CN111983424A

CN111983424A - Test fixture and test equipment

Info

Publication number: CN111983424A
Application number: CN202010750753.XA
Authority: CN
Inventors: 梁在炯; 尹振武
Original assignee: Semicon Microelectronics Shenzhen Co Ltd
Current assignee: Semicon Microelectronics Shenzhen Co Ltd
Priority date: 2020-07-30
Filing date: 2020-07-30
Publication date: 2020-11-24

Abstract

The invention relates to a test fixture and test equipment. The test fixture comprises: the bearing base is provided with a groove; the elastic component is fixed in the groove; the limiting assembly is detachably arranged in the groove, when the limiting assembly is arranged in the groove, the limiting assembly is positioned on the elastic assembly, a chip placing area used for containing a target chip is formed in the first surface of the limiting assembly, and the depth of the chip placing area is smaller than the thickness of the limiting assembly; wherein, first face is the one side that recess was kept away from to spacing subassembly. Offer the chip that is used for holding target chip on the spacing subassembly among this application test fixture and place the region, and the chip places regional degree of depth and is less than the thickness of spacing subassembly, presses the time measuring to placing the target chip that places the region at the chip, through the elastic component that is located below the spacing subassembly for target chip moves to recess inside along with spacing subassembly, plays the protection target chip, reduces and presses the crooked purpose of target chip pin that the survey arouses.

Description

Test fixture and test equipment

Technical Field

The invention relates to the technical field of chip testing devices, in particular to a testing jig and testing equipment.

Background

The SOP pogo pin Socket (small-outline package Socket spring pin) is mainly applied to a turret type test taping all-in-one machine and serves as a bearing and electrical connection device of a test station.

During the Kelvin test process of the chip by the turret type test braid all-in-one machine, the chip is fed from the guide rail, sequentially passes through the inspection station, the turning station and finally reaches the test station, the chip is sucked and moved by the suction nozzles between different stations, the positioning accuracy of the suction nozzles corresponding to the stations, the size redundancy of the bearing devices and the mechanical return difference of the forward rotation and the reverse rotation of the turning motors of the turning stations all influence the positioning accuracy of the chip at the test station, and when the time measurement of Kelvin test of the chip is carried out, the abnormal bending of the test pins of the chip is easy to occur.

Disclosure of Invention

Therefore, it is necessary to provide a test fixture and a test apparatus for solving the problem that the chip test pin is likely to be bent abnormally when the chip kelvin test is performed.

A test fixture for Kelvin testing of a target chip, comprising:

the bearing base is provided with a groove;

the elastic component is fixed in the groove;

the limiting assembly is detachably mounted in the groove, when the limiting assembly is arranged in the groove, the limiting assembly is positioned on the elastic assembly, a chip placing area used for containing the target chip is formed in the first surface of the limiting assembly, and the depth of the chip placing area is smaller than the thickness of the limiting assembly;

wherein, first face is the one side that spacing subassembly kept away from the recess.

In one embodiment, the chip placement area comprises 2 rectangular pin placement areas and 1 plastic package body placement area located between the 2 pin placement areas, the pin placement areas are provided with test holes penetrating through the limiting assemblies, and the plastic package body placement areas are provided with grounding holes penetrating through the limiting assemblies.

In one embodiment, a positioning pin is arranged in the groove, a positioning pin hole corresponding to the positioning pin is formed in the limiting assembly, and the positioning pin hole are used for positioning the limiting assembly and the bearing base.

In one embodiment, the elastic members are symmetrically arranged at the corners of the groove.

In one embodiment, the first surface of the limiting component is provided with an opening which is symmetrical with respect to the center of the limiting component, the bearing base is provided with a mounting hole corresponding to the opening, and the opening and the mounting hole are used for realizing the connection between the limiting component and the bearing base.

In one embodiment, the limiting assembly is made of an insulating wear-resistant material.

In one embodiment, the four walls of the chip placement area have a chamfered design.

In one embodiment, the difference between the size of the chip placement area and the size of the target chip is not greater than 0.04 mm.

The test fixture is used for Kelvin test of the target chip and comprises the following components: the bearing base is provided with a groove; the elastic component is fixed in the groove; the limiting assembly is detachably mounted in the groove, when the limiting assembly is arranged in the groove, the limiting assembly is positioned on the elastic assembly, a chip placing area used for containing the target chip is formed in the first surface of the limiting assembly, and the depth of the chip placing area is smaller than the thickness of the limiting assembly; wherein, first face is the one side that spacing subassembly kept away from the recess. Offer the chip that is used for holding target chip on the spacing subassembly among this application test fixture and place the region, just the degree of depth that the chip placed the region is less than the thickness of spacing subassembly, presses the time measuring to placing the target chip that places the region at the chip, through the elastic component that is located below the spacing subassembly for target chip along with spacing subassembly to the recess is inside to be removed, plays the protection target chip, reduces and presses the crooked purpose of target chip pin that the survey arouses.

A test device for Kelvin test of a target chip comprises the test fixture.

In one embodiment, the test apparatus further comprises a plurality of sets of test probes for kelvin testing, the test probes being located in the chip placement area;

each group of test probes is arranged corresponding to one pin of the target chip, and the distances between the same group of test probes and the second surface of the limiting assembly are different;

the second surface of the limiting assembly is opposite to the first surface.

The test equipment is used for performing Kelvin test on a target chip and comprises the test fixture. When the test equipment of the application is used for carrying out Kelvin test on the target chip, the target chip moves towards the interior of the groove formed in the bearing base along with the limiting component through the elastic component positioned below the limiting component, the target chip is protected, and the purpose of bending the pin of the target chip caused by pressure test is reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a top view of a load bearing base in one embodiment;

FIG. 2 is a top view of an embodiment of a stop assembly;

FIG. 3 is a diagram illustrating an embodiment of a test apparatus for testing a target chip;

description of reference numerals:

100. a load bearing base; 102. a groove; 104. testing the bearing area; 106. a pin bearing area; 108. a plastic package body bearing area; 110. testing a pinhole; 112. a grounding pinhole; 114. positioning pins; 116. mounting holes; 200. an elastic component; 300. a limiting component; 302. a chip placement area; 304. a pin placement area; 306. a plastic package body placement area; 308. a test well; 310. a ground hole; 312. a positioning pin hole; 314. an opening; 400. testing the probe; 402. a first test probe; 404. a second test probe; 500. and (4) a target chip.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

As shown in fig. 1 and fig. 2, in one embodiment, a test fixture is provided for kelvin testing a target chip, the test fixture includes:

the bearing device comprises a bearing base 100, wherein a groove 102 is formed in the bearing base 100;

a resilient member 200, said resilient member 200 being secured within said recess 102;

the limiting assembly 300 is detachably mounted in the groove 102, when the limiting assembly 300 is disposed in the groove 102, the limiting assembly 300 is located on the elastic assembly 200, a chip placement area 302 for accommodating the target chip is disposed on a first surface of the limiting assembly 300, and the depth of the chip placement area 302 is smaller than the thickness of the limiting assembly 300;

wherein the first surface is a surface of the limiting component 300 away from the groove 102.

In one embodiment, the chip placement area 302 includes 2 rectangular pin placement areas 304 and 1 plastic package placement area 306 located between the 2 pin placement areas 304, the pin placement area 304 defines a test hole 308 penetrating the position limiting assembly 300, and the plastic package placement area 306 defines a ground hole 310 penetrating the position limiting assembly 300.

When kelvin testing of the target chip is performed, the test holes 308 may be used to connect to pins of the target chip placed in the chip placement area 302, and the ground holes 310 may be used to connect to a plastic package of the target chip placed in the chip placement area 302.

In one embodiment, the plastic package placing region 306 is provided with three rows and two columns of grounding holes 310, the distance between two adjacent rows of grounding holes 310 is the same, and the distance between the grounding holes can be adjusted according to actual needs in practical application.

In one embodiment, the pin placement regions 304 are respectively provided with four rows and two columns of test holes 308, the distances between two adjacent rows of test holes 308 are the same, and when a kelvin test of a target chip is performed, each row of test holes 308 is connected with one pin of the target chip placed in the chip placement region 302. In practical applications, the distance between the test holes 308 can be adjusted according to practical requirements, as long as the connection with one pin of the target chip placed in the chip placement region 302 through one row of test holes 308 can be satisfied.

In one embodiment, a test carrying region 104 is disposed in the groove 102 and opposite to the chip placing region 302, the test carrying region 104 includes a pin carrying region 106 matching with the pin placing region 304 and a plastic package carrying region 108 matching with the plastic package placing region 306, wherein a test pin hole 110 corresponding to the test hole 308 is formed at the bottom of the pin carrying region 106, and a ground pin hole 112 corresponding to the ground hole 310 is formed at the bottom of the plastic package carrying region 108.

In one embodiment, a positioning pin 114 is disposed in the groove 102, a positioning pin hole 312 corresponding to the positioning pin 114 is disposed on the position limiting assembly 300, and the positioning pin 114 and the positioning pin hole 312 are used for positioning the position limiting assembly 300 and the bearing base 100.

The primary positioning between the limiting component 300 and the bearing base 100 can be realized through the positioning pin 114 and the positioning pin hole 312, and then the limiting component 300 is installed on the preset position of the bearing base 100, so that the calibration time of the limiting component 300 in the bearing base 100 is shortened, and the calibration efficiency is improved.

In one embodiment, as shown in fig. 1, 2 positioning pins 114 are disposed in the groove 102, and the centers of the positioning pins 114 and the groove 102 are on the same line. The positioning is more accurate, and the influence of the deformation of the limiting part 300 on the positioning is avoided.

In one embodiment, 2 positioning pins 114 are disposed in the groove 102, the positioning pins 114 are respectively located at two opposite or adjacent sides of the groove 102, and 2 positioning pin holes 312 corresponding to the positioning pins 114 are formed on the opposite limiting assembly 300. The positioning pins 114 are positioned adjacent or opposite sides of the recess 102 to provide more accurate preliminary positioning. In other embodiments, the number of the positioning pins 114 can be set according to actual needs, for example, the number of the positioning pins 114 can be 3, 4, 5, and so on.

In one embodiment, the resilient members 200 are symmetrically disposed at the corners of the recess 102.

As shown in fig. 1, in one embodiment, the recess 102 is a rectangular recess, and the elastic members 200 are disposed at four corners of the rectangular recess 102. In other embodiments, the elastic member 200 is disposed at the center of four sides of the rectangular recess 102, and the rectangular recess 102 is symmetrical with respect to a line connecting the elastic members 200 on the opposite two sides. The distance between the limiting component 300 and the groove 102 is variable through the elastic component 200, namely, the movable connection between the limiting component 300 and the groove 102 is realized, when a target chip placed in the chip placing area 302 is pressed, the deformation of the elastic component is larger than that of the target chip, the elastic component 200 is deformed by the pressure towards the groove 102, the target chip is protected in a buffering mode, and the risk that pins of the target chip are bent due to uneven or overlarge stress is reduced.

In one embodiment, the resilient member 200 is a spring.

In one embodiment, the stop assembly 300 is made of an insulating wear-resistant material.

In one embodiment, the four walls of the chip placement area 302 have a chamfered design. The target chip is conveniently placed in the chip placing area 302, and the target chip is secondarily positioned in the chip placing area 302, so that the position deviation of the target chip in the chip placing area 302 is reduced.

In one embodiment, the chamfer is 0.75. In other embodiments, the size of the chamfer is set according to actual needs, such as 0.5, 0.6, 0.7, and so on.

In one embodiment, the first surface of the position-limiting component 300 is provided with an opening 314 that is symmetrical with respect to the center of the position-limiting component 100, the bearing base 100 is provided with a mounting hole 116 corresponding to the opening, and the opening 314 and the mounting hole 116 are used for realizing the connection between the position-limiting component 100 and the bearing base 300.

The opening 314 is a non-through opening, after the positioning of the limiting component 100 and the bearing base 300 is performed, the limiting component 100 is arranged in the groove 102 through a screw passing through the opening 314 and the mounting hole 116, the plane of the screw is lower than the first surface, when a chip placed in the chip placement region 302 is pressed, the elastic component 200 is deformed under the pressure towards the groove 102, the limiting component 100 moves towards the inside of the groove 102, and after the pressing is completed, the elastic component returns to the original state, and the limiting component 100 returns to the mounting position.

In one embodiment, the openings 314 are formed at the edge of two opposite sides of the position-limiting assembly, and the openings 314 penetrate the edge of the position-limiting assembly 100.

In one embodiment, the opening 314 opens out of the registration pin hole 312.

In one embodiment, the opening 314 is opened at a corner of the position limiting assembly 100. In other embodiments, the opening 314 is opened at different positions on the position limiting assembly 100 except for the chip placement area 302 according to actual needs.

In one embodiment, the difference between the size of the chip placement area 302 and the size of the target chip is no greater than 0.04 mm. After the target chip is placed in the chip placement area 302, the redundant positioning deviation of 0.04 mm is only left at most at all, so that when the target chip is pressed, each pin of the target chip can be in good Kelvin contact with two spring probes at the same time, the accuracy and stability of the test are improved, and the one-time passing rate of the production test is improved.

In one embodiment, a test apparatus for kelvin testing a target chip is provided, which includes the test fixture described in any one of the above.

As shown in fig. 3, in one embodiment, the testing apparatus further includes a plurality of sets of testing probes 400 for kelvin testing, the testing probes 400 being located in the chip placement area;

each group of the test probes 400 is arranged corresponding to one pin of the target chip 500, and the distances between the same group of the test probes 400 and the second surface of the limiting component are different;

the second surface of the limiting assembly is opposite to the first surface.

Each group of test probes 400 includes a first test probe 402 and a second test probe 404, the first test probe 402 and the second test probe 404 contact with the same pin of the target chip 500 for implementing kelvin testing of the target chip, and contact points of the first test probe 402 and the second test probe 404 with the pin are not on the same plane. When the target chip is placed in the chip test area, the first test probe 402 and the second test probe 404 on different surfaces perform the purpose of secondary positioning on the target chip, thereby achieving the purpose of completing good kelvin contact.

In one embodiment, the first test probe 402 is in contact with the end of the target chip pin, i.e. the pin position far away from the target chip package body, and the second test probe 404 is in contact with the corner position of the target chip pin.

In one embodiment, the test apparatus includes 8 sets of test probes.

In one embodiment, the test equipment further includes a ground probe, the ground probe is located in the chip placement region, and the ground probe is in contact with a plastic package body of a target chip placed in the chip placement region, so as to realize grounding of the plastic package body of the target chip.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A test fixture is used for Kelvin test of a target chip, and comprises:

the bearing base is provided with a groove;

the elastic component is fixed in the groove;

2. The test fixture of claim 1, wherein the chip placement regions comprise 2 rectangular pin placement regions and 1 plastic package placement region located between the 2 pin placement regions, the pin placement regions are provided with test holes penetrating the limiting assemblies, and the plastic package placement regions are provided with grounding holes penetrating the limiting assemblies.

3. The test fixture of claim 1, wherein a positioning pin is disposed in the groove, a positioning pin hole corresponding to the positioning pin is disposed on the position limiting component, and the positioning pin hole are used for positioning the position limiting component and the bearing base.

4. The test fixture of claim 1, wherein the elastic elements are symmetrically disposed at corners of the recess.

5. The testing fixture of claim 1, wherein the first surface of the limiting component is provided with an opening that is symmetrical with respect to the center of the limiting component, the bearing base is provided with a mounting hole corresponding to the opening, and the opening and the mounting hole are used for realizing connection between the limiting component and the bearing base.

6. The test fixture of claim 1, wherein the limiting component is made of an insulating wear-resistant material.

7. The test fixture of claim 1, wherein the four walls of the chip placement area have a chamfered design.

8. The test fixture of claim 1, wherein a difference between a size of the chip placement area and a size of the target chip is not greater than 0.04 mm.

9. A test apparatus for kelvin testing a target chip, comprising the test fixture of any one of claims 1-8.

10. The test apparatus of claim 9, further comprising a plurality of sets of test probes for kelvin testing, the test probes located at the chip placement area;

the second surface of the limiting assembly is opposite to the first surface.