TWI418800B - A conductive member, a connecting member, a test apparatus, and a method of repairing the connecting member - Google Patents

Description

Conducting member, connecting member, testing device and method for repairing connecting member

The present invention relates to an energization member, a connection member, a test device, and a method of repairing the connection member.

When the electrical characteristics of the element on the semiconductor wafer are tested, a probe card that electrically connects the two is disposed between the test head that supplies the test pattern to the element and the element.

In recent years, there has been also used a probe card comprising: a contact probe having a plurality of bumps; and an isotropic conductive rubber having a copper film corresponding to the bump (see Patent Document 1).

(Patent Document 1) Japanese Patent No. 4187718

The bumps that contact the probe and the copper film of the isotropic conductive rubber are consumed in repeated tests. However, when the bump or the copper film is adhered to the contact probe or the isotropic conductive rubber, even if a part of the bump or the copper film is consumed, the consumed bump or copper film cannot be easily replaced. Whenever a contact probe or an anisotropic conductive rubber is replaced, the running cost will increase.

In order to solve the above problems, a first aspect of the present invention provides an electric conduction member which is detachably disposed with an opening provided in a frame of a connecting member for testing a test head and a tested component of the component to be tested The electrically connected member is provided with a conductive portion that electrically connects the test head and the device to be tested, and a holding portion that has elasticity and holds the conductive portion. In the above-described energization member, the holding portion may have a convex portion to be fitted into the opening, and the energizing member may be detachably held by the frame by a force generated between the convex portion and the side surface of the opening. In the above-described energization member, the holding portion may have a locking portion that is not fitted into the opening, and the locking portion is detachably coupled to the frame surface. The energizing member can be detachably held by the frame by the combination of the locking portion and the surface of the frame. In the above-described energization member, the locking portion may have a coupling opening that can be coupled to the projection provided on the surface of the frame.

According to a second aspect of the present invention, there is provided an electric conduction member which is detachably disposed on an opening of a frame of a connecting member, wherein the connecting member electrically connects the test head for testing the component to be tested to the component to be tested, Further, the energizing member includes a conductive portion that electrically connects the test head and the member to be tested, and a holding portion that has elasticity and holds the conductive portion, and the holding portion has a locking portion that is detachably coupled to the frame The surface is not embedded in the opening, and the locking portion includes a coupling opening that can be combined with a projection provided on a surface of the frame.

The energization member can be detachably held by the frame by a pressure difference between a region sealed by the frame and the holding portion and the outside of the sealing portion. In the above-described energization member, a hollow region and an opening that communicates the hollow region and the outside of the locking portion may be provided inside the locking portion. In the above-described energization member, the hollow region can be blocked by the frame by the opening, and sealed by the frame and the holding portion. The energization member can be detachably held by the frame by the elasticity of the holding portion. In the above-described energization member, the conductive portion may have elasticity. In the above-described energization member, the conductive portion may protrude from the surface of the holding portion. In the above-described energization member, the profile of at least one cross section of the holding portion may be a T shape, a cross shape, an H shape, a Y shape, or a quadrangular shape. In the above-described current-carrying member, the conductive portion may penetrate the holding portion, and the holding portion may have insulation properties.

A third aspect of the present invention provides a connecting member electrically connecting a test head for testing a component to be tested and a component to be tested, and the connecting member includes: a frame having an opening; and an energizing member The charging head is disposed in the opening, and the test head is electrically connected to the component to be tested. The energizing member has a conductive portion electrically connecting the test head and the component to be tested, and a holding portion having elasticity and maintaining electrical conductivity. unit. In the above connecting member, the holding portion may include: a convex portion to be embedded in the opening; and a locking portion detachably coupled to the frame surface and not embedded in the opening. In the connecting member, the energizing member can be detachably held by the frame by a force generated between the convex portion and the side surface of the opening. In the above connecting member, the energizing member can be detachably held by the frame by the combination of the locking portion and the surface of the frame.

According to a fourth aspect of the present invention, there is provided a connection member electrically connecting a test head for testing a test element to the test element, and the connection member includes: a frame having an opening; and an energization member; The test head is detachably disposed in the opening, and the test head is electrically connected to the test element. The conductive member has a conductive portion electrically connecting the test head and the test element, and a holding portion. The locking portion includes a protruding portion on the surface thereof, the holding portion is detachably coupled to the surface of the frame, and includes a locking portion not embedded in the opening, and the locking portion includes the protruding portion The opening to be embedded.

According to a fifth aspect of the invention, there is provided a test apparatus comprising: a test head for testing a test element; a body portion for supplying a test pattern to the test head; and the connecting member.

A sixth aspect of the present invention provides a method of repairing a connecting member, wherein the connecting member is repaired, and the method includes: a step of removing an energizing member disposed on the opening from the frame; and disposing the other energizing member The stage on the opening.

The above summary of the invention does not recite all of the essential features of the invention. Moreover, the sub-combination of these feature groups can also be an invention.

Hereinafter, the present invention will be described by way of embodiments of the invention. However, the following embodiments are not intended to limit the invention. Further, the means for solving the invention does not necessarily have to include all combinations of the features described in the embodiments.

In the following description, the same reference numerals are given to the same or similar parts in the description of the drawings, and the description thereof will not be repeated. Moreover, in various embodiments, the corresponding components may have the same composition, function, and use. Furthermore, the drawing is only a mode, and thus the relationship between the thickness and the plane size, the ratio, and the like are sometimes different from the actual one. Moreover, for convenience of explanation, the drawings may include portions having different dimensional relationships or ratios from each other.

FIG. 1 schematically shows an example of a cross-sectional view of the test apparatus 100. The test apparatus 100 tests the electrical characteristics of components such as semiconductor wafers formed on the wafer 10 to determine whether the components are good or not. The test apparatus 100 can perform tests on a plurality of semiconductor wafers formed on the wafer 10. An element such as the wafer 10 and the semiconductor wafer may be an example of the device to be tested.

The test apparatus 100 includes a transport unit 110, a loading unit 130, a Front Opening Unified Pod (FOUP) 150, a main unit 160, an aligning unit 170, a test head 200, and a probe card 300. In the present embodiment, the loading unit 130, the transport unit 110, and the main unit 160 are arranged adjacent to each other in the order from the front (the left side in the drawing) toward the rear (the right side in the drawing). Further, the alignment unit 170, the probe card 300, and the test head 200 are laminated on the main body unit 160. The transport unit 110 and the loading unit 130, and the transport unit 110 and the aligning unit 170 are each in sealing communication with each other. Thereby, the cleanliness inside the test apparatus 100 can be maintained.

The transport unit 110 transports the wafer 10 inside the test apparatus 100. The transport unit 110 has a built-in robot arm 116. The robot arm 116 transports the wafer 10 between the loading unit 130 and the alignment unit 170. The robot arm 116, through the loading door 134, takes the wafer 10 one by one from the FOUP 150 and transports it to the alignment unit 170. The robot arm 116 mounts the wafer 10 on the wafer tray 20 that has been placed inside the alignment unit 170. Further, the robot arm 116 takes out the wafer 10 after the end of the test by the loading gate 134, and takes it out of the alignment unit 170, and stores it in the FOUP 150.

The loading unit 130 has a loading station 132 and a loading door 134. The loading table 132 mounts the FOUP 150 in which the wafer 10 to be tested is stored. When the wafer 10 is carried into the test apparatus 100 or carried out from the test apparatus 100, the loading door 134 is opened and closed. Thereby, the wafer 10 can be loaded from the outside without lowering the cleanliness inside the test apparatus 100.

The FOUP 150 accommodates a plurality of wafers 10 as test objects. Further, the FOUP 150 stores the wafer 10 after the test is completed.

The main unit 160 controls the operation of each part of the test apparatus 100. For example, the main unit 160 synchronizes the operations of the transport unit 110, the loading unit 130, and the aligning unit 170, and delivers the wafers 10 to each other. Further, the main body unit 160 controls the operation of the test head 200 in accordance with the test program. The body unit 160 supplies the test pattern to the test head 200. The body unit 160 may be an example of a body portion.

The alignment unit 170 adjusts the relative position of the wafer 10 and the probe card 300 to electrically connect the wafer 10 and the probe card 300. The alignment unit 170 has an alignment stage 172. The stage 172 is aligned to adjust the relative position of the wafer 10 and the probe card 300 to align the probe card 300 with the wafer 10. In the present embodiment, the wafer stage 20 is mounted on the alignment stage 172, and expands and contracts in the vertical direction (vertical direction in the drawing).

The wafer tray 20 has a mounting surface on which the wafer 10 is placed. The wafer tray 20 can hold the wafer 10 on the mounting surface by vacuum suction or the like. By aligning the stage 172, the wafer tray 20 holding the wafer 10 is moved to the probe card 300, and the wafer 10 is pressed against the probe card 300. Thereby, the terminal provided on the surface of the wafer 10 is in contact with the terminal provided on the surface of the probe card 300 and corresponding to the terminal.

In this embodiment, the probe card 300, the wafer 10, and the wafer tray 20 are integrated in this state. Thereby, the test head 200 can be loaded with the wafer 10. For example, the wafer tray 20 has a sealing member that seals a space between the probe card 300 and the wafer tray 20, and in a state where the probe card 300 and the wafer tray 20 sandwich the wafer 10, The pressure in the space between the probe card 300 and the wafer tray 20 is lower than the external pressure, and the probe card 300, the wafer 10, and the wafer tray 20 can be integrated. The probe card 300 holding the wafer 10 and the wafer tray 20 can be clamped from the outside using a fixing jig as another method of integration.

The test head 200 is electrically connected to the wafer 10 to test the electrical characteristics of the wafer 10. The test head 200 can perform a burn in inspection of the wafer 10. The test head 200 houses a plurality of pin interface circuits 210. The pin interface circuit 210 has an electrical circuit required according to the test object and the test content. In the present embodiment, the test head 200 is electrically connected to the probe card 300 via a contactor 202 attached to the lower surface.

Probe card 300 is used for testing the component being tested. The probe card 300 may be a wiring board unit that electrically connects the test head 200 and the wafer 10 between the test head 200 and the wafer 10 when the test is performed in the test apparatus 100. When the wafer 10 is tested, a conductive path or an electrical signal path is formed between the test head 200 and the wafer 101 by the probe card 300. By replacing the probe card 300, the test apparatus 100 can be made to correspond to the wafer 10 having a different layout.

FIG. 2 is a view schematically showing an example of a cross-sectional view of the test head 200. The same elements as those in the first embodiment are denoted by the same reference numerals, and the description thereof will not be repeated. The test head 200 includes a housing 201, a contactor 202, a lead interface circuit 210, a motherboard 220, and a flat cable 230.

Inside the casing 201, a mother board 220 having a plurality of relay connectors 224 is horizontally disposed. The relay connector 224 has a receptacle on the upper surface side and the lower surface side of the motherboard 220 to form a signal path penetrating the mother board 220.

A pin interface circuit 210 is mounted on the upper surface of the motherboard 220 via the angle connector 222 on each of the relay connectors 224. With this configuration, the pin interface circuit 210 can be replaced according to the specifications and test contents of the test object.

The plurality of pin interface circuits 210 are sometimes of the same specification and sometimes different from each other. Further, the pin interface circuit 210 may not be mounted on a part of the relay connector 224.

On the lower surface of the mother board 220, a small substrate 228 is connected to the relay connector 224 via an angle connector 226, respectively. One end of the flat cable 230 is connected to the small substrate 228. Thereby, the lead interface circuit 210 inside the housing 201 and the contactor 202 described below can be connected via the flat cable 230.

A contactor 202 is mounted on the lower surface of the frame 201. The contactor 202 has a support substrate 240, a three-dimensional actuator 250, a contactor substrate 260, a sub-substrate 270, and a contactor housing 280.

The support substrate 240 is fixed to the upper surface thereof with respect to the frame 201, and supports the upper end of the three-dimensional actuator 250 on the lower surface. The lower end of the three-dimensional actuator 250 supports the contactor substrate 260. Further, a sub-substrate 270 and a contactor housing 280 are fixed to the lower surface of the contactor substrate 260.

The three-dimensional actuator 250 is movable in the horizontal direction along the lower surface of the support substrate 240, and also expands and contracts in the vertical direction. Thereby, the contactor substrate 260 can be moved in three dimensions. When the contactor substrate 260 moves, the sub-substrate 270 and the contactor housing 280 also move together with the contactor substrate 260.

Furthermore, the lower end of the flat cable 230 is bonded to a terminal held by the contactor housing 280, for example, to a spring pin. Thereby, the pin interface circuit 210 is electrically connected to the lowermost side of the test head 200. Although a spring pin is exemplified here, a configuration including a coupling such as capacitive coupling or optical connection without using a spring pin may be employed.

FIG. 3 schematically shows an example of an exploded view of the probe card 300. The probe card 300 electrically connects the test head 200 and the wafer 10. Probe card 300 forms part of a conductive path between test head 200 and wafer 10. The probe card 300 can be an example of a connecting member. The probe card 300 includes a wiring board 320, an elastic connector 340, an interposer 350, an elastic connector 360, and a sheet-like connector 370.

The elastic connector 340, the inserter 350, the elastic connector 360, and the sheet-like connector 370 each have an opening 344, an opening 354, an opening 364, and an opening 374 extending through the front and back. When the elastic connector 340, the inserter 350, the elastic connector 360, and the sheet-like connector 370 are laminated, the openings are arranged in communication. Thereby, the exhausting of the members is facilitated.

Hereinafter, the case where the electrodes of the elastic connector 340 and the elastic connector 360 are detachably arranged will be described as an example, and the probe card 300 will be described. In addition, in the following description, the test head 200 side may be shown as an upward direction and the wafer 10 side may be shown as a downward direction. However, the above description is not limited to the case where the wiring board 320, the elastic connector 340, the interposer 350, the elastic connector 360, and the sheet-like connector 370 are used, and the test head 200 side is shown as an upper side.

The wiring substrate 320 electrically connects the test head 200 to the wafer 10. The wiring substrate 320 forms a part of a conductive path between the test head 200 and the wafer 10. The wiring board 320 can be an example of a connecting member. The wiring substrate 320 is formed of an insulating substrate having a relatively high mechanical strength, and is formed, for example, of a polyimide film. The peripheral edge portion of the wiring board 320 is sandwiched by the frame-shaped upper frame 312 and the lower frame 314, respectively. The upper frame 312 and the lower frame 314 are laminated to each other and fastened by screws 316. Thereby, the mechanical strength of the wiring substrate 320 is further improved.

A plurality of guiding units 230 are disposed on the upper surface of the wiring substrate 320. When the contactor 202 abuts on the wiring substrate 320, the guiding unit 330 functions as a connector guide that guides the contactor 202 to perform positioning. A plurality of contact pads 323 that are electrically connected by contact are disposed on the lower surface of the wiring substrate 320. The contact pad 323 is electrically connected to a contact pad (not shown) disposed on the inner side of the guiding unit 330 on the upper surface of the wiring substrate 320.

The elastic connector 340 is disposed between the wiring substrate 320 and the interposer 350. The elastic connector 340 electrically connects the test head 200 to the wafer 10. The resilient connector 340 forms a portion of the conductive path between the test head 200 and the wafer 10. The elastic connector 340 can be an example of a connecting member.

The elastic connector 340 has a resilient contact 341 and a frame plate 342. The frame plate 342 has an opening 344 and an opening 346. The opening 344 and the opening 346 penetrate the frame plate 342 from the surface on the side of the test head 200 (hereinafter sometimes referred to as the upper surface) toward the wafer 10 side (hereinafter sometimes referred to as the lower surface).

The elastic contact member 341 is detachably disposed in the opening 346 provided in the frame plate 342. The elastic contact 341 can be an example of an energizing member. For example, by embedding at least a portion of the elastic contact member 341 into the opening 346, the elastic contact member 341 is detachably held by the frame plate 342 by a force generated between the elastic contact member 341 and the side surface of the opening 346.

The portion connected to the opening 346 of the elastic contact 341 may be formed of a material having elasticity. At this time, the elastic contact piece 341 is pressed against the side surface of the opening 346 by the elasticity of the member, and the elastic contact piece 341 is detachably held by the frame plate 342. This portion may have elasticity to the extent that the elastic contact member 341 does not fall off immediately when the frame plate 342 is inverted. Even with such a degree of elasticity, when the elastic contact member 341 is fixed to the frame plate 342 by using an adhesive, an adhesive having a weak adhesive force corresponding to the frame member 342 by elastically holding the elastic contact member 341 can be used. . Thereby, the attachment and detachment of the elastic contact piece 341 becomes easy.

As another example in which the elastic contact member 341 and the frame plate 342 are detachably coupled, the elastic contact member 341 and the frame plate 342 are detachably coupled by an adhesive which adheres due to electromagnetic wave irradiation or heating or cooling. The power is falling. For example, the elastic contact piece 341 and the frame plate 342 can be detachably coupled by an ultraviolet peeling tape whose adhesive force is lowered by ultraviolet irradiation.

According to the above configuration, in the plurality of elastic contact members 341, even if a defect is found in a part of the elastic contact members 341, the defective elastic contact members 341 can be easily replaced. Moreover, the arrangement of the terminals of the elastic connector 340 can be easily changed by replacing the elastic contact 341.

The elastic contact piece 341 has a conductive terminal on the upper surface and the lower surface. A conductive member is disposed between the terminal on the upper surface and the terminal on the lower surface. The terminal of the upper surface is electrically connected to the terminal of the lower surface. The elastic member may be an insulating material such as a silicone rubber or an anisotropic conductive rubber. The elasticity of the elastic member may be greater than the elasticity of the wiring substrate 320 or the interposer 350. The elastic contact 341 may have a Pressure sensitive Conductive Rubber penetrating the elastic contact 341. At this time, one end portion of the anisotropic conductive rubber forms a terminal of the upper surface of the elastic contact piece 341, and the other end portion forms a terminal of the lower surface of the elastic contact piece 341.

When the wiring substrate 320 and the elastic connector 340 are laminated, the terminals provided on the upper surface of the elastic contact 341 are disposed in electrical connection with the contact pads 323. The layout of the terminals on the upper surface and the lower surface of the elastic contact member 341 can be the same. Thereby, the unevenness of the unevenness disposed between the wiring substrate 320 and the interposer 350 can be absorbed. As a result, the connection state between the wiring substrate 320 and the interposer 350 can be favorably maintained.

The material constituting the frame plate 342 may be a material having a relatively high rigidity such as a metal, an alloy, a ceramic, or a resin. Thereby, the shape of the frame plate 342 can be stably maintained. The shape of the frame plate 342 may be a lattice shape or a plate shape. The frame plate 342 may be an example of a frame of the connecting member.

The opening 344 is provided to allow a fluid such as air to flow between the wiring board 320, the elastic connector 340, and the interposer 350. Thereby, for example, when the probe card 300, the wafer 10, and the wafer tray 20 are integrated, the space between the probe card 300 and the wafer tray 20 can be decompressed in a short time. The opening 346 can retain at least a portion of the resilient contact 341. The opening 346 may be provided in a lattice shape, and may be provided in accordance with the layout of the wiring substrate 320 or the terminal provided on the interposer 350.

The interposer 350 converts the spacing of the terminals between the upper surface and the lower surface. The interposer 350 electrically connects the test head 200 to the wafer 10. The interposer 350 forms a portion of the conductive path between the test head 200 and the wafer 10. The inserter 350 can be an example of a connecting member.

The interposer 350 has a contact pad 351 and a contact pad 353 on the upper surface and the lower surface of the base substrate 352, respectively. The contact pads 351 correspond to any of the contact pads 353, respectively. The corresponding contact pads 351 and contact pads 353 are electrically connected to each other by wires 355.

When the interposer 350 is laminated in close contact with the elastic connector 340, the contact pad 351 is disposed in such a manner as to be electrically connected to the terminal of the lower surface of the elastic contact 341. The contact pad 353 may have a different layout than the contact pad 351. Thereby, even if the layout of the contact pads 353 coincides with the layout of the test pads of the wafer 10, the contact pads 351 can be arbitrarily laid out.

The test pads of the wafer 10 are formed on the integrated circuit, and the test pads have a small test area and the pads are spaced apart from each other. However, by using the interposer 350, the pitch P1 of the contact pads 351 can be made larger than the pitch P2 of the contact pads 353. Moreover, by using the interposer 350, the area of the contact pad 351 can be made larger than the area of the contact pad 353. Thereby, the contactor 202 and the probe card 300 can be easily and surely connected.

The elastic connector 360 is disposed between the inserter 350 and the sheet-like connector 370. The elastic connector 360 electrically connects the test head 200 to the wafer 10. The resilient connector 360 forms a portion of the conductive path between the test head 200 and the wafer 10. The elastic connector 360 may be an example of a connecting member.

The elastic connector 360 has a resilient contact 361 and a frame plate 362. The frame plate 362 has an opening 364 and an opening 366. The opening 364 and the opening 366 extend through the frame plate 362 from above toward the bottom. The elastic contact member 361 is detachably disposed on the opening 366 provided in the frame plate 362. The elastic connector 360 may have the same configuration as the elastic connector 340 except for the layout of the elastic contact 361 and the opening 366. Therefore, the description of the elastic connector 340 may be omitted for each configuration of the elastic connector 360.

The elastic contact member 361 has conductive terminals on the upper surface and the lower surface. The elastic contact 361 may have the same configuration as the elastic contact 341. The elastic contact 361 may be an example of an energizing member. When the interposer 350 is laminated in close contact with the elastic connector 360, the terminals provided on the upper surface of the elastic contact 361 are disposed in electrical connection with the contact pads 353. The layout of the terminals of the upper surface and the lower surface of the elastic contact piece 361 may be the same. Thereby, the unevenness of the unevenness disposed between the inserter 350 and the sheet-like connector 370 can be absorbed. As a result, the connection state of the inserter 350 and the sheet-like connector 370 can be favorably maintained.

The frame plate 362 may have the same configuration as the frame plate 342. The frame plate 362 may be an example of a frame of the connecting member. The opening 364 may have the same configuration as the opening 344. The opening 364 is provided to allow a fluid such as air to flow between the inserter 350, the elastic connector 360, and the sheet-like connector 370. Thereby, for example, when the probe card 300, the wafer 10, and the wafer tray 20 are integrated, the space between the probe card 300 and the wafer tray 20 can be decompressed in a short time. The opening 366 can have the same configuration as the opening 346.

The sheet-like connector 370 electrically connects the test head 200 and the wafer 10. The sheet-like connector 370 forms a portion of the conductive path between the test head 200 and the wafer 10. The sheet-like connector 370 can be an example of a connecting member. The sheet-like connector 370 is disposed on the lowermost side of the probe card 300, and when the probe card 300 is in contact with the wafer 10, the sheet-like connector 370 is in contact with the wafer 10.

The sheet-like connector 370 has a contact pad 371, an elastic sheet 372, a bump 373, a wiring 375, and a peripheral frame 376. The elastic sheet 372 has an opening 374. The contact pad 371 is disposed on the upper surface of the elastic sheet 372. The layout of the contact pads 371 may be the same as the terminal layout of the lower surface of the resilient contact 361. The elastic sheet 372 is formed of an elastic insulating material. The elastic sheet 372 may be a polyimide film.

The bump 373 is disposed on the lower surface of the elastic sheet 372. At the lowermost portion of the probe card 300, the bump 373 functions as a contact terminal that contacts the wafer 10. Each of the bumps 373 has a shape in which the center protrudes downward. Thereby, the bump 373 functions as a contact terminal for the wafer 10 at the lowermost portion of the probe card 300. The bumps 373 are electrically connected to any of the contact pads 371 via wires 375 embedded in the through holes formed in the elastic sheets 372, respectively. The peripheral frame 376 grips the peripheral edge portion of the elastic sheet 372 to maintain the elastic sheet 372 in a flat state. The perimeter frame 376 can be formed from a material having the same degree of thermal expansion as the wafer 10.

Fig. 4 is a view schematically showing an example of a plan view of the elastic connector 400. Fig. 5 is a view schematically showing an example of a cross-sectional view of the elastic connector 400. Fig. 5 is a cross section taken along the line A-A' of the elastic connector 400 of Fig. 4. In FIGS. 4 and 5, the elastic contact member having the eight elastic contact members 420 is used for convenience of explanation, and the elastic contact member and the elastic connector will be described in detail.

The elastic connector 400 electrically connects the test head 200 and the wafer 10. The resilient connector 400 forms a portion of the conductive path between the test head 200 and the wafer 10. The elastic connector 400 may be an example of a connecting member. The elastic connector 400 is provided with a frame plate 410 and an elastic contact 420.

The elastic connector 400 may have the same configuration as the elastic connector 340 or the elastic connector 360. The frame plate 410 may have the same configuration as the frame plate 342 or the frame plate 362. The elastic contact 420 may have the same configuration as the elastic contact 341 or the elastic contact 361. Therefore, the description of each configuration of the elastic connector 340 or the elastic connector 360 may be omitted for each configuration of the elastic connector 400.

The frame plate 410 detachably holds the elastic contact member 420. The frame plate 410 removably holds a plurality of resilient contacts 420. A plurality of elastic contacts 420 can be separately loaded and unloaded. The frame plate 410 has a plurality of openings 414 and a plurality of openings 416. The frame plate 410 may be an example of a frame of a contact member. The opening 414 can have the same configuration as the opening 344 or the opening 364. When the probe card 300, the wafer 10, and the wafer tray 20 are integrated by providing the opening 414, the space between the probe card 300 and the wafer tray 20 can be decompressed in a short time.

The opening 416 can have the same configuration as the opening 346 or the opening 366. In the opening 416, a portion of the resilient contact 420 is embedded. Concavities and convexities may be formed on the sides of the opening 416. The opening 416 can be formed in a zigzag shape, and a thread or a groove can be formed on the side of the opening 416. Thereby, when the elastic contact member 420 has elasticity, the contact area of the side surface of the opening 416 with the elastic contact member 420 can be increased.

The resilient contact member 420 is detachably disposed on the opening 416 of the frame plate 410. The elastic contact 420 may be an example of an energizing member. The elastic contact 420 has an electrode holder 422 and a through electrode 424.

The electrode holder 422 is maintained through the electrode 424. The electrode holder 422 can be an example of a holding portion. In the present embodiment, the electrode holder 422 holds a plurality of through electrodes 424. The electrode holder 422 can have insulation. Thereby, the through electrode 424 can be electrically insulated from the frame plate 410. Further, a plurality of through electrodes 424 can be electrically insulated from each other.

The electrode holder 422 has an upper holder 432 that is not embedded in the opening 416 to remain on the upper surface of the frame plate 410 when mounted to the frame plate 410, and a lower holder 434 that is mounted to the frame plate 410 when mounted to the frame plate 410, Embedded into the opening 416. The upper holder 432 may be an example of a locking portion. The lower holder 434 may be an example of a convex portion. In the present embodiment, the upper holder 432 and the lower holder 434 are integrally formed.

The electrode holder 422 is removably retained on the frame 410 by the force generated between the lower holder 434 and the side of the opening 416. As a force generated between the lower holder 434 and the side of the opening 416, the friction between the lower holder 434 and the side of the opening 416 can be exemplified. The cross-sectional area of the lower holder 434 when cut perpendicular to the surface of the opening 416 may be larger than the cross-sectional area when the opening 416 is cut perpendicular to the surface of the opening 416.

The electrode holder 422 can have elasticity. The elastic contact 420 can be held on the frame plate 410 by the elasticity of the electrode holder 422. The stronger the elasticity of the electrode holder 422, the stronger the force that the lower holder 434 energizes the opening 416, and the elastic contact 420 is more firmly fixed to the frame plate 410. However, the elastic contact member 420 is held by the frame plate 410 by the elasticity of the electrode holder 422, and thus can be attached and detached separately. The electrode holder 422 may have elasticity to the extent that the elastic contact piece 341 does not fall off immediately when the frame plate 342 is inverted.

The electrode holder 422 can be formed of a material having a resilience of 20% or more and 70% or less. Thereby, the lower holder 434 can moderately energize the opening 416. The measurement of the rebound resilience was carried out in accordance with JIS K6255-1996. That is, a cylindrical test piece having a thickness of 12 mm or more and 13 mm or less and a diameter of 28.5 mm or more and 29.5 mm or less is used under the conditions of a temperature of 21 ° C or more and 25 ° C or less, by a lubke rebound elastic test device. Determine the rebound resilience.

The electrode holder 422 may comprise natural rubber, isoprene rubber, butadiene rubber, polyoxyethylene rubber, urethane rubber, chloroprene rubber. A material that is excellent in resilience and electrical insulation. Since the polyoxymethylene rubber is also excellent in heat resistance, it is preferable to select a polyoxyxene rubber as a material constituting the electrode holder 422.

Here, the concept that the elastic contact member 420 is detachably held on the frame plate 410 by the elasticity of the electrode holder 422 is not limited to the force generated by the elasticity of the electrode holder 422, and the elastic contact member 420 can be The detachable holding on the frame plate 410 also includes the force generated by the elasticity of the electrode holder 422 and the force other than the elasticity of the electrode holder 422, and the elastic contact member 420 is detachably held by The situation on the frame board 410. Thereby, the elastic contact member 420 can be held even if the force generated by factors other than the elasticity of the electrode holder 422 is small as compared with the case where the force generated by the elasticity of the electrode holder 422 is not obtained. In the present embodiment, an ultraviolet irradiation peeling tape 426 is disposed between the upper holder 432 of the electrode holder 422 and the upper surface of the frame plate 410.

The ultraviolet irradiation peeling tape 426 has a weak adhesive force due to irradiation with ultraviolet rays. Thereby, the elastic contact 420 is detachably held by the frame plate 410 by the urging force (elastic pressure) generated by the elasticity of the electrode holder 422 and the adhesive force of the ultraviolet ray-dissipating tape 426. That is, when the elastic contact member 420 is detached from the frame plate 410, the elastic contact member 420 can be separately removed by irradiating the periphery of the elastic contact member 420 to be detached with ultraviolet rays.

The profile of the cross section when the electrode holder 422 is cut from the upper surface of the frame plate 410 toward the lower direction may be T-shaped, cross-shaped, H-shaped, Y-shaped or quadrangular. When the shape of the cross section is different due to the cutting method, the outline of at least one of the cross sections may be the same as described above. In particular, when it is T-shaped, cross-shaped, H-shaped, or Y-shaped, the upper holder 432 can suppress the movement of the electrode holder 422 in the penetration direction of the opening. The T type includes a "b" shape of a katakana or a shape such as a mushroom. Further, even if the cross-sectional width of the upper surface of the frame plate 410 (referred to as the length in the left-right direction in the drawing) is different from the cross-sectional width of the lower surface of the frame 410, it is included in the H-shape. The cross-sectional width of the lower surface of the frame plate 410 may be shorter than the cross-sectional width of the upper surface of the frame plate 410.

The test head 200 is electrically connected to the wafer 10 through the electrode 424. The resilient connector 400 forms a portion of the conductive path between the test head 200 and the wafer 10. The through electrode 424 can be an example of a conductive portion. The through electrode 424 penetrates the electrode holder 422 from the upper surface of the electrode holder 422 toward the lower side.

The through electrode 424 can have elasticity. Thereby, the through electrode 424 can be brought into contact with the terminals of the wiring substrate 320, the interposer 350, or the sheet-like device at a moderate pressure. The through electrode 424 may be formed of an anisotropic conductive rubber. At least one end of the through electrode 424 may be disposed to protrude from the surface of the electrode holder 422. Thereby, the through electrode 424 can be surely brought into contact with the terminals of the wiring substrate 320, the interposer 350, or the sheet-like connector.

For example, the elastic contact 420 can be manufactured in the following order. First, a polyoxyxene rubber is molded by a mold and an electrode holder 422 is fabricated. Then, a through hole penetrating the electrode holder 422 is formed on the electrode holder 422. Then, a through electrode 424 is formed on the via hole by an isotropic conductive rubber or metal. Alternatively, the elastic contact member 420 may be produced by casting a raw material of the polyoxyxene rubber in a mold in which a rod-shaped heterogeneous conductive rubber or a metal through electrode 424 is disposed. Alternatively, an electrode holder 422 containing a material such as an insulating polyoxymethylene rubber may be disposed around the through electrode 424 to manufacture the elastic contact member 420 by insulating a single or a plurality of through electrodes 424 from each other. Furthermore, the method of manufacturing the elastic contact member 420 is not limited to these.

With the above configuration, a part of the elastic contact members 420 can be exchanged in the plurality of elastic contact members 420 of the elastic connector 400. That is, the elastic connector 400 can be repaired by the stage in which the elastic contact member 420 disposed at the opening 416 is detached from the frame plate 410 and the other elastic contact member 420 is disposed on the opening 416. Thereby, when a defect is found in a part of the elastic contact member 420 due to manufacturing failure or consumption, or when the layout of the through electrode 424 is changed, the object can be achieved by replacing a part of the elastic contact piece 420.

As a result, the yield at the time of manufacture of the elastic connector 400 can be improved. Moreover, the cost or time spent on maintenance can be saved compared to when the elastic connector 400 is replaced. For example, even when different kinds of components are formed on one wafer, the probe card can be maintained inexpensively and in a short time by preparing a preliminary elastic contact for each component in advance. Further, when the conductive contact 420 is subjected to the conduction inspection to determine the quality of the elastic contact member 420, the jig for the inspection can be miniaturized or simplified.

By adopting the above configuration, a test apparatus 100 can be provided which can easily maintain the probe card 300. A test apparatus 100 can be provided that can suppress the maintenance cost of the probe card 300. A test apparatus 100 can be provided which can inexpensively test wafers forming different kinds of components.

In the present embodiment, the case where one elastic contact 420 is disposed in one opening 416 has been described. However, the elastic connector 400 is not limited thereto. A plurality of elastic contacts 420 may also be disposed for the plurality of openings 416. In the present embodiment, the case where the upper terminal layout of the elastic contact 420 is the same as the lower terminal layout has been described. However, the elastic contact 420 is not limited thereto. The upper terminal layout of the resilient contact 420 can be different from the underlying terminal layout.

In the present embodiment, as an example of the force generated by factors other than the elasticity of the electrode holder 422, the elastic contact 420 is detachably held by the frame plate 410 by the adhesion of the ultraviolet ray stripping tape 426. The situation is explained. However, the force generated by factors other than the elasticity of the electrode holder 422 is not limited to the adhesion of the ultraviolet irradiation peeling tape 426.

For example, the elastic contact member 420 can be detachably held on the frame plate 410 by fixing the electrode holder 422 to the frame plate 410 by using a solder. At this time, the elastic contact member 420 can be separately removed by heating the periphery of the elastic contact member 420 to be detached. For example, the elastic contact can be separately removed by illuminating the periphery of the elastic contact 420 with a wavelength that selectively heats the solder. Further, in order to facilitate the fixing of the solder, it is also possible to perform solder metal plating on the lower surface or the periphery of the upper holder 432.

According to this example, the time labor for processing the solder remaining on the frame plate 410 is increased as compared with when the elastic contact member 420 is held by elasticity or when the elastic contact member 420 is held by the ultraviolet irradiation peeling. However, since the solder is not used for electrically connecting the frame plate 410 and the elastic contact member 420, the solder can be freely designed to some extent as compared with the case where the solder is used to connect the elastic contact member 420 to the terminal such as the interposer 350. Configuration or size.

As another example, the elastic contact member 420 can be detachably held by the frame plate 410 by magnetic force, or can be detachably held by the frame plate 410 by a pressure difference. For example, the recess may be provided in a portion embedded in the opening 416 of the side or lower holder 434 of the opening 416, thereby making the shape of the elastic contact member 420 into the shape of both ends of the sealable opening 416, which is elastic by the pressure difference. The contact member 420 is detachably held on the frame plate 410. That is, the elastic contact member 420 can be detachably held on the frame plate 410 by making the pressure inside the opening 416 lower than the external pressure.

For example, in the inside of the decompression container, the above-described elastic contact piece 420 is fitted into the opening 416 to manufacture the elastic connector 400. The internal pressure of the decompression container is set to a pressure lower than the pressure of the use place of the elastic connector 400 in consideration of the temperature at the time of use of the elastic connector 400. Thereby, the pressure of the said recessed part is maintained as the pressure inside the pressure-reduction container. Thereafter, the elastic contact member 420 can be detachably held on the frame plate 410 by using the elastic connector 400 at a pressure higher than the pressure reducing container.

At this time, the elastic contact member 420 can be removed by opening the upper holder 432. Further, the elastic connector 400 detached from the probe card 300 can be placed inside the decompression container, and the pressure of the decompression container can be set to the pressure at the time of manufacture to remove the elastic contact member 420.

Further, the upper holder 432 has a hollow region disposed inside the upper holder 432, and an opening communicating with the lower surface of the upper holder 432 and the hollow region, wherein the pressure of the hollow region is lower than the external portion The elastic contact 420 is attracted to the frame plate 410 by pressure.

For example, the hollow region of the upper holder 432 is pressed, and an opening provided in the lower surface of the upper holder 432 is fitted into the opening 416 in such a manner as to be in contact with the upper surface of the frame plate. Then, if the hollow region is squeezed, the hollow region of the upper holder 432 is decompressed, and the elastic contact member 420 is attracted to the upper surface of the frame plate 410. Thereby, the elastic contact member 420 can be detachably held by the frame plate 410 by the pressure difference. At this time, for example, the elastic contact member 420 can be removed by opening a hole in the hollow portion of the upper holder 432.

In the present embodiment, the elastic contact member 420 is detachably held by the frame plate 410 by the force generated by the elasticity of the electrode holder 422 and the force other than the elasticity of the electrode holder 422. The explanation. However, the elastic connector 400 is not limited to this. For example, the elastic contact member 420 can be detachably held on the frame plate 410 by at least one of the force generated by the elasticity of the electrode holder 422 and the force generated by factors other than the elasticity of the electrode holder 422. .

Fig. 6 is a view schematically showing an example of a plan view of the elastic connector 600. Fig. 7 is a view schematically showing an example of a cross-sectional view of the elastic connector 600. Fig. 7 is a cross section taken along the line B-B' of the elastic connector 600 of Fig. 6. The elastic connector 600 represents another example of the elastic connector. The elastic connector 600 electrically connects the test head 200 to the wafer 10. The resilient connector 600 forms part of a conductive path between the test head 200 and the wafer 10. The elastic connector 600 may be an example of a connecting member. Hereinafter, another example in which the elastic connector 600 is detachably held by the elastic contact member on the frame by elasticity will be described.

The elastic connector 600 is provided with a frame plate 610 and an elastic contact 620. The elastic connector 600 may have the same configuration as the elastic connector 340, the elastic connector 360, or the elastic connector 400. The frame plate 610 may have the same configuration as the frame plate 342, the frame plate 362, or the frame plate 410. The elastic contact 620 may have the same configuration as the elastic contact 341, the elastic contact 361, or the elastic contact 420. Therefore, the description of each configuration of the elastic connector 340, the elastic connector 360, or the elastic connector 400 may be omitted for each configuration of the elastic connector 600.

The frame plate 610 removably retains the resilient contact 620. The frame plate 610 detachably holds a plurality of elastic contacts 620. A plurality of elastic contacts 620 can be separately loaded and unloaded. The frame plate 610 has a plurality of openings 616. The frame plate 610 may be an example of a frame of a contact member. The frame plate 610 may have the same configuration as the frame plate 410. Opening 616 can have the same configuration as opening 416.

The elastic contact 620 is detachably disposed on the opening 616 of the frame plate 610. The elastic contact 620 has an electrode holder 622 and a through electrode 624. Electrode holder 622 remains through electrode 624. The electrode holder 622 can be an example of a holding portion. The electrode holder 622 has an upper holder 632 that is not embedded in the opening 616 to remain on the frame plate 610 when mounted to the frame plate 610, and a lower holder 634 that is embedded when mounted to the frame plate 610 To the opening 616.

The elastic contact 620 may be an example of an energized member. The upper holder 632 can be an example of a locking portion. The lower holder 634 may be an example of a convex portion. The elastic contact 620, the electrode holder 622, the through electrode 624, the upper holder 632, and the lower holder 634 may have a resilient contact 420, an electrode holder 422, a through electrode 424, an upper holder 432, and a lower holder 434, respectively. The same composition.

The resilient connector 600 differs from the resilient connector 400 in that the upper holder 632 has an opening 626 that extends through the upper holder 632 from top to bottom. The elastic connector 600 is different from the elastic connector 400 in that the electrode holder 622 has an opening 628 that penetrates the electrode holder 622 from above to below. The resilient connector 600 differs from the resilient connector 400 in that the frame plate 610 has a pin 618 and the pin 618 is embedded in the opening 628.

The opening 626 is provided at a peripheral portion of the upper holder 632. The opening 626 can be combined with a pin 618 disposed on a surface of the frame plate 610. The opening 626 can be an example of a joint opening. Thereby, the electrode holder 622 is detachably held on the frame plate 610. When the electrode holder 622 has elasticity, the elastic contact member 620 is detachably held on the frame plate 610 by the force generated between the pin 618 and the side of the opening 626.

The cross-sectional area of the opening 626 in which the electrode holder 622 is not mounted to the frame plate 610 may be larger than the cross-sectional area of the pin 618. Here, the concept of the cross section of the opening 626 is a cross section when the opening 626 is cut perpendicular to the surface of the opening 626. Further, the concept of the cross section of the pin 618 is a cross section when the electrode holder 622 is attached to the frame plate 610 and the pin 618 is cut perpendicularly to the surface of the opening 626.

The opening 628 has the same function as the opening 344, the opening 364 or the opening 414. When the probe card 300, the wafer 10, and the wafer tray 20 are integrated by providing the opening 628, the space between the probe card 300 and the wafer tray 20 can be decompressed in a short time.

The pin 618 is disposed on the surface of the frame plate 610. Pin 618 can be a cylindrical member. The pin 618 can be an example of a protruding portion. The cross-sectional shape of the pin 618 can be circular or polygonal. The pin 618 can have irregularities on the surface. The pin 618 can be formed in a zigzag shape, and the surface of the pin 618 can form a thread or a thread. Thereby, when the electrode holder 622 has elasticity, the contact area of the pin 618 with the side surface of the opening 626 can be increased. The cross-sectional area of the upper portion of pin 618 may be greater than the cross-sectional area of the lower portion of pin 618. For example, the upper end of the pin 618 may be configured with a spherical or hemispherical member. Thereby, the electrode holder 622 can be prevented from suddenly coming off the frame plate 610.

In the above, the case where the elastic contact member is detachably disposed on the elastic connector has been described. However, the probe card 300 is not limited to this. For example, the inserter 350 or the sheet-like connector 370 may have the same configuration as the elastic connector 400 or the elastic connector 600. That is, the member having the contact pad 351 of the interposer 350, the contact pad 353, and the wiring 355 can be detachably held on the base substrate 352. Alternatively, members of the contact pad 371, the bump 373, and the wiring 375 having the sheet-like connector 370 can be detachably held on the elastic sheet 372.

In particular, an elastic member such as an anisotropic conductive rubber is plastically deformed due to repeated compressive stress or thermal stress, and a resistance value changes and is easily damaged. Therefore, when the above configuration is employed in the elastic connector 340, the elastic connector 360, the elastic connector 400, or the elastic connector 600, this effect can be exhibited more remarkably.

According to the above description, the following energization members are described in the specification of the present application. That is, the specification of the present application describes an energization member which is detachably disposed with an opening provided in a frame of a connecting member for electrically testing a test head and a member to be tested for testing the component to be tested. The electrically connected member is provided with a conductive portion that electrically connects the test head to the device to be tested, and a holding portion that holds the conductive portion.

The present invention has been described above using the embodiments, but the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various changes or modifications can be made to the above-described embodiments. It is to be understood that the various modifications and improvements may be included in the technical scope of the present invention.

It should be noted that the order of execution of the actions, processes, steps, and stages in the devices, systems, programs, and methods shown in the claims, the description, and the drawings is not specifically stated as "pre-existing". , "Before", etc., and as long as the output of the pre-processing is not used for post-processing, it can be implemented in any order. The operation flow in the patent application scope, the specification, and the drawings will be described using "first," "then," etc. for convenience, but it does not mean that it must be implemented in this order.

10. . . Wafer

20. . . Wafer tray

100. . . Test device

110. . . Transport unit

116. . . Robotic arm

130. . . Loading unit

132. . . Loading station

134. . . Loading door

150. . . Front open wafer cassette (FOUP)

160. . . Body unit

170. . . Alignment unit

172. . . Aligning the stage

200. . . Test head

201. . . framework

202. . . Contactor

210. . . Pin interface circuit

220. . . motherboard

222. . . Angle connector

224. . . Relay connector

226. . . Angle connector

228. . . Small substrate

230. . . Flat cable

240. . . Support substrate

250. . . Three-dimensional actuator

260. . . Contactor substrate

270. . . Subsubstrate

280. . . Contactor housing

300. . . Probe card

312. . . Upper frame

314. . . Lower box

316. . . Screw

320. . . Wiring substrate

323, 351, 353, 371. . . Contact pad

330. . . Guidance unit

340, 360, 400, 600. . . Elastic connector

341, 361, 420, 620. . . Elastic contact

342, 362, 410, 610. . . Frame board

344, 346, 354, 364, 366, 374, 414, 416, 616, 626, 628. . . Opening

350. . . Inserter

352. . . Base substrate

355, 375. . . Wiring

370. . . Sheet connector

372. . . Elastic sheet

373. . . Bump

376. . . Peripheral framework

422, 622. . . Electrode holder

424, 624. . . Through electrode

426. . . UV irradiation strip

432, 632. . . Upper support

434,634. . . Lower support

618. . . pin

A-A’, B-B’. . . section

FIG. 1 schematically shows an example of a cross-sectional view of the test apparatus 100.

FIG. 2 is a view schematically showing an example of a cross-sectional view of the test head 200.

FIG. 3 schematically shows an example of an exploded view of the probe card 300.

Fig. 4 is a view schematically showing an example of a plan view of the elastic connector 400.

Fig. 5 is a view schematically showing an example of a cross-sectional view of the elastic connector 400.

Fig. 6 is a view schematically showing an example of a plan view of the elastic connector 600.

Fig. 7 is a view schematically showing an example of a cross-sectional view of the elastic connector 600.

400. . . Elastic connector

410. . . Frame board

414, 416. . . Opening

420. . . Elastic contact

422. . . Electrode holder

424. . . Through electrode

A-A’. . . section

Claims (25)

An energizing member detachably disposed on an opening of a frame of the connecting member, the connecting member electrically connecting the test head for testing the tested component to the tested component, and the energizing member is provided a conductive portion that electrically connects the test head to the test element; and a holding portion that has elasticity and holds the conductive portion; and the holding portion has a convex portion that is to be embedded in the opening And a locking portion detachably coupled to the surface of the frame and not embedded in the opening, wherein the energizing member generates a force between the convex portion and a side surface of the opening, and the locking The combination of the portion and the surface of the frame is detachably held by the frame. The energizing member according to claim 1, wherein the locking portion includes a coupling opening that can be coupled to a protruding portion provided on a surface of the frame. An energizing member detachably disposed on an opening of a frame of the connecting member, the connecting member electrically connecting the test head for testing the tested component to the tested component, and the energizing member is provided a conductive portion electrically connecting the test head to the test element; and a holding portion having elasticity and holding the conductive portion; and the holding portion having a surface detachably coupled to the frame And the locking portion of the opening is not fitted, and the locking portion includes a coupling opening that can be coupled to the protruding portion provided on the surface of the frame. The energization member according to the first or third aspect of the invention is detachably held by the frame by a pressure difference between a region sealed by the frame and the holding portion and the outside of the sealing portion. The energization member according to the first or third aspect of the invention, wherein the inside of the locking portion is provided with a hollow region; and an opening that communicates with the hollow region and the outside of the locking portion. The energization member according to claim 5, wherein the hollow region is sealed by the frame by the opening and sealed by the frame and the holding portion. The energization member according to the first or third aspect of the invention is detachably held by the frame by the elasticity of the holding portion. The energization member according to claim 1 or 3, wherein the electrically conductive portion has elasticity. The energization member according to claim 1 or 3, wherein the conductive portion protrudes from a surface of the holding portion. The energization member according to the first or third aspect of the invention, wherein the at least one cross section of the holding portion has a T-shaped, a cross-shaped, an H-shaped, a Y-shaped or a quadrangular shape. The energization member according to the first or third aspect of the invention, wherein the conductive portion penetrates the holding portion, and the holding portion has an insulating property. A connecting member electrically connecting a test head for testing a test component to the test component, wherein the connecting member includes: a frame having an opening; and an energizing member detachably disposed in the opening And electrically connecting the test head to the test element; and the energizing member has: a conductive portion electrically connecting the test head and the test element; and a holding portion having elasticity and Holding the conductive portion; and the holding portion includes: a convex portion to be embedded in the opening; and a locking portion detachably coupled to the surface of the frame and not embedded in the opening The force generated between the convex portion and the side surface of the opening, and the combination of the locking portion and the surface of the frame, the detachable holding member is held by the frame. The connecting member according to claim 12, wherein a cross-sectional area of the convex portion when cut perpendicular to a surface perpendicular to the opening direction is larger than a direction perpendicular to the opening of the opening The cross-sectional area when the surface is cut. The connecting member according to claim 12, wherein the frame includes a protruding portion on a surface thereof, and the locking portion includes a coupling opening into which the protruding portion is to be fitted. A connecting member electrically connecting a test head for testing a test component to the test component, wherein the connecting member includes: a frame having an opening; and an energizing member detachably disposed in the opening And electrically connecting the test head to the test element; and the energizing member has: a conductive portion electrically connecting the test head and the test element; and a holding portion having elasticity and And maintaining the conductive portion; wherein the frame includes a protruding portion on the surface, the holding portion includes a locking portion that is detachably coupled to the surface of the frame and is not embedded in the opening, and the locking portion includes the protruding portion The combined opening that is embedded. The connecting member according to claim 14 or 15, wherein the cross-sectional area when the opening for the coupling is cut perpendicular to the surface of the joining opening is larger than the protruding portion The cross-sectional area when the surface is cut perpendicularly to the surface of the coupling opening. The connecting member according to Item 14 or 15, wherein the protruding portion has irregularities on the surface. The connecting member according to claim 12 or 15, wherein the connecting member is detachably held by the frame by a pressure difference between a region sealed by the frame and the holding portion and the outside of the sealing portion. The connecting member according to Item 12 or 15, wherein the locking portion is provided with a hollow region; and an opening that communicates with the hollow region and the outside of the locking portion. The connecting member according to claim 19, wherein the hollow region is sealed by the frame by the frame and the holding portion. The connecting member according to Item 12 or 15, wherein the energizing member is held by the frame by the elasticity of the holding portion. The connecting member according to claim 12, wherein the frame has irregularities on a side surface of the opening. The connecting member according to the item 12 or 15, wherein the holding portion is cut from a surface of the frame on the test head side toward a surface of the frame on the side of the test element side. The outline is T-shaped, cross-shaped, H-shaped, Y-shaped or quadrangular. A test apparatus comprising: a test head for testing a test component; a body portion for supplying a test pattern to the test head; and the connecting member according to claim 12 or 15, wherein The test head is electrically connected to the above-mentioned test element. A method of repairing a connecting member, wherein the connecting member according to claim 12 or 15 is repaired, and the method includes: a step of removing the energized member disposed in the opening from the frame And arranging the other energized members at the stage of the opening.