TWI607223B - Press-measuring mechanism for stacked package electronic components and test classification equipment for application thereof - Google Patents

Description

Pressure measuring mechanism for stacked package electronic components and test classification device thereof

The invention provides a method for not only effectively shortening the signal transmission distance of the first and second electronic components, but also avoiding noise, and controlling the first and second electronic components to maintain the preset test temperature by using the temperature control unit to perform the test operation, thereby improving the test quality. The pressure measuring mechanism of the stacked package electronic components.

Nowadays, electronic mobile devices are increasingly demanding higher digital signal processing and higher storage capacity, and widely used stacked package on package (PoP) electronic components, please refer to FIG. 1 , the stacked package electronic The component 10 includes a first electronic component 11 and a second electronic component 12 electrically connected to each other. The first electronic component 11 located in the upper layer is mostly a memory, such as a DRAM or a Flash, and has a plurality of first electrical properties on the bottom surface. The second electronic component 12 in the lower layer is mostly an IC, and a plurality of second electrical contacts 121 are disposed on the top surface, and a plurality of third electrical contacts 122 are disposed on the bottom surface, and the second electron is The component 12 is electrically connected to the first electrical contact 111 of the first electronic component 11 by the second electrical contact 121 to be assembled into the stacked package electronic component 10.

The stacked package electronic components may be in a low temperature environment or a high temperature environment in actual use. In order to ensure the quality of the stacked package electronic components, the stacked devices must be cold-tested by the test device after the fabrication is completed. Or thermal testing, but if the finished packaged packaged electronic components are tested, it is impossible to know that the defective product is the first electronic component or the second electronic component. Therefore, the manufacturer treats the test device with the good first electronic component. The second electronic component is tested to eliminate the defective second electronic component; see Figures 2 and 3, The pressure detecting mechanism of the testing device is provided with a carrier 21 for displacement in the Z direction. The holder 21 is provided with a cooler 22 and a heating member 23, and the heating member 23 is connected and assembled by the connecting member 24. The first circuit board 26 is disposed on the outer surface of the connecting member 24, and the first circuit board 26 is provided with a plurality of first probes 261, and the plurality of first probes 261 are extended to the lower pressing fixture. 25, for electrically connecting the second electronic component 12, and mounting a first test socket 27 with a second probe 271 on the top side of the first circuit board 26, the first test socket 27 is mounted The first electronic component 11 of the first electronic component 11 is electrically connected to the first electrical interface 111 of the first electronic component 11 and the other end is electrically connected to the first circuit board 26 to make the first The test stand 27 is electrically connected to the first probe 261 via the second probe 271 and the first circuit board 26, and a second test seat 28 having a third probe 281 under the pressure measuring mechanism 25 and under the pressure measuring mechanism 25 The second electronic component 12 to be tested is mounted on the second and third electrical contacts 121 and 122, and the second electronic component is electrically connected to the second electronic component by the third probe 281. The third electrical contact 122 of the 12 and the second circuit board 29; during testing, the frame 21 of the pressure measuring mechanism drives the cooler 22, the heating element 23, the pressing fixture 25, the first circuit board 26, and The first test seat 27 is displaced downward in the Z direction, so that the first probe 261 on the pressing fixture 25 is electrically connected to the second electrical contact 121 of the second electronic component 12, so that the first electronic component 11 passes through the first A test socket 27, a first circuit board 26 and a first probe 261 are electrically connected to the second electronic component 12 to be tested in the second test socket 28 to perform a test operation, and the cooler 22 and the heating component 23 are connected via a connection. The piece 24 and the lower pressing fixture 25 conduct the second electronic component 12 to cause the second electronic component 12 to perform the testing operation within a preset temperature range; however, the pressure measuring mechanism has the following defects in use:

1. Since the pressure detecting mechanism allows the cooler 22 and the heating member 23 to conduct the second electronic component 12 via the lower pressing fixture 25, the first test socket 27 that houses the first electronic component 11 is mounted on the first circuit board 26 . On the side, the signal of the first electronic component 11 must be transmitted downward from the second probe 271 of the first test socket 27 to one side of the first circuit board 26, and then by the first circuit board 26 One side is transmitted to the other side, and the side can be transmitted to the second electronic component 12 by the first probe 261 on the other side, so that the first electronic component 11 and the second electronic component 12 have a longer signal transmission distance. As a result, noise is easy to affect the quality of the test, resulting in the lack of good test quality.

2. If the pressure measuring mechanism must perform the test operation under the condition that the first electronic component 11 and the second electronic component 12 are under the same preset test temperature, since the cooler 22 and the heating component 23 can only use the lower pressure fixture 25 to conduct the temperature control. The two electronic components 12 maintain the preset test temperature, and cannot heat the first electronic component 11 on the side of the first test socket 27, so that the first electronic component 11 and the second electronic component 12 cannot be executed at the same temperature. Test work, which affects the lack of test quality.

3. The cooler 22 and the heating member 23 of the pressure measuring mechanism can only guide the second electronic component 12 located below. If the first electronic component 11 is maintained at a preset test temperature, the first electronic component 11 must be Another set of components such as cooler, heating element, connecting piece and pressing fixture are added above, so that the volume of the whole pressure measuring mechanism is increased and the space is occupied, which causes the lack of space configuration of the unfavorable electronic component testing equipment.

A first object of the present invention is to provide a pressure measuring mechanism for a stacked package electronic component, which is provided with a working fixture on a carrier of the carrier, and is provided with a temperature guiding seat inside, and the testing unit is connected to the temperature guiding seat. a first tester having a first transmission member is disposed below, the first tester is configured to receive at least one first electronic component contacting the temperature guiding seat, and electrically connected to the first electronic component at one end of the first transmission component, and The other end is electrically connected to the second electronic component, and the temperature control unit is provided with a first temperature controller in the temperature guiding seat of the carrier, and the first electronic component is kept at a temperature to maintain a preset test temperature, and the operation of the carrier is further a second temperature controller is disposed above the second electronic component to maintain the preset test temperature; thereby, the pressure measuring mechanism electrically connects the first transmission member of the first tester to the first and the lower ones The electronic component and the second electronic component are used to effectively shorten the signal transmission distance of the first and second electronic components to avoid noise, thereby improving the test quality. Use benefits.

The second object of the present invention is to provide a pressure measuring mechanism for a stacked package electronic component, wherein the first temperature controller and the second temperature controller of the temperature control unit are arranged on the carrier in a top and bottom arrangement, first The temperature controller is located above the first tester, and the second temperature controller is located below the first tester, so that the first temperature controller and the second temperature controller can respectively guide the first electronic component and the second electron The component, and thus the first electronic component and the second electronic component, maintain the preset test temperature to perform a test operation, thereby achieving the practical benefit of improving the test quality.

A third aspect of the present invention provides a pressure measuring mechanism for a stacked package electronic component, wherein a first thermostat of the temperature control unit is located above the first tester, and a first transmission component of the first tester is In addition to allowing the first and second electronic components to maintain a preset test temperature, the first thermostat and the second thermostat can be used to arrange the arrangement of the first and second thermostats on the carrier, thereby avoiding Amplifying the volume of the pressure measuring mechanism to achieve practical benefits for the spatial configuration of the electronic component testing equipment.

A fourth object of the present invention is to provide a test classification device for a pressure measuring mechanism using a stacked package electronic component, which comprises a machine table, a feeding device, a receiving device, a testing device, a conveying device and a central control device, the feeding device The device is disposed on the machine table, and is provided with at least one feeding device for accommodating the second electronic component to be tested, the receiving device is disposed on the machine table, and is provided with at least one second electronic component that is tested. a receiving device, the testing device is disposed on the machine table, and is provided with at least one second testing device and at least one pressure detecting mechanism of the invention to perform a testing operation on the second electronic component, the conveying device The utility model is disposed on the machine platform and is provided with at least one shifter for transferring the second electronic component, wherein the central control device is used for controlling and integrating the operation of each device to perform an automatic operation, thereby achieving the practical benefit of improving the performance of the operation.

[study]

10‧‧‧Stacked package electronic components

11‧‧‧First electronic components

111‧‧‧First electrical contact

12‧‧‧Second electronic components

121‧‧‧Second electrical contact

122‧‧‧ Third electrical contact

21‧‧‧ Shelf

22‧‧‧ cooler

23‧‧‧heating parts

24‧‧‧Connecting parts

25‧‧‧Under pressure fixture

26‧‧‧First board

261‧‧‧First probe

27‧‧‧First test stand

271‧‧‧Second probe

28‧‧‧Second test seat

281‧‧‧ third probe

29‧‧‧Second circuit board

〔this invention〕

30‧‧‧Inspection mechanism

31‧‧‧ moving arm

32‧‧‧Carriers

321‧‧‧Working fixture

33‧‧‧Guide temperature seat

331‧‧‧ joining parts

34‧‧‧Parts

35‧‧‧First test seat

351‧‧‧First transmission

36‧‧‧First thermostat

37‧‧‧cooler

38‧‧‧Second thermostat

41‧‧‧First electronic components

411‧‧‧First electrical contact

42‧‧‧Second electronic components

421‧‧‧Second electrical contacts

422‧‧‧ Third electrical contact

43‧‧‧Second test seat

431‧‧‧Second transmission

44‧‧‧ boards

50‧‧‧ machine

60‧‧‧Feeding device

61‧‧‧Feeder

70‧‧‧Receiving device

71‧‧‧Receipt receiver

80‧‧‧Testing device

81‧‧‧Second tester

90‧‧‧Conveyor

91‧‧‧First mover

92‧‧‧First transfer station

93‧‧‧Second transfer station

94‧‧‧Second shifter

95‧‧‧ third shifter

Figure 1: Schematic diagram of a conventional stacked package electronic component.

Figure 2: Schematic diagram of the configuration of the conventional electronic component pressure measuring mechanism and the second test socket.

Figure 3: Schematic diagram of the use of the conventional electronic component pressure measuring mechanism and the second test socket.

Fig. 4 is a schematic view showing a pressure measuring mechanism of the stacked package electronic component of the present invention.

Figure 5: Schematic diagram of the use of the pressure measuring mechanism of the present invention (1).

Figure 6: Schematic diagram of the use of the pressure measuring mechanism of the present invention (2).

Figure 7: Schematic diagram of the use of the pressure measuring mechanism of the present invention (3).

Fig. 8 is a schematic view showing the application of the pressure measuring mechanism of the present invention to a test classification device.

In order to make the present invention further understand the present invention, a preferred embodiment and a drawing will be described in detail as follows: Referring to Figure 4, the pressure sensing mechanism 30 of the present invention comprises a carrier, a test unit and a temperature. The control unit is provided with at least one carrier member. Further, the carrier member can be displaced by at least one moving arm band in at least one direction. In this embodiment, the carrier is provided in a first direction (such as the Z direction). Displacement moving arm 31, the moving arm 31 drives the carrier 32 to be displaced in the Z direction, the carrier 32 has the characteristic of non-conductive temperature conduction, and is provided with at least one working jig 321, the working jig 321 can be a crimping fixture for crimping an electronic component, the crimping fixture can be a separate component, or a thermostat (such as a heating component) of the temperature control unit can be used as a crimping fixture to press the electronic component, the working fixture Or the pressure-moving fixture for crimping and transferring electronic components, the working fixture 321 can be a separate component or integrally formed on the carrier 32. In the embodiment, the working fixture 321 is a separate component. And is a crimping fixture for crimping electronic components, working fixture 321 In the present embodiment, at least one temperature guiding seat 33 is disposed on the bottom of the carrier member 32. In the embodiment, a temperature guiding seat 33 is disposed inside the carrier member 32, and the bottom of the temperature guiding seat 33 is provided. There is at least one engaging member 331, and in order to prevent the bearing member 32 and the temperature guiding seat 33 from mutually affecting the temperature of conduction, at least one spacer 34 is disposed between the carrier 32 and the temperature guiding seat 33; the testing unit is assembled a carrier 32 of the carrier, and a first tester having at least one first transmission member, the first tester is configured to receive at least one first electronic component 41 contacting the temperature guiding seat 33, and One end of a transmission member is electrically connected to the first electronic component 41, and the other end is electrically connected to a second electronic component (not shown). In this embodiment, it is inside the carrier 32 of the carrier and is located guide A first tester is disposed under the temperature seat 33. The first tester is provided with a first test socket 35 having a first transmission member 351. The first test socket 35 is provided with a good first electrical contact 411. a first electronic component 41 (such as a DRAM) facing down, the top surface of the first electronic component 41 is connected to the bonding component 331 of the temperature guiding seat 33, and electrically connected to the first transmitting component 351 by the first electrical contact 411 The first end of the first transmission member 351 is electrically connected to the second electronic component, and the first transmission member 351 of the first test socket 35 is electrically connected to the upper and lower portions. The first electronic component 41 and the second electronic component are configured to effectively shorten the signal transmission distance of the first electronic component 41 and the second electronic component to avoid noise, thereby improving test quality; the temperature control unit is attached to the carrier 32 of the carrier. At least one first temperature controller 36 is disposed to maintain the preset temperature of the first electronic component 41, and further, the temperature guiding seat 33 attached to the carrier 32 is provided with at least one first temperature controller 36. The first thermostat 36 can be a cryogenic wafer or a heating element or a body with a pre-warmed fluid, etc. Above the carrier 32, at least one cooler 37 is mounted. The cooler 37 can be a cryogenic wafer or a body having a low temperature fluid. In the embodiment, the cooler 37 is a body having a low temperature fluid and conducts the low temperature. To the temperature guiding seat 33 and the carrier 32, the first thermostat 36 is a refrigerating wafer. Since the temperature guiding seat 33 can conduct the low temperature of the cooler 37, the first thermostat 36 can be matched with the cooler 37. The output power is adjusted at a low temperature, so that the temperature of the first thermostat 36 is balanced with the low temperature of the cooler 37 at a preset test temperature, and the first electronic component 41 is guided to maintain the preset test via the joint member 331 of the temperature guiding seat 33. The temperature control unit is further disposed on the carrier 32 of the carrier and disposed under the first temperature controller 36 to provide at least one second temperature controller for guiding the second electronic component to maintain the preset test temperature. The second thermostat can be a refrigerating wafer or a heating element or a body with a pre-warmed fluid. In the present embodiment, the second thermostat 38 is a refrigerated wafer, and the carrier 32 can conduct the cooler 37. The low temperature, the second thermostat 38 can be adjusted with the low temperature of the cooler 37 The power, the temperature of the second thermostat 38 of the cryocooler 37 with a balance of predetermined test temperature, test temperature and maintain the preset temperature of the second guide 321 via the electronic component working jig, thereby enabling the first electronic The component 41 and the second electronic component respectively maintain a preset test temperature. Since the cooler 37 is mounted above the first thermostat 36 and the second thermostat 38, the first thermostat 36 and the second thermostat 38 are provided. The same cooler 37 can be used, and the first thermostat 36 and the second thermostat 38 can be arranged on the carrier in the upper and lower arrangement, which not only saves cost, but also avoids the volume of the amplifying and measuring mechanism. Conducive to the practical benefits of the space configuration of electronic component test equipment.

Referring to FIGS. 5 and 6, the stacked package electronic component includes a first electronic component 41 and a second electronic component 42. The first electronic component is placed in the first test socket 35 of the pressure sensing mechanism 30 of the present invention. 41, the operator only needs to test the second electronic component 42 having the second electrical contact 421 and the third electrical contact 422. Therefore, the pressure sensing mechanism 30 of the present invention is applied to an electronic component testing device, and the testing device is pressed At least one second tester is disposed under the measuring mechanism 30 to receive the test second electronic component 42. In this embodiment, the second tester is provided with a second test electrically connected to the second transport component 431. The circuit board 44 and the circuit board 44 are further electrically connected to the testing machine (not shown). The second testing seat 43 can be placed with a second electrical contact 421 facing up. The second electronic component 42 is electrically connected to the third electrical contact 422 of the second electronic component 42 and the circuit board 44 by the second transmitting component 431 .

Referring to FIG. 7 , when the second test component 43 is mounted on the second electronic component 42 to be tested, the carrier of the crimping mechanism 30 drives the carrier 32 , the test unit and the temperature control unit to be synchronized by the moving arm 31 . The Z direction is downwardly displaced, so that the first transmission member 351 of the first test socket 35 of the test unit is electrically connected to the second electrical contact 421 of the second electronic component 42. Since the first test socket 35 of the test unit is configured The test unit can electrically connect the first electrical contact 411 and the second electronic component 42 of the first electronic component 41 located above and below the first test component 35. The second electrical contact 421 can effectively shorten the signal transmission distance between the first electronic component 41 and the second electronic component 42 to avoid noise; however, the first electronic component 41 and the second electronic component 42 are kept in advance. Perform test operations, such as cold, under test temperature conditions The test temperature of the test operation is set to -20 ° C, when the low temperature of the cooler 37 is -40 ° C, and the low temperature is conducted to the lower temperature guide seat 33 and the carrier 32, due to the space between the temperature guide seat 33 and the carrier 32 The non-conductive spacer 34 is disposed so that the temperature guiding seat 33 and the carrier 32 do not affect each other when the temperature is conducted, and the first thermostat 36 can adjust the output according to the low temperature of the cooler 37 conducted by the temperature guiding seat 33. The power is such that the temperature of the first thermostat 36 matches the low temperature of the cooler 37 to maintain the bonding member 331 of the temperature guiding seat 33 at a preset test temperature of -20 ° C to contact the first electronic component with the temperature of the bonding member 331. 41 maintains a preset test temperature of -20 ° C, but when the first thermostat 36 conducts the first electronic component 41, the carrier 32 also conducts the low temperature of the cooler 37, and the second thermostat 38 is mounted on the carrier. Between the member 32 and the working fixture 321 , the second thermostat 38 can adjust the output power according to the low temperature of the cooler 37 conducted by the carrier 32, so that the temperature of the second thermostat 38 matches the low temperature of the cooler 37 to make the operation work. The jig 321 is balanced at a preset test temperature of -20 ° C to be connected with the work jig 321 The second temperature electronic component 42 maintains a preset test temperature, and the temperature control unit can maintain the first electronic component 41 and the second electronic component 42 at a preset test temperature, and the second electronic component 42 utilizes the first test socket 35. The first transmission member 351 is electrically connected to the first electronic component 41, and the second transmission member 431 of the second test socket 43 is electrically connected to the circuit board 44 to perform a cold-test operation, thereby achieving the practical benefit of improving the test quality.

Referring to Figures 4 and 8, the crimping mechanism 30 of the present invention is applied to a schematic diagram of an electronic component testing and sorting apparatus. The test sorting apparatus includes a machine table 50, a feeding device 60, a receiving device 70, and at least one crimping device of the present invention. The testing device 80 of the mechanism 30, the conveying device 90 and the central control device (not shown) are mounted on the machine 50 and provided with at least one feeding carrier for accommodating the second electronic component to be tested. The receiving device 70 is mounted on the machine 50 and is provided with at least one receiving device 71 for accommodating the second electronic component to be tested. The testing device 80 is mounted on the machine 50, and Providing at least one second tester 81 for holding the second electronic component and at least one crimping mechanism 30 of the present invention, the crimping The mechanism 30 is provided with a carrier, a test unit and a temperature control unit for performing a preset test operation on the second electronic component in cooperation with the second tester 81. In this embodiment, it is on the two sides of the machine 50. A plurality of test devices 80 are disposed opposite to perform a test operation on the second electronic component. The transport device 90 is mounted on the machine 50 and is provided with at least one shifter for transferring the second electronic component. In the embodiment, the first feeder 91 of the conveying device 90 takes out the second electronic component to be tested by the feeding device 61 of the feeding device 60, and transfers it to the first transfer station 92 and the second transfer. The stage 93, the first transfer stage 92 and the second transfer stage 93 carry the second electronic component to be tested to the refueling position for the second shifter 94 and the third shifter 95 to take the material, and the second transfer material The device 94 and the third shifter 95 respectively transfer the second electronic component to be tested to the testing device 80 to perform a test operation, and transfer the second electronic component that has been measured by the testing device 80 to the first transfer station 92. And the second transfer stage 93, the first shifter 91 is taken out from the first transfer stage 92 and the second transfer stage 93 to take out the second measured second According to the test result, the measured second electronic component is sent to the receiving device 71 of the receiving device 70 for sorting and receiving, and the central control device is used for controlling and integrating the devices to perform Automated operations to achieve practical benefits of improved operational performance.

30‧‧‧Inspection mechanism

31‧‧‧ moving arm

32‧‧‧Carriers

321‧‧‧Working fixture

33‧‧‧Guide temperature seat

331‧‧‧ joining parts

34‧‧‧Parts

35‧‧‧First test seat

351‧‧‧First transmission

36‧‧‧First thermostat

37‧‧‧cooler

38‧‧‧Second thermostat

41‧‧‧First electronic components

411‧‧‧First electrical contact

42‧‧‧Second electronic components

421‧‧‧Second electrical contacts

43‧‧‧Second test seat

431‧‧‧Second transmission

44‧‧‧ boards

Claims (10)

A pressure measuring mechanism for a stacked package electronic component, comprising: a carrier: at least one carrier; a test unit: the carrier mounted on the carrier, and having at least one first transmission component a tester, the first tester is configured to receive at least one first electronic component, and electrically connect the first electronic component to one end of the first transmission component, and electrically connect a second electronic component to the other end; Control unit: the carrier mounted on the carrier, and at least one first thermostat is mounted on the carrier to maintain the first electronic component at a preset test temperature, and the first thermostat At least one second thermostat is disposed below to maintain the second electronic component at a preset test temperature. The pressure measuring mechanism of the stacked package electronic component according to claim 1, wherein the carrier is provided with a moving arm that is displaced in at least one direction, and the moving arm is equipped with the carrier. The pressure measuring mechanism of the stacked package electronic component according to claim 1, wherein the carrier is provided with at least one temperature guiding seat on the carrier, and the first tester of the testing unit is Locating at least one of the first electronic components contacting the temperature guiding block, the temperature control unit is configured to assemble the first temperature controller to maintain the first electronic component at a preset test temperature. The pressure measuring mechanism of the stacked package electronic component of claim 3, wherein the temperature guiding seat of the carrier is provided with at least one engaging component that contacts the first electronic component. The pressure measuring mechanism of the stacked package electronic component according to claim 3, wherein the carrier is provided with at least one spacer between the carrier and the temperature guiding seat. The pressure measuring mechanism of the stacked package electronic component according to claim 3, wherein the first tester of the test unit is disposed on the carrier of the carrier and below the temperature guiding seat. The first tester is provided with a first test socket having a first transmission member, and the first transmission member of the first test socket is electrically connected to a first electrical contact of the first electronic component. The pressure measuring mechanism of the stacked package electronic component according to claim 1, wherein the carrier of the carrier is provided with at least one pair of electronic components to perform a preset operation. The pressure measuring mechanism of the stacked package electronic component of claim 1, wherein the first temperature controller of the temperature control unit is a refrigerant chip or a heating element or a body with a pre-warmed fluid, The second thermostat can be a cryogenic wafer or a heating element or a body with a pre-warmed fluid. The pressure measuring mechanism of the stacked package electronic component according to claim 1, wherein the temperature control unit is equipped with at least one cooler. A test classification device for applying a pressure measuring mechanism of a stacked package electronic component, comprising: a machine; a feeding device: being mounted on the machine, and provided with at least one feeding bearing for accommodating the second electronic component to be tested The receiving device is mounted on the machine and is provided with at least one receiving device for accommodating the second electronic component that has been tested; the testing device is mounted on the machine and is provided with at least one bearing a second tester for the second electronic component, and at least one pressure detecting mechanism of the stacked package electronic component according to claim 1 to perform a preset test operation on the second electronic component; The system is mounted on the machine and is provided with at least one shifter for transferring the second electronic component; the central control device is for controlling and integrating the operations of the devices to perform an automated operation.