KR101250306B1 - Probe card - Google Patents

Abstract

The present invention relates to a probe card.
According to the present invention, the manufacturing time and the manufacturing cost can be reduced by adopting the configuration of connecting the electrical signal between the needle and the relay board by using a PSA socket or a pogo pin socket having a conductive rubber contact terminal. Disclosed is a technique capable of narrowing the distance between needles to improve processing capacity.

Description

Probe Card {PROBE CARD}

The present invention relates to a probe card for inspecting electrical characteristics of a semiconductor wafer.

A semiconductor device includes a fabrication process for forming a pattern on a wafer and an assembly for assembling each device after dividing the wafer after the fabrication process into a plurality of devices having the same pattern, ≪ / RTI >

However, among the devices of the wafer that have been fabricated, some of the devices may have poor electrical characteristics due to manufacturing defects. Electrical Die Sorting (hereinafter referred to as 'EDS') process.

In the EDS process, an electrical signal is applied to each device on the wafer, and then a probe station is used to determine whether or not each device is defective by analyzing the electrical signal from each device.

In the probe station, a probe card is used to transmit the electric signal from the tester to the pad of the device.

The probe card is equipped with a support plate, a plurality of circuit boards and needles which can be in electrical contact with the pads on the wafer.

The electrical signal from the tester is applied to the pads on the wafer sequentially through a plurality of circuit boards and needles, and fed back to the tester while passing the needles and the plurality of circuit boards in reverse order from the pads on the wafer.

Many circuit boards include, for example, main circuit boards, sub-circuit boards, side circuit boards, and interface circuit boards on which needles are mounted, and the interface circuit boards have chips in portions where the needles are mounted. In the case where a plurality of circuit boards are thus configured, electrical signals from the tester are applied to the pads on the wafer through the needles through the main circuit board, the sub circuit board, the side circuit board, and the interface circuit board. Here, the interface circuit board has at least one chip, and since the needles are mounted in the portion where the chip is located, it is preferable that the interface circuit board is made of a material such as ceramic, which is less deformed by heat and has good hardness.

In most cases, the interface circuit board is divided from the sub circuit board with the support plate interposed therebetween. However, since the interface circuit board and the sub-circuit board must exchange electrical signals with each other, as shown in FIG. 1, an insertion hole 111 is formed in the support plate 110 and an interface circuit is formed in the insertion hole 111. Side circuit boards 141 and 412 for exchanging electrical signals between the substrate 120 and the sub-circuit board 130 are inserted and installed vertically. For reference, the interface circuit board 120 and the side circuit boards 141 and 142 may be installed in the support plate 110 after being assembled into one module (hereinafter referred to as a needle mounting module). ), Numerous needle mounting modules are installed.

On the other hand, about 70 electrical signals from the tester are applied to one chip, and the electrical signals must not overlap each other. Therefore, the circuit pattern formed on each of the plurality of circuit boards is very complicated (consider the case of hundreds of chips).

Therefore, the applicant of the present invention, as referred to in the Republic of Korea Patent Registration No. 10-0979502 (name of the invention: a probe card substrate, hereinafter referred to as 'advanced technology') a single electrical signal from the tester to the multiple circuit boards It has been proposed a circuit configuration method to branch out into several chips. According to the prior art, since the circuit patterns of the main circuit board, the sub circuit board, and the side circuit board are relatively simple, the manufacturing cost and manufacturing time are drastically shortened.

However, according to the prior art, it is necessary to form an interface circuit board as a multilayer circuit board because a complex circuit pattern in which electrical signals are branched on the interface circuit board must be formed.

As described above, since the interface circuit board is made of a hard material such as ceramic, when forming a circuit pattern of a multi-layer structure, each time the circuit pattern of one layer is formed, a sintering process must be performed. Since the needles could be mounted only after the circuit patterns having the multilayer structure of about 20 layers are formed on the substrate, the advantages of the prior art, which shorten the manufacturing time and manufacturing cost, are diluted.

The side circuit boards 141 and 412 are necessary components for exchanging electrical signals between the interface circuit board 120 and the sub circuit board 130. However, as shown in FIG. 1, the structure including the side circuit boards 141 and 412 is accompanied by welding or the like for separately electrically connecting the side circuit boards 141 and 412 to the sub circuit boards 141 and 412. Should be.

In addition, as shown in FIG. 2, the presence of the side circuit boards 141a and 412b limits the gap between the adjacent needles N ₁ and N ₂ . In addition, as the degree of integration increases, this limit serves as a limit to installing needles in a narrow gap between adjacent pads formed on the wafer. Therefore, as illustrated in FIGS. 3A and 3B, a test for one wafer W must be performed a plurality of times.

Accordingly, an object of the present invention is to provide a probe card that is easy to manufacture while narrowing the gap between the needles to solve the problems described above.

Probe card according to an aspect of the present invention for achieving the above object, a needle having a probe in electrical contact with the pad of the wafer, a needle for supporting the probe and a leg extending from the body; An installation plate provided to install the needle and having an insertion hole into which the leg of the needle can be inserted; A relay substrate on which a circuit pattern for relaying an electrical signal between the needle and the tester is formed; A plate provided between the mounting plate and the relay board and having a connection hole formed to electrically connect the needle and the relay board; And a PCR socket block inserted into a connection hole of the plate and having a conductive rubber contact terminal (hereinafter referred to as a rubber contact terminal) for electrically connecting the needle and the electrical contact point of the relay board. SOCKET BLOCK); .

The PRC socket block may include a PPC socket having the rubber contact terminal; And a circuit pattern for electrically connecting the needle and the rubber contact terminal of the PC socket, one surface of which faces the mounting plate and the other surface of which faces the PC socket, which faces the PC socket. A connecting substrate having an electrical contact point in electrical contact with the rubber contact terminal on a surface thereof; .

Preferably, the connecting substrate is provided with a passage hole through which the leg of the needle can pass.

The PC socket may include: a first layer socket having a first rubber contact terminal in electrical contact with an electrical contact point of the connection board; A second layer socket having a second rubber contact terminal in electrical contact with an electrical contact point of the relay board; And a sipan provided between the first layer socket and the second layer socket to electrically connect the first rubber contact terminal of the first layer socket and the second rubber contact terminal of the second layer socket. .

A branch circuit pattern is formed on the relay board to branch electrical signals from the tester side.

The PCB socket may further include a compensation plate for compensating the thickness between the installation plate and the PC socket.

In addition, a probe card according to another aspect of the present invention for achieving the above object, a needle having a probe in electrical contact with the pad of the wafer, a body for supporting the probe and a leg extending from the body; An installation plate provided to install the needle and having an insertion hole into which the leg of the needle can be inserted; A relay substrate on which a circuit pattern for relaying an electrical signal between the needle and the tester is formed; A plate provided between the mounting plate and the relay board and having a connection hole formed to electrically connect the needle and the relay board; And a pogo pin block inserted into a connection hole of the plate, the pogo pin block having a pogo pin for electrically connecting the needle and an electrical contact point of the relay substrate. .

The pogo pin block, the pogo pin socket having the pogo pin; And a circuit pattern for electrically connecting the needle and the contact terminal of the pogo pin socket, one surface of which faces the mounting plate and the other surface of which faces the pogo pin socket, and which faces the pogo pin socket. A connection board having an electrical contact point in electrical contact with the contact terminal; .

It is preferable that the connection hole of the said plate is located in the direct direction of the said installation plate.

The present invention has the following effects.

First, the spacing between adjacent needles can be narrowed, so that the processing capacity can be improved.

Second, the manufacturing time can be shortened.

Third, the manufacturing cost can be reduced.

1 to 3 are reference diagrams for reference in describing the prior art.
4 is a sectional view of a probe card according to a first embodiment of the present invention.
FIG. 5 is a cross-sectional view of the PC socket of the probe card of FIG.
FIG. 6 is a schematic perspective view of a first layer socket configured in the PC socket of FIG. 4. FIG.
7 is a cross-sectional view of the probe card according to the first application of the probe card of FIG.
8 is a cross-sectional view of a probe card according to a second application of the probe card of FIG.
9 is a cross-sectional view of a probe card according to a third application of the probe card of FIG.
Fig. 10 is a sectional view of a probe card according to a second embodiment of the present invention.

Hereinafter, a preferred embodiment according to the present invention as described above with reference to the accompanying drawings, for the sake of brevity of description duplicate description will be omitted or compressed as possible.

≪ Embodiment 1 >

4 is a schematic cross-sectional view of the probe card 400 according to the first embodiment of the present invention.

The probe card 400 according to the present embodiment includes a needle 410, an installation plate 420, a relay board 430, a plate 440, and a PCR socket block 450. . For reference, in FIG. 4, for the sake of brevity, one mounting plate 420 is shown coupled to the plate 440, but a plurality of mounting plates 420 are coupled to the plate 440. Naturally, dozens of needles 410 are installed in each mounting plate 420.

The needle 410 includes a probe 411, a body 412, a leg 413, a guider 414, and the like.

The probe 411 is in electrical contact with the pad of the wafer.

Body 412 supports probe 411.

Leg 413 extends long from body 412.

The guider 414 guides the installation of the needle 410 properly.

The mounting plate 420 is provided to install the needle 410, and the insertion hole 421 into which the leg 413 of the needle 410 can be inserted and the guider 414 of the needle 410 are inserted. Guide holes 422 that can be formed are formed.

The relay board 430 is provided with a branch circuit pattern for relaying an electrical signal between the needle 410 and a tester (not shown) and for branching an electrical signal from the tester side.

The plate 440 supports the mounting plate 420 and the relay board 430, and a connection hole 441 is formed to electrically connect the needle 410 and the relay board 430. This connecting hole 441 is located in the direction immediately below the mounting plate 420, as can be seen in FIG.

The PCB socket 450 is inserted into the connection hole 441, and is provided to electrically connect the electrical contact points of the needle 410 and the relay board 430. The PSA socket 450 includes a PSA socket 451 and a connection substrate 452.

The PC socket 451 is preferably configured such that its width is substantially the same as the width of the connection hole 441. The first layer socket 451a and the second layer socket ( 451b), Saipan 451c, and the like.

The first layer socket 451a has a first rubber contact terminal 451a-1 made of a conductive rubber material in electrical contact with the electrical contact point P ₁ of the connecting substrate 452. For reference, the first layer socket 451a has the same number of first rubber contact terminals 451a-1 as the number of the needles 410 installed on the mounting plate 420, for example, as referred to in the perspective view of FIG. As described above, the first rubber contact terminal 451-1 is arranged in plural numbers.

The second layer socket 451b has a second rubber contact terminal 451b-1 which is in electrical contact with the electrical contact point P ₂ of the relay board 430.

Saipan 451c is provided for electrically connecting the first rubber contact terminal 451a-1 of the first layer socket 451a and the second rubber contact terminal 451b-1 of the second layer socket 451b. . Of course, the saipan 451c is provided to compensate for the thickness of the plate 440 with a relatively cheap general circuit board material.

The connection board 452 faces one side of the mounting plate 420 and the other side faces the first layer socket 451a, and the first rubber contact terminal 451a of the needle 410 and the first layer socket 451a. A circuit pattern for electrically connecting -1) is formed on the other surface facing the first layer socket 451a. In addition, the electrical contact point P ₁ of the connection board 452 is provided on a surface facing the first layer socket 451a. For this purpose, the leg 413 of the needle 410 may pass through the connection board 452. A through hole 452a is formed.

Probe card 400 having the structure as described above, after fixing the relay board 430 and the plate 440, the second layer socket (451b), Saipan (451c), the first layer socket (451a) simply connecting holes ( 441), and then is prepared by fixing the premodular needle 410, the mounting plate 420 and the connecting substrate 452 to the plate 440. At this time, since the first rubber contact terminal 451a-1 and the second rubber contact terminal 451b-1 can be slightly elastically pressed, the plate 440 can be manufactured in the thickness direction (up and down direction in the drawing). The electrical connection between the needle 410 and the relay board 430 may be enabled while sufficiently compensating for the tolerance.

<First application example>

7 shows a probe card 700 according to a first application, in which the connecting substrate is excluded in the embodiment of FIG.

Probe card 700 according to the present application is an electrical contact point (P) which is in contact with the first rubber contact terminal (751a-1) of the first layer socket (751a) on the mounting plate 720 for installing the needle 710 ₃ ) has a structure provided.

That is, in this embodiment, a separate connection board is not provided, and instead, the electrical contact point P contacting the first rubber contact terminal 751a-1 on one surface of the mounting plate 720 facing the first layer socket 751a. _A circuit pattern having ₃ ) is formed.

<2nd application example>

8 shows a probe card 800 according to a second application, in which the PC socket is provided as one single component in the embodiment of FIG. For reference, FIG. 8 shows that the leg 813 of the needle 810 extends longer than the embodiment so that the end portion is inserted into the guide groove 451a formed in the PC socket 851 so that It is intended to guide the installation location. Accordingly, it can be seen that the PC socket 851 is easily installed at an appropriate position even if the width of the PC socket 851 is smaller than the width of the connection hole 841.

For reference, FIG. 8 shows that the leg 813 of the needle 810 extends longer than the embodiment so that the end portion is inserted into the guide groove 451a formed in the PC socket 851 so that It is intended to guide the installation location. Accordingly, it can be seen that the PC socket 851 is easily installed at an appropriate position even if the width of the PC socket 851 is smaller than the width of the connection hole 841.

<Third application example>

9 shows a probe card 900 according to a third application to the embodiment of FIG.

The probe card 900 according to the third application also includes a needle 910, a mounting plate 920, a relay board 930, a plate 940, a PC socket block 950, and the like.

Needle 910, mounting plate 920, relay board 930 and plate 940 in the present application is the same as in the embodiment of Figure 4, and a description thereof will be omitted.

The PCB socket 950 includes a PC socket 951, a connection board 952, and a compensation plate 953.

The PC socket 951 has one side of which is in electrical contact with the electrical contact point P ₁ of the connecting substrate 952, and the other side of which is electrically conductive in contact with the electrical contact point P ₂ of the relay board 930. Rubber contact terminal 951a-1.

The connecting substrate 952 has one surface in contact with the compensating plate 953 and the other surface in contact with the PC socket 951, and electrically connects the rubber contact terminals 951a-1 of the needle 910 and the PC socket 951. A circuit pattern for connecting to each other is formed on the other surface facing the PC socket 951. A through hole A 952a through which the leg 913 of the needle 910 passes is formed.

An inexpensive compensation plate 953 is provided to compensate for the thickness of the plate 940 and has a through hole B 953a through which the leg 913 of the needle 910 can pass.

Second Embodiment

10 is a schematic cross-sectional view of a probe card 1000 according to a second embodiment of the present invention.

The probe card 1000 according to the present embodiment includes a needle 1010, an installation plate 1020, a relay board 1030, a plate 1040, and a pogo pin block 1050.

Needle 1010, mounting plate 1020, relay board 1030 and plate 1040 are the same as in the first embodiment.

The pogo pin block 1050 is inserted into the connection hole 1041 and is provided to electrically connect the electrical contact points of the needle 1010 and the relay substrate 1030. The pogo pin block 1050 is configured to include a pogo pin socket 1051 and the connecting substrate 1052.

The pogo pin socket 1051 is preferably configured such that its width is substantially the same as the width of the connecting hole 1041, and a large number of pogo pins 1051a are provided.

The connecting substrate 1052 faces one side of the mounting plate 1020 and the other side faces the pogo pin socket 1051, and electrically connects the needle 1010 and the pogo pin 1051a of the pogo pin socket 1051. The circuit pattern to be formed is formed on the other surface facing the pogo pin socket 1051. And the electrical contact point (P ₁ ) of the connecting substrate 1052 is provided on the surface facing the pogo pin socket 1051, for this purpose, the leg 1013 of the needle 1010 can pass through the connecting substrate 1052 The through hole 1052a is formed.

Probe card 1000 having the above structure is fixed to the relay substrate 1030 and the plate 1040, and then simply insert the pogo pin socket 1051 into the connection hole (1041), then the pre-modulated needle (1010) And the mounting plate 1020 and the connecting substrate 1052 are fixed to the plate 1040. At this time, since both ends of the pogo pin 1051a can be slightly retracted from the center 1051a of the pogo pin, the needle 1010 is sufficiently compensated for manufacturing tolerances in the thickness direction of the plate 1204. And the electrical connection between the relay substrate 1030 may be enabled.

As can be seen from the examples described above, it can be seen that the present invention can be implemented in various forms as well as the first embodiment, the first to third application examples, and the second embodiments.

Therefore, as described above, although the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings, the above embodiments have been described only by way of examples of the present invention. It should not be understood to be limited only to the scope of the present invention will be understood by the claims and equivalent concepts described below.

400: probe card 410: needle
420: mounting plate
430 relay board
440: Plate
441: connecting hole
450: PC socket block
451 PCR socket
451a: first layer socket
451b: second layer socket
451c: Saipan
452: connecting board

Claims (9)

A needle having a probe in electrical contact with a pad of a wafer, a body supporting the probe, and a leg elongated from the body;
An installation plate provided to install the needle and having an insertion hole into which the leg of the needle can be inserted;
A relay substrate on which a circuit pattern for relaying an electrical signal between the needle and the tester is formed;
A plate provided between the mounting plate and the relay board and having a connection hole formed to electrically connect the needle and the relay board; And
PCR SOCKET inserted into a connection hole of the plate and having a conductive rubber contact terminal (hereinafter referred to as a rubber contact terminal) for electrically connecting the needle and the electrical contact point of the relay substrate. BLOCK); Characterized in that it comprises
Probe card. The method of claim 1,
The PRC socket block,
PC socket having the rubber contact terminal; And
A circuit pattern for electrically connecting the needle and the rubber contact terminal of the PC socket is formed, one surface of which faces the mounting plate and the other surface of which faces the PC socket and faces the PC socket. A connection substrate having an electrical contact point in electrical contact with the rubber contact terminal; Characterized in that it comprises
Probe card. The method of claim 2,
Wherein the connecting substrate is characterized in that the through hole through which the leg of the needle can pass
Probe card. The method of claim 2,
The PRC socket,
A first layer socket having a first rubber contact terminal in electrical contact with an electrical contact point of the connection board;
A second layer socket having a second rubber contact terminal in electrical contact with an electrical contact point of the relay board; And
Saipan provided between the first layer socket and the second layer socket for electrically connecting the first rubber contact terminal of the first layer socket and the second rubber contact terminal of the second layer socket; / RTI &gt;
Said plate is characterized in that it is inserted into the connection hole of the plate to compensate for the thickness of the plate
Probe card. The method of claim 2,
The relay board is provided with a branch circuit pattern for branching electrical signals from the tester side.
Probe card. The method of claim 2,
The PCB socket further comprises a compensation plate for compensating the thickness between the installation plate and the PC socket.
Probe card. A needle having a probe in electrical contact with a pad of a wafer, a body supporting the probe, and a leg elongated from the body;
An installation plate provided to install the needle and having an insertion hole into which the leg of the needle can be inserted;
A relay substrate on which a circuit pattern for relaying an electrical signal between the needle and the tester is formed;
A plate provided between the mounting plate and the relay board and having a connection hole formed to electrically connect the needle and the relay board; And
A pogo pin block inserted into a connection hole of the plate and having a pogo pin for electrically connecting the needle and an electrical contact point of the relay substrate; Characterized in that it comprises
Probe card. The method of claim 7 ,
The pogo pin block,
Pogo pin socket having the pogo pin; And
The circuit pattern for electrically connecting the needle and the contact terminal of the pogo pin socket is formed, one side facing the mounting plate and the other side facing the pogo pin socket, the surface facing the pogo pin socket A connection substrate having an electrical contact point in electrical contact with the contact terminal; Characterized in that it comprises
Probe card. 8. The method of claim 1 or 7,
The connection hole is formed smaller than the area of the lower surface of the mounting plate, characterized in that located below the mounting plate
Probe card.

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