JP2006173361A - Device and method for picking up chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and method for picking up chip by which various kinds of chips having different sizes can be picked up stably. <P>SOLUTION: The chip picking-up device which picks up a chip 6 stuck to a sheet 5 with an adhesive layer 5a having such a property that generates a nitrogen gas when the layer 5a is irradiated with ultraviolet rays, from the sheet 5 where the chip 6 is stuck, is provided with a shutter section constituted by laminating two light shielding plates 37 and 38 upon another between an UV light source section 8b and the sheet 5. The light transmitting sections 37b and 38b of the light shielding plates 37 and 38 can freely change a laminated light transmitting range T, and the light transmitting range T of the light irradiated upon the sheet 5 is changed in accordance with the shape/size of the chip 6 before the light is irradiated. Consequently, the chip picking-up device can stably pick up various kinds of chips having different sizes by irradiating the range corresponding to a chip to be picked up with light. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a chip pickup device and a chip pickup method for picking up a chip adhered and held on a sheet.

A die bonding apparatus that mounts individual semiconductor chips cut out from a semiconductor wafer onto a substrate such as a lead frame is a pickup apparatus that removes semiconductor chips held in a state of being stuck to a sheet from the sheet for each individual piece. I have. In this pickup device, as a method for peeling the adhered semiconductor chip from the sheet, a method using ultraviolet irradiation is put into practical use instead of the conventionally used push-up method using an ejector pin (for example, a patent) Reference 1). This method uses an adhesive having the property of reducing the adhesive strength by ultraviolet irradiation as an adhesive for adhering the semiconductor chip to the sheet, and the semiconductor is applied to the sheet by irradiating the semiconductor chip with ultraviolet rays. The adhesive force for holding the chip is reduced, and the semiconductor chip can be easily picked up by the suction collet.
JP-A-8-288318

  In the die bonding apparatus, the types of target semiconductor chips are not necessarily constant, and various types of semiconductor chips having different shapes and sizes are targeted. However, in the method shown in the above-described patent document example, it is difficult to ensure a stable pickup operation when the shape and size of the chip to be picked up are different.

  That is, when a chip larger than the standard size set in the pickup device is targeted, ultraviolet light is irradiated only to an area smaller than the chip, and the effect of reducing the adhesive force is insufficient. In addition, when a chip smaller than the standard size is targeted, not only the chip to be picked up but also the adjacent chip has an effect of reducing the adhesive force by ultraviolet irradiation, and inconvenience such as chip position misalignment on the sheet. Has occurred. As described above, the conventional chip pickup device has a problem that it is difficult to stably pick up various types of chips having different sizes.

  Accordingly, an object of the present invention is to provide a chip pickup device and a chip pickup method that can stably pick up various types of chips having different sizes.

  The chip pickup device of the present invention is a chip pickup device that picks up the chip from a sheet having a chip adhered and held on the upper surface thereof with an adhesive, the sheet holding unit holding the sheet, and the chip is picked up from the sheet Picking up means, light emitting means provided below the sheet holding portion to irradiate the sheet with light from below to reduce the sticking holding force of the chip by the adhesive, the light irradiating means and the sheet And a translucent range changing means for changing the shape and size of the translucent range through which the light is transmitted.

The chip pick-up method of the present invention is a chip pick-up method for picking up the chip from a sheet in which the chip is adhered and held on the upper surface by an adhesive, and by irradiating the sheet with light from below, A light irradiation step for reducing the sticking holding power and a pickup step for picking up the chip from the sheet, and prior to the light irradiation step, the light irradiated on the sheet according to the shape and size of the chip A translucent range changing step of changing the shape and size of the translucent range through which the light is transmitted is executed.

  According to the present invention, prior to the light irradiation step of reducing the sticking holding force of the chip by the adhesive, the shape / size of the light transmission range through which the light irradiated to the sheet is transmitted according to the shape / size of the chip. Thus, it is possible to stably pick up various types of chips having different sizes by irradiating light only in a range corresponding to the chip to be picked up.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a side view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 2 is an explanatory diagram of the structure of a shutter mechanism provided in a light irradiation unit of the electronic component mounting apparatus according to an embodiment of the present invention. 3 is an explanatory view of the shape of the light shielding plate in the shutter mechanism of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 4 is an explanatory view of the operation of the shutter mechanism of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 6 is a plan view of a shutter mechanism provided in the light irradiation unit of the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 6 is a block diagram showing the configuration of the control system of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 7 is an operation flowchart of the electronic component mounting method according to the embodiment of the present invention. FIG. 8 is an explanatory diagram of operation timing in the electronic component pickup device according to the embodiment of the present invention. 11, FIG. 12, FIG. 13, FIG. 15, 16, 17 are timing charts for explaining the operation of the electronic component pick-up method of an embodiment of the present invention.

  First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a component supply stage 2 is disposed on a base 1. The component supply stage 2 includes a jig holder 3, and the jig holder 3 detachably holds the jig 4 on which the sheet 5 is mounted. On the sheet 5, a semiconductor chip 6 (hereinafter simply referred to as “chip 6”), which is an electronic component, is bonded and held in a state of being separated into individual pieces.

  The sheet 5 used as a carrier for the chip 6 is formed by forming a light-transmitting material such as a transparent resin into a sheet shape, and a pressure-sensitive adhesive (adhesive substance) having the following properties is formed on the upper surface of the sheet 5 as a thin film. An adhesive layer 5a is formed. As the pressure-sensitive adhesive, a compound having a property of generating gas when irradiated with light (for example, a compound having a property of decomposing by irradiation of ultraviolet rays such as an azide group to generate nitrogen gas (see Japanese Patent Application Laid-Open No. 2001-200294)) A pressure-sensitive adhesive containing the composition is used.

  That is, the sheet 5 has a plurality of chips 6 adhered and held on the upper surface by an adhesive having the property of generating gas when irradiated with light, and the component supply stage 2 is mounted on the jig 4. Is supported by the jig holder 3. Therefore, the component supply stage 2 is a sheet holding unit that holds the sheet 5. By using the sheet 5 having such an adhesive layer 5a as a carrier for holding the chip 6 as described above, the chip 6 can be easily peeled when the chip 6 is picked up from the sheet 5 as will be described later. it can.

Below the sheet 5 held by the jig holder 3, a light irradiation unit 8 is disposed so as to be horizontally movable by a light irradiation unit moving mechanism 7 including an X-axis table 7X and a Y-axis table 7Y. The light irradiation unit 8 includes a cylindrical light guide unit 8a that contacts the lower surface of the sheet 5, and a UV light source unit 8b (see FIG. 2B) built in the lower part of the light guide unit 8a. The ultraviolet rays projected upward from the part 8b are irradiated to the lower surface of the sheet 5 through the inside of the light guide part 8a. A shutter mechanism 9 is provided on the upper part of the light guide unit 8a, and the light transmission range when the sheet 5 is irradiated with ultraviolet rays from the UV light source unit 8b is adjusted so that only one chip 6 is irradiated with ultraviolet rays. It can be limited to. Accordingly, when the light irradiation unit 8 is aligned with the chip 6 to be picked up, only the adhesive layer 5a located on the back side of the chip 6 is irradiated with ultraviolet rays.

  The structure of the shutter mechanism 9 will be described with reference to FIG. A base bracket 30 extending in the horizontal direction is provided on a side surface of the light guide portion 8a, and a motor 32 is mounted on the holding bracket 31 coupled to the base bracket 30. A feed screw 33 is coupled to the rotation shaft of the motor 32, and nuts 34a and 34b screwed to the feed screw 33 are coupled to light shielding plates 37 and 38 via connecting members 35a and 35b.

  As shown in FIG. 2B, the light shielding plates 37 and 38 are arranged so as to cover the upper surface of the light guide unit 8a so as to overlap each other, and are irradiated from the UV light source unit 8b as will be described later. It functions as a shutter for irradiating the lower surface of the sheet 5 with light. By rotating the motor 32, the light shielding plates 37 and 38 are guided by the guide shaft 36 and move horizontally. Here, the pitches of the thread grooves formed in the feed screw 33 are reversed with respect to the intermediate portion in the axial length direction. By rotating the feed screw 33, the nuts 34a and 34b are reverse to each other. Move to. The motor 32, the feed screw 33, and the nuts 34a and 34b constitute a shutter drive mechanism 9a that opens and closes a shutter unit including the light shielding plates 37 and 38.

  The shape and function of the light shielding plates 37 and 38 will be described with reference to FIGS. The light shielding plates 37 and 38 are plate members formed in a substantially L shape by partially cutting off a light shielding rectangular plate that does not transmit light. In the light shielding plates 37 and 38, the L-shaped portions are light shielding portions 37a and 38a that block light, and the cut portions are light transmitting portions 37b and 38b that transmit light.

  The light shielding plates 37 and 38 are overlapped in the direction in which the respective light shielding portions 37a and 38a face each other. When the light shielding plates 37 and 38 are overlapped, the overlapping portions of the light transmitting portions 37b and 38b are from the UV light source portion 8b. A light transmission range T that transmits light upward is formed (see FIGS. 14 and 14). That is, the overlapped light shielding plates 37 and 38 have a rectangular shape in which a plurality of light shielding plates each provided with a light shielding portion that blocks light and a light transmitting portion that transmits light are overlapped to overlap each other. The shutter portion forms the light transmission range T.

  At this time, as shown in FIG. 4, the shape and size of the light transmission range T are changed by moving the light shielding plates 37 and 38 to each other in the overlapping surface direction. That is, as shown in FIG. 4A, a light-transmitting range T with a large opening is formed in a state where the overlapping portions of the light shielding plates 37 and 38 are reduced. Then, by bringing the connecting members 35a and 35b closer to each other from this state and increasing the overlapping portion of the light shielding plate 37 and the light shielding plate 38, as shown in FIG. Is formed.

  In the example shown in FIG. 3A, the shutter portion is configured by the light shielding plates 37 and 38 made of a light shielding plate member. However, as shown in FIG. Instead of this, a light shielding member 137 made of a rectangular transparent glass plate may be used. The light shielding member 137 forms a light shielding portion 137a by vapor-depositing a light shielding film in a range corresponding to the light shielding portion 37a in the light shielding plate 37, and the range corresponding to the light-transmitting portion 37b cut out in the light shielding plate 37 remains transparent. The light transmitting portion 137b. Similarly, a light shielding film is formed on the side surface 137c around the transparent glass plate by vapor deposition. Thereby, light leakage to the surroundings can be prevented and light irradiation efficiency can be improved. In FIG. 4B, only the light shielding member 137 is made of a glass plate, but the light shielding plate 38 may be similarly made of a transparent glass plate having the same configuration.

FIG. 5 shows an example in which four light shielding plates are combined as a configuration of the shutter unit. In FIG. 5A, on the upper surface of the light guide portion 8a, a shutter mechanism 90 having a configuration in which two light shielding plates 40X movable in the X direction and two light shielding plates 40Y movable in the Y direction are combined in a cross-beam shape. Is arranged. The range surrounded by these four light shielding plates forms a rectangular light transmission range T through which the ultraviolet rays from the UV light source unit 8b positioned below pass.

  The two light-shielding plates 40X and the two light-shielding plates 40Y are moved in opposite directions by the feed screw 41X and the feed screw 41Y having screw grooves with opposite pitches, similarly to the feed screw 33 shown in FIG. That is, when the feed screws 41X and 41Y are rotationally driven by the motors 42X and 42Y, the two light shielding plates 40X and the two light shielding plates 40Y move in directions that are close to each other or away from each other. Thereby, it is possible to arbitrarily set the size of the rectangular translucent range T. That is, by appropriately setting the relative distance between the two light shielding plates 40X and the two light shielding plates 40Y, the light transmission range T is not limited to the square as shown in FIG. As shown, the shape of the translucent range T can be set to a rectangle.

  In the pick-up operation for taking out the chip 6 from the component supply stage 2, the light irradiation unit 8 is moved horizontally by the light irradiation unit moving mechanism 7 so that the translucent range T is positioned directly below the chip 6 to be picked up. In this state, the UV light source unit 8b is turned on to irradiate the lower surface of the sheet 5 positioned directly below the chip 6 to be picked up with ultraviolet rays. Thereby, ultraviolet rays permeate | transmit the sheet | seat 5, and are irradiated to the adhesion layer 5a, and nitrogen gas is emitted from the adhesion layer 5a. Then, the generated nitrogen gas stays at the bonding interface between the chip 6 and the adhesive layer 5a to form a gas layer, so that the holding force for the adhesive layer 5a to stick and hold the chip 6 is significantly reduced. The peeling from the sheet 5 becomes easy.

  That is, in the above configuration, the UV light source unit 8b provided in the light irradiation unit 8 is provided below the component supply stage 2 that is a sheet holding unit, and irradiates the sheet 5 with light from below, thereby forming a chip by the adhesive layer 5a. 6 is a light irradiating means for reducing the sticking holding power of No. 6. The shutter mechanism 9 is provided between the UV light source unit 8b and the lower surface of the sheet 5, and serves as a translucent range changing unit that changes the shape and size of the translucent range through which ultraviolet rays from the UV light source unit 8b are transmitted. ing. The light irradiation unit moving mechanism 7 relatively moves the component supply stage 2 and the light irradiation unit 8 to relatively align the light irradiation range of the light irradiation unit 8 with the lower surface of the chip 6 to be picked up. It is a moving mechanism.

  In the above example, an adhesive material having a property of generating nitrogen gas by ultraviolet irradiation is used as the adhesive layer 5a. However, an adhesive having a property of reducing adhesive strength by ultraviolet irradiation may be used. . Also in this case, the sticking holding force of the chip 6 by the adhesive can be reduced by the irradiation of ultraviolet rays, and the peeling from the sheet 5 can be facilitated.

  In FIG. 1, a second camera 13 and a substrate holding stage 10 are disposed on a base 1 adjacent to a component supply stage 2. The substrate holding stage 10 has a configuration in which a substrate holding table 11 is placed on a base portion 10a. The substrate holding table 11 holds a substrate 12 on which a chip 6 is mounted. The substrate 12 is carried into and out of the substrate holding table 11 by the substrate transport mechanism 21 (see FIG. 6).

  A horizontal upper frame 15 is installed on the support posts 1 a erected on both ends of the upper surface of the base 1, and a first camera 17 is moved horizontally by the first camera moving mechanism 16 on the upper frame 15. Arranged freely. By moving the first camera 17 by the first camera moving mechanism 16, the first camera 17 is positioned above an arbitrary chip 6 held on the sheet 5 and images the chip 6. The imaging result is recognized by the first component recognition unit 23b (see FIG. 6) of the control unit 23, whereby the position of an arbitrary chip 6 is recognized.

  A component holding head 19 is disposed on the upper frame 15 so as to be horizontally movable by a component holding head moving mechanism 18. A holding tool 20 is attached to the lower part of the component holding head 19, and the component holding head 19 is moved onto the component supply stage 2 so that the holding tool 20 is aligned with the chip 6 to be picked up and lowered. The holding tool 20 contacts the upper surface of the chip 6 and picks up the chip 6 by holding it by vacuum suction. The component holding head 19 provided with the holding tool 20 and the component holding head moving mechanism 18 serve as pickup means for picking up the chip 6 from the sheet 5. The component holding head 19 holding the chip 6 by this pickup operation is moved above the substrate holding stage 10, and the holding tool 20 is moved up and down with respect to the substrate 12 held on the substrate holding table 11. The held chip 6 is mounted on the substrate 12. Therefore, the component holding head 19 and the component holding head moving mechanism 18 are mounting means for mounting the picked-up chip 6 on the substrate 12.

  A second camera 13 is disposed below a moving path along which the component holding head 19 moves from the component supply stage 2 to the substrate holding stage 10. The second camera 13 is a chip 6 held by a holding tool 20. Is taken from below. And the position of the chip | tip 6 in the state hold | maintained at the holding | maintenance tool 20 is recognized by recognizing this imaging result by the 2nd component recognition part 23c. When the chip 6 is mounted on the substrate 12 by the component holding head 19, the alignment of the chip 6 with respect to the substrate 12 is performed reflecting the position recognition result.

  Next, the configuration of the control system will be described with reference to FIG. The control unit 23 includes, as internal functions, a mounting operation processing unit 23a, a first component recognition unit 23b, a second component recognition unit 23c, and a storage unit 23d. From the component holding head 19 and the component holding head moving mechanism 18 The operation and processing of the component mounting mechanism, the UV light source unit 8b, the shutter mechanism 9, the light irradiation unit moving mechanism 7, and the substrate transport mechanism 21 are controlled. The operation / input unit 22 is an input means such as a keyboard, and inputs operation commands, chip size data described later, and various data such as time parameters T1 and T2.

  Here, the mounting operation processing unit 23a controls each part of the component holding head 19, the component holding head moving mechanism 18, the UV light source unit 8b, the shutter mechanism 9, the light irradiation unit moving mechanism 7, and the substrate transport mechanism 21. The electronic component mounting operation described later is executed. The first component recognition unit 23 b recognizes the position of the chip 6 held on the sheet 5 in the component supply stage 2 by performing recognition processing on the imaging result obtained by the first camera 17. The second component recognition unit 23 c recognizes the position of the chip 6 held by the component holding head 19 by performing a recognition process on the imaging result obtained by the second camera 13. The second camera 13 and the second component recognition unit 23 c are electronic component recognition units that recognize the position of the chip 6 held by the holding tool 20.

  The storage unit 23d stores chip size data indicating the size of the chip 6 and time parameters T1 and T2. When the shutter driving mechanism 9a is driven and the above-described light transmission range T is adjusted to the target chip 6, the chip size data is read and referenced. The time parameters T1 and T2 are set in order to realize an operation condition in which the effect of facilitating the peeling of the chip 6 can be reliably obtained in the electronic component mounting operation described later. As shown in FIG. 8, the time parameter T1 indicates the time from the lighting timing ta of the UV light source unit 8b to the extinguishing timing tb. That is, the time required for generating a sufficient amount of nitrogen gas from the adhesive layer 5a by UV irradiation is set as the time parameter T1. By appropriately setting the time parameter T1, it is possible to eliminate waste of operating time in which the UV light source unit 8b is in a lighting state.

The time parameter T2 indicates the time from the lighting timing ta of the UV light source unit 8b to the holding tool lowering process start timing tc. That is, the time parameter T2 is set in anticipation that the timing at which the chip 6 on the sheet 5 is picked up by the holding tool 20 is after the gas layer formed by the generated nitrogen gas is sufficiently formed. By setting the time parameter T2 appropriately, the chip 6 can be picked up by the holding tool 20 after a sufficiently large gas layer is formed on the adhesive interface between the back surface of the chip 6 and the adhesive layer 5a. Thereby, the peeling promotion effect by nitrogen gas at the time of hold | maintaining the chip | tip 6 with the holding tool 20 and peeling from the sheet | seat 5 can be made reliable. After the holding tool lowering process start timing tc, the holding tool 20 contacts the chip 6 after a predetermined operation time required for lowering the holding tool 20.

  Next, the chip pickup operation in the electronic component mounting operation will be described along the flow of FIG. 7 with reference to each drawing. In this chip pickup operation, the chip 6 is picked up from the sheet 5 having the chip adhered and held on the upper surface by an adhesive, and FIGS. 9 to 13 show examples of the pickup operation for the chip 6 having a large size, FIG. FIG. 17 shows an example of a pickup operation for a chip 6 having a small size.

  In FIG. 7, first, chip size data is read from the storage unit 23d (ST1). Next, a first electronic component recognition process is executed (ST1). That is, as shown in FIG. 9, the first camera 17 is positioned above the chip 6 to be picked up, the chip 6 is imaged, and the imaging result is recognized and processed by the first component recognition unit 23b. 6 position is recognized. In this state, the light irradiation unit 8 is not correctly aligned with the chip 6 to be picked up, and the light transmission range T of the shutter mechanism 9 is shifted from the center of the chip 6.

  Next, an alignment process is executed (ST3). That is, the above-described positional deviation is corrected based on the recognition result in the first electronic component recognition step, and the light irradiation unit 8 is correctly aligned below the chip 6 to be picked up. Thereby, as shown in FIG. 10, the light transmission range T is located immediately below the chip 6. Next, based on the chip size data read in (ST1), a translucent range changing step is executed as necessary (ST4), and then a light irradiation step is executed (ST5).

  That is, when the preset translucent range T in the shutter mechanism 9 is a size corresponding to the target chip 6, light irradiation is performed using the translucent range T as it is as shown in FIG. 10. . If the preset translucent range T is different from the size corresponding to the target chip 6, the translucent range changing operation is performed by driving the shutter drive mechanism 9a. As shown in FIG. 14, this operation is performed by moving the light shielding plates 37, 38 in the direction of the overlapping surface, whereby the light transmission range T formed by overlapping the light transmission portions 37 b, 38 b is The size is newly changed to correspond to the chip 6.

  In the light irradiation step, as shown in FIGS. 10 and 14, the UV light source unit 8 b is turned on, and the adhesive layer 5 a located on the back surface of the chip 6 to be picked up is irradiated with ultraviolet rays from the lower surface side of the sheet 5. By doing so, nitrogen gas is generated from the adhesive layer 5a. This light irradiation is continuously executed for a predetermined time T1 set in advance as a time parameter T1, during which the first camera 17 is retracted from above the chip 6 to be picked up and the component holding head 19 is moved to the chip. 6 above.

Then, the elapse of time T2 is monitored by a timer (ST6), and the predetermined time T2 is timed up, and nitrogen gas generated from the adhesive layer 5a is accumulated in a sufficient amount at the adhesive interface between the chip 6 and the adhesive layer 5a. 11. If the gas layer G is formed as shown in FIG. 15, the holding tool lowering step is executed (ST7). That is, as shown in FIGS. 12 and 16, the holding tool 20 is lowered and brought into contact with the upper surface of the chip 6, and the chip 6 is held by vacuum suction. Next, a holding tool raising step is executed (ST8), and as shown in FIGS. 13 and 17, the holding tool 20 is raised together with the chip 6, and the chip 6 is peeled from the sheet 5 and picked up.

  If the chip 6 is picked up, the second electronic component recognition process is executed (ST9). That is, the component holding head 19 is moved above the second camera 13, the chip 6 held by the holding tool 20 is imaged by the second camera 13, and the imaging result is recognized, whereby the component holding head 19 is moved. The position of the held chip 6 is recognized. In the above-described light irradiation process, nitrogen gas is generated before the holding tool 20 contacts the chip 6, and therefore it is considered that the chip 6 moves to cause a positional shift. Therefore, when the chip 6 is mounted on the substrate 12, it is desirable to recognize the position of the chip 6 held by the holding tool 20.

  Thereafter, the component holding head 19 moves to the substrate holding stage 10 and executes an electronic component positioning step (ST10). That is, the component holding head moving mechanism 18 is controlled by reflecting the recognition result in the second electronic component recognition step, and the chip 6 held by the holding tool 20 and the substrate 12 are aligned. Next, an electronic component mounting step is executed (ST11), and the aligned chip 6 is mounted on the substrate 12.

  The chip pickup operation in the electronic component mounting operation includes a light irradiation process for reducing the sticking holding force of the chip 6 by the adhesive by irradiating the sheet 5 with light from below, and a pickup process for picking up the chip 6 from the sheet 5. And a translucent range changing step of changing the shape / size of the translucent range T through which the ultraviolet light from the UV light source unit 8b passes according to the shape / size of the chip 6 prior to the light irradiation step. It has become.

  Then, in the above-described translucent range changing step, a plurality of light shielding plates 37 and 38 each provided with a substantially L-shaped light shielding portion that blocks ultraviolet rays and a light transmitting portion that transmits light are overlapped to form a light transmitting portion. Are formed, and the shape and size of the light transmission range T are changed by moving the light shielding plates 37 and 38 to each other in the direction of the overlapping surface.

  By adopting such a configuration, it is possible to solve the following problems in the conventional chip pickup device configured to reduce the adhesive force for holding the semiconductor chip on the carrier by irradiating ultraviolet rays when picking up the semiconductor chip. It is possible.

  In the die bonding apparatus, the type of the target semiconductor chip is not necessarily constant, and various types of semiconductor chips with different shapes and sizes are targeted. However, in the conventional apparatus, it differs from the standard size set in the apparatus. In the case of a chip of a size, excess and deficiency occurred in the effect of reducing the adhesive force due to ultraviolet irradiation, resulting in problems such as pick-up mistakes and chip misalignment on the sheet.

  On the other hand, in the chip pickup device shown in the present embodiment, the shape / size of the translucent range T is changed according to the shape / size of the chip 6 prior to the light irradiation step of irradiating the sheet 5 with ultraviolet rays. Since the configuration is adopted, it is possible to always irradiate ultraviolet rays in an appropriate range according to the chip size. Therefore, even when a variety of chips of different sizes are targeted, the chips can be stably picked up without causing problems such as pick-up mistakes and chip position shifts.

INDUSTRIAL APPLICABILITY The chip pickup apparatus and the chip pickup method of the present invention have an effect that a variety of chips of different sizes can be stably picked up, and the chip held on the sheet in the die bonding apparatus is picked up to the substrate. Useful for mounting applications.

The side view of the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the shutter mechanism provided in the light irradiation part of the electronic component mounting apparatus of one embodiment of this invention Shape explanatory drawing of the light-shielding plate in the shutter mechanism of the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of operation | movement of the shutter mechanism of the electronic component mounting apparatus of one embodiment of this invention The top view of the shutter mechanism provided in the light irradiation part of the electronic component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the electronic component mounting apparatus of one embodiment of this invention Operation flow diagram of electronic component mounting method of one embodiment of the present invention Explanatory drawing of the operation | movement timing in the electronic component pick-up apparatus of one embodiment of this invention Operation explanatory diagram of electronic component pickup method of one embodiment of the present invention Operation explanatory diagram of electronic component pickup method of one embodiment of the present invention Operation explanatory diagram of electronic component pickup method of one embodiment of the present invention Operation explanatory diagram of electronic component pickup method of one embodiment of the present invention Operation explanatory diagram of electronic component pickup method of one embodiment of the present invention Operation explanatory diagram of electronic component pickup method of one embodiment of the present invention Operation explanatory diagram of electronic component pickup method of one embodiment of the present invention Operation explanatory diagram of electronic component pickup method of one embodiment of the present invention Operation explanatory diagram of electronic component pickup method of one embodiment of the present invention

Explanation of symbols

2 Component supply stage 5 Sheet 5a Adhesive layer 6 Chip 7 Light irradiation unit moving mechanism 8 Light irradiation unit 9 Shutter mechanism 10 Substrate holding stage 12 Substrate 18 Component holding head moving mechanism 19 Component holding head 20 Holding tool 37, 38 Light shielding plate 37a, 38a Light-shielding part 37b, 38b Translucent part T Translucent range

Claims (6)

A chip pickup device that picks up the chip from a sheet having a chip stuck and held on the upper surface by an adhesive,
A sheet holding unit for holding the sheet, pick-up means for picking up the chip from the sheet, and sticking of the chip with the adhesive by irradiating the sheet with light from below provided on the sheet holding unit A light irradiating means for reducing the holding force; and a light transmissive range changing means for changing the shape and size of the light transmissive range provided between the light irradiating means and the lower surface of the sheet. A chip pickup device.   The light transmission range changing unit includes a plurality of light shielding plates each provided with a light shielding portion that blocks light and a light transmission portion that transmits light, and forms a light transmission range in which the light transmission portions overlap each other. The chip pickup device according to claim 1, further comprising: a portion, wherein the shape and size of the light transmission range are changed by moving the light shielding plates in the overlapping surface direction.   The chip pickup device according to claim 1, wherein the translucent range has a rectangular shape. A chip pick-up method for picking up the chip from a sheet having a chip stuck and held on the upper surface by an adhesive,
Including a light irradiation step of reducing the sticking holding power of the chip by the adhesive by irradiating light on the sheet from below, and a pickup step of picking up the chip from the sheet, prior to the light irradiation step A chip pick-up method, comprising: performing a translucent range changing step of changing a shape / size of a translucent range through which light irradiated to the sheet is transmitted according to the shape / size of the chip.   In the light transmission range changing step, a plurality of light shielding plates each provided with a light blocking portion that blocks light and a light transmitting portion that transmits light are overlapped to form a light transmitting range where the light transmitting portions overlap, 5. The chip pickup method according to claim 4, wherein the shape and size of the light transmission range are changed by moving the light shielding plates in the direction of the overlapping surface. 5. The chip pickup method according to claim 4, wherein the translucent range is formed in a rectangular shape.

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