JP2020095002A - Probe unit - Google Patents

Abstract

To provide an inexpensive probe unit, even when the number of stages in a grid array increases, implementing highly-precise probe connection particularly to a bump terminal array, suppressing generation of metal powder, etc., and damage, deformation, etc. of terminals, and having excellent durability.SOLUTION: A probe unit comprised of probe array sheets each including a plurality of probes disposed thereon, a relay pad sheet including a plurality of conductive pads disposed on an insulating sheet, and means for aligning and fixing the probe array sheets and the relay pad sheet, where parts or all of the conductive pads electrically and independently come into contact with parts or all of tip ends of the probe group. The probe unit comprises electric conduction means that can conduct from an opposite surface of the relay pad sheet via the conductive pads, and positioning means for positioning the conductive pads in the relay pad sheet and the probe tip ends.SELECTED DRAWING: Figure 6

Description

The present invention is a probe unit used for circuit inspection of a plurality of semiconductor chips formed on a semiconductor wafer or circuit inspection of an IC package mounting the semiconductor chips, and particularly, a narrow-pitch grid-like terminal array is formed. The present invention relates to inspection of semiconductor chips or IC packages.

2. Description of the Related Art A probe card used for inspection of a semiconductor circuit is required to have a high density probe array to cope with an increase in the number of terminal pads on a semiconductor chip, a reduction in pad area, and a reduction in pitch between pads. For the purpose of improving device characteristics, reducing power consumption, and saving space, a technique for three-dimensionally mounting a plurality of IC chips by using silicon through electrodes has been developed. The three-dimensional mounting IC is characterized by a narrow pitch grid array of 40 μm pitch level, which makes the array of probes difficult.

On the other hand, also in a wafer level package (WLP) in which a semiconductor chip having a narrow pitch grid-like array terminal is mounted, miniaturization is required as the number of pins and the pitch of the semiconductor chip terminal are increased. The semiconductor chip mounting side of the package naturally has the same terminal arrangement as that of the mounted semiconductor chips. Therefore, even in the continuity inspection of the IC package and the like, a high-density probe array equivalent to that for semiconductor chip inspection is required.

Further, the contact of the probe with the semiconductor chip terminal or the IC package terminal often causes generation of metal powder or the like, damage of the terminal, deformation of the bump terminal, or the like. Therefore, highly accurate control of the probe operation is essential.

As an efficient probe assembly method for a narrow pitch pad arrangement, for example, as disclosed in Japanese Patent Laid-Open No. 2016-206160, a plurality of probes are collectively microfabricated from a conductive metal foil in manufacturing a probe. A probe assembly in which the same is attached to an insulating sheet and arranged on the same plane, and the distance between the tips of the probe vertical portions of the probe assembly is the same as any of the pad intervals in the inspection pad row. All of the probe contours in the assembly have a means for working continuously from one conductive metal foil.

JP, 2016-206160, A

However, according to the method disclosed in Japanese Unexamined Patent Publication No. 2016-206160, the number of sheet-shaped probe aggregates has to be increased as the number of stages in the grid-like array increases, and the number of sheets is increased as the number of sheets is increased. Since it takes time to position the probe tip in one direction and variations in the tip position are likely to increase, the probe contact yield with respect to the bump terminal is particularly reduced, and problems of higher cost and longer delivery time arise.

The present invention has been made in order to solve the problems in the above probe array, etc., even when the number of steps in the grid array is increased, realizes highly accurate probe connection especially to the bump terminal array, and the metal powder etc. It is intended to provide an inexpensive probe unit having excellent durability by suppressing generation, damage and deformation of terminals.

The present invention is a probe unit comprising a probe array sheet having a plurality of probes arranged thereon, a relay pad sheet having a plurality of conductive pads arranged on an insulating sheet, and means for aligning and fixing the probe array sheet and the relay pad sheet. And some or all of the conductive pads electrically and independently contact some or all of the tips of the probe group, and conduct from the opposite surface of the relay pad sheet through the conductive pads. The number of steps in the grid-like array is increased because it has an electrically conducting means that enables it and a means for inspecting the conductive pad on the side opposite to the probe tip end by contacting the circuit terminal to be inspected in the relay pad sheet. Even in this case, one relay pad sheet enables the bumps and the probes to come into contact with each other with high accuracy.

In addition, a part of or the entire circumference of the outer peripheral portion of one surface or both surfaces of one conductive pad and a means for fixing an insulating material forming the insulating sheet between the adjacent conductive pads are provided. It is possible to prevent the conductive pad from being damaged or separated by the probe operation while maintaining the electrical insulation of the conductive pad.

In addition, when the conductive pad and the probe tip portion are in contact with each other, there is no slip (scrub operation amount) in the XY plane of the probe tip portion with respect to the conductive pad, or the probe tip portion. A load in the Z direction is applied between the probe and the conductive pad, and all the probe tips and the conductive pads are in contact with each other, the conductive sheet on the side opposite to the probe tip with respect to the insulating sheet. Since there is a means for inspecting the conductive pad with the circuit terminal to be inspected, static friction between the probe tip and the conductive pad causes slipping or non-contact between the probe tip and the conductive pad. Therefore, it is possible to perform stable and durable inspection.

Further, since the linear expansion coefficient of the relay pad sheet is close to the linear expansion coefficient of the semiconductor wafer to be inspected, it is possible to realize stable terminal contact over a wide range of inspection temperatures.

Further, in the relay pad sheet, a means for simultaneously contacting two adjacent conductive pads with one circuit terminal to be inspected and electrically isolating the respective probes connected to the two conductive pads. Therefore, it is possible to perform highly accurate resistance measurement by the 4-terminal method.

In addition, a slit is provided in all of the probe array sheet surfaces that are configured, and a thin plate-shaped positioning device that can penetrate all the slits in the direction orthogonal to the probe array sheet surface (YZ plane) is installed, A plurality of step-like steps having a vertical surface and a horizontal plane are continuously provided on the upper side of the positioning device in the Z direction, and the upper side of the slit in any of the probe array sheets is arranged on one of the step horizontal planes, and then the probe array sheet Since there is a means for closely contacting a part of the surface with the step vertical surface, it is possible to easily and surely position the conductive pad and the probe tip in the Y direction.

In addition, a conductive sheet of the same or similar metal material as the conductive pad on the same surface as or a continuous surface of the conductive pad on the relay pad sheet, the same or similar thickness as the conductive pad. Now, the positioning device is arranged electrically independently of a part or all of the conductive pad, and the positioning device is continuously formed on the conductive sheet of the relay pad sheet, and the bending process of the relay pad sheet is performed. By arranging the probe array sheet along the direction perpendicular to the probe array sheet surface (XZ plane), more accurate positioning can be easily realized.

According to the probe unit of the present invention, even when the number of steps in the grid-like array is increased, a highly accurate probe connection is realized particularly for the bump terminal array, and the generation of metal powder or the like and the damage or deformation of the terminal are suppressed. It is possible to provide an inexpensive probe unit having excellent durability.

It is a perspective view showing the basic composition of the probe unit by the present invention. FIG. 4 is a cross-sectional view showing details of a probe unit according to the present invention. It is a figure explaining the detail of the relay pad sheet by this invention. It is a figure explaining the detail of the relay pad sheet by this invention. FIG. 6 is a cross-sectional view illustrating a probe operation including the relay pad sheet according to the present invention. It is a perspective view of a probe unit explaining a positioning means by the present invention. It is a figure explaining the detail of the positioning means by this invention. It is a figure explaining the detail of the positioning device by this invention. It is a figure explaining the confirmation means of the probe assembly position by this invention.

Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view showing the basic configuration of a probe unit according to the present invention. In the probe unit 1, 10 is a probe array formed on the XY plane, and a plurality of probes 13 are provided on the insulating sheet 12 so as to precisely contact the positions of all the bump arrays 40 of the circuit under test 4. Is arranged in the Y direction by arranging a plurality of probe array sheets 11 aligned in the X direction.

Further, in the probe array sheet 11, a wiring pattern 14 is continuously wired from each of the probes 13 and connected to a predetermined circuit terminal (not shown). Further, a dummy pattern 15 formed of the same metal as the probe 13 and the wiring pattern 14 is provided on the insulating sheet 12 of the probe array sheet 11 in order to maintain mechanical strength.

On the other hand, 20 is a relay pad sheet formed on the insulating sheet 21, and is provided with a plurality of conductive pads 22 in which the X-direction positional relationship and the Y-direction positional relationship of the tip portion of the probe 13 are aligned. However, the relay pad sheet 20 can be electrically connected from both sides. Further, the conductive pad 22 of the relay pad sheet 20 is brought into contact with all the probes 13 of interest to enable electrical conduction from the wiring pattern 14 to the conductive pad 22.

In addition, a conductive sheet 23 for maintaining mechanical strength is provided on the same surface as the conductive pad 22 on the relay pad sheet 20 with the same or similar thickness as the conductive pad 22. It is arranged to be electrically independent of some or all of the conductive pads 22.

Further, a fixture 31 for aligning and fixing the probe array sheet 11 and the relay pad sheet 20 and a positioning device 32 for mainly positioning in the Y direction are installed.

2, the configuration of the probe unit near the relay pad sheet 20 will be described in detail. FIG. 2A shows an example in which the probes 13 in the probe array sheet 11 and the conductive pads 22 in the relay pad sheet 20 correspond to the bumps 41 in a one-to-one correspondence. FIG.

In FIG. 2A, 22-1 to 22-4 are a part of the conductive pad group in the relay pad sheet 20, and the probes 13-1 to 13-4 in the probe 13 and the inspected object. The bumps 41-1 to 41-4 in the bump array 40 on the circuit 4 correspond independently. On the other hand, an insulating material 211 constituting the insulating sheet 21 is bonded or filled between a part of both surfaces of the conductive pads 22-1 to 22-4 and between the conductive pads. As a result, the conductive pads 22 are mechanically held by the insulating sheet 21, and electrical insulation between the conductive pads is secured.

FIG. 2B is a cross-sectional view showing an example in which two probes 13 and two conductive pads 22 correspond to one bump 41 in order to realize the measurement by the four-terminal connection method. Is.

In FIG. 2B, 22-1a and 22-1b to 22-4a and 22-4b are a part of the conductive pad group in the relay pad sheet 20, and are the probe 13-1a and the probe 13-1a in the probe 13. 13-1b to 13-4a and 13-4b are independently connected, the conductive pads 22-1a and 22-1b are the bumps 41-1 and the conductive pads 22-2a and 22-2b are the bumps. 41-2, the conductive pads 22-3a and 22-3b are in contact with the bump 41-3, and the conductive pads 22-4a and 22-4b are in contact with the bump 41-4.

On the other hand, the insulating material 211 constituting the insulating sheet 21 is bonded or bonded between a part of both surfaces of the conductive pads 22-1a and 22-1b to 22-4a and 22-4b and between the conductive pads. It is filled. As a result, the conductive pad 22 is mechanically held by the insulating sheet 21, and electrical insulation between the conductive pads is secured.

The structure of the relay pad sheet 20 will be described in detail with reference to FIGS. 3 and 4. FIG. 3 is a structural example of the relay pad sheet 20 in which the probe 13 and the conductive pad 22 correspond to the bumps 41 corresponding to FIG. Show. In FIG. 3, the conductive pad 221 has a hexagonal shape as shown in the right half of the cross section B1-B1, and the conductive pads adjacent to each other are separated by a slit 26. The insulating material 211 is filled. In this figure, the shape of the conductive pads 221 is hexagonal as an example to correspond to the arrangement in which the bump arrangements 40 are alternately shifted for each row, that is, a so-called staggered arrangement. It is not limited to hexagons.

On the upper side (circuit side to be inspected) of the relay pad sheet 20, a contact portion between the bump 41 and the conductive pad 221 is provided so as to make electrical contact with the bump 41 of the circuit to be inspected 4. An insulating material 212 is fixed to the outer peripheral portion of the conductive pad 221 other than the conductive pad 221. As shown in the left half of the cross section B1-B1, a circular pad exposed portion 241 is formed for connection with the bump 41 having a substantially spherical shape. This allows the bumps 41-1 to 41-4 to come into contact with the conductive pads 221-1 to 221-4, respectively, as shown by the cross section A1-A1.

On the other hand, on the lower side (probe side) of the relay pad sheet 20, the conductive pad except the contact portion between the probe 13 and the conductive pad 221 in order to enable the electrical contact with the probe 13. An insulating material 213 is fixed to the outer peripheral portion of 221. As shown in the left half of the cross section C1-C1, a pad exposed portion 242 is formed for connection with the probe 13. In the example of this figure, like the pad exposed portion 241, it has a circular exposed shape.

In this way, the slits 26 are filled with the insulating material 211, and the insulating materials 212 and 213 are fixed to the outer peripheral portion of the conductive pads 221, so that all the conductive pads 221 are covered with the insulating material 211. The pad non-exposed portions 251 and 252 covered with the insulating materials 212 and 213 are mechanically held and electrically insulated. Thereby, even when the contact force from the upper side of the relay pad sheet 20 with the 41 bumps and the contact force from the lower side with the probe 13 are repeatedly applied, sufficient strength can be maintained.

FIG. 4 shows an example of the structure of the relay pad sheet 20 in which two probes 13 and two conductive pads 22 correspond to one bump 41 corresponding to FIG. 2B. 4, as shown in the right half of the cross section B2-B2 of the conductive pad 222, the central portion of the hexagonal shape of the conductive pad 221 in FIG. 3 is separated by a slit 26, and the conductive pads 222a and 222b. It is separated into Further, each slit 26 is filled with an insulating material 211.

On the upper side (the circuit side to be inspected) of the relay pad sheet 20, the bump 41 and the conductive pads 222a and 222b are brought into contact with each other so that the bump 41 of the circuit to be inspected 4 can be electrically contacted. The insulating material 212 is fixed to the outer peripheral portions of the conductive pads 222a and 222b excluding the portions. As shown in the left half of the cross section B1-B1, a circular pad exposed portion 243 is formed for connection with the substantially spherical bump 41. This allows the bumps 41-1 to 41-4 to come into contact with the conductive pads 222-1a and 222-1b to 222-4a and 222-4b, as shown by a section A2-A2.

On the other hand, on the lower side (probe side) of the relay pad sheet 20, the conductive pads 222a and 222b independently enable the probes 13a, 13b and the probes 13a, 13b and The insulating material 213 is fixed to the outer peripheral portions of the conductive pads 222a and 222b except for the contact portions with the conductive pads 222a and 222b. As shown in the left half of the cross section C2-C2, a pad exposed portion 244 is formed for connection with the probes 13a and 13b. As a result, as shown in the cross section A2-A2, the probes 13-1a and 13-1b to 13-4a and 13-4b are connected to the conductive pads 222-1a and 222-1b to 222-4a and 222-, respectively. 4b can be contacted.

As described above, the slits 26 are filled with the insulating material 211 and the insulating materials 212 and 213 are fixed to the outer peripheral portions of the conductive pads 222a and 222b, so that all the conductive pads 22 are insulated. The material 211 and the pad non-exposed portions 253 and 254 covered with the insulating materials 212 and 213 are mechanically held and electrically insulated. Thereby, even when the contact force from the upper side of the relay pad sheet 20 with the 41 bumps and the contact force from the lower side with the probe 13 are repeatedly applied, sufficient strength can be maintained.

In the relay pad sheet 20 described above, the conductive pads 22 can be collectively processed into a pad shape by electroforming, etching, or laser processing using the conductive sheet 23 as a base material. Further, the insulating materials 212 and 213 include a method of attaching a conductor to a conductor after processing a necessary outer shape, a method of applying liquid polyimide, or the like.

FIG. 5 illustrates an operation of inspecting the probe array 10 by bringing the probe array 10 into contact with the bump array 40 of the circuit under test 4. FIGS. 5A to 5D explain the operation sequence when the probe 13 and the conductive pad 22 correspond to two bumps 41 each illustrated in FIG. ..

FIG. 5A shows the state before connecting the relay pad sheet 20 and the probe array 10. In the probe array 10, the position of the probe tip portion 132 in the height direction (Z direction) generally varies. The maximum height variation in the probe sequence was set as Δhp.

FIG. 5B shows a contact operation between the relay pad sheet 20 and the probe 13 in the probe array 10. That is, the probe (13-1b in this figure) having the highest height of the probe tip portion 132 shown in FIG. 5A is the conductive pad (22-1b in this figure) in the relay pad sheet 20. ) Is started, and the probe (13-2a in the figure) having the lowest height of the probe tip portion 132 contacts the conductive pad (22-2a in the figure) in the relay pad sheet 20. Up to this point, a load is applied between the relay pad sheet 20 and the probe array 10.

FIG. 5C shows a state in which the relay pad sheet 20 and all the probes 13 in the probe array 10 are connected, and the relay pad sheet 20 and the bump array 40 are connected. It shows the previous state. Also in the bump arrangement 40, it is general that there are variations in the position in the height direction (Z direction). The maximum height variation in the bump arrangement 40 was set to Δhb.

FIG. 5D shows a state in which the relay pad sheet 20 and all the bumps 41 in the bump array 40 are connected. That is, the bump having the lowest height (41-1 in this figure) of the bump 41 shown in FIG. 5C is the conductive pad (22-1a, 22-1 in this figure) in the relay pad sheet 20. -1b) until contact with the conductive pad (22-2a, 22-2b in the figure) of the bump 41 having the lowest height (41-2 in the figure). The inspection is started with a load applied in the Z direction between the relay pad sheet 20 and the relay pad sheet 20.

Since the insulating sheet 21 that holds the conductive pad 22 in the relay pad sheet 20 is made of a resin such as polyimide or a thin sheet structure, it absorbs the height variation Δhb of the bump array 40 and deforms the probe. Due to the spring deformation of the portion 133, an appropriate and uniform contact force to the bump array 40 can be held and secured, so that highly accurate contact is possible and it is advantageous for contacting a spherical terminal such as a bump. ..

Generally, if the lateral sliding motion (scrub motion) of the probe is large, damage to the pad to be contacted, wear of the probe tip, metal powder etc. due to damage or wear will occur, and durability will deteriorate. The problem arises. By determining the shape of the probe deforming portion 133 so that the slip (scrub operation amount) of the probe vertical portion 131 and the probe tip portion 132 in the X direction or the Y direction is minimized, the probe tip portion 132 and the conductive portion There is no relative slippage with the property pad 22, and a configuration in which dust such as metal powder is unlikely to occur is possible.

Further, since all the probe tips 132 and the conductive pads 22 are in contact with each other, the procedure depends on the bump 41 to be inspected. Static friction force is always applied, and even a probe having a scrubbing operation can be inspected without relative slip between the probe tip portion 132 and the conductive pad 22.

Further, since the relay pad sheet 20 is interposed, the bump terminals to be inspected are not damaged by contacting the bumps 41, and the bump terminals are always pressed by the surface of the conductive pad 22. And it is possible to minimize deformation.

FIG. 5 illustrates an operation for performing an inspection by a so-called four-terminal method (or Kelvin method), in which two probes are brought into contact with bump terminals of one circuit to be inspected to measure the resistance value of the circuit with high accuracy. It is a thing. Since two probes are brought into contact with one circuit terminal to be inspected, a probe configuration with a narrower pitch is required, which is very difficult especially for a grid array terminal. As described with reference to FIG. 5, the relay conductive pads 22-1 contacted by the probes 13-1a and 13-1b are divided into 22-1a and 22-1b, respectively, and thus electrically independent. It is a thing. On the other hand, the conductive pads 22-1a and 22-1b can simultaneously contact the bumps 41-1 of the circuit under test 4. In this way, according to the present invention, it is possible to deal with the inspection by the 4-terminal method even for the circuit terminals to be inspected with a narrow pitch.

6 to 9, the positioning means for positioning the conductive pad and the probe tip will be described.

FIG. 6 is a perspective view showing the configuration of the probe unit 1 including the positioning means. The probe unit 1 is configured by arranging a plurality of the probe array sheets 11 in which a plurality of the probes 13 are aligned in the X direction on the insulating sheet 12 in the Y direction. Further, the dummy pattern 15 is provided on the insulating sheet 12 of the probe array sheet 11 in order to maintain mechanical strength.

The relay pad sheet 20 has a plurality of the conductive pads 22 arranged such that the X-direction positional relationship and the Y-direction positional relationship of the probe tip portion 132 of the probe 13 are aligned, and the relay pad sheet 20 is provided. It is possible to connect from both sides. In addition, a conductive sheet 23 for maintaining mechanical strength is provided on the same surface as the conductive pad 22 on the relay pad sheet 20 with the same or similar thickness as the conductive pad 22. It is arranged to be electrically independent of some or all of the conductive pads 22.

Further, the fixture 31 for determining the X direction positions of the probe array sheet 11 and the relay pad sheet 20 and the positioning device 32 for determining the Y direction positions are installed. In the fixing tool 31 and the positioning device 32, the conductive sheet 23 includes an upper conductive sheet 231 and side conductive sheets 232 and 233. The conductive sheets 232 and 233 include the fixing tool 31 and the fixing sheet 31. It has a function of holding the positioning device 32.

FIG. 7 illustrates in detail the first embodiment of the positioning means for positioning the conductive pad and the probe tip. FIG. 7 shows an example in which the probe array sheets 11-1 to 11-5 are arranged so as to match the array of the conductive pads 222 in the relay pad sheet 20. As shown in the figure, the conductive pads 222 are arranged at intervals of X _{1 to} X ₃ in the X direction and at intervals of Y ₁ to Y _{4 in} the Y direction, respectively, while the probe array sheets 11-1 to 11- are arranged. All five probe tips 132 must match the placement of the conductive pads 222.

The fixture 31 is mainly for determining the X-direction positions of the probe array sheet 11 and the relay pad sheet 20, and the conductive sheets 232 and 233 have the first conductivity of the conductive pad 222. The pads 222-1 are installed with high accuracy so that the X-direction distance is X ₀ . On the other hand, the probe array sheets 11-1 to 11-5 are commonly provided with reference holes 16 on the dummy pattern 15, and the first probe of each of the probe array sheets 11-1 to 11-5 is provided. The tip portion 132-1 and the reference hole 16 are installed with high accuracy in at least the X direction so that the distance in the X direction between them is X ₀ . By penetrating the fixture 31 through the reference hole 16, the X-direction positions of all the probe tip portions 132 of the probe array sheets 11-1 to 11-5 are determined.

The fixture 31 is also effective as a common fixing means with an external housing (not shown).

The positioning device 32 is mainly for determining the mutual position of the conductive pad and the probe tip in the Y direction, and is a direction (Y) orthogonal to the plane (XZ plane) of the probe array sheet. -Z plane) has a thin plate-like shape having a length sufficient to penetrate all the probe array sheets, and is installed at a distance of Z ₀ from the conductive pad 222 in the Z direction. Further, a horizontal step surface 321 and a vertical step wall 322 are provided in the upper part of the positioning device 32 in the Z direction, and a plurality of step-like steps having a Z direction step distance of s ₁ to s ₅ are continuously formed. Are provided.

On the other hand, reference holes 17 through which the positioning device 32 can penetrate are provided on the dummy patterns 15 of the probe array sheets 11-1 to 11-5. The upper side 171 of the reference hole 17 is placed on the one step surface 321 of the positioning device 32, and the surface of the dummy pattern 15 near the reference hole 17 is brought into close contact with the step wall 322. The Y-direction position of the target probe array sheet 11 is determined.

For example, the upper side 171 of the reference hole 17-1 installed in the probe array sheet 11-1 is placed on the first step surface 321-1 and brought into close contact with the first step wall 322-1. The Y direction position of the probe array sheet 11-1 is determined. Here, the position of the step wall 322-1 is determined so that the Y-direction distance of the probe tip portion 132 of the probe array sheet 11-1 from the conductive sheet 232 is Y ₀ .

Similarly, the upper side 171 of the reference hole 17-2 installed in the probe array sheet 11-2 is placed on the second step surface 321-2 and is in close contact with the second step wall 322-2. As a result, the position of the probe array sheet 11-2 in the Y direction is determined. At this time, in order to make the Z direction positions of the probe tip portions 132 of the probe array sheets 11-1 and 11-2 the same, the Z direction position of the upper side 171 of the reference hole 17-2 is set to the first direction. The step surface 321-1 and the second step surface 321-2 are installed at positions shifted in the Z direction by a step distance s _{2 in} the Z direction between the step surface 321-1 and the second step surface 321-2. The same applies to the method of installing the reference holes 17-3 to 17-5 of the probe array sheets 11-3 to 11-5.

FIG. 8 illustrates a second embodiment of the positioning device 32. In FIG. 8, the probe array sheets 11-1 and 11-2 are on the first step surface 321-1, and the probe array sheets 11-3 and 11-4 are on the second step surface 321-2. The sheets 11-5 and 11-6 are placed on the third step surface 321-3, and the probe array sheets 11-7 and 11-8 are placed on the fourth step surface 321-4. Here, by providing each of the step surfaces 321 with the V groove 323 having a size into which the upper side 171 of the reference hole 17 can be inserted, the probe array sheet 11 can be positioned more reliably. .. The step walls 322-1 to 322-4 have an effect of a general positioning guide when the respective probe array sheets 11 are installed.

In addition, although the example in which the fourth step surface 321-4 is installed on the same plane as the first step surface 321-1 is shown, the number of inserted sheets can be changed by periodically changing the step surface. Is established, and there is an effect of preventing erroneous insertion of the probe array sheets 11-1 to 11-6 or subsequent erroneous insertion of the probe array sheets 11-7 and 11-8.

FIG. 9 illustrates means for confirming the position of the probe array sheet 11 after assembly. In FIG. 9, 13-r is a dummy probe installed at a distance of Xr in the X direction from the first probe 13-1 of the probe array sheet 11-1, and the same is true of the probe array sheet 11-4. It is installed in. 271 is an opening hole installed on the relay pad sheet 20 at a position corresponding to the XY coordinates of the tip of the dummy probe 13-r of the probe array sheet 11-1, and 272 is the probe array. It is an opening hole installed on the relay pad sheet 20 at a position corresponding to the XY coordinates of the tip portion of the dummy probe 13-r of the sheet 11-4. Reference numeral 324 denotes a dummy bar installed in the positioning device 32 and extending in the Z direction. An opening hole 273 is installed on the relay pad sheet 20 at a position corresponding to the XY coordinates of the tip of the dummy bar 324. ing.

By visually or visualizing the tip positions of the dummy probes 13-r and the dummy bars 324 during assembly, it is possible to determine whether or not the probe array sheet 11 is installed at the correct position. By installing the dummy probe 13-r or the dummy bar 324 on a plurality of arbitrary probe array sheets 11 or the positioning device 32, the relative position between the probe 13 and the conductive pad 22 can be accurately determined. ..

As described above, according to the present invention, even when the number of steps in the grid-like array is increased, it is possible to realize highly accurate probe connection especially to the bump terminal array, and to prevent generation of metal powder or the like, damage or deformation of the terminal, etc. Since it is suppressed, it is possible to provide an inexpensive probe unit having excellent durability.

In particular, it can be used as a probe unit used for electrical inspection of a semiconductor and a semiconductor package having a lattice-shaped multi-pin narrow-pitch inspection terminal, or as a connecting device for a semiconductor having a lattice-shaped multi-pin narrow-pitch inspection terminal. it can.

DESCRIPTION OF SYMBOLS 1 probe unit 10 probe arrangement 11 probe arrangement sheet 12 insulating sheet 13 probe 13-r dummy probe 131 probe vertical portion, 132 probe tip portion, 133 probe deforming portion 14 wiring pattern 15 dummy patterns 16, 17 reference hole 20 relay pad sheet 21 Insulating sheets 211, 212, 213 Insulating materials 22, 221, 222 Conductive pads 23, 231, 232, 233 Conductive sheets 24, 241, 242, 243, 244 Pad exposed parts 25, 251, 252, 253, 254 Pad non Exposed part 26 Slits 271, 272, 273 Opening hole 31 Fixing device 32 Positioning device 321 Step surface 322 Step wall 323 V groove 324 Dummy bar 4 Inspected circuit 40 Bump array, 41 bump

Claims (14)

A probe unit comprising a probe array sheet having a plurality of probes arranged thereon, a relay pad sheet having a plurality of conductive pads arranged on an insulating sheet, and a means for aligning and fixing the probe array sheet and the relay pad sheet,
Some or all of the conductive pads electrically and independently contact some or all of the tip portions of the probe group, and enable conduction from the opposite surface of the relay pad sheet via the conductive pads. A probe unit having an electrical conduction means. A conductive sheet of the same or similar metal material as the conductive pad, on the same surface or a continuous surface as the arrangement surface of the conductive pad in the relay pad sheet, with the same or similar thickness as the conductive pad. The probe unit according to claim 1, wherein the probe unit is electrically independent of a part or all of the conductive pad. The probe unit according to claim 1 or 2, wherein the insulating sheet is fixed to one surface or both surfaces of the conductive sheet. An insulating material forming the insulating sheet is fixed between a part or the entire circumference of the outer peripheral portion of one surface or both surfaces of one conductive pad and the adjacent conductive pads. Item 1. The probe unit according to Item 1. 2. The probe unit according to claim 1, wherein in the relay pad sheet, the conductive pad on the side opposite to the probe tip portion is brought into contact with a circuit terminal to be inspected for inspection. In the relay pad sheet, a load in the Z direction is applied between the probe tip and the conductive pad, and the probe tip is in contact with all of the probe tip and the conductive pad. The probe unit according to claim 1, wherein the conductive pad on the opposite side is brought into contact with a circuit terminal to be inspected for inspection. When the probe tip and the conductive pad are in contact with each other, there is no slip (scrub operation amount) in the XY plane of the probe tip with respect to the conductive pad, or it is minute. The probe unit according to claim 1. The probe unit according to claim 1, wherein the linear expansion coefficient of the relay pad sheet is close to the linear expansion coefficient of the semiconductor wafer to be inspected. In the relay pad sheet, two adjacent conductive pads are simultaneously brought into contact with one circuit terminal to be inspected, and the respective probes connected to the two conductive pads are electrically independent. The probe unit according to claim 1. The probe unit according to claim 1, wherein a positioning means for positioning the conductive pad and the probe tip portion in the relay pad sheet is installed. Slits are provided in the surfaces of all the probe array sheets that are configured, and a thin plate-shaped positioning device that can penetrate all the slits is installed in a direction (YZ plane) orthogonal to the probe array sheet surface. A plurality of step-like steps having a vertical surface and a horizontal surface are continuously provided on the upper side in the Z direction of
After arranging the upper side of the slit in any one of the probe array sheets on one of the step horizontal planes, a part of the surface of the probe array sheet and the step vertical surface are brought into close contact with each other, so that the conductive pad and the probe tip part are formed. 11. The probe unit according to claim 10, wherein the probe unit is a positioning means in the Y direction. The probe unit according to claim 10 or 11, wherein a groove into which the upper side of the slit of one of the probe array sheets can be inserted is provided on the step horizontal surface. The positioning device is continuously formed on the conductive sheet of the relay pad sheet, and is installed along the direction perpendicular to the probe array sheet surface (XZ plane) by bending the relay pad sheet. 13. The probe unit according to claim 10, wherein the probe unit is a probe unit. A dummy probe is installed on the same surface as the probe of any of the probe array sheets, and a dummy bar having a Z direction height substantially the same as the lower surface of the relay pad sheet is installed on the Z direction upper part of the positioning device,
Opening holes are provided on the relay pad sheet at positions corresponding to the XY coordinates of the tip center of the dummy probe and at positions corresponding to the XY coordinates of the tip center of the dummy bar, and the tip ends of the dummy probe and the dummy bar. 14. The probe unit according to claim 10, wherein is visible from the upper surface of the relay pad sheet.