KR100480665B1 - Vertical Type Probe Device - Google Patents

Abstract

The present invention relates to a vertical probe device for inspecting the performance of a semiconductor integrated circuit, and more particularly, to vertically test using a coil spring for a test object in a probe device for inspecting a signal transmission performance of a semiconductor integrated circuit. A vertical probe device.

The present invention is a micro pin 210 for contacting the microchip to be tested so that current is conducted; A coil spring 220 providing elastic restoring force to the micropin 210; A fixed block part 160 providing a frame for accommodating and supporting the micro pins 210 and the coil springs 220; An impedance board 240 for matching impedance for current transfer to the microchip; It characterized in that it comprises an interface board 230 for providing a line pattern for signal transmission for transferring the flow of current between the micropin 210 and the impedance board 240.

According to the present invention, it is possible to increase the number of the contact to the inspection object in accordance with the vertical spring system to improve the efficiency of the inspection by flowing a current for several objects at the same time.

Description

Vertical Probe Device

The present invention relates to a vertical probe device for inspecting the performance of a semiconductor integrated circuit, and more particularly, to vertically test using a coil spring for a test object in a probe device for inspecting a signal transmission performance of a semiconductor integrated circuit. A vertical probe device.

In order to manufacture a semiconductor device, a plurality of semiconductor devices are formed on a semiconductor wafer by using a fine photographic transfer technique or the like, and then each device is cut. In such a semiconductor device manufacturing process, conventionally, the probe device is used to measure the electrical characteristics of a semi-finished semiconductor device in the state of a semiconductor wafer, and only those that are determined to be good as a result of the test are sent to post-processing such as packaging. Is trying to improve.

This test contacts the probe tip to an electrode pad of a semiconductor wafer and measures electrical characteristics by the tester through the probe tip.

In recent years, semiconductor devices are becoming more and more minute, and the degree of integration of circuits is increasing, the size of electrode pads is miniaturized, and the spacing of electrode pads is also very narrow. Therefore, there is a need for a technique that requires hundreds of probe tips in a limited space of the probe device and at the same time to accurately and stably contact the center of the electrode pad of the probe tip.

1 is a view schematically showing the configuration of a conventional probe device.

Conventional probe device 100 is a probe tip (Needle Pin) 110, the support 120, the circuit board 130, the solder 140, the semiconductor integrated circuit 150, the electrode pad 152, fixed block portion ( 160).

That is, the probe tip 110 is generally in the shape of a needle, and is supported by the support 120 on the circuit board 130 as shown in FIG. 1A, and one side thereof is coupled to the solder 140. . In addition, the probe tip 110 is protected by being surrounded by the fixed block portion 160 as shown in FIG. In addition, the probe tip 110 is bent (Bar) the other side is bent to form an inclined portion (110b), the end portion is formed with a contact end (110a).

The probe tip 110 having such a shape is a test of the semiconductor integrated circuit 150 by contacting the contact end portion 110a of the electrode pad 152 of the semiconductor integrated circuit 150. Small electronic devices undergo a series of inspections during the manufacturing process to verify their functionality and reliability. However, yields of less than 100% are obtained because not all chips on the wafer are found to be good in wafer probe inspection.

The wafer is cut into individual chips, and the good chips are assembled and packaged. To break the defective device, the packaged device is mounted in a socket on a burn-in substrate and electrically operated at a temperature of 125-150 ° C. for a burn-in period of 8 to 72 hours to undergo a dynamic burn-in process. Burn-in inspections facilitate failure mechanisms, leading to early failure and failure of the device, and allow these defective devices to be screened by functional electrical inspection before commercial use.

A full functional check is performed on the packaged device, and the packaged device is operated at various operating speeds to classify each device by its maximum operating speed. Classifying and inspecting the packaged devices also allows the removal of devices that are broken during the burn-in process.

In this inspection process, the probe tip 110 of FIG. 1 is in a state where the inclination angle of the inclined portion 110b is large due to bending of the end portion. For this reason, as the contact end 110a is continuously subjected to repeated pressure by the repeated contact with the electrode pad 152 when the contact end 110a is in contact with the electrode pad 152, the contact end 110a becomes semiconductor integrated. When the electrode pad 152 of the circuit 150 is pressed, more than necessary slip occurs.

Accordingly, when the contact end 110a is pressed by the electrode pad 152, the moving range of the electrode pad 152 is increased, thereby leaving the center of the electrode pad 152. For this reason, only when the diameter of the contact end 110a is increased, the contact state with the electrode pad 152 can be improved. As the contact end 110a becomes larger in slip amount (moving distance) from the electrode pad 152, the contact end 110a becomes larger. In consideration of being out of the center of the electrode pad 152, the diameter of the contact end portion 110a cannot be reduced, resulting in poor contact.

In addition, the contact end 110a is repeatedly contacted with the electrode pad 152 due to repeated deformation (curvature) occurs in the contact end 110a is not stable contact with the center of the electrode pad 152 contact In addition to the problem that the correction time of the end portion 110a arrives quickly, the contact end portion 110a continues to be deformed during use, resulting in a significant adverse effect on the yield management of the semiconductor wafer, thereby significantly reducing the productivity. .

In addition, the needle-shaped probe device has a limitation in simultaneously testing a plurality of electrode pads 152 with a plurality of probe tips 110, and is difficult to apply to the above-described wafer-level burn-in test.

Since the probe tip 110 is manufactured by hand, it is difficult in the future to realize surface array responsiveness, high density, reduction of load, and high precision of position.

In order to solve the above problems, an object of the present invention is to provide a vertical probe device for vertically inspecting a test object using a coil spring in a probe device for inspecting signal transmission performance of a semiconductor integrated circuit.

In order to achieve the above object, the present invention is a vertical probe device for inspecting whether a plurality of micro-chips made of high density integrated on a circuit board is in a normal state, the micro-chip in direct contact with the micro chip Micropins to conduct current to the chip; A coil spring to provide elastic restoring force when the micropin contacts the microchip; A fixed block portion providing a frame for accommodating and supporting the micropin and the coil spring; An impedance board for matching impedance for current transfer to the microchip; And an interface board providing a line pattern for transmitting a signal for transferring a current flow between the micropin and the impedance board.

According to another object of the present invention, in the vertical probe device that checks whether a plurality of micro-chip made by densely integrated on a circuit board is in a normal state, the micro-chip is in direct contact with the microchip A first micropin for conducting current; An impedance board for matching impedance for current transfer to the microchip; An interface board providing a line pattern for signal transmission for transferring a flow of current between the micropins and the impedance board; A second micropin in direct contact with the interface board to conduct current; Positioned between the first micropin and the second micropin to electrically connect the first micropin and the second micropin, when the first micropin contacts the microchip and when the second micropin A coil spring providing elastic restoring force to the first micropin and the second micropin when a pin contacts the interface board; It characterized in that it comprises a fixing block for providing a frame for receiving and supporting the micro pin and the coil spring.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, the concept of inspecting the semiconductor integrated circuit 150 using the probe device will be described.

A printed circuit board (PCB) is an electronic component in which a plurality of chips are mounted on a plate surface and these chips are connected by a connection bus formed on the plate surface. The bus is formed by applying a conductive material along a line drawn on the plate surface of the circuit board. Therefore, if the conductive material applied on the line is peeled off even a little, the electrical signal can not be transmitted to another chip, the circuit board will not function properly.

Each of these chips can perform various functions, and electrical signals can be transmitted to each chip through a bus. A chip made of such a high density integrated circuit board is a high density integrated micro chip, and the micro chip is mounted on an electronic product to play an important role in determining the performance of the product. Therefore, it is necessary to inspect by the inspection apparatus to confirm whether the microchip of the electronic product is in a normal state. In order to perform such an inspection, a probe device is employed, and a plurality of probe devices are mounted and used in an inspection socket device.

2 is a view showing the configuration of a vertical probe device according to a first embodiment of the present invention. In Fig. 2, the parts having the same functions as those in Fig. 1 are denoted by the same reference numerals, and detailed description thereof is already omitted.

The vertical probe device 200 according to the first embodiment includes a micro pin 210, a coil spring 220, a fixed block unit 160, an interface board 230, an impedance main board 240, and the like.

The micro pin 210 is in direct contact with the microchip to be inspected to conduct current to the microchip. Therefore, the micropin 210 is made of a conductive material, for example, copper-based alloys, such as berilium kappa (BeCu), iron alloy (SK4), tungsten, titanium, and the like, and use a material capable of heat treatment to increase strength.

As shown in FIG. 3, the micro pins 210 include a contact part 310, a locking jaw 320, and a support pin 330. That is, a cylindrical contact portion 310 for contact with the microchip is formed on one side of the micro pin 210, and extends to the contact portion 310, the cylindrical locking jaw 320 is the diameter of the contact portion 310 It is formed integrally with the contact portion 310 with a larger diameter, and extends to the locking projection 320 to insert the coil spring 220 to the other side of the micro pin 210, the support pin 330 of the cylindrical shape is long Formed. The coil spring 220 is inserted into the support pin 330 and the coil spring 220 is supported by the locking jaw 320.

Although the diameter of the conventional micro pin 210 is 200 μm, it is difficult to inspect a pitch of 400 μm or less on the basis of a semiconductor integrated circuit package, but the micro pin 210 of the present invention is manufactured to 80 μm or less. It is now possible to measure an inspection object with a narrower pitch.

The coil spring 220 provides elastic restoring force when the contact portion 310 of the micropin 210 contacts the microchip. In addition, the coil spring 220 is made of a conductive material so that current flows from the interface board 230 to the microchip. In addition, the coil spring 220 has a larger diameter than the diameter of the support pin 330 to accommodate the support pin 330 and is formed longer than the support pin 330.

The fixed block portion 160 is made of an insulating material, and the upper side of the fixed block portion 160 is formed with a plurality of upper through-holes aligned in a straight line in the arrangement of the micropins 210. The contact portion 310 of the micro pin 210 is inserted into the upper through hole to protrude outward. In addition, a lower through hole is formed in the lower side of the fixing block 160 so that the coil spring 220 surrounding the support pin 330 of the micro pin 210 protrudes into the lower through hole.

The fixed block 160 is preferably made of polyether imide (PEI) having a relative dielectric constant of about 3.15 and an engineering plastic (TORON) or ceramic (alumina) having good strength and workability as an insulating material.

Impedance main board 240 is a board for matching the impedance for the current transmission to the test object. Matching the characteristic impedance on the board is based on the characteristic impedance of 50 kHz to minimize the loss in the transmission line from the probe device 200 to the inspection object. This is set to 50 mW on the grounds that the factor of factor in the transmission theory is the smallest at 77 mW and the power transfer is the largest at 30 mW.

The interface board 230 provides a line pattern for signal transmission for transferring a current flow between the micropin 210 and the impedance board 240. Since the probe device 200 measures a device having a very small pitch from a microchip to be inspected, a signal transmission board corresponding thereto is required, and the interface board 230 is responsible for such a function. The interface board 230 is formed with an electrode pad 232 to which the coil spring 220 into which the micropin 210 is inserted is in contact.

4 is a diagram illustrating a test object measured by using a probe device according to a first embodiment. In Fig. 4, the parts having the same functions as those in Figs. 1 and 2 are denoted by the same reference numerals and detailed description thereof will be omitted.

4 is a probe device manufactured by inserting a coil spring 220 into the support pin 330 of the micro pin 210. One side of the micro pin 210 is formed with a contact portion 310 for contact with the microchip, and the other side is inserted with a coil spring 220 for contact with the interface board 230. At this time, the coil spring 220 is formed longer than the support pin 330 of the micro pin (210). Therefore, the coil spring 220 formed longer than the support pin 330 protrudes through the lower through hole of the fixing block 160 to contact the electrode pad 232 of the interface board 230.

Therefore, when the microchip is inspected using the probe device, the contact portion 310 of the micropin 210 protruding into the upper through hole of the fixed block portion 160 contacts the electrode of the microchip as the measurement object, and the fixed block The coil spring 220 protruding into the lower through hole of the unit 160 contacts the electrode pad 232 of the interface board 230.

5 is a view showing a micro pin using a coil spring.

In Fig. 5, parts having the same functions as in Fig. 2 are given the same reference numerals, and detailed description thereof will be omitted.

In FIG. 5, the insulator outer cylinder 510 serves to support the micro pins 210 when the micro pins 210 move up and down while storing the micro pins 210.

The insulator outer cylinder 510 is configured in a cylindrical shape with an upper and lower opening, and is configured in a hollow shape. In addition, the upper end of the insulator outer cylinder 510 is bent inwardly so that the end of the latching jaw 320 of the micro pin 210 is hooked to the bent portion so that the micro pin 210 is endlessly outside the insulator outer cylinder 510. Prevent protruding. On the contrary, FIGS. 2 and 4 illustrate the inner wall of the fixed block portion 160 by allowing the micro pin 210 and the coil spring 220 to protrude into an insertion hole penetrated into the fixed block portion 160 without the insulator outer cylinder 510. This is to support the up and down movement.

As illustrated in FIG. 5, the surface thickness of the insulator outer cylinder 510 is made to be about 40 μm, the thickness of the micropin 210 is made to be 80 μm or less, and the micropin 210 to the outside of the insulator outer cylinder 510. ) Is produced to protrude about 200 μm. In addition, the end of the coil spring 220 protruding into the lower through hole from the end of the micro pin 210 protruding into the upper through hole of the insulator outer cylinder 510 or the fixed block part 160 is manufactured to be about 8,000 μm. do. Of course, the numerical value is shown as an example and can be produced below or above the numerical value.

6 is a view showing the configuration of a vertical probe device using a coil spring and an insulator according to a second embodiment of the present invention. In Fig. 2, the parts having the same functions as those in Figs. 1 and 2 are denoted by the same reference numerals, and the detailed description thereof has already been described and thus will be omitted.

In the vertical probe device 600 according to the second embodiment, a first micro pin 610 protrudes through an upper through hole of the fixed block unit 160, and is inserted into the fixed block unit 160. The coil spring 220 is inserted into the other side of the first micro pin 610, and the second micro pin 620 is inserted into the other side of the coil spring 220 into which the first micro pin 610 is inserted. It protrudes through the lower through-hole of the fixed block part 160.

That is, the first micro pins 610 and the second micro pins 620 are inserted at both ends of the coil spring 220, respectively, so that the first micro pins 610 protrude into the upper through holes of the fixed block part 160. ) Contacts the electrode of the microchip to be measured, and the second micropin 620 protruding into the lower through hole of the fixed block unit 160 contacts the electrode pad 232 of the interface board 230.

The first micropin 610 and the second micropin 620 are all composed of a contact portion, a locking jaw, and a support pin, as shown in FIG. 3, and the first micropin 610 and the second micropin 620. ), All of the contacts are longer than the support pins. For the inspection, the contact portion of the first micro pin 610 must protrude to the outside through the upper through hole of the fixed block portion 160, and the contact portion of the second micro pin 620 is fixed to the fixed block portion 160. This is because it must penetrate the lower through-hole and outward.

Therefore, the contact portion of the first micro pin 610 is in contact with the electrode of the microchip to be inspected, and the contact portion of the second micro pin 620 is in contact with the electrode pad 232 of the interface board 230.

Also in the vertical probe device 600 according to the second embodiment, the first micropin 610 and the second micropin 620 inserted into the fixed block unit 160 are formed on the inner wall of the fixed block unit 160. It may be supported by, or to be supported by the outer cylinder 710 as shown in FIG.

7 is a view showing first and second micropins having a body.

In FIG. 7, the outer cylinder 710 has a cylindrical shape having an upper and lower opening, and has an empty shape inside. The upper and lower ends of the outer cylinder 710 are bent inwardly bent, respectively, so that the engaging jaw of the first micro pin 610 and the second micro pin 620 is caught by the upper and lower bent portions, respectively, the coil spring ( The elastic action by the 220 prevents the first micro pin 610 and the second micro pin 620 from protruding to the outside of the outer cylinder 710. The outer cylinder 710 of FIG. 7 is a conductor included in the probe itself, and includes a first micro pin 610, a coil spring 220, and a second micro pin 620.

The contact portion of the first micro pin 610 and the second micro pin 620 is a part directly contacting the microchip or the circuit board to be inspected, and the contact portion of the first micro pin 610 and the second micro pin 620 is larger than the diameter of the contact portion. It is formed integrally with the contact portion by a diameter, the outer peripheral surface of the locking jaw is in contact with the inner circumferential surface of the outer cylinder 710 flows up and down to prevent the side flow of the first micro pin 610 and the second micro pin 620 The first micro pin 610 and the second micro pin 620 are stably flown only up and down.

In addition, since the first micropin 610 and the second micropin 620 should be electrically connected to each other, they are electrically connected to each other by a coil spring 220 made of a conductor material. The coil spring 220 is installed between the support pin of the first micro pin 610 and the support pin of the second micro pin 620 to provide elastic restoring force to the first micro pin 610 and the second micro pin 620. to provide.

Therefore, when the microchip to be inspected is pressed against the first micro pin 610 and the contact portion of the second micro pin 620 is pressed against the electrode pad 232 of the interface board 230, the first micro pin is pressed. The pin 610 and the second micro pin 620 are moved at a predetermined distance to make an even contact between the test chip terminal and the board terminals, thereby improving the reliability of the chip test.

In addition, the outer cylinder 710 is formed of a conductor material so that electric current is conducted through the inner circumferential surface of the outer cylinder 710 to electrically connect the first micro pin 610 and the second micro pin 620.

That is, when inspecting the semiconductor integrated circuit using the vertical probe device 600 according to the second embodiment configured as described above, the first micro pin 610 and the second micro pins formed at both ends of the probe device 600. The pin 620 is vertically flowed by the elastic action of the coil spring 220 to increase the contact force.

In addition, in the case of using the vertical probe device 200 according to the first embodiment, since the coil spring 220 is in direct contact with the electrode pad 232, the amount of contact can be increased, so that the current for a plurality of objects Simultaneous flow of water increases the efficiency of the inspection.

Therefore, using the probe device according to the present invention, an electrical signal is applied to the input / output pads of the semiconductor wafer, the LCD panel, and the input / output pads of various chip components to be useful for inspecting open, short, and various characteristics. Can be used and its inspection performance is improved.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

As described above, according to the present invention, an electrical signal is applied to an input / output pad of an semiconductor wafer, an LCD panel, and an input / output pad of various chip components to be useful for inspecting open, short, and various characteristics. Can improve its inspection performance.

In addition, by configuring a plurality of micropins of the probe device, it is possible to test a plurality of electrode pads of the inspection target at the same time, it can be easily applied to the wafer-level burn-in test.

In addition, the elastic force of the coil spring increases the contact force of the micro pin and the coil spring to the electrode pad, and the coil spring can increase the number of contacted, so that the current flows to several objects at the same time, thereby improving the inspection efficiency. Will be improved.

1 is a view schematically showing the configuration of a conventional probe device,

2 is a view showing the configuration of a vertical probe device according to a first embodiment of the present invention;

3 is a view showing the configuration of a micro pin;

4 is a view showing a state in which a test object is measured by using a probe device according to a first embodiment;

5 is a view showing a micropin using a coil spring,

6 is a view showing the configuration of a vertical probe device using a coil spring and an insulator according to a second embodiment of the present invention;

7 is a view showing first and second micropins having a body.

<Description of Symbols for Main Parts of Drawings>

110: probe pin (Needle Pin) 120: support

130: circuit board 140: solder

150: semiconductor integrated circuit 152, 232: electrode pad

160: fixed block portion 200: probe device

210: micro pin 220: coil spring

230: interface board 240: impedance board

310: contact portion 320: locking jaw

330: support pin 510: insulator outer cylinder

610: first micropin 620: second micropin

710: Body

Claims (19)

In the vertical probe device to check whether a large number of micro-chip made by high density integration on a circuit board is in a normal state, A current is conducted to the microchip by being in direct contact with the microchip, and a cylindrical contact portion 310 for contacting the microchip is formed on one side thereof, and extends to the contact portion 310 to have a cylindrical locking jaw. 320 is formed integrally with the contact portion 310 to a diameter larger than the diameter of the contact portion 310, and extends to the locking step 320 so that the coil spring 220 is inserted into the other side of the cylindrical shape The support pin 330 is formed long micro pin 210; A coil spring (220) made of a conductive material to provide elastic restoring force when the micropin (210) contacts the microchip and to flow current to the microchip; A fixed block part 160 providing a frame for accommodating and supporting the micro pins 210 and the coil springs 220; An impedance board 240 for matching impedance for current transfer to the microchip; Interface board 230 that provides a line pattern for transmitting a signal for transferring the flow of current between the micropin 210 and the impedance board 240 Vertical probe device comprising a. delete The method of claim 1, The coil spring 220 is inserted into the support pin 330, the vertical probe device, characterized in that the coil spring 220 is supported by the engaging jaw (320). delete The method of claim 1, The coil spring 220 has a diameter larger than the diameter of the support pin 330 and longer than the support pin 330 to accommodate the support pin 330 of the micro pin 210. Vertical probe device. The method of claim 1, The fixed block unit 160, The upper side is formed with a plurality of upper through holes arranged in a straight line positionally arranged in the array of the plurality of micro pins 210, one side of the micro pin 210 is inserted into the upper through hole to the outside Protrudes, A vertical probe device, characterized in that the lower through-hole is formed in the lower side to surround the other side of the micro pin (210) protrudes into the lower through-hole. delete The method of claim 1, Vertical probe device, characterized in that the interface board 230 is formed with an electrode pad (232) for contacting the coil spring 220, the micropin 210 is inserted. The method of claim 1, The fixed block unit 160 is a vertical probe device, characterized in that it comprises an insulator outer cylinder (510) for holding the micro pins 210 and to support when the micro pins 210 move up and down. The method of claim 6, The contact portion 310 of the micro pin 210 protruding into the upper through hole of the fixed block portion 160 contacts the electrode of the microchip and protrudes into the lower through hole of the fixed block portion 160. Vertical coil device, characterized in that the coil spring (220) is in contact with the electrode pad (232) of the interface board (230). The method of claim 9, The insulator outer cylinder 510 has a cylindrical shape having an upper and lower openings, and is formed in a hollow shape, and an upper end portion of the insulator outer cylinder 510 is formed with a bent portion inwardly so that an end of the latching jaw of the micro pin 210 is bent. Vertical probe device, characterized in that the hook is caught. In the vertical probe device to check whether a large number of micro-chip made by high density integration on a circuit board is in a normal state, Current is conducted to the microchip by being in direct contact with the microchip, and a cylindrical contact portion for contact with the microchip is formed on one side, and the hooking portion extending from the contact portion is larger than the diameter of the contact portion. A first micropin 610 integrally formed with the contact portion 310 with a larger diameter; An impedance board 240 for matching impedance for current transfer to the microchip; An interface board 230 providing a line pattern for signal transmission for transferring a flow of current between the micropins 210 and the impedance board 240; A current is conducted by directly contacting the interface board 230, and a support pin having a short cylindrical shape is formed to extend to the locking step so that the coil spring 220 is inserted into the other side of the first micro pin 610. A second micropin 620; Located between the first micro pin 610 and the second micro pin 620 to electrically connect the first micro pin 610 and the second micro pin 620, the first micro pin ( Elastic restoring force on the first micropin 610 and the second micropin 620 when 610 is in contact with the microchip and when the second micropin 620 is in contact with the interface board 230. Coil spring 220 to provide; Fixing block 160 for providing a frame for receiving and supporting the micro pins 210 and the coil spring 220 Vertical probe device comprising a. delete delete delete delete The method of claim 12, The first micro pin 610 and the second micro pin 620, A cylindrical contact portion for contact with the microchip is formed on one side, and the hooking jaw extends to the contact portion and is integrally formed with the contact portion 310 with a diameter larger than the diameter of the contact portion. The vertical probe device, characterized in that the support pin of the cylindrical shape is formed short by extending to the locking step so that the coil spring 220 is inserted into the other side. The method of claim 12, The coil spring 220 has a diameter larger than the diameter of the support pin at both ends to accommodate the support pins of the first micro pin 610 and the second micro pin 620, Vertical probe device, characterized in that made of a conductive material to flow a current from the interface board 230 to the microchip. The method of claim 12, The contact portion of the first micro pin (610) and the second micro pin (620) are both formed longer than the support pin vertical probe device.