TWI743878B - Electrical testing device - Google Patents

Abstract

An electrical testing device is suitable for testing a component to be tested, and includes a circuit board, at least one conduction module used to electrically connect with the circuit board and the component to be tested to perform testing, and a device arranged on the circuit board And it is suitable for the alignment frame for the positioning of the component under test, a plurality of bonding boards interposed between the circuit board and the alignment frame so that the circuit board and the alignment frame are spaced apart by a margin to be positioned mutually, and a The pressure module connected to the alignment frame. The alignment frame surrounds and defines an inner space, and the pressurizing module is adapted to apply an external force to the device under test placed in the inner space, so that the at least one conduction module and the device under test are properly electrically connected. Under the condition that a proper distance is maintained between the component under test, the at least one conduction module, and the circuit board, the electrical test is stably performed.

Description

Electrical testing device

The invention relates to a testing device, in particular to an electrical testing device.

Referring to FIG. 1, it is an existing electrical testing device 1, which is suitable for testing a component under test 2, and includes a bottom board 11, a system circuit board 12 disposed on the bottom board 11 and used for driving and testing, and an electrical connection An intermediate conductive module 13 between the system circuit board 12 and the component under test 2 is suitable for positioning the component under test 2 and used to align the component under test 2 and electrically connected to the intermediate conductive module 13 Positional alignment frame 14, a cover plate 15 that is arranged on the alignment frame 14 and used to apply force to make the device under test 2 contact the intermediate conductive module 13, and a cover plate 15 used to fix each Positioning unit 19 for the relative position of the components.

In order to ensure that the electrical test can be executed normally, it is necessary to first confirm that each contact on the component under test 2 actually touches the corresponding position of the intermediate conductive module 13 and also enables the intermediate conductive module 13 to communicate with the intermediate conductive module 13 The system circuit board 12 is indeed connected. Therefore, the system circuit board 12, the alignment frame 14, the cover plate 15, and even the intermediary conductive module 13 are provided with a plurality of through-shaped positioning holes 160 for alignment, and in order to make Each layer of the structure can be reliably positioned and fixed. The bottom plate 11, the system circuit board 12, the intermediate conductive module 13, the alignment frame 14, and the cover plate 15 are all penetrated with through holes 170. The positioning unit 19 includes a plurality of positioning posts 191 protruding from the bottom plate 11 and a plurality of locking members 192. When performing a test, as long as the positioning posts 191 pass through the positioning holes 160 respectively, and then the locking members 192 are passed through the through holes 170 respectively to be secured by a locking mechanism, the to-be-tested can be ensured The component 2, the intermediate conductive module 13, and the system circuit board 12 are electrically connected in the correct position, so that the electrical test can be performed correctly.

In the current situation where the circuit design requirements for electronic components are becoming more and more sophisticated, the circuit types of the device under test 2 that perform the test are usually quite dense, complex, and diverse, and correspond to the circuits of the system circuit board 12 that perform the electrical test. Naturally, we need to actually respond. However, the alignment method adopted by the electrical testing device 1 requires a plurality of positioning holes 160 and perforations 170 to be drilled on the system circuit board 12, and the positioning holes 160 and the The distribution position of the perforation 170 will inevitably affect the circuit layout of the circuit board 12 of the system, and thus limit the electrical test.

Therefore, the purpose of the present invention is to provide an electrical testing device that uses an alignment mechanism that does not limit the circuit layout, and thus can optimize electrical testing.

Therefore, the electrical testing device of the present invention is suitable for testing a component under test, and includes a circuit board, and at least one conduction mode for forming electrical connections with the circuit board and the component under test to perform testing on the component under test Group, an alignment frame arranged on the circuit board and suitable for positioning the component to be tested, and a plurality of alignment frames between the circuit board and the alignment frame so that the circuit board and the alignment frame are separated by a margin Combining plates positioned at a distance from each other, and a pressurizing module detachably connected to the alignment frame.

The alignment frame surrounds and defines an inner space for positioning the at least one conduction module, and the pressurizing module is adapted to apply an external force toward the at least one conduction module to the component under test placed in the inner space, The at least one conduction module is properly electrically connected to the component under test.

The effect of the present invention is that the alignment and fixing of the alignment frame and the circuit board are achieved by the bonding plates, compared with the perforation method, the circuit layout of the circuit board is less restricted, and the circuit layout can be The circuit board is separated from the alignment frame by a margin, so that when the at least one conductive die is assembled and arranged in the inner space defined by the alignment frame, it can be electrically connected to the circuit board at a proper distance to match the With the aid of the alignment frame, under the condition that the component under test can also be stably electrically connected with at least one conduction module, the performance of the electrical test can indeed be optimized.

2 and 3, it is an embodiment of the electrical testing device of the present invention. This embodiment is suitable for testing a device under test 9 and includes a circuit board 3 for driving electrical testing, and two circuit boards 3 for driving electrical testing. The circuit board 3 and the component under test 9 form an electrical connection to perform a test on the component under test 9 and a conduction module 4 is arranged on the circuit board 3 and is suitable for positioning the component under test 9 as a positioning frame 5 8. Eight bonding boards 6 positioned between the circuit board 3 and the alignment frame 5, and a pressurizing module 7 detachably connected to the alignment frame 5.

It should be explained first that in this embodiment, two conduction modules 4 are used as an example, and the number of conduction modules 4 is not limited to two. Each conduction module 4 is pre-modularly assembled to form an appropriate circuit form that matches the component under test 9. When the electrical test is actually performed, it can be adjusted according to the test requirements and the circuit of the component under test 9. , Not limited to what is presented in the diagram.

The alignment frame 5 surrounds and defines an inner space 510 for positioning the conduction modules 4, and includes a frame 51 that defines the inner space 510, and a plurality of protruding portions on the frame 51 and surrounding and defining A bump 52 suitable for the placement space 520 for positioning the component 9 under test. Wherein, the frame body 51 has a plurality of through-shaped alignment holes 519, and two extend a distance from opposite sides to the inner space 510 in a direction toward each other, and are suitable for supporting the to-be-measured placed in the placing space 520 The support portion 511 of the element 9.

2 to 4, four of the eight bonding boards 6 are evenly distributed and fixed to the four corners of the circuit board 3, and the other four are fixed to the alignment frame in alignment with each other The four corresponding corners of 5 are fixed to the connecting boards 6 fixed on the circuit board 3 to each other. Specifically, in this embodiment, the circuit board 3 and the alignment frame 5 are pre-installed with the coupling plates 6, and then the coupling plates 6 are fixed to each other in a "face-to-face" manner through the alignment relationship of the coupling plates 6. . Among them, the bonding plates 6 that are aligned with each other can preferably be joined in a manner that does not affect electrical conduction, such as gluing, welding, etc., but it is not limited to this.

As shown in FIG. 4, since each coupling board 6 has a certain thickness, the circuit board 3 and the alignment frame 5 will be separated by a margin D1 from each other due to the thickness of the coupling board 6 overlapped. In addition, because the circuit board 3 does not need to be pierced with holes for positioning, the circuit board 3 can be relatively equipped with a variety of circuit types without restriction, which is beneficial to respond to more diverse types of electrical properties. Test requirements. Among them, the bonding boards 6 and the circuit board 3 can preferably be joined by means of gluing, welding, etc. that do not affect electrical conduction, but it is not limited to this.

It should be particularly noted that in this embodiment, the circuit board 3 and the alignment frame 5, which are roughly rectangular, are matched so that the bonding boards 6 are evenly distributed in the four corners. If the circuit board of other shapes is used The board 3 and the alignment frame 5 can also appropriately change the distribution position or the number of the combined boards 6, as long as the circuit board 3 and the alignment frame 5 can be aligned with each other by means of "face-to-face bonding". It is enough to be fixed and make a proper distance between the two, which is not limited to this embodiment.

Continuing to refer to FIGS. 2 to 4, the pressing module 7 includes a pressing plate 70 having a plurality of through holes 700, a plurality of first coupling members 71 arranged on the alignment frame 5, and a plurality of The second coupling member 72 is respectively penetrated through the through holes 700 to be combined with the first coupling members 71 so that the pressing plate 70 applies an external force to the device under test 9. The pressurizing module 7 is adapted to apply an external force toward the conduction modules 4 to the component under test 9 placed in the inner space 510, so that the conduction modules 4 and the component under test 9 are properly electrically connected. Wherein, each first coupling member 71 has an inner screw wall 711 surrounding and defining a screwing groove 710, an outer wall surface 712 opposite to the inner screw wall 711, and a connection between the inner screw wall 711 and the outer wall 711 The wall surface 712 is far away from the abutting surface 713 at one end of the alignment frame 5. Each second coupling member 72 has a screw portion 721 for screwing on the inner screw wall 711, and a screw portion 721 connected to the screw portion 721.头722.

When the alignment frame 5 and the circuit board 3 are mutually positioned through the bonding boards 6, in addition to avoiding holes in the circuit board 3 from affecting the circuit layout, the thickness of the bonding boards 6 is formed by the The margin D1 can also match the length, shape, expected deformation and other parameters of the electrical pins 41 of the conductive modules 4 when the conductive modules 4 are arranged in the space 510 of the alignment frame 5. Ensure that the conduction modules 4 are correctly connected to the circuit board 3 in the expected electrical connection manner. Especially when pressure is applied through the pressurizing module 7, the alignment frame 5 and the circuit board 3 can also be supported by the bonding plates 6 to stably maintain a certain margin distance D1, avoiding the conduction modules 4 The deformation of the electrical pins 41 beyond expectations can not only reduce the probability of damage to the conduction modules 4, but also prevent short circuits between the electrical pins 41, thereby improving the performance of the electrical test.

Referring to FIG. 5, when the test has not been performed, an auxiliary cover 8 can be used to protect the conduction modules 4. The auxiliary cover 8 includes a cover plate 81, a plurality of alignment posts 82 from the cover plate 81 toward the alignment frame 5 and corresponding to the alignment holes 519, and two spaced apart from the cover plate 81 and the pairs Corresponding blocks 83 extending in the same direction as the quasi-post 82. When the auxiliary cover 8 is combined with the alignment frame 5, it can be accurately aligned through the relative positions of the alignment posts 82 and the alignment holes 519. At this time, the positions of the corresponding blocks 83 will also be aligned respectively. Should wait for module 4 to be turned on. When the test has not been performed, the corresponding blocks 83 can shield the conduction modules 4 to avoid contamination by foreign objects which may affect the test performance.

3, 4, and 6, when the component under test 9 is placed in the placement space 520, the component under test 9 will be supported by the supporting portions 511 of the frame 51 of the alignment frame 5. This restricts the degree of movement of the device under test 9 toward the conduction modules 4. When an electrical test is performed and external force is provided by the pressurizing module 7, the screw portions 721 of the second coupling members 72 are gradually screwed into the screw grooves 710 of the first coupling members 71, respectively. , The screw heads 722 will gradually move toward the pressing plate 70 until the pressing plate 70 contacts the abutting surfaces 713 of the first coupling members 71. At this time, the pressure plate 70 will be separated from the alignment frame 5 by a predetermined distance D2 due to the thickness of the first coupling members 71 as shown in FIG. 6, to ensure that the pressure plate 70 is at an appropriate distance Applying pressure to the device under test 9 can avoid applying excessive pressure on the device under test 9 to prevent the device under test 9 from being damaged or causing a short circuit, and to ensure that the device under test 9 is connected to the conduction modules 4Connect correctly.

To sum up, the electrical testing device of the present invention can achieve alignment by the "face-to-face" bonding of the bonding boards 6, avoiding perforations on the circuit board 3 and restricting the layout of the circuit. A marginal distance is maintained between the alignment frame 5 and the circuit board 3 to ensure that the circuit board 3, the conduction modules 4, and the component under test 9 can maintain a proper distance during the test, and form each other. The correct electrical connection can effectively improve the performance of the electrical test, so it can indeed achieve the purpose of the invention.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.

3: circuit board

4: Conduction module

41: Electrical pin

5: alignment frame

51: Frame

510: inner space

511: Support

519: Alignment Hole

52: bump

520: place space

6: Combination board

7: Pressure module

70: pressure plate

700: Through hole

71: The first combination

710: Screw Groove

711: Inner Screw Wall

712: Outer Wall

713: top

72: The second combination

721: Screw part

722: Screw Head

8: auxiliary cover

81: cover

82: Alignment Column

83: Corresponding block

9: component under test

D1: margin distance

D2: reserved distance

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Figure 1 is a three-dimensional exploded view illustrating an existing electrical testing device; Figure 2 is a three-dimensional exploded view illustrating an embodiment of the electrical testing device of the present invention; Figure 3 is a three-dimensional exploded view illustrating a situation in which the two conduction modules of this embodiment are installed in a pair of frames; Figure 4 is a side view illustrating the effects of the multiple bonding plates of this embodiment; Figure 5 is a three-dimensional exploded view illustrating the use of an auxiliary cover to protect the conduction modules; and Fig. 6 is a side view illustrating the implementation of the electrical test after the assembly is completed using this embodiment.

3: circuit board

4: Conduction module

5: alignment frame

51: Frame

510: inner space

52: bump

520: place space

6: Combination board

7: Pressure module

70: pressure plate

700: Through hole

71: The first combination

710: Screw Groove

72: The second combination

Claims (5)

An electrical testing device is suitable for detecting a component under test, and includes: a circuit board; at least one conduction module for forming electrical connection with the circuit board and the component under test to perform testing on the component under test; A pair of positioning frames are arranged on the circuit board and are suitable for positioning the component to be tested, and surround and define an inner space for positioning the at least one conduction module; a plurality of bonding boards are located between the circuit board and the Between the alignment frames, the circuit board and the alignment frame are positioned with a marginal distance between them. A part of the combination boards are fixed to the circuit board evenly, and the other part is fixed to the circuit board in alignment with each other. The alignment frame is fixed to the bonding boards fixed on the circuit board; and a pressurizing module is detachably connected to the alignment frame and is suitable for aligning the component under test placed in the inner space Applying an external force toward the at least one conduction module, so that the at least one conduction module and the device under test are properly electrically connected. The electrical testing device according to claim 1, wherein the pressure module includes a pressure plate having a plurality of through holes, a plurality of first coupling members arranged on the alignment frame, and a plurality of The second connecting member is respectively penetrated through the through holes to be combined with the first coupling members, so that the pressure plate applies external force to the second coupling member to the component to be tested. The electrical testing device according to claim 2, wherein each first coupling member of the pressurizing module has an inner screw wall surrounding and defining a screw groove, An outer wall surface opposite to the inner screw wall, and a top abutment surface connected to an end of the inner screw wall and the outer wall away from the alignment frame and separated from the alignment frame by a predetermined distance. The two connecting pieces have a screw part for screwing on the inner screw wall, and a screw head connected to the screw part. The electrical test device according to claim 1, wherein the alignment frame includes a frame body defining the inner space, and a plurality of protruding parts on the frame body and surrounding to define a device suitable for the device under test Position the bump of the placement space. The electrical testing device according to claim 4, wherein the frame body of the alignment frame has two opposite sides extending toward the inner space for a distance in a direction toward each other, and is suitable for supporting the waiting room placed in the placement space. The supporting part of the measuring element.

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