JP2010043874A - Connect board and electronic componenet inspection device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connect board without deteriorating the characteristics of a built-in electronic component and hardly restricted by the performance such as capacitance of the built-in electronic component. <P>SOLUTION: A first board member 10 is overlaid on a second board member 20. In the first board member 10, a probe pin pad 13 is formed on a major surface 12 and a first contact electrode pad 14 is formed on a surface of opposite thereto, the pad 13 is connected with the first contact electrode pad 14 via a through-conductor part 11, and a land 15 for mounting component to be connected to the adjacent through-conductor part 11 is formed on the surface opposite the major surface 12. In the second board member 20, a motherboard connection pad 23 is formed on a major surface 22 and a second contact electrode pad 24 formed on a surface opposite thereto, and the pad 23 is connected with the second contact electrode pad 24 via a through-conductor part 21. A bypass capacitor 30 connected between the lands 15 for mounting component is housed in a mounting component housing recessed part 25 formed on a surface opposite the major surface 22. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a connect substrate incorporating a chip-type electronic component and an electronic component inspection apparatus using the same.

  Generally, an electronic component inspection apparatus that inspects an electronic circuit of an electronic component to be inspected such as a semiconductor integrated circuit has an electronic component inspection socket having a probe whose tip is in contact with an electrode of the electronic component to be inspected, and the electronic component to be inspected In order to connect to a mother board on which a measurement circuit for measuring the electrical characteristics of the board is mounted, a connect substrate is interposed between the two.

  As the operation speed of the electronic component to be inspected is increased, noise generated in the power supply line to the electronic component to be inspected has become a problem.

  In order to eliminate noise in the power supply path, a bypass capacitor consisting of a large-capacitance capacitor is conventionally surface-mounted on the upper or lower surface of the motherboard.

  It has also been proposed to incorporate a thin film capacitor in a multilayer substrate as a connect substrate.

  In the configuration in which the bypass capacitor is surface-mounted on the motherboard, it is ideal that the bypass capacitor is directly connected to the power input electrode of the electronic component to be inspected, whereas the bypass is bypassed from the power input electrode (or the power supply line connected thereto). There is a problem that the length of the path to the capacitor becomes long, the effect of the bypass capacitor is impaired by the inductance due to the path length, and it may be difficult to design a space for mounting the bypass capacitor on the motherboard. It is done.

  The configuration in which the thin film capacitor is built in the multilayer substrate has a tendency that the capacitance of the thin film capacitor cannot be sufficiently increased.

Examples of the multilayer substrate with built-in electronic components include the following Patent Document 1 and Patent Document 2.
JP 2007-53328 A Japanese Patent Publication No. 6-32378 discloses a structure in which a multilayer substrate is fired in a state in which a chip capacitor is incorporated. There is a possibility that the capacity of the chip capacitor is reduced by firing, and there is a problem that the reliability of the capacity is low. Patent Document 2 also has a configuration in which the multilayer substrate is fired in a state where the chip capacitor is incorporated, and it seems that there is a similar problem.

  As described above, in the conventional technology, there is a problem that there are restrictions on electronic components that can be embedded in the multilayer substrate, or characteristics of the embedded electronic components are deteriorated.

  The present invention has been made in view of such a situation, and the object of the present invention is to make a connection without deteriorating the characteristics of the built-in electronic component and being less restricted by the performance of the built-in electronic component such as capacitance. It is an object of the present invention to provide a substrate and an electronic component inspection apparatus using the substrate.

One aspect of the present invention is a connect substrate,
The first surface electrode pad is formed on the first main surface, and the first contact electrode pad is formed on the surface opposite to the first main surface, and the first surface electrode pad and the first contact electrode pad are formed. Are connected to each other by the first penetrating conductor portion, and a pair of mounting component lands that are connected to the adjacent first penetrating conductor portion are formed on the opposite surface of the first main surface. When,
Forming a second surface electrode pad on the second main surface and a second contact electrode pad on the opposite side of the second main surface; and the second surface electrode pad, the second contact electrode pad, A second substrate member connected by a second through conductor portion;
A chip type electronic component housed in a mounting component housing recess formed on the opposite surface of the first or second main surface and connected between the paired mounting component lands;
The first and second contact electrodes are brought into contact with each other and brought into contact with each other to integrate the first and second substrate members.

  In the above aspect, the mounting component storage recess may be formed on a surface opposite to the second main surface of the second substrate member.

  In the above aspect, the mounting component storage recess is formed on a surface opposite to the first main surface of the first board member, and the mounting component land that forms the pair with the bottom of the mounting component storage recess. May be formed.

  In the above aspect, the mounting component storage recess is formed on a surface opposite to the first main surface of the first board member, and one of the mounting component lands is formed at the bottom of the mounting component storage recess. The other of the mounting component lands may be formed on the mounting component storage recess.

  In the above aspect, the chip-type electronic component may be solder-connected to the paired mounting component lands.

  The said aspect WHEREIN: The said 1st penetration conductor part and the said land for mounting components may be connected by the internal conductor of the said 1st board | substrate member.

  In the above aspect, one of the adjacent first through conductor portions may be a ground conductor portion, and the chip-type electronic component may be a bypass capacitor.

Another aspect of the present invention is an electronic component inspection apparatus, comprising the connect substrate, an electronic component inspection socket having a probe whose tip contacts an electrode of the electronic component to be inspected, and a motherboard.
The socket is mounted on the motherboard with the connect substrate interposed therebetween, the first surface electrode pad is in contact with the rear end of the probe, and the second surface electrode pad is in contact with the electrode of the motherboard. It is characterized by.

  It should be noted that any combination of the above-described constituent elements, and those obtained by converting the expression of the present invention between methods and systems are also effective as aspects of the present invention.

  According to the connect substrate of the present invention, the mounting component storage recess is formed in advance on the mutually facing surfaces of the fired first and second substrate members, and the chip-type electronic component is stored in the mounting component storage recess. Therefore, it does not deteriorate the characteristics of the built-in chip type electronic components as it is fired, and various chip type electronic components can be built in, and it is subject to restrictions such as capacitance like thin film capacitors. Nor.

  Further, according to the electronic component inspection apparatus according to the present invention, by incorporating the chip-type electronic component in the connect substrate, the degree of freedom of electronic component arrangement on the mother board side is increased. In addition, if a bypass capacitor is built in as a chip-type electronic component, the bypass capacitor can be connected at a position closer to the power supply terminal of the electronic component to be inspected than when the bypass capacitor is arranged on the motherboard side. Will improve.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same or equivalent component, member, process, etc. which are shown by each drawing, and the overlapping description is abbreviate | omitted suitably. In addition, the embodiments do not limit the invention but are exemplifications, and all features and combinations thereof described in the embodiments are not necessarily essential to the invention.

  A first embodiment of the present invention will be described with reference to FIGS. FIGS. 1A, 1B, and 1C show the completed state of the connect substrate 1, FIGS. 2A, 2B, and 2C show the first substrate member, and FIGS. B) and (C) respectively show the second substrate member.

  In these drawings, the first substrate member 10 is LTCC (Low Temperature Co-fired Ceramic) in which a through-hole is filled with a metal paste such as silver or copper and is simultaneously fired, and the portion in which the through-hole is filled with the metal paste. The first through conductor portion (via hole) 11 is sintered. Further, a probe pin pad 13 as a first surface electrode pad is formed on the first main surface 12 of the first substrate member 10, and a first contact electrode pad 14 is formed on the opposite surface. 1 through conductor portions 11.

  Further, as shown in the enlarged portion of FIG. 2B, a pair of mounting component conductor lands 15 connected to the adjacent through conductor portions 11 by the internal conductor 16 is formed on the opposite surface of the main surface 12. . For example, one of the adjacent through conductor portions 11 is a power supply line and the other is a ground line. The mounting component conductor land 15 is formed with a gap with respect to the contact electrode pad 14. This is to prevent solder from flowing into the contact electrode pad 14 when soldering the bypass capacitor 30 as a chip-type electronic component to the mounting component conductor land 15. By making the contact electrode pad 14 small in diameter, it is easy to secure the mounting area of the bypass capacitor 30.

  The internal conductor 16 that connects the through conductor portion 11 and the mounting component conductor land 15 is wired by the inner layer of the substrate member 10, and is formed of the same material as the through conductor portion 11 by simultaneous firing with LTCC. (Because the substrate member 10 has a manufacturing method in which a plurality of unfired LTCCs are fired after being laminated, the internal conductor 16 can be formed in the inner layer).

  A bypass capacitor 30 is soldered between the paired mounting component conductor lands 15 by solder reflow or the like. The soldering process is performed with the state shown in FIG. 2B inverted, that is, with the bypass capacitor 30 on the substrate 10.

  The second substrate member 20 is LTCC in which a through-hole is filled with a metal paste such as silver or copper and fired at the same time. The portion filled with the metal paste in the through-hole is sintered to form a second through-conductor portion (via hole). ) 21. Further, a motherboard connection pad 23 as a second surface electrode pad is formed on the second main surface 22 of the second substrate member 20, and a second contact electrode pad 24 is formed on the opposite surface. Two through conductor portions 21 are connected.

  A mounting component storage recess (cavity) 25 is formed on the opposite surface. The mounting component storage recess 25 has a size that can store the mounting component conductor land 15 and the bypass capacitor 30 and has a shape that does not contact the second contact electrode pad 24, and has a circular opening in the present embodiment. Since the substrate member 20 has a manufacturing method in which a plurality of unfired LTCC layers are fired after being laminated, the unfired LTCC layer having an open hole that becomes the mounting component housing recess 25 and the unfired LTCC layer without the open hole are fired after being laminated. By doing so, the mounting component housing recess 25 can be formed.

  The diameter of the second contact electrode pad 24 is set larger than that of the first contact electrode pad 14 in consideration of the positional deviation when the first and second substrate members 10 and 20 are stacked.

  As shown in FIG. 1B, the first and second substrate members 10 and 20 are laminated so that the first contact electrode pad 14 and the second contact electrode pad 24 face each other and come into contact with each other. The two board members are aligned and overlapped using means such as guide holes (not shown) on the board member 10 and 20 side and positioning pins inserted through the guide holes, and mechanically integrated with screws (not shown). To do. As a result, the probe pin pad 13 as the first surface electrode pad and the motherboard connection pad 23 as the second surface electrode pad are connected by the first and second through conductor portions 11 and 21, and the bypass capacitor 30 is connected. The built-in connect substrate 1 is obtained. The first contact electrode pad 14 and the second contact electrode pad 24 included in each of the first and second substrate members 10 and 20 are maintained with extremely good flatness by mirror finishing, and the two substrate substrates 10 and 20 have a flatness. The electrical connection between the first contact electrode pad 14 and the second contact electrode pad 24 is ensured by mechanical integration. In addition, a bypass capacitor 30 as a chip-type electronic component is stored in the mounting component storage recess 25. The probe pin pad 13 and the motherboard connection pad 23 have substantially the same diameter (the shape dimensions are substantially the same), and the planar positions are matched.

  The bypass capacitor 30 is not surface-mounted on the front and back main surfaces 12 and 22 of the connect substrate 1 because of the nature of the connect substrate 1, the probe pin pads 13 and the motherboard connection pads 23 on the main surfaces 12 and 22 are on the mating substrate. For this reason, it must be flat (cannot project), and therefore, a mounting component housing recess 25 is provided inside as an overlapping structure of the two board members 10, 20. A bypass capacitor 30 is arranged.

  According to the present embodiment, the following effects can be achieved.

(1) According to the connect substrate 1 of the present embodiment, the mounting component storage recess 25 is formed in advance on the mutually facing surfaces of the fired first and second substrate members 10 and 20, and the mounting component storage Since the bypass capacitor 30 serving as a chip-type electronic component is housed in the recess 25, the characteristics of the bypass capacitor 30 built in during firing are not deteriorated, and the capacitance is highly reliable. Further, there is no restriction on the capacitance as in the case of forming a thin film capacitor on or in the substrate, and the through-conductor portion 11 serving as a power supply line is connected to the bypass capacitor 30 having a sufficiently large capacitance. It can be connected between the penetrating conductor portion 11 serving as an adjacent ground line. For this reason, the noise removal effect of the power supply line can be improved.

(2) When used in an electronic component inspection apparatus, the bypass capacitor 30 can be connected to a position directly below the probe pin pad 13 as the first surface electrode pad, and the first and second through conductor portions 11 and 21 can be connected. An LC noise filter can be equivalently configured by the inductance and the capacitance of the bypass capacitor 30. It is possible to eliminate noise on the side close to the probe pin connected to the power supply terminal of the electronic component to be inspected. Are better.

  A second embodiment of the present invention will be described with reference to FIG. In this case, the mounting component housing recess 25 is provided in the first board member 10 instead of being provided in the second board member 20. That is, the mounting component housing recess 25 is formed on the surface opposite to the first main surface 12 of the first substrate member 10, and a pair of mounting component conductor lands 15 is formed on the bottom (bottom surface) thereof.

  A bypass capacitor 30 as a chip-type electronic component is soldered between the paired mounting component conductor lands 15 by solder reflow or the like. The soldering process is performed in a state where FIG. 4 is reversed, that is, in a state where the bypass capacitor 30 is on the substrate 10.

  In the case of the second embodiment, the same effect as that of the first embodiment can be obtained.

  A third embodiment of the present invention will be described with reference to FIG. In this case, the mounting component storage recess 45 is formed vertically (deeply in the board thickness direction) with respect to the first board member 10, and one of the mounting component conductor lands 15 is formed on the bottom (bottom surface) of the mounting component storage recess 45. The other of the mounting component conductor lands 15 is formed in the upper portion of the mounting component storage recess 45 (however, the position retracted from the opposite surface of the main surface 12).

  Then, the bypass capacitor 30 as a chip-type electronic component is disposed in the mounting component housing recess 45 in the vertical direction and soldered by solder reflow or the like. The soldering process is performed in a state where FIG. 5 is reversed, that is, in a state where the bypass capacitor 30 is on the substrate 10.

  In the case of the third embodiment, the same effect as that of the first embodiment can be obtained. Furthermore, the arrangement area of the pair of mounting component conductor lands 15 can be reduced, which is effective when the arrangement interval of the probe pin pads 13 as the first surface electrode pads is reduced.

  6 and 7 show a fourth embodiment of the present invention, which shows a case where an electronic component inspection apparatus is configured.

  This electronic component inspection apparatus includes a mother board 50 on which a measurement circuit or the like (not shown) is mounted, and an electronic component inspection socket 60 having probe pins 61 whose tips are in contact with the terminal electrodes 101 of the electronic component 100 to be inspected. The connecting substrate 1 shown in the first embodiment is interposed and overlapped, and mechanically integrated with a screw 75 or the like.

  The electrode 101 of the electronic component 100 to be inspected includes a probe pin 61 provided on a socket 60 that contacts one end thereof, a probe pin pad 13 of the connect substrate 1 that contacts the other end of the probe pin 61, and first and second electrodes. It is electrically connected to a measurement circuit or the like on the motherboard 50 side through paths of the through conductor portions 11 and 21, the motherboard connection pad 23, and the electrode pads 51 on the motherboard 50 in contact therewith.

  According to the electronic component inspection apparatus, the bypass capacitor 30 having a sufficiently large capacitance in the connect substrate 1 can be connected to a position close to the terminal electrode 101 of the electronic component 100 to be inspected. When a power supply voltage is supplied to the electrode 101, noise superimposed on the power supply voltage can be effectively removed to stabilize the power supply voltage. Further, the delay in rising of the power supply voltage caused by the inductance of the through conductor portions 11 and 21 serving as the power supply line can be mitigated by the bypass capacitor 30 connected to a position close to the terminal electrode 101.

  It is impossible to mount the bypass capacitor 30 on the socket 60 because of the structure, and it can be said that the bypass capacitor 30 is provided in the connect substrate 1 as the best policy.

  The present invention has been described above by taking the embodiment as an example. However, it is understood by those skilled in the art that various modifications can be made to each component and each processing process of the embodiment within the scope of the claims. By the way. Hereinafter, modifications will be described.

  The opening shape of the mounting component storage recess 25 in the first or second embodiment is exemplified as a circular shape, but may be an oval shape, an oval shape, a rectangular shape, or the like.

  In the electronic component inspection apparatus shown in FIGS. 6 and 7, the connect substrate according to the first embodiment is used. Instead, the connect substrate according to the second or third embodiment may be used.

  In each embodiment, the bypass capacitor is built in the connect substrate as a chip-type electronic component. However, a chip resistor, a chip inductor, or the like may be built in the connect substrate depending on the application.

  By incorporating various chip-type electronic components in the connect substrate, it is possible to improve the degree of design freedom by reducing the number of components mounted on the connection partner substrate such as a mother board connected to the connect substrate.

It is a completed state of the connect substrate of the first embodiment according to the present invention, in which (A) is a plan view of the connect substrate, (B) is a front sectional view, and (C) is a bottom view. BRIEF DESCRIPTION OF THE DRAWINGS It is the 1st board | substrate member used by 1st Embodiment, and the chip-type electronic component mounted in this, Comprising: (A) is a top view, (B) is a front sectional view, (C) is a bottom view. . It is a 2nd board | substrate member used by 1st Embodiment, Comprising: (A) is a top view, (B) is a front sectional view, (C) is a bottom view. It is a front sectional view showing a connect substrate according to a second embodiment of the present invention. It is a front sectional view showing a connect substrate according to a third embodiment of the present invention. FIG. 6 is an exploded perspective view of an electronic component inspection apparatus using the connect substrate according to the first embodiment, according to the fourth embodiment of the present invention. It is principal part sectional drawing of the said electronic component inspection apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Connect board | substrate 10 1st board | substrate member 11 1st penetration conductor part 13 Probe pin pad 14 1st contact electrode pad 15 Conductor land for mounting components 16 Internal conductor 20 2nd board | substrate member 21 2nd penetration conductor part 23 Motherboard connection pad 24 Second contact electrode pad 25, 45 Mounting component storage recess 30 Bypass capacitor 50 Motherboard 51 Electrode pad 60 Electronic component inspection socket 61 Probe pin 100 Electronic component to be inspected 101 Terminal electrode

Claims (8)

The first surface electrode pad is formed on the first main surface, and the first contact electrode pad is formed on the surface opposite to the first main surface, and the first surface electrode pad and the first contact electrode pad are formed. Are connected to each other by the first penetrating conductor portion, and a pair of mounting component lands that are connected to the adjacent first penetrating conductor portion are formed on the opposite surface of the first main surface. When,
Forming a second surface electrode pad on the second main surface and a second contact electrode pad on the opposite side of the second main surface; and the second surface electrode pad, the second contact electrode pad, A second substrate member connected by a second through conductor portion;
A chip type electronic component housed in a mounting component housing recess formed on the opposite surface of the first or second main surface and connected between the paired mounting component lands;
A connect substrate in which the first and second contact members are brought into contact with each other and brought into contact with each other to integrate the first and second substrate members.   2. The connect substrate according to claim 1, wherein the mounting component housing recess is formed on a surface opposite to the second main surface of the second substrate member.   2. The connect board according to claim 1, wherein the mounting component storage recess is formed on a surface opposite to the first main surface of the first board member, and the pair is disposed at a bottom of the mounting component storage recess. Connected board with formed mounting component lands.   2. The connect board according to claim 1, wherein the mounting component storage recess is formed on a surface opposite to the first main surface of the first substrate member, and the mounting component is provided at a bottom of the mounting component storage recess. One of the lands for connection is a connect substrate in which the other of the lands for mounting components is formed above the mounting component storage recess.   5. The connect substrate according to claim 1, wherein the chip-type electronic component is solder-connected to the paired mounting component lands.   6. The connect substrate according to claim 1, wherein the first through conductor portion and the mounting component land are connected by an internal conductor of the first substrate member.   7. The connect substrate according to claim 1, wherein one of the adjacent first through conductor portions is a ground conductor portion, and the chip electronic component is a bypass capacitor. The connect substrate according to claim 1,
An electronic component inspection socket having a probe whose tip contacts the electrode of the electronic component to be inspected, and a motherboard,
The socket is mounted on the motherboard via the connect substrate, the first surface electrode pad is in contact with the rear end of the probe, and the second surface electrode pad is in contact with the electrode of the motherboard, Electronic component inspection equipment.

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