JPH1098083A - Test socket and electric characteristic test device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize an electric characteristic test device, which is superior in general-purpose properties and lessened in characteristic test cost by a method, wherein carriers which are possessed of housing sections different in size and arrangement pitch are provided. SOLUTION: A large number of test objects 15 are arranged at a prescribed interval on the measurement terminal arranged region 10 of a socket main body 2, and the test objects 15 are arranged and aligned through a carrier 3 laid on the socket main body 2. That is, the test objects 15 are put in housing sections 16, arranged on the carrier 3, whereby the test objects are positioned, and the electrode for each test object 15 is brought into contact with measurement terminal 9, overlapping accurately with it. The carriers 3 having housing sections 16 different in size and arrangement pitch are prepared. That is, the housing sections 16 of the carrier 3 are changed in size, so as to cope with a change in the size of the test object 15, when the bump electrodes of the test object 15 are kept unchanged in arrangement pitch.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection socket and an electrical characteristic inspection apparatus, and more particularly to an inspection socket and an electrical characteristic inspection apparatus for electronic components such as semiconductor chips and semiconductor devices having electrodes arranged on one surface. For example, BGA (Ball Grid Array) and CSP (Chip Scale Pac
The present invention relates to a technology that is effective when applied to a technology for simultaneously inspecting the electrical characteristics of a plurality of semiconductor devices such as a semiconductor device at the same time.

[0002]

2. Description of the Related Art As one of semiconductor devices (semiconductor integrated circuit devices), semiconductor devices such as BGA and CSP are known. These BGAs and CSPs have a structure in which electrodes (for example, bump electrodes) are aligned on a flat bottom surface.

[0003] Regarding the BGA, see, for example, "Nikkei Electronics" published by Nikkei BP, February 14, 1994, p.
To P73. This document discloses a test socket that can be used for burn-in of a plastic BGA or the like.

[0004] On the other hand, CSP is described in, for example, "Electronic Materials", April 1995, P22-P28, issued by the Industrial Research Council.

[0005]

As described in the above-mentioned document, a conventional BGA test socket is composed of a socket body composed of a resin base on which measurement terminals (metal electrodes) are arranged in a ball grid shape. And a lid which is attached to one edge of the socket body via a hinge so as to be freely opened and closed. When the BGA type semiconductor device is put in the socket main body and the lid is closed, each electrode (bump electrode) of the BGA type semiconductor device comes into contact with the measurement terminal of the test socket, and the electrical characteristics test can be performed.

[0006] As can be seen from the name, the CSP type semiconductor device is manufactured so that the dimensions of the package (sealing body) are close to the dimensions of the semiconductor chip covered by the package. Has become.

[0007] From these, the following disadvantages arise.

(1) Even if the pitch of the electrodes is the same, the conventional test socket cannot be used if the package dimensions and the number of electrodes are changed, and the versatility is poor.

(2) If the electrodes and electrode patterns of the semiconductor device become finer, the processing of the measurement terminals (metal electrodes) of the inspection socket becomes troublesome, the manufacturing cost rises, and the reduction of the characteristic inspection cost is hindered.

(3) According to the above (2), a new inspection socket is prepared every time the package size or the number of electrodes is changed (development)
And the cost of characteristic inspection increases.

(4) The development of a new inspection socket takes time, and in some cases it may not be in time for the production schedule.
(Development time) may also cause problems.

(5) Arranging the test sockets so as to match the number of electrodes and the package size of the semiconductor device makes management such as securing a storage space for the test sockets troublesome.

An object of the present invention is to provide an inspection socket and an electrical characteristic inspection apparatus which are excellent in versatility.

Another object of the present invention is to provide an inspection socket and an electrical characteristic inspection apparatus which can reduce the characteristic inspection cost.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0016]

The following is a brief description of an outline of typical inventions disclosed in the present application.

(1) An inspection socket for an object to be inspected having electrodes arranged on one surface thereof, wherein the socket is the same as the electrode interval of the object to be inspected and is provided over a larger area than the single object to be inspected. A main body made of a wiring board having a plurality of measuring terminals on its upper surface and external terminals electrically connected to each of the measuring terminals on a peripheral edge thereof; and A plate-shaped carrier having a plurality of housing portions for detachably housing the electrodes, and having an electrode of the inspection object housed in each housing portion configured to contact the measurement terminal; An inspection socket comprising: a holding lid detachably mounted on an object to be inspected; and positioning means for positioning at least the socket body and the carrier relative to each other.

(2) In the configuration of the means (1), a plurality of carriers having mutually different sizes and arrangement pitches of the housing portions are provided.

(3) In the configuration of the means (2), a part of the carriers is configured to accommodate the inspection object having an electrode array having an integral multiple pitch of the terminal pitch of the measurement terminals in the accommodation section. .

(4) In the configuration of the means (1) to (3), the peripheral wall has an inclined guide surface so that the accommodation portion gradually widens upward.

(5) In the configuration of the means (1) to (4), the lid is provided with a pressing means which elastically acts on the inspection object stored in the storage section of the carrier.

(6) In the configuration of the means (1) to (4), the measuring terminal is depressed at the center.

(7) In the configuration of the means (6), the socket body is manufactured by a transfer board method in which a wiring board having a connection electrode body protruding from the upper surface is fixed on the wiring board. An insulating resin plate, the insulating resin plate is provided with a through-hole into which the connection electrode body is inserted, and an upper end portion of the through-hole becomes a hemispherical seat for receiving an electrode of the inspection object, A conductor layer is provided on the entire inner peripheral surface of the through hole, and is electrically connected to the connection electrode body.

(8) In the configuration of the means (1) to (5), a guide taller than the measuring terminals is provided on the upper surface of the socket body so as to surround the measuring terminals.

(9) In the configuration of the means (1) to (6) and the means (8), the socket body is provided with an elastic layer for elastically supporting the measuring terminal.

(10) In the configuration of the means (9),
The socket body has an insulative property including a base substrate that is not easily deformed, an elastic body that is fixed on the base substrate, and an external terminal that is fixed on the elastic body and that is connected to the measurement terminal and the measurement terminal. And a resin tape.

(11) An electrical characteristic inspection apparatus for inspecting characteristics of an inspection object having electrodes arranged on one surface, comprising a socket body, a carrier, and a lid, wherein the carrier has a plurality of inspection objects. A tester having a support for mounting the test sockets arranged and accommodated therein and having a means for electrically connecting to the socket body; a loader section for supplying the test object in an aligned state of the carrier; An unloader section for accommodating inspection objects in an aligned state of the carrier, and a plurality of inspection objects in an aligned state of the loader section for loading onto a carrier on the support table and a carrier on the support table A handler for holding the inspection objects in the row arrangement state and transferring them to the unloader section, and loading / unloading the lid on the carrier. The inspection socket has a plurality of measurement terminals on the upper surface which are the same as the electrode spacing of the inspection object and are provided over a larger area than the single inspection object. A socket body formed of a wiring board having peripheral terminals having external terminals electrically connected to the respective measurement terminals, and a housing portion detachably stacked on the socket body and detachably housing the object to be inspected. A plate-shaped carrier configured such that the electrodes of the inspection object stored in each of the plurality of storage units are in contact with the measurement terminals, and removably stacked on each of the inspection objects held by the carrier; And a positioning means for positioning at least the socket body and the carrier relative to each other.

(12) In the structure of the means (11), the inspection socket has the structure of the means (2) to (10).

According to the means (1), (a) the socket body composed of the wiring board has a structure in which the measuring terminal is provided at the center of the wiring board and the external terminals are provided at one peripheral portion, so that the wiring is shortened. This improves the characteristic inspection (evaluation) accuracy.

(B) Since a plurality of inspection objects are accommodated in the carrier and the characteristic inspection can be performed, the characteristic inspection efficiency is improved and the characteristic inspection cost can be reduced.

According to the above-mentioned means (2), (a) the characteristic inspection can be performed for the inspection object having a different electrode pitch by exchanging the carrier. Therefore, a characteristic inspection of a semiconductor chip or a semiconductor device having a new package size can be performed, and the inspection socket has excellent versatility.

(B) Even if the electrodes and electrode patterns of the semiconductor device become fine, once the socket body is manufactured, the socket body having the same measuring terminal pitch need not be formed. Further, in the development of an inspection socket adapted to the development of an object to be inspected having the same electrode pitch, the socket body does not need to be manufactured, and the manufacture of a carrier according to the package size is sufficient. The carrier is easy to manufacture and the manufacturing cost is inexpensive, since the carrier is only formed with an accommodating portion on the plate. Therefore, the development of the inspection socket accompanying the development of a new product is short-term and low-cost.

According to the means of the above (3), by exchanging the carrier, the characteristic inspection of the inspection object having the electrode arrangement of an integer multiple pitch of the terminal pitch of the measurement terminals can be performed by the same inspection socket. .

According to the means of (4), the peripheral wall has an inclined guide surface so that the accommodation portion gradually widens upward. Therefore, when the object to be inspected is put into the accommodation portion. Since the object to be inspected moves along the guide surface and is positioned, the electrode of the object to be inspected accurately overlaps and comes into contact with the measuring terminal of the socket body, so that accurate characteristic inspection can be performed.

According to the means (5), the lid acts as a weight, and the pressing means provided on the lid elastically presses the test object against the socket body. Electrical contact between the electrode and the measuring terminal is assured, and an accurate characteristic test can be performed. Also,
Since the pressing means elastically acts on the inspection object,
The electrode that comes into contact with the measurement terminal is no longer pressed more than necessary, and damage to the electrode can be prevented.

According to the means of (6), since the center of the measurement terminal is depressed, the electrode of the test object can easily enter the depression, and the test object is inserted into the socket body by the lid. When pressed, the electrode tries to enter the recess, and the self-alignment (self-alignment) function works, so that the contact between the electrode of the inspection object and the measurement terminal of the socket main body is ensured, and accurate characteristic inspection can be performed. Become. The self-alignment effect is particularly effective when the electrode of the inspection object is a ball-shaped bump electrode.

According to the means (7), the socket body is formed by the wiring board having the connecting electrode body protruding from the upper surface and the insulating resin plate manufactured by the transfer molding method. In addition, the manufacturing of the socket body is facilitated, and the manufacturing cost can be reduced.

According to the means of (8), since a guide taller than the measuring terminals is provided on the upper surface of the socket body so as to surround the measuring terminals, the object to be inspected is covered with the lid. Is pressed against the socket body, the periphery of the electrode of the object to be inspected is guided by the guide, so that it easily overlaps the electrode on the center side of the guide (self-alignment action), and the electrode of the object to be inspected and the measuring terminal of the socket body The contact with the semiconductor device is ensured, and an accurate characteristic inspection can be performed. The self-alignment effect is particularly effective when the electrode of the inspection object is a ball-shaped bump electrode.

According to the means of (9), since the socket body is provided with the elastic layer for elastically supporting the measuring terminal, an impact load when the object to be inspected is mounted on the socket body is provided. Can be alleviated, and application of an overload to the lid can be prevented, and damage to the inspection object can be prevented.

According to the means (10), since the elastic body acts as an elastic layer, the impact load when mounting the object to be inspected on the socket body can be reduced as in the case (9). At the same time, overload application to the lid can be prevented, and damage to the inspection object can be prevented.

According to the means (11), a plurality of inspection objects can be accommodated in the inspection socket at one time, and the characteristic inspection can be performed by automatically loading and unloading, so that the electrical characteristic inspection can be performed with high efficiency. It can be carried out. Therefore, a reduction in the characteristic inspection cost can be achieved.

According to the means (12), (a) the characteristic inspection can be performed for the inspection object having a different electrode pitch by exchanging the carrier. Therefore, the characteristics of semiconductor chips and semiconductor devices with new package dimensions can be inspected.
It becomes an electrical characteristic inspection device with excellent versatility.

(B) By replacing the carrier,
It is also possible to perform a characteristic inspection of an inspection object having an electrode arrangement having an integral multiple pitch of the terminal pitch of the measurement terminals, so that the electrical characteristic inspection apparatus has excellent versatility.

(C) Since the peripheral wall has an inclined guide surface so that the carrier accommodating portion gradually widens upward, when the object to be inspected is put into the accommodating portion, the object to be inspected is as described above. Since the electrode is moved along the guide surface and positioned, the electrode of the object to be inspected accurately overlaps and comes into contact with the measuring terminal of the socket body, and an accurate characteristic inspection can be performed.

(D) The lid acts as a weight, and the pressing means provided on the lid elastically presses the test object against the socket body, so that the electric connection between the electrode of the test object and the measuring terminal is made. The accurate contact is ensured, and accurate characteristic inspection can be performed. In addition, since the pressing means elastically acts on the inspection object, the electrode in contact with the measurement terminal is not pressed more than necessary, and damage to the electrode can be prevented.

(E) Since the center of the measuring terminal of the socket body is depressed, the electrode of the test object can easily enter the depression, and when the test object is pressed against the socket body with the lid, the electrode As a result, the self-alignment (self-alignment) action is effected so that the electrode of the object to be inspected contacts the measuring terminal of the socket body, and an accurate characteristic inspection can be performed. The self-alignment effect is particularly effective when the electrode of the inspection object is a ball-shaped bump electrode.

(F) Since the socket body is formed by the wiring substrate having the connection electrode body protruding from the upper surface and the insulating resin plate manufactured by the transfer molding method, the socket body can be easily manufactured. Thus, a reduction in manufacturing cost can be achieved.

(G) Since a guide that is taller than the measuring terminals is provided on the upper surface of the socket body so as to surround each measuring terminal, when the object to be inspected is pressed against the socket body by the lid, The periphery of the electrode of the object to be inspected is guided by the guide and easily overlaps the electrode on the center side of the guide (self-alignment action), and the contact between the electrode of the object to be inspected and the measuring terminal of the socket body is ensured, An accurate characteristic inspection can be performed. The self-alignment effect is particularly effective when the electrode of the inspection object is a ball-shaped bump electrode.

(H) Since the socket body is provided with an elastic layer for elastically supporting the measuring terminals, the impact load when mounting the object to be inspected on the socket body can be reduced, and the cover body can be oversized. Load application can be prevented, and damage to the inspection object can be prevented. In addition, even with a structure in which the socket body is provided with an elastic body, the impact load when mounting the object to be inspected on the socket body can be reduced and the overload of the lid can be prevented,
The inspection object can be prevented from being damaged.

[0050]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments of the present invention, components having the same functions are denoted by the same reference numerals, and their repeated description will be omitted.

(Embodiment 1) FIGS. 1 to 6 are views relating to a test socket according to a first embodiment of the present invention, FIG. 1 is an exploded perspective view of the test socket, FIG. 2 is a schematic sectional view of the test socket, 3 is a partially enlarged sectional view of the test socket, FIG. 4 is a plan view showing a socket main body of the test socket, FIG. 5 is a plan view showing a carrier of the test socket, and FIG. 6 tests CSP type semiconductor devices having different electrode pitches. It is a partial schematic plan view showing the state set to the socket.

As shown in FIG. 1, the inspection socket 1 of the first embodiment includes a socket body 2, a carrier 3, and a lid 4 each having a rectangular plate shape. The socket body 2
Guide pins 5 are implanted at the four corners of the carrier 3 and guide holes 6 and 7 into which the guide pins 5 are inserted are provided at the four corners of the carrier 3 and the lid 4. .

Thus, the carrier 3 and the cover 4 are inserted so that the guide pins 5 are inserted into the guide holes 6 and 7.
Can be sequentially stacked on the socket body 2. Therefore, the lid 4 and the guide pin 5 are always detachable from the socket body 2.

The socket body 2 is formed of a wiring board that does not warp or warp, and as shown in FIG.
Substantially the entire area except the periphery of the upper surface is a measurement terminal arrangement area 10 in which the measurement terminals 9 are provided. The measurement terminals 9 are indicated by dots in FIG. The measuring terminals 9 are arranged in n columns and m rows. The arrangement of the measuring terminals 9 is as follows.
It matches the electrode arrangement provided on the lower surface (one surface) of a desired electronic component (test object) such as a semiconductor chip or a semiconductor device.

In the measurement terminal arrangement area 10, a large number of inspection objects can be placed at a predetermined interval at a time.

External terminals 11 are provided on both sides of the socket body 2 at a predetermined pitch. Each of these external terminals 11 is electrically connected to the measurement terminal 9 via a wiring 12 as shown in FIG. Further, the external terminal 11 is electrically connected to a tester to be described later via an electrical connection means.

On the other hand, the carrier 3 is formed of a metal plate or an insulating resin plate. In the case of a metal plate, it may be necessary to adopt a structure capable of achieving insulation from the object 15 to be inspected, or to cover with an insulating film.

As described above, the measurement terminal arrangement area 1
At 0, a large number of test objects are placed at a predetermined interval at a time. This alignment is performed by the carrier 3 superimposed on the socket body 2. That is, accommodation portions 16 for accommodating the inspection object 15 are arranged at predetermined intervals in the carrier 3 as shown in FIG. The inspection object 15 is positioned by inserting the inspection object 15 into the accommodating portion 16, and the electrodes 17 of the inspection objects 15 are accurately overlapped with the respective measurement terminals 9 and come into contact with each other.

The inspection object 15 is, for example, a CSP type semiconductor device and a BGA type. Therefore, the electrode 17 provided on the lower surface of the inspection object 15 is
As shown in FIG. 2, bump electrodes (ball electrodes) 17 are arranged and formed.

The accommodating portion 16 has a through-hole structure, the details of which are shown in FIG. 3. The lowermost portion is a supporting portion for supporting the inspection object 15 by the support piece 20, and the middle portion is a vertical wall for supporting the inspection object 15 in the vertical wall. A positioning portion for positioning at 21 and an upper portion serve as a guide portion for guiding the inspection object 15 placed in the housing portion 16 to the positioning portion. The inspection object 15 is positioned at the hole of the positioning portion.

In the guide section, the peripheral wall has an inclined guide surface 22 (tapered structure) so that the accommodation section 16 gradually widens upward. When the test object 15 is placed in the test object 15, the test object 15 moves along the guide surface 22, so that the test object 15 can be reliably accommodated in the positioning portion, and the bump electrode 17 of the test object 15 accurately overlaps the measurement terminal 9 of the socket body 2. It is set as follows.

A plurality of carriers 3 having different sizes of the accommodating portions 16 and different arrangement pitches of the accommodating portions 16 are provided. That is, even if the size of the inspection object 15 changes, if the pitch of the bump electrodes 17 on the inspection object 15 is the same, the size of the housing portion 16 in the carrier 3 may be changed. In this case, as the size of the housing section 16 changes, the arrangement pitch of the housing sections 16 naturally changes.

As described above, if a plurality of types of carriers 3 having different sizes of the accommodating portion 16 are prepared, they can be used as inspection sockets for a plurality of types of inspection objects 15 and versatility is improved.

The inspection socket 1 of the first embodiment is
It can be used even when the pitch a of the alignment of the bump electrodes 17 on the inspection object 15 is an integral multiple. The pitch of the bump electrodes 17 of the inspection object 15 on the left side of FIG. 6 is a, which corresponds to the measurement terminal 9 of the socket body 2. Therefore, in the case of the inspection object 15 on the left side, all the measurement terminals 9 in the region where the inspection object 15 overlaps are used as inspection (measurement) electrodes.

On the other hand, the inspection object 15 on the right side of FIG.
The pitch of the bump electrodes 17 is 2a, and only the measurement terminals 9 indicated by black circles are used as inspection electrodes in the region where the housing portions 16 overlap.

Therefore, the housing 16 of the socket body 2
By selecting the size and the arrangement pitch of the housing portions 16, the characteristic inspection of the inspection object 15 having an integral multiple pitch is also possible. In the above description, the arrangement pitch of the measurement terminals 9 and the bump electrodes 17 is the same a for both the row and the column. However, the same can be applied to the case where the pitch is different between the row and the column.

On the other hand, the lid 4 is formed of a metal plate, a resin plate or the like. However, since the lid 4 needs to be placed on the inspection target 15 and pressed against the socket body 2,
The weight is formed so as to have a predetermined weight. Also, on the lower surface of the lid 4, the accommodation portion 1 of the carrier 3 is provided.
Pressing means is provided corresponding to 6. In the case of the first embodiment, the pressing means is a rubber plate 25 attached to the lower surface of the lid 4. When the lid 4 is placed on the carrier 3, the rubber plate 25 elastically acts on the test object 15, so that all the bump electrodes 17 of the test object 15 reliably contact the measuring terminals 9. As a result, a good quality inspection can be performed.

When the inspection socket 1 of the first embodiment is used, the carrier 3 is positioned on the socket body 2 and overlapped. Then, the housing 16 of the socket body 2
After the inspection object 15 is stored in the carrier 3, the lid 4 is placed on the carrier 3. As a result, each inspection object 15 is positioned and pressed against the socket main body 2, so that each inspection object 1
Since the 5 bump electrodes 17 surely come into contact with the predetermined measuring terminals 9 respectively, a good characteristic test can be performed.

Although the first embodiment has a structure in which the load of the lid 4 is applied to the inspection object 15 via the pressing means, the lid 4 is brought into direct contact with the inspection object 15. If the load is applied to the inspection object 15, the lid 4 can be used as it is even if the size of the housing 16 of the carrier 3 is changed.

The inspection socket of the first embodiment has the following effects.

(1) Since a plurality of inspection objects 15 are accommodated in the carrier 3 and the characteristic inspection can be performed simultaneously at a time, the characteristic inspection efficiency is improved and the characteristic inspection cost can be reduced.

(2) The socket body 2 made of a wiring board
Since the structure has the measurement terminal 9 at the center of the wiring board and the external terminal 11 at one peripheral portion, the wiring is shortened, and the accuracy of characteristic inspection (evaluation) is improved.

(3) Since a plurality of carriers 3 having the same electrode pitch of the inspection object 15 and different sizes of the accommodating portions 16 for accommodating the inspection object 15 are prepared, the carriers are limited to those having the same electrode pitch. In the development of a new inspection object, the characteristic inspection can be performed using a carrier having an accommodating portion corresponding to the size of the inspection object, so that the development of an inspection socket accompanying the development of a new product becomes unnecessary.

(4) In the case where the electrode pitch is the same and the sizes of the housing portions do not match, only the development (manufacturing) of the socket body 2 is sufficient, and the development period of the inspection socket 1 can be shortened. Since the carrier 3 is simply formed with the accommodating portion 16 in the plate body, the production is easy and the production cost is low, and the development of the inspection socket accompanying the development of a new product is short-term and low-cost.

(5) In the above (3) and (4),
When the electrodes and electrode patterns of the object 15 to be inspected such as a semiconductor device and a semiconductor chip become fine, the effect of reducing the development cost of the inspection socket 1 is great. In particular, the inspection object 1 is directly provided only with the lid 4 without providing the pressing means on the lid 4.
In the case of a structure in which a load is applied to 5, the development of the lid 4 can be omitted, and the manufacturing cost of the inspection socket 1 can be further reduced.

(6) As can be seen from the above (3) and (4), the inspection socket has excellent versatility.

(7) By selecting the carrier 3, it is possible to perform the characteristic inspection of the inspection object having the electrode arrangement of an integer multiple pitch of the electrode pitch of the inspection object 15 with the same inspection socket, and the versatility is high. In addition, a reduction in the characteristic inspection cost can be achieved.

(8) Since the peripheral wall of the accommodating portion 16 is the inclined guide surface 22 which gradually widens upward, when the inspected object 15 is put into the accommodating portion 16, the inspected object 1
5 moves along the guide surface 22 and drops to the positioning portion of the housing portion 16, so that the positioning accuracy of the inspection object 15 is increased, and the electrode 17 of the inspection object 15 is connected to the socket body 2.
And accurately contact the measuring terminal 9 of the measuring device 9 to perform an accurate characteristic inspection.

(9) The lid 4 acts as a weight, and the pressing means provided on the lid 4
5 is elastically pressed against the socket body 2, the electrical contact between the electrode 17 of the test object 15 and the measurement terminal 9 is ensured, and an accurate characteristic test can be performed.

(10) Since the pressing means acts on the inspection object 15 resiliently, the electrode 17 surely comes into contact with the measuring terminal 9 and a predetermined contact pressure can be obtained, so that a good characteristic inspection can be performed. Becomes In addition, an unnecessary load is not applied to the electrode 17 that comes into contact with the measurement terminal 9, and the electrode 17 can be prevented from being damaged.

(11) According to the above (1) to (10), according to the present invention, it is possible to provide an inspection socket which is excellent in versatility and which can reduce the characteristic inspection cost.

(Embodiment 2) FIG. 7 shows Embodiment 2 of the present invention.
FIG. 2 is a schematic sectional view showing a part of the inspection socket 1 of FIG. In the second embodiment, an arc-shaped recess 30 is formed in the surface of the measurement terminal 9 of the socket body 2 that receives the bump electrode 17 of the housing 16.
And the inspection object 1
5, each bump electrode 17 is positioned at the measurement terminal 9.

As a pressing means for applying a load to the inspection object 15, a method using a leaf spring 31 fixed to the lower surface of the lid 4 is adopted. As a result, the bump electrode 17 of the inspection object 15 reliably comes into contact with the measurement terminal 9 of the socket body 2, and a good characteristic inspection can be performed.

The shape of the depression 30 may be any shape such as a circle, a triangle, and a polygon. Further, the cross-sectional shape of the depression 30 may be a quadrangle other than a semicircle. Further, the shape may be a cone-shaped depression. The shape of these depressions 30 can be formed by an etching technique, a plating technique, or the like. Alternatively, a resist or the like may be attached around the measuring terminal 9 so that the height of the upper surface of the measuring terminal 9 is lower than the height of the upper surface of the resist.

As an embodiment in which the periphery of the measuring terminal 9 is raised to form a substantial depression 30, there is an embodiment shown in FIG. 8 (a modification of the second embodiment). In this example, a resin tape 33 provided with holes 32 vertically and horizontally is positioned and adhered to the upper surface of the socket body 2, and the depression 30 is formed by the holes 32 and the measuring terminals 9.

According to the second and third embodiments, (1) the depression 30 is directly provided on the surface of the measuring terminal 9 itself, or the measurement is substantially performed by the resin tape 33 provided around the measuring terminal 9 or the like. Since the depression 30 is formed in the surface portion of the terminal 9, the bump electrode 17 of the inspection object 15 enters the depression 30, and the self-alignment works to increase the positioning accuracy between the bump electrode 17 and the measurement terminal 9, thereby improving the accuracy. Characteristic inspection becomes possible.

(2) In the case where the depression 30 is provided on the surface side of the measuring terminal 9, the positioning part is not required in the housing part 16, the processing of the housing part 16 is simplified, and the manufacturing cost of the carrier 3 can be reduced. .

(3) Even when the leaf spring 31 is used as the pressing means, the leaf spring 31 elastically acts on the inspection object 15, so that the electrode 17 surely comes into contact with the measuring terminal 9 and a predetermined contact pressure is applied. And good characteristic inspection becomes possible.
In addition, an unnecessary load is not applied to the electrode 17 that comes into contact with the measurement terminal 9, and the electrode 17 can be prevented from being damaged.

(Embodiment 3) FIGS. 9A to 9D are schematic cross-sectional views showing steps of manufacturing a socket body in an inspection socket according to Embodiment 3 of the present invention.

In the third embodiment, the socket body 2 is formed using the transfer molding technique. That is,
FIG. 9 (a)
As shown in FIG. 7, an insulating resin plate 36 having a depression 35 is formed. Depressions 35 are arranged and formed on the upper surface of the insulating resin plate 36.

Next, a through hole 37 is formed at the bottom of the depression 35 by laser processing or drilling with a drilling machine.

Next, conductive wires 38 are formed on the surfaces of the recesses 35 and the through holes 37 by plating.

Next, as shown in FIG. 9D, a wiring board 40 having a conical connection electrode body 41 on the upper surface is prepared. On the wiring board 40, a conical connection electrode body 41 that is electrically connected to the wiring 12 extending over the inside and outside of the wiring board 40 is implanted on the upper surface.

Next, the connection electrode body 41 is inserted into the through hole 37 of the wiring board 40 from below, and the wiring board 40 and the insulating resin plate 36 are fixed with the insulating adhesive 42, and FIG. The socket body 2 as shown in d) is manufactured.

According to the third embodiment, the socket body 2
Is a wiring board 4 having a connecting electrode body 41 protruding from the upper surface.
0 and the insulating resin plate 36 manufactured by the transfer molding method, the socket body 2 can be easily manufactured, and the manufacturing cost can be reduced.

(Embodiment 4) FIG. 10 is a schematic sectional view showing a part of a socket body in an inspection socket according to Embodiment 4 of the present invention.

In the fourth embodiment, the socket body 2 is provided with an elastic layer 45 for elastically supporting the measuring terminals 9.

The socket body 2 includes a base 47 made of a glass epoxy resin plate or the like, and an adhesive 4 on the base 47.
The elastic layer 45 is made of a silicone rubber plate and is fixed to the elastic layer 45 via the adhesive 8, and the wiring board 50 is made of glass epoxy resin and is fixed on the elastic layer 45 through an adhesive 49. The elastic layer 45 is, for example, 50 to 150
It has a thickness of μm and acts as an elastic layer. Further, the measurement terminal 9 having the depression 30 is provided on the upper surface of the wiring board 50 as in the second embodiment.

According to the inspection socket 1 of the fourth embodiment,
Since the socket body 2 is provided with the elastic layer 45 for elastically supporting the measuring terminals 9, the impact load when mounting the inspection object 15 on the socket body 2 can be reduced and the cover 4 Load application can be prevented, and damage to the inspection object 15 can be prevented.

(Embodiment 5) FIG. 11 is a schematic plan view showing a part of a socket body in a test socket according to a fifth embodiment of the present invention, and FIG. 12 is a schematic sectional view showing a part of the test socket.

As shown in FIG. 12, the socket body 2 of the inspection socket 1 according to the fifth embodiment includes a base substrate 55 which is hardly deformed, an elastic body 56 which is fixed on the base substrate 55 by being superimposed thereon, and The measurement terminal 9 and the wiring 12 (FIG. 1)
1) and an insulative resin tape 57 having external terminals connected to the tape via an external terminal.

According to the fifth embodiment, since the elastic body 56 acts as an elastic layer as in the case of the fourth embodiment, the impact load when mounting the inspection object 15 on the socket body 2 is reduced. At the same time, it is possible to prevent the overload from being applied to the lid 4 and prevent the inspection object 15 from being damaged.

(Embodiment 6) FIGS. 13 to 15 are diagrams relating to an electric characteristic inspection apparatus according to Embodiment 6 of the present invention. FIG. 13 is a schematic plan view schematically showing the electric characteristic inspection apparatus. FIG. 15 is a schematic diagram showing a state in which the object to be inspected is held by the handler, and FIG. 15 is a schematic diagram showing a state in which the object to be inspected is supplied to the socket body by the handler.

The electric characteristic inspection apparatus is an electric characteristic inspection apparatus for inspecting the characteristic of the inspection object 15 having the electrodes 17 arranged on one surface.

As shown in FIG. 13, the electrical characteristic inspection apparatus has a support table 60 on which the inspection socket 1 (socket main body 2) is mounted, and has an electrical connection with the socket main body 1 (socket main body 2). Tester 61 with means
have.

A loader section 62 for supplying the test object in an aligned arrangement of the carriers is disposed on one side of the support table 60, and an unloader section 63 is disposed on the other side.

A supply table 64 is provided in the loader section 62. On the supply table 64, a tray 65 for arranging and housing the inspection objects 15 is placed. Although not shown, a removing mechanism is provided, and when the inspection object 15 is paid out from the tray 65, the empty tray 65 is removed by the removing mechanism.

The unloader 63 is provided with a storage table 70. A tray 66 for arranging and housing the inspection object 15 is placed on the storage table 70. Although not shown, a supply mechanism is provided, and when the inspection object 15 is full on the tray 66, an empty tray 66 is supplied by the supply mechanism.

The inspection object 15 is separated from the tray 65 by a partition plate 67. On the other hand, the tray 66 is not provided with the partition plate 67, and receives the bump electrode 17 on the lower surface of the inspection object 15 by the recess 68 to separate the inspection object 15.

On the other hand, a handler 73 is provided at one end of the loader unit 62, tester 61, and unloader unit 63 arranged in parallel. The handler 73 is a traveling type, and moves as needed.

As shown in FIGS. 14 and 15,
The handler 73 has an arm 74 and an arm 7
The suction head 75 is provided at the tip of the nozzle 4. The suction head 75 is provided with a plurality of vacuum suction nozzles 76 for vacuum-sucking the aligned inspection objects 15 so as to simultaneously hold and release the aligned inspection objects 15. 14 and 15, three rows of the vacuum suction nozzles 76 are shown.

As shown in FIG. 13, the handler 73 holds the plurality of inspection objects 15 arranged in a line on the tray 65 of the loader section 62 and loads the inspection objects 1 on the support base 60. In both cases, an operation of holding the inspection objects 15 in a row from the inspection sockets 1 on the support table 60 and transferring the inspection objects 15 to the tray 66 of the unloader section 63 is performed.

A lid transfer device 77 is provided on the left side of the tester 61. The lid transfer device 77 has an arm 78. Although not shown, a vacuum suction mechanism is provided at the tip of the arm 78. The vacuum suction mechanism performs an operation of holding and releasing the plate-shaped lid 4 by vacuum suction.

The lid transfer device 77 and the handler 73 are
Control is performed so that they do not interfere with each other by a controller (not shown).

Next, a characteristic inspection by the electrical characteristic inspection apparatus of the sixth embodiment will be described.

First, the socket main body 2 of the inspection socket 1 described above is set. In setting the socket main body 2, the external terminals 11 of the socket main body 2 are connected to the tester 61 by electrical connection means (not shown). A desired carrier 3 is placed in the socket body 2 and the socket body 2
The guide pins 5 and the guide holes 6 of the carrier 3 are used for positioning and overlapping. In this state, the lid transfer device 7
The cover 4 is removed from the working area by 7.

Next, as shown in FIG.
3, the tray 65 on the supply table 64 of the loader unit 62
The inspection objects 15 arranged in a line from the holder are collectively held, and each of the receiving portions 1 of the carrier 3 on the support 60 of the tester 61 is held.
The inspection object 15 is supplied to 6. The supplied storage unit 16
Is positioned with high precision by the guide surface 22 and the positioning portion of the housing portion 16.

As a result, the bump electrodes 17 of each accommodation portion 16
Are measuring terminals 9 arranged on the upper surface of the socket body 2
Overlap exactly.

When the loading of the inspection object 15 by the handler 73 is completed, the suction head 7 of the handler 73
5 comes off the support table 60 and returns to the standby position.

Next, the lid transfer device 77 is operated, and the lid 4 is placed on the socket body 2 on the support base 60, and the socket body 2
The guide pins 5 and the guide holes 7 of the lid 4 are used for positioning and overlapping. When the loading of the lid 4 is completed, the arm 78 of the lid transfer device 77 moves and the vacuum suction mechanism comes off the support table 60 and returns to the standby position.

When the lid 4 is mounted on the socket body 2, the weight of the lid 4 is applied to each of the housings 16, so that the bump electrodes 17 and the measuring terminals 9 of the housing 16 have a desired contact pressure. In this state, the electrical characteristics inspection of each accommodation unit 16 is performed. This characteristic inspection result is stored as a tray map in a memory of a control device (not shown) or an external storage device.

When the inspection of the electrical characteristics is completed, the lid transfer device 77 operates to remove the lid 4 overlapping the socket body 2. Further, the handler 73 operates to collectively hold the storage units 16 arranged in an aligned state on the support base 60 by vacuum suction and transport the storage units 16 onto the tray 65 on the storage base 70 of the unloader unit 63.

As a result, one electrical characteristic inspection apparatus is completed.

In the electrical characteristic inspection apparatus of the sixth embodiment, if a desired carrier 3 is selected, the characteristic inspection of the inspection object 15 having a different size and the inspection of the inspection object 15 having an electrode pitch of an integral multiple can be performed. Characteristic inspection can be performed.

Inspection socket 1 used in Embodiment 6
The socket body 2 of the first to fifth embodiments can be used.

The electrical characteristics inspection apparatus according to the sixth embodiment has the following effects.

(1) Since a plurality of inspection objects 15 can be accommodated in the inspection socket 1 at a time, and the characteristics can be inspected by automatically loading and unloading, the electric characteristics inspection can be performed with high efficiency. Therefore, a reduction in the characteristic inspection cost can be achieved.

(2) Even if the electrode pitch is different, the characteristics of the accommodating portion 16 having an electrode pitch that is an integral multiple of the electrode pitch can be inspected by selecting and using the carrier 3 corresponding to the electrode pitch.
Therefore, a characteristic inspection of a semiconductor chip or a semiconductor device having a new package size can be performed, and the electric characteristic inspection apparatus has excellent versatility.

(3) Since the peripheral wall of the accommodating portion 16 of the carrier 3 is an inclined guide surface 22 which gradually widens upward, when the accommodating portion 16 is inserted into the accommodating portion 16,
Since the inspection object 15 is moved and positioned along the guide surface, the electrode 17 of the housing 16 is brought into accurate contact with the measuring terminal 9 of the socket body 2 and an accurate characteristic inspection can be performed. .

(4) The lid 4 acts as a weight, and the pressing means provided on the lid is
6 is elastically pressed against the socket body 2, the electrical contact between the electrode 17 of the inspection object 15 and the measurement terminal 15 is ensured, and an accurate characteristic inspection can be performed. Further, since the pressing means acts on the inspection object 15 elastically, the electrode 17 contacting the measuring terminal 9 is not pressed more than necessary, and the damage of the electrode 17 can be prevented.

(5) Since the center of the measuring terminal 9 of the object 15 to be inspected is depressed, the electrode (bump electrode) 17 of the object to be inspected 15 easily enters the depression 30 and is accommodated by the lid 4. When the portion 16 is pressed against the test object 15, the bump electrode 17 attempts to enter the recess 30, and a self-alignment (self-alignment) action is performed. The contact with the semiconductor device is ensured, and an accurate characteristic inspection can be performed.

(6) Since the socket body 2 is formed by the wiring board 40 having the connecting electrode body 41 protruding from the upper surface and the insulating resin plate 36 manufactured by the transfer molding method, Can be easily manufactured, and a reduction in manufacturing cost can be achieved.

(7) Since a guide that is taller than the measuring terminals is provided on the upper surface of the socket body 2 so as to surround the measuring terminals 9, the object 15 to be inspected is covered with the lid 4. When pressed against the electrode 17, the periphery of the electrode 17 of the inspection object 15 is guided by the guide and easily overlaps the electrode on the center side of the guide (self-alignment action). The contact with the measuring terminal 9 is ensured, and an accurate characteristic test can be performed.

(8) The measuring terminal 9
Is provided, the impact load when the object 15 is mounted on the socket body 2 can be reduced, and the overload of the lid 4 can be prevented. 15 can be prevented from being damaged. In addition, even when the socket body 2 is provided with the elastic body 56, the impact load when the inspection object 15 is mounted on the socket body 2 can be reduced, the overload applied to the lid 4 can be prevented, and the inspection object 15 can be damaged. Can be prevented.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say.

[0136]

The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows.

(1) The inspection socket and the electrical characteristic inspection apparatus of the present invention can perform characteristic inspection of inspected objects having different sizes only by selecting a carrier, if the pitch of the electrodes is the same, thereby increasing versatility. Excellent.

(2) Since a plurality of inspection objects are accommodated in the carrier and the characteristic inspection can be performed simultaneously at a time, the characteristic inspection efficiency is improved and the characteristic inspection cost can be reduced.

(3) Since a plurality of carriers having the same electrode pitch and a different size of the accommodating portion for accommodating the object to be inspected are prepared, the carrier is limited to the same electrode pitch. In the development of the inspection object, the characteristic inspection can be performed using a carrier having an accommodating portion corresponding to the size of the inspection object, so that the development of an inspection socket accompanying the development of a new product becomes unnecessary.

(4) In the case where the electrode pitch is the same and the sizes of the housing portions do not match, only the development of the socket body is sufficient, and the development period of the inspection socket can be shortened. Since the carrier merely forms the accommodating portion on the plate, the production is easy and the production cost is low, and the development of the inspection socket accompanying the development of a new product is short and low in cost.

(5) The electrical characteristic inspection apparatus of the present invention can accommodate a plurality of inspected objects in the inspection socket at one time, and can perform characteristic inspection by automatically loading and unloading. It can be done with efficiency. Therefore, a reduction in the characteristic inspection cost can be achieved.

(6) Even if the electrode pitch is different, the accommodating portion having an electrode pitch that is an integral multiple of the electrode pitch can be inspected for its characteristics by selecting and using a carrier corresponding to the electrode pitch. Therefore, a characteristic inspection of a semiconductor chip or a semiconductor device having a new package size can be performed, and the electric characteristic inspection apparatus has excellent versatility.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a test socket according to a first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of the inspection socket of the first embodiment.

FIG. 3 is a partially enlarged sectional view of the inspection socket of the first embodiment.

FIG. 4 is a plan view showing a socket main body of the inspection socket of the first embodiment.

FIG. 5 is a plan view showing a carrier of the inspection socket of the first embodiment.

FIG. 6 is a partial plan view showing a state in which CSP type semiconductor devices having different electrode pitches are set in the inspection socket of the first embodiment.

FIG. 7 is a schematic sectional view showing a part of a test socket according to a second embodiment of the present invention.

FIG. 8 is a partial schematic cross-sectional view schematically showing a test socket according to a modification of the second embodiment of the present invention.

FIG. 9 is a schematic cross-sectional view showing a stage of manufacturing the socket body in the inspection socket according to the third embodiment of the present invention.

FIG. 10 is a schematic sectional view showing a part of a socket main body in a test socket according to a fourth embodiment of the present invention.

FIG. 11 is a schematic plan view showing a part of a socket main body in a test socket according to a fifth embodiment of the present invention.

FIG. 12 is a schematic cross-sectional view showing a part of the inspection socket of the fifth embodiment.

FIG. 13 is a schematic plan view illustrating an outline of an electrical characteristic inspection apparatus according to a sixth embodiment of the present invention.

FIG. 14 is a schematic diagram showing a state in which an object to be inspected is held by a handler in the electrical characteristic inspection apparatus according to Embodiment 6 of the present invention.

FIG. 15 is a schematic diagram illustrating a state in which an object to be inspected is supplied to a socket body by a handler in the electrical characteristic inspection apparatus according to the sixth embodiment of the present invention.

[Explanation of symbols]

1 ... inspection socket, 2 ... socket body, 3 ... carrier,
4 lid, 5 guide pin, 6, 7 guide hole, 9 measurement terminal, 10 measurement terminal arrangement area, 11 external terminal, 1
2 ... wiring, 15 ... inspection object, 16 ... accommodation part, 17 ... electrode (bump electrode), 20 ... support piece, 21 ... vertical wall, 22 ...
Guide surface, 25: rubber plate, 30: hollow, 31: leaf spring,
32 ... hole, 33 ... resin tape, 35 ... dent, 36 ... insulating resin plate, 37 ... through hole, 38 ... conductive wiring, 40
... wiring board, 41 ... connecting electrode body, 42 ... adhesive, 45 ...
Elastic layer, 47 base, 48, 49 adhesive, 50 wiring board, 55 base substrate, 56 elastic body, 57 resin tape, 60 support base, 61 tester, 62 loader section, 63 Unloader part, 64 ... Supply table, 65 ... Tray, 66 ... Tray, 67 ... Partition plate, 68 ... Dent, 70 ...
Storage table, 73: handler, 74: arm, 75: suction head, 76: vacuum suction nozzle, arm.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI H01R 33/88 H01R 33/88 Z (72) Inventor Ichiro Yasuo 5-2-1, Josuihoncho, Kodaira-shi, Tokyo Hitachi Semiconductor Division

Claims (12)

[Claims] An inspection socket for an inspection object having electrodes arranged on one surface, wherein the inspection socket is the same as the electrode interval of the inspection object and is provided over a larger area than the single inspection object. A socket body having a plurality of measurement terminals on its upper surface and a wiring board having peripheral terminals having external terminals electrically connected to the respective measurement terminals; and A plate-shaped carrier having a plurality of detachably accommodated accommodating portions and configured such that an electrode of an inspection object accommodated in each accommodating portion is in contact with the measurement terminal; An inspection socket comprising: a holding lid detachably mounted on an inspection object; and positioning means for positioning at least the socket body and the carrier relative to each other. 2. The inspection socket according to claim 1, wherein a plurality of carriers having mutually different sizes and arrangement pitches of the housing portions are provided. 3. The carrier according to claim 2, wherein a part of the carriers is configured to accommodate an inspection object having an electrode array having an integral multiple pitch of a terminal pitch of the measurement terminals in the accommodation portion. Inspection socket. 4. The inspection according to claim 1, wherein the peripheral wall has an inclined guide surface so that the accommodation portion gradually widens upward. socket. 5. The cover according to claim 1, wherein said lid is provided with a pressing means which elastically acts on an object to be inspected accommodated in the accommodating portion of said carrier. 2. The inspection socket according to claim 1. 6. The measuring terminal according to claim 1, wherein a center portion of the measuring terminal is depressed.
Inspection socket according to paragraph. 7. The socket body includes a wiring board having a connection electrode body protruding from an upper surface, and an insulating resin plate manufactured by a transfer molding method and fixed on the wiring board by superposition. The conductive resin plate is provided with a through hole into which the connection electrode body is inserted, and an upper end portion of the through hole is a hemispherical seat for receiving an electrode of the inspection object, and the entire inner peripheral surface of the through hole is provided. The inspection socket according to claim 6, wherein a conductor layer is provided and is electrically connected to the connection electrode body. 8. The socket according to claim 1, wherein a guide taller than the measuring terminals is provided on an upper surface of the socket body so as to surround the measuring terminals. Inspection socket as described in. 9. The socket according to claim 1, wherein the socket body is provided with an elastic layer for elastically supporting the measuring terminal. Inspection socket. 10. The socket body includes a base substrate that is not easily deformed, an elastic body that is fixed on the base substrate, and an external body that is fixed on the elastic body and is connected to the measurement terminal and the measurement terminal. The inspection socket according to claim 9, wherein the inspection socket is formed of an insulating resin tape having terminals. 11. An electric characteristic inspection apparatus for inspecting characteristics of an inspected object having electrodes arranged on one surface, comprising: a socket body, a carrier, and a lid, wherein a plurality of inspected objects are arranged on the carrier. A tester having a support for placing an inspection socket to be placed and accommodated and having an electrical connection means with the socket body; a loader unit for supplying the inspection object in an aligned arrangement of the carrier; An unloader section for accommodating an object in the aligned state of the carrier, and a plurality of inspected objects in the aligned state of the loader section are loaded onto the carrier on the support table and loaded from the carrier on the support table. A handler for holding the inspection objects in the row arrangement state and transferring the inspection objects to the unloader unit; and loading / unloading the lid on the carrier. The inspection socket has a plurality of measurement terminals on the upper surface which are the same as the electrode spacing of the inspection object and are provided over a larger area than the single inspection object. A socket body formed of a wiring board having peripheral terminals having external terminals electrically connected to the respective measurement terminals, and a housing portion detachably stacked on the socket body and detachably housing the object to be inspected. A plate-shaped carrier configured such that the electrodes of the inspection object stored in each of the plurality of storage units are in contact with the measurement terminals, and removably stacked on each of the inspection objects held by the carrier; An electrical characteristic inspection device, comprising: a holding lid that can be positioned; and positioning means for positioning at least the socket body and the carrier relative to each other. 12. The electrical characteristic inspection apparatus according to claim 11, wherein the inspection socket has a configuration according to any one of claims 2 to 10.