality of elastic members, the suction member is penetrated through the reset member, and the receiving member A member is disposed in the reset member and is abutted by a plurality of the elastic members.

Preferably, each of the movable elements includes a movable member movably disposed on the rotating component, an element main body fixed on the movable element, and slidably disposed on the inclined body fixed on the element main body. A linking member on a rail-like track; wherein the wafer pick-and-place device further includes a first heat driving component suspended from the heat dissipating element and a second heat driving component adjacent to the drive component.

Preferably, the movable pushing element pushes against the suction component adjacent to the driving component.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a wafer pick-up and detection system, which includes a carrier device and a wafer pick-and-place system. Device and detection device. The carrying device carries at least one wafer element. The wafer pick-and-place device is adjacent to the carrier device. The wafer pick-and-place device includes a rotating component, a plurality of suction components, and a driving component. There is an inclined rail on the outer periphery of the rotating component. A plurality of suction components are arranged on the rotary component in a circle, and each of the suction components includes a movable element movably disposed on the rotary component and a nozzle element interlockedly disposed on the movable element. , The movable element moves along the inclined track. A driving assembly is adjacent to the rotating assembly, and the driving assembly includes a movable pushing element. The detection device is adjacent to the wafer pick-and-place device. Wherein, at least one of the wafer components is transported by the wafer pick-and-place device to move from the carrier device to the detection device.

Preferably, the rotation component includes a base element, a rotation element, and a heat dissipation element. The slanted track is provided circumferentially on the outer periphery of the base element. A rotating element is rotatably disposed in the base element, and a plurality of the suction components are disposed around the rotating element. A heat radiating element is provided on the rotating element. The heat radiating element has a groove portion and a penetrating channel. One end of the penetrating channel is connected to an external air end, and the other end of the penetrating channel is in communication with the groove portion.

Preferably, each of the nozzle elements includes a suction member movably disposed on the movable element, an abutment member sleeved on the suction member, and a penetrating member connected to the rotating member and connected to the rotating member. Transfer of suction parts. Wherein, the suction member corresponding to the nozzle element of the groove portion communicates with the groove portion through the transmission member.

Preferably, each of the suction components further includes a reset member disposed on the movable element, the reset member has a plurality of elastic members, the suction member is penetrated through the reset member, and the receiving member A member is disposed in the reset member and is abutted by a plurality of the elastic members.

Preferably, each of the movable elements includes a movable member movably disposed on the rotating component, an element main body fixed on the movable element, and slidably disposed on the inclined body fixed on the element main body. Link on the orbit; The wafer pick-and-place device further includes a first driving component suspended from the heat dissipating element and a second driving component adjacent to the driving component.

Preferably, the movable pushing element pushes against the suction component adjacent to the driving component.

The beneficial effect of the present invention is that the wafer pick-and-place device and the wafer pick-and-place and detection system provided by the present invention can pass “a plurality of sucking components can be movably arranged on the rotating component” and “the driving component includes corresponding and can drive One of them is a "movable push-to-actuate component" solution to increase the speed and throughput of wafers.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

S‧‧‧Chip Pick and Place and Inspection System

1‧‧‧ bearing device

10‧‧‧Chip Components

2‧‧‧Chip pick and place device

20‧‧‧Rotary components

200‧‧‧ inclined track

201‧‧‧ base element

202‧‧‧Rotating element

203‧‧‧Cooling element

2030‧‧‧Groove part

2031‧‧‧through channel

21‧‧‧ Suction component

210‧‧‧movable components

2100‧‧‧Event

2101‧‧‧Element body

2102‧‧‧ Linkage

211‧‧‧Nozzle element

2110‧‧‧Pump

2110A‧‧‧Nozzle

2111‧‧‧ Arrivals

2112‧‧‧Transmission

212‧‧‧Reset member

2120‧‧‧Elastic piece

22‧‧‧Driver

220‧‧‧ movable push element

23‧‧‧First drive assembly

24‧‧‧Second drive component

3‧‧‧Detection device

4‧‧‧ external support base

41‧‧‧Support Structure

5‧‧‧ external air end

FIG. 1 is a schematic diagram of a first structure of a wafer pick-and-place device according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram of a second structure of the wafer pick-and-place device according to the first embodiment of the present invention.

3 is a schematic diagram of a first structure of a wafer pick-and-place device according to a second embodiment of the present invention.

4 is a schematic diagram of a second structure of a wafer pick-and-place device according to a second embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view of a wafer pick-and-place device according to a third embodiment of the present invention.

FIG. 6 is a schematic structural diagram of a wafer pick-and-place device according to a third embodiment of the present invention.

FIG. 7 is a schematic structural diagram of an embodiment of a wafer pick-and-place and detection system of the present invention.

The following is a description of the implementation of the “wafer pick-and-place device and wafer pick-and-place and detection system” disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. . this invention It can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple and schematic illustrations, and are not drawn according to actual dimensions. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although the terms first, second, third, etc. may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or a signal from another signal. In addition, the term "or" as used herein should, depending on the actual situation, include any one or more of the associated listed items.

[First embodiment]

Please refer to FIG. 1 and FIG. 2, which are a first structural schematic diagram and a second structural schematic diagram of a wafer pick-and-place device according to a first embodiment of the present invention, respectively. As shown in the figure, the wafer pick-and-place device 2 includes a rotation module 20, a plurality of suction modules 21, and a driving module 22. There is an inclined rail 200 on the outer periphery of the rotating assembly 20. A plurality of suction components 21 are arranged on the rotating component 20 in a circle, and each of the suction components 21 includes a movable element 210 movably disposed on the rotating component 20 and a nozzle element 211 disposed on the movable element 210 in tandem. The movable element 210 moves along the inclined rail 200. The driving assembly 22 is adjacent to the rotating assembly 20. The driving assembly 22 includes a movable pushing element 220. Wherein, the movable pushing element 220 pushes against the suction component 21 adjacent to the driving component 22.

Specifically, the wafer pick-and-place device 2 of the present invention includes a rotation module 20, a plurality of suction modules 21, and a driving module 22. The rotating assembly 20 is detachably disposed on an external support base 4, wherein the external support base 4 can be located on any machine in a wafer process. Each suction component 21 can be movably disposed on the outer periphery of the rotation component 20 by the movable member 210 on an inclined rail 200 on the outer periphery of the suction component 21, and is disposed on the rotation component 20 in a circular manner. . While driving The component 22 can be suspended by the supporting structure 41 extended by the external support base 4 and is adjacent to the rotating component 20, and the movable pushing element 220 on the driving component 22 can correspond to one of the suction components 21, wherein the driving component 22 may include a voice coil motor (not shown in the figure), and the movable pushing element 220 is reciprocated by the voice coil motor.

When the wafer pick-and-place device 2 of the present invention executes the operation of obtaining a wafer element 10 (such as a wafer), the rotating component 20 will rotate around its own axis; at the same time, the driving component 22 will also drive the movable pushing component 220 to perform Reciprocate to push against the suction component 21 adjacent to the driving component 22, so that the nozzle element 211 of the suction component 21 obtains the wafer component 10. Further, the rotating component 20 will rotate in a stepwise manner (but not limited to this). Whenever the nozzle element 211 on one of the movable elements 210 corresponds to the movable pushing element 220, the driving component 22 will The movable pushing element 220 is driven to be displaced downward, so that the movable pushing element 220 is pushed against and drives the nozzle element 211 to be displaced downward, so that the nozzle element 211 approaches the carrier device 1 and sucks the wafer on the carrier device 1 Element 10. Then, the driving assembly 22 will drive the movable pushing element 220 to be displaced upward and reset. At this time, the nozzle element 211 is also reset as it is displaced upward, and the operation of obtaining the wafer element 10 is completed. Then, the rotating component 20 will rotate again, so that the other movable component 210 corresponds to the driving component 22, and then another wafer component 10 is obtained. The method for acquiring the wafer element 10 by the nozzle element 211 of the wafer pick-and-place device 2 of the present invention may be a pick-up method, but is not limited thereto.

Thereby, the wafer pick-and-place device 2 of the present invention can be rotated by the rotating assembly 20 and reciprocated by the movable pushing element 220, so that each nozzle element 211 can sequentially suck the wafer element 10 on the carrying device 1. In other words, the plurality of wafer elements 10 on the carrier device 1 are rotated with the rotating assembly 20 and the movable pushing element 220 is reciprocated, and each of the nozzle elements 211 can be sequentially sucked.

In addition, the starting and stopping actions of the rotary assembly 20 and the drive assembly 22 can be controlled by the processing-related components or set by a program; and, the movable pushing element The implementation means that 220 corresponds to one of the nozzle elements 211 will perform reciprocating motion, which can be implemented by programming or detection of a sensing element.

It is worth mentioning that the wafer pick-and-place device 2 of the present invention is not limited to the above examples.

[Second embodiment]

Please refer to FIG. 3 and FIG. 4, which are respectively a first structural schematic diagram and a second structural schematic diagram of a wafer pick-and-place device according to a second embodiment of the present invention, and please refer to FIG. 1 and FIG. 2 together. As shown in the figure, the operations of the same components of the wafer pick-and-place device described in this embodiment are similar to those of the wafer pick-and-place device described in the first embodiment, and are not repeated here. It is worth noting that In the embodiment, the rotating component 20 may preferably include a base element 201, a rotating element 202 and a heat dissipation element 203. An inclined rail 200 is provided on the outer periphery of the base member 201. The rotating element 202 is rotatably disposed in the base element 201, and a plurality of suction components 21 are disposed around the rotating element 202. The heat dissipating element 203 is disposed on the rotating element 202. The heat dissipating element 203 has a groove portion 2030 and a through channel 2031. One end of the through channel 2031 is connected to the external air terminal 5. The other end of the through channel 2031 and the groove portion 2030 communicate with each other.

Further, each nozzle element 211 may preferably include a suction element 2110 movably disposed on the movable element 210, a resisting element 2111 sleeved on the suction element 2110, and a rotating element 202 connected to the suction element. Piece 2110 of the transmission piece 2112. Wherein, the suction member 2110 of the nozzle element 211 corresponding to the groove portion 2030 is communicated with the groove portion 2030 through the transmission member 2112.

For example, the rotating component 20 of the wafer pick-and-place device 2 of the present invention may further include a base element 201, a rotating element 202, and a heat dissipation element 203. The base element 201 may be a general bearing base, and the material is not limited. Among them, the base element 201 may be an independent base, or may be integrated with the external support base 4. The rotating element 202 may be a motor, such as a circular shape. A linear motor or a stepping motor is not limited thereto. The heat dissipation element 203 may be a fin-type heat sink with a ring structure, but is not limited thereto. Base element 201 may have a concave structure for carrying the rotating element 202, wherein a bearing (not shown in the figure) may be further provided between the rotating element 202 and the base element 201; and an outer periphery of the base element 201 is inclined The plurality of suction components 21 can be arranged around the outer periphery of the rotating element 202 and can be movably arranged on the inclined track 200. The heat dissipating element 203 may be disposed on the rotating element 202, and the side of the heat dissipating element 203 may have a recessed portion 2030. The recessed portion 2030 may be disposed in a surrounding manner on a portion of the heat dissipating element 203. The element 203 approaches, but is not limited to, a part of the body of the driving assembly 22; the heat dissipation element 203 also has a through channel 2031, which penetrates the body of the heat dissipation element 203, one end of the through channel 2031 is connected to the external air end 5, and One end communicates with the groove portion 2030. Among them, the heat dissipation element 203 can be fixed through the external air end 5 or the external support base 4, and the base element 201 can be fixed through the external support base 4. Therefore, when the rotation element 202 rotates, the base element 201 and the heat dissipation element 203 Can be stationary.

Furthermore, the nozzle element 211 of the present invention may further include a suction member 2110, a resisting member 2111, and a transmission member 2112. The suction member 2110 and the transmission member 2112 may be tubular structures, and the material is not limited. The suction member 2110 can be movably disposed on the movable element 210, one end of the suction member 2110 has a suction nozzle 2110A, the other end of the suction member 2110 is connected to the transmission member 2112, and the suction member 2110 is further provided with a resisting member 2111. One end of the transmission member 2112 can be connected to the suction member 2110, and the other end of the transmission member 2112 is threaded through the rotating element 202 and selectively communicates with the groove portion 2030.

Therefore, when the wafer pick-and-place device 2 performs the operation of obtaining the wafer element 10, the rotating element 202 rotates in a stepwise manner (but not limited to this) with its own axis as the center, and drives each pick-up assembly 21 together. Displacement. The part of the suction assembly 21 that is moved to the side of the rotation assembly 20 away from the driving assembly 22 does not communicate with the groove portion 2030, so no suction force is generated. When the suction assembly 21 is moved to the side that is closer to the rotation assembly 20, the suction The transmission member 2112 of the module 21 is in communication with the groove portion 2030 of the heat dissipation element 203. Since the through-channel 2031 receives the gas supplied from the external air end 5, the transmission member 2112 and the suction member 2110 form a negative pressure, so that the suction member 2110 produces suction. After the rotating element 202 is rotated and one of the suction components 21 corresponds to the movable pushing element 220, the driving component 22 will drive the movable pushing element 220 to move downward to push against the abutment 2111 and make the abutment 2111 drives the sucking member 2110 to move downward, and drives the sucking member 2110 to approach the carrying device 1, and then allows the sucking member 2110 to suck the wafer element 10 on the carrying device 1 through the suction nozzle 2110A through negative pressure. And when the driving component 22 drives the movable pushing element 220 to be displaced upward, and is reset, the suction nozzle element 211 is also displaced upward to perform reset, and the operation of obtaining the wafer element 10 is completed. Then, the rotation element 202 is rotated again, so that the other pickup component 21 corresponds to the driving component 22, and then another wafer component 10 is obtained.

When the suction component 21 that sucks the wafer component 10 is driven to a specific position by the rotation component 202, for example, the transmission member 2112 of the suction component 21 is not in communication with the groove portion 2030. At this time, the transmission member 2112 cannot receive the external air end 5 The supplied gas causes the gas path to be interrupted, making the suction element 2110 unable to suck the wafer element 10, so that the wafer element 10 can be separated from the suction element 2110 and moved to the detection device 3 (as shown in FIG. 7).

In the above embodiment, a vacuum generator may be provided at one end of the transmission member 2112 and connected to the suction member 2110 through the vacuum generator. Therefore, when the transmission member 2112 communicates with the groove portion 2030, the gas supplied by the external air end 5 Acting on the negative pressure with the vacuum generator, the suction element 2110 generates a suction force. In addition, the suction component 21 can pass through the design of the inclined track 200, and can be in a lower position when it is displaced to the front end of the rotating component 20 (close to the driving component 22); The position (that is, away from the driving component 22) can be at a higher position, and the suction nozzle 2110A will approach and be close to the detection surface of the detection device 3. Therefore, when the suction assembly 21 that sucks the wafer element 10 is driven by the rotation element 202 to move from the front end of the rotation assembly 20 to the rear end position of the rotation assembly 20, since the transmission member 2112 of the suction assembly 21 does not communicate with the groove portion 2030, the suction The piece 2110 does not generate a suction force, so that the wafer element 10 is separated from the suction piece 2110 and displaced to the detection surface of the detection device 3. But this implementation is not limited.

In addition, during the operation of the rotating element 202 described above, the thermal energy generated by the rotating element 202 can be taken away through the heat dissipation element 203 for heat dissipation.

In another preferred implementation aspect of this embodiment, each of the suction components 21 may preferably further include a reset member 212 disposed on the movable member 210. The reset member 212 has a plurality of elastic members 2120, and the suction members 2110 pass through. The resetting member 212 is provided, and the abutment member 2111 is disposed in the resetting member 212 and is abutted by a plurality of elastic members 2120.

That is, each of the suction components 21 of the present invention may further include a reset member 212, which may be disposed on the movable member 210, and the reset member 212 has a plurality of elastic members 2120. The suction member 2110 and the resisting member 2111 can pass through the resetting member 212, and the resisting member 2111 is pushed against by the elastic members 2120. Therefore, after the movable pushing element 220 pushes against the resisting element 2111 and the resisting element 2111 drives the suction element 2110 to move downward, a plurality of elastic members 2120 are indirectly compressed, and the movable pushing element 220 is reset. At this time, since the plurality of elastic members 2120 perform an elongation action by their own elastic restoring force, the resisting member 2111 is pushed by the plurality of elastic members 2120 and then moves upward. Among them, the structure of the resetting member 212 can have a limiting effect on the resisting member 2111 and avoid the excessive falling or rising of the resisting member 2111.

It is worth mentioning that the wafer pick-and-place device 2 of the present invention is not limited to the above examples.

[Third embodiment]

Please refer to FIG. 5 and FIG. 6, which are schematic cross-sectional views and structural diagrams of a wafer pick-and-place device according to a third embodiment of the present invention, and please refer to FIGS. 1 to 4 together. As shown in the figure, the operations of the same components of the wafer pick-and-place device described in this embodiment are similar to those of the wafer pick-and-place device described in the above embodiments, and are not repeated here. It is worth noting that in this implementation, For example, each movable element 210 may preferably include a movable element 2100 movably disposed on the rotating assembly 20, an element main body 2101 fixed on the movable element 2100, and a slidably arranged rail on the element main body 2101. Linking member 2102 on 200; among them, the wafer pick-and-place device 2 preferably further includes a heat sink suspended The first driving component 23 of the component 203 and the second driving component 24 adjacent to the driving component 22.

For example, the movable element 210 of the present invention may further include a movable element 2100, an element main body 2101, and a linking element 2102. The movable member 2100 may be a cross roller guide, but is not limited thereto. The element main body 2101 can be a plate structure. The element main body 2101 can be movably disposed on the rotating element 202 of the rotating assembly 20 through the movable member 2100, and the element main body 2101 is further provided with a linking member 2102, and the linking member 2102 can be movably engaged于 斜 状 梁 200。 In the inclined track 200. Therefore, when the rotating element 202 rotates, the linking element 2102 can gradually rise and fall along with the inclined rail 200, and the movable element 210 can be gradually raised and gradually relative to the rotating element 202 by the setting of the movable element 2100. The lowering action further drives the suction nozzle element 211 to gradually rise or fall by the movable element 210.

In addition, the wafer pick-and-place device 2 of the present invention may further include a first driving component 23 and a second driving component 24, both of which may be fan components, but not limited thereto. The first heat driving component 23 may be suspended and disposed at a position adjacent to the heat dissipation element 203. Similarly, the second heat-dissipating component 24 may also be suspended and disposed at a position adjacent to the drive component 22. Therefore, during the operation of the wafer pick-and-place device 2, air can be blown toward the heat dissipation element 203 through the first driving component 23 to accelerate the heat dissipation speed of the heat dissipation component 203; and, the second driving component 24 is used to drive the component toward the driving component. 22 blows air to remove the thermal energy generated by the driving assembly 22 from the driving assembly 22. In this way, the effect of accelerated heat dissipation is achieved.

It is worth mentioning that the wafer pick-and-place device 2 of the present invention is not limited to the above examples.

[Example]

Please refer to FIG. 7, which is a schematic structural diagram of an embodiment of a wafer pick-and-place and inspection system according to the present invention, and please refer to FIGS. 1 to 6 together. As shown in the figure, the wafer picking and placing system described in this embodiment is similar to the wafer picking and placing device described in the above embodiments. The operations of the same components are similar and will not be repeated here. It is worth noting that, in this embodiment, the wafer pick-up and detection system S includes a carrier device 1, a wafer pick-up device 2, and a test device 3. The carrying device 1 carries at least one wafer element 10. The wafer pick-and-place device 2 is adjacent to the carrier device 1. The wafer pick-and-place device 2 includes a rotating component 20, a plurality of suction components 21 and a driving component 22. There is an inclined rail 200 on the outer periphery of the rotating assembly 20. A plurality of suction components 21 are arranged on the rotating component 20 in a circle, and each of the suction components 21 includes a movable element 210 movably disposed on the rotating component 20 and a nozzle element 211 disposed on the movable element 210 in tandem. The movable element 210 moves along the inclined rail 200. The driving assembly 22 is adjacent to the rotating assembly 20. The driving assembly 22 includes a movable pushing element 220. The detection device 3 is adjacent to the wafer pick-and-place device 2. Among them, at least one wafer element 10 is transported by the wafer pick-and-place device 2 to move from the carrier device 1 to the detection device 3. In addition, the movable pushing element 220 pushes against the suction component 21 adjacent to the driving component 22.

Specifically, the wafer picking and placing system S of the present invention includes a carrier device 1, a wafer picking and placing device 2, and a testing device 3. The carrier device 1 may be any form of carrier for carrying the wafer element 10 (such as a wafer). The structure of the wafer pick-and-place device 2 is as described in the previous embodiments, and is not described in detail here. The detection device 3 may be used for An inspection tool or equipment for inspecting the wafer element 10. The wafer pick-and-place device 2 may be a pick-and-place device that sequentially and continuously transports a plurality of wafer elements 10, as described in the foregoing embodiments. The carrying device 1 may be adjacent to the carrying device 1, and a preferred setting position is below the driving component 22 and one of the suction components 21; and the detecting device 3 may also be adjacent to the carrying device 1, and the preferred setting position is that of the other suction component 21. Below, there is a distance between the detection device 3 and the carrying device 1 (depending on the needs of the operator or the manufacturer).

The carrier device 1 carries at least one or more wafer components 10, and the wafer pick-and-place device 2 performs operations of obtaining and carrying the wafer components 10 (such as wafers) through human or program automatic control. The rotating component 20 is centered on its own axis, and is rotated in a stepwise manner (but not limited thereto) to sequentially and continuously drive each movable element 210 to correspond to the driving component 22 in sequence. And in each movable element 210 and drive assembly 22 At the corresponding time, the driving component 22 will drive the movable pushing element 220 to reciprocate, so as to use the movable pushing element 220 to drive the nozzle element 211 to reciprocate, so that the nozzle element 211 obtains the wafer element 10. Therefore, when the driving assembly 22 drives the movable pushing element 220 to be displaced downward, the movable pushing element 220 will push against and drive the nozzle element 211 to be displaced downward, so that the nozzle element 211 approaches the carrying device 1. At this time, the nozzle element 211 can obtain the wafer element 10 on the carrier device 1. Then, the driving component 22 will drive the movable pushing element 220 to be displaced upward and reset, and the nozzle element 211 will also be displaced along with the upward displacement to reset, and the operation of obtaining the wafer element 10 is completed.

Then, the rotating assembly 20 will rotate again, so that another (next) movable element 210 corresponds to the driving assembly 22 to obtain another wafer element 10. In addition, by the continuous rotation of the rotating assembly 20, the nozzle element 211 for obtaining the wafer element 10 described above is brought to the detection device 3, so that the nozzle element 211 can transport the wafer element 10 to the detection device 3 for subsequent Wafer inspection process.

It is worth mentioning that the wafer pick-and-place and inspection system S of the present invention may further include the following implementation modes. For specific implementation descriptions, please refer to the above embodiments and FIGS. 1 to 6.

The rotating component 20 may preferably include a base element 201, a rotating element 202, and a heat dissipation element 203. The base element 201 has a concave structure, and an inclined rail 200 is provided on the outer periphery of the base element 201. The rotating element 202 is rotatably disposed in the base element 201, and a plurality of suction components 21 are disposed around the rotating element 202. The heat dissipating element 203 is disposed on the rotating element 202. The heat dissipating element 203 has a groove portion 2030 and a through channel 2031. One end of the through channel 2031 is connected to the external air terminal 5. The other end of the through channel 2031 and the groove portion 2030 communicate with each other.

In addition, each nozzle element 211 may preferably include a suction element 2110 movably disposed on the movable element 210, a resisting element 2111 sleeved on the suction element 2110, and a rotating element 202 and connected to the suction element. The transmission part 2110 of 2110. Among them, the suction piece 2110 of the nozzle element 211 corresponding to the groove portion 2030 is transmitted by The piece 2112 communicates with the groove portion 2030.

In addition, each suction assembly 21 may further include a reset member 212 provided on the movable element 210. The reset member 212 has a plurality of elastic members 2120. The suction member 2110 is passed through the reset member 212, and the resisting member 2111 is provided on the reset member. 212 is abutted by a plurality of elastic members 2120.

For specific implementation manners of the foregoing components, refer to the foregoing second embodiment, and details are not described herein again.

In addition, in the embodiment of the above-mentioned wafer pick-and-place and detection system S of the present invention, the movable element 210 may preferably include a movable member 2100 movably disposed on the rotating assembly 20 and a component body 2101 fixed on the movable member 2100. And a link 2102 fixed to the element body 2101 and slidably provided on the inclined rail 200. For specific implementation, refer to the foregoing third embodiment, and details are not described herein again.

In addition, the wafer pick-and-place device 2 may further include a first driving component 23 suspended from the heat dissipation element 203 and a second driving component 24 adjacent to the driving component 22. For specific implementation, refer to the foregoing fourth embodiment, and details are not described herein again.

However, the above-mentioned wafer pick-and-place and inspection system S of the present invention is not limited to the above-mentioned examples.

[Advantageous Effects of the Embodiment]

The wafer pick-and-place device and the wafer pick-and-place and detection system provided by the present invention can pass “a plurality of suction components 21 can be movably disposed on the rotating component 20” and “the driving component 20 includes a corresponding suction component and can drive one of them. The 21-actuated movable push element 220 "technology solution improves the speed and throughput of wafer transportation.

Furthermore, the wafer pick-and-place device 2 and the wafer pick-and-place and detection system S of the present invention are sequentially and continuously driven by "the plurality of pick-up modules 21 can be movably arranged on the rotary module 20" and "the rotary module 20 The technical solutions of “the plurality of suction components 21 rotate” and “the driving component 22 uses the movable pushing element 220 to drive the suction component 21 to reciprocate”, so that each suction component 21 can use the nozzle element 211 can sequentially pick up the wafer components 10 on the carrying device 1, and can also sequentially and continuously place the wafer components 10 on the detection device 3 to improve and increase the wafer transport speed, and at the same time, can also lift and improve Process capacity.

The content disclosed above is only the preferred and feasible embodiment of the present invention, and therefore does not limit the scope of patent application of the present invention. Therefore, any equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. Within the scope of the patent.

Claims (10)

A wafer pick-and-place device includes: a rotating component having an inclined track on the outer periphery; a plurality of suction components arranged on the rotating component in a circle, each of the suction components including a movable ground A movable element provided on the rotating component and a suction nozzle element provided on the movable component in a linked manner, the movable element moving along the inclined track; and a drive component adjacent to the movable component Said rotating component, said driving component includes a movable pushing element; wherein each of said movable components includes a movable member movably disposed on said rotating component, and an element body fixed on said movable component And an interlocking member fixed on the element body and slidably disposed on the inclined rail; wherein the wafer pick-and-place device further includes a first driving component suspended from the rotating component and a A second driving component adjacent to the driving component. The wafer pick-and-place device according to claim 1, wherein the rotating component includes: a base member, the inclined rail is provided on an outer periphery of the base member; and a rotating member that can rotate Disposed in the base element, a plurality of the suction components are arranged around the rotating element; and a heat dissipation element is disposed on the rotating element, the heat dissipation element has a groove portion and a through hole In the channel, one end of the through channel is connected to an external air end, and the other end of the through channel is in communication with the groove portion; wherein the first heat drive component is suspended from the heat dissipation element. The wafer pick-and-place device according to claim 2, wherein each of the nozzle elements includes a suction member movably disposed on the movable element, and a set of resisting members provided on the suction element. And a transmission member penetrating through the rotating member and connected to the suction member; wherein the suction member corresponding to the nozzle element of the groove portion passes through the transmission member to communicate with the recess The grooves communicate with each other. The wafer pick-and-place device according to claim 2, wherein each of the suction components further comprises a reset member disposed on the movable element, the reset member has a plurality of elastic members, and the suction members are passed through. To the reset member, and the abutment member is disposed in the reset member and pressed by a plurality of the elastic members. The wafer pick-and-place device according to claim 1, wherein the movable pushing element pushes against the pick-up component adjacent to the driving component. A wafer pick-up and detection system includes: a carrier device that carries at least one wafer element; a wafer pick-and-place device that is adjacent to the carrier device; the wafer pick-and-place device includes: a rotating component; There is an inclined track on the periphery; a plurality of suction components are arranged on the rotating component in a circle, and each of the suction components includes a movable element movably disposed on the rotating component and a linkage ground. A nozzle element provided on the movable element, the movable element moving along the inclined track; and a driving component adjacent to the rotating component, the driving component including a movable pushing element; And a detection device adjacent to the wafer pick-and-place device; wherein at least one of the wafer components is transported by the wafer pick-and-place device to move from the carrier device to the test device; wherein each The movable element includes a movable member movably disposed on the rotating component, a component body fixed on the movable member, and a fixed member on the element. A main body and a linkage member slidably disposed on the inclined rail; wherein the wafer pick-and-place device further includes a first heat-driving component suspended from the rotating component and a first driving component adjacent to the driving component; Second drive component. The wafer pick-up and inspection system according to claim 6, wherein the rotating component comprises: a base element, the inclined track is arranged on the outer periphery of the base element, and a rotating element, It is rotatably disposed in the base member, and a plurality of the suction components are circumferentially disposed on the rotation member; and a heat dissipation member is disposed on the rotation member, and the heat dissipation member has a groove And a through channel, one end of the through channel is connected to an external air end, and the other end of the through channel is in communication with the groove portion; wherein the first heat drive component is suspended from the heat dissipation element . The wafer picking, placing and detecting system according to claim 7, wherein each of the nozzle elements includes a suction member movably disposed on the movable element, and a set of receiving elements provided on the suction element. And a transmission member penetrating through the rotating element and connected to the suction member; wherein the suction member corresponding to the nozzle element of the groove portion communicates with the suction member through the transmission member. The grooves communicate with each other. The wafer pick-up, inspection system according to claim 7, wherein each of the suction components further includes a reset member disposed on the movable element, the reset member has a plurality of elastic members, and the suction member The reset member is inserted through the reset member, and the abutment member is disposed in the reset member and pressed by the elastic members. The wafer pick-up and inspection system according to claim 6, wherein the movable pushing element pushes the sucking component adjacent to the driving component.