JP2018152380A - Method for manufacturing package device chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a package device chip, by which the reduction in the yield of a package device chip can be suppressed.SOLUTION: A method for manufacturing a package device chip comprises: a groove-forming step ST1 of forming grooves in a wafer; a mold step ST2 of forming a package wafer; a tape-sticking step ST4 of sticking an expandable tape to a backside of the wafer; a mold resin-removing step ST5 of exposing the grooves in an outer peripheral portion; an alignment step ST6 of locating the position of a split groove; a split groove-forming step ST7 of applying a laser beam to the groove based on the position thus located to form the split groove; a completion-of-cutting confirming step ST8 of confirming whether an incompletely cut region is formed or not; and a breaking step ST9 of stretching the expandable tape to break an uncut portion as to a package wafer on which there is a region confirmed to be an incompletely cut region because of the uncut portion being left.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a method for manufacturing a package device chip.

  As processing methods for dividing a semiconductor wafer into individual device chips, cutting processing with a cutting blade and ablation processing by irradiation with a pulsed laser beam are known. In general, the device chips divided individually are fixed to a mother substrate or the like, wired with wires or the like, and packaged with a mold resin. However, when the device chip is operated for a long time due to a minute crack on the side surface, the crack may extend and break. In order to suppress such damage to the device chip, a packaging method has been developed in which the side surface of the device chip is covered with a mold resin so that external environmental factors are not exerted on the device chip (for example, see Patent Document 1). .

  In the packaging method disclosed in Patent Document 1, first, grooves are formed along a planned dividing line (street) from the surface of the wafer, and a mold resin is filled into the grooves and the wafer surface. Thereafter, the packaging method disclosed in Patent Document 1 divides the wafer device by thinning the wafer from the back surface until the mold resin in the groove is exposed. In the packaging method disclosed in Patent Document 1, finally, the mold resin in the groove is divided from the surface of the wafer and divided into individual device chips. In the packaging method described above, in order to divide into device chips, it has been developed to use ablation processing by irradiation with a pulsed laser beam instead of cutting processing. By using ablation processing, the cutting allowance used for dividing the device chips can be made very narrow, the planned dividing line can be designed very thin, and the number of device chips per wafer can be increased. It is beneficial to be able to.

JP 2002-1001009 A

  Ablation processing by irradiation with a pulsed laser beam is a processing method in which a narrow groove is gradually deepened by scanning a pulsed laser beam a plurality of times in order to form a very narrow through groove in the mold resin. Ablation processing by pulse laser beam irradiation is performed with the minimum number of scans of the pulse laser beam in order to shorten the processing time. If there is a part where the mold resin suddenly becomes thick, the mold resin is only applied to that part. It cannot be removed and the through groove cannot be formed properly, resulting in a blind hole. For this reason, in the conventional processing method, the operator confirms the wafer after ablation one by one, and discards the device in the vicinity of the region where the through groove is in a blind hole state as a defective chip. As described above, in the conventional processing method, the yield of the package device chip tends to decrease because it is discarded as a defective chip even if there is no problem in the device itself in the vicinity of the region where the through groove is in the blind hole state. .

  The present invention has been made in view of these points, and an object of the present invention is to provide a method of manufacturing a package device chip that can suppress a decrease in the yield of the package device chip.

  In order to solve the above-described problems and achieve the object, a manufacturing method of a package device chip according to the present invention is a manufacturing method of a package device chip, and includes a plurality of regions partitioned by a plurality of intersecting scheduled lines. A groove forming step for forming a groove along the line to be divided on the surface of the wafer including the surface on which the device is formed; and filling the groove with a mold resin and covering the surface of the wafer with the mold resin; A mold step for forming a package wafer; a tape attaching step for attaching an expanded tape to the back surface of the package wafer; and the mold resin coated on the outer peripheral portion of the surface of the package wafer after the tape attaching step. Mold resin removing step of removing and exposing the groove filled with the mold resin at the outer periphery An alignment step for determining the position of the dividing groove of the package wafer formed along the groove based on the groove exposed at the outer peripheral portion, and the mold resin based on the position determined in the alignment step. A split groove forming step for forming a split groove for splitting the package wafer by irradiating a laser beam having an absorptive wavelength along the groove, and a region completely cut by the split groove and a remaining uncut portion are not present. With respect to the package wafer where both the completely cut region is confirmed, the expanded tape is expanded and the uncut portion of the divided groove is broken along the planned dividing line, and the package device is removed from the package wafer. And a breaking step for obtaining a chip.

  In the manufacturing method of the package device chip, after the molding step and before the mold resin removing step, a protective member is attached to the mold surface side of the package wafer, and the back surface of the package wafer is ground and thinned. And a grinding step for exposing the groove filled with the mold resin to the back surface.

  In the manufacturing method of the package device chip, a reinforcing film attaching step of attaching a reinforcing film made of a material capable of absorbing the wavelength of the laser beam to the back surface of the package wafer after the molding step and before the tape attaching step. In the divided groove forming step, the reinforcing film may also be divided by the divided grooves.

  Therefore, the method for manufacturing a package device chip according to the present invention has an effect of suppressing a decrease in the yield of the package device chip.

FIG. 1A is a perspective view of a wafer to be processed by the manufacturing method of the package device chip according to the first embodiment, and FIG. 1B is a perspective view of the wafer device shown in FIG. FIG. FIG. 2 is a cross-sectional view of a main part of a package wafer to be processed in the manufacturing method of the package device chip according to the first embodiment. FIG. 3 is a perspective view showing a package device chip manufactured by the method for manufacturing a package device chip according to the first embodiment. FIG. 4 is a flowchart showing a flow of the manufacturing method of the package device chip according to the first embodiment. FIG. 5 is a perspective view showing a schematic configuration of a cutting apparatus used in the groove forming step of the manufacturing method of the package device chip shown in FIG. 6A is a cross-sectional view of the main part of the wafer during the groove forming step of the manufacturing method of the package device chip shown in FIG. 4, and FIG. 6B is the package device shown in FIG. FIG. 6C is a cross-sectional view of the main part of the wafer after the groove forming step of the chip manufacturing method, and FIG. 6C is a perspective view of the wafer after the groove forming step of the package device chip manufacturing method shown in FIG. is there. FIG. 7 is a perspective view of the package wafer after the molding step of the manufacturing method of the package device chip shown in FIG. FIG. 8 is a cross-sectional view of the main part of the package wafer after the molding step of the method of manufacturing the package device chip shown in FIG. FIG. 9A is a side view showing a grinding step of the manufacturing method of the package device chip shown in FIG. 4, and FIG. 9B is grinding of the manufacturing method of the package device chip shown in FIG. It is sectional drawing of the package wafer after a step. FIG. 10 is a perspective view showing a tape attaching step of the method for manufacturing the package device chip shown in FIG. FIG. 11A is a perspective view showing a mold resin removing step of the method for manufacturing the package device chip shown in FIG. 4, and FIG. 11B is a method for manufacturing the package device chip shown in FIG. It is a perspective view of the package wafer after the mold resin removal step. FIG. 12 is a perspective view showing a schematic configuration of a laser processing apparatus used in the alignment step and the division groove forming step of the package device chip manufacturing method shown in FIG. FIG. 13 is a perspective view showing an alignment step of the method of manufacturing the package device chip shown in FIG. FIG. 14 is a plan view of the package wafer shown in FIG. FIG. 15 is a plan view showing an example of the package wafer after the division groove forming step of the manufacturing method of the package device chip shown in FIG. 16 is a cross-sectional view taken along line XVI-XVI in FIG. 17 is a cross-sectional view taken along line XVII-XVII in FIG. 18 is a side view showing a complete cutting confirmation step of the method for manufacturing the package device chip shown in FIG. FIG. 19 is a cross-sectional view showing a state in which the package wafer is fixed to the breaking device in the breaking step of the package device chip manufacturing method shown in FIG. FIG. 20 is a cross-sectional view showing a package wafer divided into a plurality of package device chips by a breaking step of the package device chip manufacturing method shown in FIG. FIG. 21 is a perspective view illustrating a package device chip manufactured by the method for manufacturing a package device chip according to the second embodiment. FIG. 22 is a flowchart showing the flow of the manufacturing method of the package device chip according to the second embodiment. FIG. 23 is a perspective view showing a reinforcing film attaching step of the manufacturing method of the package device chip shown in FIG. FIG. 24 is a perspective view showing a tape attaching step of the manufacturing method of the package device chip shown in FIG. FIG. 25 is a cross-sectional view showing an example of a cross section of the package wafer after the division groove forming step of the manufacturing method of the package device chip shown in FIG. FIG. 26 is a cross-sectional view of the package wafer after the breaking step shown in FIG. FIG. 27 is a perspective view of a wafer to be processed in the package device chip manufacturing method according to the third embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
A method for manufacturing a package device chip according to the first embodiment will be described. FIG. 1A is a perspective view of a wafer to be processed in the method for manufacturing a package device chip according to the first embodiment. FIG. 1B is a perspective view of the wafer device shown in FIG. FIG. 2 is a cross-sectional view of a main part of a package wafer to be processed in the manufacturing method of the package device chip according to the first embodiment. FIG. 3 is a perspective view showing a package device chip manufactured by the method for manufacturing a package device chip according to the first embodiment. FIG. 4 is a flowchart showing a flow of the manufacturing method of the package device chip according to the first embodiment.

  The manufacturing method of the package device chip according to the first embodiment is a method for manufacturing the package device chip 203 shown in FIG. 3 by performing ablation processing or the like on the division line 202 of the package wafer 201 shown in FIG. It is. A package wafer 201 that is divided into package device chips 203 by the package device chip manufacturing method according to the first embodiment includes a wafer 204 shown in FIG. A wafer 204 shown in FIG. 1A is a disk-shaped semiconductor wafer or optical device wafer having a substrate 205 of silicon, sapphire, gallium arsenide, or the like in the first embodiment. As shown in FIG. 1A, the wafer 204 includes a device region 207 in which devices 206 are respectively formed in a plurality of regions partitioned by a plurality of division lines 202 that intersect (orthogonal in the first embodiment). The surface 209 includes an outer peripheral surplus region 208 that surrounds the device region 207 and in which the device 206 is not formed. As shown in FIG. 1B, bumps 210 that are a plurality of protruding electrodes are formed on the surface of the device 206.

  As shown in FIG. 2, the wafer 204 is configured in the package wafer 201 by covering the surface 209 of the device region 207 and the groove 211 formed in the planned dividing line 202 along the planned dividing line 202 with a mold resin 212. The That is, in the package wafer 201, the mold resin 212 is filled in the device 206 provided on the surface 209 of the substrate 205 and the groove 211 between the devices 206. The package wafer 201 is divided into package device chips 203 shown in FIG. 3 by dividing the grooves 211 formed in the planned division lines 202. In the package device chip 203, the device 206 provided on the surface 209 of the substrate 205 and all the side surfaces 213 are covered with the mold resin 212, and the bump 210 protrudes from the mold resin 212 so that the bump 210 is exposed. .

  In the first embodiment, the width of the groove 211 of the package wafer 201 is narrower than the width of the division planned line 202, for example, 30 μm. In the first embodiment, the thickness of the package wafer 201 (also referred to as a finished thickness) is thicker than the semiconductor wafer divided into devices, for example, 300 μm. In the first embodiment, the planar shape of the package device chip 203 is larger than that of a device that is divided from a semiconductor wafer using a cutting blade, and is formed in, for example, a quadrilateral with a side of 3 mm.

  As shown in FIG. 4, the package device chip manufacturing method according to the first embodiment (hereinafter simply referred to as a manufacturing method) includes a groove forming step ST1, a molding step ST2, a grinding step ST3, and a tape attaching step ST4. And a mold resin removing step ST5, an alignment step ST6, a dividing groove forming step ST7, a complete cutting confirmation step ST8, and a breaking step ST9. Although the manufacturing method according to the first embodiment performs the grinding step ST3 after performing the molding step ST2, the present invention may perform the grinding step ST3 before the molding resin removal step ST5.

(Groove forming step)
The groove forming step ST1 is a step of forming the groove 211 along the planned dividing line 202 on the surface 209 of the wafer 204. FIG. 5 is a perspective view showing a schematic configuration of a cutting apparatus used in the groove forming step of the manufacturing method of the package device chip shown in FIG. FIG. 6A is a cross-sectional view of the main part of the wafer during the groove forming step of the manufacturing method of the package device chip shown in FIG. FIG. 6B is a cross-sectional view of the main part of the wafer after the groove forming step of the manufacturing method of the package device chip shown in FIG. FIG. 6C is a perspective view of the wafer after the groove forming step of the package device chip manufacturing method shown in FIG.

  The depth of the groove 211 formed in the groove forming step ST1 is equal to or greater than the finished thickness of the package wafer 201. In the first embodiment, in the groove forming step ST1, the dicing tape 215 is attached to the back surface 214 on the back side of the front surface 209, the annular frame 216 is attached to the outer periphery of the dicing tape 215, and as shown in FIG. It is supported by an annular frame 216.

  In the groove forming step ST1, the back surface 214 of the wafer 204 is sucked and held on the holding surface 102 of the chuck table 101 of the cutting apparatus 100 via the dicing tape 215, and the cutting of the cutting apparatus 100 is performed as shown in FIG. The dividing line 202 is cut using the cutting blade 104 of the unit 103. In the groove forming step ST1, the division line 202 is cut to form a groove 211 along the division line 202 on the surface 209 of the wafer 204 as shown in FIG. 6B.

  In the groove forming step ST1, the chuck table 101 is moved in the X-axis direction parallel to the horizontal direction by an X-axis moving unit (not shown), and the cutting blade 104 of the cutting unit 103 is parallel to the horizontal direction by the Y-axis moving unit 105 and X The wafer is moved in the Y-axis direction orthogonal to the axial direction, and the cutting blade 104 of the cutting unit 103 is moved in the Z-axis direction parallel to the vertical direction by the Z-axis moving unit 106, as shown in FIG. A groove 211 is formed on the surface 209 of each division planned line 202 of 204. In the present invention, the groove forming step ST1 may form the groove 211 by ablation processing using a laser beam.

(Mold step)
The mold step ST2 is a step of filling the groove 211 with the mold resin 212 and covering the surface 209 of the wafer 204 with the mold resin 212 to form the package wafer 201. FIG. 7 is a perspective view of the package wafer after the molding step of the manufacturing method of the package device chip shown in FIG. FIG. 8 is a cross-sectional view of the main part of the package wafer after the molding step of the method of manufacturing the package device chip shown in FIG.

  In the first embodiment, in the molding step ST2, the back surface 214 of the wafer 204 is held via a dicing tape 215 on a holding table of a resin coating apparatus (not shown), the front surface 209 of the wafer 204 is covered with a mold, and the mold is molded into the mold. The resin 212 is filled, and the entire surface 209 and the groove 211 are covered with the mold resin 212. In the first embodiment, a thermosetting resin is used as the mold resin 212. In the mold step ST2, the mold resin 212 covering the entire surface 209 and the groove 211 of the wafer 204 is heated and cured. In the first embodiment, the bump 210 is exposed when the entire surface 209 and the groove 211 are covered with the mold resin 212. However, in the present invention, the cured mold resin 212 is subjected to a polishing process to obtain the bump 210. You may make it expose reliably.

(Grinding step)
In the grinding step ST3, after the molding step ST2, and before the mold resin removal step ST5, a protective member 218 is attached to the mold surface 217 side of the package wafer 201 covered with the mold resin 212, and the back surface of the package wafer 201 is obtained. In this step, 214 is thinned by grinding, and the groove 211 filled with the mold resin 212 is exposed on the back surface 214. FIG. 9A is a side view showing a grinding step of the manufacturing method of the package device chip shown in FIG. FIG. 9B is a cross-sectional view of the package wafer after the grinding step of the package device chip manufacturing method shown in FIG.

  In the grinding step ST3, as shown in FIG. 9A, the protective member 218 is attached to the mold surface 217 side of the package wafer 201, the dicing tape 215 is peeled off from the back surface 214, and then the protective member 218 is removed from the grinding device 110. The chuck table 111 is sucked and held on the holding surface 112, the grinding wheel 113 is brought into contact with the back surface 214 of the package wafer 201, and the chuck table 111 and the grinding wheel 113 are rotated about the axis, thereby the back surface of the package wafer 201. 214 is ground. In the grinding step ST3, as shown in FIG. 9B, the substrate 205 of the package wafer 201 is thinned to the finished thickness, and the package wafer 201 is thinned until the mold resin 212 filled in the groove 211 is exposed.

(Tape sticking step)
The tape sticking step ST4 is a step of sticking an expandable tape 219 having elasticity on the back surface 214 of the package wafer 201. FIG. 10 is a perspective view showing a tape attaching step of the method for manufacturing the package device chip shown in FIG.

  In the tape attaching step ST4, as shown in FIG. 10, the back surface 214 of the package wafer 201 is attached to the expanded tape 219 having the annular frame 220 attached to the outer periphery, and the protective member 218 is peeled off from the mold surface 217.

(Mold resin removal step)
In the mold resin removal step ST5, after the tape adhering step ST4, the mold resin 212 covered with the outer peripheral surplus region 208 which is the outer peripheral portion of the surface 109 of the package wafer 201 is removed, and the groove filled with the mold resin 212 In this step, 211 is exposed in the outer peripheral surplus area 208. FIG. 11A is a perspective view showing a mold resin removing step in the method of manufacturing the package device chip shown in FIG. FIG. 11B is a perspective view of the package wafer after the mold resin removal step of the package device chip manufacturing method shown in FIG.

  In the first embodiment, the mold resin removing step ST5 removes the mold resin 212 over the entire outer periphery of the outer peripheral surplus region 208 of the package wafer 201. In the first embodiment, the mold resin removing step ST5 expands the back surface 214 of the package wafer 201 on the holding surface 102 of the chuck table 101 of the cutting apparatus 100 as shown in FIG. A mold on the outer peripheral edge of the outer peripheral surplus region 208 while sucking and holding the tape 219 and rotating the chuck table 101 around the axis parallel to the Z-axis direction to the rotational drive source 107 until the cutting blade 108 reaches the substrate 205. Cut into the resin 212 to expose the groove 211 filled with the mold resin 212 on the outer peripheral edge of the outer peripheral surplus region 208. In the mold resin removing step ST5, as shown in FIG. 11B, the mold resin 212 on the outer peripheral edge of the outer peripheral surplus area 208 of the package wafer 201 is removed. In FIG. 10, FIG. 11A and FIG. 11B, the bump 210 is omitted.

(Alignment step)
The alignment step ST6 is a step of determining the position of the dividing groove 221 shown in FIG. 15 of the package wafer 201 formed along the groove 211 based on the groove 211 exposed in the outer peripheral surplus region 208. FIG. 12 is a perspective view showing a schematic configuration of a laser processing apparatus used in the alignment step and the division groove forming step of the package device chip manufacturing method shown in FIG. FIG. 13 is a perspective view showing an alignment step of the method of manufacturing the package device chip shown in FIG. FIG. 14 is a plan view of the package wafer shown in FIG.

  In the alignment step ST6, the package wafer 201 in which the groove 211 filled with the mold resin 212 is exposed in the outer peripheral surplus region 208 is sucked and held by the holding surface 122 of the chuck table 121 of the laser processing apparatus 120 shown in FIG. 220 is clamped by the clamp part 123.

  In alignment step ST6, the control unit 124 of the laser processing apparatus 120 moves the chuck table 121 to the Y-axis moving unit 125 in the Y-axis direction parallel to the horizontal direction that is the indexing feed direction, so The image pickup unit 126 is made to face the groove 211 exposed in the outer peripheral surplus area 208 of one of the planned division lines 202 and the image pickup unit 126 picks up an image. In alignment step ST6, the control unit 124 of the laser processing apparatus 120 rotates around the center of the rotation drive source 127 of the laser processing apparatus 120 based on the image of the groove 211 formed in the planned division line 202 imaged by the imaging unit 126. As shown in FIG. 14, the chuck table 121 is rotated so that the groove 211 formed on one of the planned division lines 202 orthogonal to each other is parallel to the X-axis direction.

  In alignment step ST6, the control unit 124 of the laser processing apparatus 120, as shown in FIG. 13, uses the X-axis moving unit 128 and the Y-axis moving unit 125 along the outer peripheral edge of the package wafer 201 and the chuck table 121 and the imaging unit 126. Are sequentially moved, and the grooves 211 exposed at the outer peripheral edge of the package wafer 201 are sequentially imaged. In Embodiment 1, as shown in FIG. 14, in alignment step ST <b> 6, the control unit 124 causes the imaging unit 126 to image the groove 211 formed in one of the planned division lines 202 parallel to the X-axis direction. After that, the chuck table 121 is rotated 90 degrees around the axis center by the rotation drive source 127, and the control unit 124 images the groove 211 formed in the other planned division line 202 parallel to the X-axis direction in the imaging unit 126. Then, all the grooves 211 are imaged. In alignment step ST6, the control unit 124 of the laser processing apparatus 120 calculates and stores the position of the divided groove 221 formed in the groove 211 from the image of the groove 211 imaged by the imaging unit 126. In the first embodiment, the control unit 124 determines the center of the groove 211 in the width direction as the position of the dividing groove 221.

  The control unit 124 is a computer that controls each component of the laser processing apparatus 120. The control unit 124 includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device. And have. The arithmetic processing device of the control unit 124 performs arithmetic processing according to a computer program stored in the storage device, and sends a control signal for controlling the laser processing device 120 to the laser processing device 120 via the input / output interface device. To the above-described components. The control unit 124 is connected to a display means (not shown) configured by a liquid crystal display device that displays a processing operation state, an image, and the like, and an input means used when an operator registers processing content information and the like. . The input means includes at least one of a touch panel provided on the display means, a keyboard, and the like. In FIG. 13 and FIG. 14, the bump 210 is omitted.

(Divided groove forming step)
In the split groove forming step ST7, the laser beam 222 having a wavelength that absorbs the mold resin 212 is irradiated from the laser beam irradiation unit 129 along the groove 211 based on the position determined in the alignment step ST6, and the groove 211 is filled. In this step, a dividing groove 221 for dividing the package wafer 201 is formed in the molded resin 212. FIG. 15 is a plan view showing an example of the package wafer after the division groove forming step of the manufacturing method of the package device chip shown in FIG. 16 is a cross-sectional view taken along line XVI-XVI in FIG. 17 is a cross-sectional view taken along line XVII-XVII in FIG.

  The laser beam 222 irradiated to the surface 209 of the package wafer 201 held by the holding surface 122 of the chuck table 121 by the laser beam irradiation unit 129 is absorbable with respect to the mold resin 212 filled in the groove 211 of the package wafer 201. It is a pulsed laser beam having a wavelength (for example, 355 nm) and a constant laser power. The wavelength of the laser beam 222 may be 532 nm or the like, and may be any wavelength within the range of 200 nm to 1200 nm that is absorbed by the mold resin 212.

  In the split groove forming step ST7, the control unit 124 of the laser processing apparatus 120 is based on the position obtained by determining the laser beam irradiation unit 129 and the chuck table 121 in the X-axis moving unit 128 and the Y-axis moving unit 125 in the alignment step ST6. The laser beam 222 is irradiated from the laser beam irradiation unit 129 onto the mold resin 212 filled in the groove 211 while being relatively moved along the respective division lines 202. In the division groove forming step ST7, the control unit 124 of the laser processing apparatus 120 performs each division schedule while the laser beam irradiation unit 129 is relatively moved a plurality of times along each division schedule line 202 along the X-axis direction. A laser beam 222 is applied to the mold resin 212 in the groove 211 of the line 202. The number of times the laser beam irradiation unit 129 is relatively moved along each scheduled division line 202 is the minimum number of times that the division groove 221 for dividing the mold resin 212 of the groove 211 can be formed.

  In the split groove forming step ST7, the control unit 124 of the laser processing apparatus 120 irradiates the mold resin 212 filled in the grooves 211 of all the planned split lines 202 with the laser beam 222 to ablate the package wafer 201. Then, the dividing groove 221 is formed in the mold resin 212 filled in the groove 211 of the planned dividing line 202.

  Most of the divided grooves 221 (hereinafter denoted by reference numeral 221-1) formed in the mold resin 212 in the grooves 211 of the division line 202 of the package wafer 201 after the divided groove forming step ST7 are shown in FIGS. As shown in FIG. 8, the mold resin 212 filled in the groove 211 is penetrated. However, since the number of times the laser beam irradiation unit 129 is relatively moved along each division planned line 202 is the minimum number of times that the division grooves 221 can be formed, the package wafer 201 after the division groove formation step ST7 is not included. As shown in FIG. 15 and FIG. 16, a part of the formed dividing groove 221 (hereinafter, indicated by reference numeral 221-2) has the uncut portion 224 of the mold resin 212 left on the groove bottom of the dividing groove 221. The dividing groove 221 may not penetrate the mold resin 212 filled in the groove 211. In this specification, a region penetrating the mold resin 212 in the dividing groove 221 of the package wafer 201 is referred to as a region 221-1 completely cut by the dividing groove 221, and the mold is formed on the groove bottom of the dividing groove 221 of the package wafer 201. The region where the resin 212 remains is referred to as an incompletely cut region 221-2 or an incompletely cut region 221-2. In FIG. 15, a completely cut region 221-1 of the dividing groove 221 formed in the planned dividing line 202 is shown by a white background, and the divided groove 221 formed in the scheduled dividing line 202 is an incompletely cut region. 221-2 is indicated by parallel diagonal lines. In FIG. 15, the bump 210 is omitted.

(Complete cutting confirmation step)
The complete cut confirmation step ST8 is a step for confirming whether or not the uncut portion 224 remains on the bottom of the divided groove 221 and the incompletely cut region 221-2 is generated in the package wafer 201. 18 is a side view showing a complete cutting confirmation step of the method for manufacturing the package device chip shown in FIG.

  In the first embodiment, in the complete cutting confirmation step ST8, as shown in FIG. 18, the light source 225 is arranged on the back surface 214 side of the package wafer 201, and the operator located on the front surface 209 side emits the light of the light source 225 through the dividing groove 221. Whether or not an incompletely cut region 221-2 is generated in the package wafer 201 is confirmed based on whether or not it can be visually observed. However, in the present invention, a light source 225 and an imaging device (not shown) are arranged with the package wafer 201 interposed therebetween, and image processing is performed on an image captured by the imaging device, so that an incompletely cut region 221-2 is formed in the package wafer 201. It may be confirmed whether or not the above has occurred. Further, according to the present invention, the light source 225 is built in the chuck table 121, the holding surface 122 is made of a transparent material, and the light source 225 is turned on in the complete cutting confirmation step ST8, so that the operator's visual or imaging device can be used. It may be confirmed whether or not an incompletely cut region 221-2 is generated in the package wafer 201 with an image in which the message is played.

(Breaking step)
The breaking step ST9 is a package wafer in which both the region 221-1 completely cut by the dividing groove 221 and the region 221-2 which has been cut incompletely due to the remaining uncut portion 224 are confirmed in the complete cutting confirmation step ST8. In this step, the expanded tape 219 is expanded to break the uncut portion 224 of the dividing groove 221 along the planned dividing line 202 to obtain the package device chip 203 from the package wafer 201. FIG. 19 is a cross-sectional view showing a state in which the package wafer is fixed to the breaking device in the breaking step of the package device chip manufacturing method shown in FIG. FIG. 20 is a cross-sectional view showing a package wafer divided into a plurality of package device chips by a breaking step of the package device chip manufacturing method shown in FIG.

  In the breaking step ST9, the package wafer 201 is conveyed to the breaking device 130 while being supported by the annular frame 220, and the annular frame 220 is sandwiched and fixed to the clamp part 131 of the breaking device 130. Then, in the breaking step ST9, as shown in FIG. 19, after the pressing member 132 of the breaking device 130 is brought into contact with the expanded tape 219, the pressing member 132 is raised as shown in FIG. Is expanded in the plane direction. Thereby, the breaking step ST9 applies an external force toward the surface direction of the expanded tape 219, that is, the radial direction of the package wafer 201, to the package wafer 201, and between the package device chips 203 in the completely cut region 221-1. While increasing the interval, the uncut portion 224 of the region 221-2 that has been incompletely cut is broken along the planned division line 202, and individual package device chips 203 are obtained from the package wafer 201.

  Thereafter, the divided package device chip 203 is conveyed to the next process while being adsorbed on the expanded tape 219. Further, the breakage step ST9 is performed on the package wafer 201 having only the completely cut area 221-1, that is, the incomplete area 221-2 is not confirmed in the complete cut confirmation step ST8. Instead, it may be conveyed to the next process. In the next step, when the package device chips 203 are peeled from the expanded tape 219, for example, if a plurality of package device chips 203 are sucked using a vacuum pad, the plurality of package device chips 203 are collectively removed from the expand tape 219. Can be peeled off.

  In the manufacturing method according to the first embodiment, the expanded tape 219 is expanded at the breaking step ST9 with respect to the package wafer 201 in which the region 221-2 that has been incompletely cut occurs, and the uncut portion 224 is changed to the planned division line 202. Break along. For this reason, in the manufacturing method according to the first embodiment, even when the uncut portion 224 is present at the groove bottom of the dividing groove 221, the uncut portion 224 can be broken by the expansion of the expanded tape 219, and individual package device chips are surely obtained. The effect that it can be divided into 203 can be obtained, and the package device chip 203 in the vicinity of the region 221-2 that has been incompletely cut in the dividing groove forming step ST7 can be prevented from being discarded as a defective chip. As a result, the manufacturing method according to the first embodiment has an effect that the decrease in the yield of the package device chip 203 can be suppressed.

  In addition, the manufacturing method according to the first embodiment includes a grinding step ST3 for grinding the back surface 214 of the package wafer 201 and exposing the groove 211 to the back surface 214 after the molding step ST2 and before the mold resin removing step ST5. Prepare. For this reason, the manufacturing method according to Embodiment 1 can irradiate the mold resin 212 filled in the groove 211 with the laser beam 222 in the divided groove forming step ST7, and form the divided groove 221 at a desired position.

[Embodiment 2]
A method for manufacturing a package device chip according to the second embodiment will be described. FIG. 21 is a perspective view illustrating a package device chip manufactured by the method for manufacturing a package device chip according to the second embodiment. FIG. 22 is a flowchart showing the flow of the manufacturing method of the package device chip according to the second embodiment. FIG. 23 is a perspective view showing a reinforcing film attaching step of the manufacturing method of the package device chip shown in FIG. FIG. 24 is a perspective view showing a tape attaching step of the manufacturing method of the package device chip shown in FIG. FIG. 25 is a cross-sectional view showing an example of a cross section of the package wafer after the division groove forming step of the manufacturing method of the package device chip shown in FIG. FIG. 26 is a cross-sectional view of the package wafer after the breaking step shown in FIG. In FIG. 21 to FIG. 26, the same parts as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The package device chip manufacturing method according to the second embodiment (hereinafter simply referred to as a manufacturing direction) is a method of manufacturing the package device chip 203-2 shown in FIG. The package device chip 203-2 illustrated in FIG. 21 has the same configuration as the package device chip 203 illustrated in Embodiment 1 except that the reinforcing film 226 is attached to the entire back surface 214 of the substrate 205.

  As shown in FIG. 22, the manufacturing method according to the second embodiment includes a reinforcing film adhering step ST10 after the grinding step ST3, and the tape adhering step ST4 is different from the first embodiment except for the first embodiment. equal.

  The reinforcing film attaching step ST10 is a step of attaching a reinforcing film 226 made of a material that absorbs the wavelength of the laser beam 222 to the back surface 214 of the package wafer 201 after the molding step ST2 and before the tape attaching step ST4. . In the second embodiment, the reinforcing film attaching step ST10 attaches the reinforcing film 226 to the back surface 214 of the ground package wafer 201 as shown in FIG. 23 after the grinding step ST3. The reinforcing film 226 is made of a material that absorbs the laser beam 222 and is a chip back surface protective tape for protecting the back surface 214 of the package device chip 203 and is formed in substantially the same shape as the package wafer 201.

  Specifically, for the reinforcing film 226, a chip back surface protective tape provided with a protective film forming layer disclosed in JP-A-2004-260190 may be used. In addition, this protective film formation layer is typically a thermosetting component such as an epoxy resin or a phenol resin (or an energy ray curable component such as an ultraviolet curable resin) and a binder polymer component such as an acrylic polymer. It consists of.

  In the reinforcing film sticking step ST10, the reinforcing film 226 configured as described above is attached to the back surface 214 of the package wafer 201, and then the reinforcing film 226 is cured. For example, the reinforcing film 226 is baked at 130 ° C. using a heater and thermally cured. Thereby, the reinforcing film 226 is fixed so as not to peel from the back surface 214 of the package wafer 201. The reinforcing film 226 reinforces the thin package wafer 201 after grinding.

  After the reinforcing film sticking step ST10, the tape sticking step ST4 sticks the back surface 214 of the package wafer 201 via the reinforcing film 226 to the expanded tape 219 having the annular frame 220 stuck on the outer periphery as shown in FIG. The protective member 218 is peeled off from the surface 209.

  Further, in the completely cut region 221-1 of the dividing groove 221 formed in the dividing line 221 of the package wafer 201 after the dividing groove forming step ST7 of the manufacturing method according to the second embodiment, the dividing groove 221 is formed of the mold resin 212. And the reinforcing film 226. In addition, as shown in FIG. 25, in the region 221-2 that is incompletely cut, the uncut portion 224-2 of the reinforcing film 226 remains at the groove bottom of the dividing groove 221, and the dividing groove 221 becomes the reinforcing film 226. May not have penetrated. In the breaking step ST9 of the manufacturing method according to the second embodiment, as in the first embodiment, the breaking device 130 is applied to the package wafer 201 in which the region 221-2 that has been incompletely cut in the complete cutting confirmation step ST8 is confirmed. The expanded tape 219 is expanded and the uncut portion 224-2 of the reinforcing film 226 of the dividing groove 221 is broken along the planned dividing line 202 as shown in FIG. Thus, in the manufacturing method according to the second embodiment, in the breaking step ST9, the reinforcing film 226 is also divided (along) by the dividing groove 221. In FIG. 24, the bump 210 is omitted.

  In the manufacturing method according to the second embodiment, the uncut portion 224-2 can be broken by the expansion of the expanded tape 219, even if there is the uncut portion 224-2 at the groove bottom of the dividing groove 221 as in the first embodiment. There is an effect that it is possible to surely divide the package device chip 203 into individual package device chips 203 and to suppress a decrease in the yield of the package device chip 203.

[Embodiment 3]
A method for manufacturing a package device chip according to the third embodiment will be described. FIG. 27 is a perspective view of a wafer to be processed in the package device chip manufacturing method according to the third embodiment. In FIG. 27, the same parts as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  In the manufacturing method of a package device chip according to the third embodiment (hereinafter simply referred to as a manufacturing method), the object to be processed is the wafer 204 shown in FIG. 27, and the mold step ST2, the grinding step ST3, and the mold resin removal step ST5 are performed. Without any problem, the tape adhering step ST4, the groove forming step ST1, the alignment step ST6, the divided groove forming step ST7, the complete cutting confirmation step ST8, and the breaking step ST9 are sequentially performed.

  The wafer 204 to be processed by the manufacturing method according to the third embodiment has a surface 209 formed with a low dielectric constant insulator film (Low-k film) or a device 206 having a complementary MOS (Metal-Oxide-Semiconductor) CMOS. ) And the like. The low dielectric constant insulator film is composed of an inorganic film such as SiOF or BSG (SiOB) and an organic film that is a polymer film such as polyimide or parylene. In the manufacturing method according to the third embodiment, after the expanded tape 219 is attached to the surface 209 of the wafer 204 and the annular frame is fixed to the outer periphery of the expanded tape 219 (tape attaching step ST4), in the groove forming step ST1, The groove 211 is cut along the planned dividing line 202 from the back surface 214 side while leaving a cutting allowance of a predetermined thickness on the 209 side.

  In the manufacturing method according to the third embodiment, after the groove forming step ST1, the alignment step ST6 for detecting the division planned line 202 is performed in the same manner as in the first embodiment. In the divided groove forming step ST7, the X axis of the laser processing apparatus 120 is performed. While the chuck table 121 is moved once by the moving unit 128, the laser beam irradiation unit 129 irradiates the wafer 211 with a laser beam 222 having a wavelength that absorbs the wafer 204 into the groove 211 to cut the cutting allowance. Thus, the dividing groove 221 is formed. In the manufacturing method according to the third embodiment, as in the first embodiment, the breaking step ST9 is performed on the wafer 204 in which the region 221-2 that has been incompletely cut is confirmed.

  In the manufacturing method according to the third embodiment, as in the first embodiment, even if the uncut portion 224 is present at the bottom of the dividing groove 221, the uncut portion can be broken by the expansion of the expanded tape 219, so that each device can be reliably connected. It is possible to divide the chip into chips, thereby producing an effect that a decrease in the yield of device chips can be suppressed.

In addition, according to the manufacturing method of the package device chip according to the first to third embodiments, the following wafer processing method can be obtained.
(Appendix 1)
Wafer processing method,
A groove forming step of forming a groove along the predetermined division line on the surface of the wafer including a surface in which devices are formed in a plurality of regions partitioned into a plurality of predetermined division lines intersecting;
A mold step of filling the groove with a mold resin and coating the surface of the wafer with the mold resin to form a package wafer;
A tape attaching step of attaching an expanded tape to the back surface of the package wafer;
After the tape sticking step, removing the mold resin coated on the outer peripheral portion of the surface of the package wafer, and exposing the groove filled with the mold resin at the outer peripheral portion; and
An alignment step of determining the position of the split groove of the package wafer formed along the groove based on the groove exposed at the outer periphery;
Based on the position determined in the alignment step, a split groove forming step for forming a split groove for splitting the package wafer by irradiating the mold resin with a laser beam having a wavelength that absorbs the mold resin;
A complete cutting confirmation step for confirming whether or not an uncut region is generated in the package wafer by leaving an uncut portion at the bottom of the divided groove;
In the complete cutting confirmation step, the expanded tape is expanded with respect to the package wafer in which both the area completely cut by the dividing groove and the area that has been cut incompletely due to the remaining uncut portion are confirmed. Breaking the uncut portion of the divided groove along the line to be divided, and obtaining the package device chip from the package wafer.
(Appendix 2)
Wafer processing method,
A groove forming step of forming a groove along the planned division line on a wafer having a surface on which a device is formed in a plurality of regions partitioned into a plurality of planned division lines intersecting;
A tape attaching step for attaching an expanded tape to the wafer;
An alignment step of determining the position of the dividing groove of the wafer formed along the groove based on the exposed groove;
Based on the position determined in the alignment step, a laser beam having an absorptive wavelength is irradiated along the groove, and a split groove forming step for forming a split groove for splitting the wafer;
A complete cutting confirmation step for confirming whether an incompletely cut region is generated on the wafer, with the uncut portion remaining on the groove bottom of the divided groove;
In the complete cutting confirmation step, the expanded tape is expanded to the wafer in which both the area completely cut by the dividing groove and the area that has been cut incompletely due to the remaining uncut portion are confirmed. A breakage step of breaking the uncut portion of the dividing groove along the line to be divided and obtaining the device chip from the wafer.

  In the processing methods of Supplementary Note 1 and Supplementary Note 2, even if there are uncut portions at the bottom of the divided grooves, the uncut portions can be broken by expanding the expanded tape, and can be divided into individual package device chips or device chips reliably. There is an effect that a decrease in the yield of the package device chip or the vice chip can be suppressed.

  The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the scope of the present invention.

201 Package wafer (workpiece)
202 Scheduled division lines 203, 203-2 Package device chip 204 Wafer (workpiece)
205 Substrate 206 Device 207 Device area 208 Peripheral surplus area (peripheral part)
209 Surface 211 Groove 212 Mold resin 213 Side surface 214 Back surface 217 Mold surface 218 Protective member 219 Expanding tape 221 Divided groove 221-1 Completely cut area 221-2 Incompletely cut area, Incompletely cut area 222 Laser beam 224 , 224-2 Uncut portion 226 Reinforcing film ST1 Groove forming step ST2 Molding step ST3 Grinding step ST4 Tape adhering step ST5 Mold resin removing step ST6 Alignment step ST7 Split groove forming step ST8 Complete cut confirmation step ST9 Breaking step ST10 Reinforcing film pasting Arrival step

Claims (4)

A method for manufacturing a package device chip, comprising:
A groove forming step of forming a groove along the predetermined division line on the surface of the wafer including a surface in which devices are formed in a plurality of regions partitioned into a plurality of predetermined division lines intersecting;
A mold step of filling the groove with a mold resin and coating the surface of the wafer with the mold resin to form a package wafer;
A tape attaching step of attaching an expanded tape to the back surface of the package wafer;
After the tape sticking step, removing the mold resin coated on the outer peripheral portion of the surface of the package wafer, and exposing the groove filled with the mold resin at the outer peripheral portion; and
An alignment step of determining the position of the split groove of the package wafer formed along the groove based on the groove exposed at the outer periphery;
Based on the position determined in the alignment step, a split groove forming step for forming a split groove for splitting the package wafer by irradiating the mold resin with a laser beam having a wavelength that absorbs the mold resin;
For the package wafer in which both the region completely cut by the dividing groove and the region which has been cut incompletely due to the remaining of the uncut portion are confirmed, the expanded tape is expanded to leave the uncut portion of the dividing groove. A breakage step of breaking along the division line to obtain the package device chip from the package wafer.   After the mold step and before the mold resin removing step, a protective member was attached to the mold surface side of the package wafer, the back surface of the package wafer was ground and thinned, and the mold resin was filled. 2. The method of manufacturing a package device chip according to claim 1, further comprising a grinding step for exposing the groove to the back surface. A step of attaching a reinforcing film made of a material that absorbs the wavelength of the laser beam on the back surface of the package wafer after the molding step and before the tape attaching step;
The method for manufacturing a package device chip according to claim 1, wherein in the dividing groove forming step, the reinforcing film is also divided by the dividing grooves. A device chip manufacturing method comprising:
A groove forming step of forming a groove along the planned division line on a wafer having a surface on which a device is formed in a plurality of regions partitioned into a plurality of planned division lines intersecting;
A tape sticking step for sticking an expanded tape to the surface of the wafer;
An alignment step of determining the position of the dividing groove of the wafer formed along the groove based on the exposed groove;
Based on the position determined in the alignment step, a laser beam having an absorptive wavelength is irradiated along the groove, and a split groove forming step for forming a split groove for splitting the wafer;
A complete cutting confirmation step for confirming whether an incompletely cut region is generated on the wafer, with the uncut portion remaining on the groove bottom of the divided groove;
In the complete cutting confirmation step, the expanded tape is expanded to the wafer in which both the area completely cut by the dividing groove and the area that has been cut incompletely due to the remaining uncut portion are confirmed. A breakage step of breaking the uncut portion of the divided groove along the planned dividing line, and obtaining the device chip from the wafer.

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