JP3256455B2 - socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for testing an electric component, and more particularly to a socket used for a semiconductor device having a large number of narrow lead terminals.

[0002]

2. Description of the Related Art Generally, a maker that supplies semiconductor devices forms a predetermined integrated circuit on a silicon substrate,
After the test in the wafer state is completed, the silicon substrate is divided, and the divided silicon substrate is sealed with a resin, ceramic, or the like to manufacture a semiconductor device. Prior to shipment and mounting on a printed circuit board, a finished semiconductor device is subjected to an operation test, a burn-in test, or the like, to discriminate between a good product and a defective product, and to perform screening.

[0003] In such a test, a large number of semiconductor devices must be handled, so sockets that can be easily inserted and removed are used. However, since there are many types of semiconductor device package shapes and lead shapes, There are various shapes of test sockets used for testing semiconductor devices.

Among them, reference numeral 2 in FIGS. 11 (a) and 11 (b)
A conventional socket used for testing an SOJ (small out-line J-lead) type semiconductor device indicated by reference numeral 00 will be described.

Referring to FIGS. 14 (a) to 14 (c), what is indicated by reference numeral 102 is a socket of the prior art, which is shown in FIG.
FIG. 1B is a plan view, FIG. 2B is a sectional view taken along line II, and FIG.
FIG. 2 is a sectional view taken along line II. The socket 102 has a base 116 made of an insulating resin (plastics) and contact pins 113.

[0006] The upper portion of the contact pin 113 is bifurcated, contact portions 114 and 115 are formed at the tip, and two legs 119 are formed at the lower portion. Base 116
Is provided with a recessed IC housing 128.
Outside of this, a plurality of slit members 131 are arranged at equal intervals to form slits.

[0007] The contact pin 113 is inserted into the slit from the leg portion 119 side, and is implanted on the base 116 by pressing the upper end of the pressing portion 17.
Legs 119 protrude downward from the bottom surface of 6, so that the entire socket 102 can be connected and fixed to the printed circuit board.

Positioning portions 121 for positioning the semiconductor device are provided at the four corners in the IC housing portion 128, and the semiconductor device being inserted is positioned at the four corners of the opening end portion of the IC housing portion 128. An invitation portion 122 for leading to the portion 121 is provided.

A method of housing the semiconductor device 200 in the above-described IC housing 109 will be described. In the SOJ type semiconductor device 200, the lead terminal 202 is led out from the side surface of the package 201, is bent inward on the bottom surface 204 side, and is configured to be connectable to a printed board under the package 201.

The semiconductor device 200 is connected to the socket 10
When holding the semiconductor device 200 at first,
03 downward and the lead terminal 202 upward,
It is leveled on 28 (FIG. 15 (a)).

In the socket 102, contact pins 1
The contact portions 114 and 115 of the semiconductor device 20 protrude from the inside of the slit toward the IC housing portion 128.
0 is lowered vertically, and the corner of the package 201 is slid into the guiding portion 122.
2 comes into contact with the contact portion 114 located at the top of the contact pin 113 (FIG. 15B).

In this state, when the semiconductor device 200 is pushed down, the side surface of the lead terminal 202 tries to push the contact portion 114 into the slit, and the side surface of the lead terminal 202 and the contact portion 114 are elastically applied to the contact portion 114. Slides, and the sliding surface of the lead terminal 202 is cleaned.

The corners of the package 201 are positioned
When the semiconductor device 200 is stuck in the IC housing portion 128 and cannot be pushed down any more, the semiconductor device 200 is housed in the IC housing portion 128.
Contacted. In this state, the lead terminal 202 and the contact pin 113 are electrically connected, and an operation test of the semiconductor device 200 can be performed.

When the operation test is completed, the semiconductor device 200
After determining whether the semiconductor device 200 is good or bad, the semiconductor device 200 is taken out of the socket 102, removed if the semiconductor device is defective, or sent to a post-process if the semiconductor device is good.

As described above, if the socket 102 is used,
Semiconductor device 200 having multiple lead terminals 202
Operation test and burn-in test can be performed reliably.
For various semiconductor devices, sockets corresponding to the shapes have been prepared and widely used.

However, the prior art socket 10
2, when the semiconductor device 200 is housed in the IC housing, the contact portions 114 and 11 are
A pressing force from 5 is applied. Individual lead terminals 2
02, even if the pressing force applied to the lead terminal 20 is small.
2 are held by a large force as a whole, and the semiconductor device 2
If the user tries to remove 00 in the vertical direction as it is, the holding force will be opposed, and a very large force will be required.

Therefore, in the socket 102 as described above,
The back 203 and the base 1 of the semiconductor device 200 in the housed state
16, so that there is a gap 129 between them.
When removing the semiconductor device 200 from the socket 102, a jig is inserted into the gap 129 from the side of the socket 102, and one end of the semiconductor device 200 is pushed up by the principle of leverage and then removed. By doing so, the number of lead terminals 202 that are in contact with the contact pins 113 at the time of removal is reduced, and the holding force is reduced. Therefore, the semiconductor device 200 can be removed with a small force.

However, when one end of the semiconductor device 200 is lifted, each of the lead terminals 202
02 are contacted with the contact pins 113 in an oblique state, and then removed, so that the contact pins 11
Something gets stuck between the three. If the semiconductor device 200 in that state is forcibly removed, the lead terminal 202 may be bent or the contact pin 11 may be bent.
In some cases, the lead 3 and the lead terminal 202 were completely engaged and could not be removed.

If the positioning accuracy with respect to the semiconductor device provided in the socket is poor or the semiconductor device is obliquely inserted into the socket, the lead terminals of the semiconductor device are entangled with the contact pins of the socket. In some cases, lead terminals of a semiconductor device are deformed.

[0020]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned disadvantages of the prior art, and an object of the present invention is to provide a socket in which a lead terminal of an electric component does not fit between contact pins. It is in.

[0021]

In order to solve the above problems, a first socket of the present invention has a base, a cover provided to be vertically movable with respect to the base, and a plurality of lead terminals. A mounting portion provided on the base for mounting the semiconductor device; and a plurality of contact pins, wherein the contact pins have a pedestal portion fixed to the base and an elasticity provided on the pedestal portion. And a contact portion elastically supported by the elastic portion. The contact portion retreats from the original position in response to the forward movement of the cover from the first position to the second position. The semiconductor device can be housed in the mounting portion, and returns to the original position in response to the return of the cover from the second position to the first position, and comes into contact with a lead terminal of the semiconductor device. A socket, wherein the plurality of contact pins Interval is less than the width of each lead terminal of the semiconductor device.

A second socket according to the present invention is provided on the base, a cover provided to be vertically movable with respect to the base, and provided on the base for mounting a semiconductor device having a plurality of lead terminals. And a plurality of contact pins, wherein the contact pins are fixed to the base, an elastic portion provided on the pedestal portion, and a contact elastically supported by the elastic portion. A contact portion, wherein the contact portion retracts from the original position in response to the forward movement of the cover from the first position to the second position, and allows the semiconductor device to be housed in the mounting portion, A socket that returns to the original position and contacts a lead terminal of the semiconductor device in response to the return of the cover from the second position to the first position, wherein a space between the plurality of contact pins is provided; Is greater than the width of each contact pin Sai.

A third socket of the present invention is provided on the base, a cover provided to be vertically movable with respect to the base, and provided on the base for mounting a semiconductor device having a plurality of lead terminals. And a plurality of contact pins, wherein the contact pins are fixed to the base, an elastic portion provided on the pedestal portion, and a contact elastically supported by the elastic portion. A contact portion, wherein the contact portion retracts from the original position in response to the forward movement of the cover from the first position to the second position, and allows the semiconductor device to be housed in the mounting portion, A socket that returns to the original position and contacts a lead terminal of the semiconductor device in response to the return of the cover from the second position to the first position, the width of the plurality of contact pins being Is longer than the distance between the lead terminals Listening socket.

In the socket of the present invention, the width of the tip of the contact portion that contacts the lead terminal of the mounted semiconductor device is wider than other portions.

Further, the socket of the present invention further comprises an insulating member made of an insulating material provided between the plurality of contact pins.

In the socket of the present invention, the insulating member may be formed integrally with the base, or the insulating member may be a partition-like insulating film positioned on the base.

The socket of the present invention having the above-described structure is provided on the base, a cover provided to be vertically movable with respect to the base, and the base for mounting a semiconductor device having a plurality of lead terminals. A mounting portion, a pedestal portion fixed to the base, an arc-shaped spring portion connected to the pedestal portion, and a lead terminal of the semiconductor device mounted and connected to the arc-shaped spring portion. And a plurality of contact pins having contact portions connected to the semiconductor device, wherein the contact portions are retracted from the original position in response to the forward movement of the cover from the first position to the second position. And a socket that returns to the original position in response to the return of the cover from the second position to the first position and contacts the lead terminal. Multiple contact pin spacings are placed Because it is smaller than the width of each lead terminal of the semiconductor device, there is no possibility that the lead terminal of the semiconductor device is fitted between the contact pins. The same applies to the case where the interval between the plurality of contact pins is made smaller than the width of each contact pin or larger than the interval between each lead terminal.

In such a contact pin, if the width of the tip portion in contact with the lead terminal is made wider than the other portions, the area in contact with the lead terminal becomes large,
The electrical connection is assured.

Further, if an insulating member made of an insulating material is arranged between each contact pin, it is possible to prevent a short circuit between the contact pins, which is convenient.

When the insulating member of the socket is formed as a slit formed integrally with the socket body, the socket manufacturing process can be simplified, and when a partition-like insulating film positioned on the socket body is formed, the distance between the contact pins is reduced. It can be placed closer.

[0031]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A socket according to a first embodiment of the present invention will be described with reference to FIGS. Reference numeral 2 in FIGS. 2A to 2C denotes a socket according to the first embodiment, and FIG.
FIG. 1B is a front view, FIG. 2B is a sectional view taken along line AA, and FIG.
FIG. 3 is a sectional view taken along line B-B.

This socket 2 is the same as the socket 102 described above.
Similarly to the above, it is used for testing a SOJ type semiconductor device, and includes a base 16 formed of an insulating material,
And a plurality of contact pins 13 formed by punching a metal plate. The metal plate is 0.4mm
It is composed of thick copper alloy and has a contact pin width a
(Thickness) is set to 0.4 mm.

As shown in FIG. 1, the contact pin 13 has a pedestal 11 on which two contact portions 14 and 15 are elastically supported by elastic portions 181 and 182. It is provided in. A leg 19 used for connection to a printed circuit board is provided at a lower portion. Of the contact portions 14 and 15, the contact portion 1 located on the upper side
The tip of 4 is formed to be wider than other portions by bending and crushing, and has a width b of 0.55 mm.

At the center of the base 16, there is provided a recessed IC accommodating portion 28, which is an example of a mounting portion, and outside thereof, a plurality of slits made of insulating resin and formed integrally with the base 16. A plurality of members 31 are arranged at equal intervals. By the respective slit members 31, reference numeral 3 in FIG.
2, a slit 32 is formed as schematically shown in FIG.
(Elastic portion 18 ₁ is omitted).

The slit 32 is formed in the base 16 so as to match the lead terminal arrangement of the semiconductor device to be measured.
The contact pins 13 are arranged in two rows on the upper side, and the contact pins 13 are inserted into the slits 32 from the leg portions 19 and are implanted in the base 16.

The width (thickness) c of the slit member 31 is 0.3 m.
m, the width d of the upper end portion is as thin as 0.15 mm, and the pitch of the slit members 31 is 0.8 mm. Therefore, the slit interval at the upper end portion is 0.65 mm, and the slit interval at other portions is 0. 0.5 mm.

In the slit 32, the elastic portions 18 ₁ ,
18 ₂ has a contact portion 14 at a slit interval of 0.5 mm.
Is located at a slit interval of 0.65 mm,
Since the pitch of the contact pins 13 is also 0.8 mm, the interval e between the elastic portions 18 ₁ and 18 ₂ is 0.4 mm,
The distance f between the elastic portions 1 is 0.25 mm.
8 ₁ , 18 ₂ and the contact portion 14 can enter and exit the slit 32, respectively, without being in contact with the slit member 31.

This socket 2 also has a reference numeral 200 in FIG.
When inserting the SOJ type semiconductor device shown in,
With its back 203 facing down and horizontal on the IC housing 28
(FIG. 3 (a)), it is lowered vertically from that state. Then, the lead terminal 202 first contacts the contact portion 14 located at the uppermost part of the contact pin 13 (FIG. 3B).

When the semiconductor device 202 is pushed down in this state, the side surface of the lead terminal 202 slides on the wide portion of the contact portion 14 due to the elastic force applied to the contact portion 14, and the sliding surface is cleaned. You. When the semiconductor device 200 is stored in the storage portion 29, the contact portion 15 contacts the side surface of the cleaned lead terminal 202, the contact pin 13 and the lead terminal 202 are electrically connected, and the operation test can be performed. become.

When the operation test is completed, the semiconductor device 200
When taking out from the socket 2, as shown in FIG.
Lift one end of the semiconductor device 200 using a jig,
After slanting, remove.

Lead terminal 202 of semiconductor device 200
Has a width of 0.47 mm in the root portion 205 and a width of 0.26 mm in the tip portion 206 ahead of the root portion 205.
Contact portion 14 of the contact pin 13
Since the interval f between them is 0.25 mm as described above,
As shown in FIG. 5, when one end of the semiconductor device 200 is lifted, the tip portion 206 that is in contact with the contact portion 14 is formed.
However, it does not get stuck between the contact portions 14. Therefore,
When the lead terminal 202 is removed, the lead terminal 202 does not bend or the semiconductor device 200 does not come off.

On the other hand, the above-described prior art socket 102
Then, as shown in FIG. 4B, the width of the slit member 131 is set to 0.3 mm.
The width of 3 is 0.4 mm in all other portions in addition to the contact portions 114 and 115. Since the pitch between the slit member 131 and the contact pin 113 is 0.8 mm, the interval between the contact portions 114 is 0.4 mm, and the lead terminals 202
End portion 206 easily gets stuck.

In the socket 2 of the present invention, there is no such a disadvantage, and the semiconductor device 200 in an oblique state can be easily removed. Further, since the lead terminal 202 slides on the widened portion of the contact portion 14, the lead terminal 2
02 can be reliably cleaned, and the electrical contact between the contact portion 15 and the lead terminal 202 is good.

Next, a second embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to FIG. Reference numeral 3 in FIGS. 7A and 7B is a cross-sectional view of the socket according to the second embodiment, which is used for testing a TSOP (thin small outline package) type semiconductor device 300 shown in FIG. It is something that can be done.

The socket 3 has a base 46 made of an insulating material, a cover 56 placed on the base 46, and the contact pins 43 shown in FIG.

The contact pin 43 has a pedestal portion 41, and a contact portion 44 is provided above the pedestal portion 41 while being elastically supported by an elastic portion 48. A leg 49 used for connection to a printed circuit board is provided below.

The contact pins 43 are formed by punching a metal plate, and the ends of the contact portions 44 are bent and crushed to be wide.
The width a ′ of the elastic portion 48 and the contact portion 44 of the contact pin 43 and the width b ′ of the wide portion are 0.2 mm, respectively.
0.4 mm.

At the center of the base 46, a recessed IC housing portion 58 is provided. Around the IC housing portion 58, slit members 61 formed integrally with the base 46 are arranged at equal intervals. Each slit member 61 forms a slit. The contact pin 43 in the slit
Is inserted from the leg portion 49 side, and the pressing portion 47 is pressed to be implanted on the bottom surface of the base 46. that time,
Legs 49 protrude downward from the bottom surface of the base 46,
The entire socket 3 can be connected and fixed to a printed circuit board.

In this socket 3, when the cover 56 is pressed down against the elastic force of the spring, the state shown in FIG. 7A is obtained. In this state, the trigger portion 42 provided on the contact pin 43 is pressed by the pressing member 57 provided in the cover 56, and the contact portion 44 is retracted outward.

The thickness and pitch of the slit member 61 are the same as those of the socket 2 described above.
Since the upper part of 1 is thin, when the trigger part 42 is pressed by the pressing member 57, the wide part of the contact part 44 is inserted into the slit.

In this state, when the semiconductor device 300 is vertically dropped into the IC housing portion 58 of the base 46 from a hole provided in the center of the cover 56, and then the cover 56 is pushed up by the biasing force of the spring, FIG. As shown in b), the pressing member 57 moves upward, and the contact portion 44 is electrically connected to the lead terminal 302.

When a semiconductor device is brought into contact with a semiconductor device, if the positioning state is poor, contact pins may enter between the lead terminals and contact may not be obtained.

On the other hand, the interval between the contact portions of the socket 3 is set to 0.25 mm, and the lead terminals 30
2 Since the width of the tip is narrower than 0.26 mm,
02 does not get stuck between the contact portions 44, and the semiconductor device 300 can be easily removed. In the socket 3, the lead terminals 30 of the contact portions 44
2 is formed wide so that the contact pins 302 are not damaged.

Next, a third embodiment of the present invention will be described with reference to FIGS.
Explanation will be made using 0. Reference numeral 4 in FIGS.
The QFP (quan) shown in FIG.
This is used for an operation test and a burn-in test of the semiconductor device 400 of the (d flat package) type.

FIG. 8 shows a contact pin 73 used in the socket 4. FIGS. 9 and 10 are a plan view of the socket 4 with the cover removed and a partial cross-sectional view in that state.

The contact pin 73 has a pedestal portion 71, and a contact portion 74 elastically supported by an elastic portion 78 is provided above the pedestal portion 71. A leg 79 for connection to a printed circuit board is provided below.

The contact pins 73 are also formed by punching a metal plate. The upper ends of the contact portions 74 are formed wide by bending and crushing.
The width a ″ other than the wide portion and the width b ″ of the wide portion are each 0.3 m, similarly to the contact pins 3 and 13 described above.
m, 0.55 mm.

The socket 4 has a base 76 made of an insulating material, and a recessed IC housing 88 is provided at the center of the bottom of the base 76. IC storage unit 88
Are arranged at regular intervals around the periphery of the base member 76.
Constitutes a slit.

In the slit, a contact pin 73 is inserted from the side of the leg 79 and is implanted on the bottom of the base 76, and the leg 79 protrudes from the bottom of the base 76. The contact portion 74 is located on the slit, and the semiconductor device 400 is dropped into the IC housing portion 88 from the guiding portion (not shown), and the corner of the package 401 fits into the positioning portion (not shown). The tip of the lead terminal 402 is configured to contact the contact portion 74.

At this time, the lead terminal 402 is
When the leading end of the lead terminal 402 is pressed from above by a pressing member (not shown) in this state, each lead terminal 402 and the contact pin 13 are pressed.
Electrical connection is made.

Since the upper part of the slit member 91 is formed thin, the interval between the slits is wide at the upper part and narrow at the lower part. Since the upper portion is wider than the wide portion of the contact portion 74, the lead terminal 402
When the contact portion 74 moves downward by the pressing of the tip, the wide portion of the contact portion 74 is retracted into the slit.

After the operation test of the semiconductor device 400 is performed in this state, when the pressing force applied to the tip of the lead terminal 402 is removed, the position of the contact portion 74 returns to the position on the slit.

Thereafter, when the semiconductor device 400 is lifted in the vertical direction, the semiconductor device 400 can be easily removed. However, the state of holding the semiconductor device 400 is poor, and the semiconductor device 400 may be inclined.

In the prior art socket, the interval between the contact portions of the contact pins located on the slit is smaller than that of the lead terminal 4.
Since the width of the lead terminal 402 is wider than the width of the semiconductor device 400, the tip of the lead terminal 402 may be stuck between the contact portions when the semiconductor device 400 is inclined.

In the socket 4 of the present invention, similarly to the sockets 2 and 3 described above, the interval between the wide portions of the contact pins located on the slit is not more than 0.25 mm, and the width of the leading end of the lead terminal 402 is less than 0.26 mm. Is also getting smaller.
Therefore, the lead terminal 402 does not get stuck between the contact portions 74, and the semiconductor device 400 can be easily removed.

In the above embodiment, the slits are arranged in the base of the socket.
Instead of providing these slits, something like an insulating film may be inserted between the contact pins. In that case, the insulating film may be attached to the side surface of the contact pin via an adhesive. Alternatively, a plurality of grooves may be formed in the base, and the insulating film may be erected in the grooves.

[0067]

According to the present invention, the lead terminals of the semiconductor device do not fit into the contact pins of the socket and do not engage with each other, so that deformation of the lead terminals when removing the semiconductor device can be prevented. Since the portion in contact with the lead terminal is formed wide, electrical connection is ensured. By simply forming a part of the slit member thinly, the wide part of the contact part can be moved in and out of the slit, so that the strength of the slit does not decrease.

[Brief description of the drawings]

FIG. 1 is an enlarged view of a contact pin used in a socket according to a first embodiment of the present invention and a part thereof;

2A is a plan view of the socket; FIG. 2B is a partial cross-sectional view taken along a line AA; FIG.

FIGS. 3A to 3C are diagrams for explaining a method of inserting a semiconductor device into the socket.

4A is an enlarged view of a slit portion of the socket. FIG. 4B is an enlarged view of a slit portion of a conventional socket.

FIG. 5 is a view for explaining a state in which the semiconductor device is removed from the socket according to the first embodiment;

FIG. 6 is an enlarged view of a contact pin used in a socket according to a second embodiment of the present invention and a part thereof;

FIGS. 7A and 7B are diagrams for explaining how a semiconductor device is inserted into and removed from its socket.

FIG. 8 is a partially enlarged view of a contact pin used in a socket according to a third embodiment of the present invention.

FIG. 9 is a plan view of the socket.

FIG. 10 is a partial sectional view of the socket taken along line CC.

FIGS. 11A and 11B are external views of an SOJ semiconductor device to be tested with the socket according to the first embodiment of the present invention.

FIG. 12 is an external view of a TSOP type semiconductor device to be tested with a socket according to the second embodiment of the present invention.

FIG. 13 is an external view of a QFP semiconductor device to be tested with a socket according to the third embodiment of the present invention.

14A is a plan view of an example of a conventional socket. FIG.
(b): Partial sectional view of the II line. (c): Partial sectional view of the II-II line.

FIGS. 15A to 15C are diagrams for explaining a state of inserting a semiconductor device into the socket.

[Description of References] 2, 3, 4 ... Socket 13, 43, 73 ... Contact Pin 14, 44, 74 ... Contact Part 28,
58, 88 ... Placement part (IC storage part) 31, 61, 9
1. Slit member 200, 300, 400 Semiconductor device 201, 301, 401 Package
202, 302, 402 ... lead terminals

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01R 13/11 H01R 33/76

Claims (7)

(57) [Claims] A base, a cover provided to be vertically movable with respect to the base, a mounting portion provided on the base for mounting a semiconductor device having a plurality of lead terminals, and a plurality of mounting portions provided on the base. The contact pin includes a pedestal portion fixed to the base, an elastic portion provided on the pedestal portion, and a contact portion elastically supported by the elastic portion. Responds to the forward movement of the cover from the first position to the second position, retracts from the original position and allows the semiconductor device to be accommodated in the mounting portion, and moves the cover from the second position of the cover. A socket that returns to the original position in response to the return to the first position and contacts a lead terminal of the semiconductor device, wherein a distance between the plurality of contact pins is equal to each of the lead terminals of the semiconductor device. Socket smaller than width. 2. A base, a cover provided to be vertically movable with respect to the base, a mounting portion provided on the base for mounting a semiconductor device having a plurality of lead terminals, and a plurality of mounting portions provided on the base. The contact pin includes a pedestal portion fixed to the base, an elastic portion provided on the pedestal portion, and a contact portion elastically supported by the elastic portion. Responds to the forward movement of the cover from the first position to the second position, retracts from the original position and allows the semiconductor device to be accommodated in the mounting portion, and moves the cover from the second position of the cover. A socket that returns to the original position and contacts a lead terminal of the semiconductor device in response to the return to the first position, wherein a distance between the plurality of contact pins is smaller than a width of each contact pin. socket. 3. A base, a cover provided to be vertically movable with respect to the base, a mounting portion provided on the base for mounting a semiconductor device having a plurality of lead terminals, and a plurality of mounting portions provided on the base. The contact pin includes a pedestal portion fixed to the base, an elastic portion provided on the pedestal portion, and a contact portion elastically supported by the elastic portion. Responds to the forward movement of the cover from the first position to the second position, retracts from the original position and allows the semiconductor device to be accommodated in the mounting portion, and moves the cover from the second position of the cover. A socket that returns to the original position in response to the return to the first position and contacts a lead terminal of the semiconductor device, wherein a width of the plurality of contact pins is greater than a distance between the lead terminals; Large socket. 4. The socket according to claim 1, wherein a width of a tip portion of the contact portion that contacts the lead terminal of the mounted semiconductor device is wider than other portions. 5. An apparatus according to claim 1, further comprising an insulating member made of an insulating material provided between said plurality of contact pins.
The socket according to 3 or 4. 6. The socket according to claim 5, wherein said insulating member is formed integrally with said base. 7. The socket according to claim 5, wherein said insulating member is a partition-like insulating film positioned on said base.