JP6178969B1 - Tray exchange type burn-in test unit - Google Patents

Abstract

An object of the present invention is to provide means for preventing an air pipe from being attached / detached even when a semiconductor device type is changed. A burn-in board unit (200) on which a test tray (300) is replaceably mounted and a board rack (110) on which the burn-in board unit (200) is mounted, the board rack (110) comprising a pressure plate (120) constituting a test space for decompression. And a plurality of air cylinders 130 for driving the pressing plate 120 up and down. The burn-in board unit 200 includes a burn-in board, a contact substrate, a vacuum chamber frame constituting a test space for decompression, and the test tray. The test tray 300 includes a socket for housing a semiconductor device and a tray frame. [Selection] Figure 1

Description

  The present invention relates to a tray exchange type burn-in test unit for performing a test by mounting a test tray on which a semiconductor device is mounted on a burn-in board unit used in a burn-in test apparatus or an aging apparatus for semiconductor devices.

Semiconductor devices are subjected to electrical property tests such as stress tests and functional tests in a high or low temperature environment.
In these tests, a burn-in board in which a test socket is mounted on a substrate is generally used.

  On the other hand, Patent Document 1 discloses an invention in which a test is performed using a burn-in board equipped with a test tray instead of a general test socket.

  That is, in Patent Document 1, a test tray having the same arrangement as the JEDEC standard tray is mounted with a socket for mounting one semiconductor device with the terminal of the semiconductor device facing down, and the socket is mounted on the burn-in board. Alignment pins for alignment with the contact substrate, a mechanism for floating on the test tray, a terminal for electrical connection with the individual terminals of the semiconductor device, and a floating mechanism An invention has been disclosed in which positioning is performed by fitting with positioning holes provided in a contact substrate.

Since the invention according to Patent Document 1 is mounted on the burn-in board unit with a pressure plate that presses the package surface of the semiconductor device and an air cylinder that drives the pressure plate up and down, There was a problem that the work of installing / removing the air piping occurred and that all the structural members were to be replaced.
In addition, since it is an inspection apparatus using a test tray that is limited to a test tray arrangement that can be transferred from a JEDEC standard tray, a plurality of pins that perform insertion / extraction in the tray frame, floating, and alignment with the contact substrate are provided. It was necessary to secure an installation space and a space for housing the semiconductor device.
For this reason, with the progress of narrow pitch, multiple pins, and downsizing, there is a problem that it may not be possible to configure the test tray with the same size and the same arrangement as the JEDEC standard tray due to insufficient space.
Furthermore, there is no disclosure of a technique related to the prevention of dropping of the semiconductor device during tray conveyance, and there is a problem that the semiconductor device falls from the tray due to vibration during conveyance.

  Means for solving the problems of the present invention are as follows.

First,
A burn-in board unit with a replaceable test tray,
A tray exchange type burn-in test unit including a board rack on which the burn-in board unit is mounted;
The board rack is
A pressing plate having a flat bottom surface constituting the test space for decompression;
A plurality of air cylinders for driving the pressing plate up and down,
The burn-in board unit is
Burn-in board for mounting circuit components, etc.
A contact substrate for electrical connection with the semiconductor device;
A vacuum chamber frame constituting a test space for decompression;
A tray mounting stage for mounting the test tray,
The test tray includes a plurality of sockets for housing semiconductor devices,
With a tray frame,
A tray replaceable burn-in test unit having a function of aligning with the burn-in board unit when mounted on the tray mounting stage.
Here, the tray replaceable burn-in test unit according to the present invention is used for a burn-in test apparatus or an aging apparatus of a semiconductor device, and is mounted so that a test tray on which a semiconductor device is mounted can be replaced. A test is performed using a vacuum pressure for electrical connection between a terminal of a semiconductor device and a terminal of a contact substrate mounted on the burn-in board unit.

Second,
The socket of the test tray is
An IC holder formed with a semiconductor device housing hole for housing one or a plurality of the semiconductor devices;
A terminal positioning sheet that is installed under the IC holder and guides the terminals of the semiconductor device housed in the IC holder;
A socket lid for confining the semiconductor device housed in the semiconductor device housing hole;
It has a socket frame divided into upper and lower to incorporate them,
The tray replaceable type according to the first aspect, characterized in that it has a function of positioning with a terminal of a semiconductor device, further floating in a predetermined range on the test tray, and aligning with the contact substrate. Burn-in test unit.
The IC holder may be provided with an inclination at the upper part of the four sides of the hole for accommodating the semiconductor device.
By providing the slope in this way, it becomes possible to improve the insertability of the semiconductor device.
Further, the terminal positioning sheet is made of a material such as polyimide resin having high heat resistance and good workability, so that a hole having a narrow pitch and a small diameter of 0.2 mm or 0.3 mm pitch is formed by laser processing. Processing becomes possible.
Furthermore, the terminal positioning sheet can form a terminal positioning hole for guiding and positioning the terminal of the semiconductor device at a position facing the semiconductor device housing hole provided in the IC holder.
The socket lid is attached to the socket frame so as to be in contact with the upper surface of the IC holder and to be opened and closed with a horizontal axis of rotation at one end of the socket lid.

Third,
The tray replaceable burn-in test unit according to the second aspect, wherein the socket lid is formed with a convex portion that closes the upper space of the semiconductor device.
The convex portion of the socket lid can contact the upper surface of the semiconductor device accommodated in the semiconductor device accommodation hole constituted by the IC holder and the terminal positioning sheet so as not to be pressed, or can be closed with a minute gap. In order to do so, the dimension of the convex portion is determined.
Further, the convex portion is formed on the lower surface of the socket lid in accordance with the size of the semiconductor device. In the type in which one semiconductor device is accommodated in the socket, one convex portion is formed. For example, in a type in which nine semiconductor devices are stored in a socket, nine convex portions can be formed in accordance with the storage position of each semiconductor device.
The socket lid can be made of a material having high thermal conductivity such as aluminum.
With this configuration, the pressing plate is lowered by the pressing force of the air cylinder, the test tray is pressed down by pressing the socket lid, and the test space for pressure reduction is further reduced in pressure. The test tray is further pushed down, and the terminal of the semiconductor device accommodated in the test tray is connected to the terminal of the contact substrate.
Fourth,
4. The tray replaceable burn-in according to claim 3, wherein there are a plurality of convex portions formed on the socket lid corresponding to the semiconductor device accommodated in the IC holder having the plurality of semiconductor device accommodation holes. Test unit.

According to the present invention, the following effects can be obtained.

According to the first aspect of the invention, the burn-in board unit includes a pressing plate, an air, and a plurality of air cylinders that drive the pressing plate up and down on the board rack side. Since cylinders and air pipes are not installed, the product type can be changed by simply replacing the burn-in board unit and the test tray, and can be easily inserted and removed.
Further, the socket can accommodate one or a plurality of semiconductor devices, and can be mounted on a test tray such as a narrow pitch, multi-pin, thin, small package such as WLCSP or CSP.
Further, the size of the test tray is not limited by the JEDEC standard tray, and can be configured with one tray or a plurality of trays according to the burn-in board size.
Therefore, the insertability of a semiconductor device into a socket such as WLCSP or CSP, such as a narrow pitch, multi-pin, thin, and small package, is improved, and one or more semiconductor devices are accurately positioned in the socket. Can do.

According to the second invention, since the socket lid corresponding to each semiconductor device is provided, it is possible to prevent the semiconductor device from jumping out or dropping while the test tray is being transported.
Further, the external force applied to the semiconductor device is only the contact pressure of the contact pin, and this contact pressure can be uniformly received by the bottom surface of the socket lid corresponding to each semiconductor device. With a thin package thickness such as 2 mm, it is possible to prevent breakage such as cracks in a semiconductor device having a large outer size.
At this time, a conventional board handler can be used for mounting / removing the semiconductor device to / from the test tray by opening and closing the socket lid and using the same technique as the conventional clam cell socket handling.
Furthermore, by providing the socket lid, the bottom surface side of the pressing plate that presses the upper surface of the socket lid can be flattened, and the pressing plate can be provided on the board rack side.
Furthermore, the heat transmitted from the pressing plate can be efficiently conducted to the semiconductor device by using a material having good thermal conductivity such as aluminum as the material of the pressing plate and the socket lid.

It is a perspective view of a tray exchange type burn-in test unit concerning the present invention. It is a longitudinal cross-sectional view in the principal part of the tray exchange type burn-in test unit which concerns on this invention. It is a perspective view for demonstrating the combination of the burn-in board unit which concerns on this invention, and a test tray, and is shown in the state which floated the test tray. It is a perspective view which shows the relationship between one socket on the test tray of the tray exchange type burn-in test unit according to the present invention and a contact substrate mounted at a position facing the socket. It is a perspective view which shows the structure of the burn-in board unit of the tray exchange type burn-in test unit which concerns on this invention. It is a perspective view which shows the structure of the test tray of the tray exchange type burn-in test unit which concerns on this invention. It is a perspective view which shows the external appearance of the socket mounted in the test tray of the tray exchange type burn-in test unit which concerns on this invention. It is a perspective view which shows the structure of the socket of the type which accommodates one semiconductor device of the tray exchange type burn-in test unit which concerns on this invention. It is a perspective view which decomposes | disassembles and shows the socket shown in FIG. It is a perspective view which shows the structure of the IC holder and terminal positioning sheet | seat shown in FIG. It is a perspective view which shows the structure of the socket of the type which accommodates nine semiconductor devices of the tray exchange type burn-in test unit which concerns on this invention. It is a perspective view which decomposes | disassembles and shows the socket shown in FIG. It is a perspective view which shows the structure of the IC holder and terminal positioning sheet | seat shown in FIG. 1 is a perspective view of a burn-in test apparatus equipped with a tray replaceable burn-in test unit according to the present invention.

Hereinafter, embodiments for carrying out the present invention will be described more specifically with reference to the drawings with reference to narrow pitch packages such as BGA and CSP.
Here, in the accompanying drawings, the same reference numerals are given to the same members, and redundant descriptions are omitted.
In addition, since description here is one form by which this invention is implemented, this invention is not limited to a corresponding form.

A tray exchange type burn-in test unit 100 according to the present invention shown in FIG. 1 includes a board rack 110 composed of a frame member, a burn-in board unit 200 inserted into the board rack 110, and a test tray 300 combined with the board unit 200. It is configured.
A test tray 300 on which a plurality of semiconductor devices D are mounted is mounted on the burn-in board unit 200 and has a mechanism capable of being taken out.

The board rack 110 is provided with a rectangular pressing plate 120 that presses down the test tray 300 mounted on the burn-in board unit 200 at a position corresponding to each test tray 300.
Furthermore, four air cylinders 130 for moving the pressing plate 120 up and down are attached to the board rack 110 in correspondence with each corner of the pressing plate 120.

  Each pressing plate 120 is provided with one vacuum suction port 140 for connecting a pipe from a vacuum pump for pressure reduction (not shown).

As shown in FIG. 2, the main part of the tray replaceable burn-in test unit is that the vacuum pump for decompression (not shown) is stopped before the test immediately after the test tray 300 is mounted on the tray mounting stage 250, As the end of the rod 131 of the air cylinder 130 attached to the board rack 110 moves upward, the pressing plate 120 connected to the rod 131 moves upward.
In FIG. 2, 200 is a burn-in board unit, 210 is a burn-in board, 220 is a vacuum chamber frame, 230 is a board frame, 240 is a contact substrate, 121 is a vacuum seal that contacts the vacuum chamber frame 220 in a lowered position, and 150 is a vacuum chamber. A test space 300 for decompression constituted by the frame 220 and the vacuum seal 121, and 300 represents a test tray.

As shown in FIG. 3, the test tray 300 is mounted on the tray mounting stage 250 of the burn-in board unit 200.
In order to understand the figure, the test tray 300 is illustrated in a state of being lifted from the tray mounting stage 250.
Here, when the test tray 300 is pushed down by the pressing plate 120 (see FIG. 2), the positioning pin 260 provided on the burn-in board unit 200 and the alignment hole 330 provided on the test tray 300 are fitted, Alignment is performed.

As shown in FIG. 4, there are a socket 310 on which the semiconductor device D is mounted and a tray frame 320 on which the socket 310 is mounted, and a contact substrate connected to a terminal of the semiconductor device D below the tray frame 320. 240 and the burn-in board 210 are combined.
The alignment of the socket 310 and the contact substrate 240 is performed by fitting the alignment hole 316 provided in the socket 310 and the alignment pin 241 provided in the contact substrate 240.
Although not shown, the socket 310 has a mechanism that floats in a predetermined range with respect to the tray frame 320.
The alignment of the terminal of the semiconductor device D mounted on the socket 310 and the socket 310 will be described with reference to FIGS. 9, 10, 12, and 13 described later.

As shown in FIG. 5, the burn-in board unit 200 includes a rectangular burn-in board 210 having a connection terminal on one end side, a square vacuum chamber frame 220, a board frame 230, a contact substrate 240, a tray mounting stage 250, a tray position. The alignment pin 260 is configured.
The vacuum chamber frame 220 is installed so as to surround the periphery of the upper surface of the burn-in board 210 in order to form a decompression test space 150 (see FIG. 2).

The board frame 230 is installed on the back surface of the burn-in board 210 in order to reinforce the burn-in board 210.
The contact substrate 240 is formed on the upper surface of the burn-in board 210 so as to be electrically connected to the terminals of the semiconductor device D (see FIG. 4).
The tray alignment pin 260 is configured to perform alignment with the test tray 300 (see FIG. 3).

As shown in FIG. 6, the test tray 300 includes a plurality of sockets 310 arranged vertically and horizontally to accommodate the semiconductor devices D (see FIG. 4), a tray frame 320 for mounting the sockets 310, and The tray alignment hole 330 is used for alignment with the burn-in board unit 200 (see FIG. 3).
FIG. 7 shows a state in which the socket lid 313 is closed with respect to the appearance of a single socket 310 that houses one or more semiconductor devices D (see FIG. 4).

As shown in FIGS. 8 to 10, a socket 310 of a type that accommodates one semiconductor device D includes an openable / closable socket lid 313, an IC holder 314, a terminal positioning sheet 315, an upper socket frame 311, and a lower socket frame 312. It consists of
The socket lid 313 is attached to the upper socket frame 311 so as to be in contact with the upper surface of the IC holder 314 and to be opened and closed with a horizontal rotation shaft located on one end side.
By providing the socket lid 313 in this way, it is possible to prevent the semiconductor device D from jumping out or dropping while the test tray 300 is being transported.

Further, a convex portion 313a is provided on the lower surface of the socket lid 313 so as to contact the upper surface of the semiconductor device D accommodated in the semiconductor accommodation hole 317 so as not to be pressed or to close with a minute gap. .
As a result, the external force applied to the semiconductor device D is only the contact pressure of the contact substrate 240, so that the contact pressure can be evenly received by the socket lid 313. As a result, 0.1 mm or 0 It is possible to prevent breakage such as cracks in the semiconductor device D having a large outer size with a thin package thickness of 2 mm or the like.

  Further, when the socket lid 313 is made of a material such as aluminum having high thermal conductivity, the pressing plate 120 is lowered by the thrust of the air cylinder 130 and is transmitted from the pressing plate 120 by pressing the socket lid 313. Heat can be efficiently conducted to the semiconductor device D.

The IC holder 314 shown in FIGS. 8 to 10 has a semiconductor housing hole 317 for housing one semiconductor device D.
The terminal positioning sheet 315 has terminal positioning holes 318 that guide the terminals of the semiconductor device D accommodated in the semiconductor device accommodation holes 317.
The terminal positioning sheet 315 is installed below the IC holder 314.

Here, as shown in FIG. 9, the alignment holes 316 for alignment with the contact substrate 240 (see FIG. 4) correspond to the positions of the semiconductor device D at four locations, the upper socket frame 311, IC The holder 314, the terminal positioning sheet 315, and the lower socket frame 312 are formed.
Also, as shown in FIG. 9, alignment holes 319a for preventing positional displacement of each component during assembly are provided at the four corners outside the alignment holes 316, the upper socket frame 311, the IC holder 314, and the terminals. Each is formed on the positioning sheet 315.

In the lower socket frame 312, positioning pins 319 corresponding to the positioning holes 319a are formed at the four corners on the upper surface side.
By combining each positioning hole 319a with the positioning pin 319, it is possible to prevent positional deviation during assembly.
Although illustration is omitted, the socket 310 floats within a predetermined range on the tray frame 320.

The semiconductor device accommodation hole 317 is formed in a quadrangular shape so as to match the shape of the semiconductor device D, and the upper part of its four sides is particularly inclined as shown in FIG.
As described above, by providing an inclination in the upper part, the semiconductor device D can be easily accommodated in the semiconductor device accommodation hole 317.

The terminal positioning sheet 315 has a plurality of terminal positioning holes 318 for guiding and positioning the terminals of the semiconductor device D at positions facing the semiconductor device housing holes 317 provided in the IC holder 314.
As described above, the terminal positioning hole 318 is provided so that the ball-shaped terminal of the semiconductor device D is dropped, so that the terminal of the semiconductor device D accommodated in the socket 310 can be positioned.

  Here, the terminal positioning sheet 315 is made of a material such as polyimide resin having high heat resistance and good workability, so that terminals such as a BCA or CSP package having a narrow pitch of 0.2 mm pitch or 0.3 mm pitch, etc. It is possible to process a large number of holes for positioning the semiconductor device D with high accuracy, and it is possible to position the semiconductor device D with high accuracy.

Note that the IC holder 314 and the terminal positioning sheet 315 may be bonded to each other with an adhesive and incorporated into the lower socket frame 312.
Further, the alignment hole 316 of the socket 310 is an alignment hole with the head of the board handler when the semiconductor device D mounted on the test tray 300 is taken out by the board handler or mounted on the test tray 300. Can also be used.

  As shown in FIGS. 11 to 13, the basic configuration of the socket 310 that accommodates nine semiconductor devices D is the same as that of the socket 310 that accommodates one semiconductor device D, but nine sockets 310 are included in one socket 310. In order to accommodate the semiconductor devices D, nine convex portions 313a are formed on the back surface of the socket lid 313 so as to match the housing positions of the semiconductor devices D.

Next, a usage example of the tray exchange type burn-in test unit according to the present invention will be described.
As shown in FIG. 14, the tray exchange type burn-in test unit 100 is mounted on a burn-in test apparatus 400. Specifically, the test tray 300 is mounted on the burn-in board unit 200 mounted on the board rack 110. Has been.

  Since the lower surface of the pressing plate 120 attached to the board rack 110 is flattened, it is possible to cope with all types of semiconductor devices D by preparing the test tray 300 corresponding to the type.

The test tray 300 on which the semiconductor device D is mounted is inserted and mounted on the upper side of the burn-in board unit 200 as schematically shown in FIG.
At the start of the test, the pressing plate 120 is pressed downward by the air cylinder 130 shown in FIG. 2 so that the pressing plate 120 comes into contact with the test tray 300, and then the test tray 300 is pressed down.
Then, the vacuum seal 121 attached to the pressing plate 120 is pushed down until it contacts the vacuum chamber frame 220.
As a result, the pressure plate 120, the burn-in board 210 of the burn-in board unit 200, and the vacuum chamber frame 220 constitute a decompression test space 150.

Next, by operating a vacuum pump for pressure reduction (not shown), the test space 150 for pressure reduction is decompressed, and the pressing plate 120 further pushes down the test tray 300, and the terminals of the semiconductor devices D mounted on the test tray 300 The terminals of the contact substrate 240 of the burn-in board unit 200 are connected, and the semiconductor device D is tested.
At the end of the test, the vacuum pump for pressure reduction is stopped, and the pressing plate 120 is pushed upward by the air cylinder 130.
At this time, the test tray 300 returns to a position where it can be removed from the burn-in board unit 200 by a mechanism that returns to the position before the start of the test together with the tray mounting stage 250.

Since the present invention is configured as described above, specifically, the following problems can be addressed.
In recent years, the price of burn-in boards for semiconductor devices, which are becoming narrower in pitch, has increased several times or more than the conventional one.
As an example, it is said that the price of a memory burn-in board on which about 120 BGA packages with a pitch of 0.4 mm to 0.35 mm are mounted is 1.5 million yen or more.

At present, IOT devices are attracting attention, and semiconductor device packages are also expanding to BGA, FBGA, CSP, and WLCSP, and narrow pitch, multi-pin, thin, and miniaturization are progressing.
Currently, the development of burn-in boards with a narrow pitch package with a pitch of 0.3 mm to 0.2 mm not only increases the component cost and manufacturing cost, but also is an area that is difficult to manufacture with the conventional test socket method and socket solder dip method. It is becoming.

The tray exchange burn-in test unit of the present invention has the following effects in addition to the above description.
By making the burn-in board resident in the equipment by the tray replacement method, the number of burn-in board investments that are expensive can be halved.
The operating rate of the test equipment can be improved by actually operating except when replacing the tray.

The number of burn-in board sockets can be increased and the number of board investments can be reduced.
Soldering is not required for mounting on a substrate such as a contact substrate, and the manufacturing cost can be reduced.

Due to the above-mentioned effects, not only can it be applied to narrow pitch packages and small packages that are expected to be developed in the future, but also the effect of reducing the investment cost of burn-in board to 1/2 to 1/3 can be expected.
Further, the present invention is applicable not only to burn-in tests but also to post-process tests that require a high number of measurements.

D Semiconductor device 100 Tray exchange type burn-in test unit 110 Board rack
120 pressure plate
121 Vacuum seal 130 Air cylinder 131 Rod 140 Vacuum suction port 150 Decompression test space 200 Burn-in board unit 210 Burn-in board 220 Vacuum chamber frame 230 Board frame 240 Contact substrate 241 Positioning pin 250 Tray mounting stage 260 Tray alignment pin 300 Test tray 310 Socket 311 Upper socket frame 312 Lower socket frame 313 Socket lid 313a Protrusion 314 IC holder 315 Terminal positioning sheet 316 Socket alignment hole 317 Semiconductor device receiving hole 318 Terminal positioning hole 319 Positioning pin 319a Positioning pin 320 Tray frame 330 Tray alignment Hole 400 burn-in test equipment

JP2015-055511A

Claims (1)

A burn-in board unit with a replaceable test tray,
A tray exchange type burn-in test unit including a board rack on which the burn-in board unit is mounted;
The board rack is
A pressing plate having a flat bottom surface constituting the test space for decompression;
A plurality of air cylinders for driving the pressing plate up and down,
The burn-in board unit is
Burn-in board,
A contact substrate;
A vacuum chamber frame constituting a test space for decompression;
A tray mounting stage for mounting the test tray,
The test tray is
A socket for housing a semiconductor device and a tray frame;
The socket of the test tray is
An IC holder in which a semiconductor device housing hole for housing the semiconductor device is formed;
A terminal positioning sheet that is installed under the IC holder and guides the terminals of the semiconductor device housed in the IC holder;
Characterized in that and a socket cover to confine the semiconductor devices accommodated in the semiconductor device receiving hole, preparative rate replaceable burn-in test unit.