JP2019162581A - Ultraviolet irradiation device and cutting device - Google Patents

Abstract

To increase the operating efficiency of an ultraviolet irradiation device.SOLUTION: An ultraviolet irradiation device for irradiating ultraviolet rays to a frame unit including an adhesive tape whose adhesive layer is cured by ultraviolet irradiation and an adherend having adhered to the adhesive tape includes: a partition plate having a transmission region through which ultraviolet rays transmit, and separating a space inside the housing into a first chamber into which the frame unit is carried and a second chamber below the first chamber; an ultraviolet light source for irradiating the frame unit placed on the partition plate with the ultraviolet rays through the transmission region; a cooling mechanism for supplying nitrogen gas to the second chamber and cooling the ultraviolet light source with the nitrogen gas; and a nitrogen gas supply path serving as a nitrogen gas transfer path from the second chamber to the first chamber. The nitrogen gas having cooled the ultraviolet light source is movable from the second chamber to the first chamber through the nitrogen gas supply path. The ultraviolet irradiation device has a function of supplying the nitrogen gas onto the surface of the frame unit carried into the first chamber.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an ultraviolet irradiation device and a cutting apparatus including the ultraviolet irradiation device.

  In the manufacturing process of device chips used for electronic devices such as mobile phones and personal computers, first, a plurality of intersecting division lines are set on the surface of a wafer made of a material such as a semiconductor. Then, a device such as an IC (Integrated Circuit) or an LSI (Large Scale Integration) is formed in each region partitioned by the division lines. Then, a dicing tape is stuck on the back surface of the wafer, and the wafer is divided along the division line (street). Then, individual device chips are formed on the dicing tape.

  A tape such as a dicing tape used in a device chip manufacturing process includes, for example, an adhesive layer containing an ultraviolet curable resin. The pressure-sensitive adhesive layer exhibits a strong pressure-sensitive adhesive force with respect to the wafer, but cures and decreases the pressure-sensitive adhesive force when irradiated with ultraviolet rays. And when peeling the tape affixed on the wafer, an ultraviolet-ray is irradiated to a tape and the adhesive force of an adhesion layer is reduced.

  For irradiation of the tape with ultraviolet rays, for example, an ultraviolet irradiation device including a light source such as a light emitting diode (hereinafter referred to as ultraviolet LED) that emits ultraviolet rays is used (see Patent Document 1). The ultraviolet irradiation device includes, for example, a box-shaped housing in which a carry-in / out opening is formed, and the light source inside the housing. In the ultraviolet irradiation apparatus, the tape can be irradiated with ultraviolet rays by carrying an object to be irradiated including the tape into the housing from the carry-in / out entrance while the light source is activated.

  When a light source that emits ultraviolet light is activated, heat is generated from the light source. Therefore, in the ultraviolet irradiation device, a cooling mechanism such as a fan for air-cooling the light source is disposed in the vicinity of the light source. When the cooling mechanism is operated in accordance with the operation of the light source, the light source is cooled.

JP 2007-329300 A

  By the way, when the adhesive layer is cured by irradiating the tape with ultraviolet rays, curing of the adhesive layer is inhibited by oxygen in the atmosphere. If the adhesive layer is not sufficiently cured, an excessive force is required to peel off the tape, which may damage the device. In addition, the adhesive layer may remain on the device chip because the tape cannot be properly peeled off.

  On the other hand, if ultraviolet rays are irradiated with a strong intensity in order to cure the adhesive layer reliably, the power consumed for the irradiation of the ultraviolet rays and the cooling of the light source increases, and the operating efficiency of the ultraviolet irradiation device decreases, producing a device chip. Cost increases.

  Further, when the irradiation time of ultraviolet rays is increased, the device chip manufacturing efficiency is deteriorated. Furthermore, the time until the light source reaches the end of its life is shortened, and frequent light source replacement work is required. Since the ultraviolet irradiation device cannot be used while the light source is replaced, the operation efficiency of the ultraviolet irradiation device and the manufacturing efficiency of the device chip are deteriorated.

  The present invention has been made in view of such problems, and an object of the present invention is to provide an ultraviolet irradiation device with high operating efficiency and a cutting device including the ultraviolet irradiation device.

  According to one aspect of the present invention, a frame unit comprising: an annular frame; an adhesive tape that is stretched on the annular frame and the adhesive layer is cured by irradiation of ultraviolet rays; and an adherend that is attached to the adhesive tape. An ultraviolet irradiation device for irradiating the adhesive tape with ultraviolet rays, comprising: a housing having a side surface of the frame unit for carrying in and out; a transmission region through which ultraviolet rays are transmitted; and a shielding region through which ultraviolet rays are not transmitted; A partition plate that divides a space inside the housing into a first room into which the frame unit is carried in through a carry-in / out opening, a second room below the first room, and a second room An ultraviolet light source for irradiating the frame unit placed on the partition plate with ultraviolet rays through the transmission region, and supplying the nitrogen gas to the second chamber, A cooling mechanism for rejecting, and a nitrogen gas supply path serving as a nitrogen gas transfer path from the second chamber to the first chamber, and the nitrogen gas that has cooled the ultraviolet light source passes through the nitrogen gas supply path. An ultraviolet irradiation device is provided that can move from the second room to the first room and supply the nitrogen gas to the surface of the frame unit carried into the first room.

  Preferably, in the ultraviolet irradiation device, the ultraviolet light source includes a case that transmits ultraviolet light, a plurality of ultraviolet light-emitting diodes that are accommodated in the case and are linearly arranged in a range longer than the diameter of the adherend, A moving unit that moves the case in a direction orthogonal to the direction in which the ultraviolet light-emitting diodes are arranged, the cooling mechanism supplies nitrogen gas to the inside of the case, and the nitrogen gas supply path is provided inside the case. And the first room are communicated with each other.

  In addition, a cassette mounting portion on which a cassette that accommodates a plurality of the frame units is mounted, a chuck table that holds the frame unit, and the attachment of the frame unit that is held on the chuck table are cut with a cutting blade. A cutting unit, the ultraviolet irradiation device described above, the cassette placed on the cassette placing portion, the chuck table, and a conveyance unit that conveys the frame unit between the ultraviolet irradiation device, A cutting device comprising: is also an embodiment of the present invention.

  Preferably, the ultraviolet light source is turned on when the frame unit is carried into the housing of the ultraviolet irradiation device through the carry-in / out port by the carrying unit.

  The housing of the ultraviolet irradiation device according to one embodiment of the present invention includes a first room in which the frame unit is carried in and a second room in which the ultraviolet light source is disposed. The ultraviolet irradiation device includes a cooling mechanism that cools the ultraviolet light source with nitrogen gas, and a nitrogen gas supply path serving as a nitrogen gas moving path from the second chamber to the first chamber.

  In the ultraviolet irradiation device, the frame unit is irradiated with ultraviolet rays while the ultraviolet light source is cooled with nitrogen gas. Since the frame unit placed in the first chamber is irradiated with ultraviolet rays in a nitrogen atmosphere from which oxygen is excluded, the adhesive layer can be appropriately cured without irradiating the tape with high intensity ultraviolet rays. Therefore, the operating efficiency of the ultraviolet irradiation device is increased.

  Here, the ultraviolet irradiation apparatus according to one embodiment of the present invention also uses nitrogen gas supplied to the first chamber to cool the ultraviolet light source in order to exclude oxygen. That is, the ultraviolet light source can be cooled by supplying nitrogen gas to the first chamber via the second chamber. Thereby, the configuration of the ultraviolet irradiation device is simplified, and the cost required for cooling the light source is also reduced, so that the operation efficiency of the ultraviolet irradiation device is also increased.

  Therefore, according to one aspect of the present invention, an ultraviolet irradiation device with high operating efficiency and a cutting device including the ultraviolet irradiation device are provided.

It is a disassembled perspective view which shows a ultraviolet irradiation device and a frame unit typically. 2A is an enlarged perspective view schematically showing the ultraviolet light source, and FIG. 2B is a cross-sectional view schematically showing the inside of the ultraviolet irradiation device. It is sectional drawing which shows the inside of an ultraviolet irradiation device typically. It is a perspective view which shows a cutting device typically.

  Embodiments according to one aspect of the present invention will be described with reference to the accompanying drawings. First, the frame unit irradiated with ultraviolet rays by the ultraviolet irradiation device according to the present embodiment will be described. In FIG. 1, the perspective view of the frame unit 7 containing the to-be-adhered object 1 by which the tape 3 was stuck on the back surface side is shown typically. The frame unit 7 is formed by sticking the adherend 1 to the tape 3 stretched on the annular frame 5.

  The adherend 1 is, for example, a wafer made of silicon, SiC (silicon carbide), or another semiconductor material, or a disk-shaped substrate made of a material such as sapphire, glass, or quartz. As shown in FIG. 1, on the surface of the adherend 1, division planned lines called a plurality of streets intersecting with each other are set. Devices such as ICs (Integrated Circuits) and LEDs (Light Emitting Diodes) are formed in the respective areas partitioned by the division lines.

  When the adherend 1 is divided along the division line, a device chip is formed. Each formed device chip is supported by a tape 3 called a dicing tape that is attached to the back surface of the adherend 1.

  The tape 3 includes, for example, a base material (not shown) made of epoxy resin, acrylic resin, synthetic rubber, polyimide, or the like, and an adhesive layer (not shown) containing an ultraviolet curable resin on the base material. . The pressure-sensitive adhesive layer exhibits a strong pressure-sensitive adhesive force with respect to the adherend 1, while being cured when irradiated with ultraviolet rays, the pressure-sensitive adhesive force is reduced. And when peeling the tape 3 stuck to the to-be-adhered thing 1, the ultraviolet-ray is irradiated to the tape 3 and the adhesive force of an adhesion layer is reduced. An annular frame 5 made of metal or the like is attached to the outer periphery of the tape 3.

  The adherend 1 is carried into a cutting device in the state of a frame unit 7 integrated with the tape 3 and the frame 5, and is cut by a cutting blade attached to the cutting device. Then, the tape 3 is peeled from the back surface side of the device chip formed by cutting.

  When the tape 3 is peeled from the back side of the device chip, the frame unit 7 is irradiated with ultraviolet rays to cure the adhesive layer of the tape 3 and reduce the adhesive force. For irradiation of ultraviolet rays to the frame unit 7, for example, an ultraviolet irradiation device 2 whose exploded perspective view is shown in FIG. 1 is used. Next, the ultraviolet irradiation device 2 according to the present embodiment will be described.

  The ultraviolet irradiation device 2 includes a box-shaped housing 4 having a width larger than the diameter of the frame unit 7. On one side surface of the housing 4, a loading / unloading port 6 is formed as a moving path of the frame unit 7 between the space inside the housing 4 and the outside, and the frame unit 7 includes the loading / unloading port. 6 is carried into the space inside the housing 4. The carry-in / out entrance 6 may be provided with an openable / closable door (shutter) that separates the outside of the housing 4 from the internal space.

  As shown in FIG. 2B, which will be described later, the space inside the housing 4 is located in a first room 4a into which the frame unit 7 is carried and an ultraviolet light source 14 disposed below the first room 4a. The second room 4b is provided. A partition plate 8 is disposed between the first room 4a and the second room 4b.

  A partition plate support frame 8 a that supports the partition plate 8 is formed on the inner walls of the pair of side surfaces adjacent to the side surface where the carry-in / out port 6 of the housing 4 is formed. For example, the partition plate 8 is inserted into the housing 4 through the carry-in / out port 6 and placed on the partition plate support frame 8a.

  The partition plate 8 includes a transmission region 10 having a diameter larger than the diameter of the adherend 1 and smaller than the inner diameter of the frame 5, and a shielding region 12 around the transmission region 10. A plate made of a resin or the like that transmits ultraviolet rays is disposed in the transmission region 10. When the frame unit 7 is carried into the housing 4 of the ultraviolet irradiation device 2, the frame unit 7 is placed on the partition plate 8 at a position where the transmission region 10 and the adherend 1 are overlapped.

  The partition plate 8 is replaceable, and the partition plate 8 having a transmission region 10 of an appropriate size corresponding to the diameter of the adherend 1 and the shape of the frame 5 is disposed on the partition plate support frame 8a. Is done.

  In the second room 4 b of the housing 4, there are an ultraviolet light source 14 that irradiates the frame unit 7 with ultraviolet light, a moving mechanism 16 that moves the ultraviolet light source 14, and a cooling mechanism 24 that cools the ultraviolet light source 14. Arranged.

  The ultraviolet light source 14 and the moving mechanism 16 will be described in detail with reference to FIG. FIG. 2A is an enlarged perspective view schematically showing the ultraviolet light source 14. As shown in FIG. 2A, the ultraviolet light source 14 includes, for example, a plurality of linearly arranged ultraviolet LEDs (light emitting diodes) 14a and a case 36 that covers the plurality of ultraviolet LEDs 14a. The plurality of ultraviolet LEDs 14 a are linearly arranged in a range longer than the diameter of the adherend 1. The case 36 is made of a material that is transmissive to ultraviolet rays emitted from the ultraviolet LED 14a.

  The ultraviolet LED 14 a is an LED that can emit ultraviolet light, and in particular has a function of emitting ultraviolet light having a wavelength that cures the adhesive layer of the tape 3. The ultraviolet LED 14a can instantaneously output ultraviolet light with a predetermined illuminance when it is necessary to irradiate the tape 3 with ultraviolet light. Therefore, when the ultraviolet LED 14a is used for the ultraviolet light source 14, the operation time of the ultraviolet light source 14 is relatively short. Since the temperature rise is relatively small, an expensive cooling device with high output is unnecessary.

  Below the ultraviolet LED 14 a inside the case 36, for example, a plurality of thin plate-like cooling fins 38 are arranged, and when a gas flows between the plurality of cooling fins 38, the ultraviolet LED 14 a is cooled. A back ventilation path 40 serving as a flow path for gas flowing between the plurality of cooling fins 38 is disposed at the rear of the case 36.

  Below the ultraviolet light source 14, a moving mechanism 16 that moves the ultraviolet light source 14 in a direction parallel to the partition plate 8 and perpendicular to the direction in which the ultraviolet LEDs 14a are arranged is disposed. The moving mechanism 16 includes a pair of guide rails 16a extending along the direction, and the ultraviolet light source 14 is slidably attached to the guide rail 16a. A belt-type actuator 16b (see FIG. 3) is connected to the ultraviolet light source 14, and the belt-type actuator 16b can move along the direction.

  FIG. 2B is a cross-sectional view schematically showing the ultraviolet irradiation device 2 including the direction and cut along a plane perpendicular to the partition plate 8. For example, an opening is formed in the bottom plate of the housing 4 of the ultraviolet irradiation device 2, and a cooling mechanism 24 is connected to the ultraviolet light source 14 through the opening.

  The cooling mechanism 24 will be described. The cooling mechanism 24 has a function of introducing nitrogen gas into the case 36 of the ultraviolet light source 14 and cooling the ultraviolet light source 14 with the nitrogen gas. The cooling mechanism 24 includes a nitrogen gas source 44 and a pipe-shaped nitrogen gas introduction path 18 having one end connected to the nitrogen gas source 44.

  FIG. 3 is a cross-sectional view schematically showing the ultraviolet irradiation device 2 cut along a horizontal plane including the direction and the direction in which the ultraviolet LEDs 14a are arranged. As shown in FIG. 3, a nitrogen gas inlet 18a is formed at the bottom of the back vent 40 of the ultraviolet light source 14, and the other end of the nitrogen gas inlet 18 is connected to the nitrogen gas inlet 18a. Yes.

  The nitrogen gas 42 introduced from the nitrogen gas inlet 18 a flows from one end of the back ventilation path 40 to one end side inside the case 36. Then, while flowing between the cooling fins 38 and absorbing heat from the cooling fins 38, it reaches the other end side inside the case 36 and flows to the other end of the back ventilation path 40.

  A nitrogen gas discharge port 20a is further formed at the bottom of the back air passage 40, and one end of a pipe-shaped nitrogen gas discharge channel 20 is connected to the nitrogen gas discharge port 20a. The nitrogen gas 42 that has absorbed heat from the cooling fins 38 is discharged from the nitrogen gas discharge port 20a to the nitrogen gas discharge path 20.

  The nitrogen gas introduction path 18 and the nitrogen gas discharge path 20 are fixed to a sheet 22 (see FIG. 1), for example. The sheet 22 is deformed along with the movement of the ultraviolet light source 14 and has a function of appropriately deforming the nitrogen gas introduction path 18 and the nitrogen gas discharge path 20 so as not to prevent the movement of the ultraviolet light source 14. Even if the ultraviolet light source 14 moves, the connection between the nitrogen gas introduction path 18 and the nitrogen gas discharge path 20 and the ultraviolet light source 14 is maintained by the sheet 22.

  The other end side of the nitrogen gas discharge path 20 is connected to the bottom side of the pipe-shaped nitrogen gas supply path 26 through the opening formed in the bottom plate of the housing 4. The nitrogen gas supply path 26 extends, for example, from the bottom to the top of the housing 4 along the side wall inside the housing 4. The nitrogen gas supply path 26 becomes a moving path of nitrogen gas that moves from the second room 4b of the housing 4 to the first room 4a.

  As shown in FIG. 1, a top plate 28 is disposed on the housing 4 of the ultraviolet light source 14. A through hole extending in the vertical direction is formed at a position corresponding to the nitrogen gas supply path 26 of the top plate 28, and the through hole is covered with the nitrogen gas distribution unit 30. One end of each of a plurality of nitrogen gas supply paths 32 disposed on the top plate 28 is connected to the nitrogen gas distribution unit 30 mounted on the top plate 28.

  Nitrogen gas that has reached the nitrogen gas distribution section 30 through the nitrogen gas supply path 26 and the through holes is distributed to the nitrogen gas supply paths 32 by the nitrogen gas distribution section 30. The top plate 28 is provided with a plurality of nitrogen gas ejection portions 34, and the nitrogen gas ejection portions 34 are connected to the other end side of each nitrogen gas supply path 32. The top plate 28 includes through holes penetrating in the vertical direction at positions corresponding to the respective nitrogen gas ejection portions 34, and the nitrogen gas that has reached the respective nitrogen gas ejection portions 34 passes through the through holes to form the inner holes in the housing 4. 1 room 4a (see FIG. 2B).

  Next, with reference to FIG.1 and FIG.2 (B), the ultraviolet irradiation with respect to the frame unit 7 by the ultraviolet irradiation device 2 is demonstrated. First, the frame unit 7 is carried into the housing 4 through the carry-in / out opening 6, and the frame unit 7 is placed on the partition plate 8. At this time, the frame unit 7 is disposed at a predetermined position so that the transmission region 10 of the partition plate 8 and the adherend 1 are overlapped.

  Next, the nitrogen gas is supplied from the nitrogen gas source 44 to the ultraviolet light source 14 and the ultraviolet light source 14 is cooled by the nitrogen gas, and the ultraviolet LED 14 a is operated to irradiate the tape 3 with the ultraviolet light 46 through the transmission region 10. At this time, the moving mechanism 16 is operated to move the ultraviolet light source 14, and the tape 3 is uniformly irradiated with ultraviolet rays. When the tape 3 is irradiated with ultraviolet rays, the adhesive layer of the tape 3 is cured, and the sticking force to the adherend 1 is reduced. Then, peeling of the tape 3 from the adherend 1 becomes easy.

  On the other hand, the outer peripheral portion of the tape 3 is shielded by the shielding region 12 of the partition plate 8 and therefore is not irradiated with ultraviolet rays. For example, when the outer peripheral portion of the tape 3 is irradiated with ultraviolet rays, the adhesive force of the tape 3 to the frame 5 is reduced and the tape 3 is easily peeled from the frame 5. In the ultraviolet irradiation apparatus 2 according to the present embodiment, since the partition region 8 is provided with the shielding region 12, the tape 3 from the adherend 1 can be easily peeled off, while the frame 5, the tape 3, Is difficult to peel.

  While the ultraviolet light source 14 is operated, the cooling mechanism 24 is operated to supply nitrogen gas to the ultraviolet light source 14 and cool the ultraviolet light source 14 with the nitrogen gas. The nitrogen gas used for cooling the ultraviolet light source 14 moves from the second room 4b to the first room 4a via the nitrogen gas supply path 26. Nitrogen gas is supplied from the nitrogen gas ejection section 34 to the surface of the frame unit 7 disposed in the first chamber 4a.

  For example, when the adhesive layer is cured by irradiating the tape 3 with ultraviolet rays, the curing is suppressed if oxygen is present in the atmosphere. On the other hand, in the ultraviolet irradiation device 2 according to the present embodiment, the nitrogen gas used for cooling the ultraviolet light source 14 is supplied to the surface of the frame unit 7 and the oxygen in the atmosphere is excluded. Will cure properly.

  Therefore, since the adhesive layer of the tape 3 can be cured without excessively increasing the output of the ultraviolet light source 14, the operating efficiency of the ultraviolet irradiation device 2 is increased. Moreover, since the ultraviolet light source 14 can be cooled using nitrogen gas used for exclusion from the first room 4a, the configuration of the cooling mechanism 24 is simplified, and the cost of the ultraviolet irradiation device 2 can be reduced.

  Next, a cutting device in which the ultraviolet irradiation device 2 according to this embodiment is incorporated will be described. FIG. 4 is a perspective view schematically showing an example of the cutting apparatus. The cutting device 48 includes a device base 48a having an opening 48b on the upper surface. Inside the opening 48b, a chuck table 54 for holding a frame unit 7 including a workpiece such as the adherend 1 is disposed so as to be movable in the horizontal direction. The upper surface of the chuck table 54 serves as a holding surface that holds the frame unit 7.

  The chuck table 54 includes a suction path (not shown) having one end connected to the holding surface of the chuck table 54 and the other end connected to a suction source (not shown). When the suction source is operated, negative pressure acts on the frame unit 7 placed on the holding surface, and the frame unit 7 is sucked and held by the chuck table 54. Further, the chuck table 54 can rotate around an axis perpendicular to the holding surface.

  A cassette mounting portion 50 on which a cassette 52 that can accommodate the frame unit 7 is placed is disposed at a corner portion on the upper surface of the apparatus base 48a. The cassette mounting part 50 can be moved up and down by a lifting device (not shown). When the height position of the cassette 52 is changed, a desired frame unit 7 in the cassette 52 can be carried in and out by a transport unit (not shown) of the cutting device 48.

  The above-described ultraviolet irradiation device 2 is incorporated in the lower part of the cassette mounting unit 50. The frame unit 7 including the adherend 1 that has been cut by the cutting device 48 is carried into the ultraviolet irradiation device 2.

  A cutting unit 56 for cutting a workpiece such as the adherend 1 is disposed above the chuck table 54. The cutting unit 56 is supported by a support part 60 protruding above the opening 48 b and a cutting unit moving mechanism 62 disposed on the front surface of the support part 60. The cutting unit 56 can be moved by a cutting unit moving mechanism 62 in a direction perpendicular to the holding surface of the chuck table 54 and a protruding direction of the support portion 60.

  An annular cutting blade 56 a is attached to the cutting unit 56. The frame unit 7 is conveyed onto the chuck table 54 by the conveyance unit, and the frame unit 7 is held on the chuck table 54. Then, the cutting blade 56a is rotated, the cutting unit 54 is positioned at a predetermined height position, and the chuck table 54 is moved to cut the cutting blade 56a into the adherend 1. Then, the adherend 1 is cut.

  At this time, the cutting unit 56 is positioned at a predetermined position so that the lower end of the cutting blade 56a is lower than the height position of the lower end of the adherend 1 and higher than the height position of the lower end of the tape 3. Positioned at the height position. . Individual chips formed by cutting the adherend 1 are continuously supported by the tape 3.

  A camera unit 58 is further disposed in the vicinity of the cutting unit 56. The camera unit 58 captures a portion to be processed when the adherend 1 is cut. The image obtained by photographing is used, for example, for alignment for adjusting the positions of the cutting unit 56 and the chuck table 54 so that the scheduled division line of the adherend 1 can be appropriately cut.

  In the vicinity of the opening 48b on the upper surface of the device base 48a, a cleaning device 64 for cleaning the adherend 1 after cutting is further provided. The frame unit 7 including the adherend 1 after cutting is transported to the cleaning device 64 by the transport unit, and the frame unit 7 is placed on the cleaning table of the cleaning device 64. Then, when the cleaning liquid is supplied to the adherend 1 while rotating the cleaning table, the adherend 1 is washed.

  After the cleaning by the cleaning unit 64, the frame unit 7 is transported to the ultraviolet irradiation device 2 by the transport unit. When the ultraviolet irradiation device 2 irradiates the frame unit 7 with ultraviolet rays, the adhesive layer of the tape 3 is cured. Thereafter, the frame unit 7 is carried out from the ultraviolet irradiation device 2 by the carrying unit and carried into the cassette 52.

  In the ultraviolet irradiation device 2, since nitrogen gas is supplied to the frame unit 7 and oxygen contained in the atmosphere is excluded, inhibition of curing of the tape 3 by oxygen is suppressed. Therefore, the tape 3 can be appropriately cured without excessively increasing the intensity of ultraviolet irradiation by the ultraviolet light source 14. The nitrogen gas supplied to the frame unit 7 is also used for cooling the ultraviolet light source 14. Therefore, the operating efficiency of the ultraviolet irradiation device 2 and the cutting device 48 equipped with the ultraviolet irradiation device 2 is increased.

  In addition, this invention is not limited to description of said embodiment, A various change can be implemented. For example, the ultraviolet irradiation device 2 according to one aspect of the present invention may include a detection unit that detects that the frame unit 7 is carried in from the carry-in / out entrance 6. When the detection unit detects the carry-in of the frame unit 7, the ultraviolet LED 14 a of the ultraviolet light source 14 is turned on, and the cooling of the ultraviolet light source 14 by the cooling mechanism 24 may be started.

  In this case, when the frame unit 7 is not carried into the ultraviolet irradiation device 2, each mechanism does not operate, and at the same time as the frame unit 7 is carried in, the frame unit 7 is irradiated with ultraviolet rays and the tape 3 is started to be cured. Therefore, the operation time of the ultraviolet light source 14 is minimal, and the operation efficiency of the ultraviolet irradiation device 2 and the cutting device 48 equipped with the ultraviolet irradiation device 2 is further increased.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

DESCRIPTION OF SYMBOLS 1 To-be-adhered thing 3 Tape 5 Frame 7 Frame unit 2 Ultraviolet irradiation apparatus 4 Case 4a 1st chamber 4b 2nd chamber 6 Carrying in / out port 8 Partition plate 8a Partition plate support frame 10 Transmission region 12 Shielding region 14 Ultraviolet light source 14a Ultraviolet light LED
DESCRIPTION OF SYMBOLS 16 Movement mechanism 16a Guide rail 16b Belt-type actuator 18 Nitrogen gas introduction path 18a Nitrogen gas introduction port 20 Nitrogen gas discharge path 20a Nitrogen gas discharge port 22 Sheet 24 Cooling mechanism 26 Nitrogen gas supply path 28 Top plate 30 Nitrogen gas distribution part 32 Nitrogen Gas supply path 34 Nitrogen gas ejection part 36 Case 38 Cooling fin 40 Back air passage 42 Nitrogen gas 44 Nitrogen gas source 46 Ultraviolet ray 48 Cutting device 48a Equipment base 48b Opening 50 Cassette mounting part 52 Cassette 54 Chuck table 56 Cutting unit 56a Cutting Blade 58 Camera unit 60 Support unit 62 Cutting unit moving mechanism 64 Cleaning device

Claims (4)

Irradiating the adhesive tape of the frame unit with ultraviolet rays, comprising an annular frame, an adhesive tape that is stretched on the annular frame and the adhesive layer is cured by irradiation of ultraviolet rays, and an adherend that is adhered to the adhesive tape An ultraviolet irradiation device that performs
A housing provided with a loading / unloading port of the frame unit on a side surface;
A first area in which the frame unit is carried in through the carry-in / out opening, a second room below the first room, and a transmission area that transmits the ultraviolet light and a shielding area that does not transmit the ultraviolet light. A partition plate separating the space inside the housing;
An ultraviolet light source that is installed in the second room and irradiates the frame unit placed on the partition plate with ultraviolet rays through the transmission region;
A cooling mechanism for supplying nitrogen gas to the second chamber and cooling the ultraviolet light source with the nitrogen gas;
A nitrogen gas supply path serving as a nitrogen gas transfer path from the second room to the first room,
A function of supplying the nitrogen gas to the surface of the frame unit carried into the first room, the nitrogen gas having cooled the ultraviolet light source being able to move from the second room to the first room through the nitrogen gas supply path. The ultraviolet irradiation device characterized by having. The ultraviolet light source is
A case that transmits ultraviolet light,
A plurality of ultraviolet light emitting diodes housed in the case and arranged linearly in a range longer than the diameter of the adherend;
A moving unit that moves the case in a direction perpendicular to the direction in which the plurality of the ultraviolet light emitting diodes are arranged,
The cooling mechanism supplies nitrogen gas to the inside of the case,
The ultraviolet irradiation apparatus according to claim 1, wherein the nitrogen gas supply path communicates the inside of the case with the first chamber. A cassette mounting portion on which a cassette for housing a plurality of the frame units is mounted;
A chuck table for holding the frame unit;
A cutting unit for cutting the adherend of the frame unit held on the chuck table with a cutting blade;
The ultraviolet irradiation device according to claim 1 or 2,
A cutting apparatus comprising: a transport unit that transports the frame unit between the cassette mounted on the cassette mounting unit, the chuck table, and the ultraviolet irradiation device.   4. The cutting apparatus according to claim 3, wherein the ultraviolet light source is turned on when the frame unit is carried into the housing of the ultraviolet irradiation device through the carry-in / out port by the carrying unit.