JP2007329300A - Ultraviolet ray irradiation apparatus and cutter including the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultraviolet ray irradiation apparatus irradiating an ultraviolet ray with stable intensity without deteriorating light intensity with time, and also to provide a cutter including the apparatus. <P>SOLUTION: The ultraviolet ray irradiation apparatus irradiates an adhesive tape with a wafer stuck thereon with the ultraviolet ray and deteriorates adhesive force. The apparatus includes a housing 81 with an open top; an ultraviolet ray irradiation means 83 arranged inside the housing 81 so as to irradiate the ultraviolet ray; and a cover member 82 covering the opening of the housing 81 and having an ultraviolet ray transmission area 822, for transmitting the ultraviolet ray irradiated by the means 83. The ultraviolet ray irradiation means 83 includes: a light emitting diode attaching member 84; a plurality of ultraviolet ray light emitting diodes 80 linearly arrayed in the light emitting diode attaching member 84 in a range longer than the diameter of the wafer; and a moving means 86 for moving the light emitting diode attaching member 84, in a direction orthogonal to the arrayal direction of the ultraviolet ray light emitting diodes 80. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an ultraviolet irradiation device that reduces the adhesive strength of an adhesive tape by irradiating an adhesive tape to which a wafer, such as a semiconductor wafer, is adhered, and a cutting machine including the ultraviolet irradiation device.

  For example, in a semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a semiconductor wafer having a substantially disk shape, and ICs, LSIs, etc. are partitioned in these partitioned regions. The circuit is formed. Each semiconductor chip is manufactured by dicing the semiconductor wafer along a street with a cutting machine.

  As described above, when a semiconductor wafer is diced by a cutting machine, the semiconductor wafer is previously attached to the surface of an adhesive tape attached to an annular frame so that the divided semiconductor chips do not fall apart. A plurality of semiconductor chips in which the semiconductor wafer adhered to the adhesive tape is cut along the streets and divided into individual pieces are supported in the annular frame via the adhesive tape. It is conveyed to the die bonding process, picked up one by one from the adhesive tape by the die bonder, and is mounted at a predetermined position on the lead frame or package.

In order to facilitate the pick-up operation of the semiconductor chip by the die bonder, the so-called UV tape whose adhesive strength is reduced by irradiating ultraviolet rays is generally used as the adhesive tape, and after dividing the semiconductor wafer into a plurality of semiconductor chips. The adhesive tape is irradiated with ultraviolet rays.
In Patent Document 1 below, an ultraviolet irradiation unit is disposed in a cutting machine, and while the next semiconductor wafer is being diced, the diced semiconductor wafer is conveyed to the ultraviolet irradiation unit to obtain a diced semiconductor wafer. A cutting machine is disclosed in which a so-called UV tape that has been adhered is irradiated with ultraviolet rays.
JP 2003-203887 A

  As the ultraviolet light emitter constituting the ultraviolet irradiation unit, an ultraviolet irradiation lamp in the form of a fluorescent lamp is used. However, since the intensity of light in the UV irradiation lamp decreases with time, it is necessary to adjust the irradiation time regularly and replace it regularly. In short, there is a problem with productivity.

  The present invention has been made in view of the above-mentioned facts, and the main technical problem thereof is an ultraviolet irradiation device capable of irradiating ultraviolet rays having a stable intensity without decreasing the intensity of light with the passage of time. And a cutting machine including an ultraviolet irradiation device.

In order to solve the above-mentioned main technical problem, according to the present invention, in the ultraviolet irradiation device for irradiating the adhesive tape to which the wafer is adhered, the adhesive strength of the adhesive tape is reduced.
A housing having an upper opening, an ultraviolet irradiation means disposed in the housing for irradiating ultraviolet rays, and an ultraviolet transmissive region that covers the opening of the housing and transmits ultraviolet rays irradiated by the ultraviolet irradiation means And comprising
The ultraviolet irradiation means includes: a light emitting diode mounting member; a plurality of ultraviolet light emitting diodes linearly arranged on the light emitting diode mounting member in a range longer than the diameter of the wafer; Moving means that moves in a direction orthogonal to the arrangement direction of the diodes,
The ultraviolet irradiation device characterized by this is provided.

The adhesive tape to which the wafer is attached is attached to an annular frame having a circular opening, and the ultraviolet transmission region of the cover member is set to be equal to or larger than the area of the wafer and equal to or smaller than the circular opening of the annular frame. .
The external line irradiation means preferably includes a cylindrical lens that condenses the ultraviolet rays irradiated from the plurality of ultraviolet light emitting diodes in a direction orthogonal to the arrangement direction of the plurality of ultraviolet light emitting diodes.
It is desirable that the light emitting diode mounting member of the ultraviolet irradiation means is provided with a plurality of fins for heat dissipation.
The external line irradiation means preferably includes a cooling fan for supplying cold air to the light emitting diode mounting member.
Further, it is desirable to have a control means for controlling lighting and extinguishing of the plurality of ultraviolet light emitting diodes corresponding to the outer peripheral edge of the wafer.

  Further, according to the present invention, a cassette mounting mechanism including a cassette mounting table for mounting a cassette containing a wafer attached to an adhesive tape mounted on an annular frame, and a cassette mounting mechanism mounted on the cassette mounting table. A cutting machine comprising a loading / unloading means for unloading a wafer accommodated in the placed cassette and loading the wafer into the cassette, and a cutting means for cutting the wafer unloaded by the loading / unloading means, A cutting machine characterized in that the ultraviolet irradiation device according to claim 1 is disposed at a required position is provided.

  It is desirable that the ultraviolet irradiation device is disposed below the cassette mounting table.

  According to the present invention, since the ultraviolet light emitting diode is used as the ultraviolet light emitter, it is possible to irradiate the ultraviolet light with a stable intensity without decreasing the light intensity with time. Further, according to the present invention, the ultraviolet light emitting diode is linearly arranged on the light emitting diode mounting member, and the entire surface of the adhesive tape to which the wafer is attached is irradiated by moving the light emitting diode mounting member. Therefore, the number of expensive ultraviolet light emitting diodes used can be suppressed.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of an ultraviolet irradiation device and a cutting machine equipped with the ultraviolet irradiation device according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a cutting machine equipped with an ultraviolet irradiation device constructed according to the present invention.
The cutting machine in the illustrated embodiment includes a machine body housing 2 having a substantially rectangular parallelepiped shape. In this machine body housing 2, a chuck table 3 for holding a workpiece is disposed so as to be movable in a cutting feed direction indicated by an arrow X which is a cutting feed direction. The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 mounted on the suction chuck support 31, and is a workpiece on a mounting surface that is a surface of the suction chuck 32. For example, a disk-shaped wafer is held by suction means (not shown). The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown).

  The cutting machine in the illustrated embodiment includes a spindle unit 4 as cutting means. The spindle unit 4 is mounted on a moving base (not shown) and is adjusted to move in a direction indicated by an arrow Y that is an indexing direction and a direction indicated by an arrow Z that is a cutting direction. A rotary spindle 42 supported and rotated by a rotary drive mechanism (not shown) is provided, and a cutting blade 43 attached to the rotary spindle 42 is provided. Cutting water supply nozzles 44 are disposed on both sides of the cutting blade 43. This cutting water supply nozzle 44 is connected to a cutting water supply means (not shown).

  The cutting machine in the illustrated embodiment captures an image of the surface of the wafer, which is a workpiece, held on the surface of the suction chuck 32 constituting the chuck table 3, and detects an area to be cut by the cutting blade 43. The imaging means 5 for confirming the state of the cutting groove is provided. The imaging means 5 is composed of optical means such as a microscope and a CCD camera. The cutting machine in the illustrated embodiment includes a display unit 6 that displays an image captured by the imaging unit 5.

  The cutting machine in the illustrated embodiment includes a cassette 10 that accommodates a wafer as a workpiece. The cassette 10 is provided with a workpiece loading / unloading opening 101 for loading / unloading a wafer as a workpiece, and a plurality of rack shelves 102 for loading the wafer are vertically arranged on the inner surfaces of both side walls. It is provided facing. A wafer 11 which is a workpiece to be stored in the cassette 10 is formed in a disk shape as shown in FIG. 1, and ICs are formed in a large number of areas partitioned by streets 111 formed in a lattice shape on the surface thereof. A device 112 such as an LSI is formed. The wafer 11 formed in this way is stuck to the surface of the adhesive tape 13 attached to the annular frame 12 having a circular opening 12a. The adhesive layer of the adhesive tape 13 is a so-called UV tape whose adhesive strength is reduced by irradiating ultraviolet rays of a predetermined wavelength. The cassette 10 containing the wafer 11 is placed on the ultraviolet irradiation device containing means 71 that also serves as a cassette placement table of the cassette placement mechanism 7 with the workpiece carry-in / out opening 101 facing the temporary placement region 14. The cassette mounting mechanism 7 will be described in detail later.

  The cutting machine in the illustrated embodiment includes a carry-in / out means 15 for carrying out the wafer 11 as a workpiece housed in the cassette 10 to the temporary placement region 14 and carrying the wafer 11 after the cutting into the cassette 10; The conveying means 16 that conveys the wafer 11 carried out by the carry-in / out means 15 onto the chuck table 3, the cleaning means 17 that cleans the wafer 11 cut by the chuck table 3, and the chuck table 3. A cleaning transport unit 18 for transporting the wafer 11 to the cleaning unit 17 is provided.

  Next, the cassette mounting mechanism 7 will be described with reference to FIGS. The cassette mounting mechanism 7 in the illustrated embodiment includes an ultraviolet irradiation device housing means 71 on which the cassette 10 is mounted, and an elevating device 72 for moving the ultraviolet irradiation device housing means 71 in the vertical direction. . The ultraviolet irradiation device accommodating means 71 includes a bottom wall 711, an upper wall 712, a rear wall 713, and both side walls (only one side wall 714 is shown in FIGS. 2 and 3). An opening 710 is formed on the workpiece loading / unloading mechanism side. The upper wall 712 constituting the ultraviolet irradiation device housing means 71 functions as a cassette mounting table, and a positioning member 711 for positioning when the cassette 10 is mounted is provided on the upper surface thereof as shown in FIG. As shown in FIGS. 2 and 3, the ultraviolet irradiation device accommodating means 71 is fixed on a support base 73 on which the bottom wall 711 is raised and lowered by the raising and lowering means 72.

  As shown in FIGS. 2 and 3, the elevating means 72 in the illustrated embodiment includes a male screw rod 721 disposed in the vertical direction along the side wall 21 of the body housing 2 and rotatably supported, and the male screw rod 721. A pulse motor 722 that can be rotated forward and backward, and a guide rail 723 that is disposed in parallel to both sides of the male screw rod 721 and extends in the vertical direction are provided, and the male screw rod 721 is provided at one end of the support base 73. The provided female screw hole 731 is screwed and the guided rail 732 is fitted to the guide rail 723. Accordingly, when the pulse motor 722 is rotationally driven in one direction, the support base 73 is raised along the male screw rod 721 and the guide rail 723, and when the pulse motor 722 is rotationally driven in the other direction, the support base 73 is supported by the male screw rod 721 and the guide rail. 723 is lowered. As shown in FIG. 2, the support base 73 moved up and down in this manner is such that the cassette 10 placed on the upper wall 712 constituting the ultraviolet irradiation device accommodating means 71 faces the carry-in / out means 15 and accommodates the ultraviolet irradiation device. The first loading / unloading position where the opening 710 of the means 71 is closed by the closing plate 22 disposed in the body housing 2 and the opening 710 of the ultraviolet irradiation device accommodating means 71 as shown in FIG. Is positioned at the second loading / unloading position opposite to the above. In the first carry-in / out position, the lifting / lowering means 72 adjusts the position corresponding to the accommodation position of the wafer accommodated in the cassette 10 placed on the ultraviolet irradiation apparatus accommodation means 71.

An ultraviolet irradiation device 8 is disposed in the ultraviolet irradiation device housing means 71. The ultraviolet irradiation device 8 will be described with reference to FIGS.
The ultraviolet irradiation device 8 in the illustrated embodiment includes a housing 81 whose upper side is opened, a cover member 82 covering the upper surface of the housing 81, an ultraviolet irradiation means 83 disposed in the housing 81, and the ultraviolet irradiation means 83. And moving means 86 for moving the.

  The housing 81 includes a bottom wall 811, a front wall 812, a rear wall 813, and both side walls 814 and 815, and an upper portion is opened. A notch 812a for avoiding buffering with the carry-in / out means 15 is formed at the upper center of the front wall 812.

  A cover member 82 that covers the opening is disposed on the upper surface of the housing 81 configured as described above. The cover member 82 includes a circular hole 821 corresponding to the wafer 11, and a circular plate glass 822 is attached to the hole 821. The circular plate glass 822 functions as an ultraviolet transmission region that transmits ultraviolet rays emitted from the ultraviolet irradiation means 83 described later. This ultraviolet light transmitting region is set to be not less than the area of the wafer 11 and not more than the area of the circular opening 12 a of the annular frame 12. A notch 82a for avoiding buffering with the carry-in / out means 15 is formed at the center front end of the cover member 82.

  The ultraviolet irradiation means 83 includes a light emitting diode mounting member 84, a support means 85 that supports the light emitting diode mounting member 84, and a moving means 86 that moves the support means 85. The diode mounting member 84 is formed in a rectangular parallelepiped shape and has a length larger than the diameter of the wafer 11. The diode mounting member 84 has a flat upper surface and a plurality of fins 841 for heat dissipation provided on the lower surface. A plurality of ultraviolet light emitting diodes 80 are linearly arranged in the range longer than the diameter of the wafer 11 along the longitudinal direction on the upper surface of the light emitting diode mounting member 84 thus configured. The plurality of ultraviolet light emitting diodes 80 may be arranged in a plurality of rows. The light-emitting diode mounting member 84 is provided with a cylindrical lens 800 made of a convex lens positioned above the plurality of ultraviolet light-emitting diodes 80. Both ends of the cylindrical lens 800 are fixed to the upper surface of the light emitting diode mounting member 84 by fixing members 801 and 802, and the ultraviolet rays emitted from the plurality of ultraviolet light emitting diodes 80 are orthogonal to the arrangement direction of the plurality of ultraviolet light emitting diodes 80. It arrange | positions so that it may condense in the direction to do.

  The light emitting diode mounting member 84 configured as described above has a plurality of fins 841 attached to the upper surface of the support means 85. The support means 85 is formed in a box shape by a bottom wall 851, an upper wall 852, a front wall 853, a rear wall 854, and both side walls 855 and 856. A plurality of cooling fans 857 are disposed in the box-shaped support means 85. A plurality of slit-shaped ventilation holes 852a for sending the cool air generated by the cooling fan 857 to the plurality of fins 841 provided in the light emitting diode mounting member 84 are formed in the upper wall 852 constituting the support means 85. Has been. Accordingly, since the cold air generated by the cooling fan 857 is supplied to the light emitting diode mounting member 84, the light emitting diode mounting member 84 heated by the lighting of the plurality of ultraviolet light emitting diodes 80 can be cooled. A pair of guided rails 858 and 858 guided by the moving means 86 are provided on the lower surface of the bottom wall 851 constituting the support means 85.

  The moving means 86 for moving the ultraviolet irradiation means 83 described above includes a guide member 87 having a width dimension corresponding to the dimension between the pair of guided rails 858 and 858. The guide member 87 is formed in a box shape by a bottom wall 871, an upper wall 872, a front wall 873, a rear wall 874, and both side walls 875 and 876. The upper wall 872 that constitutes the guide member 87 is provided with a long hole 872a in the longitudinal direction. By fitting the pair of guided rails 858 and 858 to the guide member 87 configured as described above, the guided rails 858 and 858 are guided to move along the side walls 875 and 876. Therefore, the light emitting diode mounting member 84 supported by the support means 85 provided with the guided rails 858 and 858 can move in a direction orthogonal to the arrangement direction of the plurality of ultraviolet light emitting diodes 80.

  The guide member 87 configured in a box shape as described above is provided with a drive mechanism 88 that moves the support means 85 that supports the light emitting diode mounting member 84 along the guide member 87. The drive mechanism 88 rotationally drives the pulleys 881 and 882 disposed at intervals on both ends in the longitudinal direction of the guide member 87, the endless belt 883 wound around the pulleys 881 and 882, and the pulley 881. The electric motor 884 is capable of normal / reverse rotation, and a part of the endless belt 883 is attached to the lower surface of the bottom wall 851 constituting the support means 85. The drive mechanism 88 configured in this manner moves the support means 85 in one direction via the pulleys 881 and 882 and the endless belt 883 by driving the electric motor 884 in the normal direction, and drives the electric motor 884 in the reverse direction. Thus, the support means 85 is moved in the other direction via the pulleys 881 and 882 and the endless belt 883.

  The moving means 86 configured as described above is disposed in the housing 81 along the side walls 875 and 876 in the longitudinal direction of the guide member 87. The ultraviolet irradiation device 8 configured as described above is disposed in the ultraviolet irradiation device accommodating means 71. At this time, the ultraviolet irradiation device 8 positions the front wall 812 side of the housing 81 on the opening 710 side of the ultraviolet irradiation device accommodating means 71.

The cutting machine in the illustrated embodiment is configured as described above, and the operation thereof will be described mainly with reference to FIG.
When cutting the wafer 11, the cassette 10 containing the wafer 11 is placed at a predetermined position on the ultraviolet irradiation device containing means 71 of the cassette placing mechanism 7. When the cassette 10 is placed on the ultraviolet irradiation device accommodating means 71, the ultraviolet irradiation device accommodating means 71 is positioned at the first carry-in / out position as shown in FIG. As shown in FIG. 2, the cassette 10 is placed at a predetermined position on the ultraviolet irradiation device accommodating means 71 at the first loading / unloading position, whereby the preparation for the cutting work of the wafer 11 accommodated in the cassette 10 is completed. .

  As described above, when preparation for the cutting operation is completed, when a cutting start switch (not shown) is turned on, the lifting / lowering means 72 of the cassette mounting mechanism 7 is operated to be mounted on the cassette mounting table 71. The cassette 10 is positioned at the first loading / unloading position shown in FIG. When the cassette 10 is positioned at the first loading / unloading position shown in FIG. 2, the loading / unloading means 15 is operated to hold the annular frame 12 that supports the wafer 11 placed on a predetermined shelf of the cassette 10. . As described above, the carry-in / out mechanism 15 that holds the annular frame 12 that supports the wafer 11 is simply referred to as the wafer 11 (hereinafter, the wafer 11 that is supported by the annular frame 12 via the adhesive tape 13). ) To the temporary storage area 14.

  The wafer 11 carried out to the temporary placement area 14 is transported to the mounting surface of the suction chuck 32 constituting the chuck table 3 by the turning operation of the transport means 16 and is sucked and held by the suction chuck 32. The chuck table 3 that sucks and holds the wafer 11 in this way is moved to a position immediately below the image pickup means 5. When the chuck table 3 is positioned immediately below the image pickup means 5, the street 111 formed on the wafer 11 is detected by the image pickup means 5, and is moved and adjusted in the direction of the arrow Y which is the indexing direction of the spindle unit 4 for precise alignment. Work is done.

  Thereafter, the wafer 11 held on the chuck table 3 is moved by moving the chuck table 3 holding the wafer 11 in the direction indicated by the arrow X which is the cutting feed direction (direction orthogonal to the rotation axis of the cutting blade 43). The cutting blade 43 cuts along a predetermined street 111 (cutting process). That is, the cutting blade 43 is mounted on the spindle unit 4 that is moved and adjusted in the direction indicated by the arrow Y that is the indexing direction and the direction indicated by the arrow Z that is the cutting direction, and is rotationally driven. Is moved along the lower side of the cutting blade 43 in the cutting feed direction indicated by the arrow X, the wafer 11 held on the chuck table 3 is cut along the predetermined street 111 by the cutting blade 43. In this manner, the wafer 11 is cut along the streets 111 to be divided into individual chips. The divided chips do not fall apart due to the action of the adhesive tape 13, and the state of the wafer 11 supported by the annular frame 12 via the adhesive tape 13 is maintained.

  When the cutting process is completed as described above, the divided chips supported by the annular frame 12 via the adhesive tape 13 (hereinafter referred to as the wafer 11 after the cutting process) first hold the wafer 11 by suction. In this state, the suction holding of the wafer 11 after cutting is released. Next, the wafer 11 after the cutting is transported to the cleaning unit 17 by the cleaning transport unit 18, where the cutting waste generated during the cutting is cleaned and removed (cleaning step). The wafer 11 after cutting that has been cleaned in this manner is transported to the temporary placement region 14 by the transport means 16.

  On the other hand, the cassette mounting mechanism 7 positions the ultraviolet irradiation device 8 at the second loading / unloading position shown in FIG. Then, by operating the carry-in / out means 15, as described above, the cut wafer 11 conveyed to the temporary placement area 14 is placed on the cover member 82 of the ultraviolet irradiation device 8 positioned at the second carry-in / out position. Placed at a predetermined position. The wafer 11 placed at a predetermined position on the cover member 82 is positioned in the ultraviolet light transmitting region formed by the circular plate glass 822 mounted in the circular hole 821 of the cover member 82.

  As described above, when the wafer 11 is placed on the cover member 82, the carry-in / out means 15 is positioned at a position indicated by a two-dot chain line in FIG. When the cut wafer 11 is conveyed to the ultraviolet irradiation device 8 in this manner, the cassette mounting mechanism 7 operates the elevating means 72 to be positioned at the first loading / unloading position shown in FIG. Then, the wafer 11 to be cut next is carried out from the cassette 10 and the above-described cutting operation is executed.

  Next, while the cutting work is being performed on the wafer 11 to be cut, the adhesive tape 13 to which the wafer 11 placed on the cover member 82 of the ultraviolet irradiation device 8 is attached is irradiated with ultraviolet rays. An ultraviolet irradiation process is performed. In this ultraviolet irradiation process, the ultraviolet light emitting diode 80 of the ultraviolet irradiation means 83 is turned on, and the electric motor 884 of the drive mechanism 88 constituting the moving means 86 is driven to arrange the light emitting diode mounting member on which the ultraviolet light emitting diode 80 is disposed. 84 is reciprocated along the guide member 87. As a result, the ultraviolet light emitted from the plurality of ultraviolet light emitting diodes 80 arranged linearly on the light emitting diode mounting member 84 is attached to the wafer 11 through the circular lens glass 822 provided on the cylindrical lens 800 and the cover member 82. The applied adhesive tape 13 is irradiated. As a result, the adhesive strength of the adhesive tape 13 to which the wafer 11 is attached is reduced. Although the ultraviolet light emitted from the ultraviolet light emitting diode 80 is diffused as shown in FIG. 7, it is condensed by passing through the cylindrical lens 800, so that the adhesive tape 13 is irradiated with strong light, so that the efficiency is improved. The adhesive force of the adhesive tape 13 can be reduced well. The ultraviolet irradiation device 8 in the illustrated embodiment uses the ultraviolet light emitting diode 80 as the ultraviolet light emitter, and therefore can irradiate the ultraviolet light with a stable intensity without decreasing the intensity of light over time. it can. In the ultraviolet irradiation device 8 in the illustrated embodiment, the ultraviolet light emitting diode 80 is linearly arranged on the light emitting diode mounting member 84, and the wafer 11 is adhered by moving the light emitting diode mounting member 84. Since the entire surface of the tape 13 is irradiated, the number of expensive ultraviolet light emitting diodes used can be suppressed. In the illustrated embodiment, the ultraviolet transmissive region provided in the cover member 82 is set to be not less than the area of the wafer 11 and not more than the area of the circular opening 12 a of the annular frame 12. The region where 11 is attached can be reliably irradiated with ultraviolet rays, and the region of the adhesive tape 13 attached to the annular frame 12 is not irradiated with ultraviolet rays. Therefore, it is possible to prevent the problem that the adhesive force is lowered by irradiating the region of the adhesive tape 13 attached to the annular frame 12 with ultraviolet light, and the adhesive tape 13 is peeled off from the annular frame 12 in advance. it can.

  As described above, when ultraviolet light is applied to the adhesive tape 13 to which the wafer 11 after cutting that has been conveyed to the ultraviolet irradiation device 8 is adhered, the cassette mounting mechanism 7 operates the elevating means 72 as shown in FIG. Position at the second loading / unloading position. Next, the carry-in / out means 15 is operated to carry out the wafer 11 after the cutting process, which is adhered to the adhesive tape 13 whose adhesive force has been lowered by the ultraviolet irradiation device 8. Then, after the lifting / lowering means 72 of the cassette mounting mechanism 7 is actuated to position the cassette 10 at the first carry-in / out position shown in FIG. 2, the carry-in / out means 15 is actuated again to remove the wafer 11 after cutting. 1 is accommodated in a predetermined position of the cassette 10 positioned at the carry-in / out position. Thus, when the wafer 11 after cutting is stored in a predetermined position of the cassette 10, the loading / unloading means 15 is operated to carry out the wafer to be cut next from the cassette 10, and the above-described cutting operation is repeated. carry out.

Next, another embodiment of a method for lighting a plurality of ultraviolet light emitting diodes 80 of the ultraviolet irradiation means 83 will be described with reference to FIGS.
In this embodiment, each of the plurality of ultraviolet light emitting diodes 80 is controlled by the control means 9. The control means 9 stores the coordinate values of the outer peripheral edge of the wafer 11 in a state where the wafer 11 is positioned at a predetermined position of the cover member 82 of the ultraviolet irradiation device 8. Then, as shown in FIGS. 9A, 9B, and 9C, the control means 9 moves the wafer along with the movement of the light emitting diode mounting member 84 in which a plurality of ultraviolet light emitting diodes 80 are linearly arranged. 11 is turned on (ON), and the ultraviolet light emitting diode 80 located at a position not facing the wafer 11 is turned off (OFF). In this way, by controlling lighting (ON) and extinguishing (OFF) of the plurality of ultraviolet light emitting diodes 80 corresponding to the outer peripheral edge of the wafer 11, power consumption can be suppressed and the ultraviolet light emitting diodes 80 can be controlled. The lifetime can be extended.

The perspective view of the cutting machine equipped with the ultraviolet irradiation device comprised according to this invention. Explanatory drawing which shows the 1st operation state of the cassette mounting mechanism with which the cutting machine shown in FIG. 1 is equipped. Explanatory drawing which shows the 2nd operation state of the cassette mounting mechanism with which the cutting machine shown in FIG. 1 is equipped. The perspective view of the ultraviolet irradiation device comprised according to this invention. The perspective view which decomposes | disassembles and shows the structural member of the ultraviolet irradiation device shown in FIG. Sectional drawing of the ultraviolet irradiation means which comprises the ultraviolet irradiation device shown in FIG. Explanatory drawing which shows the irradiation state of the ultraviolet-ray irradiated from the ultraviolet light emitting diode of the ultraviolet irradiation means which comprises the ultraviolet irradiation device shown in FIG. Explanatory drawing which shows embodiment of the control means for controlling the several ultraviolet light emitting diode of the ultraviolet irradiation means which comprises the ultraviolet irradiation device shown in FIG. Explanatory drawing which shows the state which controls lighting and light extinction of a several ultraviolet light emitting diode by the control means shown in FIG.

Explanation of symbols

2: Machine body housing 3: Chuck table 4: Spindle unit 43: Cutting blade 44: Cutting water supply nozzle 5: Imaging means 6: Display means 7: Cassette mounting mechanism 71: Ultraviolet irradiation device accommodating means 8: Ultraviolet irradiation device 72: Elevating means 80: Ultraviolet light emitting diode 800: Cylindrical lens 81: Housing 82: Cover member 83: Ultraviolet irradiation means 85: Support means 84: Light emitting diode mounting member 86: Moving means 9: Control means 10: Cassette 11: Wafer 12: Ring Frame 13: Adhesive tape 15: Loading / unloading means 16: Conveying means 17: Cleaning means 18: Cleaning and conveying means

Claims (8)

In the ultraviolet irradiation device that irradiates the adhesive tape to which the wafer is attached with ultraviolet rays to reduce the adhesive strength of the adhesive tape,
A housing having an upper opening, an ultraviolet irradiation means disposed in the housing for irradiating ultraviolet rays, and an ultraviolet transmissive region that covers the opening of the housing and transmits ultraviolet rays irradiated by the ultraviolet irradiation means And comprising
The ultraviolet irradiation means includes: a light emitting diode mounting member; a plurality of ultraviolet light emitting diodes linearly arranged on the light emitting diode mounting member in a range longer than the diameter of the wafer; Moving means that moves in a direction orthogonal to the arrangement direction of the diodes,
An ultraviolet irradiation device characterized by that. The adhesive tape to which the wafer is attached is attached to an annular frame having a circular opening,
The ultraviolet irradiation device according to claim 1, wherein the ultraviolet transmissive region of the cover member is set to be not less than the area of the wafer and not more than the area of the circular opening of the annular frame.   The ultraviolet ray irradiation unit according to claim 1 or 2, wherein the ultraviolet ray irradiation means includes a cylindrical lens that collects ultraviolet rays emitted from the plurality of ultraviolet light emitting diodes in a direction orthogonal to an arrangement direction of the plurality of ultraviolet light emitting diodes. Irradiation device.   The ultraviolet irradiation device according to any one of claims 1 to 3, wherein the light emitting diode mounting member of the ultraviolet irradiation means is provided with a plurality of fins for heat dissipation.   The ultraviolet irradiation device according to any one of claims 1 to 4, wherein the ultraviolet irradiation means includes a cooling fan for supplying cold air to the light emitting diode mounting member.   6. The ultraviolet irradiation apparatus according to claim 1, further comprising a control unit that controls lighting and extinguishing of the plurality of ultraviolet light emitting diodes corresponding to the outer peripheral edge of the wafer.   A cassette mounting mechanism having a cassette mounting table for mounting a cassette storing a wafer attached to an adhesive tape mounted on an annular frame; and a cassette mounting mechanism mounted on the cassette mounting table. A cutting machine comprising: a loading / unloading means for unloading the wafer and loading the wafer into the cassette; and a cutting means for cutting the wafer unloaded by the loading / unloading means. A cutting machine, characterized in that the ultraviolet irradiation device described in 1 is disposed at a required position. The cutting machine according to claim 7, wherein the ultraviolet irradiation device is disposed below the cassette mounting table.

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