JPWO2011030379A1 - Current-carrying member, connecting member, test apparatus and method for repairing connecting member - Google Patents

Abstract

The test head for testing the device under test and the opening provided in the frame of the connection member that electrically connects the device under test have a conductive portion that electrically connects the test head and the device under test and has elasticity. And the electricity supply member which has a holding part holding a conductive part is arranged so that attachment or detachment is possible. The energizing member may be detachably held on the frame by the elasticity of the holding portion. The holding part has a convex part fitted into the opening, and the energizing member may be detachably held on the frame by a force generated between the convex part and the side surface of the opening.

Description

  The present invention relates to a current-carrying member, a connection member, a test apparatus, and a method for repairing the connection member.

  When testing the electrical characteristics of a device on a semiconductor wafer, a probe card that electrically connects the device and a test head that supplies a test pattern to the device is disposed. In recent years, a contact probe having a large number of bumps corresponding to test pads of a semiconductor chip, and an anisotropic conductive rubber having a copper thin film corresponding to the bumps and conducting in the vertical direction when vertical pressure is applied. A plurality of semiconductor chips on a semiconductor wafer are collectively tested using a probe card provided (see, for example, Patent Document 1).

Japanese Patent No. 4187718

  Contact probe bumps and anisotropic conductive rubber copper thin films wear out during repeated tests. However, when bumps or copper thin films are attached to contact probes or anisotropic conductive rubber, even if some bumps or copper thin films are consumed, the worn bumps or copper thin films can be easily removed. It cannot be exchanged. When the contact probe or the anisotropic conductive rubber is replaced, the running cost increases.

  In order to solve the above-mentioned problems, as a first aspect of the present invention, a test head for testing a device under test and an opening provided in a frame of a connecting member that electrically connects the device under test are detachably arranged. An energizing member is provided that includes a conductive portion that electrically connects a test head and a device under test, and a holding portion that has elasticity and holds the conductive portion.

  The energization member may be detachably held on the frame by the elasticity of the holding portion. In the above energizing member, the holding part may have a convex part fitted into the opening, and the energizing member may be detachably held on the frame by a force generated between the convex part and the side surface of the opening.

  In the energization member, the holding portion may have a locking portion that is not fitted into the opening, and the locking portion may be detachably coupled to the surface of the frame. In the above-described energizing member, the locking portion may have a coupling opening that can be coupled to the protruding portion provided on the surface of the frame.

  In the energization member, the conductive portion may have elasticity. In the energization member, the conductive part may protrude from the surface of the holding part. In the energization member, the outline of at least one cross section of the holding portion may be T-shaped, cross-shaped, H-shaped, Y-shaped, or quadrangular.

  As a second aspect of the present invention, there is provided a connection member for electrically connecting a test head for testing a device under test and the device under test, the frame having an opening, and being detachably disposed in the opening, A current-carrying member that electrically connects the device under test, the current-carrying member electrically connecting the test head and the device under test, and a holding unit that has elasticity and holds the current-carrying unit A connecting member is provided.

  As a third aspect of the present invention, there is provided a test apparatus including a test head for testing a device under test, a main body for supplying a test pattern to the test head, and the connection member.

  According to a fourth aspect of the present invention, there is provided a method for repairing the above-mentioned connecting member, the method comprising a step of removing the energizing member arranged in the opening from the frame and a step of arranging another energizing member in the opening. A method of repairing a member is provided.

  The above summary of the present invention does not enumerate all necessary features of the present invention. Also, a sub-combination of these feature groups can be an invention.

An example of sectional drawing of test device 100 is shown roughly. An example of a sectional view of test head 200 is shown roughly. An example of the exploded view of probe card 300 is shown roughly. An example of the top view of elastic connector 400 is shown roughly. An example of a sectional view of elastic connector 400 is shown roughly. An example of the top view of elastic connector 600 is shown roughly. An example of sectional drawing of elastic connector 600 is shown roughly.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the claimed invention. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  Hereinafter, embodiments will be described with reference to the drawings. In the description of the drawings, the same or similar parts may be denoted by the same reference numerals and redundant description may be omitted. Also, in different embodiments, corresponding members may have similar configurations, functions and applications to each other. The drawings are schematic, and the relationship between the thickness and the planar dimensions, the ratio, and the like may be different from the actual ones. In addition, for convenience of explanation, there may be a case where the drawings have different dimensional relationships or ratios.

  FIG. 1 schematically shows an example of a cross-sectional view of the test apparatus 100. The test apparatus 100 tests the electrical characteristics of a device such as a semiconductor chip formed on the wafer 10 and determines whether the device is good or bad. The test apparatus 100 may collectively test a plurality of semiconductor chips formed on the wafer 10. The device such as the wafer 10 and the semiconductor chip may be an example of a device under test.

  The test apparatus 100 includes a transport unit 110, a load unit 130, a FOUP 150, a main body unit 160, an alignment unit 170, a test head 200, and a probe card 300. In the present embodiment, the load unit 130, the transport unit 110, and the main body unit 160 are sequentially arranged adjacently from the front surface (left side in the drawing) toward the rear (right side in the drawing). Further, the alignment unit 170, the probe card 300 and the test head 200 are stacked on the main unit 160. The transport unit 110 and the load unit 130, and the transport unit 110 and the alignment unit 170 are in airtight communication with each other. Thereby, the cleanliness inside the test apparatus 100 can be maintained.

  The transfer unit 110 transfers the wafer 10 inside the test apparatus 100. The transport unit 110 has a built-in robot arm 116. The robot arm 116 transfers the wafer 10 between the load unit 130 and the alignment unit 170. The robot arm 116 takes out the wafers 10 one by one from the FOUP 150 through the load gate 134 and conveys them to the alignment unit 170. The robot arm 116 places the wafer 10 on the wafer tray 20 disposed inside the alignment unit 170. Further, the robot arm 116 takes out the wafer 10 for which the test has been completed from the alignment unit 170 through the load gate 134 and stores it in the FOUP 150.

  The load unit 130 includes a load table 132 and a load gate 134. On the load table 132, a FOUP 150 containing the wafer 10 to be tested is placed. The load gate 134 opens and closes when the wafer 10 is loaded into or unloaded from the test apparatus 100. Thereby, the wafer 10 can be loaded from the outside without reducing the cleanliness inside the test apparatus 100.

  The FOUP 150 stores a plurality of wafers 10 to be tested. The FOUP 150 stores the wafer 10 for which the test has been completed.

  The main unit 160 controls the operation of each unit of the test apparatus 100. For example, the main body unit 160 synchronizes the operations of the transfer unit 110, the load unit 130, and the alignment unit 170, and transfers the wafer 10 to each other. The main unit 160 controls the operation of the test head 200 according to the test program. The main unit 160 supplies a test pattern to the test head 200. The main unit 160 may be an example of a main unit.

  The alignment unit 170 adjusts the relative position between the wafer 10 and the probe card 300 to electrically connect the wafer 10 and the probe card 300. The alignment unit 170 has an alignment stage 172. The alignment stage 172 adjusts the relative position between the wafer 10 and the probe card 300 to align the probe card 300 and the wafer 10. In this embodiment, the alignment stage 172 mounts the wafer tray 20 and expands and contracts in the vertical direction (vertical direction in the figure).

  The wafer tray 20 has a placement surface on which the wafer 10 is placed. The wafer tray 20 may hold the wafer 10 on the mounting surface by vacuum suction or the like. The alignment stage 172 presses the wafer 10 against the probe card 300 by moving the wafer tray 20 holding the wafer 10 toward the probe card 300. Thereby, a terminal provided on the surface of the wafer 10 and a terminal provided on the surface of the probe card 300 and corresponding to the terminal come into contact with each other.

  In this embodiment, in this state, the probe card 300, the wafer 10 and the wafer tray 20 are integrated. As a result, the wafer 10 can be loaded into the test head 200. For example, the wafer tray 20 has a seal member that seals the space between the probe card 300 and the wafer tray 20, and the probe card 300 and the wafer tray 20 sandwich the wafer 10 between the probe card 300 and the wafer tray 20. The probe card 300, the wafer 10, and the wafer tray 20 can be integrated by making the pressure of the space lower than the external pressure. As another method of integration, a fixing jig that sandwiches the probe card 300 sandwiching the wafer 10 and the wafer tray 20 from the outside may be used.

  The test head 200 is electrically connected to the wafer 10 and tests the electrical characteristics of the wafer 10. The test head 200 may perform a burn-in inspection of the wafer 10. The test head 200 stores a plurality of pin electronics 210. The pin electronics 210 has an electric circuit required according to the test target and the content of the test. In the present embodiment, the test head 200 is electrically connected to the probe card 300 via the contactor 202 attached to the lower surface.

  The probe card 300 is used for testing a device under test. The probe card 300 may be a wiring board unit that is interposed between the test head 200 and the wafer 10 and electrically connects the test head 200 and the wafer 10 when the test apparatus 100 executes a test. . When a test is performed on the wafer 10, a conductive path or an electrical signal path is formed between the test head 200 and the wafer 10 by the probe card 300. By exchanging the probe card 300, the test apparatus 100 can correspond to the wafer 10 having a different layout.

  FIG. 2 schematically shows an example of a cross-sectional view of the test head 200. Elements that are the same as those in FIG. 1 may be denoted by the same reference numerals and redundant description may be omitted. The test head 200 includes a housing 201, a contactor 202, pin electronics 210, a motherboard 220, and a flat cable 230.

  Inside the housing 201, a mother board 220 having a plurality of relay connectors 224 is disposed horizontally. The relay connector 224 has a receptacle on each of the upper surface side and the lower surface side of the mother board 220 to form a signal path that penetrates the mother board 220.

  On the upper surface of the motherboard 220, the pin electronics 210 is attached to each of the relay connectors 224 via the angle connectors 222. With such a structure, the pin electronics 210 can be exchanged according to the specification of the test object and the test content.

  The plurality of pin electronics 210 may have the same specifications or different specifications. Further, the pin electronics 210 may not be attached to some relay connectors 224.

  On the lower surface of the motherboard 220, a small board 228 is connected to each relay connector 224 via an angle connector 226. One end of a flat cable 230 is connected to the small board 228. Thereby, the pin electronics 210 inside the housing 201 and the contactor 202 described later can be connected via the flat cable 230.

  A contactor 202 is attached to the lower surface of the housing 201. The contactor 202 includes a support substrate 240, a three-dimensional actuator 250, a contactor substrate 260, a sub substrate 270, and a contactor housing 280.

  The support substrate 240 has an upper surface fixed to the casing 201 and supports the upper end of the three-dimensional actuator 250 on the lower surface. The lower end of the three-dimensional actuator 250 supports the contactor substrate 260. Further, the sub-board 270 and the contactor housing 280 are fixed to the lower surface of the contactor board 260.

  The three-dimensional actuator 250 can move in the horizontal direction along the lower surface of the support substrate 240 and also expands and contracts in the vertical direction. Thereby, the contactor substrate 260 can be moved three-dimensionally. When the contactor substrate 260 moves, the sub substrate 270 and the contactor housing 280 also move together with the contactor substrate 260.

  Note that the lower end of the flat cable 230 is coupled to a terminal, for example, a spring pin, held by the contactor housing 280. Thereby, the pin electronics 210 is electrically connected to the lowermost surface of the test head 200. In addition, although a spring pin has been described here as an example, a structure including a connection that does not use a spring pin, such as capacitive coupling or optical connection, may be employed.

  FIG. 3 schematically shows an example of an exploded view of the probe card 300. The probe card 300 electrically connects the test head 200 and the wafer 10. The probe card 300 forms a part of a conductive path between the test head 200 and the wafer 10. The probe card 300 may be an example of a connection member. The probe card 300 includes a wiring board 320, an elastic connector 340, an interposer 350, an elastic connector 360, and a sheet-like connector 370.

  Each of the elastic connector 340, the interposer 350, the elastic connector 360, and the sheet-like connector 370 has an opening 344, an opening 354, an opening 364, and an opening 374 penetrating the front and back. These openings are arranged so that these openings communicate with each other when the elastic connector 340, the interposer 350, the elastic connector 360, and the sheet-like connector 370 are stacked. This helps exhaust between the members.

  Hereinafter, the probe card 300 will be described by taking as an example the case where the electrodes of the elastic connector 340 and the elastic connector 360 are detachably arranged. In the following description, the test head 200 side may be represented as an upward direction and the wafer 10 side may be represented as a downward direction in accordance with the display of the drawings. However, the above description does not limit the wiring board 320, the elastic connector 340, the interposer 350, the elastic connector 360, and the sheet-like connector 370 to the test head 200 side when used.

  The wiring board 320 electrically connects the test head 200 and the wafer 10. The wiring board 320 forms part of a conductive path between the test head 200 and the wafer 10. The wiring board 320 may be an example of a connection member. The wiring substrate 320 is formed of an insulating substrate having a relatively high mechanical strength, for example, a polyimide plate. The peripheral edge of the wiring board 320 is sandwiched between an upper frame 312 and a lower frame 314 each having a frame shape. The upper frame 312 and the lower frame 314 are stacked on each other and fastened by screws 316. Thereby, the mechanical strength of the wiring board 320 is further improved.

  A plurality of guide units 330 are arranged on the upper surface of the wiring board 320. The guide unit 330 functions as a connector guide that guides and positions the contactor 202 when the contactor 202 contacts the wiring board 320. On the lower surface of the wiring board 320, a plurality of contact pads 323 that can be electrically connected by contact are disposed. The contact pad 323 is electrically connected to a contact pad (not shown) disposed inside the guide unit 330 on the upper surface of the wiring board 320.

  The elastic connector 340 is disposed between the wiring board 320 and the interposer 350. The elastic connector 340 electrically connects the test head 200 and the wafer 10. The elastic connector 340 forms part of a conductive path between the test head 200 and the wafer 10. The elastic connector 340 may be an example of a connection member.

  The elastic connector 340 includes an elastic contact 341 and a frame plate 342. The frame plate 342 has an opening 344 and an opening 346. The opening 344 and the opening 346 penetrate the frame plate 342 from a surface on the test head 200 side (hereinafter sometimes referred to as an upper surface) toward a surface on the wafer 10 side (hereinafter also referred to as a lower surface). .

  The elastic contact 341 is detachably disposed in an opening 346 provided in the frame plate 342. The elastic contact 341 may be an example of an energization member. For example, when at least a part of the elastic contact 341 is fitted into the opening 346, the elastic contact 341 is detachably held on the frame plate 342 by a force generated between the elastic contact 341 and the side surface of the opening 346. The

  A portion in contact with the opening 346 of the elastic contact 341 may be formed of a material having elasticity. In this case, due to the elasticity of the member, the elastic contact 341 is pressed against the side surface of the opening 346 and the elastic contact 341 is detachably held on the frame plate 342. The portion may have such elasticity that the elastic contact 341 is not easily removed when the frame plate 342 is turned upside down. Even with this degree of elasticity, when the elastic contact 341 is fixed to the frame plate 342 with an adhesive, an adhesive having a weak adhesive force is used by the amount that the elastic contact 341 is held by the frame plate 342 by elasticity. Can be used. Thereby, the elastic contactor 341 can be easily attached and detached.

  As another example in which the elastic contactor 341 and the frame plate 342 are detachably coupled, the elastic contactor 341 and the frame plate 342 can be attached and detached with an adhesive whose adhesive strength is reduced by irradiation of electromagnetic waves or heating or cooling. May be combined. For example, the elastic contact 341 and the frame plate 342 may be detachably coupled to each other by an ultraviolet irradiation peeling tape whose adhesive strength is reduced by irradiation with ultraviolet rays.

  With the above configuration, even if a failure is found in some of the plurality of elastic contacts 341, the elastic contact 341 in which a failure is found can be easily replaced. . Moreover, the arrangement of the terminals of the elastic connector 340 can be easily changed by exchanging the elastic contact 341.

  The elastic contact 341 has conductive terminals on the upper surface and the lower surface. An elastic member is disposed between the terminal on the upper surface and the terminal on the lower surface. The terminals on the upper surface and the terminals on the lower surface are electrically connected. The elastic member may be an insulating material such as silicone rubber or an anisotropic conductive rubber. The elasticity of the elastic member may be greater than the elasticity of the wiring board 320 or the interposer 350. The elastic contact 341 may include an anisotropic conductive rubber penetrating the elastic contact 341. In this case, one end of the anisotropic conductive rubber forms a terminal on the upper surface of the elastic contact 341, and the other end forms a terminal on the lower surface of the elastic contact 341.

  The terminals provided on the upper surface of the elastic contact 341 are arranged so as to be electrically connected to the contact pads 323 when the wiring board 320 and the elastic connector 340 are closely stacked. The layout of terminals on the upper and lower surfaces of the elastic contact 341 may be the same. Thereby, the unevenness | corrugation dispersion | distribution distribute | arranged between the wiring board 320 and the interposer 350 can be absorbed. As a result, the connection state between the wiring board 320 and the interposer 350 can be kept good.

  The material constituting the frame plate 342 may be a material having relatively high rigidity such as a metal, an alloy, ceramics, or resin. Thereby, the shape of the frame board 342 can be maintained stably. The frame plate 342 may have a lattice shape or a plate shape. The frame plate 342 may be an example of a frame of a connection member.

  The opening 344 is provided for the purpose of circulating a fluid such as air among the wiring board 320, the elastic connector 340, and the interposer 350. Thereby, for example, when the probe card 300, the wafer 10, and the wafer tray 20 are integrated, the space between the probe card 300 and the wafer tray 20 can be decompressed in a short time. The opening 346 may hold at least a part of the elastic contact 341. The openings 346 may be provided in a lattice shape, or may be provided in accordance with the layout of terminals provided in the wiring board 320 or the interposer 350.

  The interposer 350 converts the terminal spacing between the upper surface and the lower surface. The interposer 350 electrically connects the test head 200 and the wafer 10. The interposer 350 forms part of a conductive path between the test head 200 and the wafer 10. The interposer 350 may be an example of a connection member.

  Interposer 350 has contact pads 351 and 353 on the upper and lower surfaces of base substrate 352, respectively. Each of the contact pads 351 corresponds to one of the contact pads 353. Corresponding contact pads 351 and contact pads 353 are electrically connected to each other by wiring 355.

  The contact pad 351 is disposed so as to be electrically connected to a terminal on the lower surface of the elastic contact 341 when the interposer 350 and the elastic connector 340 are closely stacked. The contact pad 353 may have a different layout from the contact pad 351. Thereby, even when the layout of the contact pads 353 is matched with the layout of the test pads of the wafer 10, the contact pads 351 can be arbitrarily laid out.

  The test pads of the wafer 10 are formed on an integrated circuit, and the test area of the test pads is small and the pitch between the pads is also small. However, by using the interposer 350, the pitch P1 of the contact pads 351 can be made larger than the pitch P2 of the contact pads 353. Further, by using the interposer 350, the area of the contact pad 351 can be made larger than the area of the contact pad 353. Thereby, the contactor 202 and the probe card 300 can be connected easily and reliably.

  The elastic connector 360 is disposed between the interposer 350 and the sheet-like connector 370. The elastic connector 360 electrically connects the test head 200 and the wafer 10. The elastic connector 360 forms part of a conductive path between the test head 200 and the wafer 10. The elastic connector 360 may be an example of a connection member.

  The elastic connector 360 includes an elastic contact 361 and a frame plate 362. The frame plate 362 has an opening 364 and an opening 366. The opening 364 and the opening 366 penetrate the frame plate 362 from the upper surface toward the lower surface. The elastic contact 361 is detachably disposed in an opening 366 provided in the frame plate 362. The elastic connector 360 may have the same configuration as the elastic connector 340 except for the layout of the elastic contacts 361 and the openings 366. Therefore, the description overlapping each configuration of the elastic connector 340 may be omitted for each configuration of the elastic connector 360.

  The elastic contact 361 has conductive terminals on the upper surface and the lower surface. The elastic contact 361 may have the same configuration as the elastic contact 341. The elastic contact 361 may be an example of an energizing member. The terminals provided on the upper surface of the elastic contact 361 are arranged so as to be electrically connected to the contact pad 353 when the interposer 350 and the elastic connector 360 are closely stacked. The layout of terminals on the upper and lower surfaces of the elastic contact 361 may be the same. Thereby, the unevenness | corrugation dispersion | distribution distribute | arranged between the interposer 350 and the sheet-like connector 370 can be absorbed. As a result, the connection state between the interposer 350 and the sheet-like connector 370 can be kept good.

  The frame plate 362 may have the same configuration as the frame plate 342. The frame plate 362 may be an example of a frame of a connection member. The opening 364 may have a configuration similar to that of the opening 344. The opening 364 is provided for the purpose of circulating a fluid such as air among the interposer 350, the elastic connector 360, and the sheet-like connector 370. Thereby, for example, when the probe card 300, the wafer 10, and the wafer tray 20 are integrated, the space between the probe card 300 and the wafer tray 20 can be decompressed in a short time. The opening 366 may have a configuration similar to that of the opening 346.

  The sheet-like connector 370 electrically connects the test head 200 and the wafer 10. The sheet-like connector 370 forms a part of a conductive path between the test head 200 and the wafer 10. The sheet-like connector 370 may be an example of a connection member. The sheet-like connector 370 is disposed on the lowermost side of the probe card 300, and when the probe card 300 and the wafer 10 are in contact, the sheet-like connector 370 and the wafer 10 are in contact with each other.

  The sheet-like connector 370 includes contact pads 371, elastic sheets 372, bumps 373, wiring 375, and a peripheral frame 376. The elastic sheet 372 has an opening 374. The contact pad 371 is disposed on the upper surface of the elastic sheet 372. The layout of the contact pad 371 may be the same as the terminal layout on the lower surface of the elastic contact 361. The elastic sheet 372 is formed of an insulating material having elasticity. The elastic sheet 372 may be a polyimide film.

  The bump 373 is disposed on the lower surface of the elastic sheet 372. The bump 373 functions as a contact terminal with the wafer 10 on the lowermost surface of the probe card 300. Each of the bumps 373 has a shape with the center protruding downward. Thereby, the bump 373 functions as a contact terminal for the wafer 10 on the lowermost surface of the probe card 300. Each of the bumps 373 is electrically connected to one of the contact pads 371 through a wiring 375 embedded in a through hole formed in the elastic sheet 372. The peripheral frame 376 grips the peripheral edge portion of the elastic sheet 372 and maintains the elastic sheet 372 in a flat state. The peripheral frame 376 may be formed of a material having a thermal expansion coefficient similar to that of the wafer 10.

  FIG. 4 schematically shows an example of a plan view of the elastic connector 400. FIG. 5 schematically shows an example of a cross-sectional view of the elastic connector 400. FIG. 5 shows an AA ′ cross section of the elastic connector 400 of FIG. 4 and 5, details of the elastic contact and the elastic connector will be described using an elastic connector 400 having eight elastic contacts 420 for the purpose of simplifying the description.

  The elastic connector 400 electrically connects the test head 200 and the wafer 10. The elastic connector 400 forms part of a conductive path between the test head 200 and the wafer 10. The elastic connector 400 may be an example of a connection member. The elastic connector 400 includes a frame plate 410 and an elastic contactor 420.

  The elastic connector 400 may have the same configuration as the elastic connector 340 or the elastic connector 360. The frame plate 410 may have the same configuration as the frame plate 342 or the frame plate 362. The elastic contactor 420 may have the same configuration as the elastic contactor 341 or the elastic contactor 361. Therefore, in some cases, the description of each configuration of the elastic connector 400 that overlaps with each configuration of the elastic connector 340 or the elastic connector 360 may be omitted.

  The frame plate 410 holds the elastic contactor 420 in a detachable manner. The frame plate 410 may hold the plurality of elastic contacts 420 in a detachable manner. The plurality of elastic contacts 420 can be individually attached and detached. The frame plate 410 has a plurality of openings 414 and a plurality of openings 416. The frame plate 410 may be an example of a frame of a contact member. The opening 414 may have a configuration similar to that of the opening 344 or the opening 364. By providing the opening 414, the space between the probe card 300 and the wafer tray 20 can be reduced in a short time when the probe card 300, the wafer 10 and the wafer tray 20 are integrated.

  The opening 416 may have a configuration similar to that of the opening 346 or the opening 366. A part of the elastic contactor 420 is fitted into the opening 416. Unevenness may be formed on the side surface of the opening 416. The opening 416 may be formed in a zigzag shape, and a screw thread or a groove may be formed on the side surface of the opening 416. Thereby, when the elastic contactor 420 has elasticity, the contact area between the side surface of the opening 416 and the elastic contactor 420 can be increased.

  The elastic contactor 420 is detachably disposed in the opening 416 of the frame plate 410. The elastic contactor 420 may be an example of an energizing member. The elastic contactor 420 includes an electrode holder 422 and a through electrode 424.

  The electrode holder 422 holds the through electrode 424. The electrode holder 422 may be an example of a holding unit. In the present embodiment, the electrode holder 422 holds a plurality of through electrodes 424. The electrode holder 422 may have insulating properties. Thereby, the through electrode 424 and the frame plate 410 can be electrically insulated. Further, the plurality of through electrodes 424 can be electrically insulated from each other.

  The electrode holder 422 is not fitted into the opening 416 when attached to the frame plate 410 and remains on the upper surface of the frame plate 410, and the lower holder 434 fitted into the opening 416 when attached to the frame plate 410. Have The upper holder 432 may be an example of a locking part. The lower holder 434 may be an example of a convex portion. In the present embodiment, the upper holder 432 and the lower holder 434 are integrally formed.

  The electrode holder 422 may be detachably held on the frame plate 410 by a force generated between the lower holder 434 and the side surface of the opening 416. As a force generated between the lower holder 434 and the side surface of the opening 416, a frictional force between the lower holder 434 and the side surface of the opening 416 can be exemplified. The cross-sectional area when the lower holder 434 is cut along a plane perpendicular to the direction of penetration of the opening 416 may be larger than the cross-sectional area when the opening 416 is cut along a plane perpendicular to the direction of penetration of the opening 416.

  The electrode holder 422 may have elasticity. The elastic contactor 420 may be held on the frame plate 410 by the elasticity of the electrode holder 422. The stronger the elasticity of the electrode holder 422, the stronger the force with which the lower holder 434 biases the opening 416, and the elastic contactor 420 is more strongly fixed to the frame plate 410. However, since the elastic contactor 420 is held by the frame plate 410 due to the elasticity of the electrode holder 422, it can be attached and detached individually. The electrode holder 422 may have such elasticity that the elastic contact 341 cannot be removed immediately when the frame plate 342 is turned upside down.

The electrode holder 422 may be formed of a material having a resilience of 20% to 70%. Accordingly, the lower holder 434 can appropriately bias the opening 416. Measurement of impact resilience is carried out in conformity with ^{JIS K6255 -1 996.} That is, in a condition where the temperature is 21 ° C. or more and 25 ° C. or less, the rebound resilience is measured by a Rupke-type rebound resilience test apparatus using a cylindrical test piece having a thickness of 12 mm to 13 mm and a diameter of 28.5 mm to 29.5 mm. taking measurement.

  The electrode holder 422 may include a material excellent in rebound resilience and electrical insulation, such as natural rubber, isoprene rubber, butadiene rubber, silicone rubber, urethane rubber, and chloroprene rubber. Since silicone rubber is excellent in heat resistance, it is preferable to select silicone rubber as a material constituting the electrode holder 422.

  Here, the elastic contactor 420 is detachably held on the frame plate 410 due to the elasticity of the electrode holder 422. The elastic contactor 420 can be attached to and detached from the frame plate 410 due to the force generated by the elasticity of the electrode holder 422. This includes not only the case where the elastic contactor 420 is held, but also the case where the elastic contactor 420 is detachably held by the frame plate 410 due to the force generated by the elasticity of the electrode holder 422 and the force generated by factors other than the elasticity of the electrode holder 422. Accordingly, the elastic contactor 420 can be held even when the force generated by a factor other than the elasticity of the electrode holder 422 is small as compared with the case where there is no force generated by the elasticity of the electrode holder 422. In the present embodiment, an ultraviolet irradiation peeling tape 426 is disposed between the upper holder 432 of the electrode holder 422 and the upper surface of the frame plate 410.

  The adhesive strength of the ultraviolet irradiation peeling tape 426 is reduced by irradiation with ultraviolet rays. Thereby, the elastic contactor 420 is detachably held on the frame plate 410 by the biasing force generated by the elasticity of the electrode holder 422 and the adhesive force of the ultraviolet irradiation peeling tape 426. That is, when removing the elastic contactor 420 from the frame plate 410, the elastic contactor 420 can be individually removed by irradiating the periphery of the elastic contactor 420 to be removed with ultraviolet rays.

  The outline of the cross section when the electrode holder 422 is cut in the direction from the upper surface to the lower surface of the frame plate 410 may be T-shaped, cross-shaped, H-shaped, Y-shaped, or quadrangular. When the shape of the cross section differs depending on the cutting method, the outline of at least one cross section may be as described above. In particular, in the case of T-type, cross-type, H-type, and Y-type, the upper holder 432 can suppress the electrode holder 422 from moving in the direction in which the opening penetrates. The T type includes a shape like a katakana toe or a shape like a mushroom. Further, even if the width of the cross section on the upper surface of the frame plate 410 (referring to the length in the left-right direction in the figure) and the width of the cross section on the lower surface of the frame plate 410 are different, it is included in the H shape. The width of the cross section on the lower surface of the frame plate 410 may be shorter than the width of the cross section on the upper surface of the frame plate 410.

  The through electrode 424 electrically connects the test head 200 and the wafer 10. The elastic connector 400 forms part of a conductive path between the test head 200 and the wafer 10. The through electrode 424 may be an example of a conductive part. The through electrode 424 penetrates the electrode holder 422 from the upper surface to the lower surface of the electrode holder 422.

  The through electrode 424 may have elasticity. As a result, the through electrode 424 can come into contact with the wiring board 320, the interposer 350, or the terminal of the sheet-like connector with an appropriate pressure. The through electrode 424 may be formed of anisotropic conductive rubber. At least one end portion of the through electrode 424 may be arranged to protrude from the surface of the electrode holder 422. Thereby, the penetration electrode 424 can contact with the terminal of the wiring board 320, the interposer 350, or a sheet-like connector reliably.

  The elastic contactor 420 can be manufactured, for example, by the following procedure. First, an electrode holder 422 is manufactured by molding silicone rubber with a mold. Next, a through hole penetrating the electrode holder 422 is formed in the electrode holder 422. Thereafter, a through electrode 424 is formed in the through hole with anisotropic conductive rubber or metal. Alternatively, the elastic contactor 420 may be manufactured by pouring a raw material of silicone rubber into a mold in which a bar-shaped anisotropic conductive rubber or metal penetrating electrode 424 is arranged. Alternatively, an electrode holder 422 made of a material such as insulating silicon rubber may be disposed around the through electrode 424, and the elastic contactor 420 may be manufactured so as to insulate one or a plurality of through electrodes 424. In addition, the manufacturing method of the elastic contactor 420 is not limited to these.

  By adopting the above configuration, some of the elastic contacts 420 of the plurality of elastic contacts 420 of the elastic connector 400 can be exchanged. That is, the elastic connector 400 can be repaired by removing the elastic contactor 420 disposed in the opening 416 from the frame plate 410 and disposing another elastic contactor 420 in the opening 416. Accordingly, when a defect is found in some of the elastic contacts 420 due to manufacturing defects or wear, or when the layout of the through electrodes 424 is changed, the purpose can be achieved by replacing some of the elastic contacts 420.

  As a result, the yield at the time of manufacturing the elastic connector 400 can be improved. Moreover, compared with the case where it replaces with the elastic connector 400, the cost or time concerning a maintenance can be saved. For example, even when different types of devices are formed on a single wafer, a spare elastic contactor is prepared for each device, so that the probe card can be maintained at low cost and in a short period of time. it can. In addition, when the continuity test of the elastic contactor 420 is performed and the quality of the elastic contactor 420 is determined, the jig used for the inspection can be reduced in size or simplified.

  By adopting the above configuration, it is possible to provide the test apparatus 100 that can easily maintain the probe card 300. It is possible to provide the test apparatus 100 that can suppress the maintenance cost of the probe card 300. It is possible to provide a test apparatus 100 that can inexpensively test a wafer on which different types of devices are formed.

  In this embodiment, although the case where one elastic contactor 420 was arranged with respect to one opening 416 was demonstrated, the elastic connector 400 is not limited to this. One elastic contact 420 may be arranged for the plurality of openings 416. In the present embodiment, the case where the terminal layout on the upper surface and the terminal layout on the lower surface of the elastic contactor 420 are the same has been described, but the elastic contactor 420 is not limited to this. The terminal layout on the upper surface and the terminal layout on the lower surface of the elastic contactor 420 may be different.

  In the present embodiment, as an example of the force generated by factors other than the elasticity of the electrode holder 422, the case where the elastic contactor 420 is detachably held on the frame plate 410 by the adhesive force of the ultraviolet irradiation peeling tape 426 has been described. However, the force generated by factors other than the elasticity of the electrode holder 422 is not limited to the adhesive force of the ultraviolet irradiation peeling tape 426.

  For example, since the electrode holder 422 is fixed to the frame plate 410 with solder, the elastic contactor 420 can be detachably held on the frame plate 410. In this case, the elastic contactors 420 can be individually removed by heating the periphery of the elastic contactors 420 to be removed. For example, the elastic contactors 420 can be individually removed by irradiating the periphery of the elastic contactors 420 with an electromagnetic wave having a wavelength capable of selectively heating the solder. For the purpose of facilitating fixing with solder, solderable metal plating may be applied to the lower surface or the periphery of the upper holder 432.

  According to this example, as compared with the case where the elastic contactor 420 is held by elasticity or the case where the elastic contactor 420 is held by an ultraviolet irradiation peeling tape, labor for processing the solder remaining on the frame plate 410 is increased. However, since solder is not used for the purpose of electrically connecting the frame plate 410 and the elastic contactor 420, it is compared with the case where the elastic contactor 420 is connected to a terminal such as the interposer 350 using solder. Thus, the arrangement or size of the solder can be freely designed to some extent.

  As another example, the elastic contactor 420 may be detachably held on the frame plate 410 by a magnetic force, or may be detachably held on the frame plate 410 by a pressure difference. For example, a concave portion is provided in a side surface of the opening 416 or a portion fitted into the opening 416 of the lower holder 434, and the elastic contactor 420 is shaped so that both ends of the opening 416 can be sealed. Can be detachably held on the frame plate 410. That is, the elastic contactor 420 can be detachably held on the frame plate 410 by making the pressure inside the opening 416 lower than the external pressure.

  For example, the elastic contactor 420 is fitted into the opening 416 inside the decompression container to manufacture the elastic connector 400. The pressure inside the decompression container is set to be lower than the pressure at the place where the elastic connector 400 is used in consideration of the temperature when the elastic connector 400 is used. Thereby, the pressure of the said recessed part is maintained by the pressure inside a pressure reduction container. Thereafter, the elastic contactor 420 can be detachably held on the frame plate 410 by using the elastic connector 400 under a pressure higher than that of the decompression vessel.

  In this case, the elastic contactor 420 can be removed by making a hole in the upper holder 432. Alternatively, the elastic contactor 420 may be removed by installing the elastic connector 400 removed from the probe card 300 inside the decompression container and setting the pressure of the decompression container to the pressure at the time of manufacture.

  Further, the upper holder 432 has a hollow region provided inside the upper holder 432, and an opening that communicates the lower surface of the upper holder 432 with the hollow region, and the pressure of the hollow region is set to an external pressure. The elastic contactor 420 may be attracted to the frame plate 410 by lowering it.

  For example, the elastic contactor 420 is fitted into the opening 416 so that the opening provided in the lower surface of the upper holder 432 contacts the upper surface of the frame plate 410 while crushing the hollow region of the upper holder 432. If the crushing of the hollow region is stopped, the hollow region of the upper holder 432 is decompressed, and the elastic contactor 420 is attracted to the upper surface of the frame plate 410. Thereby, the elastic contactor 420 can be detachably held on the frame plate 410 due to the pressure difference. In this case, for example, the elastic contactor 420 can be removed by making a hole in the hollow region of the upper holder 432.

  In the present embodiment, the case where the elastic contactor 420 is detachably held on the frame plate 410 by the force generated by the elasticity of the electrode holder 422 and the force generated by factors other than the elasticity of the electrode holder 422 has been described. However, the elastic connector 400 is not limited to this. For example, the elastic contactor 420 may be detachably held on the frame plate 410 by at least one of a force generated by the elasticity of the electrode holder 422 and a force generated by a factor other than the elasticity of the electrode holder 422.

  FIG. 6 schematically shows an example of a plan view of the elastic connector 600. FIG. 7 schematically shows an example of a cross-sectional view of the elastic connector 600. FIG. 7 shows a BB ′ cross section of the elastic connector 600 of FIG. The elastic connector 600 shows another example of an elastic connector. The elastic connector 600 electrically connects the test head 200 and the wafer 10. The elastic connector 600 forms a part of a conductive path between the test head 200 and the wafer 10. The elastic connector 600 may be an example of a connection member. Hereinafter, another example in which the elastic contactor is detachably held on the frame using the elastic connector 600 will be described.

  The elastic connector 600 includes a frame plate 610 and an elastic contact 620. The elastic connector 600 may have the same configuration as the elastic connector 340, the elastic connector 360, or the elastic connector 400. The frame plate 610 may have the same configuration as the frame plate 342, the frame plate 362, or the frame plate 410. The elastic contact 620 may have the same configuration as the elastic contact 341, the elastic contact 361, or the elastic contact 420. Therefore, in some cases, the description of each configuration of the elastic connector 600 that overlaps with each configuration of the elastic connector 340, the elastic connector 360, or the elastic connector 400 may be omitted.

  The frame plate 610 holds the elastic contactor 620 so as to be detachable. The frame plate 610 may hold the plurality of elastic contacts 620 in a detachable manner. The plurality of elastic contacts 620 can be individually attached and detached. The frame plate 610 has a plurality of openings 616. The frame plate 610 may be an example of a frame of a contact member. The frame plate 610 may have the same configuration as the frame plate 410. The opening 616 may have a configuration similar to that of the opening 416.

  The elastic contact 620 is detachably disposed in the opening 616 of the frame plate 610. The elastic contact 620 includes an electrode holder 622 and a through electrode 624. The electrode holder 622 holds the through electrode 624. The electrode holder 622 may be an example of a holding unit. The electrode holder 622 is not fitted into the opening 616 when attached to the frame plate 610 but remains on the upper surface of the frame plate 610, and the lower holder 634 fitted into the opening 616 when attached to the frame plate 610. Have

  The elastic contact 620 may be an example of an energization member. The upper holder 632 may be an example of a locking part. The lower holder 634 may be an example of a convex portion. The elastic contactor 620, electrode holder 622, through electrode 624, upper holder 632, and lower holder 634 have the same configuration as the elastic contactor 420, electrode holder 422, through electrode 424, upper holder 432, and lower holder 434, respectively. You can do it.

  The elastic connector 600 is different from the elastic connector 400 in that the upper holder 632 has an opening 626 that penetrates the upper holder 632 from the upper surface to the lower surface. The elastic connector 600 is different from the elastic connector 400 in that the electrode holder 622 has an opening 628 that passes through the electrode holder 622 from the upper surface to the lower surface. The elastic connector 600 is different from the elastic connector 400 in that the frame plate 610 has pins 618 and the pins 618 are fitted into the openings 628.

  The opening 626 is provided at the peripheral edge of the upper holder 632. The opening 626 can be coupled to a pin 618 provided on the surface of the frame plate 610. The opening 626 may be an example of a coupling opening. Thereby, the electrode holder 622 is detachably held on the frame plate 610. When the electrode holder 622 has elasticity, the elastic contact 620 is detachably held on the frame plate 610 by a force generated between the pin 618 and the side surface of the opening 626.

  The cross-sectional area of the opening 626 when the electrode holder 622 is not attached to the frame plate 610 may be larger than the cross-sectional area of the pin 618. Here, the cross section of the opening 626 refers to a cross section obtained by cutting the opening 626 on a plane perpendicular to the penetrating direction of the opening 626. The cross section of the pin 618 is a cross section when the pin 618 is cut on a plane perpendicular to the direction of penetration of the opening 626 when the electrode holder 622 is mounted on the frame plate 610.

  The opening 628 has a function similar to that of the opening 344, the opening 364, or the opening 414. By providing the opening 628, when the probe card 300, the wafer 10 and the wafer tray 20 are integrated, the space between the probe card 300 and the wafer tray 20 can be decompressed in a short time.

  The pins 618 are provided on the surface of the frame plate 610. The pin 618 may be a columnar member. The pin 618 may be an example of a protrusion. The cross-sectional shape of the pin 618 may be circular or polygonal. The pin 618 may have irregularities on the surface. The pin 618 may be formed in a zigzag shape, and a screw thread or a groove may be formed on the surface of the pin 618. Thereby, when the electrode holder 622 has elasticity, the contact area between the pin 618 and the side surface of the opening 626 can be increased. The cross-sectional area of the upper part of the pin 618 may be larger than the cross-sectional area of the lower part of the pin 618. For example, a spherical or hemispherical member may be disposed on the upper end of the pin 618. Thereby, it can prevent that the electrode holder 622 remove | deviates from the frame board 610 unexpectedly.

  The case where the elastic contactor is detachably arranged in the elastic connector has been described above. However, the probe card 300 is not limited to this. For example, the interposer 350 or the sheet-like connector 370 may have the same structure as the elastic connector 400 or the elastic connector 600. That is, the member having the contact pad 351, the contact pad 353, and the wiring 355 of the interposer 350 may be detachably held on the base substrate 352. Alternatively, a member having the contact pad 371, the bump 373, and the wiring 375 of the sheet-like connector 370 may be detachably held on the elastic sheet 372.

  In particular, an elastic member such as anisotropic conductive rubber is likely to change its resistance value or be damaged by plastic deformation due to repeated compressive stress or thermal stress. Therefore, when the above configuration is adopted for the elastic connector 340, the elastic connector 360, the elastic connector 400, or the elastic connector 600, the effect can be exhibited more remarkably.

  From the above description, it is clear that the following energizing members are described in the present specification. That is, in the present specification, an energization member that is detachably disposed in an opening provided in a frame of a connection member that electrically connects a test head for testing the device under test and the device under test, An energizing member is described that includes a conductive portion that electrically connects a test head and a device under test and a holding portion that holds the conductive portion.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The execution order of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before”, “prior”, etc. It should be noted that it can be implemented in any order unless explicitly stated and the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for the sake of convenience, it means that it is essential to carry out in this order. is not.

  10 wafers, 20 wafer trays, 100 test equipment, 110 transfer unit, 116 robot arm, 130 load unit, 132 load table, 134 load gate, 150 FOUP (Front Opening Unified Pod), 160 main unit, 170 alignment unit, 172 alignment stage , 200 test head, 201 housing, 202 contactor, 210 pin electronics, 220 motherboard, 222 angle connector, 224 relay connector, 226 angle connector, 228 small board, 230 flat cable, 240 support board, 250 three-dimensional actuator, 260 contactor Substrate, 270 Sub-substrate, 280 Contact Housing, 300 probe card, 312 upper frame, 314 lower frame, 316 screw, 320 wiring board, 323 contact pad, 330 guide unit, 340 elastic connector, 341 elastic contact, 342 frame plate, 344 opening, 346 opening, 350 Interposer, 351 contact pad, 352 base substrate, 353 contact pad, 354 opening, 355 wiring, 360 elastic connector, 361 elastic contact, 362 frame plate, 364 opening, 366 opening, 370 sheet-like connector, 371 contact pad, 372 elastic Sheet, 373 bump, 374 opening, 375 wiring, 376 peripheral frame, 400 elastic connector, 410 frame plate, 414 opening, 416 opening, 420 elastic contact, 422 electrode holder, 424 penetrating electrode, 426 UV irradiation peeling tape, 432 upper holder, 434 lower holder, 600 elastic connector, 610 frame plate, 616 opening, 618 pin, 620 elastic contact Child, 622 electrode holder, 624 through electrode, 626 opening, 628 opening, 632 upper holder, 634 lower holder

Claims (20)

A current-carrying member that is detachably disposed in an opening provided in a frame of a connection member that electrically connects a test head for testing the device under test and the device under test,
A conductive portion that electrically connects the test head and the device under test;
A holding part that has elasticity and holds the conductive part;
Comprising
Current-carrying member. Due to the elasticity of the holding part, the frame is detachably held.
The energizing member according to claim 1. The holding part has a convex part fitted into the opening,
The force generated between the convex portion and the side surface of the opening is detachably held on the frame.
The energizing member according to claim 1 or 2. The holding portion has a locking portion that is not fitted into the opening,
The locking portion is detachably coupled to the surface of the frame.
The energizing member according to any one of claims 1 to 3. The locking portion has a coupling opening that can be coupled to a protrusion provided on the surface of the frame.
The energizing member according to claim 4. The conductive portion has elasticity.
The energization member according to any one of claims 1 to 5. The conductive part protrudes from the surface of the holding part,
The energization member according to any one of claims 1 to 6. The outline of at least one cross section of the holding portion is T-shaped, cross-shaped, H-shaped, Y-shaped, or quadrangular.
The energization member according to any one of claims 1 to 7. A connection member for electrically connecting a test head for testing a device under test and the device under test,
A frame having an opening;
An energizing member that is detachably disposed in the opening and electrically connects the test head and the device under test;
With
The energizing member is
A conductive portion that electrically connects the test head and the device under test;
A holding part that has elasticity and holds the conductive part;
Having
Connection member. The energizing member is held by the frame by the elasticity of the holding portion.
The connection member according to claim 9. The holding part has a convex part fitted into the opening,
The energization member is detachably held on the frame by a force generated between the convex portion and the side surface of the opening.
The connecting member according to claim 9 or 10. The cross-sectional area when the convex portion is cut along a plane perpendicular to the direction of penetration of the opening is larger than the cross-sectional area when the opening is cut along a plane perpendicular to the direction of penetration of the opening,
The connection member according to claim 11. The frame has irregularities on the side surface of the opening,
The connection member according to any one of claims 9 to 12. The holding portion has a locking portion that is not fitted into the opening,
The locking portion is detachably coupled to the surface of the frame.
The connecting member according to any one of claims 9 to 13. The frame has a protrusion on the surface;
The locking portion has a coupling opening,
The protrusion is fitted into the coupling opening;
The connection member according to claim 14. The cross-sectional area when the coupling opening is cut along a plane perpendicular to the penetration direction of the coupling opening is larger than the cross-sectional area when the protrusion is cut along a plane perpendicular to the penetration direction of the coupling opening,
The connection member according to claim 15. The protrusion has irregularities on the surface,
The connecting member according to claim 15 or 16. The outline of the cross section when the holding portion is cut in the direction from the surface on the test head side of the frame toward the surface on the device under test side of the frame is T-shaped, cross-shaped, H-shaped, Y-shaped or rectangular Is,
The connection member according to any one of claims 9 to 17. A test head for testing a device under test; a main body for supplying a test pattern to the test head;
The connection member according to any one of claims 9 to 18, which electrically connects the test head and the device under test.
Comprising
Test equipment. A method for repairing the connecting member according to any one of claims 9 to 18,
Removing the current-carrying member disposed in the opening from the frame;
Arranging the other current-carrying member in the opening;
Comprising
A method of repairing the connecting member.

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