WO2022190992A1

WO2022190992A1 - Laser radiation device, laser radiation method, and manufacturing method for organic el display

Info

Publication number: WO2022190992A1
Application number: PCT/JP2022/008873
Authority: WO
Inventors: 保小田嶋; 裕也高塚; 輝昭下地
Original assignee: Ｊｓｗアクティナシステム株式会社
Priority date: 2021-03-09
Filing date: 2022-03-02
Publication date: 2022-09-15
Also published as: TW202239511A; JP2022137390A; CN117015453A

Abstract

A laser radiation device (1) according to the present embodiment comprises: a light source (21) that generates laser light (L1); a holding unit (35) that holds a workpiece (100) to be irradiated by laser light; a holding unit (45) that holds a workpiece (200) to be irradiated by laser light; an X-axis mechanism (31) that conveys the holding unit (35) in the horizontal direction; an X-axis mechanism (41) that conveys the holding unit (45) in the horizontal direction; a Y-axis mechanism (32) that raises and lowers the workpiece (100); and a Y-axis mechanism (42) that raises and lowers the workpiece (200).

Description

Laser irradiation device, laser irradiation method, and organic EL display manufacturing method

The present invention relates to a laser irradiation device, a laser irradiation method, and an organic EL display manufacturing method.

Patent Document 1 discloses a laser peeling device. In this laser peeling apparatus, the substrate is irradiated with linear laser light. Then, the substrate is irradiated with laser light while the substrate is being transported. Thereby, the substrate and the release layer can be separated.

WO2018/25495

With such a laser irradiation device, it is desirable to perform an efficient and stable process. For example, when pulsed laser light is used as the laser light, it is preferable to stably drive the pulsed laser light source at a constant repetition frequency. However, once the pulse laser light source is turned off, the repetition frequency and output power may become unstable. Therefore, it is preferable to continuously irradiate without stopping the operation of the pulsed laser light source. However, if the pulsed laser beam is continuously output, useless shots of the pulsed laser beam will occur. For example, the pulsed laser beam is wasted from the end of irradiation of one workpiece until the start of irradiation of the next workpiece.

Other issues and novel features will become apparent from the description and accompanying drawings of this specification.

According to one embodiment, a laser irradiation device includes a laser oscillator that generates a laser beam, and a first holding unit and a second holding unit that respectively hold a first workpiece and a second workpiece to be irradiated with the laser beam. a holding unit, a first transport mechanism and a second transport mechanism for horizontally transporting the first holding unit and the second holding unit, respectively, the first holding unit and the second holding unit A first elevating mechanism and a second elevating mechanism for elevating each unit in a vertical direction orthogonal to the horizontal direction are provided.

According to one embodiment, the laser irradiation method includes: (a) conveying the first work horizontally while holding the first work by a first holding unit; irradiating a work with a laser beam; (b) moving down the first work irradiated with the laser beam, and then horizontally conveying the first work; and (c) a second holding (d) irradiating the second work with a laser beam by conveying the second work horizontally while the unit holds the second work; and a step of horizontally conveying the second work after lowering the second work.

According to one embodiment, a method for manufacturing an organic EL display comprises: (A) forming a release layer on a substrate; (B) forming an element on the release layer; and (D) laminating a film on the release layer, wherein (C) separating the substrate and the release layer is a step of irradiating the workpiece with a laser beam from above while the workpiece including the substrate and the peeling layer is being transported, and (Ca) a state in which the first holding unit holds the first workpiece. a step of irradiating the first work with a laser beam by conveying the first work in a horizontal direction; (Cc) conveying the second work horizontally while holding the second work by the second holding unit; (Cd) After the second work irradiated with the laser light is lowered, the second work is conveyed in the horizontal direction.

According to one embodiment, the laser irradiation apparatus includes a frame portion and a middle rail portion provided inside the frame portion, and includes a tray on which a substrate to be processed is placed and a groove corresponding to the middle rail portion. a holding unit that is inserted into an opening between the frame portion and the middle frame portion and that adsorbs the processing substrate while the tray and the processing substrate are separated from each other; and an irradiation optical system for irradiating a laser beam onto the processing substrate being transferred by the transfer mechanism.

According to the embodiment, an efficient and stable process can be performed.

It is a side view which shows typically the laser irradiation apparatus concerning embodiment. 1 is a plan view schematically showing a laser irradiation device according to an embodiment; FIG. 1 is a top view schematically showing a laser irradiation device according to an embodiment; FIG. It is a perspective view which shows the structure of a laser irradiation apparatus typically. It is a perspective view for demonstrating operation|movement of a laser irradiation apparatus. It is a perspective view for demonstrating operation|movement of a laser irradiation apparatus. It is a perspective view for demonstrating operation|movement of a laser irradiation apparatus. It is a perspective view for demonstrating operation|movement of a laser irradiation apparatus. It is a perspective view for demonstrating operation|movement of a laser irradiation apparatus. It is a perspective view for demonstrating operation|movement of a laser irradiation apparatus. It is a timing chart which shows operation|movement of a laser irradiation apparatus. 2 is an exploded view showing the configuration of a work; FIG. 4 is a cross-sectional view showing the configuration of a work; FIG. FIG. 4 is a cross-sectional view showing a state in which a workpiece is sucked in the holding unit; 3 is a cross-sectional view schematically showing an organic EL display device manufactured by the manufacturing process of the laser irradiation device 1; FIG. 3A to 3C are process cross-sectional views for explaining the manufacturing process of the laser irradiation device 1. FIG.

A laser irradiation apparatus according to the present embodiment is, for example, a laser peeling apparatus such as a laser lift-off (LLO) apparatus. The laser irradiation device performs a laser lift-off process on the work by irradiating the work having the peeling layer with laser light. In other words, the processing substrate and the separation layer can be separated by laser irradiation. A laser irradiation apparatus, method, and manufacturing method according to the present embodiment will be described below with reference to the drawings.

Embodiment 1.
A configuration of a laser irradiation apparatus according to the present embodiment will be described with reference to FIGS. 1 to 3. FIG. FIG. 1 is a side view schematically showing the configuration of a laser irradiation device 1. FIG. FIG. 2 is a top view schematically showing the configuration of the laser irradiation device 1. As shown in FIG. FIG. 3 is a YZ cross-sectional view schematically showing the configuration of the laser irradiation device 1. As shown in FIG.

It should be noted that the diagrams shown below show an XYZ three-dimensional orthogonal coordinate system as appropriate for simplification of explanation. The Y direction is the vertical up-down direction, and the X direction is the conveying direction of the

works

100 and 200 . The Z direction is the direction along the linear irradiation area 15 . That is, the Z direction is the longitudinal direction of the linear irradiation area 15, and the X direction is the lateral direction orthogonal to the longitudinal direction. The laser irradiation device 1 irradiates the work 100 with the laser light L2 while conveying the work 100 in the X direction. As a result, almost the entire workpiece 100 can be irradiated with the laser beam L2.

As shown in FIG. 1, the laser irradiation device 1 includes a chamber 10, a light source 21, and an irradiation optical system 20. As shown in FIGS. 2 and 3, the laser irradiation device 1 has two

drive mechanisms

30 and 40 inside the chamber 10 . The drive mechanism 30 drives the workpiece 100 and the drive mechanism 40 drives the workpiece 200 . The drive mechanism 30 moves the workpiece 100 in the X direction and the Y direction. The drive mechanism 40 moves the work 200 in the X direction and the Y direction. The driving mechanism 30 and the driving mechanism 40 are fixed on, for example, a mount (not shown in FIGS. 1 to 3).

The holding unit 35 holds the workpiece 100 . The drive mechanism 30 movably supports the holding unit 35 . The drive mechanism 30 moves the holding unit 35 to move the workpiece 100 . The holding unit 45 holds the workpiece 200 . The drive mechanism 40 movably supports the holding unit 45 . The workpiece 200 is moved by the driving mechanism 40 moving the holding unit 45 . The

workpieces

100 and 200 are larger than the holding

units

35 and 45 when viewed from above. That is, the workpiece 100 protrudes from the holding unit 35 in the X direction and the Z direction. The workpiece 100 protrudes from the holding unit 35 in the X direction and the Z direction.

The light source 21 is a laser oscillator that generates laser light L1. The light source 21 is a pulse laser light source. As the light source 21, an excimer laser with a wavelength of 308 nm or a solid-state laser with a wavelength of 343 nm can be used. Here, the light source 21 generates laser light L1 at a constant repetition frequency.

A laser beam L1 from the light source 21 is incident on the irradiation optical system 20 . The irradiation optical system 20 has an optical system that guides the laser beam L1 to the workpiece 100 . The workpiece 100 is irradiated with the laser beam L2 emitted from the irradiation optical system 20 . For example, the irradiation optical system 20 has a cylindrical lens (not shown) for forming the linear irradiation area 15 . The workpiece is irradiated with a line-shaped laser beam L2 (line beam) having a focal point extending in the Z direction.

Furthermore, the irradiation optical system 20 is provided with a shutter 22 . The shutter 22 is detachably arranged in the optical path of the laser beam L1. That is, the shutter 22 is removed from the optical path while the workpiece 100 or workpiece 200 is irradiated with the laser beam L2. Further, the shutter 22 is inserted into the optical path while the workpiece 100 or the workpiece 200 is not irradiated with the laser beam L2.

The irradiation optical system 20 is arranged on the +Y side of the chamber 10 . A transparent window 6 is provided on the upper wall of the chamber 10 . Laser light L2 is introduced into chamber 10 through window 6 . Then, the workpiece 100 at the irradiation height H1 is irradiated with the laser beam L2. The internal space of the chamber 10 may be filled with an inert gas such as nitrogen gas.

As shown in FIG. 1, a door valve 5 is attached to the side wall of the chamber 10 on the -X side. By opening the door valve 5, the internal space and the external space of the chamber 10 are connected, and the

workpieces

100 and 200 can be transferred. The −X side end in the chamber 10 serves as the loading position and unloading position for the

works

100 and 200 .

For example, a transfer robot 4 is arranged outside the chamber 10 . With the door valve 5 open, the transfer robot 4 transfers the

works

100 and 200 into the chamber 10 . With the door valve 5 open, the transfer robot 4 takes out the

workpieces

100 and 200 in the chamber 10 from the laser irradiation device 1 . The transfer robot 4 carries the unprocessed works 100 and 200 into the chamber 10 . Further, the transfer robot 4 unloads the

workpieces

100 and 200 after laser irradiation from the chamber 10 . When loading and unloading are completed, the door valve 5 is closed.

Specifically, the transfer robot 4 places the

works

100 and 200 on the holding

units

35 and 45 . Then, the laser irradiation device 1 irradiates the

works

100 and 200 with the laser light L2. After the irradiation process is completed, the transfer robot 4 takes out the

workpieces

100 and 200 from the holding

units

35 and 45 and transfers them to the external space of the chamber 10 . The holding

units

35 and 45 serve as stages for holding the

workpieces

100 and 200 by suction.

The distance between the hands of the transfer robot 4 is wider than the width of the holding

units

35 and 45 in the Z direction. Therefore, the transfer robot 4 contacts both ends of the

workpieces

100 and 200 in the Z direction. As a result, the transfer robot 4 can carry in and out the

workpieces

100 and 200 without interfering with the holding

units

35 and 45 .

Also, in the chamber 10, a static eliminator 8 is provided around the unloading position. For example, the

works

100 and 200 are carried out to the external space of the chamber 10 by passing under the static eliminator 8 . The static eliminator 8 is a static eliminator that irradiates the

workpieces

100 and 200 with X-rays or the like from above. The neutralizer 8 neutralizes the

workpieces

100 and 200 released from the holding

units

35 and 45 by static electricity. This makes it possible to prevent peeling electric resistance and the like. The static eliminator 8 is not limited to the X-ray static eliminator, and may be a corona discharge static eliminator (ionizer) or the like.

The work 100 and the work 200 are located at different positions in the Y direction. In other words, the work 100 is transported at a position higher than the work 200 . 1 and 3, the work 100 is at the irradiation height H1, and the work 200 is at the transfer height H2. The workpiece 100 loaded into the chamber 10 is transported at the irradiation height H1. At the irradiation height H1, the workpiece 100 is conveyed in the +X direction and is irradiated with the laser beam L2. The workpiece 200 irradiated with the laser beam L2 is lowered to the conveying height H2. At the transport height H2, the workpiece 200 is transported in the -X direction. As a result, the processed workpiece 200 moves to the carry-out position in front of the door valve 5 .

The positions of the work 100 and the work 200 match in the Z direction. A workpiece 100 is arranged above the workpiece 200 . That is, the

works

100 and 200 are driven such that the processed work 200 passes under the unprocessed work 100 . Specifically, the work 200 passes under the work 100 while the work 100 is being irradiated with the laser beam L2. This can prevent the processed workpiece 200 from being irradiated with the laser beam L2 while being conveyed in the -X direction.

The laser irradiation device 1 can accommodate two

works

100 and 200 at the same time. Then, the laser irradiation device 1 continuously applies the laser irradiation process to the two works 100 and 200 . During the processing of one of the works, transportation is performed such that the processed work is unloaded and a new work is loaded. As a result, the waiting time for loading and unloading can be shortened, so that the tact time can be shortened. Furthermore, since the

workpieces

100 and 200 can be continuously irradiated with laser light, useless pulsed laser light can be reduced. Therefore, it is possible to efficiently irradiate the pulsed laser light. During the irradiation process, the workpiece 100 is transported at the irradiation height H1. Stable processes can be carried out efficiently.

The driving

mechanisms

30, 40 for driving the

works

100, 200 will be described below. The drive mechanism 30 movably supports the holding unit 35 . The drive mechanism 30 supports the holding unit 35 on the −Z side of the holding unit 35 . A holding unit 45 is movably supported by the driving mechanism 40 . The drive mechanism 40 supports the holding unit 45 on the +Z side of the holding unit 45 .

The drive mechanism 30 includes an X-axis mechanism 31, a Y-axis mechanism 32, and a guide 33. The guide 33 is arranged on the -Z side of the

works

100 and 200 . The guide 33 is arranged along the X direction. The X-axis mechanism 31 is movably attached to the guide 33 . The X-axis mechanism 31 linearly moves along the guide 33 in the X direction. The X-axis mechanism 31 serves as a transport mechanism that transports the workpiece 100 and the holding unit 35 in the X direction. The Y-axis mechanism 32 is attached to the X-axis mechanism 31 so as to be able to move up and down. A holding unit 35 is fixed to the Y-axis mechanism 32 . The Y-axis mechanism 32 serves as an elevating mechanism for elevating the workpiece 100 and the holding unit 35 . Each of the X-axis mechanism 31 and the Y-axis mechanism 32 has a motor, a slide mechanism, and the like.

The drive mechanism 40 includes an X-axis mechanism 41, a Y-axis mechanism 42, and a guide 43. The guide 43 is arranged on the +Z side of the

works

100 and 200 . The guide 43 is arranged along the X direction. The X-axis mechanism 41 is movably attached to the guide 43 . The X-axis mechanism 41 linearly moves in the X direction along the guide 43 . The X-axis mechanism 41 serves as a transport mechanism that transports the workpiece 200 and the holding unit 45 in the X direction. The Y-axis mechanism 42 is attached to the X-axis mechanism 41 so as to be able to move up and down. A holding unit 45 is fixed to the Y-axis mechanism 42 . The Y-axis mechanism 42 serves as an elevating mechanism for elevating the workpiece 200 and the holding unit 45 . Each of the X-axis mechanism 41 and the Y-axis mechanism 42 has a motor, a slide mechanism, and the like.

The work 100 and the work 200 are at the same position in the Z direction. The holding unit 35 and the holding unit 45 hold the

workpieces

100 and 200 at the same Z position. When viewed from above, the

works

100 and 200 overlap during transportation. The laser beam L2 is applied to the

workpieces

100 and 200 at the same irradiation position.

The driving mechanism 30 is arranged on the -Z side of the

workpieces

100 and 200, and the driving mechanism 40 is arranged on the +Z side of the workpiece 200. In other words, the drive mechanism 30 supports the holding unit 35 on the −Z side of the work 100 . The drive mechanism 40 supports a holding unit 45 on the +Z side of the workpiece 200 .

Workpieces

100 and 200 are arranged between the drive mechanism 30 and the drive mechanism 40 in the Z direction. More specifically, the guide 33 is arranged on the -Z side of the transfer position of the

works

100 and 200, and the guide 43 is arranged on the +Z side of the transfer position of the

works

100 and 200.

In this embodiment, the laser irradiation device 1 has a three-dimensional structure capable of transporting the

works

100 and 200 at different heights. The footprint of the laser irradiation device 1 can be reduced. That is, in the Z direction, the drive mechanism 30 is arranged on one end side of the

works

100 and 200, and the drive mechanism 40 is arranged on the other end side. Therefore, the size in the Z direction can be reduced. Therefore, the footprint can be reduced.

The operation of the laser irradiation device 1 will be described below with reference to FIGS. 4 to 10. FIG. FIG. 4 is a perspective view showing the configuration of the main part of the laser irradiation device 1. As shown in FIG. Specifically, FIG. 4 shows the main components within the chamber 10 . 5 to 9 show the configuration of main parts in each process.

In FIG. 4 , the drive mechanism 30 and the drive mechanism 40 are installed on the pedestal 25 . Specifically, guides 33 and 43 are fixed on the base 25 . As described above, the

X-axis mechanisms

31 and 41 move along the

guides

33 and 43 in the X direction. The moving end of the X-axis mechanism 31 and the X-axis mechanism 41 are the same.

In addition, each of the

X-axis mechanisms

31 and 41 is provided with an elevating rail or the like along the Y direction. Then, the Y-

axis mechanisms

32 and 42 move up and down along the lift rails, respectively. The moving ends of the Y-axis mechanism 32 and the Y-axis mechanism 42 are the same in the vertical direction. Furthermore, the Y-

axis mechanisms

32, 42

support holding units

35, 45, respectively. The holding

units

35 and 45 may have chuck tables that vacuum-suck the

workpieces

100 and 200, respectively. The holding

units

35 and 45 release the suction when the

works

100 and 200 are carried out.

FIG. 5 shows a state in which the workpiece 100 is transferred onto the holding unit 45. FIG. The workpiece 100 is at the carry-in position (load position). The carry-in position corresponds to the moving end of the X-axis mechanism 31 on the -X side. Further, the workpiece 100 has an irradiation height H1 (see FIG. 1, etc.). Also, the X-axis mechanism 41 is at the moving end on the +X side. The workpiece 200 has a conveying height H2.

FIG. 6 shows a state in which the workpiece 100 is irradiated with the laser beam L2. When the X-axis mechanism 31 moves in the +X direction from the state shown in FIG. 5, the state shown in FIG. 6 is obtained. Also, in FIG. 6, the X-axis mechanism 41 has finished moving in the -X direction. That is, the X-axis mechanism 41 has moved to the moving end in the -X direction. A workpiece 200 is transported at a transport height H2. In FIG. 6, the workpiece 200 is at the carry-out position (unload position). It should be noted that the carry-in position and the carry-out position are the same X position. Note that the X-axis mechanism 41 is moving at a faster transport speed than the X-axis mechanism 31 here.

FIG. 7 shows a state in which the laser irradiation to the workpiece 100 is completed. Therefore, the workpiece 100 is conveyed to the +X side from the irradiation position of the laser beam L2. When the X-axis mechanism 31 moves further in the +X direction from the state shown in FIG. 6, the state shown in FIG. 7 is reached. In FIG. 7, the X-axis mechanism 31 has moved to the moving end on the +X side. 5 to 7, the workpiece 100 is moving at the irradiation height H1. In FIG. 7, the Y-axis mechanism 42 is raised and the workpiece 200 is at the irradiation height H1.

FIG. 8 shows a state in which the work 100 is lowered to the conveying height H2. That is, when the Y-axis mechanism 32 is lowered from the state shown in FIG. 7, the state shown in FIG. 8 is obtained. 6 to 8, the workpiece 200 is carried into and out of the holding unit 45. As shown in FIG. That is, the transfer robot 4 transfers the processed work 200 from the holding unit 45 and also transfers the new work 200 before processing onto the holding unit 45 . The position of the holding unit 45 and the position of the holding unit 35 are interchanged between the state shown in FIG. 5 and the state shown in FIG.

FIG. 9 shows a state in which the workpiece 200 is irradiated with the laser beam L2. When the X-axis mechanism 41 moves in the +X direction from the state shown in FIG. 8, the state shown in FIG. 9 is obtained. Also, in FIG. 9, the X-axis mechanism 31 has finished moving in the -X direction. That is, the X-axis mechanism 31 has moved to the moving end in the -X direction. Also, the workpiece 100 is transported at the transport height H2. In FIG. 9, the workpiece 100 is at the carry-out position (unload position). Here, the X-axis mechanism 31 is moving at a faster transport speed than the X-axis mechanism 41 . In the state shown in FIG. 9, the positions of the holding unit 35 and the holding unit 45 are reversed from the state shown in FIG.

FIG. 10 shows a state in which the laser irradiation to the workpiece 200 has been completed. Therefore, the workpiece 200 is conveyed to the +X side from the irradiation position of the laser beam L2. When the X-axis mechanism 41 moves further in the +X direction from the state shown in FIG. 9, the state shown in FIG. 10 is reached. In FIG. 10, the X-axis mechanism 41 has moved to the moving end on the +X side. Therefore, the workpiece 200 has moved to a position where the laser beam L2 is not irradiated. 8 to 10, the workpiece 200 is moving at the irradiation height H1. In FIG. 10, the Y-axis mechanism 32 is raised and the workpiece 100 is at the irradiation height H1. In the state shown in FIG. 10, the position of the holding unit 35 and the position of the holding unit 45 are reversed from the state shown in FIG.

Then, when the Y-axis mechanism 42 descends, it returns to the state shown in FIG. From the state shown in FIG. 9 to the state shown in FIG. 5, the workpiece 100 is carried in and out of the holding unit 35 . In other words, the processed workpiece 100 is transferred from the holding unit 35 and the new untreated workpiece 100 is transferred onto the holding unit 35 . By repeating the above process, laser irradiation can be continuously performed on a plurality of works.

Thus, the

workpieces

100 and 200 are at the irradiation height H1 during transportation in the +X direction. During transportation in the -X direction, the

workpieces

100 and 200 are at the transportation height H2. The transport height when transporting in the -X direction can be made lower than the irradiation height. Therefore, it is possible to prevent the irradiation of the laser beam during the transportation in the -X direction. The conveying height of the

workpieces

100 and 200 may be any height that can pass under the workpieces at the irradiation height. Therefore, the conveying height when conveying the work in the -X direction does not have to be constant. Alternatively, the work 100 and the work 200 may have different transport heights.

Also, the transport speed in the +X direction for laser light irradiation is limited by the laser irradiation process. On the other hand, there is no limit to the conveying speed in the -X direction for returning the processed work to the unloading position. The transport speed in the -X direction is faster than the transport speed in the +X direction. Thereby, the tact time can be shortened. In other words, since the processed work can be quickly moved to the loading/unloading position, the loading and unloading time can be secured. Furthermore, while one workpiece at the irradiation height H1 is being irradiated with the laser beam L2, the other workpiece at the conveying height H2 passes directly below the irradiation area 15 . It is possible to prevent the laser beam L2 from irradiating the workpiece at the transport height H2.

FIG. 11 is a diagram showing an example of a timing chart of the laser irradiation device 1. FIG. 11 shows, from top to bottom, the opening/closing operation of the door valve 5, the transfer operation of the transfer robot 4, the on/off operation of the static eliminator 8, the opening/closing operation of the shutter 22, the operation of the driving mechanism 30, and the operation of the driving mechanism 40. ing. Here, an example in which the tact time is 100 seconds is shown. That is, new workpieces are accommodated in the chamber every 100 seconds.

The operations of the transfer robot 4 are shown in three stages: load for transferring the workpiece into the chamber, unload for transferring the workpiece out of the chamber, and standby. The operations of the drive mechanism 30 are shown as X move for transporting the workpiece 100 in the X direction, Y move for raising and lowering the workpiece 100, and standby. Similarly, the operation of the drive mechanism 40 is represented by three movements, an X move for transporting the workpiece 200 in the X direction, a Y move for raising and lowering the workpiece 200, and a standby.

First, when the door valve 5 opens at timing t1, the transfer robot 4 unloads/loads the workpiece 100 by timing t2. When the work 100 is unloaded/loaded, the door valve 5 is closed. During the transfer operation of the workpiece 100, the drive mechanism 30 is in a standby state at the carry-in position. The drive mechanism 40 is moving in the X direction. That is, in order to irradiate the work 200 with laser light, the work 200 is conveyed in the +X direction.

Then, at the timing of t3, the driving mechanism 30 starts conveying the workpiece 100 in the +X direction. Also, the laser irradiation to the workpiece 200 ends at the timing of t3. After that, the drive mechanism 40 reaches the moving end on the +X side at the timing of t4, so that the drive mechanism 40 lowers the workpiece 200. As shown in FIG. Also, the laser irradiation to the workpiece 100 starts at the timing of t4. Since the descent of the work 200 is completed at the timing of t5, the drive mechanism 40 conveys the work 200 in the -X direction. Since the drive mechanism 40 reaches the moving end on the -X side at the timing of t6, the drive mechanism 40 raises the workpiece 200. As shown in FIG. At the timing of t7, the workpiece 200 is completely lifted, and the driving mechanism 40 enters the standby state.

Then, when the door valve 5 opens at timing t8, unloading/loading of the workpiece 200 is performed until timing t9. During the period from timing t7 to t8, the static eliminator 8 eliminates static electricity from the workpiece 200 being carried out. At the timing of t10, the drive mechanism 40 starts conveying in the +X direction. Also, the laser irradiation to the workpiece 100 ends at the timing of t10.

The drive mechanism 30 conveys the workpiece 100 in the X direction from t3 to t11. As a result, the entire surface of the workpiece 100 is irradiated with the laser beam L2. At the timing of t11, the drive mechanism 30 reaches the moving end in the +X direction, so that the drive mechanism 30 lowers the workpiece 100. As shown in FIG. Also, the laser irradiation to the workpiece 200 starts at the timing of t11. Since the descent of the work 100 is completed at the timing of t12, the drive mechanism 30 conveys the work 100 in the -X direction. Since the drive mechanism 30 reaches the moving end in the -X direction at the timing of t13, the drive mechanism 30 lifts the workpiece 100. As shown in FIG. The lifting of the workpiece 100 is completed at the timing of t14.

Then, at the timing of t15, the door valve 5 opens. The timing of t15 corresponds to the timing of t1. Therefore, since the operation after t15 is a repetition of the operation after t1, description thereof is omitted. During the period from t14 to t15, the neutralizer 8 neutralizes the workpiece 100 at the carry-in position with X-rays.

Also, the shutter 22 is closed from timing t3 to timing t4. From the timing t10 to the timing t11, the shutter 22 is closed from the end of the laser irradiation to the one work for which the shutter 22 is closed to the start of the laser irradiation to the other work. As a result, continuous transportation becomes possible, and the pulsed laser beam can be used efficiently. Here, the closing time of the shutter 22 is 4 seconds with respect to the tact time of 100 seconds. That is, the irradiation time of the laser beam for one workpiece is 96 seconds. Therefore, waste of pulsed laser light can be suppressed.

(Work 100)
An example of the workpiece 100 will be described below with reference to FIGS. 12 and 13. FIG. FIG. 12 is an exploded perspective view showing the configuration of the workpiece 100. FIG. FIG. 13 is a side sectional view schematically showing the configuration of part of the workpiece 100. As shown in FIG. Note that the configuration of the workpiece 200 is the same as that of the workpiece 100, and thus the description thereof is omitted. Workpiece 100 is subjected to a laser lift-off process.

The workpiece 100 includes a panel substrate 110, a tray 120, and a mask 130. The panel substrate 110 becomes a display panel through a laser lift process or the like. The panel substrate 110 has a processing substrate 111 and a peripheral substrate 112 . The panel substrate 110 has a size of 65 inches, for example. As shown in FIG. 13, the processing substrate 111 has, in order from the top, a glass substrate 111a, a polyimide film 111b, and a PET film 111c.

The glass substrate 111a is carrier glass that holds the polyimide film 111b and the PET film 111c. The polyimide film 111b becomes a peeling layer that is peeled off by laser irradiation. Elements for forming display pixels are formed between the PET film 111c and the polyimide film 111b. By irradiating the polyimide film 111b with the laser light through the glass substrate 111a, the polyimide film 111b and the PET film 111c can be separated from the glass substrate 111a.

A peripheral substrate 112 is attached to the peripheral region of the processing substrate 111 . The peripheral board 112 has a PCB (Printed Circuit Board) 112a and an FPC (Flexible Printed Circuit) 112b. The PCB 112a is attached to the processing board 111 via the PFPC 112b. A drive circuit or the like may be mounted on the PCB 112a.

The panel substrate 110 is placed on the tray 120 . The tray 120 is made of metal such as aluminum. The tray 120 has a frame portion 121 and a middle rail portion 123 . The frame portion 121 is formed in a rectangular frame shape and corresponds to the peripheral portion of the panel substrate 110 . The frame portion 121 holds the peripheral portion of the processing substrate 111 and the peripheral substrate 112 . Frame portion 121 may have a recess or the like for disposing panel substrate 110 .

A middle beam portion 123 is provided inside the frame portion 121 in the XZ plane. The middle rail portion 123 is provided in a grid pattern. That is, the middle crosspiece 123 is a beam extending in the X direction and the Z direction. The middle rail portion 123 is formed across from one end of the frame portion 121 to the other end. An opening 124 is formed in a region surrounded by the middle rail portion 123 and the frame portion 121 . Here, a plurality of openings 124 are formed.

A mask 130 is provided to cover the peripheral substrate 112 . A mask 130 is positioned over the peripheral substrate 112 . The mask 130 may be fixed to the tray 120 with bolts or the like. The mask 130 is formed in a frame shape and has a rectangular opening 130a. The processing substrate 111 is irradiated with the laser light L2 through the opening 130a. The mask 130 is provided to prevent the peripheral substrate 112 from being irradiated with the laser light L2. Furthermore, it is possible to prevent the peripheral substrate 112 from being irradiated with scattered ultraviolet rays or the like.

A panel substrate 110 is held on the tray 120 . A mask 130 is attached on the tray 120 . The panel substrate 110, the tray 120, and the mask 130 are integrated to form the workpiece 100. FIG. A workpiece 100 having a panel substrate 110 , a tray 120 and a mask 130 is carried into the laser irradiation apparatus 1 . The panel substrate 110 is carried into the laser irradiation apparatus 1 together with the tray 120 and the mask 130 .

The configuration of the workpiece 100 and the holding unit 35 will be described with reference to FIG. FIG. 14 is a sectional view showing the configuration of the holding unit 35 and the workpiece 100. As shown in FIG. Specifically, FIG. 14 shows a state in which the workpiece 100 is held by the holding unit 35. As shown in FIG.

The holding unit 35 is a chuck table for vacuum chucking. For example, the holding unit 35 is a porous body. Alternatively, the holding unit 35 may be provided with a suction port on the upper surface 35a. The holding unit 35 is connected to evacuation means such as a vacuum pump. By sucking gas from the holding unit 35 , the workpiece 100 is attracted to the upper surface 35 a of the holding unit 35 .

A groove 35b is formed on the upper surface 35a of the holding unit 35 so as not to interfere with the middle rail portion 123. In other words, the grooves 35b are formed in a lattice shape so as to correspond to the middle beam portion 123. As shown in FIG. The width of the groove 35b is wider than the width of the middle rail portion 123. As shown in FIG. Therefore, the middle rail portion 123 is fitted in the groove 35b. The holding unit 35 is inserted into the opening 124 between the frame portion 121 and the middle beam portion 123 .

The upper surface 35a of the holding unit 35 contacts the PET film 111c of the substrate 111 to be processed. That is, the holding unit 35 lifts the panel substrate 110 from the tray 120 . A gap is formed between the processing substrate 111 and the tray 120 . The holding unit 35 holds the work 100 in a state where the lower surface of the processing substrate 111 does not contact the tray 120 . The holding unit 35 sucks the processing substrate 111 while the tray 120 and the processing substrate 111 are separated from each other. The flatness of the processing substrate 111 depends on the flatness of the upper surface 35 a of the holding unit 35 . The flatness of the processing substrate 111 can be increased.

Here, in order to stably perform laser irradiation, it is preferable to increase the flatness of the processing substrate 111 being transported. On the other hand, since the processing substrate 111 has a multi-layer structure, it may warp due to film stress or the like. In the present embodiment, since the holding unit 35 is vacuum-sucked, warping of the processing substrate 111 can be suppressed. In other words, the processing substrate 111 is vacuum-sucked at a portion other than the middle beam portion 123 . As a result, since warping can be suppressed, the flatness of the processing substrate 111 can be increased.

The height of the processing substrate 111 can be matched with the focal plane of the laser light L2 by the irradiation optical system 20. Thereby, even when it is difficult to increase the depth of focus of the irradiation optical system 20, a stable laser irradiation process can be realized. Therefore, a stable process can be performed efficiently.

(Organic EL display)
The laser irradiation device 1 described above is suitable for a laser lift-off device for an organic EL (ElectroLuminescence) display. That is, the laser irradiation method by the laser irradiation device 1 is used as a laser lift-off process in the manufacturing process of the organic EL display.

A configuration applied to an organic EL display manufactured using the laser irradiation apparatus 1 according to the present embodiment will be described below. The structure of an organic EL (Electroluminescence) display will be described with reference to FIG. FIG. 15 is a cross-sectional view showing an example of an organic EL display. The organic EL display 300 shown in FIG. 15 is an active matrix display device in which a TFT is arranged in each pixel PX.

The organic EL display 300 includes a film 301 , a release layer 302 , a TFT (Thin Film Transistor) layer 311 , an organic layer 312 , a color filter layer 313 and a protective layer 314 . FIG. 15 shows a top emission type organic EL display in which the protective layer 314 side is the viewing side. Note that the following description shows one configuration example of the organic EL display, and the present embodiment is not limited to the configuration described below. For example, the present embodiment may be used for a bottom emission type organic EL display.

The film 301 is a flexible plastic film that can be bent by applying stress. A release layer 302 and a TFT layer 311 are provided on the film 301 . The TFT layer 311 has a TFT 311a arranged in each pixel PX. Further, the TFT layer 311 has wiring (not shown) and the like connected to the TFT 311a. The TFT 311a, wiring, and the like constitute a pixel circuit.

An organic layer 312 is provided on the TFT layer 311 . The organic layer 312 has an organic EL light emitting element 312a arranged for each pixel PX. The organic EL light-emitting element 312a has, for example, a laminated structure in which an anode, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and a cathode are laminated. In the case of the top emission method, the anode is a metal electrode and the cathode is a transparent conductive film such as ITO (Indium Tin Oxide). Further, the organic layer 312 is provided with partition walls 312b for separating the organic EL light emitting elements 312a between the pixels PX.

A color filter layer 313 is provided on the organic layer 312 . The color filter layer 313 is provided with color filters 313a for color display. That is, each pixel PX is provided with a resin layer colored R (red), G (green), or B (blue) as a color filter 313a. The white light emitted from the organic layer 312 is converted into RGB color light when passing through the color filter 313a. Note that in the case of a three-color system in which the organic layer 312 is provided with organic EL light-emitting elements that emit each color of RGB, the color filter layer 313 may be omitted.

A protective layer 314 is provided on the color filter layer 313 . The protective layer 314 is made of a resin material and provided to prevent deterioration of the organic EL light emitting element of the organic layer 312 .

The current flowing through the organic EL light emitting element 312a of the organic layer 312 changes depending on the display signal supplied to the pixel circuit. Therefore, by supplying a display signal corresponding to a display image to each pixel PX, the amount of light emitted from each pixel PX can be controlled. Thereby, a desired image can be displayed.

<Manufacturing process of organic EL display>
Next, a manufacturing process of the above-described organic EL display will be described with reference to FIG. When manufacturing an organic EL display, first, a processing substrate 331 is prepared (process A). For example, a glass substrate that transmits laser light is used as the processing substrate 331 . The processing substrate 331 corresponds to the processing substrate 111 in FIG. 12 and the like.

Next, a release layer 302 is formed on the processing substrate 331 (step B). Polyimide, for example, can be used for the release layer 302 . The release layer 302 corresponds to the polyimide film 111b. After that, a circuit element 332 is formed on the release layer 302 (process C). Here, the circuit element 332 includes the TFT layer 311, the organic layer 312, and the color filter layer 313 shown in FIG. The circuit element 332 can be formed using a photolithography technique or a film formation technique. After that, a protective layer 314 for protecting the circuit element 332 is formed on the circuit element 332 (process D). The protective layer 314 corresponds to the PET film 111c.

Next, the processing substrate 331 is turned over so that the processing substrate 331 faces upward (process E), and is carried into the laser irradiation apparatus 1 . The release layer 302 is irradiated with a laser beam L2 from the processing substrate 331 side (process F). A line beam can be used as the laser beam L2. In the case shown in FIG. 16, since the processing substrate 331 is transported in the X direction, the processing substrate 331 is irradiated with the laser beam L2 from the right side to the left side. After that, the processing substrate 331 and the separation layer 302 are separated (step G). Finally, a film 318 is laminated to the release layer 302 (step H). For example, film 318 is a flexible plastic film, a film that can be bent by applying stress. By using such a manufacturing process, the foldable organic EL display 300 can be manufactured.

Note that the laser irradiation apparatus 1 described above is applicable not only to a peeling apparatus that performs a laser lift-off process, but also to an excimer laser annealing apparatus and the like.

It should be noted that the present invention is not limited to the above embodiments, and can be modified as appropriate without departing from the scope of the invention.

This application claims priority based on Japanese Patent Application No. 2021-36889 filed on March 9, 2021, and the entire disclosure thereof is incorporated herein.

Reference Signs List 1 laser irradiation device 4 transfer robot 5 door valve 6 window 8 static eliminator 10 chamber 20 irradiation optical system 21 light source 25 base 30 drive mechanism 31 X-axis mechanism 32 Y-axis mechanism 33 guide 35 holding unit 40 drive mechanism 41 X-axis mechanism 42 Y Axis mechanism 43 Guide 45 Holding unit 100 Work 110 Panel substrate 111 Processing substrate 112 Peripheral substrate 120 Tray 130 Mask 200 Work 300 Organic EL display 310 Substrate 311 TFT layer 311a TFT
312 organic layer 312a organic EL light emitting element 312b partition wall 313 color filter layer 313a color filter (CF)
314 protective layer PX pixel H1 irradiation height H2 transport height

Claims

a laser oscillator that generates laser light;
a first holding unit and a second holding unit respectively holding a first work and a second work to be irradiated with the laser light;
a first transport mechanism and a second transport mechanism for horizontally transporting the first holding unit and the second holding unit, respectively;
a first lifting mechanism and a second lifting mechanism for lifting and lowering the first holding unit and the second holding unit, respectively, in a vertical direction orthogonal to the horizontal direction;
A laser irradiation device comprising:
The laser irradiation device according to claim 1, wherein the second work is positioned below the first work when the first work is irradiated with the laser light.
further comprising an irradiation optical system for irradiating the first work and the second work being conveyed from above by making the laser light into a line,
3. When viewed from above, the first transport mechanism and the second transport mechanism respectively transport the first workpiece and the second workpiece in a direction intersecting with the line-shaped laser beam. The laser irradiation device according to .
In top view,
The first transport mechanism supports the first holding unit on one end side in a direction perpendicular to the transport direction,
The laser irradiation device according to any one of claims 1 to 3, wherein the second transport mechanism supports the second holding unit on the other end side in the direction orthogonal to the transport direction.
The first work at a first height is transported in a first direction so that the first work is irradiated with the laser beam,
While the first work is being irradiated with the laser beam, the second work at a second height lower than the first height moves in a second direction opposite to the first direction. The laser irradiation device according to any one of claims 1 to 4, which is transported.
The laser irradiation device according to claim 5, wherein the second work in the second holding unit is replaced after the second work is transported in the second direction.
the first holding unit vacuum-adsorbs the first workpiece;
The laser irradiation device according to any one of claims 1 to 4, wherein the second holding unit vacuum-sucks the second work.
each of the first and second workpieces is a processing substrate irradiated with the laser light;
a peripheral substrate arranged around the processing substrate;
a tray on which the processing substrate and the peripheral substrate are placed;
The first holding unit is arranged in an opening provided in the tray with the first work placed on the first holding unit,
vacuum-adsorbing the first work in a state where the first holding unit separates the processing substrate from the tray;
The second holding unit is arranged in an opening provided in the tray with the second work placed on the second holding unit,
8. The laser irradiation apparatus according to claim 7, wherein the first holding unit vacuum-adsorbs the first work while the processing substrate is separated from the tray.
(a) irradiating the first work with a laser beam by conveying the first work horizontally while the first holding unit holds the first work;
(b) after descending the first work irradiated with the laser beam, conveying the first work horizontally;
(c) irradiating the second work with a laser beam by conveying the second work horizontally while the second holding unit holds the second work;
(d) A laser irradiation method comprising the step of horizontally conveying the second work irradiated with the laser beam after the second work is lowered.
The laser irradiation method according to claim 9, wherein the second work is positioned below the first work when the first work is irradiated with the laser light in step (a).
The line-shaped laser light is irradiated from above onto the first work and the second work being conveyed, and in steps (a) and (c), the line-shaped laser light intersects in a top view. 11. The laser irradiation method according to claim 9 or 10, wherein the first work and the second work are conveyed in directions.
In top view,
The first holding unit is supported on one end side in a direction orthogonal to the conveying direction,
The laser irradiation method according to any one of claims 9 to 11, wherein the second holding unit is supported on the other end side in the direction perpendicular to the conveying direction.
In the step (a), the first work at a first height is transported in a first direction so that the first work is irradiated with the laser beam;
While the first workpiece is being irradiated with the laser beam in step (a), in step (d), the second workpiece at a second height lower than the first height is The laser irradiation method according to any one of claims 9 to 12, wherein the substrate is conveyed in a second direction opposite to the first direction.
14. The laser irradiation method according to claim 13, wherein the second work in the second holding unit is replaced after the second work is transported in the second direction in step (d).
the first holding unit vacuum-adsorbs the first workpiece;
The laser irradiation method according to any one of claims 9 to 14, wherein the second holding unit vacuum-sucks the second workpiece.
(A) forming a release layer on the substrate;
(B) forming an element on the release layer;
(C) separating the substrate and the release layer;
(D) A method for manufacturing an organic EL display comprising the step of laminating a film on the release layer,
(C) the step of separating the substrate and the release layer is a step of irradiating the work including the substrate and the release layer with a laser beam from above while the work is being transported;
(Ca) irradiating the first work with a laser beam by conveying the first work horizontally while the first holding unit holds the first work;
(Cb) after descending the first work irradiated with the laser beam, conveying the first work horizontally;
(Cc) irradiating the second work with a laser beam by conveying the second work horizontally while the second holding unit holds the second work;
(Cd) A method of manufacturing an organic EL display, comprising the step of horizontally conveying the second work irradiated with the laser beam after the second work is lowered.
17. The manufacturing of an organic EL display according to claim 16, wherein the second work is positioned below the first work when the first work is irradiated with the laser beam in step (Ca). Method.
In steps (Ca) and (Cc), the line-shaped laser light is irradiated from above onto the first work and the second work being conveyed, and intersects with the line-shaped laser light in a top view. 18. The method of manufacturing an organic EL display according to claim 16, wherein the first work and the second work are conveyed in directions.
In top view,
The first holding unit is supported on one end side in a direction orthogonal to the conveying direction,
19. The method of manufacturing an organic EL display according to any one of claims 16 to 18, wherein the second holding unit is supported on the other end side in the direction orthogonal to the conveying direction.
In the step (Ca), the first work at a first height is transported in a first direction so that the first work is irradiated with the laser beam;
While the first workpiece is being irradiated with the laser beam in step (Ca), in step (Cd), the second workpiece at a second height lower than the first height is 20. The method of manufacturing an organic EL display according to any one of claims 16 to 19, wherein the substrate is transported in a second direction opposite to the first direction.
21. The method of manufacturing an organic EL display according to claim 20, wherein in step (Cd), after the second work is conveyed in the second direction, the second work in the second holding unit is replaced. .
the first holding unit vacuum-adsorbs the first workpiece;
22. The method of manufacturing an organic EL display according to claim 16, wherein the second holding unit vacuum-sucks the second workpiece.
a tray on which a substrate to be processed is placed, comprising a frame portion and a middle crosspiece portion provided inside the frame portion;
A holding device which has a groove corresponding to the middle rail portion, is inserted into an opening between the frame portion and the middle rail portion, and adsorbs the processing substrate in a state in which the tray and the processing substrate are separated from each other. a unit;
a transport mechanism that transports the holding unit;
and an irradiation optical system for irradiating a laser beam onto the processing substrate being transported by the transport mechanism.