KR20130047933A - Probe, probe assembly and probe card comprising it - Google Patents

Abstract

PURPOSE: A laminate unit formed with a layer prepared in one part of a substrate, a probe including a connector terminal, a probe assembly and a probe card including the same are provided to facilitate maintenance and repair of a probe assembly, to improve a design degree of freedom and to reduce manufacturing costs. CONSTITUTION: A probe, a probe assembly(10) and a probe card(100) including the same consist of a probe unit(20) include a plurality of probes, a substrate(30) engaged with the probe unit and a plurality of connector terminals(50) connected to a plurality of the probes. The probe assembly facilitates maintenance and repair by further including a laminate unit(40) formed by laminating a layer and a connector terminal located in the same.

Description

Probes, probe assemblies and probe cards containing them {PROBE, PROBE ASSEMBLY AND PROBE CARD COMPRISING IT}

The present invention relates to a probe, a probe assembly, and a probe card including the same. More particularly, the present invention includes a stack formed by stacking layers provided in one region of a substrate and a connector terminal located therein, thereby maintaining maintenance of the probe assembly. The present invention relates to a probe, a probe assembly, and a probe card including the same.

In general, semiconductor devices are manufactured through a fabrication process for forming a pattern on a wafer and a package assembly process for encapsulating and individualizing the wafer on which the pattern is formed with an epoxy resin, respectively. Further, an electrical die sorting (EDS) process may be performed between the fabrication process and the assembly process to inspect the electrical characteristics of the semiconductor device formed on the wafer.

The EDS process is a process for determining chips which do not satisfy the design conditions among the semiconductor devices constituting the wafer, and can determine defects through signals checked from electrical signals applied to the chips constituting the wafer.

Electrical inspection of each semiconductor device constituting the wafer may use a probe card having a plurality of needle-shaped probes in contact with a pattern of each semiconductor device to apply an electrical signal. have.

As a result of the test using the probe card, if it is determined that the semiconductor device is a good product, the semiconductor device may be manufactured as a finished product through a package assembly process and the like.

The electrical characteristic inspection of the semiconductor wafer using the probe card may be performed by measuring the output characteristic of the current supplied through the contacted needle while the needle of the probe card is in contact with the electrode pad of each semiconductor device formed on the wafer. .

In recent years, since semiconductor devices have been highly integrated and minimized, an appropriate inspection apparatus is required for the inspection of such semiconductor devices.

Conventionally, a terminal extending from a probe is connected to a connector, and the connector is connected to a terminal of the main board. Therefore, the structure is complicated, as well as the problem of difficult to repair and replace a particular probe.

The present invention relates to a probe, a probe assembly, and a probe card including the same, which may facilitate maintenance of a probe assembly, including a laminate formed by stacking layers provided on one region of a substrate and a connector terminal positioned thereon. .

Probe assembly according to an embodiment of the present invention for realizing the above object, including a laminated portion formed by stacking a layer provided in one area of the substrate and a connector terminal located therein, to facilitate maintenance of the probe assembly can do.

The electronic device may further include a stacking unit formed by stacking at least one layer on at least one region of the substrate, and the plurality of wires may be disposed on the stacking unit to couple the connector terminals.

The wiring may be arranged in a plurality of layers in the stacking portion.

At least two adjacent connector terminals of the plurality of connector terminals may be disposed to be substantially spaced apart at equal intervals.

At least one flexible printed circuit board (FPCB) may be stacked on at least a portion of an outer circumference of the substrate.

It may further include a connector line coupled to the connector terminal to provide a path for exchanging electrical signals with the plurality of probes, and at least one connector electrically connected to the connector line.

The substrate is provided with a plurality of slits into which the plurality of probes are inserted, and the probe unit further includes a plurality of ribs extending from at least one side of the probe unit to be in contact with one surface of the substrate. Can be.

The plurality of ribs and the plurality of wires for connecting the coupling may further include.

The plurality of probes may include a post extending from a base of the probe unit, a plurality of beams in which the post is refracted and extended, and a tip formed by refracting outward at an end of the beam. tip).

The plurality of probes may be in the form of a two-dimensional thin plate manufactured through at least one of an etching process and a pressing process.

In addition, a probe card according to an embodiment of the present invention for realizing the above object, a guide plate provided with a plurality of slits;

A probe unit including a plurality of probes inserted into the plurality of slits, a substrate coupled to the probe unit, a laminate formed by stacking at least one layer on at least one region of the substrate, and one surface of the laminate A probe assembly positioned at the and including a plurality of connector terminals connected to a plurality of wires connected to the plurality of probes; And a main board including a circuit pattern electrically connected to the connection body extending from the probe assembly.

The contact member may be connected to a connector line electrically connected to the connector terminal to provide a path for exchanging electrical signals with the plurality of probes.

At least two adjacent connector terminals of the plurality of connector terminals may be disposed to be substantially spaced apart at equal intervals.

The stacking unit may be formed by stacking at least one flexible printed circuit board (FPCB).

In addition, a probe according to an embodiment of the present invention for realizing the above object, the base extending the wiring connected to the connector terminal; A post extending from the base; A plurality of beams in which the post is refracted and extended; And it may include a tip (tip) is formed to be refracted outward from the end of the beam.

A probe, a probe assembly, and a probe card including the same according to the present invention may include a laminate formed by stacking layers provided on one region of a substrate and a connector terminal located therein, thereby facilitating maintenance of the probe assembly. It works.

In addition, the probe, the probe assembly, and the probe card including the same according to the present invention have an effect of increasing the degree of freedom of wiring design due to the multilayered portion.

In addition, the probe according to the present invention, the probe assembly and the probe card comprising the same, there is an effect that can simplify the process and reduce the manufacturing cost due to the thin plate probe.

1 is an exploded perspective view of the probe assembly according to an embodiment of the present invention.
2 is a side cross-sectional view of the probe assembly of FIG. 1.
3 is a bottom view of the probe assembly of FIG. 1.
4 is a bottom view of a probe assembly according to another embodiment of the present invention.
5 is a view showing a coupling relationship of the probe assembly of FIG.
6 illustrates a probe of the probe assembly of FIG. 1.
FIG. 7 illustrates a probe card including the probe assembly of FIG. 1. FIG.

The above objects, features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. It is to be understood, however, that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and similarities. Like reference numerals designate like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. In addition, the numbers (eg, first, second, etc.) used in the description process of the present specification are merely identification symbols for distinguishing one component from another component.

Hereinafter, a probe, a probe assembly, and a probe card including the same according to the present invention will be described in more detail with reference to the accompanying drawings. The suffix "module" and " part "for the components used in the following description are given or mixed in consideration of ease of specification, and do not have their own meaning or role.

1 is an exploded perspective view of the probe assembly according to an embodiment of the present invention.

As shown, the probe assembly 10 according to an embodiment of the present invention, the probe unit 20 including a plurality of probes 22, the substrate 30 is coupled to the probe unit 20, at least One layer may be stacked to include a connector line 60 to which wires extending from the probe 20 are connected. 1 is a cross-sectional view taken along line II of FIG. 3.

The probe 22 may be provided in the form of a needle in contact with the wafer on which the semiconductor device is formed. The plurality of probes 22 may be aligned at a predetermined position. For example, it is meant that the probes 22 may be aligned to be in contact with positions corresponding to respective electrode pads of the semiconductor device formed on the wafer to be inspected. In the probe 22, a tip (27 of FIG. 2) contacting the wafer as the end of the probe 22 may be aligned at the center side of the probe unit 20. However, the alignment form of the probe 22 is not limited thereto, and the tip (27 of FIG. 2) may be aligned outside the probe unit 20. The probe 22 may include a material such as tungsten (W), copper (Cu), nickel-cobalt (Ni-Co) alloy, beryllium-copper (Be-Cu), or the like.

The substrate 30 may be coupled to the base of the probe 22 (21 of FIG. 2) while shielding the upper surface of the probe unit 20. In FIG. 1, the upper surface of the substrate 30 is blurred to show the probe 22, but in fact, the upper surface of the substrate 30 is a substrate 30 except for a slit portion into which the probe 22 is inserted. This is shielded. The area of the substrate that shields the top surface of the probe 22 can be seen as the guide plate 36.

The connector unit 110 may be a path for applying an electrical signal to each probe 22 of the probe unit 20 or transferring the electrical signal from each probe 22 to the main substrate 120 (FIG. 7). Probe assembly 10 according to an embodiment of the present invention, including the connector unit 110 may be easy to maintain. For example, when it is necessary to repair a specific part of the probe 22 or the connector unit 110, it means that the effect of selectively repairing or replacing only the corresponding part can be expected.

The connector unit 110 is connected to the stacking unit 40, the connector terminal 50 located at one side of the stacking unit 40, the connector line 60 connected to the connector terminal 50, and the connector line 60. The connector 70 may include a connector 80 connected to the connector 70.

The stack 40 may be a part in which a flexible PCB (FPCB) or a PCB is stacked. For example, the stacking unit 40 may have a structure that protrudes from the substrate 30 by sequentially stacking thin FPCBs. For example, in the case shown in FIG. 1, it means that the protrusion can be protruded downward by the stacked height.

Since the stack 40 is formed of a multilayer, the design of the wiring may be implemented in a multilayer. Therefore, the degree of freedom in wiring design can be secured. For example, in the case where the first layer to the nth layer are laminated, it means that the wiring can also be divided into n layers and designed.

By stacking the stack 40 by H height, it is possible to reduce the likelihood that the probe 22 will interfere with other structures of the probe assembly 10. For example, it means that a portion of the connector line 60 in the form of a wire can be prevented from coming into contact with the base of the probe 22 (21 in FIG. 2).

The connector terminal 50 may be a conductor electrically connected to each probe 22. For example, it means that one side of the connector terminal 50 is in contact with the probe 22, the other side of the connector terminal 50 may be located on the lower side of the stacking portion (40). The connector terminal 50 and the probe 22 may be connected by the combination 90. The assembly 90 may couple the connector terminal 50 and the probe 22 through soldering and / or bonding.

The connector line 60 may be connected to one side of the connector terminal 50 and the other side of the connector line 60. Each connector line 60 may correspond to each probe 22. That is, it may be a path for transmitting a signal to each probe 22 or a signal from each probe 22.

The connector 70 may be a structure for connecting the connector line 60 and the connector 80. That is, it means that each connector 70 can serve as a converter for connecting each connector line 60.

The connector 80 may be an FPCB of a flexible material provided with conductive wires corresponding to the connector lines 60. One or a plurality of connector lines 60 may be connected to one of the plurality of conductive wires provided in the connector 80.

Since the connection body 80 is formed of a flexible FPCB, the connection body 80 can be easily connected to the main substrate 120 of FIG. 7 within the probe card 100 of FIG. 7.

2 is a side cross-sectional view of the probe assembly of FIG. 1.

As shown in the drawing, the probe assembly 10 according to the exemplary embodiment of the present invention may include a stack 40 formed by stacking at least one layer on the substrate 30.

The stacking unit 40 may be formed by stacking the first layer 40a to the second layer 40n. Each layer may be a relatively thin FPCB. That is, it means that the stacking portion 40 having a height of H can be formed by stacking a thin FPCB.

The connector 40 may be provided in the stack 40.

The connector terminal 50 may include a first terminal portion 52 and a second terminal portion 54.

The first terminal portion 52 may extend from the base 21 of the probe 22 on one side of the stack 40. The base 21 and the first terminal portion 52 may be connected by the combination 90.

The second terminal portion 54 may extend from the first terminal portion 52 and be provided on the other side of the stacked portion 40. The connector line 60 may be connected to the second terminal portion 54.

The connector line 60 may be positioned between the second terminal portion 54 and the connector 70 to be a path through which an electrical signal with the probe 22 is transmitted. By constructing the connector line 60 on the path through which the electrical signal from the probe 22 is transmitted, a part of the probe assembly 10 can be more easily repaired. For example, when an abnormality occurs in the specific probe 22, only the specific probe 22 in which the abnormality has occurred can be removed after the connector line 60 is disconnected from the second terminal portion 54. Alternatively, only the connector line 60 connected to the specific probe 22 may be removed. That is, since each part of the probe assembly 10 can be modularized, it means that only the part in which an abnormality occurs can be replaced or repaired selectively. As a result, maintenance is easy and costs can be reduced.

The connector line 60 may be spaced apart from the probe 22 by C. The connector line 60 may be coupled to the second terminal portion 54 of the stack 40. Therefore, the probe 22 may be spaced apart by C in proportion to the height H of the stack 40. Therefore, it is possible to prevent noise, short circuit, and the like, which may occur due to the interference between the connector line 60 and the probe 22.

The probe 22 may include first and second probes 22a and 22b positioned symmetrically with each other. The first and second probes 22a and 22b are similar in configuration except for their positions. Therefore, hereinafter, the first and second probes 22a and 22b will be referred to as the probes 22 unless otherwise specified.

The probe 22 includes a base 21, a post 23 extending upward from the base 21, and a beam 25 extending like a cantilever beam from the post 23. And the ends of the beam 25 may include a tip (27) that is narrowed in cross-sectional area and upwardly refracted. The long hole 29 may be located between the beam 25 and the base 21. Therefore, the tip 27 in contact with the wafer may be elastically deformed downward by the space of the long hole 29.

3 is a bottom view of the probe assembly of FIG. 1.

As shown in the drawing, in the probe assembly 10 according to an embodiment of the present invention, when the probe 22, the substrate 30, and the portion of the stack 40 are observed from the bottom, the substrate 30 may be formed. The laminated portion 40 forming a closed curve having a predetermined width can be observed along the outer circumference. For convenience of illustration, FIG. 3 illustrates a case in which six probes 22 are positioned three on each side, but the number of probes 22 may be changed.

The first and second terminal parts 52 and 54 may be electrically connected to the probe 22.

The second terminal portion 54 may be positioned on the stack 40.

The distances D1 to D4 between the plurality of second terminal portions 54 may be substantially the same. That is, the interval between the second terminal portion 54, which is each connector terminal connected to each connector line (60 of FIG. 2), may be the same.

The same spacing between the second terminal portions 54 is different from the fact that the spacings D5 to D8 between the respective probes 22 may be different from each other. That is, the spacing between the probes 22 may vary depending on the semiconductor device pattern formed on the wafer.

Since the spacing between the second terminal portion 54 is the same, a process of coupling the connector line (60 of FIG. 2) to each second terminal portion 54 may be easily performed. For example, it means that the connector line (60 in FIG. 2) can be joined to the second terminal portion 54 more easily than when wiring is connected to each probe 22 formed at different intervals. Furthermore, since the connector line (60 of FIG. 2) having a constant spacing can be used regardless of the spacing between the probes 22, even if the design of the probe 22 is changed, the same connector line (60 of FIG. 2) can be used. Can be used. Therefore, the manufacturing cost can be reduced.

4 is a bottom view of a probe assembly according to another embodiment of the present invention.

As shown in the drawing, the probe assembly 10 according to another embodiment of the present invention is stacked on the first region 41, which is one corner side of the substrate 30, and the second region 42, which is the other corner side. The unit 40 may be located.

As described above, the stacking unit 40 may be formed of a multilayered layer such that the connector terminal 50 is positioned. Therefore, the stacking unit 40 may be selectively formed only at the point where the connector terminal 50 is located.

Since the stacking unit 40 may be selectively stacked only at the position where the connector terminal 50 is located, the effect of simplifying the stacking unit 40 process and reducing manufacturing cost may be expected.

5 is a view showing a coupling relationship of the probe assembly of FIG.

As shown in the drawing, in the probe assembly 10 according to the exemplary embodiment of the present invention, the probe 20 and the chuck layer portion 40 may be coupled to the substrate 30.

In the central region of the substrate 30, a slit 32 into which the beam 25 of the probe 22 is inserted may be provided. Therefore, when the substrate 30 is viewed from above, only a portion corresponding to the beam 25 of the probe 22 may be exposed to the outside and observed.

The probe 22 may be provided with a rib 26.

The rib 26 may be a portion in which the base 21 of the probe 22 extends outward. When the probe 22 is coupled to the substrate 30, the rib 26 may be coupled to the contact surface 33 of the substrate 30. Therefore, even when an external force is applied, the probe 22 may be stably coupled to the substrate 30. The substrate 30 and the probe 22 may be coupled through a soldering and / or bonding method.

Each layer 40a to 40n of the stack 40 may be stacked on the substrate 30. By changing the number of the lair 40a to 40n, the height of the stack 40 may be adjusted.

6 illustrates a probe of the probe assembly of FIG. 1.

As shown in this, the probe 22 according to an embodiment of the present invention may be configured in various forms.

The probe 22 may be in the form of a thin plate that has undergone an etching process, a pressing process, or the like. For example, it may be possible to manufacture the shape of the probe 22 through the selective etching and / or pressing process through the etching process. Therefore, compared to the case of the three-dimensional shape, etc., the process can be relatively simplified, and the manufacturing cost can be reduced.

As shown in FIG. 6A, the probe 22 may be provided with one long hole 29 between the base 21 and the beam 25. When the tip 27 contacts the wafer, the beam 25 may be elastically deformed into the space of the long hole 29.

As shown in FIG. 6B, the probe 22 may include a plurality of beams 25. That is, the first, second, and third beams 25a, 25b, and 25c may extend from the post 23.

Since a plurality of beams 25 are provided, a plurality of long holes 29 may be provided between the base 21 and the first beam 25a. That is, the first, second, and third long holes 29a, 29b, and 29c may be provided.

When a plurality of long holes 29 are provided, the amount of scrub generated by retraction of the tip 27 with which the wafer is in contact may be reduced. That is, the x-direction deformation caused by the retraction of the tip 27 is dispersed by the first, second and third long holes 29a, 29b and 29c, so that the tip 27 moves only in the y direction. Means. Thus, more accurate measurements may be possible.

FIG. 7 illustrates a probe card including the probe assembly of FIG. 1. FIG.

As shown in the drawing, the probe card 100 according to an embodiment of the present invention may include first and second reinforcing plates 120 and 140 and a main board 130.

The first and second reinforcing plates 120 and 140 may be coupled to the lower and upper surfaces of the main board 130. Since the first and second reinforcement plates 120 and 140 are coupled to each surface of the main board 130, deformation of the main board 130 may be prevented. The first and second reinforcing plates 120 and 140 may be made of a material having a light weight and a constant strength, such as an aluminum alloy.

The main substrate 130 may have a circular flat plate shape. The circuit pattern 135 may be provided on one surface of the main substrate 130. The circuit pattern 135 may be connected to a connector 80 of a flexible material extending from the probe assembly 10. Through the connector 80, the circuit pattern 135 and the probe 10 may exchange electrical signals.

The probe assembly 10 may be located at a seating portion 122 inside the first reinforcing plate 120. The plurality of seating parts 122 may be provided in the first reinforcement plate 120.

Each probe assembly 10 located in the seat 122 may contact the semiconductor device of the wafer. The circuit pattern 135 exchanges an electrical signal with the probe assembly 10 in contact with the semiconductor device to obtain data for determining whether the specific semiconductor device is defective.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

10: probe assembly 20: probe unit
30 substrate 40 laminated part
50: connector terminal 60: connector line
70 connector 80 connector
90: assembly 100: probe card

Claims (15)

A probe unit including a plurality of probes;
A substrate coupled to the probe unit; And
And a plurality of connector terminals to which a plurality of wires connected to the plurality of probes are connected. The method according to claim 1,
Further comprising a laminate formed by laminating at least one layer on at least one region of the substrate,
In the laminated portion,
And a plurality of wires arranged to couple the connector terminals. The method of claim 2,
In the laminated portion,
And the wiring is arranged in a plurality of layers. The method according to claim 1,
At least two connector terminals adjacent to each other among the plurality of connector terminals include:
And probe assemblies spaced at substantially equal intervals. The method of claim 2,
The lamination part,
At least one flexible printed circuit board (FPCB) is laminated on at least a portion of an outer circumference of the substrate. The method according to claim 1,
A connector line coupled to the connector terminal to provide a path for exchanging electrical signals with the plurality of probes;
And at least one connector electrically connected to the connector line. The method according to claim 1,
The substrate is provided with a plurality of slits into which the plurality of probes are inserted,
The probe unit,
And a plurality of ribs extending from at least one side of the probe unit and in contact with one surface of the substrate. The method of claim 7, wherein
And a plurality of couplings connecting the plurality of ribs to the plurality of wires. The method according to claim 1,
The plurality of probes,
A post extending from the base of the probe unit,
A plurality of beams in which the post is refracted and extended;
And a tip (tip) formed and refracted outward from the end of the beam. The method according to claim 1,
The plurality of probes,
Probe assembly characterized in that the form of a two-dimensional thin plate manufactured through at least one of the etching process and the pressing process. A guide plate provided with a plurality of slits;
A probe unit including a plurality of probes inserted into the plurality of slits, a substrate coupled to the probe unit, a laminate formed by stacking at least one layer on at least one region of the substrate, and one surface of the laminate A probe assembly positioned at the and including a plurality of connector terminals connected to a plurality of wires connected to the plurality of probes; And
And a main board including a circuit pattern electrically connected to the connection body extending from the probe assembly. 12. The method of claim 11,
The contact,
And a connector line electrically connected to the connector terminal, the connector line providing a path for exchanging electrical signals with the plurality of probes. 12. The method of claim 11,
At least two connector terminals adjacent to each other among the plurality of connector terminals include:
Probe cards, characterized in that arranged substantially spaced at equal intervals. 12. The method of claim 11,
The lamination part,
A probe card, characterized in that formed by stacking at least one flexible printed circuit board (FPCB). A base extending from a wire connected to the connector terminal;
A post extending from the base;
A plurality of beams in which the post is refracted and extended; And
And a tip formed at an end of the beam to be deflected outwardly.

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