KR100889146B1 - Probe card for testing semiconductor device - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card for testing a semiconductor device, the probe card for inspecting a semiconductor device, comprising: a plurality of probes each having contact tips and terminal tips formed on both sides thereof, and a plurality of fixing members having the probes fixed side by side; And a probe bar positioned so that the fixing members are arranged in the longitudinal direction on both sides thereof so that each of the contact tips contacts the connection pad of the semiconductor element, a main circuit board to which the probe bars are fixed, and a contact tip and the main circuit board of the probe. Connection means for connecting the. Therefore, the present invention improves productivity by preventing deformation of the probe by modularizing and assembling a predetermined number of probes, and also improves productivity by separating the probes, which are worn or deformed, by being separated into module units. Replacement can be easily performed without damaging the probe, and the probe can be reliably connected to the semiconductor device and the main circuit board to be inspected to improve the reliability of the operation, and between probes due to high integration and high density of semiconductor devices. It has the effect of realizing a fine pitch.

Probe, contact tip, terminal tip, fixing member, probe bar, FPCB, main circuit board

Description

PROBE CARD FOR TESTING SEMICONDUCTOR DEVICE}

1 is an exploded perspective view illustrating a probe card for testing a semiconductor device according to the prior art;

2 is an exploded perspective view illustrating a probe card for testing a semiconductor device according to the present invention;

3 is an exploded perspective view illustrating the main part of a probe card for testing a semiconductor device according to the present invention;

4A to 4D are views illustrating various embodiments of a probe of a probe card for testing a semiconductor device according to the present invention;

5 is an assembly cross-sectional view showing a part of a probe card for testing a semiconductor device according to the present invention.

<Description of Symbols for Main Parts of Drawings>

110: probe 111: body

111a: first protrusion 111b: second protrusion

112: contact tip 113: terminal tip

114: elastic portion 115: bent portion

120: fixing member 121: fixing slit

121a: first slit 121b: second slit

122: fastening groove 130: probe bar

131: mounting groove 132: guide means

132a: guide slit 132b: guide panel

132c: fixing protrusion 132d: fixing groove

133: fastener 140: main circuit board

141: reinforcement plate 142: terminal

150: connecting means 151: FPCB

151a: Contact hole 151b: Flexible cable

152: connector 160: fixed frame

161: mounting hole

The present invention relates to a probe card for testing a semiconductor device, and more particularly, to prevent the deformation of a probe by modularizing and assembling the probe, thereby improving quality and improving assembly quality and improving reliability of operation. Relates to a probe card.

In general, semiconductor devices are manufactured by various unit processes such as an exposure process, a diffusion process, an etching process, and a chemical vapor deposition process. Through this process, a plurality of semiconductor devices are formed on the semiconductor wafer, and the semiconductor devices are inspected for electrical defects to determine whether they are defective. By these inspections, the feedback in the semiconductor manufacturing process can be fed back early. Back-up to increase the yield and reduce the cost of assembly and package test by early removal of defective semiconductor devices.

The device for inspecting a semiconductor device formed on the semiconductor wafer is composed of a tester and a probe system. The probe system includes a probe card that is in mechanical contact with the electrode pad of the semiconductor device. It is installed.

A probe card provided in a probe system for inspecting electrical characteristics of a conventional semiconductor device will be described with reference to the accompanying drawings.

1 is an exploded perspective view illustrating a probe card for testing a semiconductor device according to the related art. As shown in the drawing, a conventional probe card for testing semiconductor devices 10 includes a plurality of probes 11 formed of a thin plate, and a plurality of slits 12a formed on both sides thereof so that the probes 11 are mounted, respectively. A rectangular frame 13 and a frame 13 in which a groove 13a is formed so that both ends of the bar 12 and the probe mounting bar 12 are fitted, and an opening 13b through which the probe 11 is exposed is formed. ) Is fixed to include a printed circuit board 14 to which the probe 11 is installed.

The probe 11 is formed on the rectangular body 11a and the upper end of the body 11a to be electrically connected to each other by contacting the connection pads 2 of the chip formed on the semiconductor wafer 1 for inspection. 11b and an elastic terminal portion 11c formed at the lower end of the body 11a and in contact with the pad of the circuit board 14.

As described above, the conventional probe card 10 is electrically connected to the connection pad 2 on the semiconductor wafer 1 by the elastic probe pin portion 11b of the probe 11 to generate a signal generated from the tester and transmitted to the probe system. Is transferred to the connection pad 2 on the semiconductor wafer 1.

However, the conventional probe card 10 has to mount a large number of probes 11 at the probe mounting bar 12 at the same time, causing deformation in the probe 11 during assembly work, thereby lowering productivity due to defects, When replacing the probe 11, which is worn or deformed, it may cause inconvenience by requiring surroundings so as not to cause damage due to contact with other probes 11, or even because of difficulty in replacing the probe 11, 12) had the problem of discarding the whole.

In addition, such a conventional probe card 10 is required to realize a fine pitch between the probes 11 and to develop a stable product according to the high integration and high density of semiconductor devices.

The present invention is to solve the above-mentioned conventional problems, an object of the present invention is to prevent the deformation of the probe during the assembly operation of the probe, such as to improve the quality and productivity, and to easily replace the probe with wear or deformation In addition, it is possible to improve the reliability of the operation by enabling stable connection between the semiconductor device and the main circuit board, which are the object of inspection, and to provide a probe card for semiconductor device test that can realize minute pitch between probes due to high integration and high density of semiconductor devices. The purpose is to provide.

The present invention provides a probe card for inspecting a semiconductor device, comprising: a plurality of probes each having a contact tip and a terminal tip formed on both sides, a plurality of fixing members on which the probes are fixed in parallel, and a fixing member on both sides in the longitudinal direction; And fixed to be arranged so that each of the contact tips can be in contact with the connection pad of the semiconductor device, a main circuit board to which the probe bars are fixed, and connecting means for connecting the contact tips and the main circuit board of the probe.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

2 is an exploded perspective view showing a semiconductor device test probe card according to the present invention, Figure 3 is an exploded perspective view showing the main part of the semiconductor device test probe card according to the present invention. As shown, the semiconductor device test probe card 100 according to the present invention is provided in a probe system for inspecting a semiconductor device consisting of chips formed on the semiconductor wafer 1, and a plurality of probes Probe 110, a plurality of fixing member 120 is fixed to the probe 110 side by side, the probe bar 130 is fixed so that the fixing member 120 is arranged in the longitudinal direction on both sides, and the probe bar ( A main printed circuit board 140 to which the 130 is fixed, and connection means 150 connecting the probe 110 to the main circuit board 140.

The probe 110 is made of a material having excellent conductivity to be electrically connected to the connection pad 2 of the semiconductor device to be inspected and the circuit patterned on the main circuit board 140, and has a thin plate to have a fine structure. Contact tips 112 contacting the connection pads 2 of the semiconductor elements and terminal tips 113 electrically connected to circuits (not shown) on the main circuit board 140 are formed on both sides of the body 111. do.

The probe 110 has an elastic portion 114 having a restoring force against bending by extending vertically from an upper side of the body 111 so that the contact tip 112 has an elastic force when the contact tip 112 contacts the connection pad 2 of the semiconductor device. Is formed horizontally, the contact tip 112 is formed at the end of the elastic portion 114.

The probe bar 130 may vary the shape or formation position of each terminal tip 113, as shown in Figures 4a to 4d to be different from the position to be connected on the connecting means 150.

The fixing member 120 is fixed side by side so that the probe 110 to arrange each contact tip 112 in the same direction, for this purpose may be provided with a fixing part such as a projection, in this embodiment the probe 110 A plurality of fixing slits 121 into which the body 111 is inserted in a state in which the contact tip 112 and the terminal tip 113 are protruded are formed in parallel, and the probes 110 are 1/2 DUT (Device Under Test). Module to achieve

When the probe 110 is mounted on the fixing slit 121 of the fixing member 120, the probe 110 is fixed to the fixing member 120 using an epoxy resin, for example, the fixing member 120. By fixing an epoxy resin to the surface of the fixing slit 121 is formed so that the probe 110 fixed to the fixing slit 121 does not escape.

The fixing slit 121 may be formed in a straight line on the fixing member 120. In the present embodiment, the first and second protrusions 111a and 111b formed on the body 111 of the probe 110 may be formed. The first and second slits 121a and 121b are respectively inserted.

The first slit 121a is formed at the center of the fixing member 120, and the first protrusion 111a formed at the center of the body 111 of the probe 110 is inserted into the probe 110 on the fixing member 120. ) To fix the probes 110 to each other.

The second slits 121b are formed at both sides of the fixing member 120, respectively, and the second tip 111b formed at both sides of the body 111 of the probe 110 is inserted into the contact tip of the probe 110. Guide 112 and the terminal tip 113 to prevent deformation or positional deviation by the pressure.

The fixing member 120 has fastening grooves 122 formed to be fixed to the probe bar 130 by fastening bolts or screws (not shown) on both sides.

The fastening groove 122 is fixed to the probe bar 130 by fastening bolts or screws not shown in contact with each other when the fastening members 120 are arranged in plural. For this purpose, the fastening grooves 122 are open to both sides of the fastening members 120. It is formed so that the hole is formed on the contact portion between the adjacent fixing member (120). At this time, the probe bar 130 is formed with a screw groove (not shown) on both sides for screwing the bolt or screw fastened through the fastening groove (122).

The probe bar 130 is fixed so that the fixing members 120 are arranged in the longitudinal direction on both sides thereof, so that each of the contact tips 112 of the probe 110 protrudes so as to be in contact with each of the connection pads 2 of the semiconductor device. The mounting member 131 is fixed to the fixing member 120 by being inserted in the longitudinal direction on both sides.

On the other hand, the probe 110 is installed so that each fixed to both sides of the probe bar 130 is located in a zigzag so that the pitch (pit) between each other is fine, thereby each contact fixed to both sides of the probe bar 130 The tips 112 are staggered from one another. As such, in order for the probes 110 positioned on both sides of the probe bar 130 to be zigzag, the fixing slits 121 are formed to be offset from each other between the fixing members 120 fixed to both sides of the probe bar 130, or the probe A configuration such as shifting the positions of the fixing members 120 fixed to both sides of the bar 130 may be considered.

As illustrated in FIG. 5, each of the contact tips 112 fixed to both sides of the probe bar 130 faces the upper surface of the probe bar 130, that is, the surface facing the semiconductor device that is the object of inspection. The bent portion 115 is formed to face.

The probe bar 130 may include a guide slit that inserts a contact tip 112 forming portion of the probe 110 to suppress lateral displacement of the contact tip 112 to increase contact stability with the connection pad 2 of the semiconductor device. Guide means 132 having 132a is provided. In this case, the probe 110 protrudes upward from the contact tip 112 in a state where the formation portion of the contact tip 112 is inserted into the guide slit 132a.

The guide means 132 includes a plurality of guide panels 132b having guide slits 132a formed on both sides, and a plurality of fixing protrusions 132c formed on the upper surface of the probe bar 130 to fix the guide panels 132b. It includes.

The guide panel 132b forms a number corresponding to the number of the fixing members 120, and is deviated from each other so as to guide the contact tip 112 forming portions of the probes 110 positioned on both sides of the probe bar 130. The guide slits 132a are arranged at intervals, and fixing grooves 132d are formed at each corner to increase coupling force with the fixing protrusions 132c.

The fixing protrusion 132c may be formed in various shapes and structures in order to detachably fix the plurality of guide panels 132b to the upper surface of the probe bar 130. In this embodiment, the fixing protrusion 132c is longitudinally formed on the upper surface of the probe bar 130. It is formed to be arranged in two rows at intervals so as to be fitted into the fixing grooves (132d) of the guide panel 132b to fix the guide panel 132b to the probe bar 130.

The main circuit board 140 is patterned with a circuit not shown on one side, and a reinforcing plate 141 (shown in FIG. 5) is attached to the lower side to have rigidity against bending, and the probe is connected by the connecting means 150. Electrically connected with 110.

The connecting means 150 may connect the probes 110 located at the plurality of fixing members 120 at one time, but in this embodiment, the fixing members 120 are formed in the same number as the number of pairs to fix the pair. Probes 110 located in the member 120 are connected, and may be composed of a cable or a circuit board to connect the terminal tip 113 of the probe 110 and the main circuit board 140, but is not limited thereto. Instead, as in the present embodiment, a plurality of contact holes 151a to which the terminal tips 113 of each of the probes 110 fixed to the fixing member 120 are connected are formed and patterned on the main circuit board 140. A flexible printed circuit board (FPCB) 151 connected to the connector 152 detachably fastened to the terminal 142 connected to the integrated circuit may be formed.

The FPCB 151 is electrically connected by soldering or the like in a state where the terminal tip 113 of the probe 110 is inserted into each of the contact holes 151a, and the flexible cable 151b extends to one side. The connector 152 provided in the terminal 141 is fastened to the terminal 141 provided on the main circuit board 140, thereby connecting each of the probes 110 to a circuit of the main circuit board 140. Meanwhile, the connector 152 and the terminal 141 of the main circuit board 140 have a male and female form and are detachably coupled to each other.

Meanwhile, the probe bar 130 may be directly fixed to the main circuit board 140 by using a fastening member such as a bolt or a screw. Alternatively, the probe bar 130 may be fixed to the main circuit board through the fixing frame 160 as in the present embodiment. 140).

The fixing frame 160 is provided with a mounting hole 161 in which the probe bar 130 is mounted on the upper surface, and the mounting hole 161 is formed to open vertically to provide a space for mounting the connection means 150. The connecting means 150 positioned below the probe bar 130 is connected to the main circuit board 140.

The mounting holes 161 may be formed in a single fixed frame 160 so that a plurality of probe bars 130 are mounted. However, the mounting holes 161 may be formed in a plurality of probe bars 130. Is preferably formed in a plurality of side by side in the fixed frame 160 so that a plurality of side by side arranged.

The fixing frame 160 passes through a fastening means such as a bolt (B) fastened to the fastening portions 133 formed at both ends of the probe bar 130 while the probe bar 130 is positioned on the mounting hole 161. The main circuit board 140 is fixed to the main circuit board 140 by being fixed to the main circuit board 140.

The operation of the probe card for testing a semiconductor device having such a structure is performed as follows.

A predetermined number, for example, a number of probes 110 corresponding to 1/2 DUT are modularized by being fixed to the fixing member 120, and the fixing members 120 are mounted on both sides of the probe bar 130. Mounting a plurality of grooves in the longitudinal direction in the groove 131 as well as inserting the forming portion of the contact tip 112 of the probe 110 into the guide slit 132a of the guide means 132 to be guided, and then fastening groove ( The fixing member 120 is fixed to the probe bar 130 by screwing the probe bar 130 with a bolt or a screw through the 122 and the terminal tip 113 protruding downward from the fixing member 120 is connected to the FPCB ( Each probe 110 is connected to the main circuit by inserting it into the contact hole 151a of the 151 and fixing it by soldering or the like, and defecting the connector 152 of the FPCB 151 to the terminal 142 of the main circuit board 140. It is electrically connected to a circuit of the substrate 140.

The probe bar 130 is fixed on the main circuit board 140 together with the fixing frame 160 by the bolt B in a state where it is located in the mounting hole 161 of the fixing frame 160.

As shown in FIG. 5, the connection pads 2 of each chip formed on the semiconductor wafer 1 (shown in FIG. 2) for inspecting electrical characteristics of the semiconductor device using the assembled probe card 100; When the contact tip 112 of the probe 110 is contacted with an elastic force (shown in FIG. 2), the probe 110 is connected to the tester by connecting the semiconductor device to the tester and the semiconductor device. Through the transfer to the connection pad (2) of the semiconductor device to test whether each semiconductor device is defective.

As described above, the probe card 100 for testing a semiconductor device according to the present invention is assembled in a assembly process by modularizing and assembling a number of probes 110 corresponding to a predetermined number, for example, 1/2 DUT, by the fixing member 120. The deformation of the generated probe 110 is prevented to improve quality, and the assembly is excellent, thereby improving productivity. In addition, since the probe 110, which is worn or deformed during use, can be separated by a module unit, the probe 110 can be easily replaced without damaging other probes.

The contact tip 112 of each of the probes 110 fixed to both sides of the probe bar 130 is opposed to the upper surface of the probe bar 130 by the bent portion 115, and further, the probe tip 130 is fixed to both sides of the probe bar 130. Since the probes 110 are zigzag with each other, a minute pitch between the probes 110 may be realized due to high integration and high density of semiconductor devices.

The contact tip is formed by inserting the contact tip 112 forming part of the probe 110 into the guide slit 132a of the guide panel 132b fixed to the fixing protrusion 132c provided on the probe bar 130. The guide 112 is guided so as to accurately contact the connection pad 2 of the semiconductor device, and the terminal tip 113 of the probe 110 is connected to the main circuit by the connection means 150, that is, the FPCB 151 and the connector 152. By maintaining the state correctly connected to the desired position on the substrate 140, the probe 110 enables stable connection between the semiconductor element, which is the object of inspection, and the main circuit board 140, thereby improving reliability of the operation.

As described above, the probe card for testing a semiconductor device according to the present invention improves quality by preventing deformation of the probe by modularizing and assembling a predetermined number of probes, and also has excellent assembly performance, and improves wear and deformation. When replacing the generated probe by module unit, the replacement can be easily performed without damaging other probes.In addition, the probe can reliably connect the semiconductor device and the main circuit board to be tested to improve the reliability of operation. In addition, it has an effect of realizing a fine pitch between probes due to high integration and high density of semiconductor devices.

What has been described above is only one embodiment for carrying out the probe card for testing a semiconductor device according to the present invention, the present invention is not limited to the above-described embodiment, the invention as claimed in the following claims Without departing from the gist of the present invention, those skilled in the art to which the present invention pertains to the technical spirit of the present invention to the extent that various modifications can be made.

Claims (10)

A probe card for inspecting a semiconductor device, A plurality of probes each having a contact tip and a terminal tip formed on both sides; A plurality of fixing members to which the probes are fixed in parallel; A probe bar positioned so that each of the contact tips may be in contact with a connection pad of the semiconductor device by fixing the fixing members to be arranged in the longitudinal direction on both sides; A main circuit board to which the probe bar is fixed; Connection means for connecting the contact tip of the probe and the main circuit board, The connecting means, A plurality of contact holes are formed to be connected to the terminal tip of each of the probes fixed to the fixing member, it is a FPCB (Flexible Printed Circuit Board) connected to the main circuit board by a connector Probe card for semiconductor device testing, characterized in that. The method of claim 1, The probe, Each of which is fixed to both sides of the probe bar is installed in a zigzag Probe card for semiconductor device testing, characterized in that. The method according to claim 1 or 2, The probe, A bent portion is formed such that each contact tip fixed to both sides of the probe bar faces the upper surface of the probe bar. Probe card for semiconductor device testing, characterized in that. The method of claim 1, The fixing member, A plurality of fixing slits inserted in parallel with the probe protruding from the contact tip and the terminal tip Probe card for semiconductor device testing, characterized in that. The method according to claim 1 or 4, The fixing member, Fastening grooves are formed on both sides such that the parts contacted when arranged in a plurality are fixed to the probe bar by fastening bolts or screws. Probe card for semiconductor device testing, characterized in that. The method of claim 1, The probe bar, Mounting grooves to which the fixing member is fitted are formed along the longitudinal direction on both sides Probe card for semiconductor device testing, characterized in that. The method according to any one of claims 1, 2 or 6, The probe bar, Guide means having a guide slit into which the contact tip forming portion of the probe is inserted is provided Probe card for semiconductor device testing, characterized in that. The method of claim 7, wherein The guide means, A plurality of guide panels formed to arrange the guide slits on both sides; A plurality of fixing protrusions formed on the upper surface of the probe bar at intervals in the longitudinal direction to fix the guide panel Probe card for semiconductor device testing comprising a. delete The method of claim 1, A fixed frame installed on the main circuit board and having a probe bar mounted thereon and a mounting hole positioned to connect the connecting means to the main circuit board Probe card for semiconductor device testing further comprising.

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