TW202143312A - Method for processing a plurality of wafers and cutting device capable of increasing the number of wafers processed per unit time without changing a movable range of a transfer unit from a normal specification - Google Patents

Method for processing a plurality of wafers and cutting device capable of increasing the number of wafers processed per unit time without changing a movable range of a transfer unit from a normal specification Download PDF

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TW202143312A
TW202143312A TW110113257A TW110113257A TW202143312A TW 202143312 A TW202143312 A TW 202143312A TW 110113257 A TW110113257 A TW 110113257A TW 110113257 A TW110113257 A TW 110113257A TW 202143312 A TW202143312 A TW 202143312A
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cassette
wafer
wafers
unit
cutting
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柏木啓司
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

The object of the present invention is to, without changing a movable range of a transfer unit from a normal specification, increase the number of wafers processed per unit time in as compared with a case where a first cassette is replaced with a second cassette after all accommodated wafers are processed and transferred to the first cassette. The solution is to provide a method for processing a plurality of wafers, which includes the following steps: a cassette replacement step, in which after all the wafers other than the final wafer are accommodated in the first cassette, the first cassette is removed from a cassette loading table and a second cassette different from the first cassette is placed on the cassette loading table; a transfer starting step, after the cassette replacement step, for starting the transfer of the wafer from the second cassette to a chuck table; and a final wafer loading step, after the transfer starting step, for loading the final wafer cut in a cutting step on a wafer loading part. The aforementioned wafer loading part is arranged on the lower side of the cassette loading table and moves up and down together with the cassette loading table.

Description

複數個晶圓之處理方法及切削裝置Processing method and cutting device for multiple wafers

本發明是有關於一種將複數個晶圓沿著分割預定線依序切削的複數個晶圓之處理方法、及依序切削複數個晶圓之切削裝置。The present invention relates to a processing method for sequentially cutting a plurality of wafers along a predetermined dividing line, and a cutting device for sequentially cutting a plurality of wafers.

在半導體器件晶片的製造步驟中，是在圓盤狀的晶圓的正面將複數條分割預定線設定成格子狀，並且在藉由該複數條分割預定線所區劃出的複數個區域的每一個中形成IC(積體電路，Integrated Circuit)等的器件。之後，藉由沿著各分割預定線切削晶圓，而將晶圓分割成複數個半導體器件晶片。In the manufacturing process of a semiconductor device wafer, a plurality of planned division lines are set in a grid on the front surface of a disc-shaped wafer, and each of the plurality of regions divided by the plurality of planned division lines IC (Integrated Circuit) and other devices are formed in it. After that, the wafer is divided into a plurality of semiconductor device wafers by cutting the wafer along each planned division line.

為了切削晶圓，可使用例如切削裝置。切削裝置具備：搬送單元，搬送晶圓；工作夾台，吸引保持晶圓；及切削單元，具有對被工作夾台所吸引保持的晶圓進行切削的切削刀片(參照例如專利文獻1)。In order to cut the wafer, for example, a cutting device can be used. The cutting device includes: a transport unit that transports wafers; a work chuck table that sucks and holds the wafer; and a cutting unit that has a cutting blade that cuts the wafer sucked and held by the work chuck table (see, for example, Patent Document 1).

在切削晶圓時，首先會將容置有複數個晶圓的第1片匣配置於切削裝置。並且，藉由搬送單元從第1片匣中依序搬出晶圓，且依序將切削及洗淨後的晶圓往第1片匣搬入。When cutting wafers, the first cassette containing a plurality of wafers is first arranged in the cutting device. In addition, the wafers are sequentially unloaded from the first cassette by the transport unit, and the cut and cleaned wafers are sequentially transported into the first cassette.

並且，在已將原本容置於第1片匣之全部的晶圓搬入至第1片匣後，將容置有複數個晶圓的其他的片匣(第2片匣)配置於切削裝置來取代第1片匣。然後，與第1片匣的情況同樣地，從第2片匣依序將晶圓搬出，並進行切削及洗淨。 先前技術文獻 專利文獻And, after all the wafers originally contained in the first cassette have been loaded into the first cassette, the other cassettes (second cassettes) containing a plurality of wafers are placed in the cutting device. Replace the first cassette. Then, as in the case of the first cassette, the wafers are sequentially unloaded from the second cassette, and cut and cleaned. Prior art literature Patent literature

專利文獻1：日本特開2011-159823號公報Patent Document 1: Japanese Patent Application Publication No. 2011-159823

發明欲解決之課題The problem to be solved by the invention

所以，由於在更換片匣時必須停止切削裝置的操作，因此每單位時間之晶圓的處理數量會降低。相對於此，雖然也可為了將複數個片匣同時搭載於切削裝置，而考慮將通常的切削裝置的規格變更成在相同的高度位置設置複數個片匣載置台之作法，但必須進行將搬送單元的可動範圍擴大等的大幅度的改造。Therefore, since the operation of the cutting device must be stopped when the cassette is replaced, the number of wafers processed per unit time will be reduced. On the other hand, in order to mount a plurality of cassettes in the cutting device at the same time, it is also possible to change the specifications of the normal cutting device to install a plurality of cassette mounts at the same height position, but it is necessary to transport Significant remodeling such as expansion of the movable range of the unit.

本發明是有鑒於所述的問題點而作成的發明，其目的在於，不讓搬送單元的可動範圍從通當的規格變更，並且使每單位時間之晶圓的處理數量比以下情況提升：在所容置之全部的晶圓已被處理且搬送到第1片匣後再將第1片匣更換為第2片匣。 用以解決課題之手段The present invention was made in view of the above-mentioned problems, and its object is to prevent the movable range of the conveying unit from changing from a general specification, and to increase the number of wafers processed per unit time than in the following cases: After all the contained wafers have been processed and transported to the first cassette, the first cassette is replaced with the second cassette. Means to solve the problem

根據本發明之一態樣，可提供一種複數個晶圓之處理方法，其是將於正面側被所設定之複數條分割預定線所區劃出的複數個區域的每一個中形成有器件之複數個晶圓的每一個，沿著各分割預定線切削後容置到片匣，前述複數個晶圓之處理方法具備以下步驟： 片匣載置步驟，將容置有複數個晶圓的第1片匣載置於片匣載置台； 晶圓搬送步驟，依序將晶圓從該第1片匣往工作夾台搬送； 判斷步驟，判斷往該工作夾台搬送之晶圓是否為最後從該第1片匣被搬送出之最終的晶圓； 切削步驟，以切削單元依序切削已被該工作夾台保持之晶圓； 片匣容置步驟，將不是該最終的晶圓之晶圓在該切削步驟中切削後，容置於該第1片匣； 片匣更換步驟，在已將該最終的晶圓以外之全部的晶圓容置於該第1片匣後，將該第1片匣從該片匣載置台卸除，並將容置有複數個晶圓且和該第1片匣不同之第2片匣載置於該片匣載置台； 搬送開始步驟，在該片匣更換步驟之後，開始進行從該第2片匣往該工作夾台之晶圓的搬送；及 最終晶圓載置步驟，在該搬送開始步驟之後，將已在該切削步驟中切削的該最終的晶圓載置到晶圓載置部，前述晶圓載置部配置在該片匣載置台的下側且和該片匣載置台一起升降。According to one aspect of the present invention, a processing method for a plurality of wafers can be provided, which is to form a plurality of devices in each of a plurality of regions divided by a plurality of predetermined dividing lines set on the front side Each of the wafers is cut along each predetermined dividing line and placed in a cassette. The aforementioned processing method for multiple wafers includes the following steps: In the cassette placing step, the first cassette containing a plurality of wafers is placed on the cassette placing table; In the wafer transfer step, the wafers are transferred from the first cassette to the work clamping table in sequence; Judging step, judging whether the wafer transported to the work chuck is the final wafer transported from the first cassette; In the cutting step, the cutting unit sequentially cuts the wafers held by the work chuck; A cassette accommodating step, after cutting a wafer that is not the final wafer in the cutting step, it is stored in the first cassette; In the cassette replacement step, after all the wafers except the final wafer have been accommodated in the first cassette, the first cassette is removed from the cassette mounting table, and a plurality of wafers are accommodated A wafer and a second cassette different from the first cassette are placed on the cassette mounting table; The transport start step, after the cassette replacement step, start to transport the wafers from the second cassette to the work clamping table; and In the final wafer mounting step, after the transfer start step, the final wafer that has been cut in the cutting step is mounted on a wafer mounting portion, the wafer mounting portion is arranged on the lower side of the cassette mounting table and It moves up and down together with the cassette mounting table.

較佳的是，複數個晶圓之處理方法更具備取出及容置步驟，前述取出及容置步驟是在該最終晶圓載置步驟之後，將載置於該晶圓載置部之該最終的晶圓從該晶圓載置部取出並容置至該第1片匣。Preferably, the processing method for a plurality of wafers further includes a step of taking out and containing, and the step of taking out and containing is after the final wafer placement step, the final wafer placed on the wafer placement portion The circle is taken out from the wafer placement part and stored in the first cassette.

根據本發明的其他態樣，可提供一種切削裝置，其將於正面側被所設定之複數條分割預定線所區劃出的複數個區域的每一個中形成有器件之複數個晶圓的每一個，沿著各分割預定線切削後容置到片匣，前述切削裝置具備：工作夾台，保持晶圓；切削單元，具有主軸、及裝設於該主軸的一端側之切削刀片；片匣機構，具備供容置有複數個晶圓之第1片匣載置之片匣載置台、及配置在該片匣載置台的下側且和該片匣載置台一起升降之晶圓載置部；搬送單元，在該片匣機構與該工作夾台之間搬送晶圓；控制單元，包含判斷部，前述判斷部將最後從該第1片匣搬送出之晶圓判斷為該第1片匣之最終的晶圓；及通知部，在原本容置於該第1片匣之該最終的晶圓以外之全部的晶圓已於切削後容置於該第1片匣的情況下，發出催促該第1片匣的更換之訊息， 該控制單元藉由控制該搬送單元而進行以下動作： 將切削後的晶圓當中該最終的晶圓以外之全部的晶圓搬送到該第1片匣，並將該最終的晶圓搬送到該晶圓載置部；及 在已將該最終的晶圓以外之全部的晶圓容置於該第1片匣之後，並且已將容置有複數個晶圓且和該第1片匣不同之第2片匣載置於該片匣載置台的情況下，於將切削後的該最終的晶圓載置到該晶圓載置部之前，開始進行從該第2片匣往該工作夾台之晶圓的搬送。 發明效果According to another aspect of the present invention, there can be provided a cutting device that forms each of a plurality of wafers with a device in each of a plurality of regions divided by a plurality of predetermined dividing lines set on the front side , Cut along each predetermined dividing line and housed in the cassette, the aforementioned cutting device includes: a work chuck table to hold the wafer; a cutting unit with a main shaft and a cutting blade installed on one end of the main shaft; a cassette mechanism , Equipped with a cassette mounting table for placing the first cassette containing a plurality of wafers, and a wafer mounting section arranged on the lower side of the cassette mounting table and raised and lowered together with the cassette mounting table; A unit for transporting wafers between the cassette mechanism and the work chuck; a control unit, including a judging section, the judging section judges the last wafer transported from the first cassette as the final of the first cassette And the notification unit, in the case that all the wafers originally contained in the first cassette except the final wafer have been stored in the first cassette after being cut, issue a urging to the first cassette 1 cartridge replacement message, The control unit performs the following actions by controlling the transport unit: Transport all of the cut wafers except the final wafer to the first cassette, and transport the final wafer to the wafer placement part; and After all the wafers except the final wafer have been accommodated in the first cassette, and the second cassette that contains a plurality of wafers and is different from the first cassette has been placed In the case of the cassette mounting table, before placing the cut final wafer on the wafer mounting portion, the wafer transfer from the second cassette to the work chuck is started. Invention effect

在本發明的一態樣的複數個晶圓之處理方法中，具備以下步驟：片匣更換步驟，在將最終的晶圓以外之全部的晶圓容置於第1片匣後，將第1片匣從片匣載置台卸除，並將容置有複數個晶圓且和第1片匣不同之第2片匣載置於片匣載置台；搬送開始步驟，在片匣更換步驟之後，開始進行從第2片匣往工作夾台之晶圓的搬送；及最終晶圓載置步驟，在搬送開始步驟之後，將已在切削步驟中切削的最終的晶圓載置到晶圓載置部，前述晶圓載置部配置在片匣載置台的下側且和片匣載置台一起升降。In one aspect of the method for processing a plurality of wafers of the present invention, the following steps are provided: a cassette replacement step, after all the wafers except the final wafer are contained in the first cassette, the first cassette The cassette is removed from the cassette mounting table, and a second cassette containing a plurality of wafers and different from the first cassette is placed on the cassette mounting table; the transport start step, after the cassette replacement step, Start the transfer of wafers from the second cassette to the work chuck; and the final wafer placement step. After the transport start step, the final wafer cut in the cutting step is placed on the wafer placement section, as described above The wafer placement section is arranged on the lower side of the cassette placement table and moves up and down together with the cassette placement table.

如此，可以在讓最終的晶圓返回到第1片匣之前，開始進行從第2片匣往工作夾台之晶圓的搬送。所以，可以使每單位時間之晶圓的處理數量比以下情況提升：將所容置之全部的晶圓都處理並搬送至第1片匣後再將第1片匣更換為第2片匣。In this way, before returning the final wafer to the first cassette, the transfer of the wafer from the second cassette to the work chuck table can be started. Therefore, the number of wafers processed per unit time can be increased compared to the following situation: all the contained wafers are processed and transported to the first cassette, and then the first cassette is replaced with the second cassette.

除此之外，由於配置在片匣載置台的下側之晶圓載置部會和片匣載置台一起升降，因此搬送單元可以在不改變搬送單元的可動範圍的情形下，將最終的晶圓載置到晶圓載置部。所以，也不需要讓搬送單元之可動範圍從通常的規格變更。In addition, since the wafer placement section arranged on the lower side of the cassette placement table moves up and down together with the cassette placement table, the transport unit can load the final wafer without changing the movable range of the transport unit. Place it on the wafer placement section. Therefore, there is no need to change the movable range of the transport unit from the normal specifications.

用以實施發明之形態The form used to implement the invention

參照附加圖式，說明本發明之一態樣的實施形態。圖1是切削裝置2的立體圖。再者，於圖1顯示之X軸方向(加工進給方向)、Y軸方向(分度進給方向)及Z軸方向(鉛直方向、切削進給方向)互相正交。With reference to the attached drawings, an embodiment of one aspect of the present invention will be described. FIG. 1 is a perspective view of the cutting device 2. Furthermore, the X-axis direction (processing feed direction), Y-axis direction (indexing feed direction), and Z-axis direction (vertical direction, cutting feed direction) shown in Fig. 1 are orthogonal to each other.

切削裝置2具備支撐各構成要素的基台4。在基台4的前方的角部設置有開口4a。於開口4a內設置有圖2所示之片匣機構6。圖2是片匣機構6等的局部剖面側面圖。The cutting device 2 includes a base 4 that supports each component. An opening 4a is provided in the front corner of the base 4. The cassette mechanism 6 shown in FIG. 2 is provided in the opening 4a. Fig. 2 is a partial cross-sectional side view of the cassette mechanism 6 and the like.

片匣機構6具有升降台6a。升降台6a藉由滾珠螺桿式的升降機構8而沿著Z軸方向升降。於升降台6a的上表面配置有晶圓載置部6b。晶圓載置部6b是高度方向的長度比縱向及橫向的各長度小的長方體形的殼體。The cassette mechanism 6 has a lifting platform 6a. The lifting table 6a is raised and lowered in the Z-axis direction by a ball screw type lifting mechanism 8. The wafer mounting part 6b is arrange|positioned on the upper surface of the lift table 6a. The wafer mounting portion 6b is a rectangular parallelepiped case whose length in the height direction is smaller than the respective lengths in the vertical and horizontal directions.

晶圓載置部6b的內部為空洞，且晶圓載置部6b在與Y軸方向大致正交的兩側面具有開口6c。開口6c具有可以讓後述之1個晶圓單元21通過的程度之大小。The inside of the wafer mounting portion 6b is hollow, and the wafer mounting portion 6b has openings 6c on both side surfaces substantially orthogonal to the Y-axis direction. The opening 6c has a size such that one wafer unit 21 described later can pass through.

於晶圓載置部6b的上側設置有平板狀的片匣載置台6d，前述片匣載置台6d具有與晶圓載置部6b的上表面大致相同的大小。可在片匣載置台6d上載置容置有複數個晶圓單元21(亦即晶圓11)之片匣6e。A flat cassette mounting table 6d is provided on the upper side of the wafer mounting portion 6b, and the cassette mounting table 6d has approximately the same size as the upper surface of the wafer mounting portion 6b. A cassette 6e accommodating a plurality of wafer units 21 (that is, wafers 11) can be placed on the cassette mounting table 6d.

在此，參照圖3，說明晶圓11等。圖3是晶圓11等的立體圖。晶圓11是以例如矽等的半導體材料所形成，且具有圓盤形狀。Here, referring to FIG. 3, the wafer 11 and the like will be described. FIG. 3 is a perspective view of the wafer 11 and the like. The wafer 11 is formed of a semiconductor material such as silicon, and has a disc shape.

在晶圓11的正面11a上，以互相交叉的態樣而設定有複數條分割預定線(切割道)13。在以複數條分割預定線13所區劃出的複數個區域的每一個中，形成有IC(積體電路，Integrated Circuit)等的器件15。On the front surface 11a of the wafer 11, a plurality of planned dividing lines (dicing lanes) 13 are set in a manner of intersecting each other. In each of a plurality of regions divided by a plurality of planned dividing lines 13, a device 15 such as an IC (Integrated Circuit) is formed.

再者，對晶圓11的材質、形狀、構造、大小等並無限制。例如晶圓11亦可藉由矽以外的半導體、陶瓷、樹脂、金屬等材料來形成。同樣地，對器件15的種類、數量、形狀、構造、大小、配置等亦無限制。Furthermore, there are no restrictions on the material, shape, structure, size, etc. of the wafer 11. For example, the wafer 11 may be formed of materials such as semiconductors, ceramics, resins, and metals other than silicon. Similarly, there are no restrictions on the type, number, shape, structure, size, configuration, etc. of the device 15.

在位於與正面11a為相反的相反側的背面11b側貼附有面積比晶圓11更大之圓形的黏著膠帶(切割膠帶)17。於黏著膠帶17的外周部分固定有金屬製且環狀的框架19。A circular adhesive tape (dicing tape) 17 having an area larger than that of the wafer 11 is attached to the back side 11b that is located on the side opposite to the front side 11a. A metal ring-shaped frame 19 is fixed to the outer peripheral portion of the adhesive tape 17.

亦即，晶圓單元21形成為透過黏著膠帶17而以框架19來支撐晶圓11。複數個晶圓單元21被容置於1個片匣6e。片匣6e具有一對側壁、及分別連接一對側壁的上部與下部之連接部。That is, the wafer unit 21 is formed to support the wafer 11 by the frame 19 through the adhesive tape 17. A plurality of wafer units 21 are accommodated in one cassette 6e. The cassette 6e has a pair of side walls, and a connecting portion that connects the upper part and the lower part of the pair of side walls, respectively.

在一對側壁沿著片匣6e的高度方向設置有複數個層架(未圖示)，且在各層架載置有1個晶圓單元21。又，位於一對側壁的寬度方向的兩側之片匣6e的側部是形成為開口。A plurality of shelves (not shown) are provided along the height direction of the cassette 6e on the pair of side walls, and one wafer unit 21 is placed on each shelf. In addition, the side portions of the cassette 6e located on both sides in the width direction of the pair of side walls are formed as openings.

在此，回到圖2，針對片匣機構6進行說明。片匣機構6包含配置在升降台6a上之晶圓載置部6b及片匣載置台6d、與片匣6e。片匣機構6是藉由升降機構8而沿著Z軸方向一起升降。Here, returning to FIG. 2, the cassette mechanism 6 will be described. The cassette mechanism 6 includes a wafer placement portion 6b, a cassette placement base 6d, and a cassette 6e that are arranged on the lift table 6a. The cassette mechanism 6 is raised and lowered together in the Z-axis direction by the raising and lowering mechanism 8.

容置於片匣6e之晶圓單元21可藉由感測器6f來偵測，前述感測器6f配置在構成開口4a之基台4的側壁當中配置於後方(Y軸方向的一側)之側壁的上部。The wafer unit 21 accommodated in the cassette 6e can be detected by the sensor 6f, which is arranged behind the side wall of the base 4 forming the opening 4a (on the side in the Y-axis direction) The upper part of the side wall.

本實施形態之感測器6f是具有發光部與受光部之反射型的映射感測器(mapping sensor)，前述發光部包含LED(發光二極體，Light Emitting Diode)等之光源，前述受光部包含接收從發光部所照射之光的反射光之光電二極體等之光電轉換元件。The sensor 6f of this embodiment is a reflective mapping sensor having a light-emitting part and a light-receiving part. The light-emitting part includes a light source such as an LED (Light Emitting Diode), and the light-receiving part A photoelectric conversion element such as a photodiode that receives the reflected light of the light irradiated from the light-emitting part.

感測器6f是藉由透過片匣6e的開口來對片匣6e的內部照射光，並接收來自框架19的反射光，來偵測晶圓單元21的有無。具體而言，是以升降機構8使片匣6e上升，並且感測器6f以受光部接收反射光。The sensor 6f irradiates the inside of the cassette 6e with light through the opening of the cassette 6e, and receives the reflected light from the frame 19 to detect the presence or absence of the wafer unit 21. Specifically, the cassette 6e is raised by the elevating mechanism 8, and the sensor 6f receives the reflected light by the light receiving part.

例如，可藉由感測器6f偵測反射光的亮度之峰值，來計數已容置於片匣6e內之晶圓單元21(亦即晶圓11)的數量。再者，作為感測器6f，亦可採用穿透型的映射感測器、或梳型映射感測器。For example, the peak of the brightness of the reflected light can be detected by the sensor 6f to count the number of wafer units 21 (that is, wafers 11) contained in the cassette 6e. Furthermore, as the sensor 6f, a penetrating type mapping sensor or a comb type mapping sensor may also be used.

在此，回到圖1，針對切削裝置2的其他構成要素進行說明。在開口4a的後方形成有開口4b，前述開口4b具有沿著X軸方向的長邊部。在開口4b內配置有平板狀的工作台罩蓋10。Here, returning to FIG. 1, other components of the cutting device 2 will be described. An opening 4b is formed behind the opening 4a, and the opening 4b has a long side portion along the X-axis direction. A flat table cover 10 is arranged in the opening 4b.

在工作台罩蓋10的X軸方向的兩側配置有蛇腹狀的防塵防滴罩蓋12。在工作台罩蓋10及防塵防滴罩蓋12的下方配置有滾珠螺桿式的X軸移動機構(加工進給單元)(未圖示)。On both sides of the table cover 10 in the X-axis direction, bellows-shaped dust-proof and drip-proof covers 12 are arranged. A ball screw type X-axis moving mechanism (processing feed unit) (not shown) is arranged under the table cover 10 and the dust-proof and drip-proof cover 12.

在工作台罩蓋10上設置有工作夾台14。工作夾台14可藉由X軸移動機構而和工作台罩蓋10一起在X軸方向上移動。在工作夾台14的下部連結有馬達等的旋轉驅動源(未圖示)，工作夾台14可以繞著大致平行於Z軸方向(鉛直方向)的旋轉軸而旋轉。A work clamp table 14 is provided on the work table cover 10. The work clamp table 14 can be moved in the X-axis direction together with the work table cover 10 by the X-axis moving mechanism. A rotation drive source (not shown) such as a motor is connected to the lower part of the work chuck table 14, and the work chuck table 14 can rotate about a rotation axis substantially parallel to the Z-axis direction (vertical direction).

工作夾台14的上部固定有以多孔質陶瓷所形成的圓盤狀的多孔板。在多孔板透過預定的流路而連接有真空泵等的吸引源(未圖示)。A disc-shaped porous plate made of porous ceramics is fixed to the upper part of the work clamp table 14. A suction source (not shown) such as a vacuum pump is connected to the porous plate through a predetermined flow path.

若使吸引源動作，在多孔板的上表面會產生負壓。所以，工作夾台14的上表面成為吸保持晶圓11等的保持面14a。再者，在工作夾台14的周圍，設置有用於從四方固定框架19的4個夾具14b。If the suction source is operated, negative pressure will be generated on the upper surface of the perforated plate. Therefore, the upper surface of the work chuck table 14 serves as a holding surface 14a for sucking and holding the wafer 11 and the like. Furthermore, around the work clamp table 14, four clamps 14b for fixing the frame 19 from four directions are provided.

在開口4a的後方且在開口4b的上方配置有大致平行於Y軸方向的一對導軌(未圖示)。一對導軌會例如調整從片匣6e取出之晶圓單元21的X軸方向的位置。A pair of guide rails (not shown) substantially parallel to the Y-axis direction are arranged behind the opening 4a and above the opening 4b. A pair of guide rails adjust the position of the X-axis direction of the wafer unit 21 taken out from the cassette 6e, for example.

相對於開口4a及一對導軌而在X軸方向的一側以橫跨開口4b的態樣設置有門型的支撐體4c。在支撐體4c當中位於X軸方向的另一側的側面，設置有將晶圓單元21各自搬送之下臂單元(搬送單元)16。With respect to the opening 4a and the pair of guide rails, a gate-shaped support body 4c is provided on one side in the X-axis direction so as to straddle the opening 4b. A lower arm unit (conveying unit) 16 is provided on the side surface of the supporting body 4c located on the other side in the X-axis direction.

在下臂單元16連結有移動機構16a。移動機構16a包含大致平行於Y軸方向的軌道，並將下臂單元16以可沿著Y軸方向移動的態樣來支撐。A moving mechanism 16a is connected to the lower arm unit 16. The moving mechanism 16a includes a rail substantially parallel to the Y-axis direction, and supports the lower arm unit 16 in a manner movable along the Y-axis direction.

下臂單元16具有長邊部沿著Z軸方向而配置的氣缸16b。於氣缸16b設置有可藉由氣動控制來沿著Z軸方向上下移動之桿件16c。The lower arm unit 16 has an air cylinder 16b whose long side portion is arranged along the Z-axis direction. The cylinder 16b is provided with a rod 16c that can be moved up and down along the Z-axis direction by pneumatic control.

在桿件16c的下端連接有沿著X軸方向之細長的平板狀的第1臂部16d的一端部。在第1臂部16d的X軸方向的另一端部連接有沿著Y軸方向之細長的平板狀的第2臂部。One end portion of the first arm portion 16d in the shape of an elongated flat plate along the X-axis direction is connected to the lower end of the rod 16c. An elongated flat plate-shaped second arm portion along the Y-axis direction is connected to the other end portion of the first arm portion 16d in the X-axis direction.

在第2臂部的Y軸方向的兩端部，設有X軸方向的長度比Y軸方向的長度長之寬寬度部，且在各寬寬度部的下表面側設置有可吸附框架19的複數個吸附墊16e。At both ends of the second arm portion in the Y-axis direction, there are provided wide portions whose length in the X-axis direction is longer than the length in the Y-axis direction, and a suction frame 19 is provided on the lower surface side of each wide-width portion Plural adsorption pads 16e.

在位於前方側之寬寬度部當中與第2臂部為相反側的側面設置有把持晶圓單元21之把持機構16f。只要在把持機構16f已抓住框架19的一部分的狀態下使下臂單元16往後方移動，即可以將已容置於片匣6e之晶圓單元21往一對導軌拉出。A gripping mechanism 16f that grips the wafer unit 21 is provided on the side surface opposite to the second arm portion among the wide width portion located on the front side. As long as the lower arm unit 16 is moved backward in a state where the holding mechanism 16f has grasped a part of the frame 19, the wafer unit 21 accommodated in the cassette 6e can be pulled out to a pair of guide rails.

已藉一對導軌調整了X軸方向的位置之晶圓單元21，可在已被下臂單元16以複數個吸附墊16e吸附框架19的狀態下從一對導軌往工作夾台14搬送。The wafer unit 21 whose position in the X-axis direction has been adjusted by a pair of guide rails can be transported from the pair of guide rails to the work chuck table 14 in a state where the frame 19 has been sucked by the lower arm unit 16 with a plurality of suction pads 16e.

相對於此，在將晶圓單元21往片匣6e搬送的情況下，以已用複數個吸附墊16e吸附框架19的狀態來將晶圓單元21往一對導軌搬送。In contrast, when the wafer unit 21 is transported to the cassette 6e, the wafer unit 21 is transported to a pair of rails in a state where the frame 19 has been sucked by the plurality of suction pads 16e.

然後，以一對導軌調整晶圓單元21的X軸方向的位置後，在以把持機構16f抓取了框架19的一部分的狀態下，使下臂單元16往前方移動，而將晶圓單元21從一對導軌往片匣6e推入。Then, after adjusting the position of the wafer unit 21 in the X-axis direction with a pair of guide rails, the lower arm unit 16 is moved forward with the holding mechanism 16f grabbing a part of the frame 19, and the wafer unit 21 Push in the cassette 6e from a pair of guide rails.

再者，在將晶圓單元21從一對導軌搬送至晶圓載置部6b的情況下，是在以升降機構8將開口6c的高度設成和一對導軌大致相同的高度後，同樣地將晶圓單元21往晶圓載置部6b推入。Furthermore, when the wafer unit 21 is transported from the pair of rails to the wafer placement portion 6b, the height of the opening 6c is set to approximately the same height as the pair of rails by the lift mechanism 8, and then the same The wafer unit 21 is pushed into the wafer mounting portion 6b.

像這樣，下臂單元16在片匣機構6(晶圓載置部6b及片匣6e)與工作夾台14之間搬送晶圓單元21(晶圓11)。In this manner, the lower arm unit 16 transports the wafer unit 21 (wafer 11) between the cassette mechanism 6 (wafer mounting portion 6b and cassette 6e) and the work chuck table 14.

在相對於支撐體4c而於下臂單元16的相反側，以跨越開口4b的態樣設置有門型的支撐體4d。在支撐體4d當中支撐體4c側的側面設置有一對加工單元移動機構(分度進給單元、切入進給單元)。On the opposite side of the lower arm unit 16 with respect to the support 4c, a gate-shaped support 4d is provided so as to straddle the opening 4b. A pair of processing unit moving mechanisms (indexing feeding unit, cut-in feeding unit) are provided on the side surface of the supporting body 4c among the supporting bodies 4d.

一對加工單元移動機構具備有配置在支撐體4d的前表面且大致平行於Y軸方向的一對Y軸導軌(未圖示)。在一對Y軸導軌上，可滑動地安裝有構成各加工單元移動機構之Y軸移動板18。The pair of processing unit moving mechanisms includes a pair of Y-axis guide rails (not shown) arranged on the front surface of the support body 4d and substantially parallel to the Y-axis direction. On a pair of Y-axis guide rails, a Y-axis moving plate 18 constituting the moving mechanism of each processing unit is slidably mounted.

在Y軸移動板18的支撐體4d側之面設置有螺帽部(未圖示)，且在此螺帽部以可旋轉的形態連結有大致平行於Y軸導軌之Y軸滾珠螺桿(未圖示)。A nut portion (not shown) is provided on the surface of the Y-axis moving plate 18 on the support 4d side, and a Y-axis ball screw (not shown) that is substantially parallel to the Y-axis guide rail is connected to the nut portion in a rotatable manner. Icon).

在Y軸滾珠螺桿的一端部連結有Y軸脈衝馬達(未圖示)。只要以Y軸脈衝馬達使Y軸滾珠螺桿旋轉，Y軸移動板18即沿著Y軸導軌在Y軸方向上移動。A Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw. As long as the Y-axis ball screw is rotated by the Y-axis pulse motor, the Y-axis moving plate 18 moves in the Y-axis direction along the Y-axis guide rail.

在Y軸移動板18的支撐體4c側之面設置有大致平行於Z軸方向的Z軸導軌(未圖示)。在Z軸導軌可滑動地安裝有Z軸移動板(未圖示)。A Z-axis guide rail (not shown) substantially parallel to the Z-axis direction is provided on the surface of the Y-axis moving plate 18 on the support body 4c side. A Z-axis moving plate (not shown) is slidably mounted on the Z-axis guide rail.

在Z軸移動板的支撐體4d側之面設置有螺帽部(未圖示)，且在此螺帽部以可旋轉的形態連結有平行於Z軸導軌之Z軸滾珠螺桿(未圖示)。A nut portion (not shown) is provided on the surface of the support 4d of the Z-axis moving plate, and a Z-axis ball screw parallel to the Z-axis guide rail (not shown) is connected to the nut portion in a rotatable form. ).

在Z軸滾珠螺桿(未圖示)的上端部連結有Z軸脈衝馬達20。只要以Z軸脈衝馬達20使Z軸滾珠螺桿旋轉，Z軸移動板即沿著Z軸導軌在Z軸方向上移動。A Z-axis pulse motor 20 is connected to the upper end of the Z-axis ball screw (not shown). As long as the Z-axis ball screw is rotated by the Z-axis pulse motor 20, the Z-axis moving plate moves in the Z-axis direction along the Z-axis guide rail.

各Z軸移動板的下部設置有切削晶圓11的切削單元22。在本實施形態中，在一對Z軸移動板的各下部設置有切削單元22。一對切削單元22是配置成沿著Y軸方向而相向。A cutting unit 22 for cutting the wafer 11 is provided at the lower part of each Z-axis moving plate. In this embodiment, a cutting unit 22 is provided at each lower part of the pair of Z-axis moving plates. The pair of cutting units 22 are arranged to face each other along the Y-axis direction.

參照圖5，針對切削單元22進行說明。切削單元22具有長邊部沿著Y軸方向而配置之筒狀的主軸殼體22a。主軸殼體22a可以將圓柱狀的主軸22b支撐成可旋轉，前述主軸22b成為相對於Y軸方向平行的旋轉軸。5, the cutting unit 22 will be described. The cutting unit 22 has a cylindrical spindle housing 22a whose long side portion is arranged along the Y-axis direction. The main shaft housing 22a can support the cylindrical main shaft 22b so as to be rotatable, and the main shaft 22b becomes a rotating shaft parallel to the Y-axis direction.

主軸22b的一端部是從主軸殼體22a突出，在此一端部裝設有具有圓環狀的切刃之切削刀片22c。又，在主軸22b的另一端部連結有馬達等的旋轉驅動源(未圖示)。One end of the main shaft 22b protrudes from the main shaft housing 22a, and a cutting blade 22c having an annular cutting edge is installed at this end. In addition, a rotation drive source (not shown) such as a motor is connected to the other end of the main shaft 22b.

如圖1所示，在相鄰於切削單元22的位置，設置有用於拍攝晶圓11的拍攝單元24。拍攝單元24是包含接物透鏡或影像感測器等的拍攝元件的相機，且可利用於晶圓11與切削單元22的對位等。As shown in FIG. 1, at a position adjacent to the cutting unit 22, an imaging unit 24 for imaging the wafer 11 is provided. The imaging unit 24 is a camera including imaging elements such as an objective lens or an image sensor, and can be used for alignment of the wafer 11 and the cutting unit 22 and the like.

在開口4b的後方設置有圓形的開口4e。在開口4e內配置有用於洗淨切削後的晶圓11等的洗淨單元26。洗淨單元26包含吸引保持晶圓單元21的旋轉工作台、及朝向旋轉工作台的保持面噴射氣液混合流體的噴嘴。A circular opening 4e is provided behind the opening 4b. A cleaning unit 26 for cleaning the wafer 11 and the like after cutting is arranged in the opening 4e. The cleaning unit 26 includes a rotating table that sucks and holds the wafer unit 21, and a nozzle that sprays a gas-liquid mixed fluid toward the holding surface of the rotating table.

可在洗淨單元26的旋轉工作台、與配置於開口4b之工作夾台14之間，藉由上臂單元30來搬送晶圓單元21。在上臂單元30連結有移動機構30a。The upper arm unit 30 can transport the wafer unit 21 between the rotating table of the cleaning unit 26 and the work chuck table 14 arranged in the opening 4 b. A moving mechanism 30a is connected to the upper arm unit 30.

移動機構30a包含配置於移動機構16a的上方之大致平行於Y軸方向的軌道，且以可沿著Y軸方向移動的態樣支撐上臂單元30。上臂單元30具有將長邊部沿著Z軸方向來配置的氣缸30b。The moving mechanism 30a includes a rail substantially parallel to the Y-axis direction arranged above the moving mechanism 16a, and supports the upper arm unit 30 in a manner movable along the Y-axis direction. The upper arm unit 30 has an air cylinder 30b in which the long side portion is arranged along the Z-axis direction.

於氣缸30b設置有可藉由氣動控制而沿著Z軸方向上下移動的桿件30c。在桿件30c的下端連接有沿著X軸方向之細長的平板狀的第1臂部30d的中央部。The cylinder 30b is provided with a rod 30c that can be moved up and down along the Z-axis direction by pneumatic control. The center part of the elongated flat plate-shaped 1st arm part 30d along the X-axis direction is connected to the lower end of the rod 30c.

在第1臂部30d之X軸方向的兩端部，設有Y軸方向的長度比X軸方向的長度長之寬寬度部，並且在寬寬度部的下表面側設置有可吸附框架19的複數個吸附墊30e。At both ends of the first arm portion 30d in the X-axis direction, there is provided a wide portion whose length in the Y-axis direction is longer than that in the X-axis direction, and a suction frame 19 is provided on the lower surface side of the wide portion Plural adsorption pads 30e.

上臂單元30將包含切削後的晶圓11之晶圓單元21的框架19以已用複數個吸附墊30e吸附的狀態，從工作夾台14往洗淨單元26的旋轉工作台搬送。The upper arm unit 30 transports the frame 19 of the wafer unit 21 including the cut wafer 11 from the work chuck table 14 to the rotating table of the cleaning unit 26 in a state of being sucked by a plurality of suction pads 30 e.

切削裝置2更具有控制各構成要素的動作的控制單元32。控制單元32會控制感測器6f、升降機構8、X軸移動機構、加工單元移動機構、下臂單元16、切削單元22、拍攝單元24、洗淨單元26、上臂單元30等的動作。The cutting device 2 further has a control unit 32 that controls the operation of each component. The control unit 32 controls the actions of the sensor 6f, the lifting mechanism 8, the X-axis moving mechanism, the processing unit moving mechanism, the lower arm unit 16, the cutting unit 22, the imaging unit 24, the washing unit 26, the upper arm unit 30, and the like.

控制單元32藉由電腦來構成，前述電腦包含例如以CPU(中央處理單元，Central Processing Unit)為代表之處理器等的處理裝置、DRAM(動態隨機存取記憶體，Dynamic Random Access Memory)、SRAM(靜態隨機存取記憶體，StaticRandom Access Memory)、ROM(唯讀記憶體，Read Only Memory)等之主記憶裝置、及快閃記憶體、硬碟驅動機、固態硬碟等之輔助記憶裝置。The control unit 32 is constituted by a computer. The aforementioned computer includes, for example, processing devices such as a processor represented by a CPU (Central Processing Unit), DRAM (Dynamic Random Access Memory), and SRAM. (Static Random Access Memory), ROM (Read Only Memory) and other primary memory devices, and flash memory, hard disk drives, solid state drives, and other auxiliary memory devices.

在輔助記憶裝置記憶有包含預定的程式之軟體。可藉由依照此軟體來使處理裝置等動作，而實現控制單元32的功能。控制單元32具有以預定的程式所構成的判斷部34。判斷部34依據感測器6f所偵測出之反射光的亮度的峰值的數量，來特定已容置於片匣6e之晶圓11的數量。The auxiliary memory device stores software containing predetermined programs. The function of the control unit 32 can be realized by operating the processing device and the like in accordance with this software. The control unit 32 has a judgment unit 34 composed of a predetermined program. The determining unit 34 determines the number of wafers 11 contained in the cassette 6e according to the number of peaks of the brightness of the reflected light detected by the sensor 6f.

又，判斷部34會判斷是否已將第幾個晶圓11從片匣6e搬送(亦即搬出)，並進一步判斷是否已將第幾個晶圓11搬送(亦即搬入)至片匣6e。In addition, the judging unit 34 judges whether the number of wafers 11 has been transported (ie, moved out) from the cassette 6e, and further determines whether the number of wafers 11 has been transported (ie, transported in) to the cassette 6e.

例如，判斷部34可以藉由從片匣6e往一對導軌拉出之下臂單元16的動作的次數，來判斷是否已將第幾個晶圓11從片匣6e搬送。同樣地，判斷部34能夠藉由從一對導軌往片匣6e推入之下臂單元16的動作的次數，來判斷是否已將第幾個晶圓11搬送至片匣6e。For example, the determining unit 34 may determine whether the number of wafers 11 have been transported from the cassette 6e by the number of operations of pulling out the lower arm unit 16 from the cassette 6e to the pair of rails. Similarly, the determining unit 34 can determine whether the number of wafers 11 have been transferred to the cassette 6e by the number of operations of pushing the lower arm unit 16 into the cassette 6e from the pair of rails.

判斷部34是將最後從片匣6e搬送出之晶圓11判斷為片匣6e的最終的晶圓11。又，在已將最終的晶圓11以外之全部的晶圓11於切削及洗淨後容置到片匣6e的情況下，控制單元32會生成用於催促片匣6e的更換的控制訊號。The judging unit 34 judges the wafer 11 that was finally transported from the cassette 6e as the final wafer 11 of the cassette 6e. Furthermore, when all the wafers 11 other than the final wafer 11 have been cut and cleaned and housed in the cassette 6e, the control unit 32 generates a control signal for urging the replacement of the cassette 6e.

控制單元32藉由此控制訊號，而使兼作為輸入裝置及顯示裝置的觸控面板36、揚聲器(未圖示)、警報燈38等的通知部40動作。例如，控制單元32可於觸控面板36顯示「請更換片匣」之訊息。The control unit 32 operates the notification unit 40, such as the touch panel 36, the speaker (not shown), the warning light 38, and the like, which also serve as an input device and a display device, by controlling the signal in this way. For example, the control unit 32 can display a message "please replace the cassette" on the touch panel 36.

控制單元32亦可取代觸控面板36的訊息顯示、或者與其一起，而從揚聲器播放「請更換片匣」之聲音或預定的警報聲。又，控制單元32亦可藉由使警報燈38閃爍，來發出催促片匣6e的更換之訊息。The control unit 32 can also replace the message display of the touch panel 36 or together with it, and play the sound of "please replace the cassette" or a predetermined alarm sound from the speaker. In addition, the control unit 32 can also send out a message urging the replacement of the cassette 6e by flashing the warning light 38.

接著，參照圖4到圖7，說明在以切削單元22切削複數個晶圓11的每一個後，容置至片匣6e的複數個晶圓11之處理方法。圖4是按照時間序列來說明複數個晶圓11之處理的圖。Next, referring to FIGS. 4 to 7, after each of the plurality of wafers 11 is cut by the cutting unit 22, the processing method of the plurality of wafers 11 contained in the cassette 6 e will be described. FIG. 4 is a diagram illustrating the processing of a plurality of wafers 11 in time series.

如圖4所示，操作人員將容置有N個晶圓單元21(亦即晶圓11)之第1片匣6e-1載置於片匣載置台6d上(第1片匣6e-1之片匣載置步驟S10)。再者，N為2以上的自然數，在本實施形態中為：N=25。As shown in Figure 4, the operator places the first cassette 6e-1 containing N wafer units 21 (ie wafers 11) on the cassette mounting table 6d (the first cassette 6e-1 The cassette placement step S10). Furthermore, N is a natural number of 2 or more, and in this embodiment: N=25.

當將第1片匣6e-1載置於片匣載置台6d時，升降機構8即以預定的速度上升或下降。此時，控制單元32會使用感測器6f來計數已容置於第1片匣6e-1之晶圓單元21的數量。When the first cassette 6e-1 is placed on the cassette mounting table 6d, the elevating mechanism 8 is raised or lowered at a predetermined speed. At this time, the control unit 32 will use the sensor 6f to count the number of wafer units 21 contained in the first cassette 6e-1.

已計數晶圓單元21的數量後，下臂單元16會將#1的晶圓11從已調整高度位置之第1片匣6e-1經過一對導軌往工作夾台14搬送(#1之晶圓搬送步驟S20)。再者，記號#是表示從片匣6e被搬送之晶圓11的順序。After the number of wafer units 21 has been counted, the lower arm unit 16 will transport the #1 wafer 11 from the first cassette 6e-1 whose height has been adjusted to the work chuck 14 via a pair of guide rails (#1之晶Circle conveyance step S20). In addition, the symbol # indicates the order of the wafers 11 transported from the cassette 6e.

判斷部34在#1的晶圓搬送步驟S20中，判斷所搬送之晶圓11是否為最後從第1片匣6e-1被搬送之最終的晶圓11(#1之判斷步驟S30)。當然，#1的晶圓11並非最終的晶圓11。In the #1 wafer transport step S20, the judging unit 34 judges whether the transported wafer 11 is the final wafer 11 transported last from the first cassette 6e-1 (#1 judging step S30). Of course, the #1 wafer 11 is not the final wafer 11.

在#1的判斷步驟S30之後，工作夾台14以吸引保持有#1的晶圓11的背面11b側的狀態，往切削單元22的下方移動。然後，以繞旋轉軸的方式將工作夾台14的方向調整成1條分割預定線13變得與X軸方向大致平行。After the determination step S30 of #1, the work chuck 14 moves below the cutting unit 22 in a state where the back surface 11b side of the wafer 11 holding #1 is sucked and held. Then, the direction of the work chuck table 14 is adjusted around the rotation axis so that one planned dividing line 13 becomes substantially parallel to the X-axis direction.

之後，在將以高速旋轉的切削刀片22c的下端的高度定位在背面11b與保持面14a之間的狀態下，使切削刀片22c與工作夾台14沿著X軸方向相對地移動。藉此，可沿著1條分割預定線13切削晶圓11(#1之切削步驟S40)。After that, in a state where the height of the lower end of the cutting insert 22c rotating at a high speed is positioned between the back surface 11b and the holding surface 14a, the cutting insert 22c and the work chuck 14 are relatively moved in the X-axis direction. Thereby, the wafer 11 can be cut along one planned dividing line 13 (#1 cutting step S40).

在沿著所有的分割預定線13切削晶圓11後，即可解除在工作夾台14之吸引。然後，上臂單元30將#1的晶圓11從工作夾台14搬送到洗淨單元26，且洗淨單元26將#1的晶圓11洗淨(#1之洗淨步驟S50)。After the wafer 11 is cut along all the planned dividing lines 13, the attraction on the work chuck 14 can be released. Then, the upper arm unit 30 transfers the #1 wafer 11 from the work chuck 14 to the cleaning unit 26, and the cleaning unit 26 cleans the #1 wafer 11 (#1 cleaning step S50).

當將#1的晶圓11搬送至洗淨單元26時，下臂單元16將#2的晶圓11從第1片匣6e-1經過一對導軌往工作夾台14搬送(#2之晶圓搬送步驟S20)。像這樣，下臂單元16依序從片匣6e搬送晶圓11。When the #1 wafer 11 is transported to the cleaning unit 26, the lower arm unit 16 transports the #2 wafer 11 from the first cassette 6e-1 through a pair of rails to the work chuck 14 (#2 of the crystal Circle conveyance step S20). In this manner, the lower arm unit 16 sequentially transports the wafer 11 from the cassette 6e.

又，判斷部34也會針對#2之晶圓搬送步驟S20，判斷所搬送之晶圓11是否為最終的晶圓11(#2之判斷步驟S30)。當然，#2的晶圓11也並非最終的晶圓11。In addition, the judging unit 34 also judges whether the transferred wafer 11 is the final wafer 11 for #2 wafer transport step S20 (#2 judgment step S30). Of course, the wafer 11 of #2 is not the final wafer 11 either.

此外，藉由切削單元22切削#2的晶圓11(#2之切削步驟S40)。如此，切削單元22會依序切削晶圓11。圖5是顯示洗淨#1的晶圓11，而切削#2的晶圓11之情形的圖。In addition, the #2 wafer 11 is cut by the cutting unit 22 (#2 cutting step S40). In this way, the cutting unit 22 cuts the wafer 11 sequentially. FIG. 5 is a diagram showing a state where the wafer 11 of #1 is cleaned and the wafer 11 of #2 is cut.

在圖5中，為了方便，在圓圈之中記載為「#1」來表示#1的晶圓11(亦即晶圓單元21)。同樣地，在圓圈之中記載為「#2」來表示#2的晶圓11(亦即晶圓單元21)。In FIG. 5, for convenience, "#1" is written in the circle to indicate #1 wafer 11 (that is, wafer unit 21). Similarly, "#2" is written in the circle to indicate #2 wafer 11 (that is, wafer unit 21).

在切削#2的晶圓11之期間，下臂單元16會從旋轉工作台往第1片匣6e-1搬送洗淨後之#1的晶圓11。藉此，將#1的晶圓11容置至第1片匣6e-1(#1之片匣容置步驟S60)。During the cutting of the #2 wafer 11, the lower arm unit 16 transfers the cleaned #1 wafer 11 from the rotating table to the first cassette 6e-1. Thereby, the wafer 11 of #1 is accommodated in the first cassette 6e-1 (the cassette accommodating step S60 of #1).

於#1之片匣容置步驟S60的結束後，進行#2之洗淨步驟S50、與#3之晶圓搬送步驟S20及#3之判斷步驟S30。之後，進行#2之片匣容置步驟S60、與#3之切削步驟S40。如此進行，而將各晶圓11依序處理。After the completion of the cassette accommodating step S60 of #1, the cleaning step S50 of #2, the wafer transport step S20 of #3, and the judgment step S30 of #3 are performed. After that, the cassette housing step S60 of #2 and the cutting step S40 of #3 are performed. In this way, the wafers 11 are processed sequentially.

進一步地進行處理，在#(N-1)之洗淨步驟S50中會進行#N之晶圓搬送步驟S20及#N之判斷步驟S30。圖6是顯示處理#(N-1)的晶圓11及#N的晶圓11之情形的圖。Further processing is performed. In the #(N-1) cleaning step S50, the #N wafer transport step S20 and the #N determination step S30 are performed. FIG. 6 is a diagram showing a state of processing #(N-1) wafer 11 and #N wafer 11.

在圖6中，為了方便，而在長圓圈之中記載為「#(N-1)」來表示#(N-1)的晶圓11(亦即晶圓單元21)。同樣地，在圓圈之中記載為「#N」來表示最終的晶圓11即#N的晶圓11(亦即晶圓單元21)。In FIG. 6, for convenience, "#(N-1)" is written in the long circle to indicate the #(N-1) wafer 11 (that is, the wafer unit 21). Similarly, "#N" is written in the circle to indicate the final wafer 11, that is, the #N wafer 11 (that is, the wafer unit 21).

於#(N-1)之片匣容置步驟S60及#N之切削步驟S40完成，而將#N的晶圓11(亦即最終的晶圓11)以外之所有的晶圓11容置於第1片匣6e-1後，向操作人員傳達更換第1片匣6e-1之意旨。操作人員會接收此意旨，並例如以人工作業將第1片匣6e-1從片匣載置台6d卸除，並搬送至配置於切削裝置2的外部的預定之台座。The cassette accommodating step S60 of #(N-1) and the cutting step S40 of #N are completed, and all the wafers 11 other than the #N wafer 11 (that is, the final wafer 11) are accommodated After the first cassette 6e-1, it conveys the intention to replace the first cassette 6e-1 to the operator. The operator accepts this intention, and, for example, manually removes the first cassette 6e-1 from the cassette mounting table 6d, and transports it to a predetermined pedestal arranged outside the cutting device 2.

並且，操作人員將和第1片匣6e-1不同的第2片匣6e-2載置於片匣載置台6d(片匣更換步驟S70，亦即第2片匣6e-2之片匣載置步驟S10)。圖7是顯示片匣更換步驟S70的圖。In addition, the operator places a second cassette 6e-2 different from the first cassette 6e-1 on the cassette placement table 6d (cassette replacement step S70, that is, the cassette placement of the second cassette 6e-2 Set to step S10). Fig. 7 is a diagram showing a cassette replacement step S70.

在第2片匣6e-2中也是以晶圓單元21之狀態而容置有複數個晶圓11，且在片匣更換步驟S70之後，開始進行從第2片匣6e-2往工作夾台14之#1的晶圓11的搬送(搬送開始步驟S80，亦即#1之晶圓搬送步驟S20)。The second cassette 6e-2 also houses a plurality of wafers 11 in the state of the wafer unit 21, and after the cassette replacement step S70, the process starts from the second cassette 6e-2 to the work chuck table The 14th #1 wafer 11 is transported (the transport start step S80, that is, the #1 wafer transport step S20).

針對第2片匣6e-2中的各晶圓11，也是以和第1片匣6e-1中的晶圓11同樣的順序來進行處理。在圖7中，是在圓圈之中記載為「#1」來表示第2片匣6e-2之#1的晶圓11(亦即，晶圓單元21)。The wafers 11 in the second cassette 6e-2 are also processed in the same order as the wafers 11 in the first cassette 6e-1. In FIG. 7, "#1" is written in the circle to indicate the #1 wafer 11 (that is, the wafer unit 21) of the second cassette 6e-2.

另外，原本容置於第1片匣6e-1之最終的晶圓11經過#N之切削步驟S40及#N之洗淨步驟S50，而在第2片匣6e-2之#1的晶圓11之搬送開始步驟S80之後，被搬送至晶圓載置部6b。In addition, the final wafer 11 originally contained in the first cassette 6e-1 undergoes the #N cutting step S40 and the #N cleaning step S50, while the #1 wafer in the second cassette 6e-2 After the conveyance start step S80 of 11, it is conveyed to the wafer mounting part 6b.

此最終的晶圓11可藉由下臂單元16來載置於位於第2片匣6e-2的下方之晶圓載置部6b，而非第2片匣6e-2(最終晶圓載置步驟S90)。The final wafer 11 can be placed on the wafer placement portion 6b under the second cassette 6e-2 by the lower arm unit 16, instead of the second cassette 6e-2 (final wafer placement step S90 ).

再者，在最終晶圓載置步驟S90中，是以藉由升降機構8使晶圓載置部6b上升到和一對導軌相同高度的狀態，來將最終的晶圓11搬送至晶圓載置部6b。In addition, in the final wafer placement step S90, the wafer placement portion 6b is raised to the same height as the pair of rails by the lift mechanism 8 to transport the final wafer 11 to the wafer placement portion 6b .

在本實施形態中，可以在讓最終的晶圓11返回到第1片匣6e-1之前，開始進行從第2片匣6e-2往工作夾台14之晶圓11的搬送。所以，可以使每單位時間之晶圓11的處理數量比以下情況提升：將所容置之全部的晶圓11都處理並搬送至第1片匣6e-1後再將第1片匣6e-1更換為第2片匣6e-2。In this embodiment, the transfer of the wafer 11 from the second cassette 6e-2 to the work chuck 14 can be started before returning the final wafer 11 to the first cassette 6e-1. Therefore, the number of wafers 11 processed per unit time can be increased compared to the following situation: all the contained wafers 11 are processed and transported to the first cassette 6e-1, and then the first cassette 6e- 1 Replace with the second cassette 6e-2.

除此之外，由於配置在片匣載置台6d的下側之晶圓載置部6b會和片匣載置台6d一起升降，因此下臂單元16可以在不改變下臂單元16的可動範圍的情形下，將最終的晶圓11載置到晶圓載置部6b。所以，有以下優點：沒必要將下臂單元16的可動範圍從通常的規格變更。In addition, since the wafer mounting portion 6b arranged on the lower side of the cassette mounting table 6d is raised and lowered together with the cassette mounting table 6d, the lower arm unit 16 can be used without changing the movable range of the lower arm unit 16 Next, the final wafer 11 is placed on the wafer placement portion 6b. Therefore, there is an advantage that it is not necessary to change the movable range of the lower arm unit 16 from the normal specifications.

在最終晶圓載置步驟S90之後，操作人員以人工作業將已載置於晶圓載置部6b之最終的晶圓11從晶圓載置部6b取出，並容置到已配置於切削裝置2的外部的第1片匣6e-1(取出及容置步驟S100)。藉此，可以將包含最終的晶圓11之全部的晶圓11容置於第1片匣6e-1。After the final wafer placement step S90, the operator manually removes the final wafer 11 that has been placed on the wafer placement portion 6b from the wafer placement portion 6b and accommodates it outside the cutting device 2 The first cassette 6e-1 (removal and storage step S100). Thereby, all the wafers 11 including the final wafer 11 can be accommodated in the first cassette 6e-1.

另外，上述實施形態之構成、方法等，只要在不脫離本發明之目的之範圍內，均可適當變更而實施。片匣更換步驟S70或取出及容置步驟S100並不限定於操作人員的人工作業，亦可藉搬送機器人(未圖示)來進行。In addition, the structure, method, etc. of the above-mentioned embodiment can be suitably changed and implemented as long as it does not deviate from the purpose of the present invention. The cassette replacement step S70 or the removal and storage step S100 is not limited to the manual work of the operator, and can also be performed by a transport robot (not shown).

2:切削裝置 4:基台 4a,4b,4e,6c:開口 4c,4d:支撐體 6:片匣機構 6a:升降台 6b:晶圓載置部 6d:片匣載置台 6e:片匣 6e-1:第1片匣 6e-2:第2片匣 6f:感測器 8:升降機構 10:工作台罩蓋 11:晶圓 11a:正面 11b:背面 12:防塵防滴罩蓋 13:分割預定線 14:工作夾台 14a:保持面 14b:夾具 15:器件 16:下臂單元 16a,30a:移動機構 16b,30b:氣缸 16c,30c:桿件 16d,30d:第1臂部 16e,30e:吸附墊 16f:把持機構 17:黏著膠帶 18:Y軸移動板 19:框架 20:Z軸脈衝馬達 21:晶圓單元 22:切削單元 22a:主軸殼體 22b:主軸 22c:切削刀片 24:拍攝單元 26:洗淨單元 30:上臂單元 32:控制單元 34:判斷部 36:觸控面板 38:警報燈 40:通知部 X,Y,Z:方向 S10:片匣載置步驟 S20:晶圓搬送步驟 S30:判斷步驟 S40:切削步驟 S50:洗淨步驟 S60:片匣容置步驟 S70:片匣更換步驟 S80:搬送開始步驟 S90:最終晶圓載置步驟 S100:取出及容置步驟2: Cutting device 4: Abutment 4a, 4b, 4e, 6c: opening 4c, 4d: support body 6: Cassette mechanism 6a: Lifting table 6b: Wafer placement section 6d: Cassette mounting table 6e: cassette 6e-1: The first cassette 6e-2: second cassette 6f: sensor 8: Lifting mechanism 10: Workbench cover 11: Wafer 11a: front 11b: back 12: Dust-proof and drip-proof cover 13: Divide the planned line 14: Work clamp table 14a: Keep the face 14b: Fixture 15: Device 16: Lower arm unit 16a, 30a: mobile mechanism 16b, 30b: cylinder 16c, 30c: rod 16d, 30d: 1st arm 16e, 30e: Adsorption pad 16f: Controlling agency 17: Adhesive tape 18: Y-axis moving plate 19: Frame 20: Z-axis pulse motor 21: Wafer unit 22: Cutting unit 22a: Spindle housing 22b: Spindle 22c: cutting insert 24: shooting unit 26: Washing unit 30: Upper arm unit 32: control unit 34: Judgment Department 36: Touch panel 38: Warning light 40: Notification Department X, Y, Z: direction S10: Cassette placement steps S20: Wafer handling steps S30: Judgment step S40: Cutting step S50: Washing steps S60: Cassette accommodating steps S70: Cartridge replacement procedure S80: Steps to start transfer S90: Final wafer placement step S100: Take-out and storage steps

圖1是切削裝置的立體圖。 圖2是片匣機構等的局部剖面側面圖。 圖3是晶圓等的立體圖。 圖4是按照時間序列來說明複數個晶圓之處理的圖。 圖5是顯示將#1的晶圓洗淨，並切削#2的晶圓之情形的圖。 圖6是顯示處理#(N-1)及#N的晶圓之情形的圖。 圖7是顯示片匣更換步驟的圖。Fig. 1 is a perspective view of a cutting device. Fig. 2 is a partial cross-sectional side view of a cassette mechanism and the like. Fig. 3 is a perspective view of a wafer and the like. Fig. 4 is a diagram illustrating the processing of a plurality of wafers in time series. FIG. 5 is a diagram showing a situation where the #1 wafer is cleaned and the #2 wafer is cut. Fig. 6 is a diagram showing how wafers #(N-1) and #N are processed. Fig. 7 is a diagram showing a cassette replacement procedure.

2:切削裝置2: Cutting device

4:基台4: Abutment

4a,4b,4e,6c:開口4a, 4b, 4e, 6c: opening

4c,4d:支撐體4c, 4d: support body

6:片匣機構6: Cassette mechanism

6a:升降台6a: Lifting table

6b:晶圓載置部6b: Wafer placement section

6d:片匣載置台6d: Cassette mounting table

6e:片匣6e: cassette

10:工作台罩蓋10: Workbench cover

11:晶圓11: Wafer

12:防塵防滴罩蓋12: Dust-proof and drip-proof cover

14:工作夾台14: Work clamp table

14a:保持面14a: Keep the face

14b:夾具14b: Fixture

16:下臂單元16: Lower arm unit

16a,30a:移動機構16a, 30a: mobile mechanism

16b,30b:氣缸16b, 30b: cylinder

16c,30c:桿件16c, 30c: rod

16d,30d:第1臂部16d, 30d: 1st arm

16e,30e:吸附墊16e, 30e: Adsorption pad

16f:把持機構16f: Controlling agency

17:黏著膠帶17: Adhesive tape

18:Y軸移動板18: Y-axis moving plate

19:框架19: Frame

20:Z軸脈衝馬達20: Z-axis pulse motor

21:晶圓單元21: Wafer unit

22:切削單元22: Cutting unit

24:拍攝單元24: shooting unit

26:洗淨單元26: Washing unit

30:上臂單元30: Upper arm unit

32:控制單元32: control unit

34:判斷部34: Judgment Department

36:觸控面板36: Touch panel

38:警報燈38: Warning light

40:通知部40: Notification Department

X,Y,Z:方向X, Y, Z: direction

Claims (3)

一種複數個晶圓之處理方法，將於正面側被所設定之複數條分割預定線所區劃出的複數個區域的每一個中形成有器件之複數個晶圓的每一個，沿著各分割預定線切削後容置到片匣，前述複數個晶圓之處理方法的特徵在於具備以下步驟： 片匣載置步驟，將容置有複數個晶圓的第1片匣載置於片匣載置台； 晶圓搬送步驟，依序將晶圓從該第1片匣往工作夾台搬送； 判斷步驟，判斷往該工作夾台搬送之晶圓是否為最後從該第1片匣被搬送出之最終的晶圓； 切削步驟，以切削單元依序切削已被該工作夾台保持之晶圓； 片匣容置步驟，將不是該最終的晶圓之晶圓在該切削步驟中切削後，容置於該第1片匣； 片匣更換步驟，在已將該最終的晶圓以外之全部的晶圓容置於該第1片匣後，將該第1片匣從該片匣載置台卸除，並將容置有複數個晶圓且和該第1片匣不同之第2片匣載置於該片匣載置台； 搬送開始步驟，在該片匣更換步驟之後，開始進行從該第2片匣往該工作夾台之晶圓的搬送；及 最終晶圓載置步驟，在該搬送開始步驟之後，將已在該切削步驟中切削的該最終的晶圓載置到晶圓載置部，前述晶圓載置部配置在該片匣載置台的下側且和該片匣載置台一起升降。A processing method for a plurality of wafers, each of a plurality of wafers with a device formed in each of a plurality of regions divided by a plurality of predetermined dividing lines set on the front side, along each dividing plan After the wire is cut, it is housed in the cassette. The aforementioned processing method for multiple wafers is characterized by the following steps: In the cassette placing step, the first cassette containing a plurality of wafers is placed on the cassette placing table; In the wafer transfer step, the wafers are transferred from the first cassette to the work clamping table in sequence; Judging step, judging whether the wafer transported to the work chuck is the final wafer transported from the first cassette; In the cutting step, the cutting unit sequentially cuts the wafers held by the work chuck; A cassette accommodating step, after cutting the wafer that is not the final wafer in the cutting step, it is stored in the first cassette; In the cassette replacement step, after all the wafers except the final wafer have been accommodated in the first cassette, the first cassette is removed from the cassette mounting table, and a plurality of wafers are accommodated A second wafer cassette different from the first cassette is placed on the cassette mounting table; The transport start step, after the cassette replacement step, start to transport the wafers from the second cassette to the work chuck; and In the final wafer mounting step, after the transfer start step, the final wafer that has been cut in the cutting step is mounted on a wafer mounting portion, the wafer mounting portion is arranged on the lower side of the cassette mounting table and It moves up and down together with the cassette mounting table. 如請求項1之複數個晶圓之處理方法，其更具備有取出及容置步驟，前述取出及容置步驟是在該最終晶圓載置步驟後，將載置於該晶圓載置部之該最終的晶圓從該晶圓載置部取出並容置至該第1片匣。For example, the processing method for multiple wafers of claim 1, which is further equipped with taking out and accommodating steps, and the aforementioned taking out and accommodating steps are after the final wafer placing step, placing the wafer in the wafer placing portion The final wafer is taken out from the wafer placement part and stored in the first cassette. 一種切削裝置，將於正面側被所設定之複數條分割預定線所區劃出的複數個區域的每一個中形成有器件之複數個晶圓的每一個，在沿著各分割預定線切削後容置到片匣，前述切削裝置的特徵在於：具備： 工作夾台，保持晶圓； 切削單元，具有主軸、及裝設於該主軸的一端側之切削刀片； 片匣機構，具備供容置有複數個晶圓之第1片匣載置之片匣載置台、及配置在該片匣載置台的下側且和該片匣載置台一起升降之晶圓載置部； 搬送單元，在該片匣機構與該工作夾台之間搬送晶圓； 控制單元，包含判斷部，前述判斷部將最後從該第1片匣搬送出之晶圓判斷為該第1片匣之最終的晶圓；及 通知部，在原本容置於該第1片匣之該最終的晶圓以外之全部的晶圓已於切削後容置於該第1片匣的情況下，發出催促該第1片匣的更換之訊息， 該控制單元藉由控制該搬送單元而進行以下動作： 將切削後的晶圓當中該最終的晶圓以外之全部的晶圓搬送到該第1片匣，並將該最終的晶圓搬送到該晶圓載置部；及 已將該最終的晶圓以外之全部的晶圓容置於該第1片匣之後，並且已將容置有複數個晶圓且和該第1片匣不同之第2片匣載置於該片匣載置台的情況下，於將切削後的該最終的晶圓載置到該晶圓載置部之前，開始進行從該第2片匣往該工作夾台之晶圓的搬送。A cutting device that forms each of a plurality of wafers with a device in each of a plurality of regions divided by a plurality of predetermined division lines set on the front side, and cuts along each predetermined division line. Placed in the cassette, the aforementioned cutting device is characterized by: Work clamp table to hold wafers; The cutting unit has a main shaft and a cutting blade installed on one end of the main shaft; The cassette mechanism includes a cassette mounting table for placing a first cassette containing a plurality of wafers, and a wafer mounting table arranged on the lower side of the cassette mounting table and raised and lowered together with the cassette mounting table Department; A transport unit, which transports wafers between the cassette mechanism and the work clamping table; The control unit includes a judging unit, and the judging unit judges the last wafer transported from the first cassette as the final wafer of the first cassette; and The notification unit, in the case that all the wafers originally contained in the first cassette except the final wafer have been stored in the first cassette after being cut, issue a urge to replace the first cassette The message, The control unit performs the following actions by controlling the transport unit: Transport all the wafers in the cut wafers except the final wafer to the first cassette, and transport the final wafer to the wafer placement part; and All wafers other than the final wafer have been placed after the first cassette, and a second cassette that contains a plurality of wafers and is different from the first cassette has been placed in the In the case of the cassette mounting table, before placing the cut final wafer on the wafer mounting portion, the wafer transfer from the second cassette to the work chuck is started.
TW110113257A 2020-05-01 2021-04-13 Method for processing a plurality of wafers and cutting device capable of increasing the number of wafers processed per unit time without changing a movable range of a transfer unit from a normal specification TW202143312A (en)

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