KR102018787B1 - Probe card and manufacturing method thereof - Google Patents

Abstract

According to the present invention, a probe card comprises: a printed circuit board having a plurality of pads formed thereon; and a space transforming module coupled to the printed circuit board and configured to connect the pads formed on the printed circuit board and pads formed on a plurality of semiconductor devices to each other. The space transforming module includes: a probe block having a plurality of probes configured to be in contact with the pads formed on the semiconductor devices; and an interposer unit extending in a direction crossing a direction in which a surface of the printed circuit board is disposed and having a flexible circuit board configured to electrically connect the pads formed on the printed circuit board and the probes to each other. Accordingly, when a spatial transformation is implemented, a fine pitch can be formed, and circuit characteristics can be further enhanced.

Description

PROBE CARD AND MANUFACTURING METHOD THEREOF

The present invention relates to a probe card and a method of manufacturing the same, which are electrically connected to a semiconductor device formed on a wafer to perform a function of testing the performance of the semiconductor device.

In general, a probe card electrically connects a wafer and an inspection device to test performance during or after fabrication of a semiconductor device such as a semiconductor memory, and transmits an electrical signal of the inspection device to a semiconductor device, which is a test object formed on the wafer. It is a device for transmitting a signal from the semiconductor device to the inspection equipment.

A typical probe card includes a printed circuit board (PCB), a space transformer (STF), a fixed tip attached to the space transformer, and an interposer connecting the printed circuit board and the space transformer. At this time, the space converter is composed of a multi-layer ceramic substrate (MLC).

That is, the space converter is configured such that as the ceramic layer and the metal layer are laminated at the intersection, the gap between the adjacent metal layers becomes narrower and the pitch is changed from the upper substrate connected to the printed circuit board toward the lower side connected to the tip.

However, such a space converter is generally manufactured with a multilayer ceramic substrate, and has a disadvantage in that a manufacturing period is long and manufacturing cost is high. In other words, the space converter is an expensive product and takes up a considerable part of the cost of the probe card. As the size of the probe card increases, the space converter also increases in size, thereby increasing the cost of producing the probe card.

Accordingly, Patent Document 1 proposes an interposer combined space converter unit which is formed to be stacked in a direction perpendicular to the direction in which printed circuit boards are stacked, instead of a space converter in which a multilayer ceramic substrate having a high manufacturing cost is stacked. have.

Patent document 1 is a structure which mounts the interposer unit which is a component from which a stacking direction differs between a probe tip and a printed circuit board, and is made to perform pitch conversion by the slit structure formed in an interposer unit. However, in order to perform the fine spatial conversion required for the integrated chip, a circuit structure and a pitch between the pads may be more finely implemented, and further, a design for a probe card that can be easily manufactured is required.

KR 10-2012-0102341 A (2012.09.18. open)

One object of the present invention is to provide a probe card having a substrate structure capable of forming a finer pitch in providing spatial conversion and providing a circuit configuration with improved electrical characteristics.

Another object of the present invention is to provide a probe card configured to stably implement physical and electrical coupling of circuit boards arranged in a direction perpendicular to each other.

Still another object of the present invention is to provide a method of manufacturing a probe card, which can be fabricated by sequentially assembling various components in parallel to each other including circuit boards arranged in directions perpendicular to each other.

Probe card according to the present invention in order to achieve the object of the present invention, a plurality of pads are formed printed circuit board; And a space conversion module coupled to the printed circuit board and configured to connect pads formed on the printed circuit board and pads formed on the plurality of semiconductor devices to each other, wherein the space conversion module includes a pad formed on the semiconductor device. A probe block having a plurality of probes configured to contact each other; And an interposer unit having a flexible circuit board extending in a direction crossing the surface direction of the printed circuit board and electrically connected to the pad and the probe formed on the printed circuit board.

The flexible circuit board may include a pattern portion for patterning at least one of a capacitor, a signal branch device, and a resistance element to form an electrical circuit connected to the probe.

Probe card according to the present invention to achieve another object of the present invention, a plurality of pads are formed printed circuit board; And a space conversion module coupled to the printed circuit board and configured to connect pads formed on the printed circuit board and pads formed on the plurality of semiconductor devices to each other, wherein the space conversion module includes a pad formed on the semiconductor device. A probe block having a plurality of probes configured to contact each other; And a flexible circuit board extending in a direction crossing the surface direction of the printed circuit board and configured to electrically connect the pad formed on the printed circuit board and the probe to each other, and mounted on a surface of the printed circuit board. And an interposer unit having a connector formed to receive a lateral end of the.

The connector may include a connector pin configured to electrically connect the pad formed on the printed circuit board and the flexible circuit board to each other.

The connector may include a connector slit open to a side coupled with the printed circuit board to receive the connector pins; And a receiving part formed to receive the lateral end of the flexible circuit board in a direction opposite to the direction in which the connector pin is inserted into the connector slit.

The connector may further include a step portion formed to cover at least a portion of the connector slit spaced apart from the surface of the printed circuit board to support the connector pin received in the connector slit.

The connector pin may include a locking portion formed to surround the stepped portion when the connector pin is inserted into the connector slit to be supported by the stepped portion.

The connector may include a first connector layer mounted on a surface of the printed circuit board; And a second connector layer stacked on the first connector layer to be spaced apart from the surface of the printed circuit board.

The connector may include a connector slit formed to sequentially pass through the first and second connector layers to receive the connector pins; And a stepped portion formed on the second connector layer so as to cover a portion of the connector slit passing through the first connector layer to support the connector pin.

In addition, the probe card according to the present invention in order to achieve another object of the present invention, a printed circuit board is formed with a plurality of pads; And a space conversion module coupled to the printed circuit board and configured to connect pads formed on the printed circuit board and pads formed on the plurality of semiconductor devices to each other, wherein the space conversion module includes a pad formed on the semiconductor device. A probe block having a plurality of probes configured to contact each other; And an interposer unit having a flexible circuit board extending in a direction crossing the surface direction of the printed circuit board and electrically connected to the probe and the pad formed on the printed circuit board, wherein the probe block includes: A receiving groove extending along one surface to receive the lateral end of the flexible circuit board; And a probe slit formed to insert the probe into a surface opposite to one surface on which the receiving groove is formed.

The probe slit may be positioned adjacent to the accommodating groove so that the flexible circuit board is electrically connected to the probe while the flexible circuit board is inserted into the accommodating groove.

The flexible circuit board may include a plurality of space conversion pads formed at points spaced apart from each other by lateral ends inserted into the receiving grooves, and the probes may be in contact with the plurality of space conversion pads, respectively. It may be provided with a plurality of space conversion contact portion formed to protrude from the probe slit with different lengths.

The probe block may include a first layer forming a bottom portion of the receiving groove; And a second layer coupled to the first layer to form a side portion of the receiving groove.

In order to achieve another object of the present invention, an interposer unit having a flexible printed circuit board and a connector for coupling the flexible printed circuit board and the printed circuit board to each other, and connected to the flexible printed circuit board formed on a plurality of semiconductor devices A method of manufacturing a probe card including a probe block configured to be in contact with a pad includes: manufacturing a flexible circuit board to form an electrical circuit on the flexible circuit board; A probe block manufacturing step of forming a probe block having a receiving groove formed to receive one lateral end of the flexible circuit board; A connector manufacturing step of forming a connector having a receiving portion formed to receive the other lateral end of the flexible circuit board; Probe block-flex circuit board assembly step of mounting the flexible circuit board in the receiving groove in the state that the probe is inserted into the probe slit formed in the probe block; A connector-printed circuit board assembly step of attaching the connector to the printed circuit board while the connector pin is inserted into the connector slit formed in the connector; And assembling the flexible circuit board-connector to insert the flexible circuit board coupled to the probe block to the accommodation portion.

The method of manufacturing the probe card may include forming a block plate having a through portion; And a probe block-block plate assembly step of mounting the assembly of the probe block and the flexible circuit board to the block plate such that the flexible circuit board protrudes through the through part.

The connector fabrication step may include forming a first connector layer having a first slit and a second connector layer having a second slit; And laminating and bonding the first connector layer and the second connector layer to each other such that the first slit and the second slit communicate with each other.

The manufacturing of the probe block may include forming a first layer and a second layer forming a side portion of the receiving groove; And laminating and bonding the first layer and the second layer to each other such that the first layer forms a bottom portion of the receiving groove.

According to the present invention constituted by the solutions described above, the following effects can be obtained.

In the probe card according to the present invention, since the space conversion is implemented by a flexible circuit board extending to intersect with the printed circuit board, minute pitch conversion can be easily implemented while ensuring durability. In addition, the interposer unit can be miniaturized and lightweight.

In particular, circuit components may be mounted on the flexible circuit board so that various adjustments of current and voltage values, circuit branching, and the like may be performed, and noise removal and impedance matching may be performed near the probe, thereby providing circuit characteristics. This can be improved.

The probe card according to the present invention includes a connector connecting the flexible printed circuit board and the printed circuit board to each other, so that the substrates stacked in different directions can be stably coupled and perform a function. In particular, durability and reliability can be ensured by absorbing non-uniform displacement of the plurality of spatial conversion modules.

A method of manufacturing a probe card according to the present invention includes forming an assembly of a probe block and a flexible circuit board, and an assembly of a connector and a printed circuit board, respectively, and assembling these assemblies to each other. As a result, the components can be assembled in a side-by-side direction (surface direction of the flexible printed circuit board), so that fabrication convenience can be improved and durability of the probe card can be easily secured.

1 is a cross-sectional view of a probe card according to the present invention.
2 is a perspective view of the space conversion module shown in FIG.
3 is a front view of the flexible printed circuit board of FIG. 2.
4 is a cross-sectional view of the connector shown in FIG.
5 is a conceptual view illustrating an assembly process of the connector illustrated in FIG. 2.
6 is a perspective view of the probe block shown in FIG.
FIG. 7 is a cross-sectional view of the probe block shown in FIG. 6. FIG.
8 is a conceptual view illustrating an assembly process of the probe block illustrated in FIG. 6.
9 is a conceptual view showing a manufacturing method of a probe card according to the present invention.
FIG. 10 is a conceptual view illustrating a plurality of space conversion modules in the flexible circuit board-connector assembly step shown in FIG. 9; FIG.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is "connected" to another part, this includes not only "directly connected" but also "electrically connected" with another element in between. . In addition, when a part is said to "include" a certain component, which means that it may further include other components, except to exclude other components unless otherwise stated.

1 is a cross-sectional view of the probe card 10 according to the present invention, Figure 2 is a perspective view of the space conversion module 100 shown in FIG. 3 is a front view of the flexible circuit board 121 illustrated in FIG. 2.

1 to 3, the probe card 10 according to the present invention may include a printed circuit board 200 and a space conversion module 100.

The printed circuit board 200 may serve to generate and control an electrical signal for performing a test. The printed circuit board 200 may have a plurality of pads formed to supply current to the test objects, respectively.

The space conversion module 100 provided in the present invention serves to electrically connect the printed circuit board 200 and a plurality of semiconductor devices to be tested. In detail, the spatial transform module 100 may include a probe block 110 and an interposer unit 120. The probe block 110 includes a plurality of probes 111 in contact with each other so as to be electrically connected to pads formed in the semiconductor device under test.

The interposer unit 120 serves to physically and electrically connect the printed circuit board 200 and the probe block 110 of the probe card 10 to each other. In detail, the interposer unit 120 may be configured to electrically connect the pad formed on the printed circuit board 200 and the probe 111 of the probe block 110 to each other.

In the interposer unit 120, a plurality of circuits are formed to connect the plurality of pads formed in the printed circuit board 200 and the semiconductor device to each other. In particular, as the degree of integration of semiconductor devices increases, it is required that a number of circuits be formed to be integrated in the interposer unit 120. The pitch between circuits or between pads is an important factor, and it becomes a problem to ensure sufficient durability while forming it finely.

Meanwhile, the probe card 10 according to the present invention may further include a reinforcement plate 210, a flat bolt 220, and a block plate 300. The reinforcement plate 210 may be coupled to one side surface (eg, the upper surface) of the printed circuit board 200 to serve to enhance durability. The plurality of flat bolts 220 may perform a function of finely controlling the distance or angle between the printed circuit board 200 and the block plate 300. The flat bolt 220 may be formed to penetrate the printed circuit board 200 and the reinforcement plate 210, and may be positioned such that one end thereof is supported by the block plate 300. The block plate 300 may be positioned to be spaced apart from the other surface (eg, the bottom surface) of the printed circuit board 200, and may be configured to integrally connect and support the probe blocks 110 described below.

In order to realize a fine pitch in the space conversion of the probe card 10 according to the present invention, the interposer unit 120 of the present invention includes a flexible circuit board 121. Flexible printed circuit board (FPCB) 121 is a substrate formed by forming a conductor circuit on an insulator made of a thin and flexible material, and has advantages in terms of flexibility and light weight.

As shown, the flexible circuit board 121 constituting the interposer unit 120 of the present invention may extend so that both ends thereof face the printed circuit board 200 and the probe block 110, respectively. Specifically, one end is mounted to the probe block 110 to be physically and electrically connected to the probe 111, and the other end is electrically and physically connected to the printed circuit board 200 via the connector 122 described later. Can be connected.

In detail, the flexible circuit board 121 may include a substrate portion 121a and a pattern portion 121b. The substrate part 121a may be made of an insulating film material, and may be disposed to extend in a direction (for example, a vertical direction) crossing each other with a surface direction in which the printed circuit board 200 extends.

The pattern portion 121b may be coupled to at least one surface of the substrate portion 121a to form a conductor circuit. One end of the pattern portion 121b may be in contact with and electrically connected to the probe 111, and the other end may be in contact with and electrically connected to the connector pin 123 which will be described later. The pattern portion 121b may form a plurality of paths in parallel to be connected to the plurality of probes 111, and may include a branch or joining point. As the path of the pattern portion 121b formed on the substrate portion 121a and the distance between circuits are changed, pitch conversion between the printed circuit board 200 and the pad of the semiconductor device may be performed.

When the space conversion is implemented by the flexible circuit board 121 as in the present invention, a fine pitch may be easily implemented as compared with a case in which a multilayer ceramic substrate or a silicon substrate including a slit is stacked in a vertical direction.

In addition, in the conventional configuration of forming the slit, since a certain level of rigidity is required to maintain the three-dimensional slit structure, there is a limit in forming and maintaining the fine slit. On the contrary, in the present invention, since the pattern portion 121b is attached to the surface of the substrate portion 121a of the flexible circuit board 121 in a film form, a finer pitch may be formed in a simple structure.

In addition, the flexible printed circuit board 121 provided in the present invention may be made of a flexible elastic deformation to a certain level. Accordingly, the space conversion module 100 of the present invention is adapted to absorb deviations (designed differences or manufacturing tolerances, etc.) that may exist between individual semiconductor devices when the printed circuit board 200 is in contact with a plurality of semiconductor devices, respectively. It can be modified. Therefore, the space conversion module 100 of the present invention can improve the contact characteristics with the semiconductor device, it is possible to further ensure the reliability of the signal and operation.

In addition, the space conversion module 100 of the present invention employs the flexible circuit board 121, which is advantageous in that the size and weight are reduced compared to the conventional substrate structure.

Meanwhile, various circuit elements may be mounted on the pattern portion 121b of the flexible circuit board 121 provided in the present invention. For example, a capacitor, a signal branch element, a resistance element, and the like may be formed in the pattern portion 121b, and current reduction, voltage rise, and circuit branching may be variously performed. Accordingly, noise removal, impedance matching, and the like on the circuit formed in the pattern portion 121b may be performed, and the circuit configuration may be variously changed. In particular, since the circuit elements are mounted on the pattern portion 121b of the flexible circuit board 121 in direct contact with the probe 111, the circuit characteristics may be effectively adjusted on the side very close to the probe 111.

On the other hand, the pattern portion 121b of the flexible circuit board 121 provided in the present invention may be formed on both surfaces of the substrate portion 121a, respectively. Therefore, more electrical circuits are formed in one substrate portion 121a, so that finer space conversion is possible.

In the above, the structure in which the flexible circuit board 121 is included in the interposer unit 120 of the probe card 10 and the effects thereof have been described. Hereinafter, referring to FIG. 4, the connector 122 and the coupling structure for stably coupling the flexible circuit board 121 and the printed circuit board 200 will be described.

4 is a cross-sectional view of the connector 122 shown in FIG. 1 to 4, the interposer unit 120 may further include a connector 122. The connector 122 may be mounted on the surface of the printed circuit board 200, and the lateral end of the flexible circuit board 121 may be supported by the connector 122.

The connector 122 may be formed to physically and electrically connect the printed circuit board 200 and the flexible circuit board 121 having different surface directions to each other. The connector 122 may include a plurality of connector pins 123 electrically connecting the pads formed on the printed circuit board 200 and the flexible circuit board 121 to each other.

In addition, the connector 122 may further include a receiving portion 122a extending in one direction of the surface direction of the printed circuit board 200 to accommodate the lateral end of the substrate portion 121a. The board part 121a of the flexible printed circuit board 121 is intersected with the surface direction of the printed circuit board 200 by the connector 122 including the receiving part 122a (for example, the direction perpendicularly crosses). ) May be arranged.

Furthermore, the connector 122 may further include a plurality of connector slits 122b. A plurality of connector slits 122b may be inserted into and mounted in the connector slit 122b. In particular, the connector slit 122b may be positioned so that the pattern portion 121b and the connector pin 123 come into contact with each other while the substrate portion 121a is inserted into the accommodation portion 122a. It may be formed at a position adjacent to 122a). As shown in the drawing, the receiving portion 122a and the connector slit 122b may extend vertically and communicate with each other so that the connector pins 123 contact both surfaces of the substrate portion 121a inserted into the receiving portion 122a. have.

Specifically, the plurality of connector pins 123 may be symmetrically arranged with respect to the plane in which the substrate portion 121a extends. That is, the connector pins 123 may be disposed in pairs at points symmetrical with each other with the substrate 121a interposed therebetween. The pair of connector pins 123 that are symmetrical to each other may include a pair of elastic contact portions 123a contacting and supported by the pattern portion 121b while being elastically deformed in a direction away from each other when the substrate portion 121a is inserted. have. The pair of elastic contact portions 123a may have a hook shape that is symmetrical with each other, and may elastically support points that are symmetrical with respect to both surfaces of the substrate portion 121a as shown in FIG. 4.

Meanwhile, the connector slit 122b and the receiving portion 122a may be formed such that the connector pin 123 and the flexible circuit board 121 are inserted in opposite directions, respectively. As shown, the connector slit 122b is opened to the side (upper side) coupled with the printed circuit board 200 to receive the connector pin 123, the receiving portion 122a is the connector pin 123 The lateral end of the flexible printed circuit board 121 may be accommodated in a direction opposite to the direction in which it is inserted (lower side).

According to the connector 122 of the present invention, even if the flexible circuit board 121 is coupled to the printed circuit board 200 in a direction crossing each other, it can be structurally supported stably and reliability of electrical contact can be ensured. . In addition, since the flexible circuit board 121 and the connector 122 are not fixedly coupled to each other but are fluidly coupled by the elastic support force of the connector pin 123, the positional deviation between the plurality of spatial conversion modules 100 may be absorbed. Can be.

5 is a conceptual view illustrating an assembly process of the connector 122 illustrated in FIG. 2. 5, the connector 122 of the space conversion module 100 of the present invention may be assembled by combining two layers and inserting and mounting the connector pin 123.

The connector 122 is a first connector layer 122x mounted on the surface of the printed circuit board 200, and a second connector coupled with the first connector layer 122x and positioned to be spaced apart from the printed circuit board 200. The layer 122y may be provided. That is, the connector 122 may be positioned to protrude from the surface of the printed circuit board 200 by the thickness of the first and second connector layers 122x and 122y. In addition, the accommodating part 122a accommodating the flexible circuit board 121 may be formed to penetrate the first and second connector layers 122x and 122y.

Meanwhile, the connector slit 122b may include a first slit 122b1 penetrating the first connector layer 122x and a second slit 122b2 penetrating the second connector layer 122y. The first and second slits 122b1 and 122b2 communicate with each other in the thickness direction of the connector 122, so that the connector pin 123 may be mounted through the first and second slits 122b1 and 122b2.

However, in order to fix and support the position of the connector pin 123, the first slit 122b1 and the second slit 122b2 may have different slit shapes. For example, the second connector layer 122y may include a step portion 122c formed to cover a part of the first slit 122b1 in the thickness direction. The stepped portion 122c may be positioned to be spaced apart from the surface of the printed circuit board 200. By the step portion 122c, a portion of the connector pin 123 passing through the first slit 122b1 may be supported in the thickness direction by the second connector layer 122y without passing through the second slit 122b2. .

As a structure corresponding to the stepped portion 122c, the connector pin 123 is formed to surround the stepped portion 122c when inserted into the connector slit 122b, and has a catching portion 123b supported by the stepped portion 122c. can do. Since the locking portion 123b is formed to surround the stepped portion 122c in one of the thickness directions and in both directions, the connector pin 123 may be constrained in three directions by the stepped portion 122c.

As shown in FIG. 5, first and second connector layers 122x and 122y may be formed to be coupled to each other. The first and second connector layers 122x and 122y may be formed by simultaneously etching one silicon substrate. The first and second connector layers 122x and 122y may be coupled to each other by a surface-mount technology (SMT) method.

Thereafter, the connector pin 123 may be inserted into the connector slit 122b in one of the thickness directions of the connector 122. In the illustrated embodiment, the connector pin 123 is first inserted into the first slit 122b1 and constrained to move in both directions among the surface directions of the connector 122, and is inserted into the second slit 122b2 to catch the locking portion ( The movement in three directions may be further restricted by the 123b and the stepped part 122c. As a result, the connector pin 123 is constrained in all directions in addition to the direction in which the connector pin 123 is inserted into the connector slit 122b, thereby being firmly fixed to the connector 122. In the insertion direction of the connector pin 123, the connector 122 may be mounted on the surface of the printed circuit board 200, thereby restricting the movement.

By the above coupling structure and order, the position of the connector pin 123 with respect to the connector 122 and the printed circuit board 200 can be completely fixed without a separate bonding process, the assembly process can be simplified.

In the above, the coupling structure of the flexible circuit board 121 and the connector 122 and the assembly and mounting of the connector 122 itself have been described. Hereinafter, the coupling structure of the interposer unit 120, in particular, the flexible circuit board 121 and the probe block 110, and the effects thereof will be described.

6 is a perspective view of the probe block 110 shown in FIG. 2, and FIG. 7 is a cross-sectional view of the probe block 110 shown in FIG. 6. Referring to the drawings, the probe block 110 may include a receiving groove 112 extending along one surface of the probe block 110 to accommodate the lateral end of the substrate portion 121a. As a result, both lateral ends of the flexible circuit board 121 may be inserted into the receiving portion 122a of the connector 122 and the receiving groove 112 of the probe block 110, respectively. Since the connector 122 and the probe block 110 may be vertically coupled to the flexible circuit board 121, respectively, the connector 122 and the probe block 110 may be arranged in parallel with each other.

Meanwhile, the probe block 110 may further include a plurality of probe slits 113 on which the probe 111 is mounted. The probe slit 113 may be formed at a position adjacent to the accommodating groove 112, and the pattern portion 121b and the probe 111 may be in contact with each other while the substrate portion 121a is inserted into the accommodating groove 112. It may be formed in a position that can be electrically connected.

The receiving groove 112 and the probe slit 113 may be formed on one surface and the opposite surface to accommodate the flexible circuit board 121 and the probe 111 in different directions, respectively. As shown, the receiving groove 112 is opened in a direction (upward direction) facing the printed circuit board 200 to accommodate the lateral end of the flexible circuit board 121, the probe slit 113 The probe 111 may be accommodated in a direction opposite to the direction in which the flexible circuit board 121 is inserted (downward direction).

In addition, the probe card 10 according to the present invention has a structural feature in which additional spatial transformation may be performed when the probe 111 and the pattern unit 121b are connected.

Specifically, the plurality of space conversion pads 121c may be spaced apart from each other by one distance from one end of the substrate portion 121a into which the receiving groove 112 is inserted and contact the probe 111. It may be provided. For example, the space conversion pad 121c has a first thermal pad 121c1 disposed relatively close to one end of the substrate portion 121a and a first thermal pad (1) from one end of the substrate portion 121a. The second thermal pad 121c2 disposed farther than 121c1 may be provided. According to such a two-row pad structure, a larger number of pads can be formed than to arrange the pads side by side in the same width space.

In addition, the probe 111 may include a plurality of space conversion contact parts 111a and 111b to correspond to the space conversion pad 121c. The plurality of space conversion contact parts 111a and 111b may be formed to extend in different lengths so as to be in contact with the space conversion pads 121c having different distances from the receiving groove 112. As illustrated, the space conversion contact unit may include a first contact portion 111a having a relatively short length and a second contact pad 111c2 contacting the first thermal pad 121c1. The second contact portion 111b may extend to a longer length.

In the space transformation module 100 of the present invention, the spatial transformation may be additionally performed by a multilayer coupling structure of the space transformation pad and the contact portions 121c, 111a, and 111b. In particular, this additional spatial transformation can reduce the constraints caused by the area of the pads formed in the pattern portion 121b of the flexible circuit board 121, thereby realizing the micro pitch more integrated.

8 is a conceptual diagram illustrating an assembly process of the probe block 110 illustrated in FIG. 6. The probe block 110 of the present invention may be manufactured similar to the coupling structure and the assembly process of the connector 122 described above.

In particular, the probe block 110 may be coupled to the first layer 110x and the first layer 110x to form the bottom portion of the accommodation groove 112 for accommodating the lateral end of the flexible circuit board 121. It may include a second layer (110y) forming a side portion of (112). Since the bottom and side portions of the accommodation groove 112 are formed by the first and second layers 110x and 110y, respectively, the process of separately designing the depth of the accommodation groove 112 in the thickness direction may be omitted. have.

In addition, the probe 111 fixed to the probe block 110 may include, in addition to the space conversion contact portions 111a and 111b, a die contact portion that contacts a pad formed on a semiconductor device, a die contact portion, and a space conversion contact portion 111a, 111b) may be connected to each other and provided with a fixing part contacting and supporting the first layer 110x. Since the space conversion contact portions 111a and 111b extend from the fixing portions to different lengths, the fixing portions formed on the plurality of probes 111 may be additionally aligned even if they are inserted side by side in the first layer 110x. Can be implemented.

Furthermore, the first and second connector layers 122x and 122y described above and the first and second layers 110x and 110y of the probe block 110 may be manufactured by one substrate. As a result, a plurality of components of the space conversion module 100 according to the present invention may be more easily manufactured.

In the above, the probe card 10 according to the present invention has been described with respect to the characteristics including the flexible circuit board 121 and the coupling relationship between the components centered on the flexible circuit board 121. Hereinafter, a method of manufacturing a probe card that can effectively manufacture and assemble various components included in the probe card 10 according to the present invention will be described.

FIG. 9 is a conceptual diagram illustrating a method of manufacturing a probe card according to the present invention, and FIG. 10 is a conceptual diagram illustrating a plurality of space conversion modules 100 in the flexible circuit board-connector assembly step S4 illustrated in FIG. 9.

Referring to FIGS. 9 and 10 together with FIGS. 5 and 8 described above, the method of manufacturing a probe card according to the present invention includes a flexible circuit board fabrication step, a probe block fabrication step, and a connector fabrication step. A flexible printed circuit board assembly step (S1), a connector printed circuit board assembly step (S3) and a flexible printed circuit board-connector assembly step (S4).

The flexible circuit board manufacturing step includes forming the pattern portion 121b on the substrate portion 121a described above. The pattern unit 121b may be formed to perform spatial conversion, circuit branching, voltage and current value change, etc. on the electric signal.

Probe block fabrication may include the processes illustrated in FIG. 8. The silicon substrate may be processed to form first and second layers 110x and 110y, respectively, and the first and second layers 110x and 110y may overlap each other and be bonded to each other. In this case, the first layer 110x may form a side portion of the accommodation groove 112 described above, and the second layer 110y may form a bottom surface portion of the accommodation groove 112. The receiving groove 112 may be formed to receive one lateral end (lower end) of the flexible circuit board 121.

The connector manufacturing step may include the processes illustrated in FIG. 5. Specifically, the silicon substrate may be processed to form the first and second connector layers 122x and 122y, respectively, and the first and second connector layers 122x and 122y may be stacked and bonded to each other. First slits 122b1 may be formed in the first connector layer 122x, and second slits 122b2 may be formed in the second connector layer 122y. The first slit 122b1 and the second slit 122b2 may have different cross-sectional shapes in the direction in which the connector pin 123 is inserted, and the connector is coupled by the first and second slits 122b1 and 122b2. A step portion 122c may be formed in the slit 122b. The accommodating part 122a may be formed to accommodate the other lateral end (upper end) of the flexible circuit board 121.

The flexible circuit board 121, the probe block 110, and the connector 122 manufactured as described above may be assembled by the following steps.

In the probe block-flex circuit board assembling step S1, the flexible circuit board 121 may be inserted into the receiving groove 112 while the probe 111 is inserted into the probe slit 113. In this case, the probe 111 and the flexible circuit board 121 may be in contact with each other and electrically connected.

In the connector-printed circuit board assembly step S3, the connector 122 may be attached to the printed circuit board 200 while the connector pin 123 is inserted into the connector slit 122b. As the printed circuit board 200 is coupled in the direction in which the connector pin 123 is inserted, the pad and the connector pin 123 formed on the printed circuit board 200 may be in contact with and electrically connected to each other.

Assemblies formed by the above two steps, may be coupled to each other by the flexible circuit board-connector assembly step (S4). In detail, the other lateral end portion opposite to the one lateral end portion of the flexible circuit board 121 connected to the probe block 110 and the connector 122 attached to the printed circuit board 200 may be coupled to each other. have. The upper end of the flexible printed circuit board 121 may be inserted into the receiving portion 122a of the connector 122, whereby the connector pin 123 and the flexible printed circuit board 121 may be contacted and electrically connected to each other. Can be connected.

Meanwhile, the method of manufacturing the probe card 10 according to the present invention, such that the plurality of space conversion modules 100 are attached to the printed circuit board 200 at once, further includes a block plate manufacturing step and a probe block-block plate assembly step. can do.

In the block plate manufacturing step, a block plate 300 having a plurality of through parts may be formed. Each through part may be formed at a position where the probe block 110 is mounted.

In the probe block-block plate assembly step, an assembly in which the probe block 110 and the flexible circuit board 121 are assembled with each other may be mounted on one surface (lower surface) of the block plate 300. In this case, the flexible circuit board 121 mounted on the probe block 110 may be disposed to protrude to another surface (upper surface) of the block plate 300 through the through part. As shown in FIG. 10, the plurality of probe blocks 110 and the flexible circuit board 121 mounted on the block plate 300 may be integrally mounted to a combination of the printed circuit board 200 and the connector 122. Can be.

According to the method of manufacturing a probe card according to the present invention, the components may be assembled in parallel to each other (surface direction of the flexible circuit board 121, up and down direction), thereby improving manufacturing convenience. In addition, as shown, the flat bolt 220 may also be arranged in the vertical direction, there is an advantage that can be absorbed and shock absorbed between the space conversion module 100 when operating the probe card (10). Accordingly, durability and reliability of the probe card 10 can be further improved.

The description of the present invention described above is for illustrative purposes, and those skilled in the art can understand that the present invention can be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. There will be. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

In addition, the scope of the present invention is shown by the following claims rather than the detailed description, it should be construed that all changes or modifications derived from the meaning and scope of the claims and equivalent concepts thereof are included in the scope of the present invention. do.

10: probe card 100: space conversion module
110: probe block 110x: first layer
110y: second layer 111: probe
112: receiving groove 113: probe slit
120: interposer unit 121: flexible circuit board
121a: substrate portion 121b: pattern portion
121c: space conversion pad 122: connector
122a: receiving portion 122b: connector slit
122c: stepped portion 122x: first connector layer
122y: second connector layer 123: connector pin
123a: elastic contact portion 123b: locking portion
200: printed circuit board 210: reinforcement plate
220: flat bolt 300: block plate
310: through part

Claims (16)

A printed circuit board on which a plurality of pads are formed; And
A space conversion module coupled to the printed circuit board and configured to connect pads formed on the printed circuit board and pads formed on the plurality of semiconductor devices to each other;
The space conversion module,
A probe block having a plurality of probes configured to contact pads formed in the semiconductor device; And
An interposer unit having a flexible circuit board extending in a direction crossing the surface direction of the printed circuit board and electrically connected to the pad and the probe formed on the printed circuit board;
The interposer unit further includes a connector mounted to a surface of the printed circuit board and configured to receive a lateral end of the flexible circuit board,
And the connector comprises a connector pin configured to electrically connect a pad formed on the printed circuit board and the flexible circuit board to each other. The method of claim 1,
The flexible circuit board may include a pattern unit configured to form at least one of a capacitor, a signal branch device, and a resistor device to form an electrical circuit connected to the probe. delete The method of claim 1,
The connector,
A connector slit open to a side coupled with the printed circuit board to receive the connector pins; And
And a receptacle formed to receive a lateral end of the flexible circuit board in a direction opposite to that in which the connector pin is inserted into the connector slit. The method of claim 4, wherein
The connector further comprises a stepped portion formed to cover at least a portion of the connector slit spaced apart from the surface of the printed circuit board to support the connector pin received in the connector slit. The method of claim 5,
The connector pin may include a locking part formed to surround the stepped part when the connector pin is inserted into the connector slit and supported by the stepped part. The method of claim 1,
The connector,
A first connector layer mounted on a surface of the printed circuit board; And
And a second connector layer stacked on the first connector layer to be spaced apart from the surface of the printed circuit board. The method of claim 7, wherein
The connector,
A connector slit formed to sequentially pass through the first and second connector layers to receive the connector pins; And
And a stepped portion formed in the second connector layer to cover a portion of the connector slit penetrating the first connector layer and supporting the connector pin. A printed circuit board on which a plurality of pads are formed; And
A space conversion module coupled to the printed circuit board and configured to connect pads formed on the printed circuit board and pads formed on the plurality of semiconductor devices to each other;
The space conversion module,
A probe block having a plurality of probes configured to contact pads formed in the semiconductor device; And
An interposer unit having a flexible circuit board extending in a direction crossing the surface direction of the printed circuit board and electrically connected to the pad and the probe formed on the printed circuit board;
The probe block,
A receiving groove extending along one surface to receive the lateral end of the flexible circuit board; And
Further comprising a probe slit is formed so that the probe is inserted into the surface opposite the one surface on which the receiving groove is formed,
The flexible circuit board includes a plurality of space conversion pads formed at points spaced apart from each other by lateral ends inserted into the receiving grooves.
And the probe has a plurality of space conversion contact portions formed to protrude to different lengths from the probe slit so as to be in contact with the plurality of space conversion pads, respectively. The method of claim 9,
And the probe slit is positioned adjacent to the accommodating groove so that the flexible circuit board is electrically connected to the probe while the flexible circuit board is inserted into the accommodating groove. delete A printed circuit board on which a plurality of pads are formed; And
A space conversion module coupled to the printed circuit board and configured to connect pads formed on the printed circuit board and pads formed on the plurality of semiconductor devices to each other;
The space conversion module,
A probe block having a plurality of probes configured to contact pads formed in the semiconductor device; And
An interposer unit having a flexible circuit board extending in a direction crossing the surface direction of the printed circuit board and electrically connected to the pad and the probe formed on the printed circuit board;
The probe block,
A receiving groove extending along one surface to receive the lateral end of the flexible circuit board; And
Further comprising a probe slit is formed so that the probe is inserted into the surface opposite the one surface on which the receiving groove is formed,
The probe block,
A first layer forming a bottom portion of the receiving groove; And
And a second layer coupled to the first layer to form a side portion of the receiving groove. A probe card including an interposer unit having a flexible printed circuit board and a connector for coupling the flexible printed circuit board and the printed circuit board to each other, and a probe block connected to the flexible printed circuit board to contact pads formed in a plurality of semiconductor devices. In the manufacturing method of
A flexible circuit board manufacturing step of forming an electrical circuit on the flexible circuit board;
A probe block manufacturing step of forming a probe block having a receiving groove formed to receive one lateral end of the flexible circuit board;
A connector manufacturing step of forming a connector having a receiving portion formed to receive the other lateral end of the flexible circuit board;
Probe block-flex circuit board assembly step of mounting the flexible circuit board in the receiving groove in the state that the probe is inserted into the probe slit formed in the probe block;
A connector-printed circuit board assembly step of attaching the connector to the printed circuit board while the connector pin is inserted into the connector slit formed in the connector; And
And a flexible circuit board-connector assembly step of inserting the flexible circuit board coupled with the probe block to the accommodation portion. The method of claim 13,
Forming a block plate having a through portion; And
And a probe block-block plate assembly step of mounting the assembly of the probe block and the flexible circuit board to the block plate such that the flexible circuit board protrudes through the through part. The method of claim 13,
The connector manufacturing step,
Forming a first connector layer having a first slit and a second connector layer having a second slit; And
Stacking and bonding the first connector layer and the second connector layer to each other such that the first slit and the second slit communicate with each other. The method of claim 13,
The probe block manufacturing step,
Forming a first layer and a second layer forming a side portion of the receiving groove; And
Stacking and bonding the first layer and the second layer to each other such that the first layer forms a bottom portion of the receiving groove.

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