TWI400442B - A detection method for a detection device and a panel - Google Patents

A detection method for a detection device and a panel Download PDF

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Publication number
TWI400442B
TWI400442B TW98115569A TW98115569A TWI400442B TW I400442 B TWI400442 B TW I400442B TW 98115569 A TW98115569 A TW 98115569A TW 98115569 A TW98115569 A TW 98115569A TW I400442 B TWI400442 B TW I400442B
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Taiwan
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circuit board
test
test pads
positioning
panel
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TW98115569A
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Chinese (zh)
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TW201011288A (en
Inventor
An Ting Hsiao
Chien Wei Chiu
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Innolux Corp
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Priority to US12/551,204 priority Critical patent/US8400177B2/en
Publication of TW201011288A publication Critical patent/TW201011288A/en
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Publication of TWI400442B publication Critical patent/TWI400442B/en

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  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Description

一種檢測裝置及面板的檢測方法Detection device and panel detection method

本發明係有關於一種應用於面板的測試裝置,特別是有關於一種可以疊合接合的面板測試裝置。The present invention relates to a test device for use in a panel, and more particularly to a panel test device that can be overlapped and joined.

一般業界(顯示器模組供應商)所提供給系統廠(例如手機組裝商)之顯示器模組,通常都會以軟性電路板做為連接器,因此該系統廠則為配合的採用插槽以供軟性電路板插接。The display modules provided by the general industry (display module suppliers) to system manufacturers (such as mobile phone assemblers) usually use flexible circuit boards as connectors, so the system factory uses slots for softness. The board is plugged in.

然而,由於顯示器模組供應商在產品出廠前,會先於內部進行一連串的品質測試以確保產品(顯示器模組)的品質。在這一連串的品質測試中,均需要將顯示器模組與測試系統連接,而需多次進行拔插之動作。但因顯示器模組的軟性電路板與測試系統的拔插之動作,常因拔插施力不當,使得軟性電路板形變和電路損壞,進而造成顯示器模組的畫面顯示不正常。However, because the display module supplier will perform a series of quality tests before the product leaves the factory to ensure the quality of the product (display module). In this series of quality tests, it is necessary to connect the display module to the test system, and multiple insertions and removals are required. However, due to the improper insertion and removal of the flexible circuit board and the test system of the display module, the flexible circuit board is deformed and the circuit is damaged, which causes the display of the display module to be abnormal.

此外,另一種採用扎針結構做為連接器的測試系統,此種連接器會直接造成軟性電路板上的損傷,也會造成顯示器模組畫面的顯示不正常。In addition, another test system using a pinned structure as a connector, such a connector directly causes damage on the flexible circuit board, and also causes the display of the display module screen to be abnormal.

因此為了避免顯示器模組之軟性電路板因拔插次數過多而損壞,進而造成顯示器模組畫面顯示不正常之現象,爰是,本發明人基於產品不斷研究創新之理念,乃積極潛心研發思考,經過無數次之設計實驗,致有本發明案之產生,以降低顯示器模組之損壞率。Therefore, in order to avoid the damage of the flexible circuit board of the display module due to too many times of plugging and unplugging, and thus the display of the display of the display module is abnormal, the inventor actively researches and innovates based on the product, and actively concentrates on research and development. After numerous design experiments, the invention has been produced to reduce the damage rate of the display module.

以下僅藉由具體實施例,且佐以圖式作詳細之說明,俾使貴審查委員能對於本發明之各項功能、特點,有更進一步之了解與認識。The following is a detailed description of the present invention and the detailed description of the various features and features of the present invention.

根據本發明之第一方向,提出一種檢測裝置,用以檢測一面板。面板包括一第一電路板,其中第一電路板上包括數個接腳,其中測試裝置包括一第二電路板及壓合件。第二電路板包括一本體、數個測試墊、數個測試電路及數個導電元件。本體具有一第一表面及一第二表面。數個測試墊設置於第一表面上,且此些測試墊分別對應此些接腳設置。數個測試電路對應此些測試墊設置於第二表面上。數個導電元件貫穿設置於本體中,用以使此些測試電路與此些測試墊電性連接。壓合件對應此第二電路板之此些測試墊設置,用以使第一電路板及第二電路板疊合後緊密接合。當第一電路板疊合於第二電路板時,此些測試電路係經由此些導電元件、測試墊與此些接腳電性連接。According to a first aspect of the invention, a detection device is proposed for detecting a panel. The panel includes a first circuit board, wherein the first circuit board includes a plurality of pins, wherein the testing device includes a second circuit board and a pressing member. The second circuit board includes a body, a plurality of test pads, a plurality of test circuits, and a plurality of conductive elements. The body has a first surface and a second surface. A plurality of test pads are disposed on the first surface, and the test pads respectively correspond to the pin settings. A plurality of test circuits are disposed on the second surface corresponding to the test pads. A plurality of conductive elements are disposed through the body for electrically connecting the test circuits to the test pads. The pressing component is disposed corresponding to the test pads of the second circuit board for closely bonding the first circuit board and the second circuit board after being stacked. When the first circuit board is superposed on the second circuit board, the test circuits are electrically connected to the pins via the conductive elements and the test pads.

根據本發明之第二方向,提出一種面板的檢測方法。面板的檢測方法包括下列步驟。提供一面板,面板包括一第一電路板,且第一電路板包括複數個接腳;提供具有一第二電路板之一檢測裝置,且第二電路板,包括數個測試墊,其中此些測試墊係對應此些接腳設置;疊合第一電路板及第二電路板,以使此些測試墊與此些接腳電性連接;以及置放一壓合件於第一電路板及第二電路板之疊合處,以使第一電路板與第二電路板緊密接合。According to a second aspect of the present invention, a method of detecting a panel is proposed. The method of detecting the panel includes the following steps. Providing a panel, the panel includes a first circuit board, and the first circuit board includes a plurality of pins; a detecting device having a second circuit board is provided, and the second circuit board includes a plurality of test pads, wherein the The test pad corresponds to the pin settings; the first circuit board and the second circuit board are overlapped to electrically connect the test pads to the pins; and a pressing component is disposed on the first circuit board and The second circuit board is overlapped so that the first circuit board and the second circuit board are tightly coupled.

請參閱第1A圖及1B圖,第1A圖繪示本發明較佳實施例之測試裝置及面板上視圖,第1B圖繪示將第1A圖中測試裝置及面板疊合之上視圖。測試裝置200係用以測試一面板100,而面板100包括一第一電路板110,且第一電路板110上具有數個接腳(pin)112。本實施之測試裝置200包括一第二電路板210及一壓合件220(繪示於第1B圖中)。第二電路板210包括數個測試墊212,且此些測試墊212係分別對應第一電路板110的接腳112設置,其中當第一電路板110與第二電路板210疊合時,接腳112會與測試墊212電性耦接。於本實施例中,面板100的第一電路板110係為軟性電路板,且接腳112亦可為常見的金手指結構。本實施的測試裝置200係藉由第二電路板210與面板100的第一電路板110連接,以使面板100與測試裝置200電性連接以進行測試,進而使顯示螢幕120顯示測試結果。於本實施例中,於第一電路板110及第二電路板210疊合後,亦可以設置一壓合件220於第二電路板210上(如第1B圖),以使第一電路板110及第二電路板210疊合後緊密接合。1A and 1B, FIG. 1A is a top view of a test apparatus and a panel according to a preferred embodiment of the present invention, and FIG. 1B is a top view of the test apparatus and the panel stacked in FIG. 1A. The test device 200 is used to test a panel 100, and the panel 100 includes a first circuit board 110, and the first circuit board 110 has a plurality of pins 112 thereon. The testing device 200 of the present embodiment includes a second circuit board 210 and a pressing member 220 (shown in FIG. 1B). The second circuit board 210 includes a plurality of test pads 212, and the test pads 212 are respectively disposed corresponding to the pins 112 of the first circuit board 110, wherein when the first circuit board 110 and the second circuit board 210 are overlapped, The foot 112 is electrically coupled to the test pad 212. In this embodiment, the first circuit board 110 of the panel 100 is a flexible circuit board, and the pins 112 can also be a common gold finger structure. The test device 200 of the present embodiment is connected to the first circuit board 110 of the panel 100 by the second circuit board 210 to electrically connect the panel 100 to the test device 200 for testing, thereby causing the display screen 120 to display the test result. In this embodiment, after the first circuit board 110 and the second circuit board 210 are stacked, a pressing member 220 may be disposed on the second circuit board 210 (as shown in FIG. 1B) to make the first circuit board. 110 and the second circuit board 210 are closely joined after being stacked.

請再參照第1A圖,於此實施例中,測試墊212的形狀例如為圓形,且此些測試墊212的直徑w2略小於接腳112的寬度w1,以使測試墊212能完全與接腳112密合。比如說,當接腳112的寬度w1為0.33厘米(mm)時,測試墊212的寬度w2例如為0.3厘米(mm)。Referring to FIG. 1A again, in this embodiment, the shape of the test pad 212 is, for example, a circle, and the diameter w2 of the test pads 212 is slightly smaller than the width w1 of the pin 112, so that the test pad 212 can be completely connected. The foot 112 is in close contact. For example, when the width w1 of the pin 112 is 0.33 centimeters (mm), the width w2 of the test pad 212 is, for example, 0.3 centimeters (mm).

接著,請參照第1B及1C圖,第1C圖繪示依照第1B圖中剖面線1C-1C的剖面圖。於本實施例中,壓合件220較佳的可以活動式的方式設置,並且對應設置於測試墊212上。如此一來,便能藉由壓合件220的重量增加接腳112與測試墊212的之間緊密度,而使第一電路板110可與第二電路板210疊合後緊密接合。Next, please refer to FIGS. 1B and 1C, and FIG. 1C is a cross-sectional view taken along line 1C-1C of FIG. 1B. In this embodiment, the pressing member 220 is preferably disposed in a movable manner and correspondingly disposed on the test pad 212. In this way, the tightness between the pin 112 and the test pad 212 can be increased by the weight of the pressing member 220, so that the first circuit board 110 can be closely engaged with the second circuit board 210.

請參照第1C圖,本實施例中第二電路板210包括一本體202、數個測試墊212、數個測試電路216、數個導電元件218。本體202具有一第一表面214、第二表面215。前述的測試墊212係設置於第一表面214上。複數個電路216係設置於第二表面215上,此些測試電路216係與測試裝置200的測試系統(未繪示)連接,用以傳遞測試系統的測試訊號。再者,再藉由導電元件218貫穿設置於本體202中,使此些測試電路216與對應的測試墊212電性連接。如此一來,由測試系統傳出的測試訊號便能經由測試電路216、導電元件218、測試墊212、接腳112傳遞到面板100。於本實施例中,導電元件218例如可為金屬導線、導電塊或其他可用於導電的元件。另外,本實例所採用環狀的測試墊212,在實施情況下,當然亦可為其他形狀,如圓形或方形。Referring to FIG. 1C , the second circuit board 210 includes a body 202 , a plurality of test pads 212 , a plurality of test circuits 216 , and a plurality of conductive elements 218 . The body 202 has a first surface 214 and a second surface 215. The aforementioned test pad 212 is disposed on the first surface 214. A plurality of circuits 216 are disposed on the second surface 215. The test circuits 216 are connected to a test system (not shown) of the test device 200 for transmitting test signals of the test system. Moreover, the test circuit 216 is electrically connected to the corresponding test pad 212 by the conductive element 218 being disposed in the body 202. In this way, the test signal transmitted by the test system can be transmitted to the panel 100 via the test circuit 216, the conductive element 218, the test pad 212, and the pin 112. In this embodiment, the conductive element 218 can be, for example, a metal wire, a conductive block, or other component that can be used for electrical conduction. In addition, the annular test pad 212 used in the present example may, of course, be of other shapes, such as a circle or a square.

接著,請參照第2圖,其繪示將第1A圖中第二電路板置放於固定元件的上視圖。於本實施例中,測試裝置200較佳地更包括一固定元件230,用以固定第二電路板210,以利測試的進行。這是由於,在實際的操作上,測試人員會測試成千上萬片的面板,因此將第二電路板210固定於固定元件230後,測試人員僅需替換第一電路板110(未繪示),如此可大量減少測試人員的工作。Next, please refer to FIG. 2, which is a top view showing the second circuit board in FIG. 1A placed on the fixing member. In the present embodiment, the testing device 200 preferably further includes a fixing component 230 for fixing the second circuit board 210 for testing. This is because, in actual operation, the tester will test thousands of panels, so after the second circuit board 210 is fixed to the fixing component 230, the tester only needs to replace the first circuit board 110 (not shown) ), this can greatly reduce the work of testers.

於本實施例中,固定元件230較佳地包括一平板232、一定位板234、一第一定位柱236、一第二定位柱238。平板232具有一凹槽232a,此凹槽232a係用以置放第二電路板210及第一電路板110(請參照第3圖),其中凹槽232a係對應疊合後的第一電路板110及第二電路板210之形狀設置,以使疊合後的第一電路板110及第二電路板210能緊密置放於凹槽232a中。如此一來,便能避免第一電路板110及第二電路板210在凹槽232a中搖晃。In this embodiment, the fixing component 230 preferably includes a flat plate 232, a positioning plate 234, a first positioning post 236, and a second positioning post 238. The flat plate 232 has a recess 232a for accommodating the second circuit board 210 and the first circuit board 110 (refer to FIG. 3), wherein the recess 232a corresponds to the stacked first circuit board. The 110 and the second circuit board 210 are shaped such that the stacked first circuit board 110 and the second circuit board 210 can be closely placed in the recess 232a. In this way, the first circuit board 110 and the second circuit board 210 can be prevented from being shaken in the recess 232a.

於本實施例中,第一定位柱236例如為2個,設置於平板232的凹槽232a中。此外,第二電路板210係對應此些第一定位柱236具有兩個第一定位孔210a(亦可同時參照第1A圖)。如此一來,當第二電路板210經由第一定位孔210a套接於第一定位柱236上時,第二電路板210便能固定於平板232的凹槽232a中,以避免第二電路板210於XY方向移動。另外,定位板234係用以固定已置放於凹槽232a中之第二電路板210,其可以藉由螺絲234a鎖固於平板232上。特別的是,當定位板234固定第二電路板210後,此定位板234會恰巧裸露出第二電路板210的測試墊212。In the present embodiment, the first positioning posts 236 are, for example, two, disposed in the recess 232a of the flat plate 232. In addition, the second circuit board 210 has two first positioning holes 210a corresponding to the first positioning posts 236 (may also refer to FIG. 1A). In this way, when the second circuit board 210 is sleeved on the first positioning post 236 via the first positioning hole 210a, the second circuit board 210 can be fixed in the recess 232a of the flat plate 232 to avoid the second circuit board. 210 moves in the XY direction. In addition, the positioning plate 234 is used to fix the second circuit board 210 that has been placed in the recess 232a, and can be locked to the flat plate 232 by screws 234a. In particular, when the positioning board 234 fixes the second circuit board 210, the positioning board 234 happens to expose the test pad 212 of the second circuit board 210.

接著,請參照第3圖,繪示置放第一電路板於第2圖之第二電路板之上視圖。於本實施例中,固定元件230更包括二第二定位柱238,設置於凹槽232a中。第二定位柱238係分別對應設置於第二電路板210之一測試墊212之兩側(如第2圖所示),以使第一電路板110置放於凹槽232a中時,此些第二定位柱238會位於第一電路板110的兩側。Next, please refer to FIG. 3, which shows a view of placing the first circuit board on the second circuit board of FIG. 2. In this embodiment, the fixing component 230 further includes two second positioning posts 238 disposed in the recess 232a. The second positioning posts 238 are respectively disposed on opposite sides of one of the test pads 212 of the second circuit board 210 (as shown in FIG. 2), so that when the first circuit board 110 is placed in the recess 232a, The second positioning posts 238 are located on both sides of the first circuit board 110.

另外,由於定位板234的位置會恰巧使第二電路板210裸露出測試墊212(如第3圖),因此當第一電路板110的頂端抵觸到定位板234時,第一電路板110的接腳112(因位於另一面,並不會顯示於第3圖中)便會與第二電路板210的測試墊212疊合。此外,再藉由第二定位柱238的輔助,調整第一電路板110位於第二定位柱238之間。因此,測試人員只要先將第一電路板110置放於凹槽232a中,將第一電路板110推到抵觸到定位板234且位於兩個第二定位柱238間,便可使第一電路板110於X方向及Y方向同時定位。接著,再藉由壓合件220(未繪示於第3圖中)使第一電路板110及第二電路板210緊密接合,即可使接腳112及測試墊212電性耦接。In addition, since the position of the positioning plate 234 happens to expose the second circuit board 210 to the test pad 212 (as shown in FIG. 3), when the top end of the first circuit board 110 abuts the positioning plate 234, the first circuit board 110 The pin 112 (which is not shown in FIG. 3 because it is on the other side) overlaps the test pad 212 of the second circuit board 210. In addition, the first circuit board 110 is disposed between the second positioning posts 238 by the assistance of the second positioning post 238. Therefore, the tester only needs to place the first circuit board 110 in the recess 232a, push the first circuit board 110 against the positioning board 234 and between the two second positioning posts 238, so that the first circuit can be made. The plate 110 is simultaneously positioned in the X direction and the Y direction. Then, the first circuit board 110 and the second circuit board 210 are tightly coupled by the pressing member 220 (not shown in FIG. 3), so that the pin 112 and the test pad 212 are electrically coupled.

另外,由於接腳112及測試墊212係採用接觸的方式電性連接,所以在替換面板100測試時,僅需移走面板100,不需插拔。因此,藉由本實施例的測試裝置200進行面板100的測試,可避免因測試多次而造成第一電路板110的毀壞,降低面板100損壞率。In addition, since the pin 112 and the test pad 212 are electrically connected by contact, when the replacement panel 100 is tested, only the panel 100 needs to be removed, and no plugging or unplugging is required. Therefore, by testing the panel 100 by the testing device 200 of the embodiment, the destruction of the first circuit board 110 caused by the test multiple times can be avoided, and the damage rate of the panel 100 can be reduced.

綜合以上所述,本發明之應用於面板之測試裝置,可藉由藉由測試裝置的測試墊直接與面板的接腳接觸耦接,直接進行測試,不需插拔。如此一來,即可有效降低在測試中因多次插拔的面板毀壞率,降低成本。In summary, the test device applied to the panel of the present invention can be directly tested by directly contacting the test pad of the test device with the pin of the panel, without the need for plugging and unplugging. In this way, the panel destruction rate due to multiple insertions and removals in the test can be effectively reduced, and the cost can be reduced.

以上為本案所舉之實施例,僅為便於說明而設,當不能以此限制本案之意義,即大凡依所列申請專利範圍所為之各種變換設計,均應包含在本案之專利範圍中。The above embodiments of the present invention are provided for convenience of explanation only. When the meaning of the case cannot be limited, the various transformation designs according to the scope of the listed patent application should be included in the patent scope of the present application.

w1,w2...寬度W1, w2. . . width

100...面板100. . . panel

110...第一電路板110. . . First board

112...接腳112. . . Pin

120...顯示螢幕120. . . Display screen

200...測試裝置200. . . Test device

202...本體202. . . Ontology

210...第二電路板210. . . Second circuit board

210a...第一定位孔210a. . . First positioning hole

212...測試墊212. . . Test pad

214...第一表面214. . . First surface

215...第二表面215. . . Second surface

216...測試電路216. . . Test circuit

218...導電元件218. . . Conductive component

220...壓合件220. . . Press fit

230...固定元件230. . . Fixed component

232...平板232. . . flat

232a...凹槽232a. . . Groove

234...定位板234. . . Positioning plate

234a...螺絲234a. . . Screw

236...第一定位柱236. . . First positioning column

238...第二定位柱238. . . Second positioning column

第1A圖繪示本發明較佳實施例之測試裝置及面板上視圖;1A is a top view of a test device and a panel according to a preferred embodiment of the present invention;

第1B圖繪示將第1A圖中測試裝置及面板疊合之上視圖;FIG. 1B is a top view showing the test apparatus and the panel in FIG. 1A;

第1C圖繪示依照第1B圖中剖面線1C-1C的剖面圖;Figure 1C is a cross-sectional view taken along line 1C-1C of Figure 1B;

第2圖繪示將第1A圖中第二電路板置放於固定元件的上視圖;以及2 is a top view showing the second circuit board in FIG. 1A placed on the fixing member;

第3圖繪示置放第一電路板於第2圖之第二電路板之上視圖。Figure 3 is a view showing the top view of the first circuit board placed on the second circuit board of Figure 2.

100...面板100. . . panel

110...第一電路板110. . . First board

112...接腳112. . . Pin

202...本體202. . . Ontology

210...第二電路板210. . . Second circuit board

212...測試墊212. . . Test pad

214...第一表面214. . . First surface

215...第二表面215. . . Second surface

216...測試電路216. . . Test circuit

218...導電元件218. . . Conductive component

220...壓合件220. . . Press fit

Claims (7)

一種檢測裝置,係用以檢測一面板,該面板包括一第一電路板,其中該第一電路板上包括複數個接腳,其中該測試裝置包括:一第二電路板,包括:一本體,具有一第一表面及一第二表面;複數個測試墊,設置於該第一表面上,且該些測試墊分別對應該些接腳設置;複數個測試電路,對應該些測試墊設置於該第二表面上;複數個導電元件,貫穿設置於該本體中,用以使該些測試電路與該些測試墊電性連接,當該第一電路板疊合於該第二電路板時,該些測試電路係經由該些導電元件、測試墊與該些接腳電性連接;以及至少一第一定位孔,設置於該本體上;一固定元件,用以固定該第二電路板;以及一壓合件,對應該第二電路板之該些測試墊設置,用以使該第一電路板及該第二電路板疊合後緊密接合;其中,該固定元件包括:一平板,具有一凹槽,該凹槽係用以置放該第二電路板及該第一電路板,其中該凹槽係對應疊合後的該第一電路板及該第二電路板之形狀設置,以使疊合後的該第一電路板及該第二電路板能置放於該凹槽中;以及至少一第一定位柱,設置於該平板的該凹槽中,對應該第一定位孔藉此使該第二電路板經由該第一定位孔套接於該第一定位柱而固定於該凹槽中。 A detecting device for detecting a panel, the panel comprising a first circuit board, wherein the first circuit board comprises a plurality of pins, wherein the testing device comprises: a second circuit board comprising: a body Having a first surface and a second surface; a plurality of test pads are disposed on the first surface, and the test pads are respectively disposed corresponding to the plurality of pins; and the plurality of test circuits are disposed corresponding to the test pads On the second surface, a plurality of conductive elements are disposed in the body for electrically connecting the test circuits to the test pads. When the first circuit board is overlapped with the second circuit board, the The test circuit is electrically connected to the pins via the conductive elements and the test pads; and at least one first positioning hole is disposed on the body; a fixing component is configured to fix the second circuit board; and a pressing member disposed corresponding to the test pads of the second circuit board for closely bonding the first circuit board and the second circuit board; wherein the fixing component comprises: a flat plate having a concave shape Slot, the a slot for arranging the second circuit board and the first circuit board, wherein the recess is corresponding to the shape of the stacked first circuit board and the second circuit board, so that the stacked The first circuit board and the second circuit board can be placed in the recess; and at least one first positioning post is disposed in the recess of the flat plate, corresponding to the first positioning hole, thereby making the second circuit The plate is fixed in the groove by being sleeved to the first positioning post via the first positioning hole. 如申請專利範圍第1項所述之測試裝置,其中該固定元件更包括:一定位板,用以固定已置放於該凹槽中之該第二電路板,其中當該第一電路板抵觸到該定位板時,該第一電路板之該些接腳會與該第二電路板的該些測試墊疊合。 The test device of claim 1, wherein the fixing component further comprises: a positioning plate for fixing the second circuit board that has been placed in the recess, wherein the first circuit board is in conflict When the positioning plate is reached, the pins of the first circuit board overlap with the test pads of the second circuit board. 如申請專利範圍第1項所述之測試裝置,且該固定元件更包括:二第二定位柱,分別對應已置放於凹槽中之該第二電路板之該些測試墊之兩側設置於該凹槽中,以使該第一電路板置放於該凹槽中時,該些第二定位柱係位於該第一電路板的兩側。 The test device of claim 1, wherein the fixing component further comprises: two second positioning posts respectively disposed on opposite sides of the test pads of the second circuit board that have been placed in the recesses In the recess, when the first circuit board is placed in the recess, the second positioning posts are located on two sides of the first circuit board. 如申請專利範圍第1項所述之測試裝置,其中該些測試墊之形狀係為環形。 The test device of claim 1, wherein the test pads are in the shape of a ring. 如申請專利範圍第4項所述之測試裝置,其中該些測試墊的直徑係小於該接腳之寬度。 The test device of claim 4, wherein the test pads have a diameter smaller than a width of the pin. 一種面板的檢測方法,包括:提供一面板,該面板包括一第一電路板,且該第一電路板包括複數個接腳;提供具有一第二電路板之一檢測裝置,且該第二電路板,包括複數個測試墊,其中該些測試墊係對應該些接腳設置;提供一固定元件,且該固定元件包括一具有一凹槽之一平板;經由該第二電路板上的至少一第一定位孔套接該第二電路板於該固定元件之一第一定位柱上;設置一定位板於該第二電路板上,用以使該第二電路板固定於該凹槽中,並且使該第二電路板之該些測試墊裸露;疊合該第一電路板及該第二電路板,以使該些測試墊與該些 接腳電性連接;以及置放一壓合件於該第一電路板及該第二電路板之疊合處,以使該第一電路板與該第二電路板緊密接合。 A method for detecting a panel, comprising: providing a panel, the panel comprising a first circuit board, and the first circuit board includes a plurality of pins; providing a detecting device having a second circuit board, and the second circuit The board includes a plurality of test pads, wherein the test pads are disposed corresponding to the pins; a fixing component is provided, and the fixing component comprises a flat plate having a groove; and at least one via the second circuit board a first positioning hole sleeves the second circuit board on the first positioning post of the fixing component; a positioning plate is disposed on the second circuit board for fixing the second circuit board in the recess And exposing the test pads of the second circuit board; stacking the first circuit board and the second circuit board to make the test pads and the And electrically connecting the pin; and placing a pressing member on the overlapping of the first circuit board and the second circuit board to tightly engage the first circuit board and the second circuit board. 如申請專利範圍第6項所述檢測方法,該固定元件包括複數個第二定位柱,其中置放該第一電路板之步驟包括:調整該第一電路板,以使該第一電路板位於該些第二定位柱之間。 The detecting method of claim 6, wherein the fixing component comprises a plurality of second positioning posts, wherein the step of placing the first circuit board comprises: adjusting the first circuit board such that the first circuit board is located Between the second positioning posts.
TW98115569A 2008-09-01 2009-05-11 A detection method for a detection device and a panel TWI400442B (en)

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