JP2007292696A - Testing tool and test method for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To fix an LSI to a testing device easily and surely without using an expensive IC socket. <P>SOLUTION: A frame 11 for loading a test object LSI 1 on a mother board 10 is provided, and a through hole 13 is provided on a spot where a contact point 12 for connecting to the LSI 1 inside the frame 11 is not formed. A probe 21 for connecting to a pad on the back of the mother board 10, and a space 22 and a discharge tube 23 for vacuum-adsorbing the mother board 10 are provided on a tester head 20 for loading the mother board 10 and connected the LSI 1 to a testing device body. When the mother board 10 is loaded on the tester head 20, and the test object LSI 1 is loaded on the mother board 10, and a vacuum pump connected to the discharge tube 23 is operated, the mother board 10 is adsorbed to the tester head 20, and the LSI 1 is adsorbed to the mother board 10. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a test jig and a test method for testing a semiconductor device (hereinafter referred to as “LSI”) fixed to a test apparatus.

FIG. 2 is an explanatory diagram of an LSI testing method using a conventional test jig.
This test jig is also called a mother board 40, and is composed of a socket 41 for inserting the LSI 1 to be tested and a printed wiring board 42 on which the socket 41 is mounted. The printed wiring board 42 has, for example, an insulating substrate such as glass epoxy resin and a wiring layer such as copper foil formed on the surface or inside thereof, and is provided on the terminal of the socket 41 and the back surface of the insulating substrate by this wiring layer. This is an electrical connection between the pads.

  The mother board 40 is mounted at a predetermined position on the tester head 50 of the test apparatus. On the other hand, although not shown, a plurality of probes are arranged on the tester head 50 so as to come into contact with pads provided on the back surface when the mother board 40 is mounted at a predetermined position. Connected to the main unit.

  When the LSI 1 is tested using such a mother board 40, first, the mother board 40 is mounted at a predetermined position on the tester head 50 of the test apparatus. Next, the LSI 1 to be tested is inserted into the socket body 41b provided on the mother board 40. Further, by closing and pressing the lid 41l of the socket 41, the terminal of the LSI 1 and the terminal of the socket 41 are brought into contact with each other with a predetermined pressure. Thereafter, predetermined power and signals are supplied from the test apparatus main body to the LSI 1 via the tester head 50 and the mother board 40, and the LSI 1 is tested.

JP 2002-202346 A

  In Patent Document 1, as a position fixing method (or apparatus) for reducing the displacement of a device to be inspected due to a temperature change, a tray is provided with a recess, and the inspection target device is fitted in the recess. There is a description that uses a handler that fixes the position at a place, or connects a vacuum pump to the recess and vacuum-adsorbs the device to be inspected to the recess to fix the position at the inspection place.

However, since the mother board 40 is connected to the LSI 1 using the socket 41, there are the following problems.
(1) Manual work is required in which the LSI 1 is placed in the socket body 41b and the lid 41l of the socket 41 is pressed and closed.
(2) If there is a gap between the lid 41l of the socket 41 and the LSI 1, there is a possibility that the connection cannot be made normally.
(3) If the margin between the lid 41l of the socket 41 and the LSI 1 is small, the lid 41l may not close or the socket 41 or the LSI 1 may be damaged.
(4) The setting of the margin of the lid 41l of the socket 41 is delicate and difficult to create.
(5) Depending on the material of the socket body 41b, temperature restrictions may occur during the test.

  It is an object of the present invention to provide a test jig and a test method for easily and surely fixing an LSI to be tested to a test apparatus for testing.

  The LSI test jig of the present invention is a test jig for mounting an LSI to be tested and making an electrical connection between an external terminal of the LSI and a probe of a test apparatus. An insulating substrate having a frame for mounting on the substrate, a plurality of contacts provided at locations corresponding to external terminals of the LSI mounted in the frame on the surface of the insulating substrate, and the back surface of the insulating substrate on the back surface A plurality of pads provided at locations corresponding to the probe of the test apparatus, a wiring layer that electrically connects the contact and the pad, and the inside of the frame to suck the LSI from the test apparatus side And a through hole provided so as to penetrate from the front surface to the back surface of the insulating substrate.

  In the present invention, a through hole is provided in a substrate of a test jig on which an LSI to be tested is mounted, and the LSI is adsorbed by removing air from the test apparatus through the through hole. Thus, there is an effect that the LSI can be easily and reliably fixed to the test apparatus and tested without using an expensive IC socket.

  The above and other objects and novel features of the present invention will become more fully apparent when the following description of the preferred embodiment is read in conjunction with the accompanying drawings. However, the drawings are for explanation only, and do not limit the scope of the present invention.

  FIGS. 1A and 1B are block diagrams of an LSI test apparatus showing Embodiment 1 of the present invention. FIG. 1A is a plan view seen from above, and FIG. It is sectional drawing of the part which follows the AA line in a).

  This test apparatus includes a mother board 10 which is a test jig for mounting the LSI 1 to be tested, a tester head 20 for connecting to an external terminal of the LSI 1 via the mother board 10, a test apparatus main body (not shown), It consists of

  Similar to a general printed wiring board, the mother board 10 has an insulating substrate such as glass epoxy resin and a wiring layer such as copper foil formed on the surface or inside thereof, on the LSI mounting surface (front surface). Is provided with a frame 11 having a size and a shape that fits just around the LSI 1 to be tested. A plurality of contacts 12 are provided on the surface of the mother board 10 inside the frame 11 at positions corresponding to the external terminals of the LSI 1, and further, air is passed through the inside of the frame 11 where the contacts 12 are not provided. For this purpose, a through hole 13 is provided.

  A plurality of pads 14 for connection are formed on the back surface of the motherboard 10 at locations corresponding to the probes 21 of the tester head 20, and electrical connection is made between the pads 14 and the corresponding contacts 12 through the wiring layer 15. Connected.

  On the other hand, the tester head 20 is provided with a probe 21 that contacts the pad 14 on the back surface of the motherboard 10, a space 22 for vacuum-sucking the motherboard 10, and an exhaust for sucking out air in the space 22. A tube 23 is provided. The space 22 is formed at a position where the space 22 is connected to the through hole 13 of the motherboard 10. A vacuum pump (not shown) is connected to the exhaust pipe 23, and a test apparatus main body (not shown) is connected to the probe 21.

Next, an LSI test method using this test apparatus will be described.
First, the mother board 10 is disposed at a predetermined position on the tester head 20 so that each pad 14 on the back surface of the mother board 10 contacts the corresponding probe 21 of the test head 20.

  Next, the LSI 1 to be tested is mounted on the motherboard 10 in accordance with the frame 11 on the surface of the motherboard 10.

  Thereafter, the vacuum pump connected to the exhaust pipe 23 of the tester head 20 is operated to make the space 22 of the tester head 20 in a reduced pressure state. As a result, the mother board 10 is attracted to the tester head 20, and the space between the mother board 10 and the LSI 1 is decompressed through the through hole 13 provided in the mother board 10. As a result, the LSI 1 is attracted to the mother board 10, and the external terminals of the LSI 1 are brought into close contact with the contacts 12 provided on the surface of the mother board 10. At this time, in order to maintain an appropriate contact state, the vacuum degree of the vacuum pump is adjusted so that the contact pressure per terminal between the external terminal of the LSI 1 and the contact 12 of the motherboard 10 is about 25 g.

  In this state, a predetermined power supply or signal is supplied from the test apparatus main body to the LSI 1 via the tester head 20 and the mother board 10 to test the LSI 1.

As described above, the LSI test apparatus according to the first embodiment has the following advantages.
(A) An expensive socket for LSI becomes unnecessary, and the cost can be reduced.
(B) Since it is only necessary to place the LSI 1 at a predetermined position on the mother board 10, manual work of pressing and closing the lid of the socket becomes unnecessary.
(C) Since no socket is used, troubles such as a connection failure due to a difference in dimensions between the socket and the LSI, and damage to the socket or the LSI are eliminated. In addition, there are no temperature restrictions during testing due to the socket material.

  The adsorption of the mother board 10 using a vacuum pump is generally performed, and it is not necessary to prepare a new test head 20 for this purpose.

  FIGS. 3A and 3B are block diagrams of an LSI test apparatus showing Embodiment 2 of the present invention. FIG. 3A is a plan view seen from above, and FIG. It is sectional drawing of the part which follows the BB line in a). In FIG. 3, elements common to the elements in FIG.

  This test apparatus is provided with a mother board 10A having a slightly different configuration in place of the mother board 10 in FIG.

  That is, the motherboard 10A is provided with a stopper 16 for holding the LSI 1 to be tested on the LSI mounting surface (front surface). The stopper 16 holds the LSI 1 at a predetermined position on the surface of the motherboard 10A by supporting the four corners of the LSI 1. On the surface of the mother board 10A, a plurality of contacts 12 are provided at positions corresponding to the external terminals of the LSI 1 held by the stopper 16, and further, at a location where the contacts 12 are not provided in the area where the LSI 1 is held. Are provided with a plurality of through holes 13 for allowing air to pass therethrough.

  Further, on the back surface of the motherboard 10A, a plurality of pads 14 for connection are formed at locations corresponding to the probes 21 of the tester head 20, and electricity between the pads 14 and the corresponding contacts 12 passes through the wiring layer 15. Connected.

  Further, as an accessory of the motherboard 10A, a box-shaped lid 17 that covers the LSI 1 and the stopper 16 held on the surface of the motherboard 10A is prepared. The lid 17 is formed so that the flange portion 17f of the box is in close contact with the surface of the mother board 10A when it is put on the LSI 1, and the bottom portion 17b of the box is almost the same height as the surface of the LSI 1.

  Note that the tester head 20, the test apparatus main body and the vacuum pump (not shown) are the same as those in the first embodiment.

Next, an LSI test method using this test apparatus will be described.
First, the mother board 10A is arranged at a predetermined position on the tester head 20 so that each pad 14 on the back surface of the mother board 10A contacts the corresponding probe 21 of the tester head 20.

  Next, the LSI 1 to be tested is mounted on the motherboard 10A in accordance with the stopper 16 on the surface of the motherboard 10A.

Further, the lid 17 is placed on the LSI 1 to be tested.
Thereafter, the vacuum pump connected to the exhaust pipe 23 of the tester head 20 is operated to make the space 22 of the tester head 20 in a reduced pressure state. As a result, the motherboard 10A is adsorbed by the tester head 20, and the space between the motherboard 10A and the lid 17 is decompressed through the plurality of through holes 13 provided in the motherboard 10A. As a result, the bottom 17b of the lid 17 is drawn toward the surface of the motherboard 10A, and the surface of the LSI 1 is pressed against the motherboard 10A by the bottom 17b of the lid 17. As a result, the external terminal of the LSI 1 is in close contact with the contact 12 provided on the surface of the motherboard 10A. At this time, in order to maintain an appropriate contact state, the degree of vacuum of the vacuum pump is adjusted so that the contact pressure per terminal between the external terminal of the LSI 1 and the contact 12 of the motherboard 10A is about 25 g.

  In this state, a predetermined power supply or signal is supplied from the test apparatus main body to the LSI 1 via the tester head 20 and the mother board 10A, and the LSI 1 is tested.

As described above, the LSI test apparatus according to the second embodiment has the following advantages in addition to the advantages (a) to (c).
(D) Since a structure requiring dimensional accuracy like the frame 11 in FIG. 1 is not required, the structure can be simplified.

  4A and 4B are block diagrams of an LSI test apparatus showing Embodiment 3 of the present invention. FIG. 4A is a plan view seen from above, and FIG. It is sectional drawing of the part which follows the CC line in a). In FIG. 4, elements common to the elements in FIG.

  This test apparatus includes a motherboard 10B for mounting the LSI 1 to be tested, a tester head 20B for connecting to an external terminal of the LSI 1 via the motherboard 10B, and dry air on the surface of the LSI 1 mounted on the motherboard 10B. Is constituted by a blower tube 30 for spraying the air and a test apparatus main body (not shown).

  The motherboard 10B is obtained by removing the through hole 13 from the motherboard 10A of FIG. That is, a stopper 16 for holding the LSI 1 to be tested is provided on the LSI mounting surface (front surface), and a plurality of contacts 12 are provided at positions corresponding to the external terminals of the LSI 1 held by the stopper 16. . Further, on the back surface of the motherboard 10B, a plurality of pads 14 for connection are formed at locations corresponding to the probes 21 of the tester head 20B, and between the pads 14 and the corresponding contacts 12 are electrically connected through the wiring layer 15. Connected.

  The tester head 20B mounts the motherboard 10B and makes electrical connection with the LSI 1 mounted on the motherboard 10B. The tester head 20B has a probe 21 that contacts the pad 14 on the back surface of the motherboard 10B. In this example, the space 22 and the exhaust pipe 23 for vacuum-sucking the motherboard 10B are not particularly required, but some mechanism for fixing the motherboard 10B to a predetermined position of the tester head 20B is necessary. .

  The blower pipe 30 blows dry air sent from a blower (not shown) onto the surface of the LSI 1 and presses the surface of the LSI 1 with wind pressure. The nozzle portion at the tip of the blower pipe 30 can move up and down. .

Next, an LSI test method using this test apparatus will be described.
First, the mother board 10B is arranged at a predetermined position on the tester head 20B so that each pad 14 on the back surface of the mother board 10B contacts the corresponding probe 21 of the tester head 20B.

  Next, the test target LSI 1 is mounted on the motherboard 10B in accordance with the stopper 16 on the surface of the motherboard 10B.

  Thereafter, the nozzle portion of the blower pipe 30 is lowered to a predetermined height on the LSI 1, and the blower connected to the blower pipe 30 is operated. As a result, the LSI 1 is pressed against the surface of the motherboard 10B, and the external terminals of the LSI 1 are in close contact with the contacts 12 provided on the surface of the motherboard 10B. At this time, in order to maintain an appropriate contact state, the air volume of the blower is adjusted so that the contact pressure per terminal between the external terminal of the LSI 1 and the contact 12 of the motherboard 10B is about 25 g.

  In this state, a predetermined power supply or signal is supplied from the test apparatus body to the LSI 1 via the tester head 20B and the mother board 10B, and the LSI 1 is tested.

  As described above, the LSI test apparatus according to the third embodiment has the advantages (a) to (d). In addition, since the ventilation of dry air is generally performed also in the conventional test apparatus, if this is utilized, it is not necessary to newly prepare ventilation equipment, such as a blower.

In addition, this invention is not limited to the said Example, A various deformation | transformation is possible. Examples of this modification include the following.
(A) The shape, size, number, and position of the through-holes 13 provided in the mother board of FIGS. 1 and 3 are examples, and need to be appropriately arranged according to the arrangement of external terminals of the LSI 1 to be measured. For example, in the case of a BGA package in which external terminals are arranged on the entire back surface of an LSI, a large through hole cannot be provided in the central portion, and thus it is necessary to provide a plurality of small through holes between external terminals.
(B) In FIGS. 1, 3 and 4, the BGA package LSI is assumed. However, the present invention can be applied to other shape LSIs such as QFP and QFJ.

1 is a configuration diagram of an LSI test apparatus showing a first embodiment of the present invention. FIG. It is explanatory drawing of the testing method of LSI using the conventional test jig. It is a block diagram of the LSI test apparatus which shows Example 2 of this invention. It is a block diagram of the LSI test apparatus which shows Example 3 of this invention.

Explanation of symbols

1 LSI
10, 10A, 10B Motherboard 11 Frame 12 Contact 13 Through hole 14 Pad 15 Wiring layer 16 Stopper 17 Lid 20, 20B Tester head 21 Probe 22 Space 23 Exhaust pipe 30 Blower pipe

Claims (6)

A semiconductor device test jig for mounting a semiconductor device to be tested and performing electrical connection between an external terminal of the semiconductor device and a probe of the test device,
An insulating substrate having a frame for mounting the semiconductor device at a predetermined position;
A plurality of contacts provided at locations corresponding to external terminals of the semiconductor device mounted in the frame on the surface of the insulating substrate;
A plurality of pads provided at locations corresponding to the probe of the test apparatus on the back surface of the insulating substrate;
A wiring layer that electrically connects the contact and the pad;
A through-hole provided through the inner surface of the insulating substrate from the front surface to the rear surface to suck the semiconductor device from the test device side;
A jig for testing a semiconductor device, comprising: A semiconductor device test jig for mounting a semiconductor device to be tested and performing electrical connection between an external terminal of the semiconductor device and a probe of the test device,
An insulating substrate having a stopper for mounting the semiconductor device at a predetermined position;
A plurality of contacts provided at locations corresponding to external terminals of the semiconductor device mounted in the stopper on the surface of the insulating substrate;
A plurality of pads provided at locations corresponding to the probe of the test apparatus on the back surface of the insulating substrate;
A wiring layer that electrically connects the contact and the pad;
A through hole provided inside the stopper from the front surface to the back surface of the insulating substrate;
A cover that covers the semiconductor device mounted on the insulating substrate and contacts the surface of the semiconductor device when the semiconductor device is sucked from the test device through the through-hole, and presses the semiconductor device against the insulating substrate;
A jig for testing a semiconductor device, comprising: A semiconductor device test jig for mounting a semiconductor device to be tested and performing electrical connection between an external terminal of the semiconductor device and a probe of the test device,
An insulating substrate having a stopper for mounting the semiconductor device at a predetermined position;
A plurality of contacts provided at locations corresponding to external terminals of the semiconductor device mounted in the stopper on the surface of the insulating substrate;
A plurality of pads provided at locations corresponding to the probe of the test apparatus on the back surface of the insulating substrate;
A wiring layer that electrically connects the contact and the pad;
A blower pipe for pressing the semiconductor device against the insulating substrate by wind pressure from the surface of the semiconductor device mounted on the insulating substrate;
A test jig for a semiconductor device, comprising: An insulating substrate having a frame for mounting a semiconductor device to be tested at a predetermined position; a plurality of contacts provided at locations corresponding to external terminals of the semiconductor device mounted in the frame; and the insulating substrate A plurality of pads provided at locations corresponding to the probe of the test apparatus on the back surface, a wiring layer electrically connecting the contact and the pad, and penetrating from the surface of the insulating substrate to the back surface inside the frame A test method of a semiconductor device using a test jig provided with a through hole provided as
The test jig is mounted on the test apparatus so that the pad on the back surface corresponds to the probe of the test apparatus,
Mounting the semiconductor device in the frame;
The semiconductor device is sucked from the test device side through the through hole to bring the external terminal of the semiconductor device into contact with the contact of the test jig at a predetermined pressure,
Testing the semiconductor device from the test apparatus;
A test method for a semiconductor device. An insulating substrate having a stopper for mounting a semiconductor device to be tested at a predetermined position; a plurality of contacts provided at locations corresponding to external terminals of the semiconductor device mounted on the insulating substrate; and the insulating substrate A plurality of pads provided at a position corresponding to the probe of the test apparatus on the back surface, a wiring layer electrically connecting the contact and the pad, and penetrating from the surface of the insulating substrate to the back surface inside the stopper A test method of a semiconductor device using a test jig provided with a through hole provided as
The test jig is mounted on the test apparatus so that the pad on the back surface corresponds to the probe of the test apparatus,
The semiconductor device is mounted at a predetermined position of the test jig,
Covering the semiconductor device with a lid;
The lid is sucked through the through hole from the test apparatus side to bring the external terminal of the semiconductor device and the contact of the test jig into contact with each other at a predetermined pressure,
Testing the semiconductor device from the test apparatus;
A test method for a semiconductor device. An insulating substrate having a stopper for mounting a semiconductor device to be tested at a predetermined position; a plurality of contacts provided at locations corresponding to external terminals of the semiconductor device mounted on the insulating substrate; and the insulating substrate Semiconductor device test method using a test jig comprising a plurality of pads provided at locations corresponding to the probe of the test apparatus on the back surface of the test apparatus, and a wiring layer for electrically connecting the contacts and the pads Because
The test jig is mounted on the test apparatus so that the pad on the back surface corresponds to the probe of the test apparatus,
The semiconductor device is mounted at a predetermined position of the test jig,
Air is blown onto the surface of the semiconductor device to bring the external terminal of the semiconductor device into contact with the contact of the test jig at a predetermined pressure,
Testing the semiconductor device from the test apparatus;
A test method for a semiconductor device.

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