JP2023109276A - Processing device and abnormality detection method for proximity sensor - Google Patents

Abstract

To provide a processing device which prevents a function stop of a proximity sensor during processing of a workpiece by monitoring a state of the proximity sensor used for detecting a frame unit, and to provide an abnormality detection method.SOLUTION: The present invention relates to a processing device comprising: a cassette stage on which a cassette storing a frame unit 11 including an annular frame 9 and a workpiece therein is placed; a temporary placement unit 10 including a pair of frame guide rails 8; a first conveyance unit 14 which holds the frame unit 11 and conveys it to the temporary placement unit 10; and a control unit which controls the components. The temporary placement unit 10 includes a non-contact proximity sensor 8d. The control unit includes: a distance identification section for identifying a detection distance 8f at a time point, in which the proximity sensor 8d detects the frame unit 11, when conveying the frame unit 11 to the frame guide rails 8; and a determination section for determining that the proximity sensor 8d is abnormal when the detection distance 8f is shorter than a determination threshold 8e.SELECTED DRAWING: Figure 5

Description

The present invention provides a processing apparatus that can be used in a device chip manufacturing method for manufacturing a device chip by processing a workpiece such as a wafer made of a material such as a semiconductor, and a proximity sensor used in the processing apparatus. It relates to a detection method.

2. Description of the Related Art In the manufacturing process of device chips used in electronic devices such as mobile phones and personal computers, first, a plurality of dividing lines (streets) that intersect each other are set on the surface of a wafer made of a material such as a semiconductor. Then, devices such as ICs (Integrated Circuits) and LSIs (Large-scale Integration) are formed in each area partitioned by the planned division lines. After that, the wafer is thinned by grinding from the rear surface side, and is divided along the planned division lines to form individual device chips.

The division of the wafer is performed, for example, by a cutting device equipped with an annular cutting blade. A cutting apparatus includes a chuck table capable of holding a wafer to be processed, and a cutting unit having a cutting blade capable of cutting the wafer held on the chuck table. Alternatively, the division of the wafer is performed by a laser processing apparatus capable of laser processing the wafer.

When carrying a wafer into a processing device such as a cutting device or a laser processing device, a tape called a dicing tape having a diameter larger than that of the wafer is attached to the back side of the wafer in advance, and an opening having a diameter larger than that of the wafer is formed. The outer periphery of the tape is adhered to an annular frame having a That is, a wafer, a tape, and a frame are integrated to form a frame unit (see Patent Document 1). Then, in the processing apparatus, the wafer in the state of the frame unit is loaded and processed.

In order to continuously process a plurality of wafers in a processing apparatus, a cassette containing a plurality of frame units is loaded into the processing apparatus. Then, in the processing apparatus, the frame units are pulled out one by one from the cassette and conveyed to the chuck table while being adjusted in position. The processing device conveys a temporary placement unit having a pair of frame guide rails, a loading/unloading unit that grips a frame unit housed in a cassette and pulls it out to the temporary placement unit, and a frame unit placed on the temporary placement unit. and a transport unit.

The pair of frame guide rails of the temporary placement unit are movable in directions to widen or narrow the distance between them. The temporary placement unit adjusts the position of the frame unit by sandwiching the frame unit between the pair of frame guide rails (see Patent Document 2). In addition, the temporary placement unit includes a proximity sensor composed of a reflective photoelectric sensor or the like to detect the presence or absence of the temporarily placed frame unit. Then, in the processing apparatus, each unit operates with reference to the detection result of the presence/absence of the frame unit by the proximity sensor.

JP-A-11-330008 JP-A-2001-7058

Proximity sensors deteriorate during repeated operation of processing equipment and eventually fail to perform to the required level of functionality. In addition, the proximity sensor may fail or may be in a state where it cannot operate normally due to deposits. In these cases, since the proximity sensor cannot properly detect the presence or absence of the frame unit, the processing apparatus cannot continue normal operation and stops while processing the workpiece.

When the processing apparatus stops due to a problem with the proximity sensor, the problem can be resolved by replacing or cleaning the proximity sensor. However, since the processing apparatus must be stopped until the work is completed, there arises a problem that the processing efficiency of the workpiece in the processing apparatus decreases and the productivity deteriorates. For example, if it is possible to monitor the status of the proximity sensor and replace the proximity sensor in accordance with regular maintenance work of the processing equipment before a problem actually occurs, the processing equipment will not be able to operate during processing of the workpiece. never stop.

The present invention has been made in view of such problems, and its object is to monitor the state of the proximity sensor used for detecting the frame unit, so that the malfunction caused by the malfunction of the proximity sensor can be prevented. It is an object of the present invention to provide a processing apparatus and a method for detecting an abnormality of a proximity sensor that does not occur during processing of a workpiece.

According to one aspect of the present invention, an annular frame, a tape attached to the frame so as to close an opening of the frame, and a workpiece having the tape attached in the opening of the frame A cassette stage on which cassettes are mounted to store frame units arranged in a shelf shape, and a pair of frame guide rails extending in a direction away from the cassette stage. A temporary placement unit on which the frame unit is placed, and the frame unit is unloaded from the cassette placed on the cassette stage and temporarily placed on the temporary placement unit, or the frame is temporarily placed on the temporary placement unit. a loading/unloading unit that loads a unit into the cassette placed on the cassette stage; a chuck table that can hold the frame unit; and a chuck table that holds the frame unit temporarily placed on the temporary placement unit. a transport unit that transports or holds the frame unit and transports it to the temporary placement unit; a processing unit that processes the workpiece contained in the frame unit held by the chuck table; a control unit that controls the temporary placement unit, the temporary placement unit having a non-contact proximity sensor for detecting whether or not the frame unit is temporarily placed on the frame guide rail; The transport unit is supported by an elevating unit so that it can be lifted and lowered above the frame guide rail, and the control unit lowers the transport unit holding the frame unit by the elevating unit to move the frame guide rail. a distance specifying unit for specifying a detection distance of the proximity sensor and the frame unit at the time when the proximity sensor detects the frame unit when the frame unit is transported to the transport unit; a threshold storage unit for storing a judgment threshold set to a distance detectable by a proximity sensor; and a determination unit that determines that the proximity sensor is abnormal.

Preferably, the control unit further includes a notification unit, and the control unit further includes a warning section for causing the notification unit to issue a warning when the determination section determines that the proximity sensor is abnormal.

Preferably, the proximity sensor is a reflective photoelectric sensor that detects whether or not the frame unit is temporarily placed on the frame guide rail by irradiating the frame with light and detecting the light reflected by the frame. sensor.

According to another aspect of the present invention, there is provided an abnormality detection method for determining whether or not there is an abnormality in a proximity sensor in a processing apparatus, wherein the processing apparatus includes an annular frame and an opening of the frame. a cassette stage on which a cassette is mounted, which stores frame units arranged in a shelf shape and includes a tape adhered to the frame and a workpiece to which the tape is adhered in the opening of the frame; a temporary placement unit having a pair of frame guide rails extending in a direction away from the cassette stage, the frame unit being placed on the frame guide rails; a loading/unloading unit for carrying out a frame unit and temporarily placing it on the temporary placement unit, or carrying the frame unit temporarily placed on the temporary placement unit into the cassette placed on the cassette stage; and the frame unit. a transport unit that holds the frame unit temporarily placed on the temporary placement unit and transports it to the chuck table, or holds the frame unit and transports it to the temporary placement unit; a machining unit for machining the workpiece contained in the frame unit held by the chuck table, wherein the temporary placement unit detects whether the frame unit is temporarily placed on the frame guide rails. a frame holding step for holding the frame in the transport unit, and a lowering step for lowering the transport unit from above the frame guide rail after the frame holding step; a detection distance specifying step of causing the proximity sensor to perform a detection operation of the frame during the descending step and specifying a distance of the frame from the proximity sensor when the proximity sensor detects the frame; a determination step of determining that the proximity sensor is abnormal when the distance of the frame from the proximity sensor when the frame is detected by the proximity sensor specified in the detection distance specifying step is shorter than a determination threshold; There is provided an anomaly detection method comprising:

In the processing apparatus and the abnormality detection method according to one aspect of the present invention, it is determined whether or not there is an abnormality in the proximity sensor of the temporary placement unit. When the sensitivity of the proximity sensor is lowered due to deterioration or the like, the distance at which the proximity sensor can detect the presence or absence of the frame of the frame unit is shortened. Therefore, by monitoring the distance at which the proximity sensor can detect frames, it is possible to determine the tendency of deterioration of the proximity sensor. Then, when the distance at which the proximity sensor detects the frame is below the determination threshold value, it is determined that the proximity sensor is abnormal.

In this case, it is possible to take action before the proximity sensor becomes unable to detect the frame of the frame unit placed on the temporary placement unit. For example, by cleaning or replacing the proximity sensor at the timing of maintenance or the like that is periodically performed in the processing device, it is possible to prevent the processing device from stopping functioning during processing of the workpiece due to malfunction of the proximity sensor.

Therefore, according to one aspect of the present invention, there is provided a processing apparatus in which the state of a proximity sensor used for detecting a frame unit is monitored so that a malfunction of the proximity sensor does not cause a malfunction during processing of the workpiece. and a proximity sensor abnormality detection method is provided.

4 is a perspective view schematically showing a frame unit; FIG. It is a perspective view which shows a processing apparatus typically. FIG. 3 is a perspective view schematically showing a temporary placement unit, a cassette, and a loading/unloading unit; 4 is a perspective view schematically showing a frame unit transported by a transport unit; FIG. FIG. 5A is a cross-sectional view schematically showing the frame unit temporarily placed on the temporary placement unit, and FIG. 5B is a cross-sectional view schematically showing the lowering step. 4 is a flow chart showing the flow of each step of a proximity sensor abnormality detection method.

Embodiments of the present invention will be described with reference to the accompanying drawings. A processing apparatus according to this embodiment processes a workpiece such as a semiconductor wafer. First, an object to be processed by the processing apparatus will be described. FIG. 1 is a perspective view schematically showing the frame unit 11. FIG. The frame unit 11 contains the workpiece 1 .

The workpiece 1 is, for example, a substantially disk-shaped wafer made of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductors. be. Alternatively, the workpiece 1 is a substrate or the like made of a material such as sapphire, glass, or quartz. Moreover, the workpiece 1 may be a package substrate or the like including a plurality of device chips sealed with mold resin or the like.

The surface 1a of the workpiece 1 is partitioned, for example, by a plurality of dividing lines 3 called streets that intersect each other. Devices 5 such as ICs (Integrated Circuits) and LSIs (Large-Scale Integrated Circuits) are formed in respective regions of the surface 1a of the workpiece 1 partitioned by the dividing lines 3 . By dividing the workpiece 1 along the dividing lines 3, individual device chips can be formed.

However, the workpiece 1 to be processed by the processing apparatus according to this embodiment is not limited to this, and the device may not be formed on the surface 1a. A case where a plurality of devices 5 are formed and the wafer to be divided along the planned division lines 3 is the workpiece 1 will be described below as an example.

Before the workpiece 1 is carried into the processing apparatus, as shown in FIG. and the frame unit 11 is formed. The frame 9 is made of a metal material such as aluminum or stainless steel, and the diameter of the opening 9 a is larger than the diameter of the workpiece 1 . The tape 7 has a base layer and an adhesive layer provided on the base layer, and is also called a dicing tape.

The frame unit 11 is formed by adhering the back surface 1b side of the workpiece 1 to the tape 7 exposed in the opening 9a of the frame 9. As shown in FIG. At this time, the surface 1a side of the workpiece 1 is exposed upward. The workpiece 1 adhered to the tape 7 and mounted on the frame 9 via the tape 7 is carried into the processing apparatus in this state and processed. When dividing the workpiece 1 by the processing device, the individual chips formed are supported by the tape 7 . Forming the frame unit 11 facilitates handling of the workpiece 1 and chips.

When the frame unit 11 containing the workpiece 1 divided into individual chips is taken out of the processing apparatus and the tape 7 is expanded radially outward inside the opening 9a of the frame 9, the intervals between the individual chips are increased. It spreads out, making it easier to pick up the chips. Each component of the processing apparatus is configured to handle the frame unit 11 and processes the workpiece 1 which is a part of the frame unit 11 .

Next, the configuration of the processing apparatus according to this embodiment will be described. The processing device 2 according to this embodiment is a processing device such as a cutting device that cuts the workpiece 1 in the state of the frame unit 11 or a laser processing device that laser-machines the workpiece 1 . Hereinafter, the processing apparatus according to the present embodiment will be described by taking the case where the processing apparatus according to the present embodiment is a cutting apparatus as an example.

FIG. 2 is a perspective view schematically showing the processing device (cutting device) 2. As shown in FIG. A cassette stage 6 on which a cassette 6a containing a plurality of frame units 11 is mounted is provided at a corner of the base 4 of the processing apparatus 2. As shown in FIG. The cassette stage 6 can be raised and lowered in the vertical direction (Z-axis direction).

In FIG. 2, the outline of the cassette 6a placed on the cassette stage 6 is indicated by a chain double-dashed line. FIG. 3 also includes a perspective view schematically showing the cassette 6a. The cassette 6a is a box-shaped housing case with a housing space inside. A plurality of frame units 11 are accommodated in the cassette 6a. The frame unit 11 is carried into and out of the processing apparatus 2 while being accommodated in the cassette 6a.

A plurality of storage rails 6d extending horizontally from the loading/unloading port 6c of the cassette 6a are provided on the inner surfaces of both side walls 6b of the cassette 6a. On both side walls 6b of the cassette 6a, storage rails 6d are formed at the same corresponding height. When the ends of the frame 9 of the frame unit 11 are placed on a pair of storage rails 6d of the same height, the frame unit 11 can be stored in the cassette 6a. Then, the frame unit 11 is loaded/unloaded through the loading/unloading port 6c.

At a position adjacent to the cassette stage 6 on the upper surface of the base 4, a temporary placement unit 10 is provided on which the frame unit 11 pulled out from the cassette 6a is temporarily placed. The temporary placement unit 10 has a pair of frame guide rails 8 extending away from the cassette stage 6 (Y-axis direction), and the frame unit 11 is placed on the pair of frame guide rails 8 .

Each of the pair of frame guide rails 8 has a substantially L-shaped cross section. The upper surface of the frame guide rail 8 serves as a mounting surface 8a on which the frame 9 of the frame unit 11 is mounted. Each frame guide rail 8 has a standing portion 8b on the outer side in the direction (X-axis direction) perpendicular to the extending direction.

The frame guide rails 8 are moved toward and away from each other while being parallel to the Y-axis direction. The frame unit 11 is placed on the mounting surfaces 8a of the frame guide rails 8, and the pair of frame guide rails 8 are moved toward each other so that the frame 9 is sandwiched between the standing portions 8b of the frame guide rails 8. You can adjust the position.

At a position adjacent to the temporary placement unit 10 on the upper surface of the base 4, a loading/unloading unit 12 for loading/unloading the frame unit 11 housed in the cassette 6a placed on the cassette stage 6 from the cassette 6a is provided. The loading/unloading unit 12 includes a body portion 12a movable along the Y-axis direction, and a grip portion 12b provided on a surface of the body portion 12a facing the cassette stage 6. As shown in FIG.

The loading/unloading unit 12 can move the frame unit 11 between the cassette 6a and the temporary placement unit 10 by moving the body part 12a while gripping the frame 9 of the frame unit 11 with the grip part 12b.

For example, the body portion 12a is moved closer to the cassette 6a, and the frame unit 11 accommodated in the cassette 6a placed on the cassette stage 6 is gripped by the grip portion 12b. By moving the body portion 12a away from the cassette 6a, the loading/unloading unit 12 can unload the frame unit 11 from the cassette 6a and temporarily place it on the temporary placement unit 10. FIG.

Further, for example, the frame unit 11 is placed on the cassette stage 6 by gripping the frame 9 of the frame unit 11 temporarily placed on the temporary placement unit 10 with the grip part 12b and moving the main body part 12a toward the cassette 6a. can be carried into the placed cassette 6a. The height of the cassette 6a is adjusted in advance by raising and lowering the cassette stage 6 so that the height of the housing rail 6d to which the frame unit 11 is loaded/unloaded matches the height of the loading/unloading unit 12. .

At a position adjacent to the cassette stage 6 on the upper surface of the base 4, an opening 4a elongated in the X-axis direction (front-rear direction, processing feed direction) is formed. In the opening 4a, a ball screw type X-axis moving mechanism (processing feed unit) (not shown) and a bellows-shaped dust and drip-proof cover 26 covering the upper part of the X-axis moving mechanism are arranged.

The X-axis moving mechanism is connected to the lower part of the X-axis moving table 16 and has a function of moving this X-axis moving table 16 in the X-axis direction. For example, the X-axis moving table 16 moves between a loading/unloading area close to the cassette stage 6 and a processing area below a processing unit 32, which will be described later.

A table base 18 and a chuck table 20 mounted on the table base 18 are provided on the X-axis moving table 16 . The chuck table 20 has the function of holding the frame unit 11 while the workpiece 1 contained in the frame unit 11 is processed.

A porous plate (not shown) is provided above the chuck table 20 , and one end of a suction path (not shown) formed in the chuck table 20 is connected to the porous plate. A suction source (not shown) is connected to the other end of the suction path. Operating the suction source creates a negative pressure on the surface of the porous plate. Thereby, the surface of the porous plate functions as a holding surface 22 that holds the workpiece 1 by suction through the tape 7 .

A rotation drive mechanism (not shown) is provided below the chuck table 20 to rotate the chuck table 20 around a predetermined rotation axis. A clamp 24 for holding the frame 9 is provided on the radially outer side of the chuck table 20 . The chuck table 20 is moved in the X-axis direction by the X-axis moving mechanism described above.

The frame unit 11 is transported from the temporary placement unit 10 to the chuck table 20 by a first transport unit 14 provided on the upper surface of the base 4 adjacent to the temporary placement unit 10 and the opening 4a. That is, the first transport unit 14 has a function of holding the frame unit 11 temporarily placed on the temporary placement unit 10 and transporting it to the chuck table 20 . Further, the first transport unit 14 has a function of holding the frame unit 11 placed on the chuck table 20 and transporting it to the temporary placement unit 10 .

As shown in FIG. 4, the first transport unit 14 includes a vertically movable and rotatable shaft portion 14a protruding upward from the upper surface of the base 4, and an arm horizontally extending from the upper end of the shaft portion 14a. It has a portion 14b and a holding portion 14c provided below the tip of the arm portion 14b. Inside the base 4, a transport driving source 14d is accommodated that also functions as an elevating unit that raises and lowers the shaft portion 14a and a rotation unit that rotates the shaft portion 14a. A lower end of the holding portion 14c is connected to a suction mechanism (not shown), and the holding portion 14c has a function of sucking and holding the frame 9 from above.

When the transport drive source 14d is operated to rotate the shaft portion 14a, the holding portion 14c moves between above the frame guide rail 8 of the temporary placement unit 10 and above the chuck table 20 positioned in the carry-in/out area. can move. Further, when the transport driving source 14d is operated to raise and lower the shaft portion 14a, the holding portion 14c can be raised and lowered. In other words, the first transport unit 14 is supported by a transport driving source 14d functioning as an elevating unit so that it can move up and down above the frame guide rails 8 and above the chuck table 20. FIG.

When the first transport unit 14 transports the frame unit 11 from the temporary placement unit 10 to the chuck table 20, the X-axis moving table 16 is moved to position the chuck table 20 in the loading/unloading area. Then, the transport driving source 14d is operated to rotate the shaft portion 14a, the holding portion 14c is moved above the frame unit 11 temporarily placed on the temporary placement unit 10, and the shaft portion 14a is lowered to move the holding portion 14c. is brought into contact with the frame 9.

Next, the suction mechanism connected to the holding portion 14c is operated to suck and hold the frame unit 11 (frame 9) from above. Thereafter, when the transport driving source 14d is operated again to raise the shaft portion 14a, the frame unit 11 sucked and held by the holding portion 14c is lifted. Then, the shaft portion 14 a is rotated to move the frame unit 11 above the chuck table 20 , and the shaft portion 14 a is lowered to place the frame unit 11 on the chuck table 20 .

The clamp 24 fixes the frame 9 and the chuck table 20 sucks and holds the workpiece 1 via the tape 7 of the frame unit 11 . Then, the suction holding of the frame 9 by the holding portion 14c is released, and the holding portion 14c is moved. Thus, the frame unit 11 pulled out from the cassette 6a, temporarily placed in the temporary placement unit 10, and adjusted in position is transported to the chuck table 20 capable of holding the frame unit 11. FIG.

The processing apparatus 2 includes a support structure 28 arranged above the moving path of the X-axis moving table 16 from the loading/unloading area to the processing area so as to cross the opening 4a. An imaging unit 30 facing downward is provided on the support structure 28 . The imaging unit 30 includes an imaging element such as a CMOS sensor or a CCD sensor, for example, and images the workpiece 1 included in the frame unit 11 from above, and divides the planned dividing line 3 set on the surface 1a of the workpiece 1. Detect the position and orientation of

A machining unit (cutting unit) 32 for machining (cutting) the workpiece 1 of the frame unit 11 held by the chuck table 20 is provided in the machining area where the machining (cutting) of the workpiece 1 is performed. there is A case where the processing unit 32 is a cutting unit that cuts the workpiece 1 will be described below as an example, but the processing unit 32 is not limited to this.

A machining unit 32 for cutting the workpiece 1 includes a cutting blade 34 having an annular cutting edge on its outer periphery, and a cutting blade 34 attached to its tip end along the Y-axis direction serving as the rotation axis of the cutting blade 34. a spindle 36;

A rotary drive source (not shown) such as a motor is connected to the base end of the spindle 36, and the cutting blade 34 attached to one end of the spindle 36 is rotated by the force generated by this rotary drive source. The cutting blade 34 includes an annular base made of aluminum or the like, and an annular cutting edge fixed to the outer periphery of the base. The cutting edge is formed by, for example, fixing abrasive grains such as diamond with a binding material such as resin or metal.

The processing apparatus 2 also includes an indexing feed unit (not shown) inside the support structure 28 for moving the processing unit 32 along the indexing direction (Y-axis direction) perpendicular to the processing direction (X-axis direction). . When the machining feed unit and the indexing feed unit are operated, the chuck table 20 for sucking and holding the workpiece 1 and the machining unit 32 can be moved relative to each other.

When the cutting blade 34 is rotated to cut into the workpiece 1 along the dividing line 3, the workpiece 1 is cut to form a dividing groove. When the workpiece 1 is cut along all the dividing lines 3, the workpiece 1 is divided to form individual device chips. After that, the chuck table 20 is moved to the loading/unloading area by the X-axis movement mechanism.

An opening 4b is formed at a position adjacent to the temporary placement unit 10 and the opening 4a on the upper surface of the base 4, and a cleaning unit 38 for cleaning the frame unit 11 after processing is accommodated in the opening 4b. The cleaning unit 38 has a spinner table that holds the frame unit 11 .

The processing apparatus 2 includes a second transport unit 40 that transports the frame unit 11 from the chuck table 20 positioned in the loading/unloading area to the cleaning unit 38 . The second transport unit 40 has an arm movable along the Y-axis direction and a holding section provided below the tip of the arm.

When the second transport unit 40 transports the frame unit 11 from the chuck table 20 to the cleaning unit 38, the frame unit 11 is first held by the holding portion. Then, the arm is moved along the Y-axis direction to place the frame unit 11 on the spinner table of the cleaning unit 38 . After that, the frame unit 11 is held by the spinner table and the workpiece 1 is washed.

When cleaning the workpiece 1 with the cleaning unit 38, a cleaning fluid (typically, a mixed fluid of water and air) is directed toward the surface of the workpiece 1 while rotating the spinner table. to inject. By stopping the supply of the cleaning fluid while the spinner table continues to rotate, the frame unit 11 can be dried. The frame unit 11 cleaned by the cleaning unit 38 is transferred from the cleaning unit 38 to the temporary placement unit 10 by the first transport unit 14 .

That is, the first transport unit 14 operates the transport driving source 14d to bring the holding portion 14c into contact with the frame 9 of the frame unit 11 placed on the spinner table of the cleaning unit 38, and the holding portion 14c sucks and holds the frame unit 11. do. Then, the transport drive source 14 d is operated to transport the frame unit 11 to the temporary placement unit 10 . After that, the suction holding of the frame 9 by the holding portion 14c is released. Then, the frame unit 11 is temporarily placed on the temporary placement unit 10 .

The frame unit 11 returned to the temporary placement unit 10 and temporarily placed thereon is carried into the cassette 6 a placed on the cassette stage 6 by the loading/unloading unit 12 . As described above, in the processing device 2 , the frame unit 11 accommodated in the cassette 6 a and carried into the processing device 2 is pulled out from the cassette 6 a and transferred to the chuck table 20 . After the workpiece 1 is processed by the processing unit 32 and cleaned by the cleaning unit 38, the frame unit 11 is returned to the cassette 6a.

The processing device 2 comprises a control unit 42 . The control unit 42 is connected to each component of the processing device 2 and has a function of controlling each component. The control unit 42 is configured by a computer including, for example, a processing device such as a CPU (Central Processing Unit), a main storage device such as a DRAM (Dynamic Random Access Memory), and an auxiliary storage device such as a flash memory. . The functions of the control unit 42 are realized by operating the processing device and the like according to the software stored in the auxiliary storage device.

Machining conditions for machining the workpiece 1 are input and registered in advance in the control unit 42 . The control unit 42 then controls each component according to the processing conditions. Processing conditions are appropriately set according to the type of workpiece and the desired processing result. The control unit 42 refers to the information sent from each component and controls each component to process the workpiece 1 according to a predetermined procedure.

Here, the temporary placement unit 10 has a non-contact proximity sensor 8d for detecting whether or not the frame unit 11 (frame 9) is temporarily placed on the frame guide rail 8, as shown in FIG.

5A is a cross-sectional view schematically showing the frame unit 11 temporarily placed on the temporary placement unit 10. FIG. 5A schematically shows the frame guide rail 8 on one side of the temporary placement unit 10. FIG. A side view showing is included. Further, FIG. 5A shows a through hole 8c formed in the frame guide rail 8 and a proximity sensor for detecting the frame unit 11 (frame 9) placed on the mounting surface 8a of the frame guide rail 8 through the through hole 8c. 8d and are indicated by dashed lines.

The proximity sensor 8d is, for example, a reflective sensor that detects whether or not the frame unit 11 is temporarily placed on the frame guide rail 8 by irradiating the frame 9 of the frame unit 11 with light and detecting the light reflected by the frame 9. It is a photoelectric sensor. The proximity sensor 8d includes a light projecting portion (not shown) that emits light toward the frame 9 of the frame unit 11 and a light receiving portion (not shown) that receives light reflected by the frame 9 of the frame unit 11. have.

Preferably, the proximity sensor 8d is a limited reflection photoelectric sensor. In the limited reflection type photoelectric sensor, the light emitting portion emits light at a predetermined angle and the light receiving portion receives light at a predetermined angle. The frame 9 is easily detected by the proximity sensor 8d when positioned at a distance. The proximity sensor 8d is fixed at a position where the frame unit 11 (frame 9) placed on the mounting surface 8a of the frame guide rail 8 can be easily detected.

The proximity sensor 8d detects the frame unit 11 when the frame unit 11 (frame 9) approaches to a predetermined distance, and stops detecting the frame unit 11 when the frame unit 11 is separated from the predetermined distance. The proximity sensor 8 d is connected to the control unit 42 and continues to send electrical signals to the control unit 42 indicating the detection status of the frame unit 11 . The control unit 42 refers to information regarding whether or not the proximity sensor 8d detects the frame unit 11, controls each component, and carries out the work of transporting the frame unit 11 and the like.

Here, the proximity sensor 8d can detect the frame unit 11 (frame 9) which is relatively far away at the beginning of use. That is, the detection limit distance of unused proximity sensor 8d is relatively long. Then, the proximity sensor 8d is deteriorated while the processing apparatus 2 is repeatedly operated, and the detection limit distance of the frame 9 is gradually shortened. Ultimately, even if the frame unit 11 (frame 9) is placed on the mounting surface 8a of the frame guide rail 8, the proximity sensor 8d cannot detect the frame unit 11. FIG.

In addition, the proximity sensor 8d may malfunction and stop functioning during use. In addition, water droplets, processing dust, etc. adhere to the light-emitting portion and the light-receiving portion, and the proximity sensor 8d continues to erroneously detect the frame unit 11 even when the frame unit 11 (frame 9) is not placed on the frame guide rail 8. In these cases, since the proximity sensor 8d cannot properly detect the presence or absence of the frame unit 11, the processing apparatus 2 cannot continue normal operation while processing the workpiece 1, and stops.

When the processing apparatus 2 stops due to a malfunction of the proximity sensor 8d, the malfunction can be resolved by replacing the proximity sensor 8d with a new one or cleaning the proximity sensor 8d using an air gun or the like. However, since the processing device 2 must be stopped until the work is completed, there arises a new problem that the processing efficiency of the workpiece 1 in the processing device 2 decreases and the productivity deteriorates.

Therefore, the processing apparatus 2 according to the present embodiment monitors the state of the proximity sensor 8d used for detecting the frame unit 11, so that the malfunction caused by the malfunction of the proximity sensor 8d can be detected during the processing of the workpiece 1. to prevent it from occurring. For example, an abnormality of the proximity sensor 8d is detected before the proximity sensor 8d malfunctions, and the proximity sensor 8d is replaced during regular maintenance work of the processing apparatus 2. FIG. In this case, the operation of the processing apparatus 2 does not have to be stopped due to the malfunction of the proximity sensor 8d during processing of the workpiece 1, and the processing efficiency is not lowered.

The description of the processing apparatus 2 will be continued below, focusing on the configuration related to monitoring of the state of the proximity sensor 8d. Monitoring of the state of the proximity sensor 8 d is mainly implemented by the function of the control unit 42 . FIG. 2 shows a block diagram of a configuration that contributes to monitoring the state of the proximity sensor 8d of the control unit 42. As shown in FIG.

The control unit 42 includes a distance specifying section 42b that specifies the detection distance of the proximity sensor 8d and the frame unit 11 when the proximity sensor 8d detects the frame unit 11 (frame 9). The distance identifying section 42b can identify the height of the frame unit 11 held by the holding section 14c of the first conveying unit 14 from the operation status of the conveying drive source 14d that functions as an elevating unit.

FIG. 5B is a cross-sectional view schematically showing the frame unit 11 transported to the frame guide rails 8 by the first transport unit 14. As shown in FIG. For example, the proximity sensor 8d detects the frame unit 11 when the first transport unit 14 holding the frame unit 11 is lowered by the transport drive source 14d functioning as an elevating unit to transport the frame unit 11 to the frame guide rail 8. detect.

Then, the distance specifying unit 42b specifies the detection distance of the proximity sensor 8d and the frame unit 11 when the proximity sensor 8d detects the frame unit 11. FIG. In FIG. 5B, the detection distance 8f when the proximity sensor 8d detects the frame unit 11 is schematically indicated by an arrow. The distance specifying unit 42b specifies this detection distance 8f.

The control unit 42 uses this detection distance 8f to determine whether or not the proximity sensor 8d is abnormal. That is, the detection distance 8f is set with a determination threshold value for determining whether or not the proximity sensor 8d is abnormal. In FIG. 5B, the determination threshold value 8e is schematically indicated by a dashed arrow.

The control unit 42 has a threshold storage section 42a that stores a determination threshold 8e set at a distance at which the proximity sensor 8d can detect the frame unit 11 (frame 9) held by the first transport unit 14. FIG. The control unit 42 has a determination section 42c that determines that the proximity sensor 8d is abnormal when the detection distance 8f specified by the distance specifying section 42b is shorter than the determination threshold value 8e stored in the threshold storage section 42a. .

For example, the mounting surface 8a of the frame guide rail 8 is set at a position about 3 mm higher than the proximity sensor 8d. Therefore, when the detection distance 8f of the proximity sensor 8d becomes shorter than 3 mm, the proximity sensor 8d cannot detect the frame unit 11 even if the frame unit 11 is placed on the frame guide rail 8. FIG.

For example, the detection distance 8f of the unused proximity sensor 8d is about 11 mm. That is, the proximity sensor 8d immediately after the start of use approaches the frame unit 11 held by the holding portion 14c of the first transport unit 14 to a height position approximately 8 mm above the mounting surface 8a of the frame guide rail 8. The frame unit 11 (frame 9) is detected when the

In this case, for example, the determination threshold value 8e set to the distance detectable by the proximity sensor 8d may be 7 mm. That is, the determination unit 42c may determine that the proximity sensor 8d is abnormal when the detection distance 8f specified by the distance specifying unit 42b is below 7 mm, which is the determination threshold value 8e. In other words, when the proximity sensor 8d does not detect the frame unit 11 even when the frame unit 11 approaches the mounting surface 8a by a distance of 4 mm, the determination unit 42c determines that the proximity sensor 8d is abnormal.

When it is determined that the proximity sensor 8d is abnormal, cleaning or replacement of the proximity sensor 8d is carried out during the first maintenance operation performed on the processing apparatus 2 after that, so that the workpiece 1 can be processed during processing. It is possible to prevent the processing device 2 from stopping due to malfunction of the proximity sensor 8d. Therefore, the working time of the processing device 2 does not decrease, and the processing efficiency of the workpiece 1 in the processing device 2 is maintained.

The processing apparatus 2 may have a notification unit (not shown) that notifies various warnings to the user or administrator. A warning unit 42d that causes the notification unit to issue a warning when determined may be further provided.

For example, the notification unit is a display with a touch panel which is provided on the exterior of the processing apparatus 2 and which can display various information and is used for inputting various commands. Alternatively, the notification unit may be an alarm lamp provided on the exterior of the processing apparatus 2 or a speaker capable of emitting an alarm sound. However, the notification unit is not limited to this.

When the determination unit 42c determines that the proximity sensor 8d is abnormal, the warning unit 42d displays warning information on, for example, a display with a touch panel that functions as a notification unit. Alternatively, the warning unit 42d lights the alarm lamp functioning as the notification unit to notify the abnormality. Alternatively, the warning unit 42d causes a speaker functioning as a notification unit to emit a warning sound.

Then, when the user or manager of the processing device 2 receives the warning from the notification unit, prepare to replace or clean the proximity sensor 8d during the next maintenance performed on the processing device 2. . By performing predetermined measures during maintenance, it is possible to prevent the processing device 2 from stopping due to malfunction of the proximity sensor 8d.

Finally, the procedure of the abnormality detection method for determining whether or not the proximity sensor 8d is abnormal in the processing device 2 is summarized. FIG. 6 is a flow chart showing the flow of each step of an abnormality detection method for determining whether or not the proximity sensor 8d in the processing device 2 is abnormal.

First, a frame holding step S10 is performed to hold the frame 9 in the transport unit (first transport unit 14). For example, the frame 9 of the frame unit 11 placed on the chuck table 20 is held by the holding portion 14 c of the first transport unit 14 . Alternatively, the frame 9 of the frame unit 11 placed on the frame guide rail 8 is held by the holding portion 14 c of the first transport unit 14 .

After the frame holding step S10, a lowering step S20 is performed in which the transport drive source 14d functioning as the lifting unit is operated to lower the transport unit (first transport unit 14) from above the frame guide rails 8. FIG. Further, during the descent step S20, a detection distance specifying step S30 is performed to specify the distance of the frame 9 from the proximity sensor 8d when the proximity sensor 8d detects the frame 9 by causing the proximity sensor 8d to perform the detection operation of the frame 9. implement.

FIG. 5B is a cross-sectional view schematically showing the descending step S20 and the detection distance specifying step S30. For example, the detection operation of the proximity sensor 8d is performed while the frame unit 11 is lowered from above the frame guide rail 8 at a speed of about 0.5 mm per second. Then, the distance of the frame 9 from the proximity sensor 8d when the proximity sensor 8d detects the frame 9 of the frame unit 11 is specified.

Next, a determination step S40 is performed to determine whether or not there is an abnormality in the proximity sensor 8d based on the distance from the proximity sensor 8d of the frame 9 when the proximity sensor 8d detects the frame 9 specified in the detection distance specifying step S30. do. If the distance of the frame 9 from the proximity sensor 8d is shorter than the determination threshold, it is determined that the proximity sensor 8d is abnormal. On the other hand, when the distance of the frame 9 from the proximity sensor 8d is equal to or greater than the determination threshold, it is determined that the proximity sensor 8d is normal.

Then, when it is determined in the determination step S40 that the proximity sensor 8d is abnormal, a warning step S50 in which the notification unit provided in the processing device 2 notifies the determination result is preferably performed. In this case, the user or administrator of the processing apparatus 2 can know that the proximity sensor 8d has an abnormality, so that countermeasures can be considered and the problem can be dealt with before the proximity sensor 8d malfunctions.

It should be noted that the present invention is not limited to the description of the above embodiments, and can be implemented with various modifications. For example, in the above embodiment, the case where the frame unit 11 held by the holding portion 14c of the first transport unit 14 is gradually lowered to specify the detection distance of the proximity sensor 8d has been described. However, one aspect of the present invention is not limited to this.

That is, in the processing apparatus and proximity sensor abnormality detection method according to one aspect of the present invention, the frame unit 11 is held by the second transport unit 40 instead of the first transport unit 14 as a transport unit, and the proximity sensor 8d is operated. A detection distance may be specified. In other words, there is no limit to the transport unit that holds the frame unit 11 .

In the above embodiment, the frame unit 11 is lowered onto the frame guide rails 8 from above to specify the detection distance at which the proximity sensor 8d detects the frame 9, but one aspect of the present invention is not limited to this. For example, when the frame unit 11 placed on the frame guide rail 8 is lifted by being held by the holding portion 14c of the first transport unit 14, the distance at which the proximity sensor 8d no longer detects the frame 9 is specified as the detection distance. may be

Furthermore, in the above-described embodiment, when the determination unit 42c determines that the proximity sensor 8d has an abnormality, the processing device 2 cleans or cleans the proximity sensor 8d when the operation of the processing device 2 is stopped for the next maintenance work. A case of performing exchange has been described. However, one aspect of the present invention is not limited to this.

That is, measures such as replacement of the proximity sensor 8d need not be performed during maintenance performed immediately after the abnormality of the proximity sensor 8d is detected. For example, the use of the proximity sensor 8d may be continued for a period during which the control unit 42 evaluates the progress tendency of the abnormal state and determines that the proximity sensor 8d can withstand use.

In the above embodiment, the temporary placement unit 10 includes one proximity sensor 8d, but one aspect of the present invention is not limited to this. That is, the temporary placement unit 10 may include two or more proximity sensors 8d. Then, each proximity sensor 8d may be individually determined whether or not there is an abnormality.

Furthermore, in the above embodiment, when determining whether or not the proximity sensor 8d is abnormal, the case where the frame unit 11 is held by the first transport unit 14 and the proximity sensor 8d detects the frame unit 11 has been described. . A case where the frame unit 11 is housed in the cassette 6a and transported, and the workpiece 1 contained in the frame unit 11 is processed by the processing unit 32 has been described. However, one aspect of the present invention is not limited to this.

After the processing of the workpiece 1 is completed, the frame unit 11 is accommodated in the cassette 6a and unloaded from the processing apparatus 2. As shown in FIG. Then, the workpiece 1 after processing is separated from the tape 7, and the frame unit 11 is dismantled. Here, the frame 9 included in the frame unit 11 can be reused for processing a new workpiece 1, and is used to form a new frame unit 11 after a predetermined cleaning operation. .

However, the frame 9 may have fine scratches on its surface, or may be slightly twisted or distorted during repeated use. Also, while the frame unit 11 is being formed and the workpiece 1 is being processed, the frame 9 may become dirty. Furthermore, when the frame 9 is reused, the dirt adhering to the frame 9 may not be completely removed. Therefore, when trying to detect the frame 9 included in the frame unit 11 with the proximity sensor 8d, each frame 9 does not necessarily reflect the light received from the proximity sensor 8d in the same way.

Therefore, the detection distance of the proximity sensor 8d varies depending on the state of the frame 9 to be detected. Therefore, in order to more stably and accurately determine whether or not the proximity sensor 8d is abnormal, in one aspect of the present invention, it is used only for the purpose of determining whether or not the proximity sensor 8d is abnormal. A decision frame may be prepared and used.

In this case, the judgment frame may be stored in the cassette 6 a and carried into the processing apparatus 2 . Alternatively, the judgment frame may be stored near the processing device 2, and the user or administrator of the processing device 2 may cause the holding portion 14c of the first transport unit 14 to hold the judgment frame as necessary. For example, if the frame for determination is stored near the processing device 2, the proximity sensor 8d using the frame for determination can be detected using a short idle time when the processing device 2 is not processing the workpiece 1. Abnormality can be determined.

Here, the judgment frame may be integrated with the workpiece and the tape, or a judgment frame unit may be formed. Alternatively, the judgment frame may be used without being integrated with the workpiece 1 and the tape 7 .

When the determination frame is used to determine whether or not the proximity sensor 8d is abnormal, the detection distance of the proximity sensor 8d does not change due to the state of the frame 9, and the determination result of the determination section 42c of the control unit 42 is determined by the frame. It does not depend on the state of 9. Therefore, the reliability of the determination result of the determination unit 42c is increased, and the proximity sensor 8d determined to be normal can be reliably used continuously. Further, it is possible to formulate a plan for cleaning and replacing the proximity sensor 8d more precisely.

In addition, the structures, methods, and the like according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention.

REFERENCE SIGNS LIST 1 workpiece 1a front surface 1b back surface 3 division line 5 device 7 tape 9 frame 9a opening 11 frame unit 2 processing device 4 base 4a, 4b opening 6 cassette stage 6a cassette 6b side wall 6c loading/unloading port 6d housing rail 8 frame guide Rail 8a Mounting surface 8b Standing part 8c Through hole 8d Proximity sensor 8e Determination threshold 8f Detection distance 10 Temporary placement unit 12 Loading/unloading unit 12a Body part 12b Grip part 14 First transport unit 14a Shaft part 14b Arm part 14c Holding part 14d Transfer drive source 16 X-axis movement table 18 Table base 20 Chuck table 22 Holding surface 24 Clamp 26 Dust and drip proof cover 28 Support structure 30 Imaging unit 32 Processing unit 34 Cutting blade 36 Spindle 38 Cleaning unit 40 Second transfer unit 42 Control Unit 42a Threshold storage unit 42b Distance specifying unit 42c Judging unit 42d Warning unit

Claims (4)

A frame unit including an annular frame, a tape attached to the frame so as to close an opening of the frame, and a workpiece to which the tape is attached in the opening of the frame are arranged side by side. a cassette stage on which cassettes stored in a shelf shape are mounted;
a temporary placement unit having a pair of frame guide rails extending in a direction away from the cassette stage, and on which the frame unit is placed on the frame guide rails;
The frame unit is unloaded from the cassette placed on the cassette stage and temporarily placed on the temporary placement unit, or the frame unit temporarily placed on the temporary placement unit is placed on the cassette stage. a loading/unloading unit for loading into the cassette;
a chuck table capable of holding the frame unit;
a transport unit that holds the frame unit temporarily placed on the temporary placement unit and carries it to the chuck table, or holds the frame unit and carries it to the temporary placement unit;
a machining unit for machining the workpiece included in the frame unit held by the chuck table;
A processing apparatus comprising a control unit that controls each component,
The temporary placement unit has a non-contact proximity sensor for detecting whether the frame unit is temporarily placed on the frame guide rail,
The transport unit is supported by a lifting unit so that it can be lifted above the frame guide rail,
The control unit is
When the transport unit holding the frame unit is lowered by the lifting unit to transport the frame unit onto the frame guide rail, the proximity sensor and the frame unit at the time when the proximity sensor detects the frame unit. a distance identifying unit that identifies a detection distance;
a threshold storage unit that stores a determination threshold set at a distance at which the proximity sensor can detect the frame unit held by the transport unit;
a determining unit that determines that the proximity sensor is abnormal when the detection distance specified by the distance specifying unit is shorter than the determination threshold stored in the threshold storage unit. Device. further equipped with a notification unit,
2. The processing apparatus according to claim 1, wherein the control unit further comprises a warning section that issues a warning to the notification unit when the determination section determines that the proximity sensor is abnormal. The proximity sensor is a reflective photoelectric sensor that detects whether or not the frame unit is temporarily placed on the frame guide rail by irradiating the frame with light and detecting the light reflected by the frame. 3. The processing apparatus according to claim 1 or 2, characterized by: An abnormality detection method for determining the presence or absence of an abnormality in a proximity sensor in a processing apparatus,
The processing device is
A frame unit including an annular frame, a tape attached to the frame so as to close an opening of the frame, and a workpiece to which the tape is attached in the opening of the frame are arranged side by side. a cassette stage on which cassettes stored in a shelf shape are mounted;
a temporary placement unit having a pair of frame guide rails extending in a direction away from the cassette stage, and on which the frame unit is placed on the frame guide rails;
The frame unit is unloaded from the cassette placed on the cassette stage and temporarily placed on the temporary placement unit, or the frame unit temporarily placed on the temporary placement unit is placed on the cassette stage. a loading/unloading unit for loading into the cassette;
a chuck table capable of holding the frame unit;
a transport unit that holds the frame unit temporarily placed on the temporary placement unit and carries it to the chuck table, or holds the frame unit and carries it to the temporary placement unit;
a machining unit for machining the workpiece included in the frame unit held by the chuck table;
The temporary placement unit has the non-contact proximity sensor for detecting whether or not the frame unit is temporarily placed on the frame guide rail,
a frame holding step for holding the frame in the transport unit;
a lowering step of lowering the transfer unit from above the frame guide rail after the frame holding step;
a detected distance identifying step of causing the proximity sensor to perform a detection operation of the frame during the descending step and identifying a distance of the frame from the proximity sensor when the proximity sensor detects the frame;
A determination step of determining that the proximity sensor is abnormal when the distance of the frame from the proximity sensor when the frame is detected by the proximity sensor specified in the detection distance specifying step is shorter than a determination threshold. and an anomaly detection method comprising:

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