TW201423899A - Electric component pressing mechanism and testing facility applying the same - Google Patents

Abstract

An electric component pressing mechanism is assembled below the temperature control mechanism of the material moving unit and comprises a press bonding device and a picker. The press bonding device is connected to the temperature control mechanism and disposed with a containing space therein and at least one propping portion passing through the containing space to press the electric component. In addition, at least one first transmission member electrically connected to the electric component and the tester is disposed at the bottom of the press bonding device. The picker is assembled in the containing space of the press bonding device and has at least one taking portion containing a vacuum extraction hole and penetrating through the containing space. The taking portion uses the vacuum extraction hole passed by the propping portion of the press bonding device and has a height potential difference associated with the propping portion so as to take and place the electric component. Accordingly, the taking portion of the picker used at the pressing mechanism moves the electric component so that after the first contact at one side of the electric component is electrically connected to the tester, the second contact of the electric component and the tester is electrically connected by the first transmission member of the press bonding device and the tester to execute testing operation. Further, the propping portion of the press bonding device in the taking portion of the picker performs a first direction displacement to press the chip of the electric component to carry out temperature conduction for larger contact area together with the chip, thereby achieving practical benefits of easily testing the electric component having dual face contacts and improving the temperature control performance.

Description

Electronic component pressing mechanism and test equipment thereof

The invention provides an electronic component pressing mechanism which is easy to test electronic components with double-sided contacts and increases temperature-controlled conduction area to improve temperature control performance.

In today's world, electronic components are becoming more and more sophisticated. In the case of ICs with solder balls, a plurality of solder balls are soldered on the substrate of the IC to replace the pins of the conventional lead frame, and the size of the IC is reduced. IC, the arrangement of the solder balls is also different; please refer to Figure 1-1, which is an IC11 with a single-sided solder ball. The IC11 is provided with a wafer 112 on the top surface of the substrate 111, and is arranged on the bottom surface. There are a plurality of solder balls 113; see FIG. 1-2, which is an IC12 with a double-sided solder ball. The IC 12 is provided with a wafer 122 on the top surface of the substrate 121, and has a plurality of rings around the wafer 122. a first solder ball 123, and a plurality of second solder balls 124 are soldered and arranged on the bottom surface of the substrate 121; however, referring to FIG. 2, it is a test device for electronic components, which is disposed on the machine 13 The test device 14 of the electrical connection tester (not shown) is provided with a transfer unit 15 for transferring electronic components above the test device 14, wherein the test device 14 is provided with an electrical connection tester. The test circuit board 141 is mounted on the test circuit board 141 with a test socket 142 having at least one probe 143 for testing the IC1. 1. The material moving unit 15 is provided with a temperature control mechanism 152 under the moving arm 151. A pick-and-placer 153 having an air venting hole 1531 and a sensing member 1532 is disposed under the temperature control mechanism 152 for transferring the IC11. When the test operation is performed, the pick-and-place unit 153 of the loading unit 15 is affixed to the wafer 112 of the IC 11 to be tested by using the air vent 1531, and the IC 11 to be tested is placed in the test socket 142 of the testing device 14 so that The solder balls 113 of the IC 11 to be tested are in contact with the probes 143 of the test socket 142 to perform the test operation; however, the test device only has the test socket 142 of the test device 14 having the probe 143, so that it is only suitable for the single-sided tin. The ball IC10 test operation, and can not test the IC with double-sided solder ball, the industry can not ensure the quality of the IC with double-sided solder ball, in addition, some ICs are small, the area of the chip can be contacted Limited, when pick and place When the plurality of air holes 1531 of the device 153 occupy a large contact area of the wafer, the contact conduction area of the wafer for cold heat exchange is relatively reduced, so that the IC cannot effectively dissipate heat, resulting in a decrease in the temperature control performance.

An object of the present invention is to provide an electronic component pressing mechanism which is mounted under the temperature control mechanism of the material moving unit and includes a crimper and a pickup, and the crimping device is provided with at least one pressed electronic component. The abutting portion is provided with at least one first connecting member electrically connected to the electronic component and the tester, the picker is mounted on the crimping device, and is provided with at least one venting portion for taking out the air receiving portion The air venting hole is provided for the abutting portion of the crimping device, and has a height difference with the abutting portion for picking and placing the electronic component; thereby, the pressing mechanism moves the electronic component with the picking portion of the picking device, After the first contact on one side of the electronic component is electrically connected to the tester, the first transfer member of the crimper is electrically connected to the second contact of the electronic component and the tester to perform the test operation, so that the test is easy to test with double-sided connection. Practical benefits of electronic components.

A second object of the present invention is to provide an electronic component pressing mechanism, wherein the abutting portion of the crimping device is inserted into the air venting hole of the picking portion of the picker, and is attracted to the electron at the picking portion of the picker. When the outer side of the wafer of the component is used, the temperature of the abutting portion of the crimper is made to be in contact with the wafer to increase the temperature control efficiency of the cold and heat exchange, thereby accurately controlling the electronic component to a preset test temperature range. Achieve practical benefits of improving test quality.

A third object of the present invention is to provide an electronic component pressing mechanism, wherein the crimping device and the picking device are provided with a plurality of elastic members which are springs, and are pressed against the tilted electronic body at the picking portion of the picking device. In the case of components, the pickup can compress the elastic members and tilt the electronic components to ensure vacuum extraction of the electronic components, and in the process of transferring the electronic components, the elastic members are used to evenly push the pickup to reset the pickup and maintain a smooth state. Transfer electronic components to achieve the practical benefits of convenient transfer of electronic components.

A fourth object of the present invention is to provide an electronic component pressing mechanism, wherein the pressing mechanism can use a pickup to transfer a electronic component with a single-sided contact to a test device according to the type of the electronic component to be tested. Carry out the test operation, or use the first transmission piece of the crimper to match the probe of the test socket, and the electric power of the double-sided contact The sub-components perform test operations and are then applicable to different types of electronic components, thereby achieving practical benefits of saving equipment costs and improving performance.

A fifth object of the present invention is to provide an electronic component pressing mechanism, wherein the picking device can move the taking portion to the outer side of the wafer of the electronic component when the electronic component with a small volume is transferred, due to the crimper The abutting portion is inserted into the air venting hole of the pick-up portion of the pick-up device, so that the abutting portion of the crimping device and the wafer of the electronic component have a large contact area temperature conduction, thereby facilitating the temperature of the small-sized electronic component. Control the operation to achieve practical benefits of improving the performance.

In order to make the present invention more fully understood by the reviewing committee, a preferred embodiment and a drawing will be described in detail as follows: Referring to FIG. 3, the electronic component pressing mechanism 20 of the present invention can be applied to a moving unit. 31. The moving unit 31 is provided with a moving arm 311 for displacement in at least a first direction (such as a Z direction) for driving the pressing mechanism 20 to be displaced. In this embodiment, between the moving arm 311 and the pressing mechanism 20 The temperature control mechanism 313 is equipped with a floating mechanism 312 and a refrigerating chip 3131 (or a heating sheet). The pressing mechanism 20 of the present invention comprises a crimping device 21 and a pickup 22, and the crimping device 21 is coupled with the temperature. The control mechanism 313 is provided with an accommodating space therein, and at least one abutting portion extending through the accommodating space for pressing the electronic component, and at least one electrical property at the bottom of the crimping device 21 In the embodiment, the crimping device 21 is provided with a pressing member 211 coupled to the temperature control mechanism 313. The inside of the pressing member 211 has an air suction line 2111. And at least one abutting portion 2112 pressed against the electronic component, and below the pressing member 211 There is a socket, the receiving device is provided with an accommodating space, and the abutting portion 2112 of the pressing member 211 is extended, and the bottom of the receiving device is provided with at least one electrical connecting electronic component and a tester. The first transmission member is provided with a first carrier 212 coupled to the pressing member 211. The first carrier 212 is provided with an accommodating space 2121 and is provided by the pressing member 211. The connecting portion 2112 extends through the accommodating space 2121, and the second carrier member 213 having the loading portion 2131 is disposed under the first carrier member 212. The second carrier member 2 The loading unit 2131 of the loading unit 2131 is configured to receive the electronic component to be tested, and is provided with a guiding portion 2132 on the side of the opening of the loading portion 2131 for guiding the electronic component to be placed in the loading portion 2131. The top surface of the inlet portion 2131 is provided with a plurality of first transmission members 214 for electrically connecting the electronic components and the tester. Further, the first transmission member 214 is electrically connected to the tester via the circuit board. The circuit board can be mounted on the first carrier 212 or the second carrier 213 or between the first and second carriers 212 and 213. In this embodiment, the first transmission member 214 is electrically connected to the first component. The circuit board 215 between the first and second carrying members 212 and 213, and the circuit board 215 is provided with at least one second transmitting member 216 for electrically connecting the first transmitting member 214 and the tester. In this embodiment, One end of the two transmission members 216 is connected to the circuit board 215, and the other end protrudes from the bottom surface of the second carrier 213 and is located on the outer side of the loading portion 2131. The pickup 22 is mounted on the receiving space of the crimper 21. 2121, and is provided with at least one air venting hole and extending through the receiving portion of the accommodating space 2121, and the taking portion is drawn The hole is provided with the abutting portion 2112 of the crimping device 21 and has a high and low level difference with the abutting portion 2112 for picking and placing the electronic component. In the embodiment, the picking device 22 is provided with at least one span. The blocking portion 221 of the housing 21 is accommodated in the space 2121. The receiving portion 222 is disposed on the bottom surface of the blocking portion 221. The inside of the receiving portion 222 is provided with a suction hole of the air suction conduit 2111 of the crimping device 21. 223, the venting hole 223 is used to pass through the abutting portion 2112 of the crimping device 21, and the accommodating portion 222 and the abutting portion 2112 have a high and low level difference for picking and placing electronic components, and the picking device 22 and pressing At least one elastic member is disposed between the pressing members 211 of the connector 21, and the elastic member can be a spring. In the embodiment, the retaining portion 221 of the picker 22 is provided with a receiving groove 224, and is received by the picker 22. A plurality of spring members 225 are disposed between the groove 224 and the pressing member 211 of the crimping device 21, and the pressing mechanism 20 is further included in the abutting portion 2112 of the crimping device 21 for assembling the inductor 23 for The temperature of the inductive electronic component.

Referring to FIG. 4, the pressing mechanism 20 of the present invention can be applied to transfer electronic components 40 of double-sided solder balls. The electronic component 40 is provided with a first solder ball 41 on the bottom surface and a wafer on the top surface. 42 and the second solder ball 43 when the pressing mechanism 20 desires When the electronic component 40 is transferred, the top surface of the electronic component 40 or the wafer 42 can be contacted by the receiving portion 222 of the pickup 22, and when the receiving portion 222 of the pickup 22 contacts the outside of the wafer 42 adsorbed on the electronic component 40. The contact portion 222 is located outside the wafer 42 of the electronic component 40, and the abutting portion 2112 of the crimper 21 is inserted into the air vent 223 of the receiving portion 222, so that the abutting portion 2112 of the crimper 21 The temperature is transmitted to the wafer 42 of the electronic component 40 for a large contact area. In the embodiment, when the pickup 22 contacts the wafer 42 of the electronic component 40 with the receiving portion 222, the abutment portion of the crimper 21 can be made. 2112 and the sensor 23 are located above the wafer 42. Since the air vent 223 of the pickup 22 communicates with the air suction line 2111 of the crimper 21, the accommodating portion 222 can suck the electronic component 40 by using the air venting hole 223, and the pick-up device. When the positioning portion 222 of the 22 is pressed against the tilted electronic component 40, the pickup 22 can compress the spring 225 and tilt the electronic component 40 to ensure that the electronic component 40 is vacuum-absorbed, and the moving arm 311 of the loading unit 31 can be Driving the pressing mechanism 20 to displace the pressing mechanism 20 to the electronic component 40 Loaded above the test device 50, and during the transfer of the electronic component 40, the slider 22 is evenly pushed by the springs 225 to reset the pickup 22 to maintain the smooth transfer electronic component 40; see Figure 5, The test device 50 is provided with a test circuit board 51 electrically connected to a tester (not shown). The test circuit board 51 is provided with at least one test seat 52. The test set 52 has an open-ended test inside. The space 521 is provided with a plurality of probes 522 electrically connected to the test circuit board 51 on the bottom surface of the test space 521, and a guide slope 523 is disposed at the opening of the test space 521, and is disposed on the top surface of the test seat 52. There is a plurality of electrical connection test circuit board 51 of the guiding member 524. The moving unit 31 drives the pressing mechanism 20 and the electronic component 40 to move in the first direction, and the electronic component 40 is placed in the testing device. The test space 521 of the test socket 52 is 50, and the electronic component 40 is guided by the guide slope 523 of the test socket 52 to be accurately placed, so that the first solder ball 41 of the electronic component 40 contacts the probe 522 of the test socket 52, And electrically connected to the tester via the test circuit board 51; Referring to FIG. 6, the moving arm 311 of the loading unit 31 continues to drive the pressing mechanism 20 and the electronic component 40. When the first direction is displaced, since the first solder ball 41 of the electronic component 40 is pressed against the probe 522 of the test socket 52, the electronic component 40 is pushed by the reaction force of the probe 522 of the test socket 52, and the pickup 22 is pushed. The first direction is upwardly displaced, so that the blocking portion 221 of the pickup 22 is buffer-displaced in the accommodating space 2121 of the crimper 21, and the spring 225 is compressed, and the other crimper 21 is guided by the second carrier 213. The 2132 guiding electronic component 40 is moved into the loading unit 2131 to fine-tune the position, so that the second solder ball 43 of the electronic component 40 corresponds to the first transmitting member 214 of the crimper 21, and the first transmitting member 214 of the crimper 21 is Contacting the second solder ball 43 of the electronic component 40 and contacting the soldering member 524 of the test socket 52 with the second transmitting member 216, since the first transmitting member 214 of the crimping device 21 is electrically connected to the second transmission by the circuit board 215 The second transmission member 216 is electrically connected to the tester via the terminal 524 of the test socket 52 and the test circuit board 51, so that the second solder ball 43 of the electronic component 40 utilizes the first transmission component of the crimper 21. 214 electrical connection tester; see Figure 7, the moving arm 311 of the transfer unit 31 continues to drive the press The structure 20 and the electronic component 40 are displaced in the first direction. Since the abutting portion 2112 of the crimping device 21 and the receiving portion 222 of the pickup 22 have a high level difference, the crimper 21 can take the first direction by using the moving arm 311. Displaceing downward, and compressing the spring 225, the abutting portion 2112 is pressed against the wafer 42 of the electronic component 40, and the inductor 23 is brought into contact with the wafer 42 of the electronic component 40 to transmit the sensed temperature data to the central control device (Fig. The first ball 41 on the bottom surface of the electronic component 40 is electrically connected to the tester by the probe 522 of the test socket 52, and the second ball 43 on the top surface is the first of the crimper 21. The two transmitting members 214 and 216 and the guiding member 524 of the test socket 52 are electrically connected to the testing device, so that the electronic component 40 performs a testing operation in the test socket 52. Since the abutting portion 2112 of the crimping device 21 is located at the picking device 22 In the air vent 223, the wafer 42 of the electronic component 40 can be in contact with a larger temperature-controlled conductive area. When the wafer 42 of the electronic component 40 is heated by the test operation, the temperature control mechanism is connected to the upper portion of the crimper 21. 313 of the cold wafer 3131, the abutment portion 2112 of the crimper 21 is the wafer 42 The high temperature is conducted to the cooled wafer 3131 of the temperature control structure 313 for a cold heat exchange to accurately The electronic component 40 is controlled to a preset temperature control range, thereby improving the temperature control performance.

Please refer to FIG. 8 , which is an embodiment of the pressing mechanism 20 applied to the electronic component testing device. The testing device includes a machine 60 , a feeding device 70 , a receiving device 80 , a testing device 90 , a conveying device 100 , and an empty device . The device 110 and the central control device are disposed on the machine 60 for accommodating at least one electronic component to be tested. In this embodiment, the feeding device 70 is provided with at least one electronic component to be tested. The receiving device 80 is disposed on the machine table 60 for accommodating at least one completed electronic component. In the embodiment, the receiving device 80 is provided with at least one material for holding the electronic component. The test device 90 is provided with a test circuit board 91 electrically connected to a tester (not shown), and the test circuit board 91 is provided with at least one test seat 92 for testing electronic components and testing The test device transmits the test result to a central control device (not shown), and the central control device controls the operation of each device; the transport device 100 is provided with at least one transfer unit for picking up and transferring electronic components, and the transfer unit Equipped with a pressing mechanism 20, the pressing machine 20 is the same as the above-mentioned pressing mechanism. In this embodiment, the first loading unit 101 having the first loading stage 1011 and the first discharging stage 1012 is provided on one side of the testing device 90, the first input The discharge loading platforms 1011 and 1012 are arranged to be displaced in the second direction (such as the X direction) for respectively carrying the electronic components to be tested/completed, and the second loading platform is provided on the other side of the testing device 90. The second loading unit 102 of the 1021 and the second discharging stage 1022, the second loading and discharging stations 1021 and 1022 are respectively displaced in the second direction for respectively carrying the electronic components to be tested/tested, and First and second moving units 103 and 104 are respectively disposed on two sides of the testing device 90, and the first moving unit 103 is provided with a first moving arm for displacement in the first direction and displacement in the third direction (such as the Y direction). 1031, a first temperature control mechanism 1032 having a cooling chip (or a heating sheet) is mounted under the first moving arm 1031, and the pressing mechanism 20 of the present invention is assembled under the first temperature control mechanism 1032 (please cooperate Referring to FIG. 3), the first moving unit 103 is attached to the first loading and discharging station 1011, 1012 and the testing device 9 The electronic component to be tested/tested is transferred between 0, the second moving unit 104 is provided with a second moving arm 1041 for the first and third directions, and the second moving arm 1041 is equipped with a cooling chip (hereinafter) Or heating the second temperature control mechanism 1042 of the sheet, and the lower portion of the second temperature control mechanism 1042 is equipped with the pressing mechanism 20 of the present invention (please refer to FIG. 3), and the second moving unit 104 is second. The electronic components to be tested/completed are transferred between the loading and unloading stages 1021 and 1022 and the testing device 90, and the other conveying device 100 is provided with a first moving unit 105 and a second moving unit 106, and the first moving unit 105 is The first pick-and-placer 1051 for the first, second and third directions is arranged to transfer the electronic component to be tested of the feeding device 70 to the first and second loading stations 1011 and 1021, and the second moving unit The 106 series is provided with a second pick-and-placer 1061 for shifting the first, second and third directions for transferring the electronic components of the first and second discharge stages 1012 and 1022 to the receiving device 80 for sorting. The open space device 110 is for receiving the empty tray of the feeding device 70, and replenishing the empty tray to the receiving device 80 for loading The electronic component.

Referring to FIG. 9, the first moving unit 105 of the conveying device 100 takes out the electronic component 40 to be tested at the tray 71 of the feeding device 70 with the first pick-and-placer 1051, and transfers the electronic component 40 to be tested. The first loading stage 1011 of the first carrier unit 101; referring to FIG. 10, the first loading stage 1011 of the first carrier unit 101 carries the electronic component 40 to be tested to the testing device 90. The first moving arm 1031 of the first moving unit 103 drives the pressing mechanism 20 to perform displacement in the first and third directions, and the electronic component 40 to be tested is taken out at the first loading stage 1011 and moved. The first moving unit 105 continues to take the next electronic component 40A to be tested at the feeding device 70, and transfers the electronic component 40A to be tested to the second carrying unit 102. The second loading stage 1021, the second loading stage 1021 of the second carrying unit 102 carries the electronic component 40A to be tested to the other side of the testing device 90, and the second of the second moving unit 104. The moving arm 1041 drives the other pressing mechanism 20 to perform displacement in the first and third directions, and in the second loading The stage 1021 takes out the electronic component 40A to be tested; referring to FIG. 11, after the test device 90 completes the test operation, the first discharge stage 1012 moves to the side of the test device 90, and the first transfer unit 103 A moving arm 1031 drives the pressing mechanism 20 to perform displacement in the first and third directions, and the completed electronic component 40 is transferred from the testing device 90 to the first discharging stage 1012, and the second moving unit 104 is moved. The arm 1041 drives the other pressing mechanism 20 to perform displacement in the first and third directions, and the electronic component 40A to be tested is placed in the test device 90 to perform the test operation; refer to FIG. 12, in the first carrier unit. The first discharge stage 1012 of 101 carries out the electronic component 40 that has been tested, and the second transfer unit 106 takes out the electronic component 40 that has been tested by the second pick-and-place unit 1061 on the first discharge stage 1012, and transfers the electronic component 40. The trays 81 to the receiving device 80 are sorted and placed.

[study]

11‧‧‧IC

111‧‧‧Substrate

112‧‧‧ wafer

113‧‧‧ solder balls

12‧‧‧IC

121‧‧‧Substrate

122‧‧‧ wafer

123‧‧‧First Tin Ball

124‧‧‧Second Tin Ball

13‧‧‧ machine

14‧‧‧Testing device

142‧‧‧ test seat

141‧‧‧Test circuit board

143‧‧‧Probe

15‧‧‧Transfer unit

151‧‧‧ moving arm

152‧‧‧temperature control agency

153‧‧‧ picker

1531‧‧‧Pumping holes

1532‧‧‧Inductive parts

〔this invention〕

20‧‧‧Picking mechanism

21‧‧‧Crimper

211‧‧‧ Pressure parts

2111‧‧‧Exhaust line

2112‧‧‧Apartment

212‧‧‧First carrier

2121‧‧‧ accommodating space

213‧‧‧Second carrier

2131‧‧‧Loading Department

2132‧‧‧Guide

214‧‧‧First transmission

215‧‧‧ circuit board

216‧‧‧second transmission

22‧‧‧ Picker

221‧‧ ‧ blocking

222‧‧‧Removal Department

223‧‧‧Pumping holes

224‧‧‧ slots

225‧‧ ‧ spring

23‧‧‧ Sensors

31‧‧‧Transfer unit

311‧‧‧ moving arm

312‧‧‧Floating agencies

313‧‧‧temperature control agency

3131‧‧‧Cold wafer

40, 40A‧‧‧ electronic components

41‧‧‧First Tin Ball

42‧‧‧ wafer

43‧‧‧Second Tin Ball

50‧‧‧Testing device

51‧‧‧Test circuit board

52‧‧‧ test seat

521‧‧‧Test space

522‧‧‧Probe

523‧‧‧ guiding slope

524‧‧‧Connector

60‧‧‧ machine

70‧‧‧Feeding device

71‧‧‧Tray

80‧‧‧ receiving device

81‧‧‧Tray

90‧‧‧Testing device

91‧‧‧Test circuit board

92‧‧‧ test seat

100‧‧‧Conveyor

101‧‧‧First carrier unit

1011‧‧‧First feeding platform

1012‧‧‧First discharge stage

102‧‧‧Second carrying unit

1021‧‧‧Second feed stage

1022‧‧‧Second discharge stage

103‧‧‧First moving unit

1031‧‧‧First moving arm

1032‧‧‧First temperature control agency

104‧‧‧Second moving unit

1041‧‧‧second moving arm

1042‧‧‧Second temperature control mechanism

105‧‧‧First moving unit

1051‧‧‧First pick and place

106‧‧‧Second moving unit

1061‧‧‧Second pick and place

110‧‧‧Air equipment

Figure 1-1: Schematic diagram of an IC with a single-sided solder ball.

Figure 1-2: Schematic diagram of an IC with a double-sided solder ball.

Figure 2: Schematic diagram of a conventional test device test IC.

Fig. 3 is a schematic view showing the application of the press-fitting mechanism of the present invention to a transfer unit.

Fig. 4 is a schematic view showing the use of the pressing mechanism of the present invention (1).

Figure 5: Schematic diagram of the use of the pressing mechanism of the present invention (2).

Figure 6: Schematic diagram of the use of the pressing mechanism of the present invention (3).

Figure 7: Schematic diagram of the use of the pressing mechanism of the present invention (4).

Figure 8 is a schematic view of a test apparatus applying a press mechanism.

Figure 9: Schematic diagram of the use of test equipment (1).

Figure 10: Schematic diagram of the use of test equipment (2).

Figure 11: Schematic diagram of the use of test equipment (3).

Figure 12: Schematic diagram of the use of test equipment (4).

20‧‧‧Picking mechanism

21‧‧‧Crimper

2112‧‧‧Apartment

214‧‧‧First transmission

216‧‧‧second transmission

22‧‧‧ Picker

222‧‧‧Removal Department

223‧‧‧Pumping holes

225‧‧ ‧ spring

23‧‧‧ Sensors

31‧‧‧Transfer unit

311‧‧‧ moving arm

313‧‧‧temperature control agency

3131‧‧‧Cold wafer

40‧‧‧Electronic components

41‧‧‧First Tin Ball

42‧‧‧ wafer

43‧‧‧Second Tin Ball

52‧‧‧ test seat

522‧‧‧Probe

524‧‧‧Connector

Claims (10)

An electronic component pressing mechanism is mounted under the moving arm of the loading unit, and comprises: a crimping device: the connecting arm is connected to the moving arm, and the receiving space is provided therein, and at least one abutting portion is provided. Pressing the electronic component, and at least one first transmission component electrically connecting the electronic component and the tester to the bottom of the crimper; the pickup: being assembled in the accommodating space of the crimper and provided with at least A venting opening and a receiving portion extending out of the accommodating space for picking up and placing electronic components. The electronic component pressing mechanism according to claim 1, wherein the abutting portion of the crimping device extends through the accommodating space for pressing against the electronic component, and the picking portion of the picking device is The air venting hole is provided for the abutting portion of the crimping device and has a high and low level difference with the abutting portion. The electronic component pressing mechanism according to claim 1 or 2, wherein the crimping device is provided with a pressing member having at least one abutting portion, and is disposed under the pressing member. The receiving device is provided with an accommodating space, and the abutting portion of the pressing member is extended, and the bottom of the receiving device is provided with at least one first connecting member electrically connecting the electronic component and the tester . The electronic component pressing mechanism according to claim 3, wherein the first transmitting member of the crimping device is electrically connected to at least one circuit board, and the circuit board is provided with a second transmitting member for electricity The first transmission member and the test device are connected to the first transmission member, and the first carrier member is provided with a receiving space for opening the abutting portion of the pressing member. And a second carrier having at least one first transmission member is disposed under the first carrier. The electronic component pressing mechanism according to claim 3, wherein at least one elastic member is disposed between the pressing member of the crimping device and the pickup. The electronic component pressing mechanism according to claim 1 or 2, wherein the moving unit is equipped with a temperature control mechanism under the moving arm, and the crimping mechanism of the pressing mechanism is coupled to the temperature control mechanism. The electronic component pressing mechanism according to claim 1 or 2, wherein the first transmitting member of the crimping device is electrically connected to at least one circuit board, and the circuit board is provided with a second transmitting member for The first transmission member and the tester are electrically connected. The electronic component pressing mechanism according to claim 1 or 2, wherein the crimping device is provided with an air suction pipe, and the pickup device is provided with a blocking portion which is placed in a receiving space of the crimping device. And a receiving portion having a suction hole is arranged on a bottom surface of the blocking portion, and an air suction pipe of the crimping device is connected by a suction hole. The electronic component pressing mechanism according to claim 1 or 2, further comprising the pressing mechanism for assembling an inductor in the abutting portion of the crimping device for sensing the temperature of the electronic component. A testing device for applying an electronic component pressing mechanism, comprising: a machine table; a feeding device: the device is mounted on the machine table for accommodating at least one electronic component to be tested; and the receiving device is assembled on the machine table, The device is used for accommodating at least one electronic component; the test device is mounted on the machine, and has a test circuit board with a test socket for testing electronic components; and a transport device: the device is mounted on the machine. a moving unit with at least one moving arm is disposed, and at least one electronic component pressing mechanism according to claim 1 or 2 is installed under the moving arm of the moving unit for picking up and releasing the electronic Components; central control unit: used to control and integrate the various devices to perform automated operations.