TWI530698B - Test equipment for electronic component testing devices and their applications - Google Patents

Description

Electronic component testing device and test equipment thereof

The present invention provides a high temperature or low temperature test temperature that can be transmitted from the peripheral side of the transmission member of the test mechanism, and shortens the distance that the transmission member conducts the test temperature to the electronic component, and ensures the electron when the transmission member contacts the electrical contact of the electronic component. The component performs a test operation within a preset test temperature range, thereby improving the quality of the test component of the electronic component.

Nowadays, electronic components are applied to different electronic devices. Since the environment in which the electronic devices are located may be a low-temperature environment or a high-temperature environment, in order to ensure the quality of use of the electronic components, the electronic components must be cold-tested after the electronic components are manufactured. For example, in the image sensing electronic component with a photosensitive member (such as CMOS), please refer to FIG. 1 , one side of the image sensing electronic component 11 has a photosensitive member 111 which can be made of glass, and the other side There is a plurality of electrical contacts which can be solder balls 112. Since the photosensitive member 111 of the image sensing electronic component 11 may have a photosensitive abnormality due to a process problem or an application environment temperature, for example, the bright red color is misidentified as a reddish color. The image sensing electronic component 11 must be cooled or warmed up to the temperature of the simulated test operation for cold test operation or thermal test operation; however, when testing the electronic components that can be pressed against a large area, the pressure of the temperature control component is used. The resistor is pressed against the electronic component to have a large area (ie, no one side of the solder ball), so that the electronic component is heated or cooled to preset the test temperature range. The test operation is performed, but since the image sensing electronic component 11 does not have a photosensitive member 111 that is incapable of being pressed against one of the solder balls 112, the manufacturer cannot press the photosensitive member 111 with the pressure roller to make a large-area contact conduction test temperature. The operator must perform the test operation by means of the pre-warm image sensing electronic component 11.

Please refer to FIG. 2 and FIG. 3 , which are schematic diagrams of the test equipment of the image sensing electronic component 11 . The testing device is equipped with a feeding tray 13 , a receiving tray 14 , a feeding mechanism 15 and a heating tray 16 on the machine table 12 . And the testing mechanism 17, the loading mechanism 15 takes out the image sensing electronic component 11 to be tested on the feeding tray 13, and transfers it to the heating tray 16, which is the image sensing electronic component 11 to be tested. Warming up the operation, sensing the image to be tested The sub-element 11 is preheated to the test temperature, and the re-feeding mechanism 15 takes out the preheated image sensing electronic component 11 on the heating tray 16 and transfers it to the test socket 171 of the testing mechanism 17, so that the image sensing electronic component 11 The photosensitive member 111 faces upward, and the solder ball 112 is brought downward to contact the probe 172 of the test socket 171. The test mechanism 17 irradiates the photosensitive member 111 of the image sensing electronic component 11 with the light source 173 to perform a test operation, after the test operation is completed. The loading mechanism 15 takes out the measured image sensing electronic component 11 in the test socket 171 of the testing mechanism 17, and transfers it to the receiving tray 14 for storage; however, the testing device uses the heating disk 16 to preheat the image sensing. The electronic component 11, but the transfer mechanism 15 transfers the preheated image sensing electronic component 11 to the test 171 of the test mechanism 17, and the image sensing electronic component 11 is gradually cooled down, so that the image sensing electronic When the component 11 is placed in the test socket 171 of the testing mechanism 17, the test operation cannot be performed at the preset test temperature, and the quality of the test is affected.

If the photosensitive member 111 based on the image sensing electronic component 11 cannot be heated and pressurized, and the temperature of the end of the probe 172 is heated, the probe 172 is used to conduct the high temperature to the solder ball 112, so that the image sensing electronic component 11 is enabled. The test operation is performed while the temperature is raised, but the probe 172 of the test mechanism 17 has a long length, and when one end of the probe 172 conducts the high temperature to the other end, the heat transfer distance is long and the heat is cooled and cooled, so that the image sensing electronic component cannot be made. 11 Perform the test operation at the preset test temperature to influence the test quality.

An object of the present invention is to provide an electronic component testing device, comprising a temperature control mechanism and a testing mechanism, wherein the temperature control mechanism is provided with at least one temperature controller for outputting a high temperature or low temperature test temperature, and one of the temperature controllers is assembled. There is a carrier, the inside of the carrier is provided with at least one temperature guiding member, and at least one conducting member is connected between the temperature guiding member and the temperature controller to conduct the test temperature of the temperature controller to the temperature guiding member, the testing mechanism The utility model is provided with at least one bearing component for mounting electronic components, and at least one transmission component for connecting the circuit board, wherein the transmission component is inserted into the temperature guiding component of the temperature control mechanism, so that the temperature guiding component is surrounded by the transmission component. Side conduction of high or low temperature test temperature, and shortening the distance that the transmission member conducts the test temperature to the electronic component to ensure that the electronic component performs the test within the preset test temperature range when the transmission member contacts the electrical contact of the electronic component. Work, to achieve the practical benefits of improving test quality.

An object of the present invention is to provide an electronic component testing device, wherein At least one temperature guiding member of the temperature control mechanism is a soft cushion body, and at least one pick-and-place component that is connected to the air extracting device and is a suction hole, and can be pressed against the electronic component by the temperature guiding member to have an electrical contact On one side, the temperature guiding member and the electronic component are kept sealed, which not only makes the pick-and-place component of the temperature guiding member absorb the transfer electronic component, but also increases the temperature conduction contact area and improves the conduction efficiency, thereby achieving the practical benefit of improving the convenience of use. .

The third object of the present invention is to provide an electronic component testing device, wherein the temperature guiding component of the temperature control mechanism conducts the test temperature of the high temperature or low temperature of the electronic component during the process of transferring the electronic component, so as to shorten the electronic component setting. The working time of heating or cooling to the preset test temperature in the testing organization enables the electronic components to quickly perform the testing operation, thereby achieving the practical benefit of improving the testing capacity.

A fourth object of the present invention is to provide a testing device for applying an electronic component testing device, which is provided with a feeding device, a receiving device, a testing device, a conveying device and a central control device, which are used in the feeding device. The receiving device is configured to receive at least one electronic component to be tested, and the testing device is provided with a testing mechanism and a temperature control mechanism for testing the electronic component. The temperature control mechanism performs the test operation by keeping the electronic components within a preset test temperature range, and the transport device is provided with at least one transfer mechanism for transferring the objects, and the central control device is for controlling and integrating the devices. And perform automated operations to achieve practical benefits of improving production productivity.

[study]

11‧‧‧Image sensing electronic components

111‧‧‧Photosensitive parts

112‧‧‧ solder balls

12‧‧‧ machine

13‧‧‧ Feeding tray

14‧‧‧ receiving tray

15‧‧‧Transfer mechanism

16‧‧‧heating tray

17‧‧‧Test institutions

171‧‧‧ test seat

172‧‧‧ probe

173‧‧‧Light source

〔this invention〕

20‧‧‧Testing device

21‧‧‧temperature control agency

21A‧‧‧First temperature control agency

21B‧‧‧Second temperature control agency

211‧‧‧ Temperature Controller

2111‧‧‧Transmission parts

212‧‧‧temperature control components

213‧‧‧First carrier

2131‧‧‧First jack

214‧‧‧Second carrier

2141‧‧‧second jack

215‧‧‧First temperature guide

2151‧‧‧ first through hole

2152‧‧‧First perforation

216‧‧‧ pick and place parts

217‧‧‧Second temperature guide

2171‧‧‧Second perforation

218‧‧‧ Third temperature guide

2181‧‧‧3rd perforation

2182‧‧‧Removable parts

22‧‧‧Test institutions

221‧‧ ‧ socket

2211‧‧‧Holding parts

2212‧‧‧ 容部

222‧‧‧Light source

223‧‧‧First board

2231‧‧‧Electrical contact parts

224‧‧‧First transmission

225‧‧‧second transmission

226‧‧‧second circuit board

23‧‧‧ drive mechanism

231‧‧‧ drive

23A‧‧‧First drive mechanism

23B‧‧‧Second drive mechanism

30‧‧‧Image sensing electronic components

31‧‧‧Photosensitive parts

32‧‧‧ solder balls

40‧‧‧ machine

50‧‧‧Feeding device

60‧‧‧ receiving device

70‧‧‧Conveyor

71‧‧‧Input transfer mechanism

72‧‧‧First feeding stage

73‧‧‧Second feed stage

74‧‧‧First receiving platform

75‧‧‧Second receiving platform

76‧‧‧Output transfer mechanism

Figure 1: Schematic diagram of a conventional image sensing electronic component.

Figure 2: Schematic diagram of a conventional electronic component test equipment.

Figure 3: Schematic diagram of the use of a conventional test mechanism.

Figure 4 is an exploded view of the first embodiment of the test apparatus of the present invention.

Figure 5 is an assembled cross-sectional view showing a first embodiment of the test apparatus of the present invention.

Figure 6 is a schematic view showing the use of the first embodiment of the test apparatus of the present invention (I).

Figure 7 is a schematic view showing the use of the first embodiment of the test apparatus of the present invention (2).

Figure 8 is a schematic view showing the use of the first embodiment of the test apparatus of the present invention (3).

Figure 9 is an assembled cross-sectional view showing a second embodiment of the test apparatus of the present invention.

Fig. 10 is a schematic view showing the use of the second embodiment of the test apparatus of the present invention (1).

Figure 11 is a schematic view showing the use of the second embodiment of the test apparatus of the present invention (2).

Figure 12 is a schematic view showing the use of the second embodiment of the test apparatus of the present invention (3).

Figure 13 is a schematic view showing the application of the first embodiment of the test apparatus of the present invention to a test apparatus.

In order to make the present invention further understand the present invention, a preferred embodiment and a drawing will be described in detail as follows: Please refer to Figures 4 and 5, which is a first embodiment of the testing device 20 of the present invention. The test device 20 includes a temperature control mechanism 21 and a test mechanism 22, and the temperature control mechanism 21 is provided with at least one temperature controller 211 that outputs a high temperature or low temperature test temperature. Further, the temperature controller 211 can be internally assembled with temperature. The control element (such as a cooling chip or a heater), or an external cold source/heat source supply device, causes the temperature controller 211 to output a high or low temperature test temperature. In this embodiment, the temperature controller 211 The temperature control element 212 (such as a cooling chip) is disposed inside to output a low temperature test temperature, and the temperature control mechanism 21 is coupled to one of the temperature controllers 211 to be equipped with at least one temperature guiding member, and the temperature guiding member transmits the temperature. The controller 211 has a carrier, and the carrier 211 has a carrier 213 and a second carrier 214. First and second carrier 213 The 214 is made of a non-conductive, non-conductive plastic material, and is respectively provided with first and second sockets 2131, 2141. The carrier is connected to the temperature controller 211 by the first carrier 213, and is coupled to the second carrier. The first temperature guiding member 215 is provided with a first conductive hole 215 (for example, a thermal grease), and the first temperature guiding member 215 is provided with a plurality of first through holes 2151 and a first through hole 2152. At least one conducting member is connected between the temperature guiding member 215 and the temperature controller 211 to conduct the high temperature or low temperature of the temperature controller 211 to the first temperature guiding member 215. In this embodiment, it is attached to the bottom surface of the temperature controller 211. A plurality of conductive members 2111 are disposed, and the plurality of conductive members 2111 are inserted into the first through holes of the first and second carrying members 213 and 214, and the first through holes 2151 of the first temperature guiding member 215. The low temperature test temperature outputted by the temperature controller 211 is transmitted to the first temperature guiding member 215, and the testing device 20 can be provided with the pick-and-place component of the electronic component on the at least one temperature guiding member of the temperature control mechanism 21, Or configuring an independent material transfer mechanism for picking up the transfer electronic component, in the embodiment, the first temperature guide member A pick-and-place member 216 connected to an air extracting device (not shown) is disposed under the 215 for picking and placing electronic components (such as image sensing) The electronic component) is provided with at least one mounting member for mounting the electronic component. Further, the receiving component can be disposed on the machine or a separate seat. In this embodiment, the bearing is attached to a socket. The 221 is provided with a mounting member 2211 for receiving the electronic component, and a receiving portion 2212 is disposed under the receiving member 2211. The receiving portion 2212 accommodates the light source 222 for testing, and the testing mechanism 22 A circuit board having at least one transmission member for testing the electronic component is provided. In this embodiment, the socket 221 is provided with a first circuit board 223 having an electrical contact member 2231. The first circuit board 223 Then electrically connected to a tester (not shown), and the first through hole 2152 of the first temperature guiding member 215 is inserted with a plurality of first transmitting member 224 and second transmitting member 225 which can be probes, The first temperature guiding member 215 is caused to pass the test temperature of the high temperature or the low temperature from the circumferential side of the first transmitting member 224 and the second transmitting member 225, and the two ends of each of the first transmitting member 224 and the second transmitting member 225 are respectively protruded. The first temperature guiding member 215, one end of the first transmitting member 224 is used to contact an electrical contact of the electronic component (eg The other end is electrically connected to a second circuit board 226 mounted on the first carrier 213. One end of the second transmission member 225 is electrically connected to the second circuit board 226, and the other end is electrically connected. The first circuit board 223 is electrically connected to the component 2231, and the testing device 20 is provided with a driving mechanism 23 for driving the temperature control mechanism 21 or the testing mechanism 22 for at least one direction displacement. The driving mechanism 23 is provided with at least one driver. In the embodiment, the driving mechanism 23 is provided with a driver 231 for displacement in the first and second directions (such as Y and Z directions). The driver is driven by the temperature control mechanism 21 or the testing mechanism 22 in at least one direction. The 231 system drives the temperature controller 211 of the temperature control mechanism 21 to perform displacement in the first and second directions.

Referring to FIG. 6 , the test device 20 of the present invention can be applied to perform a low temperature test operation on the image sensing electronic component 30. The image sensing electronic component 30 is provided with a photosensitive member 31 on one side and a solder ball 32 on the other side. The test device 20 drives the temperature controller 211, the first temperature guiding member 215, and the pick-and-place member 216 to be displaced in the first and second directions to have a sense of image to be tested. At the loading stage (not shown) of the electronic component 30, the photosensitive member 31 of the image sensing electronic component 30 to be tested is directed downward, and the pick-and-place component 216 of the temperature control mechanism 21 is adsorbed to the image to be tested. The sensing electronic component 30 faces upward and has one side of the solder ball 32, and the first transmission member 224 of the testing mechanism 22 contacts the solder ball 32. Since the temperature controller 211 of the temperature control mechanism 21 uses the temperature control element 212 to have a low temperature. Test temperature, the temperature controller 211 is a conductive member 2111, the low temperature test temperature is transmitted to the first temperature guiding member 215, and the first temperature guiding member 215 is coated on the circumferential side of the first transmitting member 224 and the second transmitting member 225, so that the first temperature guiding member 215 can be first The peripheral side of the transmission member 224 and the second transmission member 225 conducts the low temperature test temperature, so that the first transmission member 224 and the second transmission member 225 are input to the low temperature test temperature on the circumferential side, thereby shortening the first transmission member 224 and the second transmission. The member 225 conducts the distance and time of the low temperature test temperature to effectively reduce the low temperature loss, so that the first transmission member 224 rapidly conducts the low temperature test temperature to the solder ball 32 of the image sensing electronic component 30, so that the temperature control mechanism 21 is transferred. During the measurement of the image sensing electronic component 30, the image sensing electronic component 30 to be tested can be kept at the low temperature test temperature, and the image sensing electronic component 30 to be tested is not required to be placed in the socket 221. The temperature is lowered, and the cooling time of the image sensing electronic component 30 to be tested is effectively shortened. Then, the driver 231 of the driving mechanism 23 drives the temperature controller 211 and the pick-and-place component 216 to perform displacement in the first direction, and the image sensing electronic device to be tested Component 30 shift Loaded above the seat 221.

Referring to FIG. 7, the driver 231 of the driving mechanism 23 drives the temperature controller 211, the pick-and-place component 216, and the image sensing electronic component 30 to be tested for second-direction displacement, and the image sensing electronic component to be tested. 30 is placed on the receiving member 2211 of the socket 221, and the second transmitting member 225 of the testing mechanism 22 contacts the electrical contact member 2231 on the first circuit board 223, and the image sensing electronic component 30 is sensed. The component 31 corresponds to the light source 222. Since the first temperature guiding member 215 of the temperature control mechanism 21 conducts the low temperature test temperature to the circumferential side of the first transmission member 224, the first transmission member 224 then rapidly tests the temperature of the low temperature from the circumferential side. The solder ball 32 is transmitted to the image sensing electronic component 30, so that the image sensing electronic component 30 to be tested is quickly in a preset low temperature test state, and the light source 222 of the testing mechanism 22 irradiates the light to the image sensing electronic device to be tested. When the photosensitive member 31 of the component 30 is used, the image sensing electronic component 30 to be tested can be simulated in a low temperature environment, and the image sensing electronic component 30 to be tested transmits the photosensitive signal to the solder ball 32. a transmission member 224, The transmitting component 224 transmits the photosensitive signal to the second transmitting component 225 via the second circuit board 226, and the second transmitting component 225 transmits the photosensitive signal to the tester via the first circuit board 223 for discriminating, and the tester transmits the test result. To the central control unit (not shown).

Please refer to Figure 8, after the test operation is completed, the drive of the drive mechanism 23 The 231 system drives the temperature controller 211, the pick-and-place component 216, and the measured image sensing electronic component 30 to be displaced in the second direction, so that the pick-and-place component 216 removes the measured image sensing electronic component 30 from the socket 221. The component 2211 disengages the second transmission member 225 from the first circuit board 223, thereby transferring the measured image sensing electronic component 30 to a discharge stage (not shown) for output.

Referring to FIG. 9 , it is a second embodiment of the testing device 20 of the present invention. The testing device 20 includes a temperature control mechanism 21 , a testing mechanism 22 , and a driving mechanism 23 . The temperature control mechanism 21 is provided with at least one output high temperature or a temperature controller 211 for testing the temperature at a low temperature, the temperature controller 211 is internally provided with a temperature control element 212, so that the temperature controller 211 has a test temperature of high temperature or low temperature, and the temperature controller 211 is equipped with a carrier, The carrier has a first carrier 213 and a second carrier 214. The first and second carriers 213 and 214 are made of non-conductive and non-conductive plastic materials, and are respectively provided with first and second insertions. The holes 2131, 2141 are connected to the temperature controller 211 by the first carrier 213, and the first temperature guiding member 215 and the second temperature guiding member are disposed in the second carrier 214. 217, the first temperature guiding member 215 can be a thermal grease, and is provided with a plurality of first through holes 2151 and a first through hole 2152. The second temperature guiding member 217 can be made of ceramic material and assembled to the first temperature guiding member 215. Below, and at the position of the first through hole 2152 corresponding to the first temperature guiding member 215 There are a plurality of second through holes 2171, and a third temperature guiding member 218 is disposed under the second temperature guiding member 217, and the third temperature guiding member 218 is made of a non-conductive, temperature-conducting and soft material. And a plurality of third through holes 2181 are opened in the second through hole 2171 of the corresponding second temperature guiding member 217, and a plurality of picking and placing parts 2182 which can be suction holes are opened in the third temperature guiding member 218, and are taken and put The component 2182 is connected to an air extracting device (not shown) for picking up and placing electronic components (such as image sensing electronic components), and further comprising a plurality of conductive members 2111 on the bottom surface of the temperature controller 211, and a plurality of conductive members. The second through hole 2151 is inserted into the first and second sockets 2131, 2141 of the first and second carrier members 213, 214 and the first temperature guiding member 215, and is connected to the second temperature guiding member 217 to The low temperature test temperature of the temperature controller 211 is transmitted to the first temperature guiding member 215 and the second temperature guiding member 217, and the second temperature guiding member 217 transmits the low temperature testing temperature to the third temperature guiding member 218; the testing mechanism 22 is configured There is a socket 221, and the socket 221 is provided with a mounting member 2211 for mounting electronic components, and is disposed below the receiving member 2211. The accommodating portion 2212, the accommodating portion 2212 is configured to receive the light source 222 for testing, and the testing mechanism 22 is disposed on the socket 221 to provide a first circuit board 223 having an electrical contact member 2231. The circuit board 223 is electrically connected to a tester (not shown), and the first, second, and third through holes 2152, 2171 of the first, second, and third temperature guiding members 215, 217, and 218 of the temperature control mechanism 22. 2181 is disposed with a plurality of first transmitting members 224 and second transmitting members 225, so that the first, second, and third temperature guiding members 215, 217, 218 are conducted by the peripheral sides of the first transmitting member 224 and the second transmitting member 225 The test temperature of high temperature or low temperature, and effectively increase the area of the contact conduction temperature, so as to more quickly conduct the low temperature test temperature of the temperature controller 211 to the first and second transmission members 224, 225, the first transmission member 224 and the second transmission The two ends of the member 225 protrude from the first temperature guiding member 215 and the third temperature guiding member 218. One end of the first transmitting member 224 is for contacting the electrical contact of the electronic component, and the other end is electrically connected to the assembly. The second circuit board 226 on the first carrier 213, one end of the second transmission member 225 is electrically connected to the second circuit board 2 26, the other end is used to electrically connect the electrical contact member 2231 of the first circuit board 223, and the driving mechanism 23 of the testing device 20 is provided with a driver for the first and second directions (such as Y, Z direction) displacement. 231. The driver 231 drives the temperature controller 211 of the temperature control mechanism 21 to perform displacement in the first and second directions.

Referring to FIG. 10, when the cold sensing operation of the image sensing electronic component 30 is performed, the driver 231 of the driving mechanism 23 drives the temperature controller 211, the first temperature guiding member 215, and the pick-and-place component 2182 to be the first. The two directions are displaced to a loading stage (not shown), and the third temperature guiding member 218 is pressed against one side of the image sensing electronic component 30 having the solder ball 32, and the pick-and-place member 2182 is placed. On one side of the image sensing electronic component 30, since the third temperature guiding member 218 is a soft pad body, the solder ball 32 can be covered and attached to one surface of the image sensing electronic component 30, thereby not only increasing contact conduction. The area of the temperature and the vacuum is prevented, so that the pick-and-place component 2182 does take out the image sensing electronic component 30 to be tested, and the first transmitting component 224 contacts the solder ball 32 of the image sensing electronic component 30 to be tested. The temperature controller 211 of the control mechanism 21 transmits the low temperature test temperature to the first temperature guiding member 215 and the second temperature guiding member 217 by using the conducting member 2111, and the second temperature guiding member 217 transmits the low temperature testing temperature to the third temperature guiding portion. 218, because the first, second, and third temperature guiding members 215, 217, 218 are covered A peripheral member 224 of the transmission side, and increase the contact conduction The area of the temperature causes the first, second and third temperature guiding members 215, 217, 218 to rapidly conduct the low temperature test temperature from the peripheral side of the first transmission member 224, and further shorten the distance and time at which the first transmission member 224 conducts the low temperature test temperature. In order to effectively reduce the low temperature loss, the first transmission member 224 quickly conducts the low temperature test temperature to the solder ball 32 of the image sensing electronic component 30, so that the temperature control mechanism 21 moves the image sensing electronic component 30 to be tested. The image sensing electronic component 30 to be tested inputs a low temperature test temperature to shorten the operation time of the image sensing electronic component 30. Further, the driver 231 of the driving mechanism 23 drives the temperature controller 211 and the pick and place component 2182 as the first The image sensing electronic component 30 to be tested is transferred to the upper side of the socket 221 in one direction.

Referring to FIG. 11 , the driver 231 of the driving mechanism 23 drives the pick-and-place component 2182 and the image sensing electronic component 30 to be tested for second-direction displacement, and the image sensing electronic component 30 to be tested is placed in the bearing. The housing 221 is mounted on the component 2211, and the second transmission member 225 of the testing mechanism 22 is in contact with the electrical contact member 2231 on the first circuit board 223, and the photosensitive member 31 of the image sensing electronic component 30 to be tested corresponds to The light source 222, the first, second and third temperature guiding members 215, 217, 218 of the temperature control mechanism 21 conduct the low temperature test temperature to the circumferential side of the first transmission member 224, and the first transmission member 224 further tests the temperature at the low temperature from the circumferential side. The solder ball 32 is quickly transmitted to the image sensing electronic component 30, so that the image sensing electronic component 30 to be tested is quickly in a preset low temperature test state, and the light source 222 of the testing mechanism 22 illuminates the image to be tested. When the photosensitive member 31 of the electronic component 30 is used, the image sensing electronic component 30 to be tested can be simulated in a low temperature environment for the cold sensing operation, and the image sensing electronic component 30 to be tested transmits the photosensitive signal to the solder ball 32 through the solder ball 32. First transmission member 224, first transmission The output 224 transmits the photosensitive signal to the second transmission member 225 via the second circuit board 226, and the second transmission member 225 transmits the photosensitive signal to the tester via the first circuit board 223 for discriminating, and the tester transmits the test result. To the central control unit (not shown).

Referring to FIG. 12, after the test operation is completed, the driver 231 of the driving mechanism 23 drives the temperature controller 211, the pick-and-place component 2182, and the measured image sensing electronic component 30 to perform the second direction displacement, so that the third temperature is adjusted. The pick-and-place component 2182 of the member 218 removes the measured image sensing electronic component 30 from the receiving component 2211 of the socket 221, and disengages the second transmitting component 225 from the first circuit board 223, thereby sensing the detected image. Element 30 is transferred to a discharge stage (not shown) for output.

Referring to FIG. 13, the testing device 20 of the present invention can be applied to a testing device which is equipped with a feeding device 50, a receiving device 60, a testing device 20, a conveying device 70 and a central control device on the machine table 40 ( The feeding device 50 is mounted on the machine table 40 and is provided with at least one feeding mechanism for accommodating at least one electronic component to be tested; the receiving device 60 is mounted on the machine table 40, And at least one receiving mechanism for accommodating at least one tested electronic component; the testing device 20 is mounted on the machine 40, and is provided with a first temperature control mechanism 21A, a second temperature control mechanism 21B and a testing mechanism The first and second temperature control mechanisms 21A and 21B are the same temperature control mechanism 21 for maintaining the electronic components within a preset test temperature range. The test mechanism 22 For testing the electronic components, the first and second driving mechanisms 23A, 23B are the same as the driving mechanism 23 for driving the first and second temperature control mechanisms 21A, 21B for at least one direction displacement; the conveying device 70 is provided with an input. End transfer mechanism 71 for feeding the feeding device 50 The electronic components to be tested are respectively sent to the first feeding stage 72 and the second feeding stage 73. The first feeding stage 72 and the second feeding stage 73 respectively carry the electronic components to be tested to the testing device. 20, for the first temperature control mechanism 21A and the second temperature control mechanism 21B to take out the electronic component to be tested, and carry it to the testing mechanism 22 to perform a test operation, and the conveying device 70 is provided with a first receiving carrier 74 And the second receiving stage 75 can be displaced to the testing device 20 to respectively carry the tested electronic components placed by the first temperature control mechanism 21A and the second temperature control mechanism 21B, and carry out the testing device 20, the conveying device The 70 series is provided with an output end transfer mechanism 76 for taking out the tested electronic components on the first receiving stage 74 or the second receiving stage 75, and according to the test result, the measured electronic components are sent to the receiving materials. The devices 60 are placed in a sorted manner, and the central control device is used to control and integrate the operations of the devices to perform automated operations to achieve practical benefits of improving operational efficiency.

20‧‧‧Testing device

21‧‧‧temperature control agency

211‧‧‧ Temperature Controller

2111‧‧‧Transmission parts

212‧‧‧temperature control components

213‧‧‧First carrier

2131‧‧‧First jack

214‧‧‧Second carrier

2141‧‧‧second jack

215‧‧‧First temperature guide

2151‧‧‧ first through hole

2152‧‧‧First perforation

216‧‧‧ pick and place parts

22‧‧‧Test institutions

221‧‧ ‧ socket

2211‧‧‧Holding parts

2212‧‧‧ 容部

222‧‧‧Light source

223‧‧‧First board

2231‧‧‧Electrical contact parts

224‧‧‧First transmission

225‧‧‧second transmission

226‧‧‧second circuit board

23‧‧‧ drive mechanism

231‧‧‧ drive

Claims (10)

An electronic component testing device comprises: a temperature control mechanism: at least one temperature controller for outputting a high temperature or low temperature test temperature, and at least one temperature guiding member is assembled on one side of the temperature controller, the temperature guiding component is conductive The temperature controller has a test temperature, and the temperature control mechanism is provided with a pick-and-place component for picking and placing electronic components; and the test mechanism is provided with at least one bearing component for mounting the electronic component, and is provided with at least one transmission component a circuit board, the transmission member is inserted into the temperature guiding member of the temperature control mechanism, so that the temperature guiding member transmits the test temperature from the peripheral side of the transmission member, and the loading and unloading member adsorbs and transfers the electronic component. When the transmitting member contacts the electrical contact of the electronic component, the electronic component is maintained at a preset test temperature range. The electronic component testing device according to claim 1, wherein the temperature control mechanism is equipped with at least one carrier on one side of the temperature controller, and the carrier is equipped with the at least one temperature guiding component. At least one conductive member is connected between the temperature guiding member and the temperature controller. The electronic component testing device of claim 2, wherein the carrier of the temperature control mechanism is provided with a first carrier and a second carrier to respectively connect the temperature controller and the temperature guiding component, In addition, the first and second carrying members are provided with first and second jacks for inserting the conductive member. The electronic component testing device according to claim 2, wherein the temperature control mechanism is provided with a first temperature guiding member and a second temperature guiding member, wherein the first temperature guiding member is provided At least one first through hole is disposed for the conductive member, the conductive member is connected to the second temperature guiding member, and the first and second temperature guiding members are provided with at least one first and second through holes for assembling the test. The transmission member of the mechanism causes the first and second temperature guiding members to conduct the test temperature from the peripheral side of the transmission member. The electronic component testing device according to the fourth aspect of the invention, wherein the temperature control mechanism is provided with a third temperature guiding member below the second temperature guiding member, and the third temperature guiding member is provided with at least one And a third perforation for assembling the transmission member of the testing mechanism, so that the third temperature guiding member conducts the test temperature from the circumferential side of the transmission member. The electronic component testing device of claim 5, wherein the third temperature guiding member of the temperature control mechanism is provided with at least one pick-and-place component for picking and placing electronic components. The electronic component testing device according to claim 1, wherein the temperature control mechanism is provided with a pick-and-place component for picking and placing electronic components on at least one of the temperature guiding members. The electronic component testing device according to claim 1, wherein the testing device is provided with a driving mechanism, and the driving mechanism is provided with at least one driver to drive the temperature control mechanism or the testing mechanism to at least one direction. Displacement. The electronic component testing device of claim 1, wherein the testing device is provided with at least one light source for testing to project light to the electronic component. A testing device for applying an electronic component testing device, comprising: a machine; a feeding device: being assembled on the machine, and provided with at least one feeding mechanism for accommodating the electronic component to be tested; Mounted on the machine, and provided with at least one receiving mechanism for accommodating the tested electronic components; at least one electronic component testing device according to claim 1 of the patent application; conveying device: being assembled on the machine The platform is provided with at least one material moving mechanism for transferring electronic components; and the central control device is for controlling and integrating the operations of the devices to perform automated operations.