200807537 (1) 九、發明說明 【發明所屬之技術領域】 本發明，是有關對於黏合有半導體晶圓等的晶圓的膠 帶照射紫外線使膠帶的黏接力下降的紫外線照射裝置及具 備紫外線照射裝置的切削機。 w 【先前技術】 φ 例如，在半導體裝置製造過程，是在略圓板形狀也就 是半導體晶圓的表面藉由配列成格子狀的格線的分割予定 線被區劃成複數領域，在此被區劃的領域形成1C、LSI等.. 的電路。而且，將半導體晶圓沿著格線藉由切削機切割成 方塊來製造各半導體晶片。 如上述藉由切削機將半導體晶圓切割成方塊時，被分 割的半導體晶片不會散落地預先將半導體晶圓黏合於被裝 設於環狀的框架上的膠帶的表面上。如此黏合於膠帶上的 φ 半導體晶圓是沿著格線被切斷分割的複數個半導體晶片， 是在藉由膠帶被支撐於環狀的框架的狀態下被搬運至次過 程也就是黏晶過程，藉由模具黏合器從膠帶每次拾取1個 並被裝設至導引框架或包裝的預定位置。 爲了使模具黏合器的半導體晶片的拾取作業容易，膠 帶一般使用藉由照射紫外線讓黏接力下降的UV帶，將半 導體晶圓分割成複數個半導體晶片後將紫外線照射於膠帶 〇 在下述的專利文獻1的切削機，是將紫外線照射組件 -4- 200807537 (2) 配設於切削機，再接著的將半導體晶圓切割成方塊之間， 將已切割成方塊的半導體晶圓搬運至紫外線照射組件對於 黏合有已切割成方塊的半導體晶圓的UV帶照射紫外線。 [專利文獻1]日本特開2003 -203 8 8 7號公報 f 【發明內容】 (本發明所欲解決的課題） φ 構成上述紫外線照射組件的紫外線發光體，是使用螢 光燈形態的紫外線照射燈泡。然而，紫外線照射燈泡，因 爲其光的強度會隨著時間經過而下降，所以需要定期地調 整照射時間、定期地交換，因此有需要花費調整作業或交 換作業時間的生産性的問題。 本發明是鑑於上述事實，其主要的技術課題，是提供 一種光的強度不會隨著時間經過而下降的可以照射強度穩 定的紫外線的紫外線照射裝置及具備紫外線照射裝置的切 馨 削機。 (用以解決課題的手段） 因爲解決上述主要的技術課題，本發明提供一種紫外 線照射裝置，是對於黏合有晶圓的膠帶照射紫外線，使該 膠帶的黏接力下降，其特徵爲，具備：上側開口的外殼、 及配設於該外殻內供照射紫外線用的紫外線照射手段、及 覆蓋該外殼的開口具備讓由該紫外線照射手段所照射的紫 外線透過的紫外線透過領域的蓋構件，該紫外線照射手段 -5- 200807537 (3) ’是具備：發光二極管安裝構件、及在比該晶圓的直徑長 的範圍呈直線狀配列於該發光二極管安裝構件的複數紫外 線發光二極管、及將該發光二極管安裝構件朝對於該複數 紫外線發光二極管的配列方向垂直的方向移動的移動手段 〇 r 黏合有該晶圓的該膠帶是裝設於具有圓形開口的環狀 的框架，該蓋構件的紫外線透過領域，是設定成該晶圓的 φ 面積以上且該環狀的框架的圓形開口的面積以下。 上述紫外線照射手段，是具備將從複數紫外線發光二 極管照射的紫外線朝與複數紫外線發光二極管的配列方向. 垂直的方向集光的圓筒狀透鏡較佳。 在上述紫外線照射手段的發光二極管安裝構件中，設 有放熱用的複數鰭片較佳。 上述紫外線照射手段，是具備將冷風供給至發光二極 管安裝構件的冷卻用風扇較佳。 φ 且，具備對應該晶圓的外周緣控制該複數紫外線發光 二極管的點燈及息燈的控制手段較佳。 且，本發明提供一種切削機，是具備：内含可載置收 容有被黏合於被裝設於環狀的框架上的膠帶上的晶圓的卡 匣的卡匣載置台之卡匣載置機構、及將被收容於被載置於 該卡匣載置台上的該卡匣的晶圓搬出並且將晶圓搬入該卡 匣的搬出入手段、及將藉由該搬出入手段搬出的晶圓切削 的切削手段，其特徵爲：如申請專利範圍第1至6項中任 一項的紫外線照射裝置是配設於所需位置。 -6- 200807537 (4) 上述紫外線照射裝置，是配設於上述卡匣載置 側較佳。 (發明之效果） 依據本發明，因爲使用紫外線發光二極管作爲 發光體，所以光的強度是不會隨著時間經過下降， 射強度穩定的紫外線。且，依據本發明，因爲將紫 φ 光二極管呈直線狀配設於發光二極管安裝構件，藉 發光二極管安裝構件照射黏合有晶圓的膠帶的全面 可以抑制高價的紫外線發光二極管的使用個數。 【實施方式】 以下’參照添付圖面詳細說明本發明的紫外線 置及具備紫外線照射裝置的切削機的最佳的實施例 在第1圖中，顯示裝備有由本發明構成的紫外 裝置的切削機的立體圖。 圖示的實施例的切削機，是具備略直方體狀的 殼2。在此機體外殼2內，保持被加工物的挾盤載 是配設成朝切削送出方向也就是箭頭X所示的切 方向移動可能。挾盤載置台3，是具備：吸著挾盤 31、及裝設於該吸著挾盤支撐台31上的吸著挾盤 該吸著挾盤32的表面也就是載置面上藉由無圖示 段保持被加工物也就是例如圓板狀的晶圓。且，挾 台3，是藉由無圖示旋轉機構可轉動。 台的下 紫外線 可以照 外線發 由移動 ，所以 照射裝 〇 線照射 機體外 置台3 削送出 支撐台 32，在 吸引手 盤載置 200807537 (5) 圖示的實施例的切削機，是具備作爲切削手段的轉軸 組件4。轉軸組件4，是具備：裝設於無圖示移動基台且 朝分割方向也就是箭頭Y所示方向及切入方向也就是箭 頭Z所示方向可移動調整的轉軸外殼4 1、及可旋轉自如 地支撐於該轉軸外殼4 1並藉由無圖示的旋轉驅動機構被 旋轉驅動的旋轉轉軸42、及裝設於該旋轉轉軸42的切削 刀片43。在此切削刀片43兩側配設有供給切削水用的噴 φ 嘴44。此切削水供給噴嘴44是連接於無圖示的切削水供 給手段。 圖示的實施例的切削機，是具備攝影手段5，可攝影 被保持於構成上述挾盤載置台3的吸著挾盤32的表面的 被加工物也就是晶圓的表面，供檢出上述切削刀片43應 切削的領域、或確認切削溝的狀態用。此攝影手段5是如 顯微鏡或CCD照相機等的光學手段。且，圖示的實施例 的切削機，是具備顯示由攝影手段5所攝影的畫像的顯示 φ 手段6。 圖示的實施例的切削機，是具備收容作爲被加工物的 晶圓的卡匣1 0。卡匣1 0，是具備供出入被加工物也就是 晶圓用的被加工物搬出入開口 1 0 1，在兩側壁的內面上下 方向相面對設置供載置晶圓用的複數個的棚架1 02。收納 於卡匣1 〇的被加工物也就是晶圓Π，是形成如第1圖所 示的圓板形狀，在藉由形成於其表面的格子狀的格線111 所區劃的多數的領域形成1C、LSI等的裝置1 12。如此形 成的晶圓11，是黏合於被裝設於具備圓形開口 12a的環 -8- 200807537 (6) 狀的框架12上膠帶13的表面上。膠帶13的黏接層是使 用藉由照射預定波長的紫外線使黏接力下降的UV帶。收 容晶圓1 1的卡匣1 〇，是將被加工物搬出入開口 ！ 〇 1朝向 W B領域1 4地載置於兼具卡匣載置機構7的卡匣載置台 的紫外線照射裝置收容手段71上。又，對於卡匣載置機。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Cutting machine. w [Prior Art] φ For example, in the semiconductor device manufacturing process, the surface of the semiconductor wafer is divided into a plurality of fields by a predetermined predetermined line which is arranged in a lattice-like grid line on the surface of the semiconductor wafer, and is divided into a plurality of fields. The field forms a circuit of 1C, LSI, etc. Moreover, the semiconductor wafers are fabricated by cutting the semiconductor wafers into squares along the grid lines by a cutter. When the semiconductor wafer is cut into squares by the cutting machine as described above, the divided semiconductor wafer is not scattered and the semiconductor wafer is previously bonded to the surface of the tape mounted on the annular frame. The φ semiconductor wafer thus bonded to the tape is a plurality of semiconductor wafers which are cut and divided along the ruled line, and are transported to the secondary process by the tape being supported by the annular frame, that is, the die-bonding process. By picking up one piece of tape from the tape each time by a mold bonder and mounting it to a predetermined position of the guide frame or package. In order to facilitate the picking up of the semiconductor wafer of the mold bonder, the tape is generally used by dividing the semiconductor wafer into a plurality of semiconductor wafers by irradiating ultraviolet rays to reduce the adhesion force of the semiconductor wafer, and then irradiating the ultraviolet rays on the tape. The cutting machine of 1 is to arrange the ultraviolet irradiation component -4- 200807537 (2) on the cutting machine, and then to cut the semiconductor wafer into squares, and to transport the semiconductor wafer that has been cut into squares to the ultraviolet irradiation component. The UV band that is bonded to the semiconductor wafer that has been cut into squares is irradiated with ultraviolet rays. [Problem to be Solved by the Invention] φ The ultraviolet ray constituting the ultraviolet ray irradiation unit is ultraviolet ray irradiated in the form of a fluorescent lamp. light bulb. However, since the ultraviolet ray is irradiated to the bulb, the intensity of the light is lowered as time elapses. Therefore, it is necessary to periodically adjust the irradiation time and periodically exchange it. Therefore, there is a problem that it is necessary to adjust the productivity of the work or the exchange operation time. The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide an ultraviolet irradiation apparatus capable of irradiating an ultraviolet ray having a stable intensity without decreasing the intensity of light, and a dicing machine equipped with an ultraviolet ray irradiation apparatus. (Means for Solving the Problem) The present invention provides an ultraviolet ray irradiation device that irradiates ultraviolet rays on a tape to which a wafer is bonded to reduce the adhesive force of the tape, and is characterized in that: An open outer casing, an ultraviolet ray irradiation means for illuminating the ultraviolet ray disposed in the outer casing, and an opening covering the outer casing, and a cover member for transmitting ultraviolet rays through the ultraviolet ray irradiated by the ultraviolet ray irradiation means, the ultraviolet ray irradiation Means-5-200807537 (3) 'There are: a light-emitting diode mounting member, and a plurality of ultraviolet light-emitting diodes arranged linearly in a range longer than a diameter of the wafer, and mounting the light-emitting diode The moving means for moving the member toward the direction perpendicular to the arrangement direction of the plurality of ultraviolet light-emitting diodes 〇r is attached to the annular frame having a circular opening, and the ultraviolet light transmitting region of the cover member Is set to a circle of φ or more of the wafer and the circle of the ring-shaped frame The following area of the opening. The ultraviolet irradiation means is preferably a cylindrical lens that collects ultraviolet rays irradiated from the plurality of ultraviolet light-emitting diodes in a direction perpendicular to the arrangement direction of the plurality of ultraviolet light-emitting diodes. In the light-emitting diode mounting member of the ultraviolet irradiation means, it is preferable to provide a plurality of fins for heat radiation. The ultraviolet irradiation means is preferably a cooling fan that supplies cold air to the light-emitting diode mounting member. Further, it is preferable to have a control means for controlling the lighting and the light of the plurality of ultraviolet light-emitting diodes corresponding to the outer periphery of the wafer. Further, the present invention provides a cutting machine comprising: a cassette having a cassette mounting table in which a cassette of a wafer attached to an adhesive tape attached to a ring-shaped frame is placed; a mechanism, and a loading and unloading means for carrying the wafer loaded on the cassette mounting table and carrying the wafer into the cassette, and a wafer to be carried out by the loading and unloading means The cutting means for cutting is characterized in that the ultraviolet irradiation device according to any one of claims 1 to 6 is disposed at a desired position. -6- 200807537 (4) It is preferable that the above-mentioned ultraviolet irradiation device is disposed on the side of the cassette mounting. (Effect of the Invention) According to the present invention, since an ultraviolet light-emitting diode is used as an illuminant, the intensity of light is ultraviolet ray which does not decrease with time and has stable radiation intensity. Further, according to the present invention, since the violet φ photodiode is linearly disposed on the light emitting diode mounting member, the total number of expensive ultraviolet light emitting diodes can be suppressed by irradiating the entire surface of the tape to which the wafer is bonded by the light emitting diode mounting member. [Embodiment] Hereinafter, a preferred embodiment of an ultraviolet ray according to the present invention and a cutting machine equipped with an ultraviolet ray irradiation device will be described in detail with reference to the accompanying drawings. In Fig. 1, a cutting machine equipped with an ultraviolet device comprising the present invention is shown. Stereo picture. The cutting machine of the illustrated embodiment is a casing 2 having a substantially rectangular parallelepiped shape. In the casing 2 of the casing, it is possible to move the pallet load to hold the workpiece in the cutting direction, that is, the tangential direction indicated by the arrow X. The tray mounting table 3 includes a suction tray 31 and a suction tray mounted on the suction tray support table 31. The surface of the suction tray 32, that is, the mounting surface, is The illustrated segment holds the workpiece, that is, a wafer such as a disk. Further, the platform 3 is rotatable by a rotating mechanism (not shown). The lower ultraviolet ray of the stage can be moved by the outer line, so the illuminating unit is irradiated to the outside of the table 3 to cut off the support table 32, and the cutting machine of the embodiment shown in the drawing of the hand wheel is placed on the hand-held disk. The shaft assembly 4 of the means. The rotating shaft unit 4 is provided with a rotating shaft housing 4 1 that is mounted on a moving base without a drawing and that is movable in a direction indicated by an arrow Y and a cutting direction, that is, a direction indicated by an arrow Z, and is rotatable and freely The rotary shaft 42 that is rotatably driven by the rotary drive mechanism (not shown) and the cutting insert 43 attached to the rotary shaft 42 are supported by the rotary shaft housing 41. On both sides of the cutting insert 43, a spray φ nozzle 44 for supplying cutting water is disposed. This cutting water supply nozzle 44 is connected to a cutting water supply means (not shown). The cutting machine of the illustrated embodiment is provided with a photographing means 5 for photographing the surface of the workpiece, that is, the surface of the wafer, which is held on the surface of the suction chuck 32 constituting the tray mounting table 3, for detecting the above. The cutting insert 43 is to be used in the field of cutting or to confirm the state of the cutting groove. This photographing means 5 is an optical means such as a microscope or a CCD camera. Further, the cutting machine of the illustrated embodiment is provided with a display φ means 6 for displaying an image photographed by the photographing means 5. The cutting machine of the illustrated embodiment is provided with a cassette 10 for accommodating a wafer as a workpiece. The cassette 10 is provided with a plurality of workpieces for inserting and receiving a workpiece, that is, a workpiece for loading and unloading into the opening 10, and facing the inner surface of the both side walls. Scaffolding 1 02. The workpiece to be stored in the cassette 1 is a wafer crucible, and is formed in a circular plate shape as shown in Fig. 1 and formed in a plurality of fields defined by lattice-shaped ruled lines 111 formed on the surface thereof. Device 1 12 such as 1C or LSI. The wafer 11 thus formed is bonded to the surface of the tape 13 attached to the frame 12 of the ring -8-200807537 (6) having the circular opening 12a. The adhesive layer of the tape 13 is a UV tape which is used to reduce the adhesive force by irradiating ultraviolet rays of a predetermined wavelength. When the cassette 1 1 of the wafer 1 is received, the workpiece is carried out into the opening! The 〇 1 is placed on the ultraviolet irradiation device housing means 71 of the cassette mounting table of the cassette mounting mechanism 7 toward the W B area 14 . Also, for the cassette mounting machine
I 構7，詳細說明如後。 圖示的實施例的切削機，是具備：將被收容於卡匣 Φ 1 0的作爲被加工物的晶圓1 1搬出至暫置領域1 4並且將 切削加工後的晶圓1 1搬入卡匣1 〇的搬出入手段1 5、及 將由該搬出入手段15搬出的晶圓11搬運至上述挾盤載置. 台3上的搬運手段16、及將由挾盤載置台3所切削加工 的晶圓1 1洗淨的洗淨手段1 7、及將由挾盤載置台3所切 削加工的晶圓11往洗淨手段17搬運的洗淨搬運手段18 〇 接著，參照第2圖及第3圖說明上述卡匣載置機構7 φ 。圖示的實施例的卡匣載置機構7，是具備：載置有上述 卡匣1 0的紫外線照射裝置收容手段7 1、及將該紫外線照 射裝置收容手段71朝上下方向移動用的昇降手段72。紫 外線照射裝置收容手段7 1，是由：底壁7 1 1及上壁7 1 2、 及後壁71 3、及兩側壁（第2圖及第3圖中只有顯示一側 壁7 1 4 )所構成，於被加工物搬出入機構側形成開口 7 i 〇 。構成紫外線照射裝置收容手段.7 1的上壁7 1 2是作爲卡 匣載置台的功能，設有當在其上面如第1圖所示載置卡匣 1 〇時供定位用的定位構件7 U。紫外線照射裝置收容手段 -9- 200807537 (7) 71，是固定於如第2圖及第3圖所示使底壁7Π可藉由昇 降手段72昇降的支撐台73上。 圖示的實施例的昇降手段72，是具備：如第2圖及 第3圖所示沿著機體外殼2的側壁21配設且朝上下方向 旋轉可能地被支撐的公螺絲桿72 1、及旋轉該公螺絲桿 * 7 2 1的正轉及反轉可能的脈衝馬達7 2 2、及平行配設並上 述公螺絲桿721的兩側並朝上下方向延伸的導引軌道723 φ ，使設在上述支撐台7 3的一端部的母螺紋孔7 3 1螺合於 公螺絲桿721，並且使被導引軌道732與導引軌道723嵌 合。因此，將脈衝馬達722朝一方向旋轉驅動的話，支撐、 台73會沿著公螺絲桿721及導引軌道723上昇，將脈衝 馬達722朝另一方向旋轉驅動的話，支撐台73會沿著公 螺絲桿721及導引軌道723下降。如此昇降的支撐台73 ’是位置於：如第2圖所示使被載置於構成紫外線照射裝 置收容手段71的上壁7 12的卡匣10與上述搬出入手段 φ 1 5相面對使紫外線照射裝置收容手段71的開口 7 1 0藉由 配設於機體外殼2內的閉塞板22所閉塞的第1搬出入位 置' 及如第3圖所示使紫外線照射裝置收容手段71的開 口 7 1 〇與搬出入手段1 5相面對的第2搬出入位置。又， 在第1搬出入位置，昇降手段72是對應被收容於被載置 於紫外線照射裝置收容手段7 1的卡匣1 0的晶圓的收容位 置進行位置調整。 在上述紫外線照射裝置收容手段71內，配設有紫外 線照射裝置8 °參照第4圖乃至第6圖說明此紫外線照射 -10- 200807537 (8) 裝置8。 圖示的實施例的紫外線照射裝置8，是具備··上方開 放的外殼81、及覆蓋外殼81上面的蓋構件82、及配設於 該外殼8 1內的紫外線照射手段83、及移動該紫外線照射 手段8 3用的移動手段8 6。 外殼81’是由：底壁811、及前壁812、及後壁813 、及兩側壁814，815所構成，且上方開口。又，在前壁 812的中央上部形成供回避與上述搬出入手段15的緩衝 用的缺口 8 1 2 a。 在如此結構外殻8 1的上面配設覆蓋開口用的蓋構件· 82。此蓋構件82，是具備與上述晶圓1 1對應的圓形的孔 821，在該孔821裝設圓形的板玻璃822。此圓形的板玻 璃822，是作爲讓從後述紫外線照射手段83照射的紫外 線透過的紫外線透過領域的功能。此紫外線透過領域，是 設定成晶圓1 1的面積以上且環狀的框架1 2的圓形開口 12a的面積以下。又’在蓋構件82的中央前端部形成供 回避與上述搬出入手段15的緩衝用的缺口 82a。 上述紫外線照射手段8 3，是具備··發光二極管安裝 構件84、及支撐該發光二極管安裝構件84的支撐手段85 、及移動該支撐手段85的移動手段86。二極管安裝構件 8 4，是形成直方體狀且具有比上述晶圓1 1的直徑大的長 度。此二極管安裝構件84的上面形成平面，並於下面設 置放熱用的複數鰭片8 4 1。在如此結構的發光二極管安裝 構件84的上面’複數紫外線發光二極管8〇是沿著長度方 -11 - 200807537 (9) 向在比晶圓1 1的直徑長的範圍配列成直線狀。又，胃_ 紫外線發光二極管80，是複數列配設也可以。且，t # 光二極管安裝構件84中配設有位置於複數紫外線= 極管80上方的由凸透鏡組成圓筒狀透鏡800。此自胃@ 透鏡8 00，是兩端藉由固定構件801、8 02固定於發光二 ' 極管安裝構件84的上面，並配置成使從複數紫外線發光 二極管80照射的紫外線朝與複數紫外線發光二極管8〇的 φ 配列方向垂直的方向集光。 如以上結構的發光二極管安裝構件84，是使複數鰭 片841側安裝於支撐手段85的上面。支撐手段85，是藉. 由底壁851、及上壁852、及前壁853、及後壁854、及兩 側壁85 5、8 5 6形成箱狀。在此箱狀的支撐手段85內配設 複數冷卻用風扇857。在構成支撐手段85的上壁852形 成將由冷卻用風扇8 5 7生成的冷風朝設在上述發光二極管 安裝構件84的複數鰭片841送出用的複數開縫狀的通過 馨 風孔852a。因此，由冷卻用風扇857生成的冷風因爲供 給至發光二極管安裝構件84，藉由複數紫外線發光二極 管8 0的點燈可以冷卻加熱發光二極管安裝構件8 4。且， 在構成支撐手段8 5的底壁8 5 1的下面設有由移動手段8 6 導引的一對被導引軌道858、8 5 8。 移動上述紫外線照射手段8 3的移動手段8 6，是具備 形成對應上述一對的被導引軌道8 5 8、8 5 8間的尺寸的寬 度尺寸的導引構件87。此導引構件87，是往底壁871、 及上壁872、及前壁873、及後壁874、及兩側壁875、 -12- 200807537 (10) 8 7 6形成箱狀。在構成導引構件8 7的上壁8 7 2，是在長度 方向設有長孔872a。藉由在如此結構的導引構件87嵌合 上述的一對被導引軌道858、85 8，使被導引軌道858、 858可沿著兩側壁875、876移動地被導引。因此’被支 撐於設有被導引軌道858、8 5 8的支撐手段85的發光二極 ‘管安裝構件84，可以朝與複數紫外線發光二極管80的配 列方向垂直的方向移動。 ^ 且，在如上述構成的箱狀的導引構件87，是配設有 將支撐發光二極管安裝構件84的支撐手段85沿著導引構 件87移動的驅動機構88。驅動機構88，是由：隔有間 配設於導引構件87的長度方向兩端部的帶輪88 1、882 ' 及捲繞於該帶輪881及8 82的無端皮帶8 83、及旋轉驅動 上述帶輪881的正轉•反轉可能的電動馬達8 84所構成’ 無端皮帶8 83的一部分是安裝於構成上述支撐手段85的 底壁8 5 1的下面。如此結構的驅動機構8 8，是將電動馬 φ 達8 84藉由正轉驅動透過帶輪881、882及無端皮帶883 支撐手段85朝一方向移動，藉由反轉驅動電動馬達884 透過帶輪881、882及無端皮帶883將支撐手段85朝另一 方向移動。 如以上結構的移動手段86，是於上述外殼8 1內使導 引構件87的長度方向沿著兩側壁875、8 76配設。如此結 構的紫外線照射裝置8，是配置於紫外線照射裝置收容手 段71內。這時，紫外線照射裝置8，是將外殼81的前壁 812側位置於紫外線照射裝置收容手段71的開口 71〇側 -13- 200807537 (11) 圖示的實施例的切削機的結構如以上，以下主要參照 第1圖的說明其作用。 在進行晶圓1 1的切削時，是將收容晶圓n的卡匣 10，載置於卡匣載置機構7的紫外線照射裝置收容手段 7 1上的預定位置。又，在紫外線照射裝置收容手段71上 載置卡匣1 0的情況時，紫外線照射裝置收容手段7 1是如 馨 第2圖所不位置在第1搬出入位置。如第2圖所示在第1 搬出入位置藉由使卡匣1 0載置於紫外線照射裝置收容手 段71上的預定位置，完成被收容於卡匣1 〇的晶圓n的 切削作業的準備。 如上述切削作業的準備完成的話，打開切削加工開始 開關（無圖示）的話，卡匣載置機構7的昇降手段72作 動將載置於卡匣載置台71的卡匣1〇位置至第2圖所示的 第1搬出入位置。卡匣10若位置於如第2圖所示的第1 φ 搬出入位置後，使搬出入手段1 5作動把持支撐被載置於 卡匣1 〇的預定的棚上的晶圓1 1的環狀的框架1 2。如此 ，把持供支撐晶圓1 1用的環狀的框架1 2的搬出入機構 15，是將晶圓11(以下，對於透過膠帶13將被支撐於環 狀的框架1 2的狀態的晶圓1 1只稱作晶圓1 1 )搬出至暫 置領域1 4。 被搬出至暫置領域1 4的晶圓1 1，是藉由搬運手段1 6 的繞轉動作搬運至構成上述挾盤載置台3的吸著挾盤32 的載置面，並被該吸著挾盤32吸引保持。如此吸引保持 -14· 200807537 (12) 著晶圓1 1的挾盤載置台3，是移動直到攝影手段5的正 下爲止。挾盤載置台3位置於攝影手段5的正下的話，藉 由攝影手段5檢出形成於晶圓1 1的格線1 !〗，朝轉軸組 件4的分割方向也就是箭頭γ方向移動調節進行精密的 位置對合作業。 之後，藉由將吸引保持著晶圓1 1的挾盤載置台3朝 切削送出方向也就是箭頭X所示方向（與切削刀片43的 旋轉軸垂直的方向）移動，被保持於挾盤載置台3的晶圓 1 1是藉由切削刀片43沿著預定的格線1 1 1被切斷（切削 過程）。即，因爲切削刀片43是裝設於朝分割方向也就_ 是箭頭Y所示方向及切入方向也就是箭頭Z所示方向的 可移動調整並定位的轉軸組件4上而被旋轉驅動，所以藉 由將挾盤載置台3沿著切削刀片43的下側朝箭頭X所示 切削送出方向移動，就可使被保持於挾盤載置台3的晶圓 1 1是藉由切削刀片43沿著預定的格線1 1 1被切斷。如此 藉由沿著格線1 1 1切斷晶圓1 1，而分割成各晶片。被分 割的晶片，是藉由膠帶1 3的作用不會散落，維持晶圓1 1 隔著膠帶1 3支撐於環狀的框架1 2的狀態。 如上述切削過程結束後，隔著膠帶1 3被支撐於環狀 的框架1 2的已分割的晶片（以下，指切削加工後的晶圓 11)，最初返回至吸引保持晶圓1 1的位置，在此解除切 削後的晶圓1 1的吸引保持。接著，切削加工後的晶圓1 1 ，是藉由洗淨搬運手段1 8被搬運至洗淨手段1 7，在此洗 淨除去於上述切削時生成的切削屑（洗淨過程）。如此洗 -15- 200807537 (13) 淨切削加工後的晶圓11，是藉由搬運手段16搬運至暫置 領域1 4。 另一方面，卡匣載置機構7，是將紫外線照射裝置8 位置於第3圖所示的第2搬出入位置。而且，搬出入手段 1 5作動將如上述被搬運至暫置領域1 4的切削加工後的晶 4 圓1 1，載置至位置於第2搬出入位置的紫外線照射裝置8 的蓋構件82上的預定位置。被載置於蓋構件82上的預定 φ 位置的晶圓1 1，是位置於由被裝設於蓋構件82的圓形的 孔8 2 1的圓形的板玻璃8 2 2形成的紫外線透過領域。 如上述，將晶圓1 1載置於蓋構件8 2上的話，將搬出: 入手段1 5位置於第3圖中2點鎖線所示位置。如此將切 削加工後的晶圓1 1搬運至紫外線照射裝置8的話，卡匣 載置機構7會作動昇降手段72並位置於第2圖所示的第 1搬出入位置。而且，接著將應被切削加工的晶圓1 1從 卡匣10搬出，實行上述切削作業。 φ 接著對於應被切削加工的晶圓1 1實施切削作業期間 ’對於黏合有被載置於紫外線照射裝置8的蓋構件8 2上 的晶圓1 1的膠帶1 3實施照射紫外線的紫外線照射過程。 此紫外線照射過程，是將紫外線照射手段8 3的紫外線發 光一極管8 0點燈，並且驅動構成移動手段8 6的驅動機構 88的電動馬達8 84將配設有紫外線發光二極管8〇的發光 一極管安裝構件84沿著導引構件87往復運動。此結果， 從呈直線狀配設於發光二極管安裝構件84的複數紫外線 發光一極管8 0發光的紫外線，是通過被設在圓筒狀透鏡 -16· 200807537 (14) 800及蓋構件82的圓形的板玻璃822照射於黏合有晶圓 1 1的膠帶13。此結果，黏合有晶圓1 1的膠帶1 3的黏接 力下降。又，從紫外線發光二極管80發光的紫外線，雖 如第7圖所示地擴散，但是因爲藉由通過圓筒狀透鏡8 〇〇 集光，且因爲強力光照射於膠帶13，所以可以有效下降 膠帶1 3的黏接力。圖示的實施例的紫外線照射裝置8， 因爲使用紫外線發光二極管8 0作爲紫外線發光體，所以 φ 光的強度不會隨著時間經過下降可以照射強度穩定的紫外 線。且’圖示的實施例的紫外線照射裝置8，因爲是在發 光二極管安裝構件84呈直線狀配設紫外線發光二極管80, ，藉由移動發光二極管安裝構件84照射黏合有晶圓1 1的 / 膠帶1 3的全面，所以可以抑制高價的紫外線發光二極管 的使用個數。且，圖示的實施例，因爲是設置於上述蓋構 件8 2的紫外線透過領域是設定成晶圓！ 1的面積以上且環 狀的框架1 2的圓形開口 1 2a的面積以下，所以紫外線可 φ 確實照射膠帶13中黏合有晶圓1 1的領域，膠帶1 3中裝 設於環狀的框架1 2的領域不會照射到紫外線。因此，膠 帶1 3中裝設於環狀的框架1 2的領域不會因爲照射到紫外 線而導致黏接力下降，可以事先防止膠帶1 3從環狀的框 架1 2剝離的問題。 如上述對於黏合有被搬運至紫外線照射裝置8的切削 加工後的晶圓1 1的膠帶1 3照射紫外線的話，卡匣載置機 構7會作動昇降手段72位置於第3圖所示的第2搬出入 位置。接著，作動搬出入手段〗5搬出黏合於藉由紫外線 -17- 200807537 (15) 照射裝置8而黏接力下降的膠帶1 3的切削加工後的晶 ;11。而且，卡匣載置機構7的昇降手段72作動將卡匣 位置於第2圖所示的第】搬出入位置後，再度作動搬出 手段1 5將切削加工後的晶圓！丨收容至位於第！搬出入 置的卡匣1 0的預定位置。如此，將切削加工後的晶圓 收容至卡匣10的預定位置的話，作動搬出入手段15將 著應切削的晶圓從卡匣1 0搬出，返覆實施上述的切削 • 業。 接著’參照第8圖及第9圖說明將上述紫外線照射 段8 3的複數紫外線發光二極管8 〇點燈的方法的其他的 施例。 此實施例，複數紫外線發光二極管8 0是分別由控 手段9控制。控制手段9內藏有記憶體，可容納晶圓 位置於上述紫外線照射裝置8的蓋構件82的預定位置 狀態的晶圓1 1的外周緣的座標値。而且，控制手段9 ❿ 是如第9圖（a ) 、（ b ) 、（ c )所示隨著呈直線狀配 於複數紫外線發光二極管8 0的發光二極管安裝構件8 4 移動，將位於晶圓1 1相面對位置的紫外線發光二極管 點燈，將未位於晶圓丨丨相面對位置的紫外線發光二極 8〇息燈。如此，藉由對應晶圓丨〗的外周緣地控制複數 外線發光二極管80點燈及息燈，可以抑制消耗電力， 可以延長紫外線發光二極管80的壽命。 【圖式簡單說明】 圓 10 入 位 11 接 作 手 實. 制 11 的 ， 列 的 80 管 紫 並 -18- 200807537 (16) [第1圖]裝備了依據本發明構成的紫外線照射裝置的 切削機的立體圖。 [第2圖]裝備於第i圖所示的切削機的卡匣載置機構 的第1作動狀態的說明圖。 [第3圖]裝備於第i圖所示的切削機的卡匣載置機構 的第2作動狀態的說明圖。 [第4圖]依據本發明構成的紫外線照射裝置的立體圖 〇 [第5圖]第4圖所示的紫外線照射裝置的構成構件的 分解立體圖。 [第6圖]構成第4圖所示的紫外線照射裝置的紫外線 照射手段的剖面圖。 [第7圖]從構成第4圖所示的紫外線照射裝置的紫外 線照射手段的紫外線發光二極管照射的紫外線的照射狀態 的說明圖。 [第8圖]控制構成第4圖所示的紫外線照射裝置的紫 外線照射手段的複數紫外線發光二極管用的控制手段的實 施例的說明圖。 [第9圖]藉由第8圖所示的控制手段控制複數紫外線 發光二極管的點燈及息燈的狀態的說明圖。 【主要元件符號說明】 2 :機體外殼 3 :挾盤載置台 -19- 200807537 (17) 4 :轉軸組件 5 :攝影手段 6 :顯不手段 7 :卡匣載置機構 胃 8 :紫外線照射裝置 9 :控制手段 1 0 :卡匣 1 1 : 晶圓 12 :框架 1 2 a :圓形開口 13 :膠帶 1 4 :暫置領域 1 5 :再度搬出入手段 1 5 :搬出入手段 1 6 :搬運手段 φ 17 :洗淨手段 1 8 :洗淨搬運手段 21 :側壁 22 :閉塞板 3 1 :吸著挾盤支撐台 3 2 :吸著挾盤 41 :轉軸外殻 4 2 :旋轉轉軸 43 :切削刀片 -20- 200807537 (18) 44 :切削水供給噴嘴 71 :卡匣載置台 71 :紫外線照射裝置收容手段 72 :昇降手段 7 3 :支撐台 80 :紫外線發光二極管 81 :外殻 82 :蓋構件 8 2 a .缺口 83 :紫外線照射手段 84 :發光二極管安裝構件 8 5 :支撐手段 86 :移動手段 87 :導引構件 88 :驅動機構 1 0 1 :被加工物搬出入開口 102 :棚架 1 1 1 :格線 1 12 :裝置 710 :開口 7 11 :定位構件 71 1 :底壁 712 :上壁 713 :後壁 -21 200807537 (19) 7 1 4 :側壁 721 :公螺絲桿 722 :脈衝馬達 723 :導引軌道 731 :母螺紋孔 732 :被導引軌道I structure 7, detailed description as follows. In the cutting machine of the illustrated embodiment, the wafer 11 as a workpiece to be accommodated in the cassette Φ 10 is carried out to the temporary field 14 and the wafer 1 1 after the cutting is carried into the card. The loading and unloading means 15 of the crucible 1 and the transporting means 16 for transporting the wafer 11 carried out by the loading and unloading means 15 to the above-mentioned pallet mounting table 3 and the crystal to be cut by the pallet mounting table 3 The cleaning means 1 for cleaning the circle 1 1 and the cleaning and transport means 18 for transporting the wafer 11 cut by the tray mounting table 3 to the cleaning means 17 are further described with reference to FIGS. 2 and 3 The above-described cassette mounting mechanism 7 φ . The cassette mounting mechanism 7 of the illustrated embodiment includes an ultraviolet irradiation apparatus storage means 7 1 on which the cassette 10 is placed, and a lifting means for moving the ultraviolet irradiation apparatus housing means 71 in the vertical direction. 72. The ultraviolet ray irradiation device accommodating means 71 is composed of a bottom wall 7 1 1 and an upper wall 7 1 2, a rear wall 71 3, and two side walls (only one side wall 7 1 4 is shown in FIGS. 2 and 3). In this configuration, an opening 7 i 形成 is formed on the side of the workpiece to be carried in and out of the mechanism. The upper wall 7 1 2 constituting the ultraviolet irradiation device housing means 71 is a function as a cassette mounting table, and is provided with a positioning member 7 for positioning when the cassette 1 is placed thereon as shown in Fig. 1 U. Ultraviolet irradiation device housing means -9- 200807537 (7) 71 is fixed to the support table 73 which can be raised and lowered by the raising and lowering means 72 as shown in Figs. 2 and 3. The lifting/lowering means 72 of the illustrated embodiment includes a male screw rod 72 1 disposed along the side wall 21 of the body casing 2 and rotatable in the vertical direction as shown in FIGS. 2 and 3, and Rotating the male screw rod 7 7 2 1 forward and reverse rotation possible pulse motor 7 2 2, and guiding rails 723 φ arranged in parallel and extending on both sides of the male screw shaft 721 in the up and down direction The female screw hole 733 of the one end portion of the support base 73 is screwed to the male screw 721, and the guided rail 732 is fitted to the guide rail 723. Therefore, if the pulse motor 722 is rotationally driven in one direction, the support and the table 73 will rise along the male screw 721 and the guide rail 723, and if the pulse motor 722 is rotationally driven in the other direction, the support table 73 will follow the male screw. The rod 721 and the guide rail 723 are lowered. The support table 73' thus raised and lowered is positioned such that the cassette 10 placed on the upper wall 7 12 constituting the ultraviolet irradiation device housing means 71 faces the loading/unloading means φ 15 as shown in Fig. 2 The opening 7p of the ultraviolet irradiation device housing means 71 is closed by the first loading/unloading position ' which is closed by the closing plate 22 provided in the casing 2, and the opening 7 of the ultraviolet irradiation device housing means 71 is shown as shown in Fig. 3. 1 第 The second loading and unloading position facing the loading and unloading means 1 5 . Further, at the first carry-in/out position, the elevating means 72 adjusts the position corresponding to the storage position of the wafer accommodated in the cassette 10 placed on the ultraviolet irradiation apparatus housing means 7 1 . In the ultraviolet irradiation apparatus storage means 71, an ultraviolet irradiation apparatus 8 is disposed. This ultraviolet irradiation -10- 200807537 (8) apparatus 8 will be described with reference to Fig. 4 to Fig. 6. The ultraviolet irradiation device 8 of the illustrated embodiment is provided with an outer casing 81 that is open above, a cover member 82 that covers the upper surface of the outer casing 81, and an ultraviolet irradiation means 83 disposed in the outer casing 81, and the ultraviolet rays are moved. The moving means 86 for the means of illumination 8 3 . The outer casing 81' is composed of a bottom wall 811, a front wall 812, a rear wall 813, and two side walls 814, 815, and is open at the upper side. Further, a notch 8 1 2 a for escaping the buffering of the loading/unloading means 15 is formed in the upper center portion of the front wall 812. A cover member 82 for covering the opening is disposed on the upper surface of the structural casing 81. The cover member 82 is provided with a circular hole 821 corresponding to the wafer 1 1 , and a circular plate glass 822 is attached to the hole 821. The circular plate glass 822 functions as a field of ultraviolet light transmitted through the ultraviolet rays irradiated from the ultraviolet irradiation means 83 to be described later. This ultraviolet light transmission region is set to be equal to or larger than the area of the wafer 11 and equal to or smaller than the area of the circular opening 12a of the annular frame 12. Further, a notch 82a for escaping from the loading/unloading means 15 is formed in the center front end portion of the lid member 82. The ultraviolet irradiation means 8.3 includes a light-emitting diode mounting member 84, a supporting means 85 for supporting the light-emitting diode mounting member 84, and a moving means 86 for moving the supporting means 85. The diode mounting member 804 is formed in a rectangular parallelepiped shape and has a length larger than the diameter of the wafer 11 described above. The upper surface of the diode mounting member 84 is formed into a flat surface, and a plurality of radiating plurality of fins 841 are disposed below. On the upper surface of the light-emitting diode mounting member 84 having such a configuration, the plurality of ultraviolet light-emitting diodes 8 are arranged linearly along the length -11 - 200807537 (9) in a range longer than the diameter of the wafer 11. Further, the stomach _ ultraviolet light emitting diode 80 may be arranged in a plurality of columns. Further, the t # photodiode mounting member 84 is provided with a cylindrical lens 800 composed of a convex lens positioned above the plurality of ultraviolet rays = the pole tube 80. The self-stomach @ lens 8 00 is fixed on the upper surface of the light-emitting diode assembly member 84 by fixing members 801 and 802, and is arranged to illuminate the ultraviolet rays from the plurality of ultraviolet light-emitting diodes 80 toward the plurality of ultraviolet rays. The φ of the diode 8 集 is arranged in a direction perpendicular to the direction of the light collection. The light-emitting diode mounting member 84 having the above configuration is such that the side of the plurality of fins 841 is attached to the upper surface of the supporting means 85. The supporting means 85 is formed by a bottom wall 851, an upper wall 852, a front wall 853, a rear wall 854, and two side walls 85 5, 8 6 . A plurality of cooling fans 857 are disposed in the box-shaped supporting means 85. The upper wall 852 constituting the supporting means 85 forms a plurality of slit-shaped passage holes 852a for conveying the cold air generated by the cooling fan 855 to the plurality of fins 841 provided in the light-emitting diode mounting member 84. Therefore, the cold air generated by the cooling fan 857 is supplied to the light emitting diode mounting member 84, and the heating of the light emitting diode mounting member 84 can be cooled by the lighting of the plurality of ultraviolet light emitting diodes 80. Further, a pair of guided rails 858, 859 guided by the moving means 86 are provided on the lower surface of the bottom wall 865 which constitutes the supporting means 85. The moving means 86 for moving the ultraviolet irradiation means 83 is a guide member 87 having a width corresponding to the size of the pair of guided rails 8 5 8 and 8 58 . The guiding member 87 is formed in a box shape toward the bottom wall 871, and the upper wall 872, and the front wall 873, and the rear wall 874, and the two side walls 875, -12-200807537 (10) 8 7 6 . In the upper wall 872 which constitutes the guiding member 87, a long hole 872a is provided in the longitudinal direction. The guided rails 858, 858 can be guided to move along the side walls 875, 876 by fitting the pair of guided rails 858, 85 8 in the guide member 87 thus constructed. Therefore, the light-emitting diode "tube mounting member 84" supported by the supporting means 85 provided with the guided rails 858, 859 can be moved in a direction perpendicular to the direction in which the plurality of ultraviolet light-emitting diodes 80 are arranged. Further, in the box-shaped guide member 87 configured as described above, the drive mechanism 88 for moving the support means 85 for supporting the light-emitting diode mounting member 84 along the guide member 87 is disposed. The drive mechanism 88 is composed of pulleys 88 1 and 882 ′ disposed at both end portions in the longitudinal direction of the guide member 87 and endless belts 8 83 wound around the pulleys 881 and 880 and rotating A part of the endless belt 8 83 which is formed by the electric motor 8 84 which drives the forward/reverse rotation of the pulley 881 is attached to the lower surface of the bottom wall 851 which constitutes the above-mentioned support means 85. The drive mechanism 8 8 of such a configuration moves the electric horse φ up to 8 84 in a direction by the forward rotation drive transmission pulleys 881, 882 and the endless belt 883 support means 85, and drives the electric motor 884 through the pulley 881 by the reverse rotation. , 882 and endless belt 883 move support means 85 in the other direction. The moving means 86 having the above configuration is such that the longitudinal direction of the guiding member 87 is disposed along the both side walls 875, 8 76 in the outer casing 81. The ultraviolet irradiation device 8 thus constructed is disposed in the ultraviolet irradiation device housing section 71. In this case, the ultraviolet ray irradiation device 8 has a structure in which the front wall 812 side of the outer casing 81 is positioned at the opening 71 of the ultraviolet ray irradiation device accommodating means 71, and the structure of the cutting machine of the embodiment shown in the above is as follows. The function is mainly explained with reference to Fig. 1. When the wafer 11 is cut, the cassette 10 accommodating the wafer n is placed at a predetermined position on the ultraviolet irradiation device housing means 7 of the cassette mounting mechanism 7. When the cassette 10 is placed on the ultraviolet irradiation apparatus housing means 71, the ultraviolet irradiation apparatus housing means 7 1 is in the first loading/unloading position as shown in Fig. 2 . As shown in Fig. 2, preparation for cutting the wafer n accommodated in the cassette 1 is completed by placing the cassette 10 at a predetermined position on the ultraviolet irradiation apparatus housing means 71 at the first loading/unloading position. . When the preparation of the cutting operation is completed, when the cutting start switch (not shown) is turned on, the lifting/lowering means 72 of the cassette mounting mechanism 7 is actuated to place the cassette 1 position on the cassette mounting table 71 to the second position. The first loading and unloading position shown in the figure. When the cassette 10 is positioned at the first φ loading/unloading position as shown in Fig. 2, the loading/unloading means 15 is actuated to support the ring of the wafer 1 1 placed on the predetermined shed of the cassette 1 〇. Shaped frame 1 2. In this manner, the loading/unloading mechanism 15 for holding the annular frame 1 for supporting the wafer 1 is a wafer 11 (hereinafter, the wafer is supported by the annular frame 12 in the transmission tape 13). 1 1 is called wafer 1 1 ) moved out to the temporary field 14 . The wafer 1 1 that has been carried out to the temporary field 14 is transported to the mounting surface of the suction tray 32 constituting the above-described tray mounting table 3 by the winding operation of the transport means 16 and is sucked by the suction The tray 32 attracts hold. In this way, the tray mounting table 3 of the wafer 1 is moved until the photographing means 5 is immediately below. When the disk mounting table 3 is positioned directly below the photographing means 5, the image line 5 detects the ruled line 1 formed on the wafer 1 and moves toward the direction of the arrow γ in the direction of the arrow γ. Sophisticated position for cooperation. Thereafter, the disk mounting table 3 that sucks and holds the wafer 1 is moved to the cutting table in the direction indicated by the arrow X (the direction perpendicular to the rotation axis of the cutting blade 43). The wafer 11 of 3 is cut by the cutting insert 43 along a predetermined ruled line 1 1 1 (cutting process). That is, since the cutting insert 43 is rotatably mounted on the rotary shaft assembly 4 which is movably adjusted and positioned in the direction indicated by the arrow Y and the direction of the cut arrow, that is, the direction indicated by the arrow Z, the cutting insert 43 is rotatably driven. By moving the disk mounting table 3 along the lower side of the cutting insert 43 in the cutting and feeding direction indicated by the arrow X, the wafer 11 held on the disk mounting table 3 can be made to be predetermined by the cutting blade 43. The grid line 1 1 1 is cut off. Thus, by dividing the wafer 1 1 along the ruled line 1 1 1 , the wafers are divided into individual wafers. The divided wafer is not scattered by the action of the tape 13, and the wafer 1 1 is maintained in a state of being supported by the annular frame 12 via the tape 13 . After the completion of the above-described cutting process, the divided wafer (hereinafter referred to as the wafer 11 after the cutting) supported by the annular frame 12 via the tape 13 is returned to the position of the suction holding wafer 11 first. Here, the suction holding of the wafer 1 1 after the cutting is released. Then, the wafer 1 1 after the cutting process is transported to the cleaning means 17 by the cleaning and transport means 18, and the chips generated during the cutting are washed and washed (washing process). Washing as such -15-200807537 (13) The wafer 11 after the net cutting process is transported to the temporary field 14 by the transport means 16. On the other hand, the cassette mounting mechanism 7 positions the ultraviolet irradiation device 8 at the second carry-in/out position shown in Fig. 3 . Then, the loading/unloading means 15 is actuated to place the crystal 4 circle 1 1 which has been conveyed to the temporary field 14 as described above on the cover member 82 of the ultraviolet irradiation device 8 positioned at the second carry-in/out position. The intended location. The wafer 11 placed at a predetermined φ position on the cover member 82 is transmitted through the ultraviolet ray formed by the circular plate glass 8 2 2 of the circular hole 8 2 1 installed in the cover member 82. field. As described above, when the wafer 11 is placed on the lid member 82, the carry-in means 15 is positioned at the position indicated by the 2-point lock line in Fig. 3. When the wafer 1 1 after the cutting process is transported to the ultraviolet irradiation device 8, the cassette mounting mechanism 7 moves the lifting/lowering means 72 and is positioned at the first loading/unloading position shown in Fig. 2 . Then, the wafer 1 to be cut is then carried out from the cassette 10 to perform the above-described cutting operation. φ Next, during the cutting operation, the wafer 1 1 to be cut is subjected to an ultraviolet irradiation process of irradiating ultraviolet rays to the tape 1 3 to which the wafer 1 1 placed on the lid member 8 2 of the ultraviolet irradiation device 8 is bonded. . In the ultraviolet irradiation process, the ultraviolet light-emitting diode 80 of the ultraviolet irradiation means 83 is turned on, and the electric motor 8 84 that drives the drive mechanism 88 constituting the moving means 86 is equipped with the ultraviolet light-emitting diode 8 The one-tube mounting member 84 reciprocates along the guiding member 87. As a result, the ultraviolet rays that are emitted from the plurality of ultraviolet light-emitting diodes 80 that are linearly arranged in the light-emitting diode mounting member 84 are provided by the cylindrical lenses -16, 200807537 (14) 800 and the cover member 82. The circular plate glass 822 is irradiated onto the tape 13 to which the wafer 11 is bonded. As a result, the adhesive force of the tape 13 to which the wafer 11 is bonded is lowered. Further, although the ultraviolet light emitted from the ultraviolet light-emitting diode 80 is diffused as shown in Fig. 7, since the light is collected by the cylindrical lens 8, and the strong light is applied to the tape 13, the tape can be effectively lowered. 1 3 adhesion. In the ultraviolet irradiation device 8 of the illustrated embodiment, since the ultraviolet light-emitting diode 80 is used as the ultraviolet light-emitting body, the intensity of the ? light does not decrease with time, and the ultraviolet light having stable intensity can be irradiated. Further, in the ultraviolet irradiation device 8 of the illustrated embodiment, since the ultraviolet light emitting diode 80 is disposed linearly in the light emitting diode mounting member 84, the wafer 1 1 is bonded by the moving light emitting diode mounting member 84. 1 3 is comprehensive, so it can suppress the number of expensive UV LEDs used. Further, in the illustrated embodiment, since the ultraviolet light transmission region provided in the cover member 8 2 is set as a wafer! Since the area of 1 is equal to or larger than the area of the circular opening 1 2a of the ring-shaped frame 12, the ultraviolet ray φ is surely irradiated to the area where the wafer 1 1 is bonded to the tape 13, and the tape 13 is mounted in the ring-shaped frame. The area of 1 2 will not be exposed to ultraviolet light. Therefore, in the field of the frame 1 2 in which the tape 13 is attached, the adhesive force is not lowered by the irradiation of the ultraviolet rays, and the problem that the tape 13 is peeled off from the annular frame 12 can be prevented in advance. When the ultraviolet ray of the tape 1 3 to be bonded to the wafer 1 1 after the cutting of the ultraviolet ray irradiation device 8 is irradiated with ultraviolet rays, the cassette mounting mechanism 7 moves the lifting means 72 to the second position shown in FIG. Move in and out. Next, the movable loading/unloading means _5 carries out the crystals 11 after the cutting of the adhesive tape 13 which is adhered to the irradiation device 8 by the ultraviolet ray -17-200807537 (15). Further, the elevating means 72 of the cassette mounting mechanism 7 is actuated to position the cassette at the first loading and unloading position shown in Fig. 2, and then the driving/unloading means 15 re-cuts the processed wafer!丨 accommodating to the first place! Move out the predetermined position of the inserted cassette 10 . When the wafer after the cutting is stored in the predetermined position of the cassette 10, the movable loading/unloading means 15 carries out the wafer to be cut from the cassette 10, and returns to perform the above-described cutting. Next, another embodiment of the method of lighting the plurality of ultraviolet light-emitting diodes 8 of the ultraviolet irradiation section 8 3 will be described with reference to Figs. 8 and 9. In this embodiment, the plurality of ultraviolet light emitting diodes 80 are controlled by the control means 9, respectively. The control means 9 contains a memory for accommodating the coordinates of the outer periphery of the wafer 11 at a predetermined position of the lid member 82 of the ultraviolet irradiation device 8. Further, the control means 9 移动 is moved as shown in Fig. 9 (a), (b), and (c) as the light-emitting diode mounting member 8 4 linearly coupled to the plurality of ultraviolet light-emitting diodes 80 moves to the wafer. The 1 1 phase facing UV LED lights up the UV-emitting diode 8 suffocating light that is not in the facing position of the wafer. In this manner, by controlling the plurality of external light-emitting diodes 80 lighting and the light source corresponding to the outer periphery of the wafer, the power consumption can be suppressed, and the life of the ultraviolet light-emitting diode 80 can be prolonged. [Simple description of the drawing] Round 10 in place 11 is connected to hand. In the case of system 11, 80 tubes of the column are purple and -18-200807537 (16) [Fig. 1] A cutting machine equipped with an ultraviolet irradiation device constructed according to the present invention Stereogram. [Fig. 2] An explanatory view of the first operation state of the cassette mounting mechanism of the cutting machine shown in Fig. i. [Fig. 3] An explanatory view of a second operation state of the cassette mounting mechanism of the cutting machine shown in Fig. i. [Fig. 4] A perspective view of an ultraviolet irradiation device constructed in accordance with the present invention. [Fig. 5] An exploded perspective view of the components of the ultraviolet irradiation device shown in Fig. 4. Fig. 6 is a cross-sectional view showing an ultraviolet ray irradiation means constituting the ultraviolet ray irradiation apparatus shown in Fig. 4. [Fig. 7] Fig. 7 is an explanatory diagram of an irradiation state of ultraviolet rays irradiated by an ultraviolet light-emitting diode constituting an ultraviolet ray irradiation means of the ultraviolet ray irradiation device shown in Fig. 4. [Fig. 8] Fig. 8 is an explanatory view showing an embodiment of a control means for a plurality of ultraviolet light-emitting diodes which constitute an ultraviolet irradiation means for constituting the ultraviolet irradiation device shown in Fig. 4. [Fig. 9] An explanatory diagram for controlling the state of the lighting and the light of the plurality of ultraviolet light-emitting diodes by the control means shown in Fig. 8. [Description of main component symbols] 2: Body casing 3: Tray mounting table -19- 200807537 (17) 4: Shaft assembly 5: Photographic means 6: Display means 7: Cartridge mounting mechanism Stomach 8: Ultraviolet irradiation device 9 : Control means 1 0 : cassette 1 1 : Wafer 12 : Frame 1 2 a : Circular opening 13 : Tape 1 4 : Temporary field 1 5 : Re-entry means 1 5 : Carry-in means 1 6 : Handling means φ 17 : Cleaning means 1 8 : Washing and transporting means 21 : Side wall 22 : Closing plate 3 1 : Suction holding plate support table 3 2 : Suction plate 41 : Shaft housing 4 2 : Rotating shaft 43 : Cutting insert -20- 200807537 (18) 44 : Cutting water supply nozzle 71 : cassette mounting table 71 : ultraviolet irradiation device housing means 72 : lifting means 7 3 : support table 80 : ultraviolet light emitting diode 81 : housing 82 : cover member 8 2 a. Notch 83: ultraviolet irradiation means 84: light-emitting diode mounting member 8 5: supporting means 86: moving means 87: guiding member 88: driving mechanism 1 0 1 : workpiece is carried in and out of opening 102: scaffold 1 1 1 : Grid 1 12 : Device 710 : Opening 7 11 : Positioning member 71 1 : Bottom wall 712 : Upper wall 713 : Back wall - 21 20080 7537 (19) 7 1 4 : Side wall 721 : Male screw 722 : Pulse motor 723 : Guide rail 731 : Female threaded hole 732 : Guided track
8 0 0:圓筒狀透鏡 801，802:固定構件 8 1 1 :底壁 812 :前壁 8 12a：缺口 813 ：後壁 814， 815 ：側壁8 0 0: cylindrical lens 801, 802: fixing member 8 1 1 : bottom wall 812 : front wall 8 12a: notch 813 : rear wall 814, 815 : side wall
821 ：孑L 822 :板玻璃 841 :鰭片 851 ：底壁 852 ：上壁 85 2a ：通過風孔 85 3 :前壁 854 ：後壁 8 5 5，8 5 6 :兩側壁 8 5 7 :冷卻用風扇 8 5 8 :被導引軌道 200807537 (20) 8 7 1 :底壁 872 ：上壁 8 7 2 a :長孔 8 7 3 :前壁 874 :後壁 875， 876:兩側壁 8 8 1 :帶輪 φ 8 8 2 :帶輪 8 8 3 :無端皮帶 8 8 4 :電動馬達821 : 孑L 822 : plate glass 841 : fin 851 : bottom wall 852 : upper wall 85 2a : through the air hole 85 3 : front wall 854 : rear wall 8 5 5, 8 5 6 : two side walls 8 5 7 : cooling With fan 8 5 8 : guided track 200807537 (20) 8 7 1 : bottom wall 872 : upper wall 8 7 2 a : long hole 8 7 3 : front wall 874 : rear wall 875, 876: two side walls 8 8 1 : Pulley φ 8 8 2 : Pulley 8 8 3 : Endless belt 8 8 4 : Electric motor