CN113484561A - Probe card and wafer test system - Google Patents
Probe card and wafer test system Download PDFInfo
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- CN113484561A CN113484561A CN202110769474.2A CN202110769474A CN113484561A CN 113484561 A CN113484561 A CN 113484561A CN 202110769474 A CN202110769474 A CN 202110769474A CN 113484561 A CN113484561 A CN 113484561A
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- 239000000523 sample Substances 0.000 title claims abstract description 142
- 238000012360 testing method Methods 0.000 title claims abstract description 75
- 239000000758 substrate Substances 0.000 claims abstract description 118
- 239000000919 ceramic Substances 0.000 claims abstract description 95
- 238000003466 welding Methods 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 10
- 150000007530 organic bases Chemical class 0.000 description 4
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 3
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 3
- 238000005034 decoration Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention provides a probe card and a wafer test system, wherein the probe card comprises: a PCB board; the ceramic substrate is arranged on the PCB; the probe head is arranged on the ceramic substrate and comprises a guide plate, and a plurality of uniformly distributed probes are arranged on the guide plate; the PCB board with be provided with the picture peg between the ceramic substrate, be provided with a plurality of on the picture peg and run through the pogo pin of picture peg, the both ends of pogo pin respectively with the PCB board with ceramic substrate fixed connection. The probe card can increase the test area and ensure the needle point flatness of the probe, thereby being beneficial to the test of the wafer.
Description
Technical Field
The present invention relates to the field of probe card technology, and more particularly, to a probe card and a wafer test system.
Background
In the semiconductor wafer testing stage, unpackaged chips (bare chips) on a wafer need to be tested, and a probe card is used in the testing process. The Probe card is mainly divided into 3 parts, namely a Printed Circuit Board (PCB), a substrate (MLO/MLC) and a Probe head (Probe head), wherein one end of a Probe (Probe) of the Probe head is pricked on a bonding pad of the substrate, and the other end of the Probe (Probe) is pricked on a bonding pad of a wafer. Therefore, the electrical connection is established between the wafer and the PCB (test machine), and the test machine is used for allocating resources and completing automatic test, thereby ensuring the quality of bare chips on the wafer.
Generally, wafer testing requires that the flatness of the tips of all probes (flatness is the height difference of the tips) is less than 50um, and the smaller the value is, the more favorable the wafer testing is, which provides a bigger challenge for the manufacture of probe cards, which requires that the main components of the probe cards, namely printed circuit boards and substrates, must control the flatness in a testing area to meet the requirements of chip testing; with the test requirements of high test efficiency and high data throughput, the requirement of customers for the test area of the probe card to be enlarged is more and more urgent, the larger the test area is, the more difficult the probe point flatness of the probe is to be ensured, which is higher for the probe card, and the existing probe card is difficult to meet the requirements, so that the probe card capable of ensuring the probe point flatness of the probe while enlarging the test area is needed.
Disclosure of Invention
The invention aims to provide a probe card and a wafer test system, which solve the problem that the flatness of a probe point of a probe cannot be ensured while a test area is enlarged in the prior art.
The technical scheme provided by the invention is as follows:
the present invention provides a probe card, including:
a PCB board;
the ceramic substrate is arranged on the PCB;
the probe head is arranged on the ceramic substrate and comprises a guide plate, and a plurality of uniformly distributed probes are arranged on the guide plate;
the PCB board with be provided with the picture peg between the ceramic substrate, be provided with a plurality of on the picture peg and run through the pogo pin of picture peg, the both ends of pogo pin respectively with the PCB board with ceramic substrate fixed connection.
Generally, wafer testing requires that the flatness of the tips of all probes (flatness is the height difference of the tips) is less than 50um, and the smaller the value is, the more favorable the wafer testing is, which presents a greater challenge to the manufacturing of probe cards; with the test requirements of high test efficiency and high data throughput, the requirement of customers for enlarging the test area of the probe card is more and more urgent, and the larger the test area is, the more difficult the flatness of the probe tip of the probe is to be ensured, which is a higher requirement for the probe card.
At present, the manufacturing capability of a multilayer organic substrate (MLO) can ensure the flatness within an area of 80mmX40mm, and the minimum pad center distance (Pitch) which can be supported is 50 um; the manufacturing capability of the multi-layer ceramic substrate (MLC) can ensure the flatness within the area 300mmX300mm, and the minimum pad center distance (Pitch) which can be supported is 150 um; the manufacturability of a multi-layer Printed Circuit Board (PCB) can ensure flatness within the area 80mmX40mm, and the minimum pad-to-center distance (Pitch) that can be supported is 300 um. Therefore, the flatness of the ceramic substrate is more easily controlled than the organic substrate and the PCB board.
Through set up ceramic substrate on the PCB board, and set up the picture peg between PCB board and ceramic substrate, be provided with the spring pin that a plurality of runs through the picture peg on the picture peg, the both ends of spring pin respectively with PCB board and ceramic substrate fixed connection, make the characteristics that the effective stroke ratio through the spring pin is bigger and MLC roughness is controlled more easily, can effectively reduce the requirement of probe card to PCB's roughness, and then make can be under the prerequisite of guaranteeing the probe roughness, realize test area's expansion, be favorable to improving wafer test efficiency and precision.
Specifically, in this embodiment, the effective stroke of the pogo pin is set to be 0.45mm, that is, if the flatness of the MLC is 30um, even if the flatness of the PCB is 400um, the pogo pin can still ensure the electrical connection between the PCB and the MLC. Through this kind of mode, increase the adjustable surplus between PCB and the MLC, realize the reduction to the pincard is required to PCB roughness, need not restrict PCB's roughness again and must satisfy 50um, can widen PCB roughness to more than 200um even, be favorable to solving PCB roughness's processing control problem like this, when reducing the technical difficulty, practiced thrift cost and time.
Furthermore, one end of the probe penetrates through the guide plate and is fixed on the bonding pad of the ceramic substrate, and the other end of the probe extends to the outer side of the guide plate.
Furthermore, an organic substrate is arranged between the ceramic substrate and the probe head, and the organic substrate is fixedly connected with the ceramic substrate in a loop welding mode.
Specifically, because the minimum pad center distance (Pitch) that MLC can support is 150um, but there are very many application scenarios, chip test requires minimum pad center distance (Pitch) to be 50um, can pass through to set up organic substrate between ceramic substrate and probe head, organic substrate passes through return circuit welding's mode and ceramic substrate fixed connection, because MLC has better structural strength and roughness, after MLO MLC welds together, MLO can be evened out by MLC, makes MLO possess the good roughness as MLC, and then satisfies more test demands.
Preferably, to ensure that the MLO will be leveled by the MLC, the MLO needs to be made thinner, typically within 1 mm.
Further, one end of the probe penetrates through the guide plate and is fixed on the bonding pad of the organic substrate, and the other end of the probe extends to the outer side of the guide plate.
Further, the probes are equal in length; and/or
The probes extend to the outer side of the guide plate for equal lengths.
Furthermore, the pogo pin includes canned paragraph and flexible section, be provided with the jack on the canned paragraph, the bottom activity of flexible section is inserted and is established in the jack.
Furthermore, a first spring is arranged in the jack, and two ends of the first spring are respectively and fixedly connected with the bottom end of the telescopic section and the bottom end of the jack; or
The top of flexible section is provided with the annular piece, just the outside cover of flexible section is equipped with the second spring, the both ends of second spring respectively with the annular piece the top fixed connection of canned paragraph.
Furthermore, the fixed section is connected with the PCB, and the telescopic section is connected with the ceramic substrate; or
The fixed section is connected with the ceramic substrate, and the telescopic section is connected with the PCB.
In addition, the present invention also provides a wafer test system, comprising:
the probe card comprises a PCB (printed circuit board), a ceramic substrate and a probe head;
testing the wafer;
the ceramic substrate is arranged on the PCB, an inserting plate is arranged between the PCB and the ceramic substrate, a plurality of spring pins penetrating through the inserting plate are arranged on the inserting plate, and two ends of each spring pin are fixedly connected with the PCB and the ceramic substrate respectively;
the probe head is arranged on the ceramic substrate and comprises a guide plate, a plurality of uniformly distributed probes are arranged on the guide plate, and the probes are matched with bonding pads on the test wafer.
Furthermore, an organic substrate is arranged between the ceramic substrate and the probe head, and the organic substrate is fixedly connected with the ceramic substrate in a loop welding mode.
According to the probe card and the wafer test system provided by the invention, the ceramic substrate is arranged on the PCB, the inserting plate is arranged between the PCB and the ceramic substrate, the inserting plate is provided with the plurality of spring pins penetrating through the inserting plate, and the two ends of each spring pin are respectively and fixedly connected with the PCB and the ceramic substrate, so that the requirement of the probe card on the PCB flatness can be effectively reduced through the characteristics that the effective stroke of the spring pins is larger and the MLC flatness is easier to control, further, the test area can be expanded on the premise of ensuring the probe flatness, and the wafer test efficiency and precision can be improved.
Drawings
The foregoing features, technical features, advantages and embodiments of the present invention will be further explained in the following detailed description of the preferred embodiments, which is to be read in connection with the accompanying drawings.
FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another embodiment of the present invention.
Reference numbers in the figures: 1-a PCB board; 2-a ceramic substrate; 3-a probe head; 4-a guide plate; 5-a probe; 6-inserting plates; 7-an organic substrate; 8-test wafer.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will be made with reference to the accompanying drawings. It is obvious that the drawings in the following description are only some examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be derived from them without inventive effort.
For the sake of simplicity, the drawings only schematically show the parts relevant to the present invention, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. In this document, "one" means not only "only one" but also a case of "more than one".
Example 1
One embodiment of the present invention, as shown in fig. 1, provides a probe card including a PCB board 1, a ceramic substrate 2, and a probe head 3.
The ceramic substrate 2 is arranged on the PCB 1; the probe head 3 is arranged on the ceramic substrate 2, the probe head 3 comprises a guide plate 4, and a plurality of uniformly distributed probes 5 are arranged on the guide plate 4.
Wherein, be provided with picture peg 6 between PCB board 1 and ceramic substrate 2, be provided with the spring needle that a plurality of runs through picture peg 6 on the picture peg 6, the both ends of spring needle respectively with PCB board 1 and ceramic substrate 2 fixed connection.
Generally, wafer testing requires that the flatness of the tips of all probes (flatness is the height difference of the tips) is less than 50um, and the smaller the value is, the more favorable the wafer testing is, which presents a greater challenge to the manufacturing of probe cards; with the test requirements of high test efficiency and high data throughput, the requirement of customers for enlarging the test area of the probe card is more and more urgent, and the larger the test area is, the more difficult the flatness of the probe tip of the probe is to be ensured, which is a higher requirement for the probe card.
At present, the manufacturing capability of a multilayer organic substrate (MLO) can ensure the flatness within an area of 80mmX40mm, and the minimum pad center distance (Pitch) which can be supported is 50 um; the manufacturing capability of the multi-layer ceramic substrate (MLC) can ensure the flatness within the area 300mmX300mm, and the minimum pad center distance (Pitch) which can be supported is 150 um; the manufacturability of a multi-layer Printed Circuit Board (PCB) can ensure flatness within the area 80mmX40mm, and the minimum pad-to-center distance (Pitch) that can be supported is 300 um. Therefore, the flatness of the ceramic substrate is more easily controlled than the organic substrate and the PCB board.
Through set up ceramic substrate 2 on PCB board 1, and set up picture peg 6 between PCB board 1 and ceramic substrate 2, be provided with the spring pin that a plurality of runs through picture peg 6 on the picture peg 6, the both ends of spring pin respectively with PCB board 1 and ceramic substrate 2 fixed connection, make the characteristics that the effective stroke ratio through the spring pin is bigger and MLC roughness is controlled more easily, can effectively reduce the requirement of probe card to PCB's roughness, and then make and to guarantee under the prerequisite of 5 roughness of probe, realize test area's expansion, be favorable to improving wafer test efficiency and precision.
Specifically, in this embodiment, the effective stroke of the pogo pin is set to be 0.45mm, that is, if the flatness of the MLC is 30um, even if the flatness of the PCB is 400um, the pogo pin can still ensure the electrical connection between the PCB and the MLC. Through this kind of mode, increase the adjustable surplus between PCB and the MLC, realize the reduction to the pincard is required to PCB roughness, need not restrict PCB's roughness again and must satisfy 50um, can widen PCB roughness to more than 200um even, be favorable to solving PCB roughness's processing control problem like this, when reducing the technical difficulty, practiced thrift cost and time.
Preferably, one end of the probe 5 is fixed on the pad of the ceramic substrate 2 through the guide plate 4, and the other end extends to the outside of the guide plate 4.
The length of the probes 5 is equal; and/or the probes 5 extend to the outside of the guide plate 4 by the same length, thereby ensuring that the probes 5 can be in sufficient contact with the wafer when the wafer test is performed.
Example 2
In one embodiment of the present invention, as shown in fig. 2, the present invention provides a probe card including a PCB board 1, a ceramic substrate 2, and a probe head 3.
The ceramic substrate 2 is arranged on the PCB 1; the probe head 3 is arranged on the ceramic substrate 2, the probe head 3 comprises a guide plate 4, and a plurality of uniformly distributed probes 5 are arranged on the guide plate 4.
Wherein, be provided with picture peg 6 between PCB board 1 and ceramic substrate 2, be provided with the spring needle that a plurality of runs through picture peg 6 on the picture peg 6, the both ends of spring needle respectively with PCB board 1 and ceramic substrate 2 fixed connection.
An organic substrate 7 is arranged between the ceramic substrate 2 and the probe head 3, and the organic substrate 7 is fixedly connected with the ceramic substrate 2 in a loop welding mode.
Generally, wafer testing requires that the flatness of the tips of all probes (flatness is the height difference of the tips) is less than 50um, and the smaller the value is, the more favorable the wafer testing is, which presents a greater challenge to the manufacturing of probe cards; with the test requirements of high test efficiency and high data throughput, the requirement of customers for enlarging the test area of the probe card is more and more urgent, and the larger the test area is, the more difficult the flatness of the probe tip of the probe is to be ensured, which is a higher requirement for the probe card.
At present, the manufacturing capability of a multilayer organic substrate (MLO) can ensure the flatness within an area of 80mmX40mm, and the minimum pad center distance (Pitch) which can be supported is 50 um; the manufacturing capability of the multi-layer ceramic substrate (MLC) can ensure the flatness within the area 300mmX300mm, and the minimum pad center distance (Pitch) which can be supported is 150 um; the manufacturability of a multi-layer Printed Circuit Board (PCB) can ensure flatness within the area 80mmX40mm, and the minimum pad-to-center distance (Pitch) that can be supported is 300 um. Therefore, the flatness of the ceramic substrate is more easily controlled than the organic substrate and the PCB board.
Through set up ceramic substrate 2 on PCB board 1, and set up picture peg 6 between PCB board 1 and ceramic substrate 2, be provided with the spring pin that a plurality of runs through picture peg 6 on the picture peg 6, the both ends of spring pin respectively with PCB board 1 and ceramic substrate 2 fixed connection, make the characteristics that the effective stroke ratio through the spring pin is bigger and MLC roughness is controlled more easily, can effectively reduce the requirement of probe card to PCB's roughness, and then make and to guarantee under the prerequisite of 5 roughness of probe, realize test area's expansion, be favorable to improving wafer test efficiency and precision.
Specifically, in this embodiment, the effective stroke of the pogo pin is set to be 0.45mm, that is, if the flatness of the MLC is 30um, even if the flatness of the PCB is 400um, the pogo pin can still ensure the electrical connection between the PCB and the MLC. Through this kind of mode, increase the adjustable surplus between PCB and the MLC, realize the reduction to the pincard is required to PCB roughness, need not restrict PCB's roughness again and must satisfy 50um, can widen PCB roughness to more than 200um even, be favorable to solving PCB roughness's processing control problem like this, when reducing the technical difficulty, practiced thrift cost and time.
In addition, because the minimum pad center distance (Pitch) that MLC can support is 150um, but there are very many application scenarios, chip test requires minimum pad center distance (Pitch) to be 50um, can pass through set up organic base plate 7 between ceramic base plate 2 and probe head 3, organic base plate 7 passes through the fixed connection of return circuit welding mode with ceramic base plate 2, because MLC has better structural strength and roughness, after MLC welds together, MLO can be leveled by MLC, make MLO possess MLC equally good roughness, and then satisfy more test demands.
Preferably, to ensure that the MLO will be leveled by the MLC, the MLO needs to be made thinner, typically within 1 mm.
Preferably, one end of the probe 5 is fixed on the pad of the organic substrate 7 through the guide plate 4, and the other end extends to the outside of the guide plate 4.
The length of the probes 5 is equal; and/or the probes 5 extend to the outside of the guide plate 4 by the same length, thereby ensuring that the probes 5 can be in sufficient contact with the wafer when the wafer test is performed.
Example 3
In an embodiment of the present invention, based on embodiment 1 or 2, the pogo pin includes a fixed section and a telescopic section, the fixed section is provided with a jack, and a bottom end of the telescopic section is movably inserted into the jack.
Specifically, when the fixed section is connected with the telescopic section, the spring can be externally arranged or internally arranged. When the spring is internally arranged, a first spring can be arranged in the jack, and two ends of the first spring are respectively and fixedly connected with the bottom end of the telescopic section and the bottom end of the jack; when the spring is external, the top end of the telescopic section can be provided with the annular block, the outside of the telescopic section is sleeved with the second spring, and two ends of the second spring are respectively fixedly connected with the annular block and the top end of the fixed section.
In addition, when the PCB and the ceramic substrate are particularly connected through the spring pins, the fixed section can be arranged to be connected with the PCB 1, and the telescopic section is connected with the ceramic substrate 2; the fixing section can be connected with the ceramic substrate 2, and the telescopic section is connected with the PCB board 1, which is not limited herein.
Example 4
In one embodiment of the present invention, as shown in fig. 1, the present invention further provides a wafer test system, which includes a probe card and a test wafer 8.
The probe card comprises a PCB (printed Circuit Board) 1, a ceramic substrate 2 and a probe head 3; wherein, ceramic substrate 2 sets up on PCB board 1, and is provided with picture peg 6 between PCB board 1 and the ceramic substrate 2, is provided with the pogo pin that a plurality of runs through picture peg 6 on the picture peg 6, the both ends of pogo pin respectively with PCB board 1 and ceramic substrate 2 fixed connection.
The probe head 3 is arranged on the ceramic substrate 2, the probe head 3 comprises a guide plate 4, a plurality of uniformly distributed probes 5 are arranged on the guide plate 4, and the probes 5 are matched with bonding pads on a test wafer 8.
Through set up ceramic substrate 2 on PCB board 1, and set up picture peg 6 between PCB board 1 and ceramic substrate 2, be provided with the spring pin that a plurality of runs through picture peg 6 on the picture peg 6, the both ends of spring pin respectively with PCB board 1 and ceramic substrate 2 fixed connection, make the characteristics that the effective stroke ratio through the spring pin is bigger and MLC roughness is controlled more easily, can effectively reduce the requirement of probe card to PCB's roughness, and then make and to guarantee under the prerequisite of 5 roughness of probe, realize test area's expansion, be favorable to improving wafer test efficiency and precision.
Example 5
In one embodiment of the present invention, as shown in fig. 2, the present invention further provides a wafer test system, which includes a probe card and a test wafer 8.
The probe card comprises a PCB (printed Circuit Board) 1, a ceramic substrate 2 and a probe head 3; wherein, ceramic substrate 2 sets up on PCB board 1, and is provided with picture peg 6 between PCB board 1 and the ceramic substrate 2, is provided with the pogo pin that a plurality of runs through picture peg 6 on the picture peg 6, the both ends of pogo pin respectively with PCB board 1 and ceramic substrate 2 fixed connection.
The probe head 3 is arranged on the ceramic substrate 2, the probe head 3 comprises a guide plate 4, a plurality of uniformly distributed probes 5 are arranged on the guide plate 4, and the probes 5 are matched with bonding pads on a test wafer 8.
An organic substrate 7 is arranged between the ceramic substrate 2 and the probe head 3, and the organic substrate 7 is fixedly connected with the ceramic substrate 2 in a loop welding mode.
Through set up ceramic substrate 2 on PCB board 1, and set up picture peg 6 between PCB board 1 and ceramic substrate 2, be provided with the spring pin that a plurality of runs through picture peg 6 on the picture peg 6, the both ends of spring pin respectively with PCB board 1 and ceramic substrate 2 fixed connection, make the characteristics that the effective stroke ratio through the spring pin is bigger and MLC roughness is controlled more easily, can effectively reduce the requirement of probe card to PCB's roughness, and then make and to guarantee under the prerequisite of 5 roughness of probe, realize test area's expansion, be favorable to improving wafer test efficiency and precision.
In addition, because the minimum pad center distance (Pitch) that MLC can support is 150um, but there are very many application scenarios, chip test requires minimum pad center distance (Pitch) to be 50um, can pass through set up organic base plate 7 between ceramic base plate 2 and probe head 3, organic base plate 7 passes through the fixed connection of return circuit welding mode with ceramic base plate 2, because MLC has better structural strength and roughness, after MLC welds together, MLO can be leveled by MLC, make MLO possess MLC equally good roughness, and then satisfy more test demands.
It should be noted that the above embodiments can be freely combined as necessary. The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A probe card, comprising:
a PCB board;
the ceramic substrate is arranged on the PCB;
the probe head is arranged on the ceramic substrate and comprises a guide plate, and a plurality of uniformly distributed probes are arranged on the guide plate;
the PCB board with be provided with the picture peg between the ceramic substrate, be provided with a plurality of on the picture peg and run through the pogo pin of picture peg, the both ends of pogo pin respectively with the PCB board with ceramic substrate fixed connection.
2. A probe card according to claim 1, wherein: one end of the probe penetrates through the guide plate and is fixed on the bonding pad of the ceramic substrate, and the other end of the probe extends to the outer side of the guide plate.
3. A probe card according to claim 1, wherein: an organic substrate is arranged between the ceramic substrate and the probe head, and the organic substrate is fixedly connected with the ceramic substrate in a loop welding mode.
4. A probe card according to claim 3, wherein: one end of the probe penetrates through the guide plate and is fixed on the bonding pad of the organic substrate, and the other end of the probe extends to the outer side of the guide plate.
5. A probe card according to claim 2 or 4, characterized in that: the length of the probes is equal; and/or
The probes extend to the outer side of the guide plate for equal lengths.
6. A probe card according to any of claims 1 to 4, wherein: the spring needle comprises a fixed section and a telescopic section, wherein the fixed section is provided with a jack, and the bottom end of the telescopic section is movably inserted into the jack.
7. A probe card according to claim 6, wherein: a first spring is arranged in the jack, and two ends of the first spring are respectively and fixedly connected with the bottom end of the telescopic section and the bottom end of the jack; or
The top of flexible section is provided with the annular piece, just the outside cover of flexible section is equipped with the second spring, the both ends of second spring respectively with the annular piece the top fixed connection of canned paragraph.
8. A probe card according to claim 6, wherein: the fixed section is connected with the PCB, and the telescopic section is connected with the ceramic substrate; or
The fixed section is connected with the ceramic substrate, and the telescopic section is connected with the PCB.
9. A wafer test system, comprising:
the probe card comprises a PCB (printed circuit board), a ceramic substrate and a probe head;
testing the wafer;
the ceramic substrate is arranged on the PCB, an inserting plate is arranged between the PCB and the ceramic substrate, a plurality of spring pins penetrating through the inserting plate are arranged on the inserting plate, and two ends of each spring pin are fixedly connected with the PCB and the ceramic substrate respectively;
the probe head is arranged on the ceramic substrate and comprises a guide plate, a plurality of uniformly distributed probes are arranged on the guide plate, and the probes are matched with bonding pads on the test wafer.
10. The wafer test system of claim 9, wherein: an organic substrate is arranged between the ceramic substrate and the probe head, and the organic substrate is fixedly connected with the ceramic substrate in a loop welding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110769474.2A CN113484561A (en) | 2021-07-07 | 2021-07-07 | Probe card and wafer test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110769474.2A CN113484561A (en) | 2021-07-07 | 2021-07-07 | Probe card and wafer test system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113484561A true CN113484561A (en) | 2021-10-08 |
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| CN202110769474.2A Pending CN113484561A (en) | 2021-07-07 | 2021-07-07 | Probe card and wafer test system |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116223866A (en) * | 2023-05-10 | 2023-06-06 | 上海泽丰半导体科技有限公司 | Modularized probe card and manufacturing method thereof |
| WO2023240786A1 (en) * | 2022-06-17 | 2023-12-21 | 上海泽丰半导体科技有限公司 | Stroke compensation system and method for probe card |
| WO2024021200A1 (en) * | 2022-07-26 | 2024-02-01 | 上海泽丰半导体科技有限公司 | Probe high-speed testing apparatus and testing system |
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| WO2023240786A1 (en) * | 2022-06-17 | 2023-12-21 | 上海泽丰半导体科技有限公司 | Stroke compensation system and method for probe card |
| WO2024021200A1 (en) * | 2022-07-26 | 2024-02-01 | 上海泽丰半导体科技有限公司 | Probe high-speed testing apparatus and testing system |
| CN116223866A (en) * | 2023-05-10 | 2023-06-06 | 上海泽丰半导体科技有限公司 | Modularized probe card and manufacturing method thereof |
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