KR100365008B1 - Carrier Module for a Surface Mounting IC Components - Google Patents

Abstract

The present invention relates to a carrier module for a surface-mounted device that allows accurate testing and rapid test with a test socket without damaging the balls formed on the bottom of the device when testing the performance of the finished device.

The present invention is a carrier module upper and lower body formed in each of the upper and lower projection jaw in the upper and lower sides, the element seating unit is inserted into the carrier module upper body so that the micro-BGA (μ-BGA) type device can be seated, and the carrier module It is characterized by consisting of a spring that is elastically fixed by being inserted into the upper and lower projection jaw formed in the upper and lower body.

In the case of a TSOP type device, a carrier module can be configured without using an element seating unit.

Description

Carrier Module for a Surface Mounting IC Components

The present invention relates to a carrier module for use in contacting a surface mount device to a socket. More particularly, the present invention relates to a test socket without damaging the ball formed on the bottom surface of the device when testing the performance of the finished device. The present invention relates to a carrier module for a surface mount device that allows for quick connection and test.

In general, the characteristics of the device are determined by the tester by transferring one or several devices produced in the production process to the test part of the handler and electrically connecting the device leads to the connectors installed in the test part. Good and defective items are sorted, and the elements of the good are shipped and the bad is discarded.

1 is a plan view showing a micro-BGA type device molded, and FIG. 2 shows a state before connecting a micro-BGA type device to a contact pin of a socket. As shown in the drawing, the micro-BGA type element 1 has a very small size of about 5 X 8 MM and a diameter of the ball 2 which is formed at the bottom and acts as a lead as small as 0.3 MM, and the spacing of the balls is small. -The pitch is only 0.5mm.

The device having the above structure is formed on the bottom surface of the body 1 by molding a plurality of devices at the same time in consideration of productivity during the manufacturing process to form the body 3 and then sawing it along the cutting line 4 as indicated by the dotted line. The outer border dimension S of the formed ball 2 is not constant.

Therefore, the current situation is managing the tolerance of the dimension (S) of the outer edge portion in the allowable range of 0.15MM.

3 is a view showing a state in which a conventional micro-BGA (μ-BGA) type device is connected to a contact pin of a socket, and FIG. 4 is a view showing a connection state of a device with a contact pin of a device in a conventional contact device. State diagram.

The element 1 contained in the customer tray (not shown) is transferred to the alignment block to determine the position, and then the plurality of pickers 5 as the adsorption means adsorb the positioned element and transfer it to the socket 6 side.

When the ball 2 adsorbed by the picker 5 and exposed downward of the element 1 is positioned on the vertical line with the contact pin 7 of the socket 6, the picker descends to the socket side, and thus the ball is tooled downward. 2) is connected with the contact pin 7 of the socket 6.

In this state, when the picker 5 descends further downward and pressurizes the device 1, the balls 2 formed in the device 1 are electrically connected to the contact pins 7. Electrical characterization becomes possible.

However, such a conventional apparatus has a ball pin 2 of the element 1 whose outer edge dimensions are within an allowable tolerance even if the picker 5 picks up the correct position of the element 1 positioned by the alignment block. 7) If the position is shifted away from the picker 5, when the picker 5 descends, the ball 2 having a small pitch does not deviate from the contact pin 7 and contact the contact pin accurately. This occurred.

That is, since the picker 5 directly holds the plurality of elements 1 in contact with the contact pins 7 of the socket, alignment defects between the ball and the contact pins due to the pitch and poor positioning of the balls 2 are generated. .

Since the pitch of the ball and the thickness of the test socket become smaller not only in the connection of the conventional test socket and the micro-BGA type device shown in the above, but also in the test socket of the type in which the ball groove is formed in the test socket. As a result, there are disadvantages such as poor alignment and broken or crushed balls of the device.

In addition, in recent years, as the thickness of the test socket becomes thinner and thinner, this is to shorten the distance between the device and the test socket to minimize the occurrence of noise or distortion occurring when the distance is long. Therefore, as the thickness of the test socket becomes smaller as described above, if the thickness of the test socket becomes thin, the chamber thickness of the test site should be thin at the same time. It was not possible to make the thickness thinner. Therefore, when the chamber thickness of the test site is not thin, the existing test tray including the device supplied to the test site is not easily contacted with the test socket.

Therefore, there is a problem that many defects occur because the characteristic test of the device is impossible and the characteristic of the device is not accurately measured even if the test is performed.

In addition, in the conventional carrier module, even though the pitch between the ball and the ball of the micro-BGA element is constant, the pitch from the cut line to the ball is irregular, causing a lot of errors. Since the ball of the non-BGA device is not inserted correctly and contacts the surroundings, the ball of the device is broken or crushed, thereby improving the error rate of the finished device and lowering the productivity.

The carrier module for the surface mount device of the present invention has been devised to solve such a conventional problem, and an object of the present invention is to accurately contact a test socket with a μ-BGA type device or a TSOP type device at a test site of a handler. This is to improve the performance by precisely testing the characteristics of the device.

Another object of the present invention is to provide a carrier module for a surface mount device for shortening the contact distance between the test socket and the device so that a high speed test can be made.

In addition, another object of the present invention is to provide a carrier module for a surface-mounted device capable of miniaturizing the equipment by minimizing the test socket for shortening the contact distance between the test socket and the device.

1 is a plan view of a micro-BGA (μ-BGA) type device is molded,

2 is a view showing a state before connecting a conventional micro-BGA (μ-BGA) type device to the contact pin of the socket,

3 is a view showing a state in which a conventional micro-BGA (μ-BGA) type device is connected to a contact pin of a socket;

4 is a state diagram showing a state in which a ball of an element is connected with a contact pin in a conventional contact device;

5A is a perspective view showing a carrier module for a micro BGA type device of the present invention;

5B is a perspective view showing a carrier module for a TSOP type device of the present invention;

Figure 6 is a perspective view showing a device seating unit of the carrier module for a micro-vision type device of the present invention,

7 is a cross-sectional view showing a carrier module for a microvisied device of the present invention;

8 is a plan view showing a test tray equipped with a carrier module for a micro-vision type device of the present invention,

9 is a partially enlarged view showing a test tray when the micro busy carrier module of the present invention is mounted.

*** Explanation of symbols on main parts of drawing ***

10 carrier body upper body 12 element seating unit

14: element seating portion 16: element seating unit insertion groove

18: positioning groove 20: fixing bolt

22: upper projection jaw 24: lower projection jaw

26: spring 28: carrier module lower body

30: positioning groove 32: the first guide

34: second guide 36: fixing nut

38: latch 40: protruding jaw

42 silicon rubber 100 micro-BGA device

102: carrier module 104: test socket

In order to achieve the above object, the present invention is a carrier module upper and lower body body formed in each of the upper and lower projection jaw in the upper and lower sides; An element seating unit inserted into the carrier module upper body to allow a micro-BGA type element to be seated thereon; It provides a carrier module for a surface-mounted device, characterized in that consisting of a spring that is elastically fixed to the upper and lower projection jaw formed in the upper and lower body of the carrier module.

The device seating unit may further include: a device seating part on which a micro-BGA type device is mounted; And a first guide and a second guide for determining the position of the device seated on the device seat.

In addition, the second guide of the element seating unit has a fixing groove for fixing the element seating unit to the carrier module.

In addition, the device seating unit and a fixing bolt that is fastened to the fixing groove of the second guide; A silicon rubber inserted into and fixed to the outside of the fixing bolt and inserted into the fixing groove of the element seating unit; It consists of a fixing nut fastened to the lower portion of the fixing bolt.

The fixing nut is inserted into and fixed to the lower end of the silicon rubber inserted into the fixing groove of the element seating unit and fastened by the fixing bolt.

In addition, the upper and lower projection jaw formed in the upper and lower body of the carrier module is formed to be staggered in the upper and lower parts.

In addition, the spring is fitted between the upper and lower protrusion jaw to be wound around the upper and lower body of the carrier module.

In addition, the carrier module consisting of the upper and lower body of the carrier module, the spring is wound around the carrier module is mounted on a test tray provided with a mounting portion.

In addition, the test tray is installed so that the spring installed around the carrier module consisting of the carrier module upper and lower bodies so as not to deviate from the protruding jaw symmetrically formed in the carrier module mounting portion of the test tray and move back and forth by the spring elasticity.

(Example)

Hereinafter, a carrier module for a surface mount device according to the present invention will be described in detail with reference to the accompanying drawings.

5A is a perspective view showing a carrier module for a micro BGA type device of the present invention, FIG. 5B is a perspective view showing a carrier module for a TSOP type device, and FIG. 6 is a carrier of FIG. 5A. A perspective view showing a device seating unit of a module.

First, as shown in FIG. 5A, the carrier module 102 for the micro-visual type device of the present invention includes upper and lower body bodies 10 and 28 having upper and lower protrusions 22 and 24 formed at upper and lower sides thereof, respectively. ) And a device seating unit 12 inserted into the carrier module upper body 10 so that the micro-BGA type device can be seated, and the upper and lower bodies 10 and 28 of the carrier module. It is composed of a spring 26 that is elastically fixed to the upper and lower protrusions 22 and 24 formed.

However, the carrier module 102a for the TSOP type device has a latch for holding and releasing the upper and lower bodies 10 and 28 and the TSOP type device 100a. 38) and a spring 26 that is elastically fixed to the upper and lower protrusions 22 and 24 formed on the upper and lower bodies 10 and 28 of the carrier module. Here, in the case of the TSOP type device 100a, unlike the micro BGA device 100, a separate device seating unit 12 to be described later is not required.

In the carrier module for the micro-visgi type device, the element mounting unit 12 may include a device seat 14 on which a micro-BGA type device is mounted, as shown in FIG. It consists of a first guide 32 and a second guide 34 for determining the position of the element seated in the part 14. In addition, the second guide 34 of the element seating unit 12 includes a fixing groove 18 for fixing the element seating unit 12 to the carrier module 102. In addition, the device seating unit 12, as shown in Figure 6 and 7, the fixing bolt 20 is fastened to the fixing groove 18 of the second guide 34, and the fixing bolt 20 It is composed of a silicone rubber 42 is inserted into and fixed to the outside of the device mounting unit 12 is inserted into the fixing groove 18, and the fixing nut 36 is fastened to the lower portion of the fixing bolt (20).

At this time, the fixing nut 36 is inserted into and fixed to the lower end of the silicon rubber 42 inserted into the fixing groove 18 of the device seating unit 12 and is fastened by the fixing bolt 20 at the same time, and the carrier module Upper and lower protrusion projections 22 and 24 formed on the upper and lower bodies 10 and 28 are alternately formed at the upper and lower portions. The spring 26 is configured to be fitted between the upper and lower protrusion projections 22 and 24 while being wound around the carrier module upper and lower bodies 10 and 28. The carrier module 102 has a spring 26 wound around the upper and lower bodies 10 and 28, and a predetermined element is mounted on the element seating unit 12.

As illustrated in FIG. 8, the test tray 106 includes a spring 26 installed around the carrier module 102 including the carrier modules upper and lower bodies 10 and 28 to the carrier module mounting portion of the test tray 106. Inserted so as not to be separated from the protruding jaw 40 formed in each symmetrical and move back and forth by the spring elasticity.

Looking at the carrier module 102 of the present invention having the structure as described above in more detail, each of the upper body 10 and the lower body 28 is formed in the upper and lower portions of the carrier module 102, the upper body Positioning grooves 30 are respectively formed at one corner of the edge 10 so as to be coupled with the positioning pins of the test sockets (not shown), and the device seating unit 12 into which the device seating unit 12 is inserted is inserted into the center portion. The groove 16 is formed.

In addition, the upper protrusion jaw 22 is formed symmetrically on the left and right sides of the carrier module upper body 10, a pair of lower protrusion jaw 24 formed while maintaining a predetermined distance is the carrier module lower body 28 Are formed symmetrically on the left and right sides of The spring 26 is fitted to the upper and lower projection jaws 22 and 24 and is provided around the carrier module 102.

In addition, the device seating unit insertion groove 16 is inserted into the device seating unit 12 on which the micro-BIGA (μ-BGA) device 100 is seated, and the micro-BGA (μ-BGA) device 100 ), The latch 38 provided in the carrier module 102 is fixed.

In this case, the device seating unit 12 has a first guide 32 is formed on both sides of the diagonal corner to fix the micro-BGA (μ-BGA) device 100, the fixing groove 18 is formed at the opposite edge The formed second guide 34 is formed.

A fixing nut (not shown) is inserted into the fixing groove 18 of the second guide 34, and the fixing bolt 20 is inserted into the fixing nut (not shown) to be fastened to the element seating unit 12. ) To the carrier module 102.

As shown in FIG. 7, FIG. 7 is a cross-sectional view illustrating a carrier module 102 in which a micro BGA element 100 is inserted, and the micro module (μ) is formed in the carrier module 102 of the present invention. BGA) The device 100 is seated, and the silicone rubber 42 is inserted into the fixing groove 18 formed by being connected to the upper and lower bodies 10 and 28 of the carrier module, and the fixing nut 36 is inserted into the lower portion thereof. Is inserted, the fixing bolt 20 is fastened to the fixing nut (36).

At this time, even if the fixing bolt 20 is fastened to the fixing nut 36, the silicone rubber 42 is inserted into and fixed to the fixing nut 36, and the front and rear left and right sides due to the elasticity of the material of the silicone rubber 42. Fluid movement is possible.

In addition, one side portion of the micro-BIGA (μ-BGA) device 100 is fixed by a latch 38, and the upper and lower protrusion protrusions 22 and 24 of the upper and lower body bodies 10 and 28 are respectively formed. A spring 26 is inserted therebetween so that the carrier module 102 is elastically moved when contacting the test socket (not shown) with the carrier module 102 mounted on the test tray (not shown), thereby engaging with the test socket. Configure.

The test tray 106 shown in FIGS. 8 and 9 is provided with a plurality of mounting portions on which the carrier module 102 can be mounted, and each of the carrier module 102 mounting portions has protruding jaws 40 at both sides. Formed to install so that the spring 26 is installed around the carrier module 102 is caught. In addition, the heat sink 110 is formed in the center of the upper body 10 of the carrier module 102, the air inlet 112 is formed on the heat sink 110, the air outlet 114 is formed on the side do. The heat sink 110 has an air inlet 112 and the air outlet 114 is preferably formed integrally.

The present invention configured as described above is seated on the element mounting unit 12 of the carrier module 102, the micro-BIGA (μ-BGA) device 100 is fixed by the latch 38 and the carrier module ( The spring 26 is inserted between the upper and lower protrusions 22 and 24 around the 102.

As described above, the carrier module 102 on which the micro-BGA device 100 is mounted is mounted on the test tray 106 to be transferred to the test socket of the test site for testing.

At this time, the spring 26 fitted to the upper and lower protrusion projections 22 and 24 formed around the carrier module 102 is installed to be fitted to the protrusion projection 40 formed in the test tray 106.

As described above, the carrier module 102 installed in the test tray 106 may make contact with the test socket completely by using the elasticity of the spring 26 even if the thickness of the test socket becomes thin. Miniaturization can be achieved.

In addition, the fixing groove 118 of the element seating unit 12 so that the ball of the micro-BGA element 100 in contact with the ball groove of the micro-BGA element formed in the test socket is correctly inserted. Insert the silicone rubber 42 and the lower end of the silicone rubber 42 is inserted and fixed to the fixing nut 36 and the fixing nut 36 is installed to be fastened to the fixing bolt 20 to enable flow. By placing a slight gap A on the fixing nut 36 fastened to the fixing bolt 20 to allow the element seating unit 12 to flow, the micro-BGA element 100 is provided. Accurate insertion into the micro-BGA-type test socket with ball grooves in which the ball of the micro-BGA-type ball contacts the ball, without breaking .

As described above, the carrier module of the present invention is configured to double the carrier module upper and lower body (10,28) and the separate element seating unit 12 inserted into the upper part to meet the trend of the test socket which is continuously thinned in the future. In this case, it is possible to miniaturize the device.

In addition, the ball of the micro-BGA element inserted into and contacted with the ball groove of the micro-BGA test socket allows the flow of the element seating unit 12 installed in the carrier module to be freely contacted. This results in more precise and accurate testing.

As described above, the surface-mount device carrier module of the present invention allows the device seating unit in which the device is seated to flow individually, thereby precisely making contact with the test socket, thereby lowering the error rate of the device and reliability of the product. The test distance between the test socket and the micro-BGA device can be shortened, thereby improving productivity while simultaneously performing high-speed performance test.

Claims (11)

Upper and lower carrier modules each having upper and lower protrusion protrusions formed on both upper and lower sides thereof; A device seating unit inserted into the carrier module upper body to allow a micro-BGA type device to be seated thereon; Surface mounted type device, characterized in that consisting of a spring which is inserted into the upper and lower protrusion projection formed on the upper and lower body of the carrier module is wound around the outer periphery of the upper and lower body and elastically fixed to the protrusion of the test tray to contact the test socket. Carrier module. The carrier module of claim 1, wherein a heat dissipation plate is formed at a predetermined portion of the upper body of the carrier module, and an air inlet and an outlet are formed at the predetermined portion of the carrier module. The device of claim 1, wherein the device seating unit comprises: a device seating part on which a micro-BGA type device is mounted; Carrier module for a surface-mounted device, characterized in that consisting of a first guide and a second guide for determining the position of the device seated on the device seat. The method of claim 3, wherein The device seating unit includes a fixing bolt that is fastened to the fixing groove of the second guide; A silicon rubber inserted into and fixed to the outside of the fixing bolt and inserted into the fixing groove of the element seating unit; Consists of a fixing nut fastened to the lower portion of the fixing bolt, The fixing nut is a carrier module for a surface-mounted device, characterized in that the lower end of the silicone rubber inserted into the fixing groove of the device mounting unit is inserted and fastened by a fixing bolt. delete delete The carrier module for a surface mount device according to claim 1, wherein the upper and lower protrusion projections formed on the upper and lower body of the carrier module are staggered in the upper and lower parts. delete The upper and lower body of the carrier module and a spring-shaped carrier module fitted to the upper and lower projection jaw formed around the mounting is mounted on a test tray provided with a mounting portion, the test tray is the upper and lower body of the carrier module Carrier module for a surface-mounted device characterized in that the spring is installed around the carrier module made of a carrier module mounting portion of the test tray so as not to be separated from the projection jaw symmetrically formed so as to be moved back and forth by the spring elasticity. delete Upper and lower body carrier modules each having upper and lower protruding jaws formed on upper and lower sides thereof; A latch capable of holding and releasing a TSOP type device; It is elastically fixed by being inserted into the upper and lower protrusion jaws formed on the upper and lower body of the carrier module, and is composed of a spring which is inserted so as not to be separated from the protrusion jaw formed symmetrically to the carrier module mounting portion of the test tray and moved back and forth by elasticity. Carrier module for a surface-mount device, characterized in that the.