TW201614251A - Electronic component transporting device and electronic component inspecting device - Google Patents

Electronic component transporting device and electronic component inspecting device

Info

Publication number
TW201614251A
TW201614251A TW104132623A TW104132623A TW201614251A TW 201614251 A TW201614251 A TW 201614251A TW 104132623 A TW104132623 A TW 104132623A TW 104132623 A TW104132623 A TW 104132623A TW 201614251 A TW201614251 A TW 201614251A
Authority
TW
Taiwan
Prior art keywords
electronic component
inspecting
holding part
transporting device
inspecting device
Prior art date
Application number
TW104132623A
Other languages
Chinese (zh)
Other versions
TWI641848B (en
Inventor
Satoshi Nakamura
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW201614251A publication Critical patent/TW201614251A/en
Application granted granted Critical
Publication of TWI641848B publication Critical patent/TWI641848B/en

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)

Abstract

This invention provides an electronic component inspecting device, comprising: a holding part abutted against an electronic component with a terminal for holding the electronic component and heating the electronic component; and an inspecting part having a holding part capable of cooling the terminal and inspecting the electronic component. The heating period implemented by using the holding part and the cooling period implemented by using the holding part can be repeated.
TW104132623A 2014-10-06 2015-10-02 Electronic component conveying device and electronic component inspection device TWI641848B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014205492A JP2016075550A (en) 2014-10-06 2014-10-06 Electronic component conveyance device and electronic component inspection device
JP2014-205492 2014-10-06

Publications (2)

Publication Number Publication Date
TW201614251A true TW201614251A (en) 2016-04-16
TWI641848B TWI641848B (en) 2018-11-21

Family

ID=55951284

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104132623A TWI641848B (en) 2014-10-06 2015-10-02 Electronic component conveying device and electronic component inspection device

Country Status (2)

Country Link
JP (1) JP2016075550A (en)
TW (1) TWI641848B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI676584B (en) * 2018-03-02 2019-11-11 台灣愛司帝科技股份有限公司 Chip pick-and-place apparatus and chip pick-and-place and detection system
TWI706140B (en) * 2017-12-26 2020-10-01 日商精工愛普生股份有限公司 Electronic component conveying device and electronic component inspection device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117706340B (en) * 2024-02-18 2024-04-16 深圳市森美协尔科技有限公司 Fork arm assembly and wafer probe station

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5290134A (en) * 1991-12-03 1994-03-01 Advantest Corporation Pick and place for automatic test handler
WO2003058264A1 (en) * 2001-12-27 2003-07-17 Formfactor, Inc. Cooling assembly with direct cooling of active electronic components
JP5161870B2 (en) * 2008-03-27 2013-03-13 株式会社アドバンテスト Socket guide, socket unit, electronic component test apparatus, and socket temperature control method
US8058888B2 (en) * 2009-10-13 2011-11-15 Nanya Technology Corporation Test apparatus for electronic device package and method for testing electronic device package
TWI414798B (en) * 2010-05-21 2013-11-11 Hon Tech Inc Testing and classifying machine for testing electronic elements at high and lower temperature
JP5941713B2 (en) * 2012-03-14 2016-06-29 東京エレクトロン株式会社 Wafer inspection interface and wafer inspection apparatus
TW201423899A (en) * 2012-12-14 2014-06-16 Hon Tech Inc Electric component pressing mechanism and testing facility applying the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI706140B (en) * 2017-12-26 2020-10-01 日商精工愛普生股份有限公司 Electronic component conveying device and electronic component inspection device
TWI676584B (en) * 2018-03-02 2019-11-11 台灣愛司帝科技股份有限公司 Chip pick-and-place apparatus and chip pick-and-place and detection system

Also Published As

Publication number Publication date
TWI641848B (en) 2018-11-21
JP2016075550A (en) 2016-05-12

Similar Documents

Publication Publication Date Title
PH12017500861A1 (en) Anti-interleukin-33 antibodies and uses thereof
PL3490193T3 (en) Terminal rule engine device and terminal rule operation method
MY193661A (en) Anti-tim3 antibodies and methods of use
BR112016018751A2 (en) gas supply device, hydrogen station, and gas supply method.
IL257580B (en) Purge device, purge stocker, and purge method
EP3217424A4 (en) Electroconductive assembly for electronic component, semiconductor device in which said assembly is used, and method for manufacturing electroconductive assembly
EP3391175A4 (en) Electronic device with cradling function
EP3550310A4 (en) Contact terminal, inspection jig, and inspection device
EP3344022A4 (en) Electronic device having metal case and metal case used for same
AU358903S (en) Housing for an electronic device
EP3391182A4 (en) Electronic device and cradle therefore
EP3550812C0 (en) Electronic device and method for delivering message by same
CL2016002754A1 (en) Treatment device and treatment procedure for pickling and phosphating metal parts
HK1222226A1 (en) Electronic component transporting device
MX2016016233A (en) Anti-lgr5 antibodies and uses thereof.
GB2526825B (en) An integrated circuit with interface circuitry, and an interface cell for such interface circuitry
TWI561143B (en) Housing, manufacture method of the housing and electronic device using the same
HK1255058A1 (en) Systems, devices, and methods for interactions with an account
EP3232755A4 (en) Component housing member, and component housing method
GB201409673D0 (en) An apparatus for transporting an engine
TR201909125T4 (en) AN APPARATUS FOR CLEANING THE SURFACE
TW201614251A (en) Electronic component transporting device and electronic component inspecting device
GB2543197A (en) Methods and apparatus for controlling metals in liquids
GB201621079D0 (en) Semiconductor device, electronic component and method
GB2556675B (en) Vapour chamber with ring geometry for cooling an electronic device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees