JP5619855B2 - PROBE DEVICE, TEST DEVICE, AND PROBE METHOD - Google Patents

Description

  The present invention relates to a probe device, a test device, and a probe method.

A test apparatus that tests a plurality of devices under test formed on a wafer or the like is known (see, for example, Patent Document 1).
Patent Document 1 Japanese Patent Application Laid-Open No. 8-115954

  However, in the above-described test apparatus, there is a problem that the pressing force that is applied between the members in order to be electrically connected cannot be set appropriately.

  According to a first aspect of the present invention, there is provided a probe apparatus for electrically connecting a device under test to a tester, a device holding unit for holding the device under test, a flexible sheet, and A device side unit having a plurality of device side terminals connected to the device under test held by the device holding part through the sheet, and an intermediate substrate provided on the tester side from the device side unit, A plurality of device side intermediate electrodes formed on the intermediate substrate electrically connected to the plurality of device side terminals, and a plurality of tester side intermediates formed on the intermediate substrate electrically connected to the tester An intermediate unit having electrodes, a tester side substrate provided on the tester side from the intermediate unit, and the tester side base electrically connected to the tester A tester side unit having a plurality of tester side electrodes, a first pressure reducing unit that decompresses a first space between the intermediate unit and the tester side unit, and the device under test as the device side unit. Provided is a probe device including a second decompression unit that decompresses a second space between the device holding unit and the intermediate unit in a connected state.

  In a second aspect of the present invention, a test apparatus for testing a plurality of devices under test formed on a wafer, wherein the plurality of devices under test are exchanged with the plurality of devices under test by exchanging electrical signals. Provided is a test apparatus comprising a tester for testing a device, and the above-described probe apparatus that electrically connects device pads formed on the plurality of devices under test and the tester.

  According to a third aspect of the present invention, there is provided a probe method for electrically connecting a device under test to a tester, a device holding portion for holding the device under test, a flexible sheet, and A device side unit having a plurality of device side terminals connected to the device under test held by the device holding part through the sheet, and an intermediate substrate provided on the tester side from the device side unit, A plurality of device side intermediate electrodes formed on the intermediate substrate electrically connected to the plurality of device side terminals, and a plurality of tester side intermediates formed on the intermediate substrate electrically connected to the tester An intermediate unit having electrodes, a tester side substrate provided on the tester side from the intermediate unit, and the tester side base electrically connected to the tester In a probe apparatus comprising a tester side unit having a plurality of tester side electrodes formed in a first decompression stage for decompressing a first space between the intermediate unit and the tester side unit, and the device under test A probe method comprising: a second decompression step of decompressing a second space between the device holding unit and the intermediate unit in a state of being connected to the device side unit.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

1 is a front view showing an entire test apparatus 100. FIG. 1 is a partial longitudinal sectional view of a test apparatus 100. FIG. 2 is a partial horizontal sectional view of the test apparatus 100. FIG. 4 is a partial longitudinal sectional view showing the structure of alignment unit 400. FIG. 2 is a cross-sectional view of a test head 200. FIG. 2 is an exploded view of a probe card 300. FIG. FIG. 3 is an overall view of a probe card 300 that sucks a wafer tray 450. 3 is a flowchart showing a test process for a wafer 101. It is a figure which shows the state of the probe card 300 in a test process. It is a figure which shows the state of the probe card 300 in a test process.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a front view showing the entire test apparatus 100. The test apparatus 100 loads a wafer such as a semiconductor wafer on which a plurality of devices under test are formed into the apparatus, aligns the wafers, and then tests the plurality of devices under test using a tester.

  Here, the test apparatus 100 tests devices under test such as analog circuits, digital circuits, memories, and system-on-chip (SOC). The test apparatus 100 inputs a test signal based on a test pattern for testing the device under test to the device under test, and determines whether the device under test is acceptable based on an output signal output from the device under test according to the test signal. judge. The test apparatus 100 includes an EFEM 110, an operation unit 120, a load unit 130, and a chiller 140. EFEM is an abbreviation for Equipment Front End Module.

  The EFEM 110 incorporates a mechanism for transporting a substrate to be tested inside the test apparatus 100. Since the EFEM 110 is the largest in the test apparatus 100, the signal lamp 112 indicating the operation state of the test apparatus 100 and the EMO 114 operated when the test apparatus 100 is stopped in an emergency are arranged at a high position on the front surface of the EFEM 110. The Note that EMO is an abbreviation for Emergency Off.

  The operation unit 120 is supported by the EFEM 110. The operation unit 120 includes a display 122, an arm 124, and an input device 126. One end of the arm 124 is coupled to the EFEM 110 and the other end of the arm 124 supports the display 122 and the input device 126 movably.

  The display 122 includes, for example, a liquid crystal display device, and displays an operation state of the test apparatus 100, an echo back of input content from the input device 126, and the like. The input device 126 may include a keyboard, a mouse, a trackball, a jog tire, and the like, and accepts settings, operations, and the like of the test apparatus 100.

  Note that control of the entire test apparatus 100 such as the operation of each component input from the input device 126 or programmed in advance is performed by a control unit (not shown). In this case, each component is controlled by an individual control unit provided for each component, and the entire control unit instructs each individual control unit to give instructions such as timing when a plurality of components perform cooperative work. May be.

  The load unit 130 includes a load table 132 and a load gate 134. On the load table 132, a container that contains a semiconductor wafer to be tested is placed. The load gate 134 opens and closes when the semiconductor wafer is loaded into or unloaded from the test apparatus 100. Thereby, the semiconductor wafer can be loaded from the outside without reducing the cleanliness inside the test apparatus 100.

  The chiller 140 supplies a cooled medium, for example, when a wafer whose temperature has been raised by a test in the test apparatus 100 is cooled before being unloaded. For this reason, the chiller 140 has a heat exchanger and is arranged in the vicinity of the test head that performs the test. In many cases, the chiller 140 is used for the purpose of cooling the refrigerant. However, it may be used to heat the heat medium for the purpose of supplying a heat source for heating. In addition, when a supply source of a cooled or heated heat medium is separately prepared outside the test apparatus 100, the chiller 140 may be omitted from the test apparatus 100.

  FIG. 2 is a partial longitudinal sectional view of the test apparatus 100. Elements that are the same as those in FIG. 1 are given the same reference numerals, and redundant descriptions are omitted. The test apparatus 100 includes a load unit 130, an EFEM 110, a main frame 160, an alignment unit 400, a probe card 300, and a test head 200. In this figure, the chiller 140 is not shown.

  In the test apparatus 100, a load unit 130, an EFEM 110, and a main frame 160 are sequentially arranged adjacently from the front surface (left side in the figure) to the rear side (right side in the figure). The alignment unit 400, the probe card 300, and the test head 200 are stacked on the main frame 160.

  A FOUP 150 is placed on the load table 132 of the load unit 130. FOUP is an abbreviation for Front Opening Unified Pod. The FOUP 150 stores a plurality of wafers 101 to be tested. Further, when the wafer 101 after the test is collected, the wafer is stored in the FOUP 150.

  The EFEM 110 incorporates a robot arm 116. The robot arm 116 is mounted on a column 117 that travels along the rail 115, and conveys the wafer between the load unit 130 and the alignment unit 400. For this reason, the load unit 130 and the EFEM 110 and the alignment unit 400 and the EFEM 110 communicate with each other in an airtight manner, and the inside thereof is kept highly clean.

  The main frame 160 controls the overall operation of the test apparatus 100. For example, it is connected to the operation unit 120, receives an input from the input device 126, and reflects it on each unit of the test apparatus 100. Further, display contents reflecting the operation state of the test apparatus 100 are generated and displayed on the display 122.

  Further, the main frame 160 synchronizes the operations of the load unit 130, the EFEM 110, and the alignment unit 400 to transfer the wafer 101 to each other. Further, when the EMO 114 is operated, the operation of each part of the test apparatus 100 is immediately stopped. Since these operations are required regardless of the type of wafer 101 to be tested and the content of the test, the main frame 160 is constantly installed in the test apparatus 100.

  The alignment unit 400 includes an alignment stage 410 that transports the wafer 101 and corrects misalignment at the transport destination. In other words, by replacing the probe card 300, the test apparatus 100 can correspond to the wafer 101 having a different layout.

  The alignment stage 410 travels along the rail 402 with the wafer tray 450 and the wafer 101 mounted thereon. In addition, the alignment stage 410 can expand and contract in the vertical direction to raise or lower the mounted wafer 101. Thereby, after aligning the wafer 101 with respect to the probe card 300, the wafer 101 is pressed against the upper probe card 300.

  The probe card 300 is used as a wiring board unit that is interposed between the test head 200 and the wafer 101 and electrically connects the test head 200 and the wafer 101 when the test apparatus 100 executes a test. When a test is performed on the wafer 101, an electrical signal path is formed between the test head 200 and the wafer 101 by the probe card 300.

  The test head 200 stores a plurality of pin electronics 210. The pin electronics 210 is mounted with an electric circuit required according to the test target and the content of the test. In other words, the test head 200 is electrically connected to the probe card 300 via the contactor 202 attached to the lower surface.

  In the test apparatus 100 as described above, the wafer 101 to be tested is mounted on the load table 132 while being accommodated in the FOUP 150. The robot arm 116 takes out the wafers 101 one by one through the load gate 134 and conveys them to the alignment unit 400.

  In alignment unit 400, wafer 101 is mounted on wafer tray 450 of probe card 300 on alignment stage 410. The alignment stage 410 aligns the mounted wafer 101 with the probe card 300 and then presses it against the probe card 300 from below. Subsequent operations will be described later.

  FIG. 3 is a partial horizontal sectional view of the test apparatus 100. Elements common to those in FIGS. 1 and 2 are denoted by the same reference numerals, and redundant description is omitted. The test apparatus 100 includes four load units 130 and four test heads 200. Each load unit 130 is loaded with a FOUP 150.

  One EFEM 110 and one alignment unit 400 are arranged. The alignment unit 400 includes a single alignment stage 410.

  In the EFEM 110, the column 117 that supports the robot arm 116 moves along the rail 115 over substantially the entire width of the EFEM 110. Therefore, the robot arm 116 can transfer the wafer 101 to all of the four load units 130 and the four test heads 200.

  A pre-aligner 118 is disposed at the end of the EFEM 110 opposite to the chiller 140. The pre-aligner 118 adjusts the mounting position of the wafer 101 with respect to the robot arm 116 with a considerably higher accuracy than the accuracy required by the test head 200.

  Thereby, the initial position accuracy when the robot arm 116 mounts the wafer 101 on the wafer tray 450 is improved, and the time required for alignment with the probe card 300 is shortened. In addition, the throughput of the test apparatus 100 can be improved.

  The alignment unit 400 includes rails 402 and 422, a stage carrier 420, an alignment stage 410 and a microscope 430. The rail 402 is disposed over substantially the entire width of the bottom surface of the housing 401. The stage carrier 420 moves in the longitudinal direction of the housing 401 along the rail 402.

  The stage carrier 420 has a rail 422 that goes directly to the rail 402 of the housing 401 on the upper surface. The alignment stage 410 moves on the rail 422 in the lateral direction of the housing 401.

  A part of the microscope 430 is arranged in the vicinity of each of the probe cards 300 corresponding to each of the test heads 200. These microscopes 430 are arranged downward on the ceiling surface of the housing 401.

  A pair of microscopes 430 are mounted on the stage carrier 420 together with the alignment stage 410. The pair of microscopes 430 moves together with the alignment stage 410. These microscopes 430 are arranged upward.

  By using these microscopes 430, the wafer 101 on the alignment stage 410 can be aligned with the probe card 300. That is, at the stage of being mounted on the alignment stage 410, the position of the wafer 101 is positioned with the accuracy of pre-alignment. Therefore, the position of the wafer 101 can be accurately detected by detecting, for example, the edge of the wafer 101 with the microscope 430 facing downward.

  On the other hand, the relative position of the microscope arranged in the housing 401 with respect to the probe card 300 is known. As a result, the difference between the position of the wafer 101 and the position of the probe card 300 can be detected, and the alignment stage 410 can be moved so as to compensate for the difference, thereby aligning the wafer 101 and the probe card 300.

  The detection of the wafer 101 is not limited to the detection of the edge. For example, an image of the microscope 430 may be displayed on the display 122 and manually aligned.

  FIG. 4 is a partial longitudinal sectional view showing the structure of the alignment unit 400. Elements common to FIGS. 1 to 3 are given the same reference numerals, and redundant description is omitted. The alignment unit 400 includes a housing 401, an alignment stage 410, and a hanger hook 440.

  The casing 401 has a width corresponding to a plurality of test heads 200, for example, four test heads 200. In addition, four probe cards 300 are mounted on the upper surface of the housing 401 corresponding to each of the test heads 200. Further, on the ceiling surface inside the housing 401, hanger hooks 440 that are opened and closed are arranged at positions corresponding to the test heads 200, respectively.

  When closed, the hanger hook 440 suspends the wafer tray 450 and holds it under the probe card 300. When the hanger hook 440 is opened, the wafer tray 450 is opened. Thereby, the alignment unit 400 can hold | maintain the wafer tray 450 in the lower part of each of the test head 200 and the probe card 300 so that opening is possible respectively.

  The alignment stage 410 can move below all the test heads 200 along the rail 402 arranged on the bottom surface of the housing 401. In addition, the alignment stage 410 can expand and contract in the vertical direction to raise or lower the mounted wafer tray 450 together with the wafer 101.

  In the alignment unit 400 and the probe card 300 having the above-described structure, a wafer tray 450 that does not hold the wafer 101 held by the hanger hook 440 is supported by the alignment stage 410 that is lifted from below. Subsequently, after opening the hanger hook 440, the alignment stage 410 lowers the wafer tray 450.

  In this state, the robot arm 116 of the EFEM 110 mounts the wafer 101 transferred from the FOUP 150 on the wafer tray 450 on which the wafer 101 is not mounted. The alignment stage 410 raises the wafer tray 450 and presses it against the lower part of the probe card 300 while aligning the wafer 101 with the probe card 300.

  Next, the probe card 300 sucks the pressed wafer tray 450 and wafer 101. The structure in which the probe card 300 sucks the wafer 101 and the wafer tray 450 will be described later. The sucked wafer tray 450 is not held by the hanger hook 440, but is picked up by the hanger hook 440 when the suction fails and the wafer tray 450 is dropped.

  The alignment stage 410 moves leaving the wafer 101 and the wafer tray 450, and carries another wafer 101. Thus, the wafer 101 is loaded into the test head 200 via the probe card 300. In this state, the test head 200 tests the wafer 101.

  When the wafer 101 that has been tested is collected, the wafer tray 450 in the suction state is held on the alignment stage 410 that is lifted from below. Subsequently, after opening the hanger hook 440, the alignment stage 410 is lowered together with the wafer tray 450. As a result, the wafer tray 450 is released from the lower part of the probe card 300 together with the wafer 101. Thereafter, the wafer 101 is unloaded to the FOUP 150 by the EFEM 110.

  In the illustrated example, the wafer tray 450 and the wafer 101 are adsorbed to the probe card 300 immediately below the right test head 200 in the drawing. The hanger hook 440 is closed but is not in contact with the wafer tray 450.

  Immediately below the second test head 200 from the right, the alignment stage 410 pushes up the mounted wafer tray 450 and wafer 101 so as to be in close contact with the lower surface of the probe card 300. Under the other test head 200, a hanger hook 440 holds the wafer tray 450 and stands by.

  As described above, the alignment unit 400 is equipped with the probe card 300 including the wafer tray 450 corresponding to each of the four test heads 200. Thereby, each of the test heads 200 can test the wafer 101 individually.

  Note that the plurality of test heads 200 may perform the same type of test, or may perform different types of tests. In the latter case, the throughput of the test apparatus 100 can be improved by causing a plurality of test heads to perform a time-consuming test.

  As described above, in the test apparatus 100, the single alignment stage 410 and the robot arm 116 are used for the plurality of test heads 200. As a result, it is possible to improve the utilization efficiency of the alignment stage 410 and the robot arm 116 that are not required during the test execution period.

  FIG. 5 is a cross-sectional view of the test head 200. Elements common to FIGS. 1 to 4 are denoted by the same reference numerals, and redundant description is omitted. The test head 200 tests the plurality of devices under test by exchanging electrical signals with the plurality of devices under test. The test head 200 includes a housing 201, a contactor 202, pin electronics 210, a motherboard 220, and a flat cable 230.

  Inside the housing 201, a mother board 220 having a plurality of relay connectors 224 is disposed horizontally. The relay connector 224 has receptacles on the upper surface side and the lower surface side of the mother board 220, respectively, and forms a signal path that penetrates the mother board 220.

  On the upper surface of the motherboard 220, the pin electronics 210 is attached to each of the relay connectors 224 via the angle connectors 222. With such a structure, the pin electronics 210 can be exchanged according to the specification of the test object and the test content.

  The plurality of pin electronics 210 may have the same specifications or different specifications. Further, the pin electronics 210 may not be attached to some relay connectors 224.

  On the lower surface of the motherboard 220, a small board 228 is connected to each relay connector 224 via an angle connector 226. One end of a flat cable 230 is connected to the small board 228. Thereby, the pin electronics 210 inside the housing 201 and the contactor 202 described later can be connected via the flat cable 230.

  The contactor 202 has an upper surface fixed to the housing 201. The contactor 202 moves in the horizontal direction and expands and contracts in the vertical direction. Thereby, the contactor 202 can move three-dimensionally.

  Note that the lower end of the flat cable 230 is coupled to a terminal, for example, a spring pin, held by the contactor 202. Thereby, the pin electronics 210 is electrically connected to the lowermost surface of the test head 200. In addition, although a spring pin has been described here as an example, a structure including a connection that does not use a spring pin, such as capacitive coupling or optical connection, may be employed.

  FIG. 6 is an exploded view of the probe card 300. FIG. 7 is an overall view of the probe card 300 that sucks the wafer tray 450. In FIG. 6, the wafer tray 450 is omitted. The probe card 300 is an example of a probe device, and electrically connects a plurality of devices under test and the test head 200. More specifically, the probe card 300 connects device pads formed on a plurality of devices under test to the test head 200. The probe card 300 includes a stiffener 302, a performance board 304, a frame body 306, an IPC 308, an interposer 310, a PCR sheet 312, a membrane unit 314, a pressing member 316, a decompression unit 318, a wafer tray 450, A decompression unit 456 and an adsorption unit 458 are provided. IPC is an abbreviation for InterPosor Connector. PCR is an abbreviation for Pressure sensitive Conductive Rubber.

  The stiffener 302 has a frame part 320 and a cross member 322. The frame part 320 surrounds and holds the outside of the performance board 304. The cross member 322 is provided inside the frame part 320. The cross member 322 crosses the upper surface of the performance board 304 in a mesh shape in plan view. As a result, the bending rigidity of the entire performance board 304 integrated with the stiffener 302 is improved and the torsional rigidity is also increased. Therefore, deformation such as warping of the performance board 304 is suppressed.

  The performance board 304 is an example of a tester unit. The performance board 304 includes a tester side substrate 326, a guide unit 328, a plurality of contact pads 330 and a plurality of contact pads 332, a wiring 334, and an electronic component 335. The plurality of contact pads 330, the plurality of contact pads 332, and the wiring 334 are examples of tester side electrodes.

  An example of the tester side substrate 326 is an insulating substrate having relatively high mechanical strength, for example, a multilayer substrate in which polyimide plates are stacked. The tester side substrate 326 is provided closer to the test head 200 than the IPC 308 and the interposer 310. The peripheral portion of the tester side substrate 326 is held by a stiffener 302. As a result, the mechanical strength of the performance board 304 is enhanced by the stiffener 302.

  The guide unit 328 is provided on the upper surface of the tester side substrate 326. The guide unit 328 functions as a contactor guide that guides and positions the contactor 202 when the contactor 202 contacts the performance board 304.

  The plurality of contact pads 330 are formed on the upper surface of the tester side substrate 326. Contact pad 330 is electrically connected to test head 200 via contactor 202. The plurality of contact pads 332 are formed on the lower surface of the tester side substrate 326. The plurality of contact pads 332 are connected to the corresponding contact pads 330 via the wiring 334. The wiring 334 is configured by wiring formed in each layer of the tester side substrate 326 having a multilayer structure.

  The electronic component 335 is disposed in a region where the contact pads 330 and 332 are not mounted on the surface on the test head 200 side and the surface on the wafer 101 side of the tester side substrate 326. The electronic component 335 includes a resistor, a capacitor, a coil, a semiconductor device, and the like.

  The frame body 306 includes a main body portion 338 and a sealing member 340.

  The main body 338 is provided on the lower surface of the performance board 304. The main body 338 surrounds the outer periphery of the IPC 308 and the interposer 310 over the entire periphery. An exhaust passage 339 is formed in the main body 338. The exhaust path 339 connects the first space 344 and the decompression unit 318. The first space 344 here is a space surrounded by the performance board 304, the frame body 306, and a frame 362 of the membrane unit 314 described later. Accordingly, the first space 344 includes a space between the performance board 304 and the interposer 310.

  An example of the sealing member 340 is an O-ring made of resin or the like. The sealing member 340 is disposed between the lower surface of the peripheral portion of the performance board 304 and the upper surface of the peripheral portion of the main body 338. The sealing member 340 seals between the performance board 304 and the main body 338.

  The IPC 308 is an example of a contact unit. The IPC 308 is provided between the performance board 304 and the interposer 310. One end of the IPC 308 is held by the main body 338 of the frame 306 so as to be movable in the vertical direction. The IPC 308 has a plurality of through electrodes 346. The through electrode 346 is an example of a connection electrode. The through electrode 346 penetrates the IPC 308 in the vertical direction. The through electrode 346 is an elastic member such as a spring having conductivity and extending and contracting in the vertical direction. Each through electrode 346 is electrically connected to one of the contact pads 332.

  The interposer 310 is an example of an intermediate unit. The interposer 310 includes an intermediate substrate 350, a holding member 352, a plurality of contact pads 354, a plurality of contact pads 356, and a through electrode 358.

  The intermediate substrate 350 is disposed between the performance board 304 and the membrane unit 314. In other words, the intermediate substrate 350 is provided closer to the test head 200 than the membrane unit 314. The intermediate substrate 350 is held by the frame body 306 via a holding member 352 so as to be movable in the vertical direction with respect to the frame body 306. Thereby, the intermediate board 350 moves in the direction of the performance board 304 and the IPC 308 when the first space 344 is depressurized.

  The contact pad 354 is an example of a tester side intermediate electrode. The contact pad 354 is formed on the upper surface of the intermediate substrate 350. The contact pads 354 are arranged in the same layout as the through electrodes 346 in plan view. As a result, the contact pad 354 is connected to the through electrode 346 and is connected to the contact pad 332 by the through electrode 346. The contact pad 354 is electrically connected to the test head 200 via the performance board 304 and the IPC 308. Any of the contact pads 354 is formed in the same layout as the through electrode 358 of the IPC 308 in plan view. Thereby, any one of the contact pads 354 is electrically connected to the through electrode 358.

  The through electrode 358 penetrates the intermediate substrate 350 in the vertical direction. The through electrode 358 electrically connects the contact pad 354 and the contact pad 356 corresponding to the contact pad 354.

  The contact pad 356 is an example of a device side intermediate electrode. Contact pad 356 is formed on the lower surface of intermediate substrate 350. The contact pad 356 is electrically connected to the bump 368 of the membrane unit 314 described later via the PCR sheet 312. The contact pad 356 is formed with a different layout from the contact pad 354. Specifically, the pitch between the plurality of contact pads 356 is smaller than the pitch between the plurality of contact pads 354. As a result, the interposer 310 changes the narrow pitch of the contact pads 356 to the wide pitch of the contact pads 354.

  The PCR sheet 312 is an example of a conductive member. The PCR sheet 312 is provided between the interposer 310 and the membrane unit 314. The PCR sheet 312 is a resin sheet such as rubber containing metal fine particles. When pressure is applied to the PCR sheet 312 in the thickness direction (that is, the vertical direction), the metal fine particles in the region to which pressure is applied come into contact with each other. Thereby, the PCR sheet 312 electrically connects the upper surface and the lower surface of the area where the pressure is applied. Therefore, when pressure is applied by the contact pad 356 of the interposer 310 and the contact pad 366 of the membrane unit 314 to be described later, the PCR sheet 312 does not short-circuit the adjacent contact pads 356 and 366, but by metal fine particles. The contact pads 366 and bumps 368 of the membrane unit 314 and the contact pads 366 are individually connected.

  The membrane unit 314 is an example of a device side unit. The membrane unit 314 includes a frame 362, a flexible sheet 364, a plurality of contact pads 366, and a plurality of bumps 368.

  The frame 362 is an example of a separation member. The frame 362 maintains the periphery of the flexible sheet 364 and maintains the flatness of the flexible sheet 364. The frame 362 is pressed by the pressing member 316 toward the lower surface of the main body 338 of the frame body 306 and the lower surface of the intermediate substrate 350 of the interposer 310. Therefore, the frame 362 seals between the outer peripheral portion of the flexible sheet 364 and the lower surface of the main body portion 338 of the frame body 306. Accordingly, the frame 362 seals the gap between the interposer 310 and the membrane unit 314 of the membrane unit 314, and seals the first space 344 so that the pressure can be reduced. Further, the frame 362 separates the first space 344 and the second space 370. The second space 370 here is a space between the wafer tray 450 and the interposer 310. Thereby, the 1st space 344 and the 2nd space 370 can be made into different atmospheric pressure.

  The flexible sheet 364 has an insulating property and is formed into a sheet shape using a flexible elastically deformable resin or the like. As a result, the central region of the flexible sheet 364 not held by the frame 362 is elastically deformed up and down with respect to the frame 362.

  The contact pad 366 is provided on the upper surface of the flexible sheet 364. Contact pad 366 is arranged in the same layout as contact pad 356 of interposer 310 in plan view. As a result, the contact pad 366 and the contact pad 356 of the interposer 310 facing each other press the same region of the PCR sheet 312 and are therefore connected by the metal particles of the PCR sheet 312.

  The plurality of bumps 368 are an example of device-side terminals. The plurality of bumps 368 are provided through the flexible sheet 364 so as to be electrically connected to the device under test of the wafer 101 held on the wafer tray 450. The plurality of bumps 368 are arranged in the same layout as the contact pads 366. Each bump 368 is electrically connected to a corresponding contact pad 366. The plurality of bumps 368 are arranged in the same layout as the device pads formed on the device under test of the wafer 101 to be tested. Thus, the bump 368 functions as a probe terminal for the wafer 101 on the surface of the probe card 300 on the wafer 101 side. The end of the bump 368 on the wafer 101 side may have a cone shape with a flat tip, a shape having a protrusion, a flat surface without a protrusion, or a needle shape with a rounded tip.

  The pressing member 316 is provided on the lower surface of the main body 338 of the frame body 306. The pressing member 316 presses the lower surface of the membrane unit 314 to the interposer 310.

  The decompression unit 318 is connected to the exhaust path 339 of the main body 338 of the frame 306. Thereby, the decompression unit 318 decompresses the first space 344 via the exhaust passage 339.

  When testing the wafer 101, the wafer tray 450 is disposed below the membrane unit 314. In this state, the wafer 101 is electrically connected to the bumps 368 of the membrane unit 314.

  The wafer tray 450 is an example of a device holding unit. The wafer tray 450 has a tray body 452 and a sealing ring 454.

  The upper surface of the tray main body 452 functions as a mounting surface larger than the wafer 101 in plan view. A pressure reducing exhaust passage 462 that connects the second space 370 and the external pressure reducing portion 456 is formed inside the tray body 452. The end of the decompression exhaust passage 462 on the second space 370 side is formed in an outer peripheral portion that is not blocked even when the wafer 101 is placed on the placement surface of the tray main body 452. As a result, the second space 370 is decompressed by the decompression unit 456. An adsorption exhaust path 464 is formed inside the tray body 452. The end of the adsorption exhaust path 464 on the placement surface side is formed at a position that is blocked when the wafer 101 is placed on the placement surface.

  The sealing ring 454 is an example of a sealing member. The sealing ring 454 is provided on the upper surface of the tray main body 452. The sealing ring 454 has a ring shape and is formed so as to surround the entire upper periphery of the tray body 452. In a state where the wafer tray 450 is disposed below the membrane unit 314, the sealing ring 454 is in close contact with the lower surface of the frame 362 of the membrane unit 314. Thereby, since the sealing ring 454 seals between the membrane unit 314 and the wafer tray 450, the 2nd space 370 is sealed so that pressure reduction is possible.

  The decompression unit 456 and the adsorption unit 458 are configured by a device that can exhaust a gas, such as a vacuum pump. The decompression unit 456 decompresses the second space 370 through the decompression exhaust passage 462 in a state where the wafer 101 including the device under test is connected to the bump 368 of the membrane unit 314. Here, the decompression unit 456 decompresses the second space 370 such that the decompression unit 318 has a lower pressure than the pressure at which the first space 344 is decompressed. As a result, the interposer 310 presses the membrane unit 314 toward the wafer 101. As a result, the electrical connection between the bump 368 of the membrane unit 314 and the device under test of the wafer 101 becomes stronger. The suction unit 458 reduces the pressure of the suction exhaust path 464, so that the wafer tray 450 holds the wafer 101 on which the device under test is sucked on the mounting surface.

  FIG. 8 is a flowchart showing the test process of the wafer 101 including the probe process. 9 and 10 are diagrams showing a state of the probe card 300 in the test process.

  As shown in FIG. 8, in the test apparatus 100, when the test process is started, as shown in FIG. 9, the decompression unit 318 causes the gas in the first space 344 to flow while the wafer 101 is not loaded into the wafer tray 450. Evacuate and depressurize (S10). By this pressure reduction, the IPC 308 and the interposer 310 are attracted toward the performance board 304 and moved or elastically deformed. Thereby, the position of the interposer 310 is fixed with respect to the performance board 304. In this state, since the interposer 310 presses the performance board 304 and the IPC 308, the electrical connection between the interposer 310 and the IPC 308 and the electrical connection between the performance board 304 and the IPC 308 are strengthened. The membrane unit 314 is pressed and held by the pressing member 316 toward the test head 200 side.

  Next, as shown in FIG. 10, the alignment stage 410 lowers the wafer tray 450 on which the wafer 101 is not placed. In this state, the EFEM 110 carries the wafer 101 from the FOUP 150 to the wafer tray 450 on the alignment stage 410 (S12). The suction unit 458 depressurizes the suction exhaust passage 464, whereby the wafer tray 450 sucks and fixes the wafer 101. The alignment stage 410 aligns the loaded wafer 101 with the probe tray 300 together with the wafer tray 450 (S14).

  The alignment stage 410 raises the wafer tray 450 together with the wafer 101 to the lower surface of the probe card 300 (S16). With this rise, the wafer 101 comes into contact with the bumps 368 of the membrane unit 314 as shown in FIG.

  Next, the decompression unit 456 exhausts the gas in the second space 370 to decompress (S18). In this state, as described above, the first space 344 is decompressed by the decompression unit 318. The membrane unit 314 is adsorbed in the direction of the wafer tray 450 and the wafer 101 by this decompression. As a result, the bump 368 of the membrane unit 314 comes into contact with the wafer 101 more firmly, and the electrical connection between the bump 368 and the device under test on the wafer 101 is strengthened.

  Thereafter, the wafer 101 is tested by the test head 200 (S20). When the test of the wafer 101 is completed, gas is supplied to the second space 370, and the second space 370 returns to atmospheric pressure (S22). The wafer tray 450 is lowered together with the wafer 101 by the alignment stage 410 and is detached from the membrane unit 314. Here, even when the wafer tray 450 is detached from the membrane unit 314, the decompression unit 318 maintains the decompressed state of the first space 344. Thereafter, the wafer 101 on the wafer tray 450 for which the test has been completed is carried out to the FOUP 150 by the EFEM 110 (S24). After this, step S12 and the subsequent steps are repeated without executing step S10 until all the wafers 101 have been tested (S26: No). In other words, the decompression unit 318 continues the decompression state of the first space 344 even when the wafer tray 450 is detached from the membrane unit 314 together with the wafer 101. When all the wafers 101 have been tested (S26: Yes), the test process is finished.

  As described above, in the test apparatus 100, the decompression units 318 and 456 decompress the first space 344 and the second space 370 independently. Accordingly, the pressure between the performance board 304, the IPC 308, and the interposer 310 that are electrically connected by the decompression of the first space 344, and the interposer 310 that is electrically connected by the decompression of the second space 370, the PCR sheet. 312 and the pressing force between the membrane units 314 can be set individually. As a result, the test apparatus 100 can appropriately set the pressing force between the performance board 304 and the membrane unit 314 that are operated for electrical connection. Furthermore, by controlling the pressure in the second space 370, the pressure acting between the bump 368 of the membrane unit 314 and the wafer 101 can be set appropriately.

  In the test apparatus 100, even when the interposer 310 is deformed due to a warp or the like, the bumps 368 of the membrane unit 314 and the wafer in the plane are controlled by controlling the pressure in the first space 344 and the second space 370. The pressing force with 101 can be made uniform.

  In the test apparatus 100, since the decompression unit 318 decompresses the first space 344 before the second space 370, the interposer 310 can be held and fixed before the wafer 101 contacts the membrane unit 314. it can. Thereby, even if the second space 370 is depressurized while the wafer 101 is in contact with the membrane unit 314, the interposer 310 can be prevented from moving. As a result, the displacement of the relative position between the interposer 310 and the membrane unit 314 when the bump 368 of the membrane unit 314 contacts the wafer 101 can be suppressed.

  In the test apparatus 100, the decompression unit 318 maintains the decompression of the first space 344 even when the wafer 101 is detached from the probe card 300. Accordingly, when testing each wafer 101, the second space 370 may be decompressed, and therefore the time required for decompression can be reduced.

  You may change suitably the numerical values, arrangement | positioning, etc., such as a shape of each structure of embodiment mentioned above, a number.

  In the embodiment described above, the second space 370 is the space between the interposer 310 and the wafer tray 450, but the space between the membrane unit 314 and the wafer tray 450 may be the second space 370.

  In the above-described embodiment, the form in which the pressure in the second space 370 is reduced to be lower than the pressure in the first space 344 has been described. However, the pressure in the second space 370 is lower than the pressure in the first space 344. It may be the same.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

  100 test equipment, 101 wafer, 110 EFEM, 112 signal lamp, 114 EMO, 115 rail, 116 robot arm, 117 column, 118 pre-aligner, 120 operation unit, 122 display, 124 arm, 126 input device, 130 load unit, 132 load Table, 134 load gate, 140 chiller, 150 FOUP, 160 main frame, 200 test head, 201 housing, 202 contactor, 210 pin electronics, 220 motherboard, 222 angle connector, 224 relay connector, 226 angle connector, 228 small board, 23 Flat cable, 300 probe card, 302 stiffener, 304 performance board, 306 frame, 308 IPC, 310 interposer, 312 PCR sheet, 314 membrane unit, 316 pressing member, 318 decompression section, 320 frame section, 322 cross member, 326 tester Side substrate, 328 guide unit, 330 contact pad, 332 contact pad, 334 wiring, 335 electronic component, 338 main body, 339 exhaust path, 340 sealing member, 344 first space, 346 penetrating electrode, 350 intermediate substrate, 352 holding Members, 354 contact pads, 356 contact pads, 3 8 Through electrode, 362 frame, 364 flexible sheet, 366 contact pad, 368 bump, 370 second space, 400 alignment unit, 401 housing, 402 rail, 410 alignment stage, 420 stage carrier, 422 rail, 430 microscope 440 Hanger hook, 450 Wafer tray, 452 Tray body, 454 Seal ring, 456 Decompression unit, 458 Suction unit, 462 Depressurization exhaust path, 464 Suction exhaust path

Claims (9)

A probe apparatus for electrically connecting a device under test and a tester,
A device holding unit for holding the device under test;
A sheet having flexibility, and a device-side unit having a plurality of device-side terminals that pass through the sheet and are connected to the device under test held by the device holding unit;
An intermediate board provided on the tester side from the device side unit, a plurality of device side intermediate electrodes formed on the intermediate board electrically connected to the plurality of device side terminals, and electrically with the tester An intermediate unit having a plurality of tester side intermediate electrodes formed on the intermediate substrate to be connected;
A tester side unit provided on the tester side substrate from the intermediate unit, a tester side unit having a plurality of tester side electrodes formed on the tester side substrate electrically connected to the tester;
A first decompression unit for decompressing a first space between the intermediate unit and the tester side unit;
In a state where the device under test is connected to the device side unit, a second decompression unit that decompresses a second space between the device holding unit and the intermediate unit ,
The first decompression unit continues the decompressed state of the first space even when the device holding unit is detached from the device-side unit.
The probe device according to claim 2, wherein the second decompression unit decompresses the second space in a state where the first decompression unit decompresses the first space . The contact unit is further provided between the intermediate unit and the tester side unit, and further includes a contact unit having a plurality of connection electrodes that electrically connect the plurality of tester side intermediate electrodes and the plurality of tester side electrodes. 2. The probe device according to 1. The probe apparatus according to claim 1, further comprising a conductive member provided between the device side unit and the intermediate unit and individually connecting the plurality of device side terminals and the plurality of device side intermediate electrodes. . The probe device according to claim 1, wherein the device holding unit includes a sealing member that seals between the device holding unit and the device side unit. 5. The probe device according to claim 1, further comprising a separation member that seals the first space and separates the first space and the second space. 6. The first decompression unit decompresses the first space,
The intermediate unit is fixed to the tester side unit;
The plurality of tester-side intermediate electrodes, the probe device according to any one of claims 1 to 5, wherein the tester and are electrically connected. The second decompression unit decompresses the second space,
The device-side unit, the probe device according to any one of the device holding portion Ru is adsorbed to the side <br/> claims 1 to 6. A test apparatus for testing a plurality of devices under test formed on a wafer,
A tester for exchanging electrical signals with the plurality of devices under test to test the plurality of devices under test;
Wherein the plurality of test apparatus including a probe device according to any one of claims 1 7 for electrically connecting the device pad formed on the device under test and the tester. A probe method for electrically connecting a device under test and a tester,
A device holding unit for holding the device under test;
A sheet having flexibility, and a device-side unit having a plurality of device-side terminals that pass through the sheet and are connected to the device under test held by the device holding unit;
An intermediate board provided on the tester side from the device side unit, a plurality of device side intermediate electrodes formed on the intermediate board electrically connected to the plurality of device side terminals, and electrically with the tester An intermediate unit having a plurality of tester side intermediate electrodes formed on the intermediate substrate to be connected;
In a probe apparatus comprising: a tester side substrate provided on the tester side from the intermediate unit; and a tester side unit having a plurality of tester side electrodes formed on the tester side substrate electrically connected to the tester.
A first depressurization stage for depressurizing a first space between the intermediate unit and the tester side unit;
A second depressurizing step of depressurizing a second space between the device holding unit and the intermediate unit in a state where the device under test is connected to the device side unit ;
In the first decompression step, even if the device holding unit is detached from the device side unit, the decompression state of the first space is continued,
In the second decompression step, the second space is decompressed in a state where the first space is decompressed in the first decompression step .

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