KR100291940B1 - Probe card for arranging hollow type probe tip to vertical direction - Google Patents

Abstract

PURPOSE: A probe card for arranging a hollow type probe card to a vertical direction is provided to test the electric characteristic of a testing object such as a semiconductor device by providing elasticity to a probe tip. CONSTITUTION: A guide plate(52) is fixed to a center portion of a lower face of a multi-layer printed circuit substrate(51). A hole(52a) is formed in the guide plate(52). A pogo pin(56) is connected electrically with the multi-layer printed circuit substrate(51) through the hole(52a). A support plate(58) is located in an edge portion of a lower face of the guide plate(52). A relay plate(60) is fixed to the guide plate(52). The relay plate(60) has a contact point(60a) connected with the pogo pin(56). A plurality of hole(60b) is arranged on the relay plate(60). A hollow type auxiliary probe tip(62) is connected with a contact point(60a) formed in the relay plate(60). A fixing plate(66) is fixed by a lower face of the relay plate(60). A plurality of hole(66a) is arranged on the fixing plate(66). An upper portion of a hollow type probe tip(68) is connected with the hollow type auxiliary probe tip(62). A lower portion of the hollow type probe tip(68) is connected with an electrode pad. A reinforcing plate(70) is used for preventing distortion of the guide plate(52), the support plate(58), the fixing plate(66), and the multi-layer printed circuit board(51).

Description

Probe card with vertical hollow probe tip

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card of a probe device for inspecting electrical characteristics of an object under test, such as a semiconductor device.

In the manufacture of semiconductor devices, a plurality of semiconductor devices are formed on a semiconductor wafer by using a precision photograph transfer technique or the like, and are then cut for each device.

In such a semiconductor device manufacturing process, conventionally, the probe device is used to inspect the electrical characteristics of a semi-finished semiconductor device in the state of a semiconductor wafer, and only the product determined as a good result is sent to a post-process such as packaging, for productivity. It is trying to improve.

In this test, a probe tip is brought into contact with an electrode pad of a semiconductor wafer and an electrical property test is performed by a tester through the probe tip.

In recent years, semiconductor devices have become more and more fine, and the degree of integration of circuits is increasing, and the size of electrode pads has been miniaturized, and the spacing of the electrode pads has also become very narrow.

As a result, hundreds of probe tips are required in a limited space of the probe card, and at the same time, a technique is required to ensure that the probe tips accurately and stably contact the center of the electrode pad.

1 is a front view of a conventional probe card, FIG. 2 is a bottom view of FIG. 1, and FIG. 3 is an explanatory view illustrating an operation state of a conventional probe tip.

As shown in the drawing, the probe card 10 includes a printed circuit board 12 having a circuit, a reinforcement plate 14 formed at the center of the upper surface of the printed circuit board 12, and a center of the bottom surface of the printed circuit board 12. The probe tip 16 is composed of a holding plate 18 so that the probe tip 16 is fixed to the holding plate 18 by an insulator (epoxy) 20.

Arrangement of the probe tip 16 fixed as described above, the plurality of probe tips 16 fixed to the fixing plate 18 with the insulator 20 as shown in FIG. Arranged and symmetrical to each other.

In the probe card 10 configured as described above, the structure and arrangement of the probe tip 16 will be described in more detail. The tip of the probe tip 16 may be bent and processed to be in contact with the electrode pad 100 of the semiconductor wafer. The end portion 16a is polished flat by sanding, and fixed to the fixed plate 18 with the insulator 20.

The probe tip 16 as described above is exposed to the conductor portion (that is, from the contact end portion 16a to the portion fixed by the insulator 20) in a long manner, and the inclined portion 16b for forming the contact end portion 16a. The inclination angle of is in a large state. For this reason, the probe card 10 moves up and down (or the semiconductor wafer moves up and down) so that the contact end portion 16a contacts the electrode pad 100 when the contact end portion 16a contacts the electrode pad 100. As the 16a continues to be subjected to repeated pressure, the contact end 16a is pressed against the electrode pad 100 as shown in the virtual line of FIG. Accordingly, when the contact end portion 16a is pressed by the electrode pad 100, the moving range of the electrode pad 100 increases, leaving the center of the electrode pad 100.

For this reason, the contact state with the electrode pad 100 can be improved only when the electrode of the contact end portion 16a is turned on. As the contact end portion 16a has a large slip amount (moving distance) from the electrode pad 100, Considering that the electrode pad 100 deviates much from the center, the diameter of the contact end portion 16a can only be reduced, resulting in poor contact.

In addition, the contact portion 16a is gradually deformed (bending) due to contact with the electrode pad 100 where the conductor end portion 16a has a long contact end portion 16a, so that the center portion of the electrode pad 100 is not stably contacted. As a result, the correction time of the contact end portion 16a can be reached quickly, and it becomes worse due to the deformation of the contact end portion 16a which is continued during use, which significantly affects the yield management of the semiconductor wafer, thereby greatly reducing the productivity. You have a problem.

On the other hand, since the probe tip 16 has an outer diameter of about 250 microns in order to have a predetermined strength in consideration of the long exposed length of the conductor portion, the thickness of the probe tip 16 is larger than that of the electrode pad 100. In the case of a semiconductor wafer in which many electrode pads 100 are densely arranged to have a larger size, the electrode pads 100 cannot be inspected a lot at a time.

Furthermore, in the left and right symmetrical probe tips 16, the inclination of both contact ends 16a has the inclination angle toward the same direction (that is, the direction in which the contact ends 16a arranged on both sides face each other). When sanding is again performed to regenerate the deformed and worn contact end 16a, the center of the contact end 16a is moved in both directions (see the arrow direction in FIG. 1) by the sanded height, thereby forming It does not coincide with the center of the electrode pad 100 disposed so that the contact end portion 16a may be sanded several times and thus may not be reused.

The present invention was devised to solve the problems of the above-described technology, the probe tip in contact with the electrode pad is perpendicular to the electrode pad while the self-elasticity to remove the slip of the probe tip when contacting the electrode pad contact Hollow probe tips vertically arranged to improve contact efficiency with electrode pads repeated by pressure, greatly improving inspection efficiency, and to support probe wafers arranged vertically to cope with highly integrated semiconductor wafers by small diameters The purpose is to provide a probe card.

The present invention to achieve the above object,

A multi-layer printed circuit board connected to the probe device circuit;

A guide plate fixed to a central portion of a lower surface of the multilayer printed circuit board;

Pogo pins (pogopin) is installed through the holes arranged in the guide plate and electrically connected to the multilayer printed circuit board;

A relay plate which is fixed to the guide plate through a lower surface of the support plate and is electrically connected to the pogo pin while maintaining a predetermined space with the guide plate by a support plate positioned through a lower edge of the guide plate;

A hollow auxiliary probe tip arranged vertically through a plurality of perforated holes arranged in correspondence with the coordinates of the electrode pads on the relay plate, and electrically connected to the contacts formed on the relay plate;

A fixed plate fixed through a lower surface of the relay plate;

A hollow probe tip disposed vertically through a plurality of holes drilled in the fixing plate, the upper portion of which is connected to the hollow auxiliary probe tip, and the lower portion of which protrudes from the fixing plate to be in contact with the electrode pad;

The multilayer printed circuit board is fixed to a central portion of the upper surface, characterized in that composed of a reinforcing plate to prevent deformation of the guide plate, support plate, relay plate, fixed plate and the multilayer printed circuit board.

The pogo pin is,

A casing inserted into and fixed to the hole drilled in the guide plate;

Contact pins installed on both sides of the casing to be in contact with the contacts of the multilayer printed circuit board and the contacts of the relay board;

It is installed in the casing and interposed between both contact pins, characterized in that consisting of a spring to increase the contact force of the contact pins.

The hollow probe tip is characterized in that the length of the protruding from the fixing plate is less than 2000㎛.

In the space formed between the guide plate and the relay plate, a plurality of supports are further installed on the guide plate side to prevent deformation due to the contact pressure of the hollow probe tip.

The guide plate, the support plate, the relay plate and the fixing plate are characterized in that the ceramic material or PEEK (Polyethertherketone) material having a bending deformation rigidity and good insulation, chemical resistance, heat resistance.

The reinforcement plate is characterized in that the ceramic material or steel having a structural rigidity.

It is characterized in that the hollow auxiliary probe tip and the hollow and hollow probe tips formed in a single body.

The contact formed on the relay plate to electrically connect the hollow auxiliary probe tip with the pogo pin is characterized in that the copper wire is electrically connected to the contact by wire bonding through the auxiliary contact by '∞'.

1 is a front view of a conventional probe card

2 is a bottom view of FIG. 1.

3 is an explanatory diagram illustrating an operation state of a conventional probe tip;

4 is a front view of the probe card of the present invention;

5 is a bottom view of FIG. 4.

Figure 6 is a bottom view of a probe card of a modified example of the present invention.

Figure 7 is a perspective view of a hollow probe tip installed on the probe card of the present invention.

8 is a bottom view of FIG. 7.

9 is a state diagram of the hollow probe tip shown in FIG.

<Description of the symbols for the main parts of the drawings>

50: probe card 51: multilayer printed circuit board

51a, 60a: contact 52: guide plate

52a, 60b, 66a: hole 54: bolt

56: pogopin 56a: casing

56b, 56c: Contact pin 56d: Spring

58: support plate 60: relay plate

62: hollow auxiliary probe tip 64: copper wire

66: fixed plate 68: hollow probe tip

68a: hollow pin portion 68b, 68c: end

68d: axial elastic pin portion 68e: bone

68f: contact end 70: reinforcement plate

72: support 100: electrode pad

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 4 is a front view of the probe card of the present invention, Figure 5 is a bottom view of Figure 4, Figure 6 is a bottom view of a probe card of a modified example of the present invention, Figure 7 is a hollow type installed in the probe card of the present invention 8 is a perspective view of the probe tip, and FIG. 8 is a bottom view of FIG. 7, and FIG. 9 is a diagram illustrating an operation state of the hollow probe tip illustrated in FIG. 7.

As shown in the drawing, a rectangular guide plate 52 is installed as a fixing means of the bolt 54 toward the center of the lower surface of the multilayer printed circuit board 51 which is connected to the probe device not shown.

The guide plate 52 is provided with pogo pins 56 electrically connected to the multilayer printed circuit board 51 through a plurality of arrayed holes 52a.

The support plate 58 is positioned on the lower edge of the guide plate 52, and the relay plate 60 is installed on the guide plate 52 as a fixing means of the bolt 54 through the support plate 58.

A portion of the guide plate 52 is provided between the relay plate 60 by the support plate 58 to provide an installation space, through which a portion of the pogo pin 56 is exposed, and the pogo pin 56 is a relay plate. It is electrically connected with the contact 60a formed in 60.

As shown in the enlarged view of FIG. 1, the pogo pin 60 is inserted into a hole 52a drilled in the guide plate 52 and fixed to an epoxy or insulating bond to both the casing 56a and the casing 56a. Contact pins 56b and 56c which are installed on the casing 56a and are connected to the contact 51a of the multilayer printed circuit board 51 and the contact 60a of the relay board 60, and are installed in the casing 56a. And a spring 60d interposed between both contact pins 56b and 56c to elastically contact the contact pins 56b and 56c with the contacts 51a and 60a to increase the contact force. .

In the above, it is preferable that the spring 56d uses a plate or coil spring.

Accordingly, the contact pins 56b and 56c are closely contacted with both the contact points 51a and 60a by the repulsive force of the spring 56d, thereby improving the electrical conductivity.

A plurality of holes 60b corresponding to the coordinates of the electrode pad 100 are punctured and arranged in the relay plate 60 so that the hollow auxiliary probe tip 62 is vertically installed and fixed through the holes 60b.

The hollow auxiliary probe tip 62 is inserted into the hole 60b and fixed with epoxy or an insulating bond, and the upper part thereof is connected with copper wire 64 to be electrically connected to the contact 60a of the relay plate 60 by wire bonding. Connected.

As shown in the enlarged main portion of the relay plate 60 of FIG. 4, the contact point 60a has the shape of the contact point 60a such that the copper wire 64 is connected to the auxiliary contact point 64a. As the wire is bonded through, the contact pins 56c of the pogo pins 56 in contact with the contacts 60a are not interfered, thereby making the contactability stable and the conductance good.

A fixing plate 66 is installed at a lower portion of the relay plate 60 as a fixing means for the bolt 54, and the fixing plate 66 is drilled in a manner corresponding to the same position as that of the hole 60b of the relay plate 60. The hollow probe tips 68 are arranged vertically through the plurality of holes 66a.

The upper portion of the hollow probe tip 68 is inserted and electrically connected through the lower portion of the hollow auxiliary probe tip 62, and the lower portion of the hollow probe tip 68 protrudes slightly from the fixing plate 66 to be electrode. It is configured to be in contact with the pad 100.

The reinforcement plate 70 which prevents deformation of the guide plate 52, the support plate 58, the relay plate 60, the fixed plate 66, and the multilayer printed circuit board 51 is formed at the center of the upper surface of the multilayer printed circuit board 51. ) Is installed.

The hollow probe tip 68 roll-forms a metal plate as shown in FIG. 7 so that the hollow pin portions 68b and 68c having empty interiors have clearance gaps C spaced apart from each other. A spring action is generated in the radial direction (68a), and the lower portion of the hollow pin portion (68a) is bent inward to form an axial elastic fin portion (68d) in the form of a conical frustum (cone frustum), the axial direction A plurality of bones 68e are formed at a predetermined height and a predetermined interval around the elastic pin portion 68d so that the bones 68e are formed to contact the electrode pad 100 in the form of a trident by the bones 68e. The end 68f is formed and comprised.

Although three contact ends 68f are formed by the valleys 68e, the two contact ends 68f form two or four, so that the contact ends 68f are stable even when they are in contact with the electrode pad 100. Contact is made.

In addition, the contact end portion 68f is sanded as shown in FIG. 8 to form a horizontal contact portion having a predetermined width W. In this case, the contact thickness T of the contact end portion 68f is shown in FIG. 9. As shown in the enlarged view, the cross-sectional area becomes wider by the bending angle of the axial elastic pin portion 68d bent inward. Therefore, the contact end portion 68f has an effect of improving the contact force with the life extension effect of the hollow probe tip 68 as the contact area with the electrode pad 100 is reduced to decrease the contact resistance.

The length of the lower portion of the hollow probe tip 68 protrudes from the fixing plate 66 is shortened to within 2000 μm so that the rigid probe tip 68 remains rigid when contacted with the electrode pad 100. It is desirable to have required elasticity and electrical conductance.

On the other hand, the hollow probe tip 68 is preferably a beryllium copper alloy (Be-Cu alloy) having good conductivity, warning, and strength to have a correlation between conductivity and contact resistance in a semiconductor using an ultrafine current. .

The hollow auxiliary probe tip 62 also has the same shape and structure as the hollow probe tip 68 described above.

On the other hand, the reinforcing plate 70 is a guide plate 52, a support plate 58, including a multilayer printed circuit board 51 in accordance with the contact pressure upon contact with the repetitive post pad (62) probe pad 100, The deformation of the relay plate 60 and the fixing plate 66 is prevented. As a result, the guide plate 52 including the multilayer printed circuit board 51, the support plate 58, the relay plate 60, and the fixing plate 66 are installed. The hollow probe tip 68 maintains flatness and is in contact with each electrode pad 100 with a uniform contact pressure to prevent a poor contact of the hollow probe tip 68.

As the reinforcing plate 70 as described above, it is preferable to use a ceramic material or steel material having structural rigidity.

On the other hand, in the space formed between the guide plate 52 and the relay plate 60 by the support plate 58, the guide plate 52 and the relay to prevent deformation due to the contact pressure of the hollow probe tip 68 The plurality of supports 72 may be fixed to the guide plate 52 side between the plates 60.

Meanwhile, the guide plate 52, the support plate 58, the relay plate 60, and the fixing plate 66 may be formed of a ceramic material or PEEK (Polyethertherketone) material having bending deformation rigidity and good insulation, chemical resistance, and heat resistance. Do.

In addition, the above-described holes 52a, 60b, 66a drilled in the guide plate 52, the relay plate 52, and the fixing plate 66 are formed in a round shape by laser processing to form a pogo pin 56 and a hollow auxiliary support. The insertion and fixing of the probe tip 62 and the hollow probe tip 68 is stabilized.

On the other hand, the hollow probe tip 68 is electrically connected to the medium via the hollow auxiliary probe tip 68. Since the diameter of the hollow probe tip 68 is very small, bending deformation according to the contact pressure is achieved. In order to prevent the length (height) of the hollow probe tip 68 to be as short as possible, it is connected with the hollow auxiliary probe tip 68. Accordingly, by using the hollow probe tip 68 connected to the hollow auxiliary probe tip 68, it is possible to counter the bending deformation.

If the stiffness of the hollow probe tip 68 satisfies the requirements (bending deformation), the hollow auxiliary probe tip 62 may be deleted and the hollow probe tip 68 may be extended to form a single body. to be. Therefore, by eliminating the hollow auxiliary probe tip 62, it is possible to improve assembly and reduce manufacturing costs.

Meanwhile, the hollow probe tips 68 arranged on the fixing plate 66 are arranged in two rows, left and right as shown in FIG. 5, but are not limited thereto, and the semiconductor to be inspected as shown in FIG. 6. Of course, the hollow probe tips 68 may be arranged in three, four, or more rows corresponding to the wafer. This arrangement of the hollow probe tip 68 is to install a large number of hollow probe tip 68 in a limited space because the hollow probe tip 68 is installed perpendicular to the fixed plate 66. . The array of hollow probe tips 68 may be selectively arranged in various ways such as two rows, three rows, and four rows corresponding to the semiconductor wafer to be inspected, thereby enabling the semiconductor inspection to be highly integrated.

Referring to the effects of the present invention configured as described above are as follows.

As the probe card 50 moves up and down (or the semiconductor wafer moves on the mounting table) by the probe device, not shown, the hollow probe tip 68 contacts the electrode pad 100 of the semiconductor wafer to make it hollow. Probing is carried out by a probe device connected thereto via a probe tip 68, a hollow auxiliary probe tip 62, a relay plate 60, a contact 60a, a pogo pin 56, and a multilayer printed circuit board 51. It is determined whether the electrode pad 100 is good or bad according to the output signal of the electrode pad 100.

As described above, when the hollow probe tip 68 contacts the electrode pad 100, the hollow probe tip 68 is vertically fixed to the fixing plate 66 to receive contact pressure in the vertical direction. As shown, the elastic end and the electrical conductivity required by the axial elastic pin portion 68d in which the contact end 68f of the hollow probe tip 68 has a contact pressure and a valley 68e is formed when contacting the electrode pad 100. It can be accurately contacted without damaging the electrode pad 100 without slipping, so that accurate inspection can be made without an error, and in appearance, several layers of plate (guide plate 52, support plate 58) The relay plate 60 and the fixing plate 66 overlap each other, and only the hollow probe tip 68 is slightly exposed to the outside so as to reduce damage due to careless handling.

As described above, the probe card 50 of the present invention has a hollow probe tip 68 vertically protruding shortly from the fixed plate 66, so that the probe card 50 accurately contacts the electrode pad 100 of the semiconductor wafer without slip. The problem of coordinate deviation due to wear of (68) is also eliminated, and the effect of greatly improving the production yield of semiconductor devices can be obtained.

In addition, by installing the hollow probe tips 68 vertically, a high density array can be installed, and the semiconductor probes 68 are becoming highly integrated to meet the small size of the electrode pad 100 by the high density of the hollow probe tips 68. It can cope with the trend (next-generation semi-vegetables such as 1G DRAM).

Since the hollow probe tip 68 is densely installed vertically to inspect the high density semiconductor as described above, there is no need for sanding process due to deformation and abrasion of the semiconductor device during use. The use time can be increased drastically to increase the inspection yield.

Meanwhile, when the service life of the hollow probe tip 68 of the present invention is terminated, the fixing plate 66 together with the relay plate 60 may be separated and replaced by the bolts 54 from the guide plate 52. This can greatly reduce the cost.

As described above, according to the present invention, the hollow probe tip is vertically fixed and the conductor portion only protrudes slightly from the fixing plate, so that the elasticity due to the formal forming of the probe tip from the contact pressure is maintained while maintaining the rigidity even when the outer diameter of the probe tip is small. Since there is no slip, there is no restriction on the use time due to wear of the hollow probe tips, and thus the inspection yield can be increased. The small diameter of the hollow probe tips results in high density and arrangement of 2 rows, 3 rows, and 4 rows. It can cope with semiconductor wafers that are highly integrated in batch, can cope with the inspection of next-generation semiconductors that are developed in the future, and can inspect many electrode pads at the time of semiconductor inspection, thereby maximizing the hourly inspection efficiency and furthermore. It has an effect that can cope with inspection of a large diameter semiconductor wafer.

Claims (8)

A multi-layer printed circuit board connected to the probe device circuit; A guide plate 52 fixed to a center of a lower surface of the multilayer printed circuit board 51; A pogo pin 56 installed through the holes 52a arranged in the guide plate 52 to be electrically connected to the multilayer printed circuit board 51; The pogo pin is fixed to the guide plate 52 through the bottom surface of the support plate 58 while maintaining a predetermined space with the guide plate 52 by the support plate 58 located through the bottom edge of the guide plate 52. A relay plate 60 formed with a contact 60a electrically connected to 56; The hollow is arranged vertically through a plurality of holes (60b) perforated in accordance with the coordinates of the electrode pad 100 in the relay plate 60 and the hollow is electrically connected to the contact (60a) formed in the relay plate 60 Type auxiliary probe tip 62; A fixing plate 66 fixed through the lower surface of the relay plate 60; It is installed vertically through a plurality of holes (66a) arranged in the fixing plate 66, the upper portion is connected to the hollow auxiliary probe tip 62, the lower portion protrudes from the fixing plate 66 to the electrode pad A hollow probe tip 68 in contact with 100; A reinforcement plate is fixed to a central portion of the upper surface of the multilayer printed circuit board 51 to prevent deformation of the guide plate 52, the support plate 58, the relay plate 60, the fixed plate 66, and the multilayer printed circuit board 51. Probe card vertically arranged hollow probe tip, characterized in that consisting of (70). The method of claim 1, wherein the pogo pin is, A casing 56a inserted into and fixed to the hole 52a drilled into the guide plate 52; Contact pins 56b and 56c installed on both sides of the casing 56a and connected to the contact 51a of the multilayer printed circuit board 51 and the contact 60a of the relay board 60; The hollow probe tip vertically installed in the casing 56a and composed of a spring 56d interposed between both contact pins 56b and 56c to increase the contact force of the contact pins 56b and 56c. Probe card The probe card according to claim 1, wherein the hollow probe tip (68) protrudes from the fixed plate (66) within 2000 µm. According to claim 1, In the space formed between the guide plate 52 and the relay plate 60 a plurality of supports 72 to prevent deformation due to the contact pressure of the hollow probe tip 68 Probe card vertically arranged hollow probe tip, characterized in that the installation further on the (52) side. According to claim 1, wherein the guide plate 52, the support plate 58, the relay plate 60 and the fixing plate 66 is a ceramic material or PEEK (Polyethertherketone) material having a bending deformation rigidity and good insulation, chemical resistance, heat resistance Probe card vertically arranged hollow probe tip, characterized in that. The probe card according to claim 1, wherein the reinforcement plate (70) has a structural rigidity of ceramic or steel. The probe card according to claim 1, wherein the hollow auxiliary probe tip (62) and the hollow probe tip (68) are formed in a single body. The hollow contact formed on the relay plate to electrically connect the hollow auxiliary probe tip with the pogo pin is '∞' hollow connection characterized in that the copper wire is electrically connected to the contact by wire bonding through the auxiliary contact Probe card with vertical probe tips vertically arranged.