KR20110139827A

KR20110139827A - Probe card and method for manufacturing the same

Info

Publication number: KR20110139827A
Application number: KR1020100059884A
Authority: KR
Inventors: 김형익; 안두성
Original assignee: (주) 미코티엔
Priority date: 2010-06-24
Filing date: 2010-06-24
Publication date: 2011-12-30

Abstract

The probe card may include a printed circuit board having an inspection circuit, a disk member disposed at both sides of each of the through holes, and having support parts disposed under the printed circuit board and having a plurality of through holes formed thereon and protruding from the bottom surface. A plurality of spatial transducers bonded on the supports and disposed under the through-holes and spaced apart from the lower surface of the disc member, and a plurality of connecting members each electrically connecting the spatial transducers to the inspection circuit through the through-holes. And a plurality of probes connected to the bottom surface of the space transducers. Therefore, since the gap between the space transducers and the lower surface of the disk member is formed by the height of the support, the repair of the space transducers is facilitated, and the joining efficiency of the space transducer using solder or epoxy is improved by the supports.

Description

Probe card and method for manufacturing the same

The present invention relates to a probe card and a method of manufacturing the same, and more particularly to a probe card and a method of manufacturing the same comprising a disk member and a space transducer.

In general, a semiconductor device includes a Fab process for forming an electrical circuit including electrical devices on a silicon wafer used as a semiconductor substrate, and an EDS (Electrical) for inspecting electrical characteristics of the semiconductor devices formed in the fab process. Die Sorting) and a package assembly process for encapsulating and individualizing the semiconductor devices with epoxy resin, respectively.

The EDS process is performed to determine a defective semiconductor device among the semiconductor devices. The EDS process is performed by using an inspection apparatus called a probe card, wherein the probe card applies an electrical signal for inspection while the probe member is in contact with a pad of semiconductor elements, and by a signal checked from the applied electrical signal. Determine the defect

For example, the probe card may include a disk member having a plurality of through holes, pogo blocks inserted into and fixed to the through holes of the disk member, and space modifiers bonded to an upper surface of the disk member. Space Transformer), which is bonded onto the space transducers and may comprise probe blocks.

The space transducer is bonded to one surface of the disk member so as to be disposed above the through hole. In this case, the space transducer may fall due to the elastic force of the pogo pins at a high temperature. In addition, since the space transducers are directly bonded to one surface of the disk member, there is a problem in that the use of a tool is not easy and repair of the space transducer is not easy.

In addition, when the space transducers are bonded to the disk member, position alignment is performed. In the conventional position alignment, all of the space transducers are aligned by using a pair of alignment keys formed on the disk member. . In this case, if the alignment key is incorrectly recognized on the disk member, an alignment error occurs in all the space transducers.

As described above, the conventional probe card has a problem in that the bonding efficiency between the disk member and the space transducer is weak, repair is not easy, and the alignment of the space transducer in the manufacturing stage is weak.

Therefore, the problem to be solved by the present invention is to improve the bonding efficiency between the disk member and the space transducer, to facilitate the repair of the space transducer, to provide a probe card that can improve the position alignment error when joining the space transducers will be.

Another object of the present invention is to provide a method of manufacturing a probe card with improved alignment error when joining a disk member and a space transducer.

In order to achieve the above object, a probe card according to embodiments of the present invention includes a printed circuit board on which an inspection circuit is formed, and a support part disposed under the printed circuit board and formed with a plurality of through holes and protruding from the lower surface. Disk members each provided at both sides of each of the through holes, a plurality of space transducers bonded to the support parts and disposed below the through holes, respectively, and spaced from the bottom surface of the disk member; And a plurality of connecting members each electrically connecting the spatial transducers to the inspection circuit through through holes, and a plurality of probes connected to the lower surface of the spatial transducers.

According to embodiments of the present invention, the disk member may include alignment key holes for recognizing alignment keys formed on an alignment disk disposed on an opposite surface of one surface to which the space transducers are joined when the space transducers are joined. The through holes may be formed at positions opposite to each other.

According to the embodiments of the present invention, each of the support parts may be formed with a gold (Au) coating layer on the bonding surface to which the space transducers are bonded.

In addition, the disk member may be an anodized film formed on the entire remaining surface except for the bonding surface of each of the support portion on which the gold (Au) coating layer is formed.

According to embodiments of the present invention, an insulating material layer may be formed on the lower surface of the disk member.

In addition, the insulating material layer may be formed at a lower height than the support portions.

In addition, the insulating material layer may include ceramic or Teflon.

According to embodiments of the present invention, each of the connection members may include a pogo block inserted into the through hole and a plurality of pogo pins penetrating the pogo block.

In order to achieve the above object, a method of manufacturing a probe card according to embodiments of the present invention provides a disk member in which a plurality of through holes are formed and alignment key holes are formed at symmetrical positions on both sides of each of the through holes. And preparing each of the align disk on which the first align keys are formed and a plurality of spatial modifiers, each of which has a second align key, on the opposite side of one side of the disk member to which the spatial modifiers are to be joined. Attaching an align disk, and a second align formed in each of the first align keys and the spatial modifiers of the align disk attached to an opposite surface of the disk member recognized through the align key holes Individually aligning the spatial transducers with a key and joining them to the disc member; After a step of separating the aligned disc from the disc member.

According to the embodiments of the present invention, the disk member protrudes from the one surface and includes a plurality of support parts provided on both sides of each of the through holes, and the space modifiers are joined on the support parts to form the disk member. It may be spaced apart from one side of.

According to embodiments of the present invention, the preparing of the disk member may include forming an anodization film on the entire surface of the disc member, and forming one surface of the support parts to which the spatial transducers are to be bonded after the anodization film is formed. And removing the anodic oxide film to expose one surface of the support parts by polishing, and forming a gold (Au) coating layer on one surface of the support parts from which the anodic oxide film is removed.

According to embodiments of the present disclosure, preparing the disk member may include forming an insulating material layer on one surface of the disk member.

In addition, the insulating material layer may include ceramic or Teflon.

According to embodiments of the present invention, the spatial transducers may be joined using a single or a combination of solder and epoxy.

According to embodiments of the present invention, the alignment disc may include glass.

The probe card according to the embodiment of the present invention configured as described above has a plurality of through-holes formed thereon, and support parts protruding on the lower surface of the disk member respectively provided on both sides of the through-holes, and on the support parts. It includes a plurality of spatial transducers bonded to each other disposed under the through holes. Thus, the supports allow the space deformers to be spaced between the lower surfaces of the disc members, which facilitates the use of a tool for detaching the space deformers at such intervals.

In addition, by forming the gold (Au) coating layer on the bonding surface of the support portion, the bonding efficiency of the space transducers is improved by improving the bonding force between the gold (Au) coating layer and the solder. In addition, when both ends of the space transformers are bonded using epoxy, the bonding area of the epoxy is increased, and thus the bonding force is improved.

In the method of manufacturing a probe card according to an exemplary embodiment of the present invention, alignment key holes are formed at positions at both sides of the through-holes, which are symmetrical to each of the through-holes, and at one side of the disk member to which the space deformers are bonded in the bonding step of the space deformers. Spatial modulators using a second align key formed in each of the first align keys and spatial modifiers recognized through the align key holes after attaching an align disk having first align keys formed on an opposite side thereof. Join each other individually aligned. Therefore, the position alignment error in the joining of the spatial transducers is improved, and partial repair is facilitated even if an error occurs in the joining position.

1 is a schematic cross-sectional view showing a probe card according to an embodiment of the present invention.
FIG. 2 is an enlarged partial cross-sectional view of a portion of the probe card shown in FIG. 1.
3 is a schematic bottom view illustrating the disk member shown in FIG. 1.
4 is a view for explaining another example of the disk member shown in FIG.
5 is a view for explaining another example of the disk member shown in FIG.
6 is a schematic process flowchart illustrating a method of manufacturing a probe card according to an embodiment of the present invention.
7A to 7F are process steps illustrating a method of manufacturing a probe card according to an embodiment of the present invention.

Hereinafter, another probe card and a method of manufacturing the same will be described with reference to the accompanying drawings.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the invention, and are actually shown in a smaller scale than the actual dimensions in order to explain the schematic configuration. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a schematic cross-sectional view showing a probe card according to an embodiment of the present invention, Figure 2 is a partial cross-sectional view of an enlarged portion of the probe card shown in Figure 1, Figure 3 is a disk member shown in FIG. A schematic bottom view to explain.

1 to 3, the probe card 100 according to an embodiment of the present invention is disposed under the printed circuit board 110 and the printed circuit board 110 on which the test circuit is formed, and has a plurality of through holes. The disk member 120 having the 121 formed therein, the plurality of spatial transducers 130 and the through holes 121 joined to the disk member 120, respectively, are electrically inserted into the inspection circuit and the spatial transducers 130. It includes a plurality of connecting members 140 and a plurality of probes 150 connected to the bottom surface of the space transducers 130 to connect.

The printed circuit board 110 has a circular flat plate shape and has a test circuit for testing a semiconductor device. For example, an inspection circuit may be formed on the upper surface of the printed circuit board 110, and a plurality of internal wirings 111 may be formed to connect the inspection circuit and the lower surface of the upper surface. Therefore, the lower surface of the printed circuit board 110 may be provided with terminals connected to the inspection circuit, and electrically connected to the connection members 140 through these terminals to exchange signals for inspection.

The printed circuit board 110 may have a plurality of openings 113 formed along an edge. The openings 113 may be arranged at equal intervals. The openings 113 may be in the form of grooves or upper and lower holes formed radially in the edge portion of the printed circuit board 110. Although not shown in detail, connection terminals are formed on the upper surface of the printed circuit board 110 along the edges to connect with the pins of the test head, and the connection terminals are electrically connected to the inspection circuit.

The disk member 120 is disposed below the printed circuit board 110. The disc member 120 has a shape corresponding to an inspection object, such as a silicon wafer. That is, the disk member 120 has a circular flat plate shape and generally has a smaller size than the printed circuit board 110. The disk member 120 may be formed of a metal material which is excellent in workability and may reduce manufacturing cost. Examples of the metal material include iron-nickel alloys (Invar), Novinite, and the like. Alternatively, the disk member 120 may be formed of ceramic.

The disk member 120 has a plurality of through holes 121. The through hole 121 is formed through the upper and lower surfaces (eg, one side and the opposite side) of the disc member 120. Connection members 140 are disposed in the through holes 121. The through hole 121 may be, for example, a rectangle having a predetermined length and width. Here, according to the configuration of the connecting member 140, the stepped portion may be provided at both ends in the longitudinal direction so that the connecting member 140 is caught in the inside of the through hole 121, and the coupling depth of the connecting member 140 is formed by the stepped step. May be limited.

In addition, support parts 122 are formed on both sides of each of the through holes 121 on the bottom surface of the disc member 120. The support parts 122 protrude from the bottom surface of the disc member 120 and are provided at both sides of each through hole 121. For example, the support portions 122 may be formed on both sides of the through holes 121 in the longitudinal direction, respectively, and the support portions 122 may have a length corresponding to the width of the through holes 121. The support 122 has a bottom surface (eg, a front end surface) having a predetermined surface area. The bottom surface of the support 122 is a substantial bonding surface to which the space transducer 130 is bonded when the space transducer 130 is bonded to the disk member 120. Therefore, it is preferable that the lower surface of the support part 122 is formed to have a predetermined surface area or more for stable bonding of the space transducer 130. These supports 122 are provided for joining the space modifiers 140 at intervals between the bottom surface of the disk member 120. The protruding height of these supports 122 is preferably 0.1 mm to 0.3 mm. If the protruding height of the support portions 122 is 0.1 mm or less, the distance between the space transducers 140 and the lower surface of the disc member 120 is narrow, so that the tool for detaching the space transducer 140 from the disc member 120. The insertion process is difficult, so the repair process is not easy and is not preferable. If the protruding height of the support parts 122 is 0.3 mm or more, foreign matter may be inserted into the through-hole 121 of the disc member 120. When epoxy molding is performed at both ends of the space transducer 140, epoxy flows. It is not preferable because workability is poor, such as lowering, and the uniformity of the molding form is lowered.

In addition, the disk member 120 is provided with alignment key holes 123. The alignment key holes 123 are formed at positions symmetrical to both sides of each of the through holes 121. That is, the alignment key hole 123 is disposed at a point at which both sides of the through hole 121 are symmetrical to each other. The alignment key hole 123 is formed through the upper and lower surfaces (for example, one surface and the opposite surface) of the disk member 120 similarly to the through hole 121. Alignment key holes 123 are used to align the position when joining the spatial modifiers 130 to the disk member 120. Although not shown, the align key holes 123 are connected to one side of the disk member 120 (for example, the opposite side of the surface to which the space transducers 130 are bonded) in the step of aligning and joining the space transducers 130. It is used as a passage for checking the alignment keys formed on the alignment disk (not shown) to be temporarily attached. The alignment keys formed on the alignment disk (not shown) disposed on one side of the disk member 120 are aligned through the alignment key holes 123 to align the bonding positions of the space modifiers 130. Therefore, in the present exemplary embodiment, individual alignment of each of the spatial transducers 130 is performed by using an alignment key hole 123 and an alignment disk (not shown) provided at two symmetrical points of each through hole 121. This becomes possible. As a result, the joint position error due to the alignment error can be reduced, and individual repair can be performed when an error occurs at the joint position.

For example, the alignment key hole 123 may be formed at a position that is symmetrical to both sides of the through hole 121 in the longitudinal direction. The alignment key hole 123 may be a circular hole as shown, and may have a different shape such as a rectangular hole. The align key hole 123 may have a structure capable of recognizing an align key of an align disk (not shown) disposed on one side of the disc member 120. The range is not limited.

In addition, in the present exemplary embodiment, the alignment key holes 123 are provided at both sides of each of the through holes 121, so that the number of the alignment key holes 123 can be reduced. One alignment key hole 123 is provided between the through holes 121 and configured to share the same. That is, one alignment key hole 123 disposed between the arbitrary through hole 121 and the next through hole 121 serves as one side alignment key hole 123 for the arbitrary through hole 121. Next, the next through hole 121 serves as the other alignment key hole 123. As described above, the space required for forming the alignment key hole 123 may be reduced by sharing the alignment key hole 123, and the rigidity of the disk member 120 may be reduced due to excessive formation of the alignment key hole 123. Can be suppressed. The use of the alignment key holes 123 formed in the disk member 120 will be apparent through the manufacturing method of the probe card 100 which will be described later.

Meanwhile, solder 10 or epoxy 12 may be used to join the space transducers 130, and solder 10 and epoxy 12 may be used singly or together. In general, the solder 10 is interposed on the joint surface of the support 122 and the space transducer 130, and the epoxy may be formed at the end of the space transducer 130. Here, when only epoxy 12 is used to bond the space transducers 130, the support portions 122 serve to support the space transducers 130 to form a gap.

4 is a view for explaining another example of the disk member shown in FIG.

Referring to FIG. 4, in another example, an anodic oxide film 124 and a gold (Au) coating layer 125 may be formed on the disk member 120. The anodic oxide film 124 is formed on the disk member 120 as a whole, and the gold (Au) coating layer 125 is formed on the lower surface of the support parts 122 (for example, the surface to which the space transducers 130 are bonded). More specifically, first, the anodic oxide film 124 is formed on the disk member 120 as a whole, and the lower surfaces of the support parts 122 are polished by polishing (polishing) only the lower surfaces of the support parts 122 on which the anodic oxide film 124 is formed. The anodic oxide film 124 is removed so that it is exposed. The gold (Au) coating layer 125 is formed on the lower surfaces of the support portions 122 from which the anodization layer 124 is removed. Therefore, the gold (Au) coating layer 125 is interposed on the joint surface of the support part 122 and the space transducer 120, and the gold (Au) coating layer 125 has a property of improving the bonding force of the solder 10. As a result, the bonding force of the space transducer 120 using the solder 10 is improved due to the gold (Au) coating layer 125.

5 is a view for explaining another example of the disk member shown in FIG.

Referring to FIG. 5, in another example, an insulating material layer 126 may be formed on the bottom surface of the disc member 120 (for example, a plane in which the support parts 122 are formed). The insulating material layer 126 may be formed by a coating process, and an example of the insulating material may include ceramic or teflon. The insulating material layer 126 is provided to improve the bonding force when the epoxy 12 is used to bond the space transducers 130. As described above, when bonding the space transducer 130 using the epoxy 12, the epoxy 12 is bonded to the side of the end of the space transducer 130 and the bottom surface of the disk member 120. An insulating material such as Teflon has excellent heat resistance and epoxy 12 bonding strength. Therefore, the bonding force of the space transducer 120 using the epoxy 12 is improved by the insulating material layer 126.

The insulating material layer 126 is formed at a height lower than the supports 122 (eg, the thickness of the coating layer). If the height of the insulating material layer 126 is formed to be less than 40 μm, the effect of improving the bonding strength with the epoxy 12 through the insulating material layer 126 is insignificant, which is not preferable. In addition, when the height difference between the insulating material layer 126 and the support portions 122 is less than 40 μm, the tool may not be easily used during the repair operation of the space transducer 130, which is not preferable. Accordingly, the height of the insulating material layer 126 is formed to be 40 μm or more lower than the height of the support parts 122, and preferably formed to have a thickness in the range of 40 μm to 260 μm.

The anodization layer 124, the gold (Au) coating layer 125, and the insulating material layer 126 may be provided singly or together depending on the bonding material used to bond the space transducers 130. That is, when the solder 10 is used to bond the space transducers 130, a gold (Au) coating layer 125 or a gold (Au) coating layer 125 and an anodization layer 124 may be provided, and an epoxy ( If 12) is used, an insulating material layer 126 may be provided. In addition, when the solder 10 and the epoxy 12 are used together, the gold (Au) coating layer 125 and the insulating material layer 126 may be provided together.

Referring back to FIGS. 1 to 3, the space transducers 130 are bonded to the disk member 120 and are disposed under the through holes 121, respectively. As described above, the spatial transducers 130 are bonded to the supports 122. Each of the space transducers 130 is bonded to the support portions 122 formed at both sides of each of the through holes 121. For example, the space transducer 130 may have a rectangular plate structure, and both ends of the longitudinal transducer may be joined to a pair of support portions 122 formed at both sides of the through hole 121. Here, since the support part 122 protrudes from the lower surface of the disk member 120, the space transducers 130 are spaced apart from the lower surface of the disk member 120. Solder 10 and epoxy 12 may be used singly or together for the joining of space transducer 130.

In this way, the space transducer 130 is bonded to the support 122 to have a gap between the space transducer 130 and the lower surface of the disk member 120, the tool is easy to use at this interval to the space transducer 130 Repair becomes easy. In addition, when epoxy 12 is used for bonding, the bonding area is increased to improve the bonding efficiency. In addition, it is possible to prevent the bonding material (solder, epoxy) from being diffused in a pattern such as a terminal of the space transducer 130 when the space transducer 130 is bonded.

The space transducer 130 serves to adjust the spacing between the terminals. The space transducer 130 is connected to the connecting member 140 on the upper surface and the probe block 150 on the lower surface. Accordingly, the space modifier 130 adjusts the spacing between the relatively wide terminals of the connection member 140 to correspond to the arrangement of the probes 150 having the spacing between the relatively narrow terminals. To this end, the internal wires 131 for adjusting the spacing are provided in the space transformer 130.

The connecting members 140 are disposed in the through holes 121, respectively. The connection members 140 serve to electrically connect each of the spatial transducers 130 to the inspection circuit of the printed circuit board 110 through the through holes 121. For example, each of the connection members 140 may include a pogo block 141 inserted into the through hole 121 and a plurality of pogo pins 142 installed in the pogo block 141. Pogo pin 142 is formed through the pogo block 141, the upper end is electrically connected to the inspection circuit of the printed circuit board 110, the lower end is electrically connected to the space transducer 130. Both sides of the pogo block 141 may be provided with a locking step to be caught in the step formed in the through-hole 121. The pogo block 141 may be fixed by the fixing bolt 143. Although not shown in detail, it may further include a connection block interposed between the printed circuit board 110 and the disk member 120 in a plate form and connected to the upper portions of the pogo blocks 141 to be integrally formed. At this time, the pogo pins 142 pass through the pogo block 141 and the connection block.

Alternatively, each of the connection members 140 may be an interposer or a flexible connector, and examples of the flexible connector may include a wire and a flexible circuit board. That is, the connection members 140 may be electrically connected to the test circuit of the printed circuit board 110 and the space transducers 130 through the through holes 121.

The probes 150 are connected to the bottom surfaces of the space transducers 130. For example, the probes 150 may have a needle shape, and may include a guide plate 151 to arrange the needle-shaped probes 150 in a predetermined pattern. The guide plate 151 has a flat plate shape. The guide plate 151 has slits 152 for arranging the probes 150 to correspond to the pads of the semiconductor device to be inspected in the silicon wafer. These slits 152 are provided for inserting and fixing the probes 150, and the slits 152 may be arranged to face each other or to be staggered with each other, and may be arranged in one or a plurality of rows. For example, the guide plate 152 may include a lower guide 151a and an upper guide 151b that are coupled to face each other, and the probe is coupled between the lower guide 151a and the upper guide 151b. The field 150 may be pinched and fixed. The guide plate 151 is bonded to the lower surface of the space transducer 130 by an adhesive material. Alternatively, the guide plate 151 may have a single plate structure with slits 152, in which case the probes 150 may be fixed on the guide plate 151 by a bonding material (eg epoxy). Can be.

The probes 150 are inserted into and fixed to the slits 152 formed on the guide plate 151. To this end, each probe 150 has a locking jaw at both ends, and the locking jaw is supported at both ends of the slit 152. For example, while the probe 150 is inserted into the slit 152, the locking jaw of both ends may be pressed and fixed between the lower guide 151a and the upper guide 151b. Probe 150 is a tip portion protruding downward of the guide plate 151 is in direct contact with the pad of the semiconductor element formed on the silicon wafer serves to transfer the electrical signal. In addition, the probe 150 is connected to the space transducer 130 through a terminal protruding upward of the guide plate 15 ′.

Alternatively, the probes 150 and the guide plate 15 ′ may have various shapes, and the scope of the present invention is not limited thereto. In addition, the probes 150 may be formed in a MEMS manner to have a predetermined arrangement directly on the space transducer 130 without the guide plate 151.

The probe card 100 may include an upper reinforcement plate 160 disposed on the printed circuit board 110. The upper reinforcing plate 160 is formed of a material having a predetermined or more rigidity, and may include, for example, aluminum, an aluminum alloy, iron, or an iron alloy. The upper reinforcement plate 160 is provided to reinforce the printed circuit board 110 to prevent deformation such as bending or warping. The upper reinforcement plate 160 may have a circular flat plate shape, and may have a plurality of wings 161 formed radially along a circumference of the circle. The wings 161 are provided corresponding to the number and positions of the openings 113 formed in the printed circuit board 110, and have a structure extending downwardly so that a portion of an end thereof can be inserted into the openings 113. . In addition, although not shown in detail, it may also include a lower reinforcing plate disposed under the printed circuit board 110. The lower reinforcing plate, like the upper reinforcing plate 160, is intended to prevent deformation of the printed circuit board 110, such as bending or warping.

The probe card 100 includes a plurality of level bolts 102 for adjusting the flatness of the disk member 120 and a plurality of fastening plates for fastening the disk member 120 and the upper reinforcing plate 160. Fastening bolts 104. The level bolts 102 contact the disk member 120 through the upper reinforcement plate 160 and the printed circuit board 110. The fastening bolts 104 are fastened to the upper reinforcement plate 160 through the disk member 120 and the printed circuit board 110.

Hereinafter, a method of manufacturing the probe card 100 according to an embodiment of the present invention will be described.

6 is a schematic process flowchart illustrating a method of manufacturing a probe card according to an embodiment of the present invention, and FIGS. 7A to 7F are process steps illustrating a method of manufacturing a probe card according to an embodiment of the present invention.

6 and 7A, in the method of manufacturing a probe card according to an exemplary embodiment, an alignment key is formed at a position where a plurality of through holes 121 are formed and symmetrical to both sides of each of the through holes 121. The disk member 120 having the holes 123 is prepared. (S110)

Here, the disk member 120 protrudes on one surface to which the space transducers 130 are to be joined and has support parts 122 disposed on both sides of each of the through holes 121. The support parts 122 have a constant surface area with a front end surface for the stable bonding of the space transducers 130, and one surface of the support units 122 is a joint surface to which the space transducers 130 are joined. The support portions 122 are provided to form a gap between the space transducers 130 and one surface of the disk member 120, and the protrusion height is preferably 0.1 mm to 0.3 mm.

Meanwhile, as shown in FIG. 4, in another example, the disk member 120 may form the anodization layer 124 and the gold (Au) coating layer 125. That is, preparing the disk member 120 may include forming the anodized film 124 and the gold (Au) coating layer 125. More specifically, first, the anodic oxide film 124 is formed on the disk member 120 as a whole. After the anodic oxide film 124 is formed, polishing (polishing) of the front end surfaces of the support parts 122 to which the spatial transducers 130 are to be bonded is performed to polish the front end surfaces of the support parts 122 (for example, the spatial transducers 130). Anodic oxide film 124 is removed to expose the surface to be bonded). Next, a gold (Au) coating layer 125 is formed on front ends of the supporting parts 122 from which the anodization layer 124 is removed. The gold (Au) coating layer 125 may be formed to improve the bonding force of the solder 10 when bonding the space transducers 130 using the solder 10.

In addition, as shown in FIG. 5, in another example, an insulating material layer 126 (see FIG. 5) may be formed on one surface of the disk member 120. That is, preparing the disk member 120 may include forming an insulating material layer 126 on one surface of the disk member 120 to which the space modulators 130 are bonded. The insulating material layer 126 is formed at a height lower than the supports 122. Examples of the insulating material may include ceramic or Teflon. The insulating material layer 126 is epoxy 12 when bonding the space transducers 130 using the epoxy 12 through the excellent heat resistance of the insulating material such as ceramic or Teflon and excellent epoxy 12 bonding strength. It can be formed to improve the bonding force.

Meanwhile, the anodization layer 124, the gold (Au) coating layer 125, and the insulating material layer 126 may be provided singly or in combination depending on the bonding material used to bond the space transducers 130.

6, 7B, and 7C, a plurality of spatial modifiers 130 each including an align disk 20 and a second align key 132 having a plurality of first align keys 21 are formed. Prepare each of them. (S120)

In this embodiment, the align disk 20 as shown in FIG. 7B is used for the joining of the space transducers 130. Referring to FIG. 7B, the align disk 20 has a plate shape. The alignment disk 20 may have a shape corresponding to the disk member 120. Thus, the align disk 20 may be in the form of a circular flat plate. The align disk 20 may have a size equal to or larger than the size of the disk member 120. On one surface of the alignment disk 20, first alignment keys 21 are provided for aligning positions of the space transducers 130. The first alignment keys 21 are for position alignment of each of the spatial modifiers 130, and the arrangement of the first alignment keys 21 is performed by the alignment key holes 123 formed in the disk member 120. Corresponds to an array. In this case, it is preferable that the first alignment keys 21 have a fine size for more accurate and detailed position alignment with respect to the space modifiers 130. The larger the size of the first alignment key 21 is, the larger the recognition allowance range for the first alignment key 21 is, which is not preferable because the alignment error of the spatial modifier 130 may increase. Therefore, the first alignment keys 21 are preferably formed in a fine size.

For example, the alignment disk 20 may include glass, and the first alignment keys 21 may be formed on the glass through a photolithography process. By using the photolithography process, it is possible to form the first alignment keys 21 of fine size in the correct position. The first alignment keys 21 may be a concave pattern formed through etching, or may be a convex pattern. Alternatively, the first alignment keys 21 may be a print pattern, whereby the scope of the present invention is not limited.

Referring to the plan view of the space transformer 130 shown in FIG. 7C, each of the space transformers 130 includes a second alignment key 132 on one surface thereof. Here, one surface provided with the second alignment key 132 is a plane to which the probe block 150 is bonded. For example, two second alignment keys 132 may be formed in the space modifier 130 at intervals.

6 and 7D, the align disk 20 is attached to an opposite surface of one surface of the disk member 120 to which the space transducers 130 are to be bonded (S130).

The alignment disk 20 is temporarily attached to an opposite surface of the disk member 120 facing one surface on which the support portions 122 are formed. In addition, when the alignment disk 20 is attached to the disk member 120, the alignment disk 20 is attached through a predetermined alignment so that the first alignment keys 21 may be recognized through the alignment key holes 123. At this time, in order to align the spatial transducers 130 with accuracy and ease, attaching the alignment disk 120 so that the first alignment keys 21 are disposed at the center of the alignment key holes 123. desirable.

6 and 7E, after attaching the alignment disk 20 to the opposite surface of the disk member 120, the opposite surface of the disk member 120 recognized through the alignment key holes 123. The first and second alignment keys 21 of the alignment disk 20 and the second alignment keys 132 formed on each of the space transducers 130 attached thereto are individually aligned to the space transducers 130. It is bonded to the disk member 120. (S140)

The space transducers 130 are bonded to the support parts 122 formed on one surface of the disk member 120. Specifically, the space transducers 130 are joined to be disposed on the through holes 121, respectively, as shown in the drawing, and each of the space transformers 130 has two supporting parts formed on both sides of the through hole 121. Both sides are joined to 122. Therefore, the space modifiers 130 are bonded to each other by a distance of one surface of the disk member 120 and the height of the support parts 122. As the bonding material used for bonding the space transducers 130, for example, solder 10 or epoxy 12 may be used, and solder 10 and epoxy 12 may be used singly or together. In this case, when the epoxy 12 is used in the bonding of the space transformers 130, the space transformers 130 are not directly bonded to the supports 122, and the support units 122 are the space transformers 130. ) To support.

When each of the spatial transducers 130 are aligned and bonded to each other, alignment may be performed separately, so that even if an error occurs at the bonding position, repair may be performed separately (or partially).

6 and 7F, after the bonding of the space transducers 130 to the disk member 120 is completed, the alignment disk 20 is separated from the disk member 120 (S150).

As such, in the present embodiment, when the space modulators 130 are aligned and bonded to the disk member 120, the auxiliary uses the alignment disk 20. Here, since the first alignment key 21 formed on the alignment disk 20 can be formed in a fine size, accurate and fine alignment is possible. In addition, since individual alignment is possible for each of the spatial transducers 130, alignment errors may be improved.

Meanwhile, although not shown in detail, the method of manufacturing the probe card 100 may include preparing a printed circuit board 110 having an inspection circuit, and each of the plurality of probes 151 on one surface of the space transducers 130. Bonding the probe blocks 150 having the plurality of pogo pins 141 to the through-holes 121 of the disc member 120 to electrically connect the space transducers 130 to the space transducers 130. Connecting the printed circuit board 110 to the opposite surface of the disc member 120 into which the pogo blocks 140 are inserted, thereby electrically connecting the pogo blocks 140 and the inspection circuit. Include.

According to the embodiments of the present invention as described above, the probe card includes a disk member having a plurality of through-holes formed on both sides of each of the through-holes and supporting parts formed on the bottom surface of each of the through-holes. It includes a plurality of spatial transducers bonded to each other disposed under the through holes. Thus, the supports allow the space transducers to be spaced between the bottom surfaces of the disk member, which facilitates the use of tools for detaching the space transducers.

According to an embodiment of the present invention, in the method of manufacturing a probe card, alignment key holes are formed at positions on both sides of each of the through holes in the disk member, and at one side of the disk member to which the space transducers are joined in the bonding step of the space transducers. Spatial modulators using a second align key formed in each of the first align keys and spatial modifiers recognized through the align key holes after attaching an align disk having first align keys formed on an opposite side thereof. Join each other individually aligned. Therefore, the position alignment error in the joining of the spatial transducers is improved, and partial repair is easy even if an error occurs in the joining position.

Therefore, the bonding of the space transducer is easy, and it can be preferably used in the probe card and its manufacturing method for improving the bonding efficiency to improve the problem of dropping the space transducer.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

10: solder 20: alignment disk
21: first alignment key 100: probe card
102: level bolt 104: fastening bolt
110: printed circuit board 111: internal wiring
113: opening 120: disk member
121: through hole 122: support part
123: alignment key hole 124: anodized film
125: gold (Au) coating layer 126: insulating material layer
130: space transducer 131: internal wiring
132: second alignment key 140: pogo block
141: pogo pin 142: fixing bolt
150: probe 152: guide plate
152a: lower guide 152b: upper guide
153: slit 160: upper reinforcing plate
161: wing

Claims

A printed circuit board on which an inspection circuit is formed;
A disk member disposed under the printed circuit board and having a plurality of through holes formed therein, and supporting parts protruding from the bottom surface of each of the through holes, respectively;
A plurality of spatial transducers bonded on the support parts and disposed below the through holes, respectively, and spaced apart from the lower surface of the disc member;
A plurality of connecting members electrically connecting the spatial transducers to the inspection circuit through the through holes, respectively; And
A probe card comprising a plurality of probes connected to the bottom surfaces of the spatial transducers.

The through-hole of claim 1, wherein the disk member includes alignment key holes for recognizing alignment keys formed on an alignment disk that is disposed on an opposite side of a surface to which the spatial transducers are joined when the disk members are joined. Probe card, characterized in that formed on both sides of the symmetrical position.

The probe card of claim 1, wherein each of the support parts has a gold (Au) coating layer formed on a joint surface to which the space transducers are bonded.

The probe card of claim 3, wherein the disk member is formed with an anodized film formed on the entire surface of the disk except for a bonding surface of each of the support parts on which the gold (Au) coating layer is formed.

The probe card of claim 1, wherein an insulating material layer is formed on a lower surface of the disc member.

6. The probe card of claim 5 wherein said layer of insulating material is formed at a lower height than said supports.

6. The probe card of claim 5 wherein said layer of insulating material comprises ceramic or teflon.

The probe card of claim 1, wherein each of the connection members comprises a pogo block inserted into the through hole, and a plurality of pogo pins passing through the pogo block.

Preparing a disk member in which a plurality of through holes are formed and alignment key holes are formed at positions symmetrically opposite each of the through holes;
Preparing an alignment disk on which first alignment keys are formed and a plurality of spatial modifiers each of which has a second alignment key formed;
Attaching the align disk to an opposite side of one surface of the disk member to which the spatial transducers are to be joined;
The spatial modifiers are individually formed by using the first alignment keys of the alignment disk and a second alignment key formed on each of the spatial transducers attached to the opposite surface of the disk member recognized through the alignment key holes. Aligning and bonding to the disk member; And
And separating the align disk from the disk member after the joining of the spatial transducers.

The disk member of claim 9, wherein the disk member protrudes from the one surface and includes a plurality of support parts provided at both sides of each of the through holes.
And said space deformers are joined on said support parts to space one side of said disk member.

The method of claim 10, wherein preparing the disk member
Forming an anodized film on the entire surface of the disk member;
After the formation of the anodization film, polishing the front end surfaces of the support parts to which the spatial modifiers are to be bonded to remove the anodization film so that the front end surfaces of the support parts are exposed; And
And forming a gold (Au) coating layer on front ends of the supporting parts from which the anodic oxide film has been removed.

The method of claim 9, wherein preparing the disk member
And forming a layer of insulating material on one surface of the disk member.

The method of claim 12, wherein the insulating material layer is formed to have a lower height than the supports.

The method of claim 12, wherein the insulating material layer comprises ceramic or Teflon.

10. The method of claim 9, wherein the spatial transducers are joined using a single or together solder and epoxy.

10. The method of claim 9, wherein the alignment disk comprises glass.