CN101598743A

CN101598743A - Probe

Info

Publication number: CN101598743A
Application number: CNA2008101100177A
Authority: CN
Inventors: 李天嘉; 陈明祈; 吴世昌; 陈文吉; 黄朝敬; 林进亿; 吴学智
Original assignee: MJC Probe Inc
Current assignee: MJC Probe Inc
Priority date: 2008-06-02
Filing date: 2008-06-02
Publication date: 2009-12-09

Abstract

A kind of probe of the present invention comprises connection unit, a substrate, a probe groups, and the adjusting gear of a circuit board, a compliance.Connect unit and be arranged at circuit board, substrate then is arranged at and connects in the unit, see through to connect unit and be electrically connected at circuit board, and the end face of substrate forms a plurality of contact mats, wherein connects first compliant substrate moving and distortion and elastic deformation thereupon with respect to circuit board.Probe groups possesses a probe station and a plurality of probe, and its middle probe passes the two side faces of probe station, and probe station removably is fixed in the end face of substrate, an end that makes each probe with contact each contact mat respectively.Adjusting gear is adjusted probe in order to the shape that changes substrate or orientation, makes the tip of probe be positioned at a reference plane jointly.

Description

Probe

Technical field

The present invention relates to the probe stationary of probe, particularly about a kind of probe that can install and dismantle probe simply.

Background technology

Probe of the prior art is directly probe to be fixed on the ceramic substrate with welding manner, ceramic substrate is seen through connection unit again and is fixed in circuit board, and electrically connect with circuit board.Open cases of No. 2006257631, U.S. Pat for example, it is in ceramic base plate surface a plurality of micropore arrays that are shaped, and uses the link for probe to be inserted in wherein.Then probe is fixed in the micropore with welding manner, and fixedlys connected with the internal wiring of ceramic substrate.Finish the ceramic substrate of probe stationary, be further be connected unit and be fixed on the circuit board, be combined into a ceramic substrate probe.Other, U.S. Pat discloses cases, No. 6520778 patent cases of United States Patent (USP) for No. 20070007977, reaches No. 293938 patent of invention cases of TaiWan, China patent also is directly probe to be welded in ceramic substrate.No. 5852871, U.S. Pat and TaiWan, China patent then are for I284379 number to provide ceramic substrate earlier, form probe again on ceramic substrate, and it remains in essence probe is difficult to be incorporated into discretely ceramic substrate.

The probe of No. 3806801 patent cases of United States Patent (USP) and for example, its probe flexibly is contacted with ceramic substrate, but because do not have adjusting gear on its probe, can't adjust the levelness and the depth of parallelism of probe smoothly when changing, also therefore the user can't carry out the replacing of probe voluntarily.

During with the probe test chip, be with contact or metallic circuit exposed on the probe contact chip, whether normal operation of test chip.Probe is compressive deformation and contact chip flexibly, guarantee the end of probe of each probe can be really and chip electrically conduct.Yet the probe of continuous deformation material gradually is tired, and causes damaging so that the time with the probe test chip, can occur the part probe can't be really with chip on corresponding contact point electrically conduct.The replacing of probe must remove probe with the special solution soldering equipment at the mode of weld probe, then with special welding gear new probe is welded in probe substrate again.Therefore, probe must wholely be delivered to the manufacturer place, carries out the replacing of probe, and the user also can't carry out the replacing of probe.For fear of interrupting chip testing work, the user must prepare a plurality of probe, replaces to send when repairing in probe.

The probe price is high, so stock's preparation meeting of probe causes user's equipment cost to promote.Therefore, further ceramic substrate is made into separable form in the prior art, the user only need prepare a plurality of ceramic substrates that comprise probe, when needs are changed probe, ceramic substrate by the probe removal, is refilled new ceramic substrate and gets final product.The probe substrate of changing still can be delivered to the manufacturer place and change probe.

Though reduced cost partly with dismountable ceramic substrate for whole group probe, the ceramic substrate manufacturing cost that comprises probe is still very expensive, still can cause user's equipment cost to promote.

Summary of the invention

In the prior art probes card, probe is changed operation and must be used special welding and separate soldering equipment, and the user can't change probe voluntarily, probe must be delivered to the manufacturer place and carry out the replacing of probe.Therefore, the user must keep probe or possess the deposit of the ceramic substrate of probe, with keep chip testing work continue carry out.In view of the above problems, the objective of the invention is to propose a kind of probe, is to change probe apace, reduces the use cost of probe.

In order to reach above-mentioned purpose, the invention provides a kind of probe, comprise connection unit, a substrate, a probe groups, an and fixation kit one adjusting gear of a circuit board, a compliance.Connecting unit is the upper side that is arranged at circuit board, and substrate is arranged at and connects in the unit, sees through to connect unit and be electrically connected at circuit board, wherein connects unit and be compliant substrate moving or be out of shape and be out of shape thereupon with respect to circuit board.In addition, and the end face of substrate forms a plurality of contact mats, sees through the conducting wire of substrate inside and connects unit, is electrically connected at circuit board.Probe groups possesses a probe station and a plurality of probe, and its middle probe is the two side faces that passes probe station, and probe station is the end face that removably is fixed in substrate, an end that makes each probe with contact each contact mat respectively.Adjusting gear is adjusted probe in order to the shape that changes substrate or orientation, makes the tip of probe be positioned at a reference plane jointly.

Effect of the present invention is that a plurality of probes are to be fixed on the probe station, and constitute a probe groups, are fixed in substrate more removably, and probe is electrically conducted with the way of contact and substrate.Therefore, remove probe or stationary probe on substrate the time by substrate, do not need probe is welded or tip-off, get final product but see through easy relatively fixing means stationary probe platform, no matter be the probe body therefore, or substrate does not need to change, and does not just need the stock to be equipped with card.For the user, only need the cheap relatively probe groups of inventory cost, and can construct voluntarily to change probe or probe groups.Simultaneously, probe tip also can see through the adjustment of adjusting gear, and is maintained on the reference plane, so that probe is with average pressure contact measured chip.

Description of drawings

Figure 1A and Figure 1B are the sectional exploded view of first embodiment of the invention;

Fig. 1 C is the cut-open view of first embodiment of the invention;

Fig. 2 A and Fig. 2 B are the cut-open view that is applied to probe groups of the present invention;

Fig. 3 A is the sectional exploded view of second embodiment of the invention;

Fig. 3 B is the cut-open view of second embodiment of the invention;

Fig. 4 is the cut-open view of third embodiment of the invention;

Fig. 5 A is the sectional exploded view of fourth embodiment of the invention;

Fig. 5 B is the cut-open view of fourth embodiment of the invention;

Fig. 6 is the cut-open view of fifth embodiment of the invention;

Fig. 7 is the cut-open view of sixth embodiment of the invention.

[primary clustering symbol description]

100 probe, 110 circuit boards 120 connect unit

130 substrates, 131 contact mats

140 probe groups

141 probe stations, 142 probes, 143 upper guide plates

144 bottom guides, 145 chambers, 146 end of probe

147 links, 148 relay

150 fixation kits

160 adjusting gears, 161 rigid strutting pieces, 162 web members

200 probe, 210 circuit boards 220 connect unit

221 adjust matrix 222 resilient contacts

230 substrates, 232 first connecting portions

240 probe groups, 241 probe stations, 242 probes

246 end of probe, 247 links, 249 second connecting portions

250 fixation kits, 251 buttons are held end 252 openings

260 adjusting gears, 261 rigid strutting pieces, 262 web members

300 probe, 310 circuit boards 320 connect unit

330 substrates, 332 connecting portions

340 probe groups

341 probe stations, 342 probes, 343 upper guide plates

344 bottom guides, 347 links

350 fixation kits, 351 bolts, 352 locking blocks

360 adjusting gears

400 probe, 410 circuit boards 420 connect unit

430 substrates, 432 substrate fixed parts

440 probe groups

441 probe stations, 442 probes, 443 upper guide plates

444 bottom guides, 447 links, 449 connecting portions

450 fixation kits, 451 fixed parts, 452 pressing parts

460 adjusting gears, 461 rigid strutting pieces, 462 web members

500 probe, 510 circuit boards 520 connect unit

530 substrates

540 probe groups

541 probe stations, 542 probes, 543 upper guide plates

544 bottom guides, 549 fixed parts

560 adjusting gears

600 probe

610 circuit boards 620 connect first 630 substrates

640 probe groups

641 probe stations, 642 probes, 643 upper guide plates

644 bottom guides, 649 fixed parts

660 adjusting gears, 670 pads

Embodiment

In order to describe structure of the present invention and characteristics place in detail, lift following preferred embodiment now and cooperate graphic explanation as after.

See also Figure 1A, Figure 1B, reach shown in Fig. 1 C, be the disclosed a kind of probe 100 of first embodiment of the invention, comprise a circuit board 110, and connect unit's 120, one substrate 130, a probe groups 140, a fixation kit 150, reach an adjusting gear 160.

Circuit board 110 provides the binding with test machine.Connect the upper side that unit 120 is arranged at circuit board 110, wherein connecting unit 120 is compliance, and it comprises a plurality of spring needles, and an end is connected in the signaling point of circuit board 110.

Substrate 130 is the plate that high rigidity nonconductive material such as ceramic substrate is done, is arranged to connect in the unit 120, and the substrate 130 inner signal lines that form, and to connect unit 120 be to be connected in substrate 130 and circuit board 110.As previously mentioned, connecting unit 120 be compliance, so connects first 120 compliant substrates and move with respect to circuit board or be out of shape and elastic deformation thereupon, keeps electrically conducting between substrate 130 and the circuit board 110.In addition, the end face of substrate 130 forms a plurality of contact mats 131, sees through connection unit 120 and electrically conducts with circuit board 110.

Please in conjunction with shown in reference Fig. 2 A, probe groups 140 has a probe station 141 and a plurality of probe 142, and probe station 141 comprises a stacked upper guide plate 143 and a bottom guide 144 mutually, and forms a chamber 145 between upper guide plate 143 and the bottom guide 144.Each probe 142 has an end of probe 146, a link 147 respectively, reaches a relay 148, and relay 148 is between end of probe 146 and link 147.Relay 148 is an elastically deformable, and is arranged in chamber 145.And end of probe 146 is to penetrate bottom guide 144, and link 147 is to penetrate upper guide plate 143, makes probe 142 by chamber 145, and the two side faces of penetration probe platform 141.The relay 148 of elastically deformable can compression when end of probe 146 and link 147 are squeezed, and changes probe 142 length.In addition, relay 148 can be limited to again in the chamber 145, for example makes the aperture of the diameter of relay 148 greater than the through hole of upper guide plate 143 and bottom guide 144, and probe 142 is fixed in probe station 140.

Please refer to shown in Fig. 2 B, be the probe 140 of another kind of form, the relay 148 of its middle probe 140 is to be the bent stick kenel, and end of probe 146 and link 147 are to stagger and be not positioned at online always, limitation relay 148 is fixed in probe station 140 with probe 142 in chamber 145.

Consult Figure 1A, Figure 1B again, reach shown in Fig. 1 C, probe station 141 is to place on the substrate 130, and upper guide plate 143 is towards substrate 130.The configuration of the link 147 of described probe 142, it is configuration corresponding to the contact mat 131 of substrate 130, when probe station 141 is placed on substrate 130, and after a contraposition program, the link 147 of each probe 142 is its pairing contact mat 131 of Elastic Contact respectively, make probe 142 see through substrate 130 and connection unit 120, and electrically conduct with circuit board 110.

Fixation kit 150 is in order to linking probe platform 141 and substrate 130, and stationary probe group 140 is in substrate 130.In present embodiment, fixation kit 150 is a bolt, pass the perforation of probe station 141, and lock in the screw of substrate 130 end faces, and linking probe group 140 and substrate 130, and force the end face of the bottom surface contact substrate 130 of probe groups 140.In addition, see through 150 pairs of probe groups 140 of fixation kit and position, the link 147 of probe 142 also can be aimed at its pairing contact mat 131, electrically conducts.

Fixation kit 150 is fixed in substrate 130 with probe station 141, and makes closely closing in substrate 130, thus substrate 130 orientation when changing, probe groups 140 orientation are changed thereupon, make probe 142 tips the depth of parallelism change.And during the alteration of form of substrate 130, the position of the contact mat 131 on the substrate 130 also can change thereupon, makes probe 142 ends also can change in the position of contact contact mat 131 thereupon, and then the flatness at probe 142 tips is changed.Under the perfect condition, probe 142 tips should be positioned at a reference plane jointly, so that chip to be measured is produced average contact pressure.Adjusting gear 160 is the opposite sides that are arranged at substrate 130, changes the shape or the orientation of substrate 130, and changes the position of adjusting probe 142 tips, can make probe 142 tips be positioned at reference plane jointly.

Adjusting gear 160 comprises a rigid strutting piece 161 and a plurality of isometric web member 162.Web member 162 is to pass rigid strutting piece 161, and an end is fixed in rigid strutting piece 161.The other end of web member 162 is to be connected in substrate 130 in modes such as welding or lockings, by grinding the surface of contact that this rigid strutting piece 161 contacts with web member 162, reach the flatness of adjustment substrate 130 and the effect in orientation, make the position change of probe 142 terminal contact substrates 130, and then influence the position of needle point 142.Similarly, between this rigid strutting piece 161 and interface that web member 162 contacts, place the different pad of thickness, also can reach identical effect.

The arrangement mode of the end of probe 146 of probe 142, be corresponding to chip to be measured signal feed-in point, feed out contact point (for example Luo Lu plain conductor or contact mat) a little.When probe station 140 is finished the location, and with the bottom guide 144 of probe station 140 after the chip closing, but the signal feed-in point of end of probe 146 contact chips of probe 142, feed out a little, and force relay 148 distortion to produce elastic forces, and make end of probe 146 with suitable pressure contact chip.Via circuit board 110 test signal is seen through the end of probe 146 that connects unit 120, substrate 130 and probe 142 and be sent to chip, produce feedback signal by chip again, be sent to circuit board 110 by end of probe 146 by substrate 130 and connection unit 120, arrive test machine at last, but judge whether normal operation of chip.Chip that can't normal operation will be marked as inefficacy, and cancel in follow-up electronic package processing procedure.

When probe 142 damages, do not need to change the whole probe card, only need to unload fixation kit 150, probe groups 140 is removed, the probe groups 140 that more renews, or carry out the replacing of indivedual probes 142 in the probe groups 140, put in back probe, can finish the maintenance update of probe.That is to say that for the user, its spare unit that only need lay in probe groups 140 or probe 142 just can carry out the maintenance of probe to change.Simultaneously, the replacing of probe groups 140 does not relate to tip-off or welding sequence, only is simple fixation kit 150 field-strips, does not relate to the deposit or the change of high price assemblies such as substrate 130 or probe yet.The maintenance update of the probe 142 of probe can be fully implemented with light instrument voluntarily by the user, delivers to the fabricator after not needing again to locate to wait for maintenance, reduces the cost of safeguarding probe effectively.

Consult shown in Fig. 3 A and Fig. 3 B, be the disclosed a kind of probe 200 of second embodiment of the invention, comprise a circuit board 210, and connect unit's 220, one substrate 230, a probe groups 240, at least one fixation kit 250, reach an adjusting gear 260.

Circuit board 210 provides the binding with test machine, connects the upper side that unit 220 is arranged at circuit board 210, and wherein connecting unit 220 is compliance, comprises to adjust matrix 221 and be arranged at the resilient contact 222 of adjusting matrix 221 two side faces.

Substrate 230 is the plate that high rigidity nonconductive material such as ceramic substrate is done, and is arranged to connect unit 220.Substrate 230 forms a plurality of signaling points towards a side of circuit board 210, and circuit board 210 also possesses corresponding signaling point.Adjust the resilient contact 222 difference Elastic Contact circuit boards 210 of matrix 221 two side faces and the signaling point of substrate 230, make substrate 230 see through connection unit 220 and be electrically connected at circuit board 210.In addition, the edge of substrate 230 forms unsettled and does not contact first connecting portion 232 of the resilient contact 222 that connects unit 220, and formation one gap between first connecting portion 232 and the circuit board 210.

Probe groups 240 has a probe station 241 and a plurality of probe 242, probe station 241 comprises a stacked upper guide plate 244 and bottom guide 243 mutually, each probe 242 is two side faces of penetration probe platform 241, makes its end of probe 246 and link 247 penetrate upper guide plate 243 and bottom guide 244 respectively.At least one side of probe station 241 forms outward extending second connecting portion 249, and when the upper guide plate 243 of probe station 241 was placed on the substrate 230, second connecting portion 249 was superimposed in first connecting portion 232.

Fixation kit 250 is that a button is held sheet, this button hold sheet have two the button hold the end 251, and hold between the end 251 in two buttons and to form a lateral openings 252, fixation kit 250 is the lateral edge by probe station 241 and substrate 230, with this lateral openings 252 clampings, first connecting portion 232 and second connecting portion 249.Two buttons are held end 251 and are held in the downside of first connecting portion 232 and the upper side of second connecting portion 249 respectively, first connecting portion 232 and second connecting portion, 249 buttons are held in together, and connect first connecting portion 232 and second connecting portion 249, probe station 241 is fixed in substrate 230, makes the corresponding contact mat 231 of probe 242 contacts.Fixation kit 250 can adopt easy instrument, and for example clamp removes, even utilizes hand to remove, and after fixation kit 250 was removed, probe station 241 just can take off from substrate 230, with probe station 241 or the probe 242 that more renews.

Adjusting gear 260 is the opposite sides that are arranged at substrate 230, changes the orientation of substrate 230, and probe groups 240 orientation are changed thereupon, make probe 242 tips the depth of parallelism change.And during the alteration of form of substrate 230, the position of the contact mat 231 on the substrate 230 also can change thereupon, makes probe 242 ends also can change in the position of contact contact mat 231 thereupon, and then the flatness at probe 142 tips is changed.

Adjusting gear 260 comprises a rigid strutting piece 261 and a plurality of isometric web member 262.Web member 262 is to pass rigid strutting piece 261, and an end is fixed in rigid strutting piece 261.The other end of web member 262 is to be connected in substrate 230, in order to adjust the shape of substrate 230, makes the position change of probe 242 terminal contact substrates 230, and then influences the position of needle point 242.Consult shown in Fig. 3 A and Fig. 3 B, the number of holding sheet as the button of fixation kit 250 can be one or more, is held in a side or a plurality of side of probe station 241.Or button is held sheet and also can be an annular component, holds the whole edge of probe station 241 around the ground button.

Consult shown in Figure 4ly, be the disclosed a kind of probe 300 of third embodiment of the invention, comprise a circuit board 310, and connect unit's 320, one substrate 330, a probe groups 340, at least one fixation kit 350, an and adjusting gear 360.

Circuit board 310 provides the binding with test machine, and connecting unit 320 is the upper sides that are arranged at circuit board 310, and wherein connecting unit 320 is compliance.Substrate 330 is the plate that high rigidity nonconductive material such as ceramic substrate is done, and is arranged to connect in the unit 220.Substrate 330 forms a plurality of signaling points towards a side of circuit board, and circuit board 310 also possesses corresponding number point.Connect unit's 320 signaling points, make substrate 330 see through connection unit 320 and be electrically connected at circuit board 310 in order to Elastic Contact circuit board 310 and substrate 330.

Probe groups 340 has a probe station 341 and a plurality of probe 342, and probe station 341 comprises a stacked upper guide plate 343 and a bottom guide 344 mutually, and probe 342 passes upper guide plate 343 and bottom guide 344, makes the two side faces of probe 342 penetration probe platforms 341.

Probe groups 340 is removably to place on the substrate 330, and the probe groups bottom surface is that closely closing is in substrate 330, probe station 341 is through behind the finder, the link 347 of each probe 342 can contact its pairing contact mat respectively, is electrically connected at circuit board 310 and make probe 342 see through substrate 330 and connect unit 320.In addition, the area of probe station 341 is the areas greater than substrate 330, forms the connecting portion 332 that protrudes in substrate 330 edges.

Fixation kit 350 comprises a bolt 351 and a locking block 352, and wherein, locking block 352 is to be fixed in circuit board 310 upper sides, and is positioned at the below of connecting portion 332.Bolt 351 is to pass probe station 341, and is locked on the locking block 352, linking probe platform 341 and circuit board 310, and stationary probe group 340 is in the end face of substrate 330.In addition, see through the combination of bolt 351 and locking block 352, also can position, make the link 347 of each probe 342 aim at and contact its pairing contact mat probe groups 340.

Adjusting gear 360 is the opposite sides that are arranged at substrate 330, in order to adjust the shape of substrate 330, makes the position change of probe 342 terminal contact substrates 330, and then influences the position of needle point 342, can make probe 342 most advanced and sophisticated coplines.

Consult shown in Fig. 5 A and Fig. 5 B, be the disclosed a kind of probe 400 of fourth embodiment of the invention, comprise a circuit board 410, and connect unit's 420, one substrate 430, a probe groups 440, at least one fixation kit 450, reach an adjusting gear 460.

Circuit board 410 provides the binding with test machine, and connecting unit 420 is the upper sides that are arranged at circuit board 410, and wherein connecting unit 420 is compliance, comprises a plurality of spring needles, and an end is connected in the signaling point of circuit board 410.

Substrate 430 is the plate that high rigidity nonconductive material such as ceramic substrate is done, and is arranged to connect in the unit 420, and connecting unit 420 is the signaling points that are connected in substrate 430 and circuit board 410, substrate 430 is seen through connect unit 420 to be electrically connected at circuit board 410.

Probe groups 440 has a probe station 441 and a plurality of probe 442, and probe station 441 comprises a mutually stacked upper guide plate 443 and a bottom guide 444, and probe 442 passes upper guide plate 443 and bottom guide 444 and the two side faces of penetration probe platform 441.

Probe station 441 is the end faces that place substrate 430, and upper guide plate 443 is that closing is in substrate 430, behind the probe station 441 process finders, the link 447 of each probe 442 can contact its pairing contact mat 431 respectively, is electrically connected at circuit board 410 and make probe 442 see through substrate 430 and connect unit 420.In addition, the edge of probe station 441 forms a connecting portion 449 that extends.

Fixation kit 450 comprises the pressing part 452 that a fixed part 451 and extends fixed part 451, and fixed part 451 is to be connected in circuit board 410 in modes such as welding, stickup or screw locks, and stands on the circuit board 410.And the height of pressing part 452 bottom surfaces is the height of end face that equal or be slightly less than the connecting portion 452 of probe station 441, suppresses securely in probe station 441 with pressing part 452, and fixes this probe station 441 on substrate 430.

Adjusting gear 460 is the opposite sides that are arranged at substrate 430, in order to adjust the shape of substrate 430, makes the position change of probe 442 terminal contact substrates 430, and then influences the position of needle point 442, can make probe 442 most advanced and sophisticated coplines.

Adjusting gear 460 comprises a rigid strutting piece 461 and a plurality of isometric web member 462.Rigid strutting piece 461 possesses the plane P that is provided with that forms once attrition process, and web member 462 is to pass rigid strutting piece 461, and an end is fixed in the plane P that is provided with of rigid strutting piece 461.Among aforementioned each embodiment, the two side faces of substrate all can be ground into the plane, therefore when isometric web member is connected in substrate, can forces substrate to be parallel to the plane is set.And in this embodiment, substrate 430 does not need the whole plane that grinds to form towards a side of adjusting gear 460, but forming a plurality of substrate fixed parts 432 corresponding to web member 462, the front end of each substrate fixed part 432 is by common processing grinding, and in the same plane.

Probe groups is connected in circuit board except seeing through fixation kit, and be fixed on the substrate outside, also can be directly connected in circuit board, and be fixed on the substrate.

Consult shown in Figure 6ly, be the disclosed a kind of probe 500 of fifth embodiment of the invention, comprise a circuit board 510, and connect unit's 520, one substrate 530, a probe groups 540, an and adjusting gear 560.

Connecting unit 520 is compliance, and it is by elastic conduction glue, and (AnisotropicConductive Film ACF) forms, and is connected in the signaling point of circuit board 510 as anisotropic conductive.

Substrate 530 is the plate that high rigidity nonconductive material such as ceramic substrate is done, is arranged to connect in the unit 520, and the substrate 530 inner signal lines that form, and to connect unit 520 be to be connected in substrate 530 and circuit board 510.As previously mentioned, connecting unit 520 be compliance, so connects first 520 compliant substrates and move with respect to circuit board 510 or be out of shape and elastic deformation thereupon, keeps electrically conducting between substrate 530 and the circuit board 510.

Probe groups 540 has a probe station 541 and a plurality of probe 542, and probe station 541 comprises a stacked upper guide plate 543 and a bottom guide 544 mutually, and described probe 542 is to pass upper guide plate 543 and bottom guide 544, and penetrates the two side faces of probe station 541.

Bottom guide 544 1 sides of probe station 541 form at least one fixed part 549, and are resisted against the side of upper guide plate 543.The front end of fixed part 549 is connected in circuit board 510 with stickup, welding or mode such as sealed, and stationary probe platform 541 makes the contact mat of probe 542 contact substrates 530 in the end face of substrate 530.

The inboard of fixed part 549 is resisted against the edge of substrate 530, slide and guiding probe station 541 towards substrate 530 closings.See through the guiding of fixed part 549, also can position, make each probe 542 aim at and contact the contact mat of its pairing substrate 530 probe station 541.

Adjusting gear 560 is the opposite sides that are arranged at substrate 530, in order to adjust the shape of substrate 530, makes the position change of probe 542 terminal contact substrates 530, and then influences the position of needle point 542, can make probe 542 most advanced and sophisticated coplines.

Consult shown in Figure 7ly, be the disclosed a kind of probe 600 of sixth embodiment of the invention, comprise a circuit board 610, and connect unit's 620, one substrate 630, a probe groups 640, an and adjusting gear 660.

What they were different with first preferred embodiment is, except comprising a rigid strutting piece 661 and a plurality of web member 662, more include a plurality of pads 670, wherein this each pad 670 is folded in 661 of circuit board 610 and rigid strutting pieces, be mainly used in and process the height of adjusting this pad 670, and then finely tune the shape of substrate 630, make the position change of probe 642 terminal contact substrates 630, and then influence the position of needle point 642, can make probe 642 most advanced and sophisticated coplines.

Inventive point of the present invention is, probe is to be arranged at probe station, and electrically connects with the mode and the substrate of Elastic Contact, rather than is directly welded in substrate, so the installation of probe and remove and do not need to use special welding or separate soldering equipment.The installation of probe or remove is to see through the stationary probe platform to reach in substrate or circuit board, so has reduced the cost of fund of probe spare unit.

Claims

1. probe is characterized in that comprising:

One circuit board;

The connection unit of one compliance is arranged at this circuit board;

One substrate sees through this connections unit and is electrically connected at this circuit board, and the end face of this substrate forms a plurality of contact mats, and wherein this connections unit complies with this substrate to reach with respect to this circuit board mobile and be out of shape and elastic deformation thereupon;

One probe groups possesses a probe station and a plurality of probe, and wherein said probe is the two side faces that passes this probe station, and this probe station is the end face that removably is fixed in this substrate, and making respectively, an end of this probe contacts respectively this contact mat respectively; And

One adjusting gear in order to the flatness that changes this substrate and orientation and adjust those probes, makes the tip of those probes be positioned at a reference plane jointly.

2. probe as claimed in claim 1 is characterized in that, this connection unit comprises a plurality of spring needles, connects this substrate and this circuit board respectively.

3. probe as claimed in claim 1 is characterized in that, this connection unit comprises the resilient contact adjusting matrix and be arranged at this adjustment matrix two side faces, and each resilient contact is this substrate of Elastic Contact and this circuit board.

4. probe as claimed in claim 1 is characterized in that, this connection unit is formed by elastic conduction glue.

5. probe as claimed in claim 4 is characterized in that, this elastic conduction glue is anisotropic conductive.

6. probe as claimed in claim 1 is characterized in that, this probe station comprises a stacked upper guide plate and a bottom guide mutually, and described probe is to pass this upper guide plate and this bottom guide.

7. probe as claimed in claim 6 is characterized in that, form a chamber between this upper guide plate and this bottom guide, and described probe is by this chamber.

8. probe as claimed in claim 7, it is characterized in that, respectively this probe has an end of probe, a link respectively, reaches a relay, this relay is between this end of probe and this link, wherein this end of probe be penetrate this bottom guide, this link be penetrate this upper guide plate, and this relay be to be arranged in this chamber.

9. probe as claimed in claim 8 is characterized in that, this relay is an elastically deformable.

10. probe as claimed in claim 1 is characterized in that, also comprises a fixation kit, connects this probe station and this ceramic substrate, and fixes the end face of this probe groups in this substrate.

11. probe as claimed in claim 10 is characterized in that, this fixation kit is to pass this probe station, and is fixed in this substrate with its front end.

12. probe as claimed in claim 11 is characterized in that, this fixation kit is a bolt, passes this probe station and is locked in this substrate.

13. probe as claimed in claim 10, it is characterized in that, at least one side of this probe station extends to form one first connecting portion, and at least one side of this ceramic substrate extends to form one second connecting portion, and this fixation kit is to connect this first connecting portion and this second connecting portion.

14. probe as claimed in claim 13, it is characterized in that this fixation kit is that a button is held sheet, has two buttons and holds end, this two button is held end and is detained respectively and hold this first connecting portion and this second connecting portion, makes this fixation kit connect this first connecting portion and this second connecting portion.

15. probe as claimed in claim 10 is characterized in that, this fixation kit comprises a bolt and a locking block, and this locking block is to be fixed in this circuit board, and this bolt is to pass this probe station and be locked on this locking block.

16. probe as claimed in claim 10 is characterized in that, this fixation kit comprises the pressing part that a fixed part and extends this fixed part, and this is connected in this circuit board, and this pressing part is suppressed in this probe station and fixed this probe station on this substrate.

17. probe as claimed in claim 10 is characterized in that, a side of this probe station extends to form at least one fixed part, is connected in this circuit board, to fix the end face of this probe station in this ceramic substrate.

18. probe as claimed in claim 1 is characterized in that, this adjusting gear comprises a rigid strutting piece and a plurality of isometric web member, and respectively an end of this web member is fixed on this rigid strutting piece, and the other end is to be connected in this substrate.

19. probe as claimed in claim 18 is characterized in that, respectively this web member is isometric screw, sees through screw-in version and is incorporated into this rigid strutting piece.

20. probe as claimed in claim 18, it is characterized in that, this substrate forms a plurality of substrate fixed parts corresponding to described web member towards a side of this adjusting gear, respectively the front end of this substrate fixed part is in the same plane, and respectively the other end of this web member is to be connected in this substrate fixed part.

21. probe as claimed in claim 18 is characterized in that, this adjusting gear more includes a plurality of pads, and wherein this each pad is folded between circuit board and rigid strutting piece.

22. a probe is characterized in that comprising:

One circuit board;

The connection unit of one compliance is arranged at this circuit board;

One adjusting gear comprises a rigid strutting piece and a plurality of web member, and respectively an end of this web member is fixed on this rigid strutting piece, and the other end is to be fixed in this substrate;

Adjust the interface that this rigid strutting piece contacts with this web member respectively, and then change the flatness of this substrate and orientation and adjust those probes, make the tip of those probes be positioned at a reference plane jointly.

23. probe as claimed in claim 22 is characterized in that, respectively this web member is a screw, sees through screw-in version and is incorporated into this rigid strutting piece.

24. probe as claimed in claim 22 is characterized in that, the interface that this rigid strutting piece contacts with this web member respectively can be for grinding.

25. probe as claimed in claim 22 is characterized in that, the interface that this rigid strutting piece contacts with this web member respectively can be provided with pad.