JP3225685B2 - Function test method for contact unit and IC semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact unit which is mounted on a handling device for performing a function test of an IC semiconductor device and performs an electrical interface between the IC semiconductor device and an external tester. The present invention relates to a contact unit capable of accurately measuring high-frequency characteristics of an IC semiconductor device in a frequency range and identifying an IC semiconductor device having deformed leads, and a method of testing the function of an IC semiconductor device.

[0002]

2. Description of the Related Art A handling device referred to in this specification is an I
This is a device for performing a function test of a C semiconductor device (hereinafter, abbreviated as IC for simplicity), and is generally called a handler. Here, the function test is defined as I
C means various functional tests including a test of a logical function to be implemented by the semiconductor device. The contact unit mounted on the handling device contacts the lead (pin) of the IC semiconductor device for measuring the electrical characteristics of the IC semiconductor device, and performs an electrical interface between the external tester and the IC semiconductor device. .

A conventional contact unit generally has a structure shown in FIG.
It had a configuration as shown in (a) and (b). As shown in FIG. 4A, the main parts of the standard type contact unit are a socket 81, a rigid lead holder 80 attached to the lower end of a lead pressing mechanism (not shown), and an elastically deformable contact pin. 82. The lead pressing mechanism is a mechanism for pressing the lead 84 against the contact pin 82 via the lead holder 80,
Numeral 0 is pressed downward by the lead pressing mechanism, and clamps the lead 84 of the IC 86 placed on the IC receiving base 88 between the elastic deformation type contact pin 82 and the lead 84. In the high frequency contact unit, the lead retainer 80 is as shown in FIG.
4 (b), but the parts constituting the contact pins are shown in FIG. 4 (b).
As shown in FIG. 7, an elastically deformable contact pin 82 having one end fixed to a wall of a socket 81 and a terminal
3 between the rigid lead holder 80 and the contact pin 82.
Is sandwiched.

[0004]

However, the conventional contact unit shown in FIG.
As described below, it has been extremely difficult in practice to reliably measure the high frequency characteristics of an IC in a high frequency range.
First, regarding the standard type contact unit, IC
The length of the electrical path from the lead to the test head of the handling device becomes long due to the bent contact pin, and errors in the measurement of high-frequency characteristics are likely to occur. In addition, although the path length of the high frequency contact unit is shorter than that of the standard type contact unit, reliable contact is always maintained because there are two contact points in the portion that constitutes the contact pin. Difficult to do,
In addition, since the contact pin has a shape that is difficult to maintain a fixed shape, it is difficult to accurately control the height of the contact portion between the contact pin and the lead, so that a high contact ratio cannot be maintained.

In view of the above problems, the present invention provides a contact unit capable of measuring high-frequency characteristics with high reliability in a function test of an IC semiconductor device and identifying an IC semiconductor device having deformed leads and a reliability of the IC semiconductor device. And a method of manufacturing an IC semiconductor device.

[0006]

In order to achieve the above object, a contact unit according to the present invention is a unit to be mounted on a handling device for performing a function test of an IC semiconductor device. In a contact unit having a lead pressing mechanism for pressing a contact pin and performing an electrical interface between an IC semiconductor device and an external tester, a first socket mounted on a test head of a handling device and mounted on a peripheral portion thereof. And an IC cradle for mounting an IC semiconductor device on a central portion of the first socket so as to be able to move up and down a predetermined range via a spring. An IC that presses down the IC semiconductor device mounted on the same IC cradle with a predetermined pressing force.
A pressing mechanism is mounted and mounted on a hold block movably provided in the horizontal and vertical directions, and a flat plate contacting the second socket with a lead of an IC semiconductor device mounted on the IC receiver. A rigid contact pin comprising a head and a leg extending downward from the head is placed on the upper surface of the second socket, the leg is passed through the second socket, and the rigid socket is connected to the first socket. The first socket is fitted with a conductive terminal that is in electrical contact with the leg of the contact pin and is connected to an external tester.
A lead provided to be positioned on the left, right, or periphery of the pressing mechanism, and having a lead presser for pressing a lead of the IC semiconductor device mounted on the IC receiving base against the head of the contact pin by a resilient force due to elastic deformation. The pressing mechanism is provided so as to be able to move up and down in a vertical direction.

Further, according to the method of testing the function of an IC semiconductor device according to the present invention, the IC semiconductor device is mounted on an IC cradle which can be moved up and down a predetermined range via a spring. The pin is placed so as to be in contact with the flat head of the pin, and the lead is brought into contact with the head by pressing the IC with a predetermined pressing force below the IC semiconductor device to measure the presence or absence of conduction. Test whether the lead is deformed, contact the lead holder with the lead, press the lead against the head by the elastic force of the elastic deformation of the lead holder, and test the high frequency characteristics of the IC semiconductor device. It is characterized by doing.

[0008]

In the contact unit and the function test method of the IC semiconductor device according to the present invention, the IC semiconductor device mounted on the IC receiving table is pressed downward by the IC pressing mechanism, so that the leads of the IC semiconductor device are rigidly contacted. An IC semiconductor device whose lead has been deformed can be checked while being in contact with the head of the pin, and the lead pressing mechanism is then lowered, and the lead is held down by the resilient force of the lead holder. It is possible to accurately control the height of the contact position between the lead and the contact pin while maintaining a high contact ratio by pressing against the part, and measure the high frequency characteristics of the IC semiconductor device with high reliability. At this time, since the head of the contact pin is flat, observe the state of contact between the lead and the contact pin,
Defective IC semiconductor devices floating from contact pins having deformed leads can be reliably identified.
Further, since the contact pin is a rigid component composed of a flat plate-shaped head contacting the lead of the IC semiconductor device and a short straight leg extending downward from the head,
The length of the electrical path from the contact portion of the lead can be significantly reduced as compared with the conventional contact pin. Further, since the lead of the IC semiconductor device is sandwiched between the rigid contact pin and the elastically deformable lead retainer, the lead is securely pressed against the contact pin due to the resiliency of the lead retainer, and the contact ratio is reduced. Can be increased. The error is reduced by the shortened electrical path length and the high contact ratio, and the I.sub.
The high frequency characteristics of the C semiconductor device can be accurately measured.

[0009]

FIG. 1 is an overall perspective view schematically showing a handling device to which an embodiment of a contact unit according to the present invention is attached, and FIG. 2 is attached to a contact portion of the handling device shown in FIG. FIG. 3 is a schematic partial sectional view of an embodiment of the contact unit according to the present invention. The handling device 10 shown in FIG. 1 is a device for performing a function test of an IC semiconductor device (hereinafter simply referred to as IC for simplicity), and mainly includes a handling device main body (hereinafter simply referred to as an apparatus main body for simplicity). ) 12 and test head 14
It is composed of The test head 14 is a part that functions as an interface for connecting the apparatus main body 12 and an external tester (not shown). The test head 14 supplies a power supply to the IC, an output unit to the IC, and an IC output to the tester. It is composed of an input unit and has an IC mounted directly.
This is the part that evaluates the characteristics of

The handling device 10 includes a contact portion 16 on an upper plate 29 of the main body 12 and a contact unit 18 incorporated in the contact portion 16. Furthermore,
Tray bases 20, 22, and 24 are arranged at the back of the upper surface of the main body 12, function as a tray on which the tray is placed, and also function as a loader / unloader for the tray to receive and discharge the tray. I do. The tray base 20 is a tray base on which a tray containing an IC for performing a function test is placed.
The tray base 22 is a tray base for storing trays for storing non-defective products determined to be passed as a result of the function test, and the tray base 24 is a tray base for storing trays for storing defective products determined to be unsuccessful as a result of the function test.

Further, the IC is picked up from the tray on the tray base 20 and conveyed to the contact section 16. After the function test is completed, a non-defective IC is transferred to the tray 22 and a defective IC is transferred to the tray 22 according to the result of the function test. A transport unit 26 for transporting to the tray table 24 is provided. The transport unit 26 is an IC
A suction portion 39 for sucking the suction portion 38 at the tip thereof;
9 has a structure capable of freely moving in the X, Y and Z directions.

FIG. 2 is a sectional view showing the contact unit 18 in more detail. The contact unit 18 is an assembly made up of a number of parts, and has a mother socket (first socket) 28 at the lowermost portion thereof. Mounted on top. Mother socket 28
A plurality of child sockets (second sockets) 30 are mounted on the peripheral edge of the child socket.

In the mother socket 28 and the child socket 30, a conductive metal terminal 32 and a conductive contact pin 34 are respectively embedded integrally with the socket.
The terminal 32 is in the shape of a clip that opens bifurcated upward, penetrates the mother socket 28 almost vertically, and is provided at its base with an external tester ( (Not shown). The contact pin 34 is a rigid component formed by a flat head 36 and a leg 35 extending linearly downward from the center thereof.
Eight leads 44 contact the head 36. The head 36 extends to the upper surface of the child socket 30, and the legs 35 penetrate vertically through the child socket 30 to reach the mother socket 28, and are clipped by the clips of the terminals 32 provided thereon. There is electrical contact. With the above configuration, electrical continuity between the contact pin 34 and an external tester (not shown) is ensured via the conductor 33. Since the child socket 30 is formed integrally with the contact pin 34, when the contact resistance between the contact pin 34 and the lead 44 of the IC 38 increases, the child socket 30 is replaced with another new child socket.

On the other hand, on the center of the mother socket 28, there is mounted an IC receiving base 40 for maintaining the positional accuracy of the IC 38 in the horizontal plane at about ± 0.1 mm. A spring 42 is interposed between the mother socket 28 and the IC cradle 40, and the IC cradle 40 is urged by the spring 42 in the upward direction. When the IC cradle 40 is in a free state and the strength of the spring 42 is maximized, the distance between the head 36 of the contact pin 34 and the lead 44 of the IC 38 becomes 0.3 to 0.5 mm. 3 (a) from the IC receiving surface of the IC receiver 40 to the head 36 of the contact pin 34 when the IC receiver 40 is lowered at the maximum, the size of the IC 38 shown in FIG. The size is set to be 0.05 to 0.1 mm smaller than the stand-off dimension, that is, the dimension d between the lower surface of the IC body and the lower surface of the lead 44. The strength of the spring 42 varies depending on the number of pins of the IC, the lead material, the lead width, and the like, and is appropriately determined by experiments or trials.

Above the IC cradle 40, an arm-shaped hold block 46 is provided, one end of which is supported by a vertical support 48 and extends horizontally therefrom.
Further, the hold block 46 can be freely moved up and down by the operation of an elevating drive cylinder 50 provided along the support 48, and by the operation of the horizontal drive cylinder 52 fixed to the upper plate 29 of the apparatus main body 12. It is configured to freely and horizontally move integrally with the camera. The hold block 46 has an IC pressing mechanism at the center thereof. This IC pressing mechanism is used for the IC 3 on the IC receiving table 40.
8, a pressure pin 54 that presses down on the guide pin 8, a guide 56 surrounding the pressure pin 54, a pin 58 screwed into a through screw hole of the hold block 46,
It comprises a spring 60 interposed between the pin 58 and the pressure pin 54.

With the above configuration, the pressure pin 54
While being guided vertically downward by the guide 56, the urging force of the spring 60 pushes down the IC 38 on the IC receiving table 40 with a force of 1 kg or more. The pressing force of the pressure pin 54 can be adjusted by screwing or unscrewing the pin 58 to adjust the spring force of the spring 60, and is adjusted according to the number of pins of the IC 38. By pressing with the pressure pin 54, the IC3
8 is pushed down by 0.05 to 0.1 mm, which is the difference between D and d, so that the lead 44 is deformed and securely pressed against the head 36 of the contact pin 34. However, the deformation is in the range of the elastic deformation range, and the pressure pin 5
When the pressing of 4 is released, it returns to its original shape and does not remain. FIG. 2 shows a state where the IC 38 is pressed by the pressure pin 54. Clearance S between pressure pin 54 and guide 56
By appropriately selecting, the pressing force of the spring 42 on the pressure pin 54 can be adjusted. The pressure on the IC 38 by the pressure pin 54 uniformly applies to the upper surface of the IC 38.

Further, the hold block 46 has a lead pressing mechanism on the left and right sides of or around the IC pressing mechanism in accordance with the lead shape of the IC. The lead pressing mechanism includes a pressing cylinder 62 and a lead holder 64 attached to the lower end of the piston 63. The pressing cylinder 62 is fixed to the hold block 46 and lowers its piston 63 substantially vertically downward.
The lead retainer 64 is a hairpin-shaped elastic element having bifurcated legs, and is disposed with both legs substantially vertically up and down. The upper leg is a pressing cylinder 6
A projection 66 that is fixed to the lower end of the second piston 63 and that contacts the lead 44 of the IC 38 is provided at the tip of the lower leg. The lead retainer 64 may be independent for each pin or may be common to two or three pins. However, to make all bins on one side common to one lead retainer,
It is not preferable because it is difficult to manage the degree of parallelism between the head 36 of FIG. On the other hand, the pressing cylinder 6
2 can be independent for each side, or can be common for all four sides.

Next, the operation and operation method of the contact unit 18 will be described. First, the horizontal drive cylinder 52 is operated, and the IC pressing mechanism of the
It is positioned above the C receiving table 40, and then the elevation drive cylinder 50 is operated to lower the pressure pin 54 to bring it to the state shown in FIG. In the state of FIG. 2, that is, the pressure pin 54 presses the IC 38 on the IC
While the leads 44 of 38 are in contact with the head 36 of the contact pins 34, a test start signal is sent to the tester side, and an open short check is performed between the leads 44.

In such a test, when it is determined that the lead that should be short-circuited is open,
It is considered that the cause is that the inside of the IC is open, the contact resistance is large, or the lead of the IC floats from the contact pin due to lead deformation. In such a case, when the contact unit 18 of the present embodiment is used, since the head 36 of the contact pin 34 is flat, the lead is deformed and the defective product floats from the head 36 of the contact pin 34. ICs can be easily identified by this test. On the other hand, the conventional contact pin has a complicated shape and is elastically deformed, so that it is extremely difficult to identify an IC whose lead is deformed.

Next, the lead pressing mechanism is operated from the state shown in FIG. By operating the pressing cylinder 62, the protrusion 66 at the lower end of the lead holder 64 is connected to the lead 44 of the IC 38.
And the piston 63 is further lowered, and the resiliency of the lead holder 64 causes the lead 44 and the contact pin 3 to move downward.
4 increases the contact pressure with the head 36. With the contact pressure at a required value, various functional tests are performed following the open short check.

In the contact unit 18 of this embodiment,
By embedding the rigid contact pin 34 consisting of the flat head 36 and the short straight leg 35 in the child socket 30, the electrical path length to the test head 14 is significantly larger than that of the conventional socket. Becomes shorter. Also,
The resiliency of the lead holder 64 presses the lead 44 of the IC 38 against the rigid head 36 of the contact pin 34, so that a high contact ratio can be maintained. Furthermore, a desired contact pressure can be easily obtained by arbitrarily setting the thickness and width of the two legs of the lead retainer 64.
Due to such a shortened electric path length and a high contact ratio, an IC in a higher frequency range than a conventional product is obtained.
Measurement of the high-frequency characteristics of the device. Further, a conventional elastically deformable contact pin used for a normal socket can be diverted as the above-described lead holder 64.
In this case, highly reliable high-frequency measurement can be performed by spraying ceramics or the like on the projection 66 at the tip of the lead holder 64 to make it nonconductive.

[0022]

According to the contact unit of the present invention, the IC semiconductor device mounted on the IC cradle is pressed downward by the IC pressing mechanism so that the lead of the IC semiconductor device is placed on the head of the rigid contact pin. In this state, the identification check of the IC semiconductor device whose lead is deformed in the contact state can be surely performed, and the lead pressing mechanism is lowered, and the lead is pressed against the head of the contact pin by a resilient force holder. Therefore, it is possible to accurately control the height of the contact position between the lead and the contact pin while maintaining a high contact ratio, and to reliably measure the high frequency characteristics of the IC semiconductor device with high reliability. The identification check of the semiconductor device and the functional test such as the measurement of the high-frequency characteristics can be sequentially and efficiently performed. At this time, since the head of the contact pin has a flat plate shape, the contact state between the lead and the contact pin is observed, and a defective IC semiconductor device floating from the deformed contact pin is reliably identified. be able to.

Further, since a rigid contact pin having a flat head and short legs is embedded in the second socket, the length of the electrical path from the lead of the IC semiconductor device to the conductive terminal can be greatly increased. It can be shortened, and a measurement error can be hardly generated. Furthermore, since the lead can be pressed against the head of the contact pin by the resilient lead presser, the contact rate can be improved, and the contact pin has rigidity and does not deform.
The height of the contact position between the lead of the semiconductor device and the contact pin can be easily managed, and the high-frequency characteristics of the IC semiconductor device in a higher high-frequency range can be measured with high reliability. In addition, since the shape and configuration of the contact pins can be simplified, it is easy to manufacture a socket including the contact pins, so that the unit price of the socket can be reduced and the cost can be reduced. Further, by using the contact unit of the present invention, it is possible to check the identification of a defective IC semiconductor device in which the lead is deformed and floats using the contact pin having a flat head. In addition, since the lead inspection of the IC semiconductor device can be continuously and simply performed, the efficiency of the function test of the IC semiconductor device can be greatly improved.
A great effect can be achieved, such as the manufacturing accuracy and manufacturing efficiency of the semiconductor device can be further improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a handling device.

FIG. 2 is a schematic sectional view of a contact unit.

FIGS. 3 (a) and 3 (b) are side views of the IC illustrating the stand-off of the IC.

FIG. 4A is an explanatory view of a standard type contact unit, and FIG. 4B is an explanatory view of a high frequency contact unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Handling device 12 Device main body 14 Test head 16 Contact part 18 Contact unit 20, 22, 24 Tray stand 26 Transport unit 28 Mother socket (1st socket) 29 Upper plate 30 Child socket (2nd socket) 32 Conductive metal terminal 34 Contact pin 35 Leg 36 Head 38 IC 40 IC holder 42 Spring 44 Lead 46 Hold block 48 Prop 50 Elevating drive cylinder 52 Horizontal drive cylinder 54 Pressure pin 56 Guide 58 Pin 60 Spring 62 Press cylinder 64 Lead holding

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G01R 31/26 H01L 21/66 H01R 33/76

Claims (2)

(57) [Claims] 1. A unit mounted on a handling device for performing a function test of an IC semiconductor device, comprising a lead pressing mechanism for pressing a lead of the IC semiconductor device against a contact pin, wherein a unit is provided between the IC semiconductor device and an external tester. A contact unit for providing an electrical interface, comprising: a first socket mounted on a test head of a handling device; and a second socket mounted on a peripheral portion thereof, wherein an IC semiconductor is provided on a central portion of the first socket. An IC cradle on which the device is mounted is installed so as to be able to ascend and descend a predetermined range via a spring, and the IC semiconductor device mounted on the IC cradle is opposed to the IC cradle above and is lowered with a predetermined pressing force. Attaching an IC pressing mechanism that presses to a hold block provided movably in the horizontal and vertical directions, In the second socket, an IC mounted on the IC receiver is mounted.
A rigid contact pin having a flat head contacting the lead of the semiconductor device and a leg extending downward from the head is mounted on the upper surface of the second socket, and the leg is mounted on the second socket. And a conductive terminal is attached to the first socket so as to electrically contact the leg of the contact pin and to be connected to an external tester. The lead of an IC semiconductor device mounted on the IC receiving table is provided on the hold block so as to be positioned on the left, right, or around the IC pressing mechanism, and is resiliently deformed. A contact unit, wherein a lead pressing mechanism having a lead press for pressing is installed so as to be vertically movable. 2. An IC semiconductor device is mounted on an IC cradle which can be moved up and down by a predetermined range via a spring so that a lead of the IC semiconductor device comes into contact with a flat head of a rigid contact pin. A test is performed to determine whether or not the lead is deformed by pressing the IC with a predetermined pressing force below the IC semiconductor device with the lead in contact with the head and measuring the presence or absence of conduction. A lead holder is brought into contact with the lead holder and the lead is pressed against the head by the elastic force of the elastic deformation of the lead holder to test the high frequency characteristics of the IC semiconductor device.
Function test method for C semiconductor device.