TWM530955U - Test device for stacked package testing - Google Patents

Description

Test device for stacked package testing

The present invention relates to a test device for an electronic product, and more particularly to a test device for use in a stacked package test.

Referring to FIG. 1 , a stacked package test device 1 is used to test a wafer to be tested 21 , and includes a test platform 10 , an upper socket 11 , and an electrical connection to the test platform 10 , and can be matched with the upper socket The lower socket 12 of 11. The upper socket 11 is coupled to a good wafer 22, and includes an upper body 111, a vacuum flow path 112 disposed in the upper body 111, and a vacuum flow path 112 connected to one end of the lower socket 12. a nozzle 113, and a plurality of test probes 114 embedded in the upper body 111 and each having a test contact 101 exposed outside the upper body 111; the lower socket 12 is used for inserting the test wafer 21 And including a body 121, and a plurality of electrical connectors 122 embedded in the lower body 121 and each having a signal contact 102 exposed outside the lower body 121.

When the wafer 21 to be tested is detected by the stacked package test apparatus 1, the vacuum flow path 112 is connected to a vacuum pump (not shown), and can be directly adsorbed by the nozzle 113. The wafer 21 to be tested is in a specific position, and the wafer 21 to be tested is moved. When the upper socket 11 is attracted to the wafer to be tested 21 and moved to the correct position corresponding to the lower socket 12, then the wafer to be tested 21 can be inserted as shown in FIG. 2 as long as it is moved toward the lower socket 12. The lower socket 12 is electrically connected to the signal to be tested 21 of the electrical connector 122. When the upper socket 11 is also connected to the wafer 21 to be tested from the side opposite to the lower socket 12, and the test contacts 101 of the test probes 114 are electrically connected to the wafer 21 to be tested, the standby The test chip 21, the lower socket 12, the upper socket 11, the good wafer 22, and the test platform 10 are electrically connected, that is, the driving of the test platform 10 enables the electrical signal to be on the good wafer 22 and the waiting The test wafer 21 is transferred, and by confirming the transmitted test signal, it can be detected whether the wafer 21 to be tested is a good product.

When the stacked package test device 1 performs the test, the test result is generated by the transmission of the electrical signal. If the electrical signal is interfered, the test result may be misjudged, thereby affecting the accuracy of the test. However, usually in order to reduce the manufacturing cost, the upper socket 11 is made of a plastic material which is relatively inexpensive and easy to mold, but electromagnetic waves which may interfere with the test result can easily pass through the plastic material, so that the test probes 114 The crosstalk is generated, and the detection performance of the stacked package test apparatus 1 is greatly affected. In terms of improving the detection performance, a powerful solution is inevitable.

Therefore, the object of the present invention is to provide a test apparatus for stacked package testing in which a test can be performed to avoid interference and improve accuracy.

Therefore, the test device applied to the stacked package test is adapted to detect a second chip by using a test platform and a first wafer, wherein the first chip is a good product stored with information, confirming the first The test signal transmitted after the two wafers are electrically connected to the first wafer can detect whether the second wafer is a good product. The test device applied to the stacked package test comprises: a lower socket unit; and an upper socket unit spaced apart from each other by a first direction and the lower socket unit.

The lower socket unit includes a lower body and a plurality of test contacts exposed outside the lower body. The lower socket unit is electrically connected to the test platform, and the lower body is for carrying the second wafer, and the test contacts are electrically connected to the test platform. The test contact is electrically connected to the test platform and is connected to other electronic components for operation together with the test platform.

The upper socket unit includes an upper body surrounding a plurality of through-holes, and a plurality of probes respectively received in the holes and extending in the first direction. One end of the probes is electrically connected to the first wafer, and at least a portion of the upper body is made of a metal material, and at least a portion of the metal material is located between the two probes.

When the test is performed, the upper socket unit moves relative to the lower socket unit in the first direction to cooperate with the lower socket unit, so that the second chip is electrically connected to the other end of the probe of the upper socket unit and the lower socket The unit is tested between the contacts. The test platform, the upper socket unit, the lower socket unit, the first wafer, and the second wafer form a signal connection, such that the first wafer transmits electrical signals to the second wafer through the probes. Since the metal material can provide a good shielding effect on the electromagnetic wave, the upper socket unit can shield the at least two probes by the metal material, so as to avoid the interference of the electrical signals transmitted therebetween. This improves the performance and accuracy of the test.

The effect of the present invention is that at least a part of the upper body of the upper socket unit is made of a metal material, so that when the upper socket unit and the lower socket unit cooperate with each other to test the second wafer, The metal material has a shielding effect between at least two probes to prevent the transmitted electrical signals from being interfered by the generated electromagnetic waves, thereby effectively improving the performance and accuracy of the detection.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 3, a first embodiment of the present invention is applied to a test apparatus for stacked package testing. The first embodiment is adapted to detect a second wafer 92 by a test platform 90 in cooperation with a first wafer 91, wherein the first wafer 91 is generally a memory chip that stores information, and is a good product that has been inspected and confirmed. When the detection is performed, it is confirmed whether the test signal transmitted when the second wafer 92 is connected to the first wafer 91 is correct, that is, Whether the second wafer 92 is good can be detected. The first embodiment comprises: a lower socket unit 3, and an upper socket unit 4 spaced apart from the lower socket unit 3 by a first direction D1.

The lower socket unit 3 includes a lower body 31 and a plurality of test contacts 32 exposed outside the lower body 31. The lower socket unit 3 is electrically connected to the test platform 90, and the lower body 31 is disposed on the test platform 90 and carries the second wafer 92. The test contacts 32 are electrically connected to the test platform 90 to operate together with the test platform 90. The upper socket unit 4 includes an upper body 41 surrounding a plurality of through-holes 410, and a plurality of probes 42 respectively received in the holes 410 and extending along the first direction D1. One end of the probes 42 is electrically connected to the first wafer 91. The upper body 41 has a metal layer 411 extending in a direction perpendicular to the first direction D1, and two opposite sides are opposite to the first direction. D1 is respectively connected to the metal layer 411 and non-metal layers 412, 413 extending in the same direction as the metal layer 411. It is specifically noted that the perforations 410 are through the metal layer 411 such that the probes 42 are surrounded by the metal layer 411.

Referring to FIG. 4, when the test is performed, the upper socket unit 4 is moved toward the lower socket unit 3 in the first direction D1 to cooperate with the lower socket unit 3 to electrically connect the second chip 92 to the upper socket unit 4. The other end of the probe 42 is between the test contact 32 of the lower socket unit 3. The test platform 90, the upper socket unit 4, the lower socket unit 3, the first wafer 91, and the second wafer 92 form a signal connection, so that the first wafer 91 passes through the probes 42 and the second The chip 92 transmits electrical signals. During the test, the electrical signal is transmitted between the probes 42. As long as the electromagnetic layer is shielded by the metal layer 411, a good shielding effect can be produced between each of the two probes 42 to avoid The transmitted electrical signal is interfered by the electromagnetic waves generated, so that the performance and accuracy of the detection can be improved.

Referring to FIG. 5, a second embodiment of a test apparatus for a stacked package test according to the present invention is different from the first embodiment in that the upper body 41 of the upper socket unit 4 is made of metal. The upper socket unit 4 further includes a vacuum flow path 43 extending through the upper body 41 and connected to a vacuum suction device (not shown), and is connected to the vacuum flow path. 43 is opposite to the suction nozzle 44 at one end of the vacuum suction device.

Since the upper main body 41 of the upper socket unit 4 of the second embodiment is made of a metal material, the same effect as that of the first embodiment can be achieved by the shielding effect of the metal when detecting. In addition, since the upper body 41 made of a metal material has a relatively better rigidity than a non-metal such as plastic, in addition to the process of frequent assembly and detachment, the upper socket unit 4 is thereby increased. In addition to the service life, it is also advantageous to perform the processing of the upper body 41 to form the vacuum flow path 43. When the upper body 41 is made of a metal material to enhance the rigidity, the volume of the upper body 41 can be relatively reduced under the same degree of rigidity, thereby reducing the overall volume of the upper socket unit 4, and Made into a thinned appearance.

Referring to FIG. 5 and FIG. 6, it is specifically noted that, when tested in the second embodiment, the vacuum flow path 43 is connected to a vacuum suction device opposite to one end of the suction nozzle 44 to provide suction of the vacuum. The power of the air in the flow passage 43 allows the suction nozzle 44 to be used to adsorb the articles. Then, as long as the upper socket unit 4 is directly moved and the second wafer 92 is sucked by the suction nozzle 44, the effect of moving the second wafer 92 can be achieved, and the upper socket unit 4 can be easily moved by moving the upper socket unit 4. The second wafer 92 and the upper socket unit 4 are assembled with the lower socket unit 3 to perform the detection in a systematic and automated manner, so that the detection process can be more efficient.

In summary, the present invention is applied to a test device of a stacked package test. At least a part of the main body 41 of the socket unit 4 is made of a metal material, and the shielding effect by the metal on the electromagnetic wave can be obtained. The electromagnetic waves generated when the probes are transmitted in the probes 42 have a shielding effect, and the electromagnetic waves are prevented from interfering with the electrical signals transmitted during the test, thereby improving the performance and accuracy of the detection, so that the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and when it is not possible to limit the scope of the present invention, all the simple equivalent changes and modifications according to the scope of the patent application and the contents of the patent specification are still This new patent covers the scope.

3‧‧‧Under socket unit
31‧‧‧Lower subject
32‧‧‧Test contacts
4‧‧‧Upper socket unit
41‧‧‧Upper subject
410‧‧‧Perforation
411‧‧‧metal layer
412‧‧‧Non-metal layer
413‧‧‧Non-metal layer
42‧‧‧Probe
43‧‧‧vacuum runner
44‧‧‧ nozzle
90‧‧‧Test platform
91‧‧‧First chip
92‧‧‧second chip
D1‧‧‧ first direction

Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is a schematic diagram illustrating a conventional stacked package test apparatus; FIG. 2 is a schematic diagram illustrating the stacked type FIG. 3 is a schematic view showing a first embodiment of the test device applied to the stacked package test; FIG. 4 is a schematic view showing the first use of the test device; FIG. 5 is a schematic view showing a second embodiment of the test device applied to the stacked package test of the present invention; and FIG. 6 is a schematic view showing the second implementation For example, the test of the wafer to be tested.

3‧‧‧Under socket unit

31‧‧‧Lower subject

32‧‧‧Test contacts

4‧‧‧Upper socket unit

41‧‧‧Upper subject

410‧‧‧Perforation

411‧‧‧metal layer

412‧‧‧Non-metal layer

413‧‧‧Non-metal layer

42‧‧‧Probe

90‧‧‧Test platform

91‧‧‧First chip

92‧‧‧second chip

D1‧‧‧ first direction

Claims (4)

A test device for a stacked package test is adapted to detect a second wafer by using a test platform in conjunction with a first wafer. The test device for the stacked package test comprises: a socket unit, including a lower a main body, and a plurality of test contacts exposed outside the lower body, the lower socket unit is electrically connected to the test platform, the lower body is for carrying the second chip, and the test contacts are electrically connected to the test platform And an upper socket unit spaced apart from the lower socket unit by a first direction, and including an upper body surrounding a plurality of through-holes, and a plurality of respectively received in the perforations, And a probe extending along the first direction, one end of the probes is electrically connected to the first wafer, and at least a portion of the upper body is made of a metal material, and at least a part of the metal material is located therein Between the pins; when the test is performed, the upper socket unit moves relative to the lower socket unit in the first direction to cooperate with the lower socket unit to electrically connect the second wafer to the upper plug Between the other end of the probe of the unit and the test contact of the lower socket unit, the test platform, the upper socket unit, and the lower socket unit, the first wafer form a signal connection with the second chip, so that the The first wafer transmits electrical signals to the second wafer through the probes, and the metal material creates a shielding effect between the at least two probes to prevent the electrical signals from being interfered with each other. The test device applied to the stacked package test according to claim 1, wherein the upper body of the upper socket unit has a metal layer extending in a direction perpendicular to the first direction, and at least one is connected in the first direction And a non-metal layer extending in the same direction as the metal layer, the through holes extending through at least the metal layer. The test device applied to the stacked package test according to claim 1, wherein the upper body of the upper socket unit is made of a metal material. The test device applied to the stacked package test according to claim 3, wherein the upper socket unit further comprises a vacuum flow path penetrating the upper body and one end for communicating with a vacuum suction device, and a vacuum is connected thereto The flow path is opposite to the suction nozzle at one end of the vacuum suction device.