TW201614251A - Electronic component transporting device and electronic component inspecting device - Google Patents
Electronic component transporting device and electronic component inspecting deviceInfo
- Publication number
- TW201614251A TW201614251A TW104132623A TW104132623A TW201614251A TW 201614251 A TW201614251 A TW 201614251A TW 104132623 A TW104132623 A TW 104132623A TW 104132623 A TW104132623 A TW 104132623A TW 201614251 A TW201614251 A TW 201614251A
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- inspecting
- holding part
- transporting device
- inspecting device
- Prior art date
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
This invention provides an electronic component inspecting device, comprising: a holding part abutted against an electronic component with a terminal for holding the electronic component and heating the electronic component; and an inspecting part having a holding part capable of cooling the terminal and inspecting the electronic component. The heating period implemented by using the holding part and the cooling period implemented by using the holding part can be repeated.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014205492A JP2016075550A (en) | 2014-10-06 | 2014-10-06 | Electronic component conveyance device and electronic component inspection device |
JP2014-205492 | 2014-10-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201614251A true TW201614251A (en) | 2016-04-16 |
TWI641848B TWI641848B (en) | 2018-11-21 |
Family
ID=55951284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104132623A TWI641848B (en) | 2014-10-06 | 2015-10-02 | Electronic component conveying device and electronic component inspection device |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2016075550A (en) |
TW (1) | TWI641848B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI676584B (en) * | 2018-03-02 | 2019-11-11 | 台灣愛司帝科技股份有限公司 | Chip pick-and-place apparatus and chip pick-and-place and detection system |
TWI706140B (en) * | 2017-12-26 | 2020-10-01 | 日商精工愛普生股份有限公司 | Electronic component conveying device and electronic component inspection device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117706340B (en) * | 2024-02-18 | 2024-04-16 | 深圳市森美协尔科技有限公司 | Fork arm assembly and wafer probe station |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5290134A (en) * | 1991-12-03 | 1994-03-01 | Advantest Corporation | Pick and place for automatic test handler |
WO2003058264A1 (en) * | 2001-12-27 | 2003-07-17 | Formfactor, Inc. | Cooling assembly with direct cooling of active electronic components |
JP5161870B2 (en) * | 2008-03-27 | 2013-03-13 | 株式会社アドバンテスト | Socket guide, socket unit, electronic component test apparatus, and socket temperature control method |
US8058888B2 (en) * | 2009-10-13 | 2011-11-15 | Nanya Technology Corporation | Test apparatus for electronic device package and method for testing electronic device package |
TWI414798B (en) * | 2010-05-21 | 2013-11-11 | Hon Tech Inc | Testing and classifying machine for testing electronic elements at high and lower temperature |
JP5941713B2 (en) * | 2012-03-14 | 2016-06-29 | 東京エレクトロン株式会社 | Wafer inspection interface and wafer inspection apparatus |
TW201423899A (en) * | 2012-12-14 | 2014-06-16 | Hon Tech Inc | Electric component pressing mechanism and testing facility applying the same |
-
2014
- 2014-10-06 JP JP2014205492A patent/JP2016075550A/en active Pending
-
2015
- 2015-10-02 TW TW104132623A patent/TWI641848B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI706140B (en) * | 2017-12-26 | 2020-10-01 | 日商精工愛普生股份有限公司 | Electronic component conveying device and electronic component inspection device |
TWI676584B (en) * | 2018-03-02 | 2019-11-11 | 台灣愛司帝科技股份有限公司 | Chip pick-and-place apparatus and chip pick-and-place and detection system |
Also Published As
Publication number | Publication date |
---|---|
TWI641848B (en) | 2018-11-21 |
JP2016075550A (en) | 2016-05-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |