JP2020017713A - Intermediate connecting member and inspection device - Google Patents

Abstract

To provide a technique capable of suppressing a position shift due to a difference in thermal expansion between a pogo frame and a pogo block in an intermediate connecting member configured by inserting the pogo block into an insertion hole of the pogo frame.SOLUTION: An intermediate connecting member provided between a first member having a plurality of first terminals and a second member having a plurality of second terminals, and electrically connecting the first terminal and the second terminal includes a main body, a pogo block having a plurality of pogo pins which are provided on the main body and are connectors that connect the first terminal and the second terminal, and a pogo frame having an insertion hole for inserting the pogo block. The pogo block has a positioning pin, the pogo frame has a positioning hole into which the positioning pin is inserted, and the positioning pin is inserted into the positioning hole and thereby the pogo block is positioned with respect to the pogo frame.SELECTED DRAWING: Figure 7

Description

  The present disclosure relates to an intermediate connection member and an inspection device.

  In a semiconductor device manufacturing process, when all processes on a semiconductor wafer (hereinafter simply referred to as a wafer) are completed, an electrical inspection of a plurality of devices (IC chips) formed on the wafer is performed. An inspection apparatus that performs such an electrical inspection generally includes a wafer stage, an aligner that aligns the wafer, and a wafer transfer system, and a probe card that has a probe that contacts a device formed on the wafer. It has a prober to be mounted and a tester for supplying an electric signal to the device via a probe card and inspecting various electric characteristics of the device.

  In such an inspection apparatus, an intermediate connecting member is provided to establish electrical continuity between the tester (test head) and the probe card. As an intermediate connection member, a member having a plurality of pogo blocks formed by arranging a large number of pogo pins and a pogo frame having a plurality of insertion holes into which the pogo blocks are inserted is known (for example, Patent Document 1). .

JP 2014-179379 A

  The present disclosure provides a technology capable of suppressing a positional shift due to a difference in thermal expansion between a pogo frame and a pogo block in an intermediate connecting member formed by inserting a pogo block into an insertion hole of a pogo frame.

  An intermediate connection member according to an aspect of the present disclosure is provided between a first member having a plurality of first terminals and a second member having a plurality of second terminals, and the first terminal And a plurality of pogo pins, which are intermediate connecting members for electrically connecting the first terminal and the second terminal, the plurality of pogo pins being provided on the main body and connecting the first terminal and the second terminal. And a pogo frame having an insertion hole into which the pogo block is inserted.The pogo block has a positioning pin, and the pogo frame has a positioning hole into which the positioning pin is inserted. The pogo block is positioned with respect to the pogo frame by inserting the positioning pin into the positioning hole.

  ADVANTAGE OF THE INVENTION According to this indication, in the intermediate | middle connection member comprised by inserting a pogo block in the insertion hole of a pogo frame, the displacement by the thermal expansion difference of a pogo frame and a pogo block can be suppressed.

It is a perspective view showing roughly composition of an example of an inspection system. FIG. 2 is a schematic sectional view illustrating an inspection device provided in the inspection system of FIG. 1. FIG. 3 is a plan view showing a pogo frame of an intermediate connecting member in the inspection device of FIG. 2. It is a perspective view showing a pogo block of an intermediate connecting member. It is a schematic sectional drawing which shows the state which inserted the pogo block in the pogo frame. FIG. 4 is a schematic vertical sectional view showing a process of inserting a pogo block into an insertion hole of a pogo frame. It is a schematic horizontal sectional view of the height position in the middle of the positioning pin 427 when a pogo block is inserted in the insertion hole of a pogo frame. It is a schematic side view which shows the middle of inserting a pogo block in the insertion hole of a pogo frame in the intermediate connection member of another example. FIG. 14 is a schematic horizontal cross-sectional view of a height position in the middle of a positioning pin 427 when a pogo block is inserted into an insertion hole of a pogo frame in an intermediate connection member of another example.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a perspective view schematically showing an example of an inspection system equipped with a plurality of inspection apparatuses according to one embodiment. The inspection system 10 of the present embodiment is for inspecting electrical characteristics of a plurality of devices under test (Device Under Test; DUT) formed on a semiconductor wafer (wafer) as an object to be inspected.

  The inspection system 10 of FIG. 1 includes an inspection unit 12 having a plurality of inspection rooms (cells) 11 having a rectangular parallelepiped overall shape, and a loader unit 13 for carrying in / out a wafer W to / from each inspection room 11. It has. In the inspection unit 12, four inspection rooms 11 are arranged in a horizontal direction to form a cell row, and the cell rows are vertically arranged in three stages. In addition, a transfer unit 14 is provided between the inspection unit 12 and the loader unit 13, and a transfer mechanism (a transfer mechanism) that transfers the wafer W between the loader unit 13 and each inspection chamber 11 is provided in the transfer unit 14. (Not shown). In each inspection room 11, an inspection device described later is provided. From the front of the inspection unit 12, a tester 30 forming a part of the inspection device is inserted into each inspection room 11. In FIG. 1, the depth direction of the test room 11 is the X direction, the arrangement direction of the test rooms 11 is the Y direction, and the height direction is the Z direction.

  FIG. 2 is a schematic configuration diagram illustrating an inspection device provided in the inspection room 11. The inspection device 20 has a tester 30, an intermediate connection member 40, and a probe card 50. In the inspection device 20, an inspection of the electrical characteristics of the DUT formed on the wafer W is performed by the tester 30 via the probe card 50.

  The tester 30 has a tester motherboard 31 provided horizontally, a plurality of test circuit boards 32 mounted upright in slots of the tester motherboard 31, and a housing 33 that houses the test circuit boards 32. I have. A plurality of terminals (not shown) are provided on the bottom of the tester motherboard 31.

  The probe card 50 has a plate-shaped base 51 having a plurality of terminals (not shown) on the upper surface, and a plurality of probes 52 provided on the lower surface of the base 51. The plurality of probes 52 are configured to contact a DUT formed on the wafer W. The wafer W is positioned by an aligner (not shown) while being attracted to the chuck top (stage) 60, and a corresponding probe comes into contact with each of the plurality of DUTs.

  The intermediate connection member 40 is for electrically connecting the tester 30 and the probe card 50, and has a pogo frame 41 and a pogo block 42.

  The pogo frame 41 is made of a material having high strength, high rigidity, and a small coefficient of thermal expansion, for example, a NiFe alloy. The pogo frame 41 is provided with a plurality of rectangular insertion holes 43 as shown in FIG. 3, and the pogo block 42 is inserted into the insertion holes 43.

  The pogo block 42 is positioned with respect to the pogo frame 41 as described later, and connects the terminal of the tester motherboard 31 of the tester 30 to the terminal of the base 51 of the probe card 50.

  A seal member 71 is provided between the tester motherboard 31 and the pogo frame 41, and a seal member 72 is provided between the pogo frame 41 and the probe card 50. Then, the space between the tester motherboard 31 and the intermediate connection member 40 is evacuated, so that the intermediate connection member 40 is attracted to the tester motherboard 31 via the seal member 71. In addition, the space between the intermediate connection member 40 and the probe card 50 is evacuated, so that the probe card 50 is attracted to the intermediate connection member 40 (the pogo frame 41) via the seal member 72. A seal member 73 is provided on the upper surface of the chuck top 60 so as to surround the wafer W. The chuck top 60 is raised by an aligner (not shown) provided at each stage, and the probes 52 of the probe card 50 are brought into contact with the electrodes of the DUT formed on the wafer W. At the same time, the chuck top 60 is sucked by bringing the seal member 73 into contact with the pogo frame 41 of the intermediate connecting member 40 and evacuating the space surrounded by the seal member 73.

Next, the intermediate connecting member 40, particularly the pogo block 42 will be described in detail.
FIG. 4 is a perspective view showing the pogo block 42, and FIG. 5 is a schematic sectional view showing a state where the pogo block 42 is inserted into the pogo frame 41.

  The pogo block 42 has a guide member 421, a connection terminal 422, and a flange 423.

  The guide member 421 has a substantially rectangular parallelepiped shape as a whole, and has long sides and short sides in plan view. The direction parallel to the long side is the X direction, and the direction parallel to the short side is the Y direction. The length of the long side is, for example, 50 mm or more, and the length of the short side is, for example, 20 mm or more. A frame 421a is formed along the outer edge of the upper end of the guide member 421, and a plurality of connection terminals 422 are arranged in a space surrounded by the frame 421a. A frame 421b is formed at the lower end of the guide member 421 along the outer edge thereof, and a plurality of connection terminals 422 are arranged in a space surrounded by the frame 421b. The plurality of connection terminals 422 arranged in the space surrounded by the frame 421a and the plurality of connection terminals 422 arranged in the space surrounded by the frame 421b are connected to connection pins (not shown) provided in the guide member 421, respectively. ) Are connected to one end and the other end.

  The tester motherboard 31 (corresponding to the first member) and the intermediate connecting member 40, and the intermediate connecting member 40 and the base 51 of the probe card 50 (corresponding to the second member) are vacuum-adsorbed, so that the terminals of the tester motherboard 31 are held. (Corresponding to the first terminal), the terminal of the base 51 (corresponding to the second terminal) and the connection terminal 422 are connected. At this time, the tester motherboard 31 is in contact with the frame 421a, and the base 51 is in contact with the frame 421b.

  The flange 423 is made of resin, and is provided so as to protrude outside a pair of long sides on the upper part of the guide member 421.

  FIG. 6 is a schematic vertical sectional view showing the way in which the pogo block 42 is being inserted into the insertion hole 43 of the pogo frame 41. As shown in this figure, the pogo block 42 is inserted from above the insertion hole 43 of the pogo frame 41, and the flange 423 is locked on the upper surface of the pogo frame 41. A positioning pin 427 is provided on the lower surface of one flange 423 so as to protrude downward. That is, the positioning pins 427 are provided in an area different from the connection pin arrangement area of the pogo block 42.

  FIG. 7 is a schematic horizontal cross-sectional view of a height position in the middle of the positioning pin 427 when the pogo block 42 is inserted into the insertion hole 43 of the pogo frame 41. As shown in FIGS. 6 and 7, a positioning hole 411 into which the positioning pin 427 is inserted is provided at a position corresponding to the positioning pin 427 on the upper surface of the pogo frame 41.

  As shown in FIG. 7, the positioning hole 411 is provided near the center of the pogo block 42 in the long side direction. The positioning hole 411 has a long hole shape in which the short side direction of the pogo block 42, that is, the Y direction is the long axis direction. In the X direction which is the long side direction of the pogo block 42, the positioning hole 411 There are few gaps. Therefore, the positioning pin 427 is inserted into the positioning hole 411, whereby the pogo block 42 is positioned in the long side direction, that is, the X direction. On the other hand, since the positioning hole 411 has a long hole shape extending in the Y direction, the Y direction of the pogo block 42 is determined by the inner wall (tolerance of the inner wall) of the insertion hole 43 of the pogo frame.

  The connection terminal 422 is for connecting a terminal of the tester motherboard 31 (tester 30) to a terminal of the base 51 (probe card 50), and these constitute a pogo pin as a connector. Usually, the pogo pin has a built-in spring and is connected to the tester motherboard 31 and the terminals of the base 51 by the elastic force (biasing force) of the spring. In addition, a pogo pin includes a connector using an elastic material such as an elastic resin plated as an elastic material such as an elastic resin as the connecting terminal 422, and using an elastic force of the elastic material. Also in this case, an effect equivalent to that of a normal pogo pin using a spring can be obtained.

  In the inspection system 10 configured as described above, in each of the inspection devices 20, the intermediate connection member 40 is configured by inserting the pogo block 42 into the insertion hole 43 of the pogo frame 41. Then, the intermediate connection member 40 and the tester motherboard 31 are aligned, and these are vacuum-sucked via the seal member 71. Further, the base 51 of the probe card 50 and the intermediate connecting member 40 are aligned, and these are vacuum-sucked via the seal member 72.

  In this state, the wafer W of the loader unit 13 is taken out by the transfer mechanism (not shown) in the transfer unit 14 and delivered to the chuck top 60 on the aligner (not shown). After the alignment of the wafer W in the XYθ directions is performed by the aligner, the aligner is raised, and the probes 52 of the probe card 50 are brought into contact with the electrodes of the DUT formed on the wafer W. At the same time, the chuck top 60 is sucked by bringing the seal member 73 into contact with the pogo frame 41 of the intermediate connecting portion 40 and evacuating the space surrounded by the seal member 73. In this state, the tester 30 inspects the electrical characteristics of the DUT formed on the wafer W.

  In the inspection system 10, when the inspection apparatus 20 inspects the wafer W, when the measurement temperature increases, a relative displacement occurs due to a difference in the thermal expansion coefficient between the pogo frame 41 and the pogo block 42.

In other words, the pogo frame 41 is made of a material having high strength, high rigidity, and a small thermal expansion coefficient, for example, a NiFe alloy, whereas the pogo block 42 is made of a resin whose body has a large thermal expansion coefficient. At a high temperature, the pogo pin is displaced from the terminal of the tester motherboard or the terminal of the probe card due to a difference in thermal expansion. Specifically, the thermal expansion coefficient of the pogo frame 41 is about 1.5 × 10 ⁻⁶ / cm, while the thermal expansion coefficient of the pogo block 42 is about 20 × 10 ⁻⁶ / cm. A corresponding displacement occurs.

  Conventionally, as shown in Patent Document 1, the plane shape of the pogo block is a square and the length of one side is 20 mm or less. Therefore, the size of the insertion hole of the pogo frame and the clearance between the insertion hole and the pogo block are strict. , The pogo block could be positioned. That is, by positioning the pogo block by the inner wall of the insertion hole of the pogo frame (tolerance of the inner wall), the positional deviation between the pogo pin and the terminal of the tester motherboard or the terminal of the probe card can be within an allowable range. Was.

  However, as the miniaturization and miniaturization of semiconductor devices have progressed and the number of pins has been increased, the size of the pogo block has been required to increase, and the planar shape of the pogo block is shifting from a square to a rectangle. For this reason, the elongation itself due to the thermal expansion of the pogo block increases, and the elongation due to the vertical and horizontal thermal expansion differs. In addition, with the increase in the number of pins, the diameter of the electrode pad itself has been reduced. Therefore, in the conventional positioning using only the inner wall of the insertion hole, it is difficult to make the positional deviation between the pogo pin due to the difference in thermal expansion and the terminal of the tester motherboard or the terminal of the probe card within an allowable range.

  Therefore, in the present embodiment, the pogo block 42 is positioned by inserting the positioning pins 427 provided on the lower surface of the flange 423 outside the connection pin arrangement area of the pogo block 42 into the positioning holes 411 on the upper surface of the pogo frame 41. .

  At this time, the positioning hole 411 has a long hole shape in which the Y direction, which is the short side direction of the pogo block 42, is the long axis direction. There is almost no gap between For this reason, the pogo block 42 can perform high-precision positioning with respect to the pogo frame 41 in the X direction which is the long side direction. Can be set within an allowable range.

  On the other hand, in the positioning hole 411, since the Y direction which is the short side direction is the long axis direction, the positioning pin 427 can escape in the Y direction which is the short side direction. Accordingly, the pogo block 42 is positioned by the inner wall of the insertion hole 423 in the Y direction, which is the short side direction, without being restricted by the positioning pins 427 as in the related art. That is, since the short side of the pogo block 42 has a short length, positioning by the inner wall of the insertion hole 423 can be performed as in the related art.

  Therefore, by simply providing one positioning pin 427 and the corresponding positioning hole 411 having a long hole shape, the pogo pin, the terminal of the tester mother board, and the probe in both the long side direction and the short side direction are provided. It is possible to set the positional deviation from the terminal of the card within an allowable range. However, the positioning pin 427 and the positioning hole 411 are not limited to one each.

Next, another example of the intermediate connecting member 40 will be described.
In this example, positioning is performed using the positioning pins and the positioning holes in both the long side direction and the short side direction.

  Specifically, as shown in FIG. 8, on the lower surface of one flange 423 of the pogo block 42, a first positioning pin 427a at the center and two second positioning pins 427b on both sides thereof are provided.

  On the other hand, a first positioning hole 411a into which the first positioning pin 427a is inserted is formed at a position corresponding to the first positioning pin 427a on the upper surface of the pogo frame 41, as shown in FIG. At positions corresponding to the two positioning pins 427b, two second positioning holes 411b into which the second positioning pins 427b are inserted are formed.

  The first positioning hole 411a has a long hole shape in which the Y direction which is the short side direction of the pogo block 42 is the long axis direction, and can perform highly accurate positioning in the X direction which is the long side direction. On the other hand, the second positioning hole 411b has a long hole shape in which the X direction, which is the long side direction of the pogo block 42, is the long axis direction, and can perform highly accurate positioning in the Y direction, which is the short side direction.

  Therefore, in this example, the positioning accuracy in both the X direction and the Y direction can be enhanced, and the positional deviation between the pogo pin and the terminal of the tester motherboard or the terminal of the probe card can be more reliably set within the allowable range.

  In this example, the first positioning pin 427a and the first positioning hole 411a are not limited to one each, and the second positioning pin 427b and the second positioning hole 411b are limited to two each. It is not something to be done. In this example, the pogo block 42 is not limited to a rectangular shape in plan view, but may be a square shape.

  Although the embodiments have been described above, the embodiments disclosed this time are to be considered in all respects as illustrative and not restrictive. The above embodiments may be omitted, replaced, or changed in various forms without departing from the scope of the appended claims and the spirit thereof.

  For example, in the above embodiment, the inspection apparatus in the inspection system having a plurality of inspection units has been described. However, the invention is not limited thereto, and a single inspection apparatus may be used.

  Further, in the above embodiment, the intermediate connection member for connecting the tester and the probe card in the inspection apparatus is shown, but the intermediate connection member is not limited to this as long as it can form electrical conduction.

10; inspection system 11; inspection room (cell)
12; inspection section 13; loader section 14; transport section 20; inspection apparatus 30; tester 31; tester motherboard 40; intermediate connecting member 41; pogo frame 42; pogo block 43; insertion hole 50; probe card 51; 60; chuck tops 411, 411a, 411b; positioning holes 421; guide members 421a, 421b; frames 422; connection terminals 423; flanges 427, 427a, 427b;

Claims (12)

Provided between a first member having a plurality of first terminals and a second member having a plurality of second terminals, and electrically connecting the first terminal and the second terminal. An intermediate connecting member,
A pogo block provided on the main body and having a plurality of pogo pins as connectors for connecting the first terminal and the second terminal;
A pogo frame having an insertion hole into which the pogo block is inserted,
With
The pogo block has a positioning pin,
The pogo frame has a positioning hole into which the positioning pin is inserted,
An intermediate connection member for positioning the pogo block with respect to the pogo frame by inserting the positioning pin into the positioning hole. The pogo block forms a rectangle having a long side and a short side in plan view,
The intermediate connection member according to claim 1, wherein the positioning hole has a long hole shape in which a direction parallel to the short side is a long axis direction. The pogo block forms a rectangle or a square having a first side and a second side orthogonal to the first side in plan view,
The positioning pin has a first positioning pin and a second positioning pin,
The positioning hole has a first positioning hole into which the first positioning pin is inserted, and a second positioning hole into which the second positioning pin is inserted,
The first positioning hole has a long hole shape in which a direction parallel to the first side is a long axis direction, and the second positioning hole has a long axis direction in a direction parallel to the second side. The intermediate connection member according to claim 1, wherein the intermediate connection member has an elongated hole shape.   The intermediate connection member according to claim 1, wherein the positioning pin is provided in an area of the pogo block other than an area where the pogo pin is arranged.   The pogo block is provided so as to protrude from the main body, and has a flange that is engaged with the pogo frame when being inserted into the insertion hole of the pogo frame, and the positioning pin is provided on the flange. The intermediate connection member according to claim 4, wherein the intermediate connection member is provided.   The said pogo pin has a connection pin and the connection terminal provided in the both ends, The said main body of the said pogo block is any one of Claim 1 to 5 comprised as a guide member of the said connection pin. The intermediate connecting member as described in the above. A tester for providing an electrical signal to a plurality of devices on the substrate and inspecting electrical characteristics of the device;
A probe card having a probe that contacts electrodes of a plurality of devices on the substrate,
A plurality of terminals of the tester, an intermediate connection member for electrically connecting the plurality of terminals of the probe card,
With
The intermediate connecting member,
A pogo block provided on the main body and having a plurality of pogo pins that are connectors for connecting terminals of the tester and terminals of the probe card, provided on the main body;
A pogo frame having an insertion hole into which the pogo block is inserted,
With
The pogo block has a positioning pin,
The pogo frame has a positioning hole into which the positioning pin is inserted,
An inspection device, wherein the pogo block is positioned with respect to the pogo frame by inserting the positioning pin into the positioning hole. The pogo block forms a rectangle having a long side and a short side in plan view,
The inspection device according to claim 7, wherein the positioning hole has a long hole shape in which a direction parallel to the short side is a long axis direction. The pogo block forms a rectangle or a square having a first side and a second side orthogonal to the first side in plan view,
The positioning pin has a first positioning pin and a second positioning pin,
The positioning hole has a first positioning hole into which the first positioning pin is inserted, and a second positioning hole into which the second positioning pin is inserted,
The first positioning hole has a long hole shape in which a direction parallel to the first side is a long axis direction, and the second positioning hole has a long axis direction in a direction parallel to the second side. The inspection device according to claim 7, wherein the inspection device has an elongated hole shape.   The inspection device according to any one of claims 7 to 9, wherein the positioning pin is provided in an area of the pogo block different from an area where the pogo pin is arranged.   The pogo block is provided so as to protrude from the main body, and has a flange that is engaged with the pogo frame when being inserted into the insertion hole of the pogo frame, and the positioning pin is provided on the flange. The inspection apparatus according to claim 10, wherein the inspection apparatus is used.   The pogo pin according to any one of claims 7 to 11, wherein the pogo pin has a connection pin and connection terminals provided at both ends thereof, and the main body of the pogo block is configured as a guide member for the connection pin. Inspection device as described.

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