KR100673286B1 - Probe card of semiconductor device test apparatus and porbe block using the probe card - Google Patents

Abstract

A probe card of a semiconductor device test apparatus and a probe block using the same are provided to improve reliability of a semiconductor wafer chip test process by minimizing leakage current in a signal transferring process. A probe block(130) includes a guide block(132) and a plurality of probes(150). The guide block includes a groove formed at one side thereof and a loading part having slots. Each of the probes includes a first and second elastic beam parts which are inserted into the groove of the guide block. The probe further includes a connective beam part which is positioned at the groove of the guide block. The first and second elastic beam parts are extended to both ends of the connective beam part in order to be elastically fixed to the groove of the guide block.

Description

Probe card of semiconductor device test apparatus and porbe block using the probe card}

1 is a perspective view of a probe card according to the present invention.

2 is an exploded perspective view of a probe card according to the present invention.

3 is a perspective view of a socket frame and a probe block of the probe card according to the present invention.

4 is an exploded perspective view of a probe block according to the present invention.

5 is a front view of a probe according to the present invention.

6A and 6B are cross-sectional views of a probe block according to the present invention.

7 is a sectional view of principal parts of a probe card according to the present invention.

8 is a perspective view showing a modification of the probe block according to the present invention.

9 is a view showing another modified example of the probe block according to the present invention.

10 and 11 illustrate another modified example of the probe block according to the present invention.

Explanation of symbols on the main parts of the drawings

110: electromagnetic plate

120: socket frame

130: probe block

150 probe

The present invention relates to a probe card for inspecting whether an IC chip integrated in a semiconductor wafer is defective and a probe block used in the probe card.

In the semiconductor integrated circuit inspection process, there is a wafer probing inspection that performs IC chip inspection in a wafer state. This probing inspection is an electrical characteristic test of a semiconductor integrated circuit. This is to prevent the increase.

A typical wafer probing inspection apparatus has an inspection head electrically connected to an inspection system for performing IC chip inspection in a wafer state, and a probe card includes a probe card electrically connected to the inspection head and a wafer on which a semiconductor IC chip is formed. The wafer probe station is installed so that it can be placed in contact.

The probe card is fixed by fixing the needle with an epoxy resin on the electromagnetic plate to test each chip on the wafer, and then contacting the needle of the probe card with the chip pad of the wafer to be inspected, and energizing the measurement current through the needle. Electrical characteristics will be measured.

However, since the conventional probe card uses an epoxy resin to fix the needle-type probes, the flatness is not changed in the process of the probes repeatedly deforming (shrink and expand with the temperature change) and deformation of the epoxy resin. Occurred. In this case, there is a problem that the reliability of the chip test is not only deteriorated but also a cost increase factor due to the probe replacement.

In order to solve this problem, a blade-type probe has been proposed, but the blade-type probe has a large portion exposed to the outside, which not only has instability in signal transmission, but also requires a separate fixing structure for fixing the probes (blade type). Since the assembly work is difficult and difficult disadvantages, there is a problem that the assembly time is delayed and the productivity is lowered. In particular, since the blade-type probe is fixed to the probe holder by the fixing structure, the probe can be replaced only by removing the fixing structure, and thus has a low maintenance ability.

SUMMARY OF THE INVENTION An object of the present invention is to provide a probe card of a new type semiconductor inspection apparatus with a simple assembly process and a probe block used for the probe card.

Another object of the present invention is to provide a probe card of a new type of semiconductor inspection device, in which a probe can be easily replaced, and a probe block used for the probe card.

Still another object of the present invention is to provide a probe card of a semiconductor inspection apparatus having a probe that can be fixed to a guide block by using its elasticity, and a probe block used for the probe card.

Probe block of the present invention for achieving the above object is a guide block having a groove having a groove on one side and the slot is formed on one side; It may include probes that are inserted into the groove of the guide block and is elastically fixed to the slot.

According to an exemplary embodiment of the present invention, the probe may include a connecting beam part positioned in a groove of the guide block, a first elastic beam part and a second elasticity that are bent from both ends of the connecting beam part and elastically fixed to the groove of the guide block. It may include a beam unit.

According to an embodiment of the present invention, the mounting portion of the guide block further includes a locking jaw formed in a direction crossing the slots on the upper and lower surfaces of the groove, respectively, wherein the probe is the first elastic beam portion and the second elastic beam portion Each of the plurality of hook hooks may further include hook hooks formed in the first elastic beam part and the second elastic beam part to be fixed to the locking jaws of the guide block.

According to an embodiment of the present invention, further comprising a first contact end in contact with the chip pad of the wafer and a second contact end in contact with the connection pad of the electromagnetic plate to receive an electrical signal to be provided to the chip pad of the wafer; The first contact end may be formed at an end of the first elastic beam part, and the second contact end may be formed at an end of the second elastic beam part.

According to an embodiment of the present invention, the first contact end and the second contact end may be of a spring type.

According to an embodiment of the present invention, the mounting portions are respectively formed on both side surfaces of the guide block, the probes coupled to the slots of the mounting portion formed on both sides of the guide block may be positioned with the first contact end alternately.

Probe card of the semiconductor inspection device of the present invention for achieving the above object is an electromagnetic plate having a connection pad on one surface; A socket frame coupled to one surface of the electromagnetic plate; Guide blocks coupled to the socket frame and having mounting portions grooved in at least one side; And probes inserted into the mounting portion of the guide block and elastically fixed to each other and having one end contacting the connection pad of the electromagnetic plate and the other end contacting the chip pad of the wafer.

According to an embodiment of the present invention, the probe may include a first elastic beam part and a second elastic beam part which are inserted into the grooves of the mounting part of the guide block and are elastically fixed.

According to an embodiment of the present invention, the guide block may include slots into which the first elastic beam part of the probe is fitted and fixed, and slots into which the second elastic beam part of the probe is fitted and fixed.

According to an embodiment of the present invention, the probe may further include a connecting beam part for elastically connecting the first elastic beam part and the second elastic beam part.

According to an embodiment of the present invention, the probe is formed at an end portion of the first elastic beam portion and in contact with the chip pad of the wafer, and formed at an end portion of the second elastic beam portion to connect the electromagnetic plate. It may further include a second contact end in contact with the pad.

According to an embodiment of the present invention, the probe further includes a third elastic beam part bent from the first elastic beam part and a fourth elastic beam part bent from the second elastic beam part, and the third elastic beam The part may have a first contact end in contact with the chip pad of the wafer, and the fourth elastic beam part may include a second contact end in contact with the connection pad of the electromagnetic plate.

According to an embodiment of the present invention, the guide block may have slots in which the third elastic beam part is inserted and fixed to a bottom surface thereof, and slots in which the fourth elastic beam part is inserted and fixed to an upper surface thereof may be formed.

According to an embodiment of the present invention, the socket frame may further include a plurality of bolts for fixing and adjusting the flatness of the guide block.

For example, embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape of the elements in the drawings and the like are exaggerated to emphasize a clearer description.

An embodiment of the present invention will be described in detail with reference to FIGS. 1 to 11. In addition, in the drawings, the same reference numerals are denoted together for components that perform the same function.

The basic intention of the present invention is to facilitate the fixing of the probes 150 and the guide block 132. To achieve this, the probe card of the present invention may be fixed to the guide block 132 by using its own elasticity. It is characterized by having a probe 150 having a structure that allows it.

In general, a probing inspection apparatus for semiconductor wafer inspection has an inspection head electrically connected to a test system for performing IC chip inspection in a wafer state, and a probe card is electrically connected to the inspection head and a semiconductor chip is formed. The wafer is placed in a wafer probe station and moved to a position where it can contact the probe card.

The probe card 100 is a pad W1 of a chip to test a probe 150 of a probe block 130 mounted on an electromagnetic plate 110 to test each chip on a substrate. (See Fig. 6b), and then to transmit the electrical signal (SIGNAL) of the test system (TEST SYSTEM) to the chip, each signal wiring of the test and each pad on the board so that the board can actually test It is a core inspection device that connects at the same time by chip.

1 to 3, the probe card 100 of the present invention includes an electromagnetic plate 110 having a conductive wiring pattern formed on an insulating substrate, and a socket detachably installed on one surface of the electromagnetic plate 110. The frame 120 and eight probe blocks 130 are detachably installed on the socket frame 120.

Here, the electromagnetic plate 110 is made of a space transformer or a printed circuit board.

In addition, the electromagnetic plate 110 has a plurality of pin contacts (not shown) contacting the pins of the test head (not shown) to receive a test signal on the upper surface thereof, and the probe 150 of the probe block 130 on the bottom surface thereof. ) And a circular plate with connection pads 114 in contact with them.

The socket frame 120 is mounted on the bottom surface of the electromagnetic plate 110 by four fixing bolts 10. The socket frame 120 has a plurality of fixing pins 122 protruding from one surface facing the bottom of the electromagnetic plate 110, and when the socket frame 120 is mounted on the bottom of the electromagnetic plate 110, the socket frame 120 is fixed. The pin 122 is fitted into the groove 119 formed on the bottom surface of the electromagnetic plate 110. Meanwhile, the socket frame 120 has four mounting units 124 on which the probe blocks 130 are mounted. The mounting part 124 has the opening 125 and the screw holes 126 on both sides of the opening 125.

4 to 7, the probe block 130, which is the most important component of the probe card 100, is detachably attached to the guide block 132 and the guide block 132 in a clip manner. It includes a plurality of probes (150). When the probe 150 is coupled to the groove 132a of the guide block 132, the probe 150 is narrowed (constricted) to be inserted into the slot 136, and the retracted probe 150 is restored to its original state by its elastic force. The guide block 132 is to be elastically fixed to the top and bottom of the groove (132a). That is, the probe 150 is fixed to the groove 132a of the guide block 132 by the interference fit method.

The probe 150 is a blade type made of a thin conductive metal plate and has a structural feature that can be elastically fitted to and coupled to the guide block 132.

Looking at the structural features of the probe 150 in more detail, the probe 150 is the first elastic beam portion 152, the connecting beam portion 154 formed by bending from one end of the first elastic beam portion 152, the connecting beam portion 154 It has a second elastic beam portion 156 is bent from the end of the.

The first elastic beam part 152, the second elastic beam part 156, and the connection beam part 154 of the probe 150 are inserted into the groove 132a of the guide block 132, and the first elastic beam part 152 is provided. And the second elastic beam part 156 are fitted into the slot 136 and fixed.

Since the first and second elastic beam parts 152 and 156 are concealed in the grooves 132 a and the slots 136, there is no need for separate insulation and a special effect of enabling stable signal transmission. In addition, as shown in FIG. 6B, when the first contact end 152b comes in contact with the chip pad w1 of the semiconductor wafer w, the first elastic beam part (1) receives a force applied to the first contact end 152b. As the 152 is absorbed and bent, it is possible to secure an overdrive value between the first contact ends 152b.

The first elastic beam part 152 is bent downwardly at the end of the hook hook 152a protruding toward the bottom of the groove 132a and exposed from the slot 136 of the guide block 132. It has a first contact end 152b. The first contact end 152b is a portion that is in contact with the chip pad w1 of the semiconductor wafer to be inspected, and the hook hook 152a is a portion that is caught by the latching jaw 134 formed on the bottom surface of the groove 132a. The first contact end 152b and the second contact end are stable up-down in the slot 136 when they are in contact with the chip pad W1 of the semiconductor wafer W and the connection pad 114 of the electromagnetic plate 110. (Bent) is possible (see FIG. 6B).

The probe 150 has a connection beam part 154 formed by bending from one end of the first elastic beam part 152 and a second elastic beam part 156 formed by bending from an end of the connection beam part 154. The second elastic beam part 156 is formed in a direction parallel to the first elastic beam part 152 and is fitted into and fixed to the slot 136 formed in the guide block 132. Like the first elastic beam part 152, the second elastic beam part 156 also has a hook hook 156a and a second contact end 158a bent upwardly at the end of the second elastic beam part. The second contact end 158a is a part contacting the connection pad 114 of the electromagnetic plate 110 to receive the test signal provided to the chip pad (not shown) of the semiconductor wafer.

As described above, the probe 150 has a slot 136 in which the first elastic beam portion 152 and the second elastic beam portion 156 are inserted into the grooves 132a of the guide block 132 and formed in the guide block 132. The gap between the probes 150 is maintained while being inserted into the gap, and the engaging hooks 152a and 156a of the first elastic beam part 152 and the second elastic beam part 156 are engaged with the guide block 132. While being caught in the probe 150 is held so as not to fall out of the groove 132a of the guide block 132.

The guide block 132 is a rectangular block having a predetermined length of a ceramic material, and has mounting parts 131 on which both sides of the probes 150 are inserted. The mounting portion 131 has a groove 132a formed from a side surface, and several slots 136 to which the probes 150 are inserted and fixed in one side and the inside of the groove 132a are formed at intervals between the chip pads W1 of the semiconductor wafer. It is provided along, and the engaging jaw 134 is provided on the top and bottom of the groove 132a, respectively. The hooking jaw 134 is fixed while the hooks 152a and 156a of the probe 150 are caught. The coupling of the guide block 132 and the socket frame 120 is made by bolts 180 coupled to the screw holes 126 (shown in FIG. 3) formed in the mounting portion 124 of the socket frame 120.

On the other hand, the guide block 132 is divided into an upper block (a) and a lower block (b) for processing the groove 132a and the slots 136 may be manufactured after each assembly. In the present embodiment, the mounting portions 131 are respectively provided on both sides of the guide block 132, but this is only one example, and the mounting portion 131 is provided only on one side of the guide block 132 as necessary. May be

As described above, in the probe card 100 of the present invention, since the structure of the probe 150 is fixed to the guide block 132 itself uses the elastic force of the probe 150, it is necessary to fix the separate probe 150. There is no need for parts. In particular, the probe 150 may shorten the length between the first contact end 152b and the second contact end 158a, and may have a simple shape to minimize the leakage current in the signal transmission process. In addition, since the probe block 130 may selectively replace and replace the probe 150 in the guide block 132, the probe block 130 may be easily replaced.

On the other hand, as the test is long, the flatness of the probe block 130 is inclined due to the physical contact pressure. In this case, each of the guide blocks 130 tightens or loosens the bolts 180 mounted at both ends. Individual flatness adjustment is possible. As shown in the present embodiment, when only one bolt 180 is used at each end of the guide block 132, only the flatness of the x-axis can be adjusted. However, as shown in FIG. If four bolts 180 are used, the flatness of the x-axis and the y-axis can be adjusted to more accurately match the flatness.

(First Modification of Probe Block)

9 is a view showing a modification of the probe block.

Referring to FIG. 9, the probe block 130 ′ includes a guide block 132 ′ and a probe 150 having the same configuration and function as the probe block 130 of the probe card 100 according to the first embodiment described above. Including the '), the description thereof will be omitted in the present modification because it has been described in detail above.

However, in this modified example, the probes 150 'have a structure similar to that of the probe 150 shown in FIG. 5, and the first contact end 152b' and the second elastic beam part 156 of the first elastic beam part 152. The second contact end 158a 'of the () is characterized in that it is formed of a spring type. As such, the spring type first and second contact ends 152b 'and 158a' have sufficient elastic force when they are in contact with the chip pad W1 of the semiconductor wafer W and the connection pad 114 of the electromagnetic plate 110. The first and second contact ends 152b 'and 158a' have an advantage of minimizing contact failure due to height difference. In particular, in the process of adjusting the flatness of the guide block 132 ', even if the distance between the connection pad 114 and the second contact end 158a' of the electromagnetic plate 110 is narrowed, the second contact end 158a 'is reduced. This sufficient elastic force ensures an overdrive value. For reference, in FIG. 9, the deformation states of the first and second contact ends 152b ′ and 158a ′ are indicated by dotted lines. The probe 150 ″ having such a structure has an elastic force capable of sufficiently compensating an error value with respect to the height of the first and second contact ends 152b and 158a ', thereby securing an overdrive value.

(2nd modification of probe block)

10 and 11 are diagrams illustrating a modification of the probe block.

10 and 11, the probe block 130 ″ includes a guide block 132 ″ and a probe 150 ″ having the same configuration and function as the probe block of the probe card 100 according to the first embodiment described above. ), Which are described in detail above, will be omitted in the present modification.

However, in the present modified example, the probes 150 ″ have a structure similar to those of the probes 150 and 150 ′ shown in FIGS. 5 and 9, and are formed by bending the first elastic beam part 152 and the third elastic beam part 158. The fourth elastic beam portion 159 is formed by bending from the second elastic beam portion 156. The guide block 132 " has a third elastic beam portion 158 and a fourth elastic beam portion 159 on the bottom and top surfaces, respectively. It is characterized by having slots 136a located therein. Particularly, the portion of the slot 136a in which the first contact end 152b of the fourth elastic beam portion 159 is located has a sufficient depth, so that the fourth elastic beam portion 159 moved into the slot 136a by elastic force. ) Can fully accommodate the end. In addition, a spring type first contact end 152b 'and a second contact end 158a' are formed in the third elastic beam part 158 and the fourth elastic beam part 159, respectively. As such, the spring type first and second contact ends 152b 'and 158a' have sufficient elastic force when they are in contact with the chip pad W1 of the semiconductor wafer and the connection pad 114 of the electromagnetic plate 110. The overdrive value can be secured because it has an elastic force capable of sufficiently compensating an error value of the heights of the two contact ends 152b and 158a '. For reference, in FIG. 10, deformation states of the first and second contact ends 152b ′ and 158a ′ are indicated by dotted lines.

As shown in FIG. 11, the guide block 132 ′ may be formed by alternately arranging slots 136a of the mounting portions 131 on both sides. For example, when the spacing of each chip pad on the wafer is dense, the method of arranging the probes 150 in a line has a limitation in densely processing the spacing of the slots 136a and between the probes 150. Problems may also occur in the mutual insulation of the slots, but as shown in FIG. 11, when the slots 136a are alternately arranged on both sides of the guide block 132 ", the probe 150" mounted in the slot 136a is formed. The first contact ends 152b 'of are alternately positioned. Therefore, the probe 150 "interval of the probe block 130" can be arranged more densely, and it can respond to fine pitch.

On the other hand, the present invention can be variously modified and can take various forms in the probe card consisting of the above configuration. It is to be understood, however, that the present invention is not limited to the specific forms referred to in the above description, but rather includes all modifications, equivalents and substitutions within the spirit and scope of the invention as defined by the appended claims. It should be understood to do.

As described above, the probe card of the present invention uses the probe's own elastic force, and thus, the assembly of the probes to the guide block is excellent.

The probe card of the present invention increases signal transmission efficiency through the probe, thereby minimizing leakage current in the signal transmission process, thereby improving reliability of chip inspection of the semiconductor wafer.

In the probe card of the present invention, the replacement of the probe in the guide block may be selectively performed, and thus the replacement operation may be easily performed.

When the probe card of the present invention is deformed and moved in accordance with repetitive testing, or when a defect occurs, the entire probe card must be discarded (or replaced). However, in the present invention, the probe block (or Maintenance is easy because only the relevant probe) needs to be removed and repaired or replaced.

Probe card of the present invention, even if the flatness of the probe block is inclined due to the physical contact pressure according to the repeated test progress, it is possible to independently adjust the flatness of the guide block by using the bolts for fixing the guide block There is an advantage.

In the probe card of the present invention, the first contact ends of the probes respectively coupled to both slots of the probe block are alternately positioned so that the distance between neighboring first contact ends can be reduced by half with respect to the interval between the slots so that it can cope with fine pitch. Do.

Claims (16)

In the probe block used for the probe card of the semiconductor inspection device: A guide block having a groove on one side and a mounting portion formed with slots on one side; And a probe having a first elastic beam part and a second elastic beam part inserted into the groove of the guide block and elastically fixed to the slot. The method of claim 1, The probe further comprises a connecting beam portion located in the groove of the guide block, And the first elastic beam part and the second elastic beam part are bent from both ends of the connection beam part and extended to be fixed to the groove of the guide block. The method of claim 2, The mounting portion of the guide block further comprises a locking step formed in the direction crossing the slots on the upper and lower surfaces of the groove, respectively, The probe may further include a hook formed on the first elastic beam part and the second elastic beam part such that the first elastic beam part and the second elastic beam part are fitted into the locking jaw of the guide block, respectively. block. The method according to claim 2 or 3, A first contact end in contact with the chip pad of the wafer and a second contact end in contact with a connection pad of the electromagnetic plate for receiving an electrical signal to be provided to the chip pad of the wafer; The first contact end is formed at an end of the first elastic beam part, And the second contact end is formed at an end of the second elastic beam part. The method of claim 4, wherein And the first contact end and the second contact end are of a spring type. The method according to claim 2 or 3, The mounting portion is formed on each side of the guide block, Probes coupled to the slots of the mounting portion formed on both sides of the guide block are probe blocks, characterized in that the first contact end is staggered with each other. In the probe card of the semiconductor inspection device: An electromagnetic plate having connection pads on one surface thereof; A socket frame coupled to one surface of the electromagnetic plate; Guide blocks coupled to the socket frame and having mounting portions grooved in at least one side; And Inserted into the mounting portion of the guide block is elastically fixed, including a probe having one end in contact with the connection pad of the electromagnetic plate, the other end in contact with the chip pad of the wafer; And the probe has a first elastic beam portion and a second elastic beam portion inserted into a groove of the mounting portion of the guide block and fixed elastically. delete The method of claim 7, wherein The guide block may include slots in which the first elastic beam part of the probe is inserted into and fixed to the mounting portion, and slots in which the second elastic beam part of the probe is inserted into and fixed to the mounting block. The method of claim 7, wherein The probe further comprises a connection beam unit for elastically connecting the first elastic beam unit and the second elastic beam unit. The method of claim 7, wherein The probe may include a first contact end formed at an end of the first elastic beam part and contacting the chip pad of the wafer, and a second contact end formed at an end of the second elastic beam part to contact the connection pad of the electromagnetic plate. Probe card of a semiconductor inspection device further comprising. The method of claim 7, wherein The probe further includes a third elastic beam part bent from the first elastic beam part and a fourth elastic beam part bent from the second elastic beam part, wherein the third elastic beam part is in contact with the chip pad of the wafer. And a fourth contact end having a first contact end, wherein the fourth elastic beam part has a second contact end in contact with a connection pad of an electromagnetic plate. The method of claim 12, The guide block is a probe card of the semiconductor inspection apparatus, characterized in that the bottom is formed with slots to be fixed to the third elastic beam portion is inserted, the fourth elastic beam portion is inserted and fixed to the upper surface. The method of claim 12, And the first contact end and the second contact end are made of a spring type. The method of claim 7, wherein And a plurality of bolts for fixing the guide block to the socket frame and adjusting the flatness. The method of claim 7, wherein The electromagnetic plate is a space transformer or a printed circuit board (Printed Circuit Board), characterized in that the probe card of the semiconductor inspection device.

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