JP2007157949A - Low-temperature calcination multilayer ceramic substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a low-temperature calcination multilayer ceramic substrate, capable of making substrate wiring high density and of simplifying a manufacturing process. <P>SOLUTION: The low-temperature calcination multilayer ceramic substrate has a recess 14, formed by low-temperature calcination on a substrate body 1 with a wiring patterns 11a, 12a, via holes 11b, 12b, and passive elements disposed thereon as a plurality of layers; an electrode 16 connected to the wiring patterns 11a, 12a, and the via holes 11b, 12b inside the recess 14; and an IC chip 3, mounted so as to be flip-chip bonded 31 onto the wiring pattern 11a on the uppermost layer of the substrate body 1. These are all constituted as a SiP (System in a Package). Accordingly, the system can be integrated by a simple manufacturing process, with high densified patterning of the substrate wiring. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a low-temperature fired multilayer ceramic substrate using a low-temperature fired multilayer ceramic substrate (LTCC) as a substrate body, and more particularly to a low-temperature fired multilayer ceramic substrate in which a connector is built in the substrate body.

  Conventionally, the low-temperature fired ceramic multilayer circuit board according to the background art is superior in its thermal conductivity, heat resistance, and chemical durability to the organic material board, and its use is expanding as an alternative to the organic material board. . In addition, as electronic devices have become smaller and more diversified, they have been widely used as substrates capable of high-density wiring and high-density mounting. In addition, the demand for semiconductor bare chip mounting substrates is expected to increase in the future, and since it has the feature that fine wiring is easy and high in reliability, a method for manufacturing a low-temperature fired ceramic multilayer circuit board is particularly necessary. It is thought to become.

  In addition to the conventional low-temperature fired multilayer ceramic substrate, there is a composite module substrate or a composite circuit substrate that enables high-density mounting to some extent. In these circuit boards capable of high-density mounting, the circuit itself is miniaturized, but it is difficult to miniaturize the connector. In particular, in a circuit board mounted with high density, as the number of elements and circuits per board increase, the number of input / output terminals of each element and each circuit also increases.

  As a module with a built-in connector corresponding to such an increase in the number of input / output terminals, there is one disclosed in Japanese Patent Laid-Open No. 2005-79318, which is shown in FIG. In the figure, a conventional connector built-in module includes an electric insulating layer 101 provided with a wiring pattern 104 and at least one electronic component 103 selected from one or more active components and passive components. One or more connectors 102 for electrically connecting the wiring pattern 104 and electrically connecting to external electrodes are built in, and the connector 102 is provided with an external wiring insertion portion 105. It is the composition which is.

Based on this configuration, a conventional module with a built-in connector can be a module with a built-in connector capable of high-density mounting with little noise generation, a composite module and a circuit board using the same, for signal connection to the outside. It becomes.
JP-A-2005-79318

  Since each of the above background arts is configured as described above, when trying to manufacture a connector built-in module with built-in input / output terminals by LTCC, the electrical insulating layer 101 and the connector 102 are separately formed, and each formed A connector built-in module must be constructed by assembling the connector 102 to the electrical insulating layer 101, and a process of firing the electrical insulating layer 101 as LTCC, a process of creating the connector 102, and a process of assembling them are required. As a result, the manufacturing process becomes complicated, and the product cost cannot be reduced.

  In particular, in the assembly process for assembling the connector 102 to the electrical insulation layer 101 in the background art, the electrical insulation layer 101 itself of the circuit board premised on high-density mounting is miniaturized, and this miniaturized electrical insulation layer The connector 102 that is further miniaturized must be assembled to the 101, and this assembly work has a problem that extremely high accuracy is required. In addition, since the electrical insulating layer 101 is manufactured separately from the connector 102, there is a problem that the density of the substrate wiring on the side surface of the electrical insulating layer 101 to which the connector 102 is attached cannot be increased.

  The present invention has been made to solve the above problems, and an object of the present invention is to provide a low-temperature fired multilayer ceramic substrate capable of simplifying the manufacturing process as well as increasing the density of substrate wiring.

  The low-temperature fired multilayer ceramic substrate according to the present invention is a low-temperature fired multilayer ceramic substrate comprising a substrate body in which a wiring pattern is formed as a plurality of layers, wherein a concave portion or a step portion is formed on a side end surface of the substrate body. An electrode connected to the wiring pattern or via is disposed on the stepped portion.

  Thus, in the present invention, a recess or a step portion is formed on the side end surface of the substrate body on which the wiring pattern is formed as a plurality of layers, and an electrode connected to the wiring pattern or the via is formed in the recess or the step portion. Thus, the board body and the connector made of electrodes arranged in the recess or the stepped portion can be integrally formed by a simple manufacturing process, and the board wiring can be densified.

  In addition, the low-temperature fired multilayer ceramic substrate according to the present invention is formed by extending the wiring pattern from the wiring pattern on the inner surface of the recess or the surface of the stepped portion formed on the side end surface of the substrate body as necessary. It is.

  Thus, in the present invention, the wiring pattern formed as a plurality of layers on the substrate body is extended to the inner surface of the recess or the surface of the stepped portion formed on the side end surface of the substrate body, and this extended wiring Since the electrodes are formed in a pattern, the connectors can be formed finely and with high density simultaneously with the low-temperature firing of the substrate body, and the substrate wiring can be made dense.

  In addition, the low-temperature fired multilayer ceramic substrate according to the present invention is provided with a thin wire-like mounting hole having a depth reaching the wiring pattern on the bottom surface of the concave portion or the side surface of the step portion, if necessary, and the electrode has a thin wire shape. It is formed as a needle body, and the needle body is inserted and fixed in an attachment hole of a substrate body that is fired at a low temperature.

  As described above, in the present invention, the electrode made of a fine needle is inserted into the mounting hole formed on the lower surface of the concave portion or the side surface of the step portion formed on the side end surface of the substrate body until the wiring pattern is reached. Thus, the connector portion is formed, so that the substrate main body and the connector formed of the electrode disposed in the recess or the step portion can be integrally formed by a simple manufacturing process, and the substrate wiring can be densified.

  Further, in the low-temperature fired multilayer ceramic substrate according to the present invention, if necessary, the electrode is connected to one wiring pattern of the corresponding intermediate layer among the plurality of wiring patterns, and other wirings other than the one wiring pattern. The patterns are connected through a single wiring pattern by via holes.

  Thus, in the present invention, an electrode is connected to one wiring pattern of a corresponding intermediate layer among a plurality of wiring patterns, and one wiring pattern other than the one wiring pattern is connected to one wiring pattern by a via hole. Therefore, any wiring pattern formed in each of the plurality of layers can be connected to the connector via the via hole, and the connector composed of the substrate body and the electrode disposed in the recess or the stepped portion is provided. It can be formed integrally with a simple manufacturing process, and the substrate wiring can be densified.

Further, the low-temperature fired multilayer ceramic substrate according to the present invention comprises a single substrate by connecting a plurality of substrate bodies to each other as required.
As described above, in the present invention, a plurality of substrate bodies are connected to each other to form a single substrate, whereby a large substrate can be formed. In particular, when a plurality of board bodies have different functions, the connected boards can be configured as a multifunction board, and even if each board body has the same or different functions, they are complementary or synergistic to each other. The function can be improved.

(First embodiment of the present invention)
Hereinafter, a low-temperature fired multilayer ceramic substrate according to a first embodiment of the present invention will be described with reference to FIGS. 1 is a schematic perspective view of a low-temperature fired multilayer ceramic substrate according to the present embodiment, FIG. 2 is a cross-sectional view taken along the line AA of the low-temperature fired multilayer ceramic substrate shown in FIG. 1, and FIG. The manufacturing process explanatory drawing of a baking multilayer ceramic substrate is shown.

  In each of the drawings, the low-temperature fired multilayer ceramic substrate according to the present embodiment includes a substrate body 1 on which wiring patterns 11a, 12a, vias 11b, 12b and passive elements are arranged as a plurality of layers, and a side end surface of the substrate body 1. A recess 14 is formed by low-temperature firing, and an electrode 16 connected to the wiring patterns 11a, 12a or vias 11b, 12b is formed in the recess 14, and the IC chip 3 is connected to the wiring pattern 11a on the uppermost layer of the substrate body 1. It is mounted so as to be flip-chip bonded 31 and configured as a SiP (System in a Package).

  The substrate main body 1 sequentially includes ceramic substrates 11 and 12 (represented schematically in two layers in this embodiment, simplified) in which wiring patterns 11a and 12a, vias 11b and 12b, and passive elements are respectively disposed. Laminated and fired at a low temperature in this laminated state. The electrode 16 is formed with a thin hole-like attachment hole 16a having a depth reaching the wiring pattern 12a on the lower surface of the recess 14 at the same time as the substrate body 1 is fired at low temperature. The thin wire-like conductive needle body 16b of the mounting hole 16a is inserted and fixed while being in contact with the wiring pattern 12a.

  The connection plug 2 connected to the electrode 16 has a plug main body 21 formed with an external dimension corresponding to the concave groove shape of the concave portion 14, and an insertion hole that fits the conductive needle body 16 b at the tip of the plug main body 21. The contact portion 22 is formed of a conductive material on the inner side surface of the insertion hole, and the cable 24 has a conductor 24 connected to the contact portion 22.

  Next, the formation operation of the low-temperature fired multilayer ceramic substrate and the connection operation with the connection plug 2 according to this embodiment based on the above configuration will be described. First, regarding the formation operation of the low-temperature fired multilayer ceramic substrate, the lower ceramic substrate 12 has a notch 14b corresponding to the recess 14 at the end, and a wiring pattern 12a, a via 12b, a passive element, etc. (Not shown) is formed (see FIG. 3A). The upper ceramic substrate 11 has a notch 14a corresponding to the recess 14 at the end, a wiring pattern 11a, a via 11b, a mounting hole 16a on the surface, and a passive element (not shown). .) Is formed (see FIG. 3A).

  The ceramic substrate 11 is laminated on the ceramic substrate 12 as shown in FIG. 3B, and in this laminated state, it is fired and integrated at a low temperature (for example, 900 ° C. or less). Even if a low melting point metal such as copper (Cu) or silver (Ag) is used for the wiring patterns 11a and 12a, the vias 11b and 12b formed on the ceramic substrates 11 and 12 by the low temperature firing, and the passive elements, respectively. It can be fired equally and integrated.

As shown in FIG. 3C, the substrate body 1 integrated in this way has the conductive needle body 16b inserted through the mounting hole 16a to form the electrode 16 in the recess 14, and the wiring pattern 11a on the upper surface. These electrode terminal portions and bumps formed on the input / output terminal portions of the IC chip 3 are joined by flip chip bonding 31.
As shown in FIG. 3D, the substrate main body 1 of the low-temperature fired multilayer ceramic substrate formed in this way inserts the plug main body 21 of the connection plug 2 into the concave portion 14 and connects the conductive needle body 16b to the contact portion 22. The connecting operation is completed by inserting through.

(Second embodiment of the present invention)
A low-temperature fired multilayer ceramic substrate according to a second embodiment of the present invention will be described with reference to FIGS. 4 is a schematic perspective view of the low-temperature fired multilayer ceramic substrate according to this embodiment, and FIG. 5 is a cross-sectional view taken along the line BB of the low-temperature fired multilayer ceramic substrate shown in FIG.

  In each of the drawings, the low-temperature fired multilayer ceramic substrate according to the present embodiment is similar to the low-temperature fired multilayer ceramic substrate according to the first embodiment, as wiring layers 11a, 12a, 13a, vias 11b, 12b, 13b and the substrate body 1 on which the passive elements are disposed, and a recess 14 is formed in the side end surface of the substrate body 1 by low-temperature firing, and the wiring patterns 11a, 12a, 13a or the vias 11b, 12b, An electrode 17 connected to 13b is formed, and the IC chip 3 is mounted on the wiring pattern 11a on the uppermost layer of the substrate body 1 so as to be flip-chip bonded 31 to form an SiP. Further, unlike the case of the first embodiment, the substrate body 1 is configured to be simplified to three layers of ceramic substrates 11, 12, and 13 and similarly fired at a low temperature in this laminated state.

  The electrode 17 is configured as an exposed portion in which the wiring patterns 12a and 13a are extended on opposite side surfaces of the concave portion 14 of the substrate body 1, and is connected to vias 11b, 12b and 13b connected to the wiring patterns 12a and 13a. It is configured as a body part. The connection plug 5 connected to the electrode 17 is formed of a plug main body 51 formed with an outer dimension corresponding to the concave groove shape of the concave portion 14, and a strip-shaped conductive material on both side surfaces of the tip end of the plug main body 51. The configuration includes a contact portion 52 and a cable 54 to which a conductor core wire 53 is connected.

  Next, the formation operation of the low-temperature fired multilayer ceramic substrate and the connection operation with the connection plug 5 according to this embodiment based on the above configuration will be described. First, regarding the formation operation of the low-temperature fired multilayer ceramic substrate according to the present embodiment, the lowermost ceramic substrate 13 has a wiring pattern 13a, a via 13b, and an exposed portion of a strip-shaped conductive material extending from the wiring pattern 13a on the surface. An electrode 17 is formed. Further, the middle layer ceramic substrate 12 is formed so that the end thereof is shorter than the length of the ceramic substrate 13 by the dimension that the plug main body 51 of the connection plug 5 is fitted, and the wiring pattern 12a, via 12b, passive elements, etc. Is omitted). The upper layer ceramic substrate 11 has an electrode 17 that is an exposed portion formed of a strip-shaped conductive material in contact with the wiring pattern 12a of the ceramic substrate 12 of the ceramic substrate 12 at the back end portion, and the wiring pattern on the surface. 11a, vias 11b, mounting holes 16a, and passive elements (not shown) are formed.

  A ceramic substrate 12 is laminated on the ceramic substrate 13, and further a ceramic substrate 11 is laminated on the ceramic substrate 12. In the laminated state as in the first embodiment, a low temperature (for example, 900 ° C.) is used. The following is fired and integrated. The electrode terminal portion of the wiring pattern 11 a on the upper surface and the bump formed on the input / output terminal portion of the IC chip 3 are joined by flip chip bonding 31.

  As shown in FIG. 5, the substrate body 1 of the low-temperature fired multilayer ceramic substrate formed in this way has two electrodes facing each other in the recess 14 by inserting the plug body 51 of the connection plug 5 into the recess 14. 17, the contact portions 52 of the connection plug 5 are brought into contact with each other to complete the connection operation.

(Third embodiment of the present invention)
A low-temperature fired multilayer ceramic substrate according to a third embodiment of the present invention will be described with reference to FIG. FIG. 6 shows a schematic perspective view of the low-temperature fired multilayer ceramic substrate according to this embodiment.
In the figure, the low-temperature fired multilayer ceramic substrate according to the present embodiment is different from the recess 14 of the low-temperature fired multilayer ceramic substrate according to the second embodiment in that the electrode 17 made of a strip-shaped conductive material is provided with a stepped planar portion. The electrode 17 is formed as a conductive material extending from the wiring pattern 12 a formed on the lower ceramic substrate 12.

  Further, the electrode 17 may be configured to extend from the wiring pattern of the upper ceramic substrate 11 to the flat portion of the step portion 18 so as to be stepped along the surface of the step portion 18. In this case, the electrode 17 can be formed on both the stepped flat surface portion and the upright portion of the step portion 18, and the low-temperature fired multilayer ceramic substrates can be more reliably connected to each other.

  Next, when the substrate body 1 of the low-temperature fired multilayer ceramic substrate according to the present embodiment is connected to the substrate body 4 of another low-temperature fired multilayer ceramic substrate, the step portion 18 of the substrate body 1 and both side protrusions of the substrate body 4 are projected. The portion 41 is engaged, and the electrode 17 formed on the flat portion and the upright portion of the stepped portion 18 is brought into contact with the electrode 41 a formed on the lower surface and the inner side surface of the protruding portion 41. Also, when connecting another substrate body having the same shape as the substrate body 1, as in the case of the substrate body 4, they are overlapped with each other so that the stepped portion 18 of the substrate body 1 and both side protrusions (19 It is executed by engaging.

(Other embodiments of the present invention)
A low-temperature fired multilayer ceramic substrate according to another embodiment of the present invention will be described with reference to FIGS. 7 is an external perspective view and a cross-sectional view of a low temperature fired multilayer ceramic substrate according to another embodiment of the present invention, and FIG. 8 is an external perspective view of a low temperature fired multilayer ceramic substrate according to another embodiment of the present invention. And a connection mode development view is shown.

  In the low-temperature fired multilayer ceramic substrate shown in FIG. 7, a substrate body 10 is formed in the same manner as the substrate body 1 in each of the above embodiments, and a recess 14 is formed on one side end side of the substrate body 10 and the other side. A convex portion 15 is formed on the end side, and an electrode 17b is formed in the concave portion 14, and an electrode 17a is formed outside the convex portion 15 at a position corresponding to the electrode 17b. The concave portion 14 and the convex portion 15 are formed so as to be fitted when the substrate bodies 10 are connected to each other so that the electrode 17a and the electrode 17b are in close contact with each other.

  In this way, by connecting a plurality of substrate bodies 10 continuously in a uniaxial direction, the substrate can be formed larger by a small substrate body 10 (see FIG. 7B). In particular, when the plurality of substrate bodies 10 have different functions, the connected substrates can be configured as a multifunction substrate, and even if the substrate bodies 10 have the same or different functions, The function can be improved synergistically.

  The low-temperature fired multilayer ceramic substrate shown in FIG. 8 is connected to a plurality of substrate bodies 10 in one axial direction of the low-temperature fired multilayer ceramic substrate shown in FIG. 7, and the other axis orthogonal to this one axis (x-axis direction). In this configuration, a plurality of substrate bodies 10 are also connected in the direction (y-axis direction). As shown in FIG. 8A, the substrate body 100 located at the intersection of the x-axis and the y-axis is formed with concave portions 14 and convex portions 15 on two adjacent side end surfaces of the rectangular substrate. An electrode 17b is formed in the concave portion 14 and an electrode 17a is formed outside the convex portion 15.

  With the substrate body 100 as the center, the substrate body 10 shown in FIG. 7 can be sequentially connected and developed in the x-axis direction and the y-axis direction as shown in FIG. 8B. Thus, by connecting a plurality of substrate bodies 10 in the biaxial directions of the x and y axes, a larger-scale multifunction substrate can be easily and reliably formed.

1 is a schematic configuration perspective view of a low-temperature fired multilayer ceramic substrate according to a first embodiment of the present invention. It is the sectional view on the AA line of the low-temperature baking multilayer ceramic substrate described in FIG. It is explanatory drawing of the manufacturing process of the low-temperature baking multilayer ceramic substrate described in FIG. It is a schematic perspective view of a low-temperature fired multilayer ceramic substrate according to a second embodiment of the present invention. FIG. 5 is a cross-sectional view of the low-temperature fired multilayer ceramic substrate shown in FIG. 4 taken along the line BB. It is a schematic structure perspective view of the low-temperature baking multilayer ceramic substrate which concerns on the 3rd Embodiment of this invention. It is the external appearance perspective view and connection aspect sectional drawing of the low-temperature baking multilayer ceramic substrate which concerns on other embodiment of this invention. It is the external appearance perspective view and connection mode expansion | deployment figure of the low-temperature baking multilayer ceramic substrate which concerns on other embodiment of this invention. It is sectional drawing of the module with a built-in connector which enables the conventional high-density mounting.

Explanation of symbols

1, 4, 10, 100 Substrate body 11a, 12a, 13a Wiring pattern 11b, 12b, 13b Via 14 Recess 14a, 14b Notch 15 Protrusion 16, 17, 17a, 17b, 41a Electrode 16a Mounting hole 16b Conductive needle body 18 Steps 19, 41 Protruding part 2, 5 Connection plug 21, 51 Plug body 22, 52 Contact part 23, 53 Conductor core wire 24, 54 Cable 3 IC chip 31 Flip chip bonding

Claims (5)

In a low-temperature fired multilayer ceramic substrate comprising a substrate body in which a wiring pattern is formed as a plurality of layers
A low-temperature fired multilayer ceramic substrate, wherein a concave portion or a step portion is formed on a side end surface of the substrate body, and an electrode connected to the wiring pattern or the via is disposed in the concave portion or the step portion. In the low-temperature fired multilayer ceramic substrate according to claim 1,
The low-temperature fired multilayer ceramic substrate, wherein the electrode is formed to extend from the wiring pattern on an inner surface of a recess or a surface of a stepped portion formed on a side end surface of a substrate body. In the low-temperature fired multilayer ceramic substrate according to claim 1,
A thin wire-like mounting hole reaching the wiring pattern is formed on the bottom surface of the recess or the side surface of the stepped portion,
A low-temperature fired multilayer ceramic substrate, wherein the electrode is formed as a fine-line needle body, and the needle body is inserted and fixed in a mounting hole of a substrate body fired at a low temperature. In the low-temperature fired multilayer ceramic substrate according to any one of claims 1 to 3,
The electrode is connected to one wiring pattern of a corresponding intermediate layer among a plurality of wiring patterns, and other wiring patterns other than the one wiring pattern are connected via one wiring pattern by via holes. A low temperature fired multilayer ceramic substrate. In the low-temperature fired multilayer ceramic substrate according to any one of claims 1 to 4,
A low-temperature fired multilayer ceramic substrate, wherein a plurality of the substrate bodies are connected to each other to form a single substrate.

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