KR20090025154A - Expanding method and expanding apparatus - Google Patents

Expanding method and expanding apparatus Download PDF

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Publication number
KR20090025154A
KR20090025154A KR1020080086188A KR20080086188A KR20090025154A KR 20090025154 A KR20090025154 A KR 20090025154A KR 1020080086188 A KR1020080086188 A KR 1020080086188A KR 20080086188 A KR20080086188 A KR 20080086188A KR 20090025154 A KR20090025154 A KR 20090025154A
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KR
South Korea
Prior art keywords
workpiece
adhesive film
imaging
stage
expansion
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KR1020080086188A
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Korean (ko)
Inventor
가츠유키 이소하타
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가부시기가이샤 디스코
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Publication of KR20090025154A publication Critical patent/KR20090025154A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

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  • Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

An object of the present invention is to reliably confirm whether an adhesive film is divided in correspondence to a device chip when the adhesive film of a workpiece is expanded.

The workpiece 1a taken out from the cassette 22 is positioned at a fixed position by the positioning mechanism 31 and then moved to the expansion stage 80 via the standby stage 70 by each moving means. . Subsequently, after the adhesive film 5 is expanded in the expansion stage 80, the dicing tape 6 is heated in the heating stage 90. The workpiece 1a on which the dicing tape 6 is heated is placed on the chuck table 50, and the surface of the wafer 1 is imaged by the imaging means 33. Based on this photographed image, it is determined by the image processing means whether the adhesive film 5 has been divided in correspondence with the semiconductor chip 3.

Description

Expansion method and expansion device {EXPANDING METHOD AND EXPANDING APPARATUS}

The present invention relates to an expansion method for dividing an adhesive film by expanding an adhesive film adhered to a back surface of a semiconductor wafer, and to an expansion device for appropriately implementing the expansion method.

In the recent semiconductor device technology, a plurality of MCP (multi-chip package), SiP (system-in-package), and the like are realized in order to realize thin and short size reduction of electronic device devices. A stacked package in which device chips are stacked is effectively used for achieving higher density and smaller size. In the device chip corresponding to this technique, a die bonding adhesive film such as DAF (Die Attach Film) is adhered to the back side, and the adhesive film maintains the stacked state of the device chip.

In the manufacturing process of a device chip, the adhesive film is adhere | attached on the back surface of the semiconductor wafer in which the some device chip was formed, this semiconductor wafer is cut | disconnected by a cutting blade, and the adhesive film is divided | segmented with a device chip. In this case, however, the pressure-sensitive adhesive of the adhesive film sticks to the cutting blades, thereby making it easy to cause cutting failures. Therefore, as a method of dividing the adhesive film adhered to a semiconductor wafer, there exists a method of dividing an adhesive film separately from division of a semiconductor wafer, for example (refer patent document 1). In this method, first, only the semiconductor wafer is divided along the dividing line of the semiconductor wafer, and then the adhesive film is attached to the back surface of the semiconductor wafer, and then the adhesive film is expanded to divide the adhesive film in correspondence with the device chip. have. There is also a method of dividing the adhesive film simultaneously with the semiconductor wafer (see Patent Documents 2 and 3). In this method, after irradiating a laser beam into the dividing line of a semiconductor wafer to form a dividing cutting origin, the adhesive film is attached and the semiconductor wafer and the adhesive film are expanded to divide and cut the semiconductor wafer, while simultaneously cutting the adhesive film into the device chip. To split in response.

[Patent Document 1] Japanese Unexamined Patent Publication No. 2007-027562

[Patent Document 2] Japanese Patent Application Laid-Open No. 2005-251986

[Patent Document 3] Japanese Unexamined Patent Publication No. 2007-158152

In the dividing method of the adhesive film described in each said patent document, when the adhesive film is expanded, the location which only an adhesive film lengthens and does not break may generate | occur | produce. In that case, since the location where the adhesive films are integrated with adjacent device chips occurs, there arises a problem that the semiconductor chips are not picked up in the die bonding step performed after expansion. Conventionally, although division | segmentation confirmation of an adhesive film is performed visually, confirmation operation took time and there existed a possibility that a confirmation miss might arise.

Therefore, in the present invention, when the plurality of device chips formed on the surface of the semiconductor wafer in the state of being separated into pieces individually or already extended to the back surface of the semiconductor wafer is expanded, the adhesive film is applied to the device chips. It is an object of the present invention to provide an expansion method and an expansion device capable of reliably confirming whether or not they are partitioned.

The present invention relates to an adhesive film in which a ring-shaped frame member having an opening larger than the wafer diameter is adhered to an adhesive film adhered to the back surface of a wafer in which a plurality of device chips formed on the surface are individually separated or already separated. A method of expanding a workpiece formed by pasting a tape, comprising: an adhesive film expansion step of expanding at least an adhesive film of the workpiece, and a transfer step of transferring the workpiece to which the adhesive film is expanded to an imaging stage provided with an imaging means. And an image pickup process for picking up the surface of the workpiece transferred to the image pickup stage by the image pickup means, and processing image data picked up by the image pickup means, and determining whether the adhesive film is divided in correspondence to the device chip. It is characterized by including an image processing process.

The expansion method of this invention divides an adhesive film in correspondence with a device chip by expanding an adhesive film. In a form in which the device chip is not separated before expansion, the device chip is divided and separated into pieces with the expansion of the adhesive film. In the form in which the device chip has already been separated, the adhesive film between the device chips is expanded and broken, and the adhesive film is divided in correspondence with the device chip. By the way, in this invention, after extending an adhesive film, a to-be-processed object is transferred to an imaging stage, and the whole surface of a to-be-processed object is imaged by this imaging stage. And by processing the image data picked up appropriately, it is determined whether the adhesive film is divided | segmented according to the device chip. Thereby, whether the adhesive film is divided | segmented corresponding to the device chip can be confirmed reliably. If the location which is not divided | segmented in the extended adhesive film is detected, an expansion process is performed again and a adhesive film is divided. As a result, an error occurring at the time of pickup can be prevented.

Next, the workpiece expansion device of the present invention is an apparatus capable of suitably implementing the expansion method of the present invention, which includes an expansion stage for expanding at least an adhesive film of a workpiece and an imaging stage for imaging the surface of the workpiece. And a transfer means for transferring the workpiece to which the adhesive film is expanded to the imaging stage. In addition, the imaging stage includes a workpiece holding table having a holding surface for holding the workpiece, and an imaging means for imaging the surface of the workpiece, and processes the image data captured by the imaging means, wherein the adhesive film And image processing means for determining whether or not it is divided in correspondence with the device chip. In the expansion apparatus of this invention, an expansion stage and an imaging stage are provided separately. For this reason, expansion of a to-be-processed object and confirmation of division | segmentation can be performed in parallel, and therefore, an improvement of a production efficiency is aimed at.

Moreover, it is preferable that the light source which illuminates a holding surface from the back surface side is embedded in the workpiece holding table of the said expansion apparatus. Accordingly, the workpiece held on the workpiece holding table is dimmed on the back surface side by the light generated from the light source. As a result, after extending | stretching and dividing an adhesive film, the contrast between a device chip and a device chip becomes clear, and the division failure point of an adhesive film can be detected more reliably.

In the expansion device of the present invention, the workpiece holding table is not rotatable, and the imaging means picks up the entire surface of the workpiece by linearly moving in two directions parallel to the surface of the workpiece held on the workpiece holding table. It can be mentioned. In this embodiment, the entire surface of the workpiece is imaged by moving the imaging means so as to capture the entire surface of the workpiece while the workpiece is fixed to the workpiece holding table. Accordingly, it is not necessary to perform an operation such as rotation on the workpiece holding table in which the light source is embedded, so that the structure of the workpiece holding table can be simplified.

According to the present invention, after the adhesive film is expanded, the surface of the workpiece is picked up by the imaging means, and the captured image data is processed and confirmed by the image processing means, whereby the adhesive film adhered to the semiconductor wafer is a device chip in the expansion step. It is possible to reliably determine whether or not the partition has been divided in correspondence with. Thereby, since the adhesive film which is not divided before pick-up can be grasped | reliably reliably, pick-up error can be prevented and the device chip can be manufactured smoothly.

[1] wafers, semiconductor

The code | symbol 1a of FIG. 1 has shown the to-be-processed object expanded by the expansion method of one Embodiment of this invention. At the center of the workpiece 1a is a disk-shaped semiconductor wafer 1 (hereinafter referred to as wafer). This wafer 1 is a silicon wafer or the like. On the surface of the wafer 1, a plurality of rectangular semiconductor chips (devices) 3 are partitioned by the grid-shaped dividing line 2, and IC, LSI, etc. are formed on the surface of these semiconductor chips 3; An electronic circuit (not shown) is formed. The V-shaped cutout (notch) 4 which shows the crystal orientation of a semiconductor is formed in the predetermined location of the circumferential surface of the wafer 1. The wafer 1 is previously cut along the dividing line 2 by a cutting device or the like and separated into a semiconductor chip 3.

An adhesive film 5 for die bonding is adhered to the back surface of the wafer 1 which is separated into pieces. This adhesive film 5 is a film type adhesive material made of polyimide or epoxy. In addition, the dicing tape 6 is stuck to the adhesive film 5. The dicing tape 6 is, for example, an adhesive tape having a polyvinyl chloride having a thickness of about 100 μm as a base material and an acrylic resin pressure sensitive adhesive applied to one side thereof with a thickness of about 5 μm. As the dicing tape 6 of this invention, what shrink | contracts by heat is used suitably. This is for applying the tension in the horizontal direction again to the dicing tape 6 extended by the expansion process demonstrated later. An annular dicing frame 7 having an inner diameter larger than the diameter of the wafer 1 is adhered to the outer circumferential portion of the adhesive face (the upper face in FIG. 1) of the dicing tape 6. The dicing frame 7 is made of a metal plate or the like having rigidity, and the wafer 1 is handled through the dicing tape 6 and the dicing frame 7.

The adhesive film 5 of the to-be-processed object 1a is expanded by the expansion method of one Embodiment of this invention, and is divided | segmented according to the semiconductor chip 3. The expansion method of one embodiment is suitably implemented using the expansion device 10 shown in FIG. 2.

[2] configuration and operation of expansion units

Next, with reference to FIGS. 2-4, the expansion apparatus which can implement the expansion method of this invention suitably is demonstrated. 2 is a perspective view of the expansion device 10, and FIG. 3 is a plan view. The expansion device 10 has a base 11, on which the supply portion 20, the positioning / imaging stage 30, and the ultraviolet irradiation stage 100 are directed upward from the bottom right in the X direction in FIG. 3. ), The heating stage 90, the standby stage 70, and the expansion stage 80 are disposed upward from the lower left side in the X direction. Hereinafter, these will be explained.

(a) Supply

A recess 11a is formed at one end (lower right in Fig. 3) in the longitudinal direction of the base 11, and a cassette elevator 21 is disposed at the recess 11a. The cassette elevator 21 is operated in the vertical direction by an elevator mechanism not shown. On the upper surface of this cassette elevator 21, the conveyance is possible and the cassette 22 which stacks and accommodates several to-be-processed object 1a is set detachably. The cassette 22 has a pair of parallel cases 23 spaced apart from each other, and the racks 24 are provided in multiple stages in the vertical direction on opposite surfaces inside the cases 23. In these racks 24, the workpiece 1a in a horizontal posture with the surface of the wafer 1 facing upward is slidably inserted. The cassette 22 is set in the cassette elevator 21 of the base 11 so that the slide direction of the to-be-processed object 1a becomes parallel to a Y direction.

As shown in FIG. 2, at one end in the X direction (right side in FIG. 3) of the upper surface of the base 11, a first Y-axis moving means 25 reciprocating between the cassette 22 and the ultraviolet irradiation stage 100 is provided. It is installed. The 1st Y-axis movement means 25 is equipped with the 1st Y-axis cylinder 27 at the front-end | tip of the inverted L-shaped 1st Y-axis frame 26, and the 1st Y-axis cylinder 27 has a 1st The Y-axis clamp 28 is connected so that lifting and lowering is possible. The first Y-axis clamp 28 clamps the workpiece 1a with the dicing frame 7 of the workpiece 1a positioned at a predetermined position interposed therebetween. The base end of the first Y-axis frame 26 is slidably attached to the guide rail 29 provided on the base 11 and extending in the Y direction. The guide rail 29 is set to such a length that the workpiece 1a fixed to the first Y-axis clamp 28 can move from the cassette 22 to the ultraviolet irradiation stage 100. The first Y-axis frame 26 is moved along the guide rail 29 by a drive mechanism (not shown). As a result, the workpiece 1a fixed to the first Y-axis clamp 28 can be reciprocated between the cassette 22 and the ultraviolet irradiation stage 100.

After the first Y-axis moving means 25 is moved to the cassette 22 adjusted to a height that is optimal for taking out the workpiece 1a by the cassette elevator 21, the first Y-axis moving means 25 The workpiece 1a in the cassette 22 is taken out from the cassette 22 by the first Y-axis clamp 28 provided at the tip and transferred to the positioning mechanism 31 of the positioning / imaging stage 30. .

(b) Positioning / imaging stage

The positioning mechanism 31 of the positioning / imaging stage 30 moves in the X direction orthogonal to the Y direction while the pair of parallel guide bars 32 extending in the Y direction are linked so as to be close to or away from each other. It is configured to. The work piece 1a is placed on the guide bar 32, and the work piece 1a is positioned at a predetermined position by being fitted to the guide bar 32 adjacent to each other.

The imaging means 33 is provided with the imaging frame 34 which has an inverted L shape, and the imaging head 35 provided in the front-end | tip of this imaging frame 34. As shown in FIG. The imaging frame 34 is a hollow cylinder, and the chuck table is substantially horizontal from the upper end of the imaging stand 34a with a cylindrical axis extending in an approximately vertical direction (Z direction in FIG. 2). It consists of the imaging arm part 34b extended in the 50 direction. At the tip of the imaging arm portion 34b, a cylindrical imaging head 35 in which an axis extends in a substantially vertical direction is integrally formed with the imaging frame 34.

The imaging frame 34 is attached by the thin plate-shaped bracket 36 so that the image pickup frame 34 can be moved up and down along the guide 37 provided on the base 11. The bracket 36 is driven up and down along the guide 37 by a lift drive mechanism (not shown). The motor 38 is fixed between the imaging stand part 34a and the attachment part to the guide 37 on this bracket 36. The imaging stand portion 34a of the imaging frame 34 is rotatably supported around the shaft via the bearing member 39 at the tip of the bracket 36. 34 A of gears are formed in the outer periphery of the imaging stand part 34a, and the belt 40 is wound by the drive shaft of this gear 34A and the motor 38. As shown in FIG.

When the motor 38 is driven, its power is transmitted to the stand portion 34a via the belt 40 and the gear 34A, whereby the imaging head 35 pivots in the substantially horizontal direction. In addition, the imaging head 35 moves up and down integrally with the bracket 36. The lower end of the guide 37 is slidably attached to the guide rail 41 and is moved in the Y direction along the guide rail 41 by a drive mechanism (not shown).

The image picked up by the image pickup means 33 is transferred to an image processing means (not shown) for image processing. Based on the processed image, it is determined whether or not the adhesive film 5 has been expanded in correspondence with the semiconductor chip 3.

The chuck table 50 is a general well-known vacuum chuck type, and absorbs and holds the work 1a placed on the upper surface. As shown in FIG. 4, the chuck table 50 has a circular shape and has a frame 51 in which a recess 51a is formed. On the bottom face of the recessed part 51a, the light emitting element 52, such as LED, is arranged in multiple numbers with the light emitting surface facing upwards. A circular transparent transparent plate 53 made of glass or the like is fitted on the upper portion of the light emitting element 52. The upper surface of the transparent plate 53 forms an adsorption region 53a for adsorbing and retaining the work 1a, and forms the same plane continuously with the upper surface 51b of the frame 51. Grooves 54 are formed radially and concentrically in the adsorption region 53a. The groove 54 communicates with the hole 55 in the frame 51 and is connected to a vacuum means (not shown) for sucking air. The work 1a adsorbed and held in the adsorption region 53a is irradiated with light from the back surface side by the light emitting element 52. In addition, the chuck table 50 is rotated independently, that is, rotates in one direction or in both directions by a rotational drive mechanism (not shown) provided in the base 11.

Cleaning nozzles (not shown) are provided around the chuck table 50. The cleaning nozzle removes debris adhering to the wafer 1 in an expansion process or the like described later. The workpiece 1a on which the expansion process is completed is sucked and held on the chuck table 50 and rotated. By spraying washing water or air onto the wafer 1 of the rotated workpiece 1a, debris and the like adhering to the surface of the wafer 1 are removed.

2 and 3, the X-axis moving means 56 provided between the positioning / imaging stage 30 and the standby stage 70 includes a stand 57 and an X-axis driving mechanism ( 58, the X-axis cylinder 59, and the conveyance pad 60 are comprised. A screw rod type X-axis drive mechanism 58 is disposed on the upper surface of the stand 57 which is disposed substantially in the center of the device 10, and the X-axis cylinder is moved to the X-axis drive mechanism 58 through a slider 58a. 59 is slidably connected. The slider 58a moves the X-axis cylinder 59 in an X direction by the drive mechanism not shown. This X-axis cylinder 59 supports the conveyance pad 60 to drive up and down. The conveyance pad 60 adsorb | sucks and hold | maintains the dicing frame 7 of the to-be-processed object 1a, and is moved to an X-Z direction by the X-axis drive mechanism 58 and the X-axis cylinder 59. FIG. Accordingly, the workpiece 1a that is waiting in the positioning / imaging stage 30 or the standby stage 70 is lifted up to move the workpiece 1a between the positioning / imaging stage 30 and the standby stage 70. It can be reciprocated at.

(c) standby stage

As shown in Figs. 2 and 3, the second Y-axis moving means for reciprocating between the standby stage 70 and the expansion stage 80 at one end of the base 11 in the X direction (upper left in Fig. 3). 71) is installed. The second Y-axis moving means 71 has a second Y-axis cylinder 73 at the tip of the second Y-axis frame 72 having an inverted L-shape, and has a second under the second Y-axis cylinder 73. The Y-axis clamp 74 is provided. The second Y-axis clamp 74 is lifted by the second Y-axis cylinder 73 to clamp the dicing frame 7 of the workpiece 1a positioned at a predetermined position. The base end of the 2nd Y-axis frame 72 is slidably attached to the guide rail 75 provided in the upper surface of the base 11 and extending in the Y direction. The guide rail 75 is set to such a length that the workpiece 1a fixed to the second Y-axis clamp 74 can move from the standby stage 70 to the expansion stage 80. The 2nd Y-axis frame 72 is moved along the guide rail 75 by the drive mechanism not shown. Thereby, the workpiece 1a fixed to the second Y-axis clamp 74 can be reciprocated between the standby stage 70 and the expansion stage 80.

(d) expansion stage

The expansion stage 80 is provided with expansion means 81 for expanding the adhesive film 5 of the workpiece 1a. The expansion means 81 includes a freezing table (not shown) on which the work 1a is placed, and a clamp mechanism 82 for fixing the work 1a placed on the freezing table. On the upper surface of the freezing table, a loading surface on which the work 1a is placed is formed, and the work 1a is placed on this loading surface. In addition, the freezing table is provided with a Peltier element for cooling the adhesive film 5 of the workpiece 1a placed on the loading surface. Two clamp mechanisms 82 are arranged on the side of the expansion means 81 so as to face each other, and press the dicing frame 7 of the work 1a placed on the freezing table. The clamp mechanism 82 is comprised so that it may approach and space apart in the perpendicular direction with respect to a refrigeration table. Accordingly, when the workpiece 1a is placed on the freezing table or when the workpiece 1a is removed from the freezing table, two clamp mechanisms 82 are positioned above the loading surface and collide with the workpiece 1a. It is not supposed to. Moreover, the lifting mechanism is provided in the lower part of the clamp mechanism 82, and the clamp mechanism 82 can be dropped at the point where the dicing frame 7 of the to-be-processed object 1a was fixed. Alternatively, the elevating mechanism may be provided on the freezing table side to raise the freezing table.

In the expansion stage 80, the work 1a is placed on the freezing table, and the dicing frame 7 fixed by the clamp mechanism 82 is cooled to the work 1a while the adhesive film 5 is cooled. Relative downwards. As a result, the dicing tape 6 and the adhesive film 5 are expanded, and the adhesive film 5 is divided along the semiconductor chip 3. Since the adhesive film 5 is formed with the above-mentioned resin material, ductility falls by cooling and it becomes easy to break. As a cooling method of the adhesive film 5 other than using a freezing table, there is also a method of covering the entire expansion stage 80 with a cover and filling the cold air generated by a heat pump method or the like therein.

(e) heating stage

As shown in FIG. 2 and FIG. 3, a pivoting movement means 91 is disposed between the chuck table 50 with the imaging means 33 and the standby stage 70 and the heating stage 90. The swing type moving means 91 includes an arm 92 that pivots by a swing mechanism (not shown), a lift cylinder 93 provided at the tip of the arm 92, and a pad that is lifted by the lift cylinder 93. 94). The pivoting movement means 91 pivots between the chuck table 50 with the imaging means 33, the standby stage 70, and the heating stage 90 to move the workpiece 1a.

The heating means 90 is provided with the heating means 90. The heating means 95 is provided with a heater (not shown), and heats the intermediate region 6a of the dicing tape 6 between the wafer 1 and the dicing frame 7. By heating the intermediate region 6a, the dicing tape 6 expanded by the expansion means 81 is contracted, and the tension in the lateral direction is applied to the dicing tape 6 again. As a result, the contact of the semiconductor chips 3 by the sagging of the dicing tape 6 can be prevented.

(f) UV irradiation stage

As shown in FIG. 2 and FIG. 3, the ultraviolet irradiation stage 100 is provided with ultraviolet irradiation means 101. A circular recess 101a is formed in the ultraviolet irradiation means 101, and a plurality of ultraviolet lamps 102 are provided in the recess 101a. The ultraviolet lamp 102 irradiates ultraviolet rays to the dicing tape 6 to make it easy to peel off the wafer 1 in a state where the dicing tape 6 and the adhesive film 5 are attached.

[3] extension methods

Next, the operation of the expansion device 10 will be described.

First, the workpiece 1a laminated on the cassette 22 is first taken out of the cassette 22 by the first Y-axis moving means 25. The workpiece 1a taken out is placed on the guide bar 32 of the positioning mechanism 31 and positioned at a fixed position. At this time, the imaging means 33 retreats from the positioning / imaging stage 30.

The workpiece 1a positioned at a fixed position is attracted to and held by the transport pad 60 dropped by the X-axis cylinder 59 of the X-axis moving means 56. Subsequently, after raising the conveyance pad 60, the X-axis drive mechanism 58 is operated to move the workpiece 1a to the standby stage 70.

The workpiece 1a moved to the standby stage 70 moves the second Y-axis as the dicing frame 7 is clamped to the second Y-axis clamp 74 of the second Y-axis moving means 71. It is fixed to the means 71. After the workpiece 1a is fixed to the second Y-axis moving means 71, the suction of the workpiece 1a by the X-axis moving means 56 is released, and the transfer pad 60 is placed on the standby stage ( Retreat from 70).

The second Y-axis moving means 71 moves the work 1a fixed to the second Y-axis clamp 74 to the expansion stage 80. When the workpiece 1a is moved directly above the expansion means 81, the movement of the second Y-axis moving means 71 in the Y direction is stopped, and the second Y-axis cylinder 73 causes the second Y-axis clamp. (74) is lowered and the workpiece 1a is placed on the loading surface of the freezing table. At this time, the clamp mechanism 82 of the expansion means 81 is retreating from the mounting surface or is fixed above the mounting surface. When the workpiece 1a is placed on the loading surface, the clamp mechanism 82 is moved to fix the workpiece 1a. Subsequently, the clamp mechanism 82 is lowered while pressing the dicing frame 7 by the lifting mechanism to expand the dicing tape 6 and the adhesive film 5 (adhesive film expansion step). At this time, the adhesive film 5 is pulled outward and divided along the semiconductor chip 3. When the clamp mechanism 82 drops to a predetermined position, the lowering operation is stopped, and the clamp mechanism 82 is raised to the original position. In addition, when the lifting mechanism is provided on the freezing table side, the freezing table in a state in which the dicing frame 7 of the workpiece 1a placed on the loading surface is restricted by the clamp mechanism 82 to move upward. Is raised to expand the adhesive film 5. Subsequently, the clamp mechanism 82 is retracted from the mounting surface, and the second Y-axis clamp 74 of the second Y-axis moving means 71 is lowered to move the workpiece 1a to the second Y-axis clamp 74. Secure in. When the work piece 1a is fixed to the second Y-axis clamp 74, the second Y-axis clamp 74 is raised, and the work 1a is moved to the standby stage 70.

The work piece 1a positioned in the standby stage 70 is held on the pad 94 of the pivoting movement means 91. When the workpiece 1a is held by the pad 94, the fixing by the second Y-axis clamp 74 is released, and the second Y-axis moving means 71 is retracted from the standby stage 70. The pivotal moving means 91 holding the workpiece 1a pivots the arm 92 and moves the workpiece 1a directly above the heating means 95. Subsequently, the pad 94 is lowered by the elevating cylinder 93 to place the work 1a on the heating means 95. When the workpiece 1a is placed on the heating means 95, the heater is operated to heat the excess area 6a of the dicing tape 6. As a result, the dicing tape 6 is thermally contracted and tension is applied to the dicing tape 6 again.

When the heating by the heater is completed, the work 1a is held on the pad 94 again. The pivot conveyance means 91 raises the workpiece 1a held by the pad 94, then pivots the arm 92 to move the workpiece 1a directly above the chuck table 50, and the suction area. The work 1a is placed on 53a (transfer step). The placed work 1a is attracted to and held by the chuck table 50. Here, after spin-cleaning and drying the surface of the wafer 1, the imaging head 35 of the imaging means 33 is pivoted to the surface of the wafer 1, and the height of the bracket 36 is appropriately adjusted to focus the wafer. We match to surface of (1). Subsequently, the chuck table 50 is appropriately intermittently rotated, and the surface of the wafer 1 is photographed at a necessary point while turning the imaging head 35 (imaging step). At this time, in order to obtain contrast of the gap between the adjacent semiconductor chips 3, the light emitting element 52 of the chuck table 50 is turned on and light is irradiated to the wafer 1. The captured image is transferred to the image processing means.

5 shows a part of the surface of the wafer 1 taken by the imaging means 33. In the same figure, a gap | gap arises in the part corresponding to the division | segmentation line 2 between the adhesive films 5 broken in the substantially same shape as the semiconductor chip 3. It is confirmed by the image processing means whether or not such a normal divided state is formed on the entire surface of the wafer 1 (image processing step). The workpiece 1a which can be confirmed by the image processing means that the adhesive film 5 is divided along the semiconductor chip 3 is conveyed to the ultraviolet irradiation stage 100 which performs the next process. In addition, when a defective division part is detected, the to-be-processed object 1a is conveyed to the expansion means 81 again, and the adhesive film 5 is expanded.

The workpiece 1a in which no division failure point is detected is ultraviolet-ray irradiation stage 100 as the dicing frame 7 is clamped to the first Y-axis clamp 28 of the first Y-axis conveying means 25. Is moved to. When the workpiece 1a moves directly above the ultraviolet irradiation means 101, the ultraviolet lamp 102 is turned on to irradiate the dicing tape 6 of the workpiece 1a with ultraviolet rays. Thereby, peeling between the dicing tape 6 and the adhesive film 5 becomes easy. Thereafter, the first Y-axis moving means 25 is moved to the cassette 22 to accommodate the work 1a in the cassette 22 again.

In the above embodiment, the wafer 1 is cut, but the deteriorated layer is formed by the laser processing apparatus along the dividing line 2, and the wafer 1 is not separated into semiconductor chips 3. It is also applicable to. In this case, the wafer 1 is divided and cut along the dividing line 2 at the same time as the adhesive film 5 is expanded by the expansion step. Thereby, the semiconductor chip 3 by which the adhesive film 5 was divided along the semiconductor chip 3 can be obtained.

This embodiment divides the adhesive film 5 corresponding to the semiconductor chip 3 by expanding the adhesive film 5. In the form in which the semiconductor chip 3 is already separated, the adhesive film 5 between the semiconductor chips 3 is expanded and broken, and the adhesive film 5 is divided in correspondence with the semiconductor chip 3. In the form in which the semiconductor chip 3 is not separated before expansion, the semiconductor chip 3 is divided and separated into pieces with the expansion of the adhesive film 5. After expanding the adhesive film 5, the workpiece 1a is transferred to the positioning / imaging stage 30, and the entire surface of the wafer 1 is imaged in this positioning / imaging stage 30. Then, by appropriately processing the captured image data, it is determined whether the adhesive film 5 is divided in correspondence with the semiconductor chip 3. Thereby, whether the adhesive film 5 is divided | segmented corresponding to the semiconductor chip 3 can be confirmed reliably. If the location which is not divided | segmented in the expanded adhesive film 5 is detected, an extension process is performed again and the adhesive film 5 is divided. As a result, an error occurring at the time of pickup can be prevented.

In addition, in the expansion device 10 of the present embodiment, the positioning / imaging stage 30 and the expansion stage 80 are provided separately. For this reason, expansion of the to-be-processed object 1a and division | segmentation confirmation of the adhesive film 5 can be performed in parallel, and the improvement of a productive efficiency is aimed at by this.

In the chuck table 50 of the expansion device 10, a light emitting element 52 for illuminating the adsorption region 53a from the rear surface side is embedded. As a result, the wafer 1 held in the adsorption region 53a is dimmed on the back surface side by the light generated from the light emitting element 52. As a result, after extending | stretching and dividing the adhesive film 5, the contrast between the semiconductor chip 3 and the semiconductor chip 3 becomes clear, and the division failure point of the adhesive film 5 can be detected more reliably.

[4] other embodiments

In the said embodiment, although the washing | cleaning of the wafer 1 and the imaging | photography of the surface of the wafer 1 were performed in the same stage, it is also possible to perform each in a separate stage. This embodiment will be described with reference to FIG. 6.

FIG. 6 shows the expansion device 110 in which the spinner type cleaning means 120 is provided in the standby stage 70. The spinner type washing | cleaning means 120 is comprised by the holding table 121 which adsorb | sucks and hold | maintains the to-be-processed object 1a, and the washing | cleaning nozzle 122 which injects washing water and air. The holding table 121 rotates independently, that is, rotates in one direction or both directions by a rotational drive mechanism (not shown) provided in the base 11. In addition, the cleaning nozzle 122 is connected to a swing mechanism (not shown), so that the cleaning nozzle 122 can be retracted on the holding table 121.

The imaging means 130 of the imaging stage 30 includes a Y-axis guide rail 131 provided on the base 11, a Z-axis guide 132 slidably connected to the Y-axis guide rail 131, and Z A thin plate-shaped bracket 133 connected to the shaft guide, an X-axis guide rail 134 provided on the bracket 133, and an X-axis slider 135 slidably connected to the X-axis guide rail 134; And an imaging head 136 provided at the tip of the X-axis slider 135. The Z-axis guide 132 is moved in the Y direction along the Y-axis guide rail 131 by a drive mechanism (not shown). The bracket 133 is moved up and down along the Z-axis guide 132 by a lift drive mechanism (not shown). In addition, the X-axis slider 135 is moved along the X-axis guide rail 134 by the drive mechanism not shown.

In this embodiment, the chuck table of the imaging stage 30 is set to not rotate. For this reason, when imaging the surface of the wafer 1 of the workpiece 1a held by the chuck table 137, the imaging head 136 is moved in the XY direction so that each driving mechanism can image the entire surface of the wafer 1. Move to.

In the expansion method of this embodiment, first, the workpiece 1a taken out from the cassette 22 is positioned at a fixed position by the positioning mechanism 31. Subsequently, the workpiece 1a is moved to the standby stage 70 and moved to the expansion stage 80 by the second Y-axis moving means 71. When the adhesive film 5 is expanded in the expansion stage 80, the adhesive film 5 is moved back to the standby stage 70. Subsequently, the work 1a is moved to the heating stage 90 to heat the dicing tape 6 of the work 1a.

After the dicing tape 6 is heated, the workpiece 1a is again transferred to the standby stage 70 to be adsorbed and held by the holding table 121. At this time, since the cleaning nozzle 122 retreats on the holding table 121, the cleaning nozzle 122 is pivoted and positioned on the holding table 121. Subsequently, the holding table 121 is rotated to inject cleaning water and air from the cleaning nozzle 122 onto the wafer 1 of the workpiece 1a to clean the wafer 1.

When the cleaning is finished, the workpiece 1a is moved to the imaging stage 30 by the X-axis moving means 56. The moved workpiece 1a is attracted to and held by the chuck table. The light emitting element 52 is turned on to drive the imaging means 130. The imaging unit 130 moves the Z-axis guide 132 in the Y direction while photographing the entire surface of the wafer 1 while reciprocating the imaging head 136 in the X direction. The photographed image data is transferred to the image processing means, and it is confirmed whether the adhesive film 5 is divided along the semiconductor chip 3. When a division failure point is detected, it expands by expansion means 81 similarly to the said embodiment. The to-be-processed object 1a in which the division failure point was not detected is conveyed to the ultraviolet irradiation stage 100, and ultraviolet-ray is irradiated and accommodated in the cassette 22. FIG.

In this form, the whole surface of the wafer 1 is imaged by moving the imaging means 130 so as to capture the entire surface of the wafer 1 while the workpiece 1a is fixed to the chuck table. Thereby, it is not necessary to perform operations such as rotation to the chuck table in which the light emitting element 52 is embedded, and the configuration of the chuck table can be simplified.

BRIEF DESCRIPTION OF THE DRAWINGS (a) A perspective view and (b) sectional drawing which shows the to-be-processed object extended by the expansion method of one Embodiment of this invention.

2 is a perspective view showing an expansion device for suitably implementing the expansion method of one embodiment;

3 is a plan view of the expansion device shown in FIG. 2;

4 is a (a) cross-sectional view and (b) a plan view of the chuck table provided in the expansion device shown in FIG.

FIG. 5 is a view showing an image captured by an imaging means provided in the expansion device shown in FIG.

6 is a plan view illustrating an expansion device of another embodiment;

<Explanation of symbols for main parts of drawing>

1: wafer

1a: Workpiece

3: semiconductor chip (device chip)

5: adhesive film

6: dicing tape (adhesive tape)

7: dicing frame (frame member)

30: imaging stage

33: imaging means

Claims (4)

The ring-shaped frame member having an opening larger than the wafer diameter is adhered to the adhesive film adhered to the back surface of the wafer in which the plurality of device chips formed on the surface are individually separated or already separated. As a method of expanding a workpiece formed by adhering an adhesive tape, An adhesive film expansion step of expanding at least the adhesive film of the workpiece, A transfer step of transferring the workpiece to which the adhesive film is expanded to an imaging stage having an imaging means; An imaging process of imaging the surface of the workpiece transferred to the imaging stage by the imaging means; An image processing step of processing image data picked up by the imaging means to determine whether the adhesive film is divided in correspondence to the device chip. Expansion method comprising a. A plurality of device chips formed on the surface are individually separated or adhered to an adhesive film adhered to the backside of the wafer which has already been separated, by adhering a ring-shaped frame member having an opening larger than the wafer diameter to the adhesive tape adhered to the periphery thereof. An apparatus for expanding a workpiece to be formed, An expansion stage for expanding at least the adhesive film of the workpiece, An imaging stage for imaging the surface of the workpiece, Transfer means for transferring the workpiece to which the adhesive film is expanded to the imaging stage Including; The imaging stage includes a workpiece holding table having a holding surface for holding the workpiece, and an imaging means for picking up the surface of the workpiece, And the expansion device further comprises image processing means for processing the image data picked up by the imaging means to determine whether the adhesive film is divided in correspondence with the device chip. The expansion device according to claim 2, wherein a light source for illuminating the holding surface from the rear surface side is embedded in the workpiece holding table. The surface of the workpiece according to claim 2 or 3, wherein the workpiece holding table is not rotatable, and the imaging means moves linearly in two directions parallel to the surface of the workpiece held on the workpiece holding table. An expansion device characterized by capturing the whole.
KR1020080086188A 2007-09-05 2008-09-02 Expanding method and expanding apparatus KR20090025154A (en)

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CN101383277A (en) 2009-03-11

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