WO2022208708A1 - Probe card - Google Patents

Probe card Download PDF

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Publication number
WO2022208708A1
WO2022208708A1 PCT/JP2021/013787 JP2021013787W WO2022208708A1 WO 2022208708 A1 WO2022208708 A1 WO 2022208708A1 JP 2021013787 W JP2021013787 W JP 2021013787W WO 2022208708 A1 WO2022208708 A1 WO 2022208708A1
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WO
WIPO (PCT)
Prior art keywords
electrode pad
probe
electrode
electrode pads
reinforcing film
Prior art date
Application number
PCT/JP2021/013787
Other languages
French (fr)
Japanese (ja)
Inventor
敬 吉田
Original Assignee
日本電子材料株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電子材料株式会社 filed Critical 日本電子材料株式会社
Priority to PCT/JP2021/013787 priority Critical patent/WO2022208708A1/en
Priority to TW111112679A priority patent/TW202242422A/en
Publication of WO2022208708A1 publication Critical patent/WO2022208708A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes

Definitions

  • the present invention relates to a probe card, and more particularly to improvement of a probe card in which probes are attached to electrode pads on a wiring board.
  • a probe card is an inspection device used for inspecting the electrical characteristics of a semiconductor device formed on a semiconductor wafer. It is provided on the wiring board. A semiconductor device is tested by bringing a semiconductor wafer close to a probe card and bringing the tips of the probes into contact with electrodes on the semiconductor wafer, thereby connecting a tester device to the semiconductor device through the probes and the wiring board.
  • a probe card has electrode pads formed on a wiring substrate, and probes are attached to the electrode pads.
  • the probe elastically deforms due to the load applied from the inspection object each time it contacts the inspection object. At this time, the load applied from the test object to the probe is transmitted to the electrode pad via the probe. Since the probe is firmly joined to the electrode pad by soldering or the like, it is relatively difficult for the probe to come off from the electrode pad.
  • the size of the electrode pads is becoming smaller, and the bonding strength of the electrode pads to the wiring substrate is insufficient, and the electrode pads are peeled off from the wiring substrate due to the elastic deformation of the probes during inspection.
  • a problem has arisen.
  • the probes are soldered onto the electrode pads to form a strong metal-to-metal bond.
  • the electrode pads are metal films deposited on the resin film of the wiring substrate, the bonding force between the electrode pads and the wiring substrate is weaker than the bonding force between the probes and the electrode pads. Therefore, as the size of the electrode pads becomes smaller, the problem arises that the electrode pads are peeled off from the wiring substrate during inspection, making it impossible to carry out appropriate inspections.
  • Patent Document 1 In order to prevent the electrode pads from coming off, it has been conventionally proposed to improve the adhesion force between the electrode pads and the wiring board by embedding the electrode pads inside the wiring board (for example, Patent Document 1, 2).
  • Patent Document 1 an electrode pad and a polymer layer are sequentially formed on a wiring substrate, and after the electrode pad is embedded in the polymer layer, the electrode pad is exposed by polishing. For this reason, the side surfaces of the electrode pads are surrounded by the polymer layer, and in addition to the bonding force on the bottom surface, the bonding force on the side surfaces is generated, thereby suppressing the electrode pads from being peeled off from the wiring board.
  • a metal seed film is formed on a wiring substrate, a metal plating layer is deposited on a part of the metal seed film excluding a peripheral portion, and these layers are embedded in an adhesive material.
  • the upper surface of the metal plating layer is exposed by .
  • the side surfaces of the metal seed film and the metal plating layer are surrounded by the adhesive material, and the peripheral edge portion of the upper surface of the metal seed film is covered with the adhesive material, thereby suppressing the electrode pad from being peeled off from the wiring substrate.
  • JP 2016-195235 A Japanese Patent Publication No. 2007-534947 JP 2011-43441 A
  • the metal plating layer is formed by forming openings in a mask layer covering the metal seed film and depositing a metal material in the openings.
  • the upper surface of the metal plating layer formed in this way becomes the probe mounting area. Therefore, when the pitch of the electrode pads is narrowed and the width of the electrode pads is narrowed, high opening accuracy is required to cover the peripheral portion on the metal seed film with the adhesive material while securing the probe mounting area. Therefore, there is a problem that narrowing of the pitch is restricted by aperture accuracy.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a highly reliable probe card in which electrode pads for probes are difficult to peel off from the wiring substrate.
  • Another object of the present invention is to provide a probe card in which the electrode pads are difficult to peel off from the wiring board while the probes are replaceable.
  • a probe card comprises a wiring substrate provided with two or more electrode pads, two or more probes attached to the two or more electrode pads, and edges of the electrode pads. a reinforcing film formed on the electrode pad and the wiring substrate so as to straddle the electrode pad and covering a part of the electrode pad.
  • the electrode pad has a probe mounting area for mounting the probe, the reinforcing film is formed on at least part of the area on the electrode pad excluding the probe mounting area, and the two or more electrode pads are , arranged in alignment in a first direction to form one electrode pad row, and the reinforcing film is formed in a band-like shape extending in the first direction and formed on two or more of the electrode pads.
  • the reinforcing film is formed so as to straddle the edge of the electrode pad, and it is possible to prevent the electrode pad from peeling off from the wiring board.
  • the electrode pads are arranged at a narrow pitch, and the width of the electrode pads in the first direction is narrow, the probe mounting region can be expanded. can be easily secured.
  • the reinforcement film by making the reinforcement film into a belt-like shape extending along the electrode pad rows, it is possible to prevent the electrode pads from being peeled off while securing the probe mounting area. Furthermore, since no reinforcing film is formed on the probe, it becomes possible to replace the probe when it is defective or damaged when it is attached to the electrode pad.
  • a probe card in addition to the configuration described above, includes: a base portion to which the probe is attached to the electrode pad; a contact portion to contact an object to be inspected; the base portion and the contact portion; and a beam portion extending along the wiring board, wherein the reinforcing film is formed to straddle the edge located on the opposite side of the probe mounting region from the contact portion. be.
  • the reinforcing film is formed so as to straddle the edge where stress tends to peel off the electrode pad from the wiring board due to the elastic deformation of the probe, thereby more effectively preventing the electrode pad from peeling off. be able to.
  • a probe card in addition to the above configuration, has an elongated shape in which the electrode pad has a longitudinal direction in a second direction that intersects with the first direction, and the reinforcing film includes: A pair of ends of the electrode pads which are formed to straddle one of a pair of edge sides of the electrode pad facing each other across the probe mounting region in the second direction and which face each other in the first direction from the probe mounting region.
  • the distance to a side is configured to be shorter than the distance from the probe mounting area to the edge on which the reinforcing film is formed.
  • the probe card according to the fourth aspect of the present invention includes, in addition to the above configuration, two reinforcing films respectively straddling the pair of edges.
  • a probe card in addition to the configuration described above, comprises two or more electrode pads arranged in alignment in the first direction, and two electrode pad rows adjacent to each other are formed by: and the reinforcing film includes an end side facing the other electrode pad row of the electrode pad belonging to one of the electrode pad rows and the one electrode pad row of the electrode pad belonging to the other electrode pad row. are formed on the two or more electrode pads and on the region on the wiring substrate sandwiched between the two electrode pad rows so as to straddle the edge side facing the .
  • two or more electrode pads belonging to two electrode pad rows adjacent to each other can be covered with one reinforcing film, and peeling of the electrode pads can be more effectively prevented.
  • the probes attached to the electrode pads belonging to the two electrode pad rows have contact portions that come into contact with the test object aligned in a row. are placed as follows.
  • the reinforcing film is formed by thermal curing after coating.
  • the reinforcing film is made of polyimide.
  • the present invention it is possible to provide a highly reliable probe card in which electrode pads for probes are difficult to peel off from the wiring board.
  • a probe card in which the electrode pads arranged at a narrow pitch are less likely to come off from the wiring substrate.
  • FIG. 2 is a diagram schematically showing how probes 5 are attached to the ST substrate 103 of FIG. 1.
  • FIG. 4 is a diagram showing the bottom surface of the ST substrate 103 to which the probes 5 are attached;
  • FIG. 3 is an enlarged view of an electrode pad 3 of FIG. 2;
  • FIG. 4 is a view (AA cross-sectional view) showing an example of a cross section of the ST substrate 103 of FIG. 3 taken along the AA cutting line;
  • FIG. 4 is a view (AA cross-sectional view) showing another example of a cross section when the ST substrate 103 of FIG. 3 is cut along the AA cutting line;
  • FIG. 1 is a diagram showing an example of a schematic configuration of a probe card 10 according to an embodiment of the present invention, showing a cross section when the probe card 10 is cut along a vertical plane.
  • the probe card 10 is attached to the wafer prober with the probe installation surface facing downward, faces the semiconductor wafer 20 placed on the stage 200, and moves the probes 5 to the semiconductor wafer by moving the stage 200 up and down. It can be contacted with electrodes 21 on 20 .
  • the probe card 10 is composed of a main substrate 100, a reinforcing plate 101, an interposer 102, an ST (Space Transformer) substrate 103, and two or more probes 5.
  • the main board 100 is a wiring board detachably attached to the wafer prober, and for example, a disk-shaped glass epoxy board is used.
  • the main substrate 100 is supported by a card holder 201 of a wafer prober at the peripheral portion of the lower surface thereof, and is arranged substantially horizontally.
  • a reinforcing plate 101 for suppressing distortion of the main board 100 is attached to the central portion of the upper surface of the main board 100 .
  • Two or more external terminals 11 to which signal terminals of a tester device (not shown) are connected are provided on the periphery of the upper surface of the main board 100 .
  • the interposer 102 is disposed between the main substrate 100 and the ST substrate 103, and is a connection means between the substrates that makes the wiring of the main substrate 100 and the wiring of the ST substrate 103 conductive.
  • the ST substrate 103 is an insulating multilayer wiring substrate, for example, a laminated plate in which two or more ceramic plates are pasted together, and is used to convert the electrode pitch.
  • the ST board 103 is attached to the main board 100 by the board holder 12 and arranged substantially horizontally.
  • the substrate holder 12 has one end fixed to the lower surface of the main substrate 100 and the other end supporting the peripheral portion of the lower surface of the ST substrate 103 .
  • the electrode pads 3 are electrodes for attaching the probes 5 , and a large number of electrode pads 3 are formed on the lower surface of the ST substrate 103 .
  • the electrode pads 3 are electrically connected to the external terminals 11 of the main board 100 via the interposer 102 .
  • the electrode pad 3 is a thin film made of a conductive metal formed by photolithography using an electroplating method or an etching method.
  • the probe 5 is made of an elastically deformable conductive metal such as NiCo (nickel-cobalt alloy) and has a tip for contacting the electrode 21 on the semiconductor wafer 20 .
  • the probes 5 are fixed on the electrode pads 3 by soldering.
  • the stage 200 is a mounting table for the semiconductor wafer 20, and is capable of moving and rotating in the horizontal plane and moving in the vertical direction. By horizontally moving or rotating the stage 200, the tip of the probe 5 and the electrode 21 of the semiconductor wafer 20 can be aligned. By raising the stage 200 after alignment, the semiconductor wafer 20 can be brought closer to the probe card 10 and the tips of the probes 5 can be brought into contact with the electrodes 21 .
  • Overdrive is performed in order to absorb variations in height of the probes 5 and the electrodes 21 and bring all the probes 5 into contact with the electrodes 21 .
  • Overdrive is a process in which the tip of the probe 5 and the electrode 21 are brought closer to each other by a predetermined distance from the state where they start to come into contact with each other. Due to the overdrive, each probe 5 is elastically deformed according to the height variation of the probes 5 and the electrodes 21 , and all the probes 5 can be reliably brought into contact with the corresponding electrodes 21 .
  • FIG. 2 is a diagram schematically showing how the probes 5 are attached to the ST substrate 103 of FIG. 1
  • FIG. 3 is a diagram showing the bottom surface of the ST substrate 103 to which the probes 5 are attached.
  • Electrode pad 3 A large number of electrode pads 3 are formed on the lower surface of the ST substrate 103 , and one probe 5 is attached to each electrode pad 3 .
  • An insulating film made of an insulating resin is formed on the lower surface of the ST substrate 103, and the electrode pads 3 are formed on the insulating film.
  • a probe mounting region 300 for mounting the probe 5 is provided in the central portion of the electrode pad 3 , and the reinforcing film 6 is formed in a region on the electrode pad 3 that does not overlap with the probe mounting region 300 .
  • Probe row 51 A large number of probes 5 are aligned in the vertical direction (first direction) in the figure to form a probe row 51 .
  • the probes 5 belonging to the same probe row 51 include a first probe 5A and a second probe 5B.
  • the first and second probes 5A, 5B have shapes different from each other and are alternately arranged in the probe row 51. As shown in FIG.
  • Electrode pad rows 31A and 31B A large number of electrode pads 3 are arranged corresponding to the probes 5 .
  • a large number of electrode pads 3 corresponding to the same probe row 51 form a first electrode pad row 31A and a second electrode pad row 31B.
  • the first electrode pad row 31A is formed by aligning the electrode pads 3 corresponding to the first probes 5A in the vertical direction (first direction) in the figure.
  • the second electrode pad row 31B is formed by aligning the electrode pads 3 corresponding to the second probes 5B in the first direction in the figure.
  • the first and second electrode pad rows 31A and 31B are arranged adjacent to each other with a small gap therebetween and extend parallel to each other.
  • the probe 5 has a contact portion 501 , a beam portion 502 and a base portion 503 .
  • the contact portion 501 is the tip portion of the probe 5 that contacts the electrode 21 of the test object, and is provided at one end of the beam portion 502 .
  • the base portion 503 is a support portion having a joint portion 504 joined to the electrode pad 3 and is provided at the other end of the beam portion 502 .
  • the beam portion 502 is a connection portion that connects the contact portion 501 and the base portion 503 and has an elongated shape extending along the ST substrate 103 . That is, the probe 5 has a cantilever beam structure, and achieves overdrive by elastically deforming the beam portion 502 due to the load that the contact portion 501 receives from the electrode 21 .
  • the first and second probes 5A and 5B are configured so that the contact portion 501 and the beam portion 502 have substantially the same shape, and the contact portion 501 exhibits substantially the same behavior with respect to the same load.
  • the first and second probes 5A and 5B have different shapes of base portions 503, and different distances from the contact portion 501 to the joint portion 504 in the horizontal plane.
  • the probes 5A and 5B belonging to the same probe row 51 are arranged such that the contact portions 501 are aligned on the same straight line and the joint portions 504 are aligned on different electrode pad rows 31A and 31B.
  • the reinforcement film 6 is an insulating resin film for reinforcing the electrode pad 3 .
  • the reinforcing film 6 is formed on the electrode pad 3 and the surrounding ST substrate 103 so as to straddle the edge 301 or 302 of the electrode pad 3 . Therefore, the electrode pads 3 are firmly fixed to the ST substrate 103, and the electrode pads 3 are less likely to come off from the ST substrate 103 during inspection.
  • the reinforcing film 6 is formed so as to cover at least part of the area on the electrode pad 3 excluding the probe mounting area 300 .
  • the reinforcement film 6 is formed so as to cover the peripheral region on the electrode pad 3 , the reinforcement film 6 is not formed in the probe mounting region 300 and the electrode pad 3 is exposed. Therefore, the probe 5 can be attached and detached even after the reinforcing film 6 is formed. For example, if the probe 5 is defective or damaged, the probe 5 can be replaced.
  • the reinforcing film 6 has a strip shape extending along the electrode pad row 31A or 31B, and is formed on two or more electrode pads 3 belonging to the electrode pad row 31A or 31B. Therefore, the electrode pads 3 are more strongly fixed to the ST substrate 103 and the electrode pads 3 are less likely to come off, compared to the case where the reinforcing film 6 is formed for each electrode pad 3 .
  • the electrode pad 3 has a pair of edges 301 and 302 facing each other, and two reinforcing films 6 are formed so as to straddle the pair of edges 301 and 302, respectively, facing each other with the probe mounting region 300 interposed therebetween. Two areas on the electrode pads 3 to be covered are respectively covered. Therefore, the electrode pad 3 is more firmly fixed to the ST substrate 103 and is less likely to come off, compared to the case where the reinforcing film 6 is formed only on one of the pair of edges 301 and 302 .
  • the pair of edges 301 and 302 on which the reinforcing film 6 is formed is desirably a pair of edges facing each other in the extension direction of the beam portion 502 of the probe 5 corresponding to the electrode pad 3 .
  • the extension direction of the beam portion 502 is the horizontal direction (second direction)
  • two reinforcing films 6 are formed so as to straddle the left and right edges 301 and 302 of the electrode pad 3 .
  • the probe 5 Since the probe 5 has a cantilever beam structure, if the contact portion 501 contacts the test object during inspection, a force acts on the base portion 503 in a direction that tilts the contact portion 501 side. At this time, a stress is generated in a region on the electrode pad 3 opposite to the contact portion 501 with the probe mounting region 300 interposed therebetween, such that the electrode pad 3 is peeled off from the ST substrate 103 . Therefore, by forming two reinforcing films 6 so as to straddle a pair of opposite sides 301 and 302 in the extending direction of the beam portion 502 among the four sides of the substantially rectangular electrode pad 3, It is possible to effectively suppress peeling of the electrode pad 3 .
  • the reinforcing film 6 is formed on one of the pair of opposing edges 301 and 302 of the electrode pad 3 and the reinforcing film 6 is not formed on the other.
  • the reinforcing film 6 is formed only on one of the pair of edges 301 and 302, the edge 301 opposite to the contact portion 501 across the probe mounting region 300, that is, the edge 301 located farthest from the contact portion 501.
  • the reinforcing film 60 formed between the electrode pad rows 31A and 31B covers both the region on the electrode pads 3 belonging to the electrode pad row 31A and the region on the electrode pads 3 belonging to the electrode pad row 31B. It is formed.
  • the reinforcing film 60 is formed of the edge 302 of the electrode pads 3 belonging to one electrode pad row 31A facing the other electrode pad row 31B and the electrode pad 3 belonging to the other electrode pad row 31B. are formed so as to straddle both the one electrode pad row 31A and the facing edge 301, among the edge sides.
  • the electrode pad rows 31A and 31B are formed close to each other, leaving only a narrow region between them. Therefore, by forming one reinforcing film 60 covering both the two electrode pads 3 belonging to different electrode pad rows 31A and 31B, the reinforcing film 6 can be formed even in a narrow area, and the electrode pads 3 can be It can prevent peeling.
  • FIG. 4 is an enlarged view of the electrode pad 3, showing an enlarged part of FIG.
  • the electrode pad 3 has a substantially rectangular shape with four edges 301 to 304 and has an elongated shape with the second direction as the longitudinal direction.
  • a pair of edges 301 and 302 facing each other in the second direction are covered with the reinforcement film 6, while a pair of edges 303 and 304 facing each other in the first direction are covered with the reinforcement film 6 except near both ends.
  • the probe mounting area 300 is provided substantially in the center of the electrode pad 3 and is an elongated rectangular area whose longitudinal direction is the lateral direction.
  • the distances L1-L4 are the lengths from the probe mounting area 300 to the edges 301-304.
  • a reinforcing film 6 is formed on a pair of edges 301 and 302 facing each other in the second direction, and the distances L1 and L2 in the second direction are longer than the distances L3 and L4 in the first direction. It is possible to secure a desired area on the electrode pad 3 for this purpose.
  • the reinforcing film 6 is not formed on the pair of edges 303 and 304 facing each other in the first direction, and the distances L3 and L4 in the first direction are set shorter than the distances L1 and L2 in the second direction, preferably zero. By doing so, it is possible to narrow the arrangement pitch of the electrode pads 3 in the electrode pad rows 31A and 31B.
  • FIG. 5 is a diagram (AA cross-sectional view) showing an example of a cross section of the ST substrate 103 of FIG. 3 cut along the AA cutting line. Note that FIG. 5 is a diagram showing the vertically downward direction upward, and the vertical direction is opposite to that in FIG. 1 .
  • the ST substrate 103 is formed by laminating one or more insulating films 703 and 704 on a laminated plate in which two or more ceramic substrates 701 and 702 are laminated. Electrode pads 3 are formed on the outermost insulating film 704 .
  • An insulating resin such as polyimide is used for the insulating films 703 and 704 , and a conductive metal such as copper is used for the electrode pad 3 .
  • the insulating films 703 and 704 are formed by photolithography processing using an etching method.
  • a wiring pattern 71 and a through hole 72 are provided in the ST substrate 103 .
  • the electrode pads 3 are electrically connected to electrodes provided on the main surface opposite to the ST substrate 103, ie, the lower surface (upper surface in FIG. 1).
  • the probes 5A and 5B belong to the same probe row 51, and the contact portion 501 and the beam portion 502 have the same shape and position, but the base portion 503 has a different shape and the joint portion 504 has a different position.
  • the reinforcing film 6 is formed on the region on the electrode pad 3 adjacent to the edges 301 and 302 and on the insulating film 704 adjacent to the electrode pad 3 so as to straddle the pair of opposing edges 301 and 302 of the electrode pad 3 . formed in the area.
  • An insulating resin such as polyimide is used for the reinforcement film 6, and is formed by photolithography processing using an etching method. Further, the reinforcing film 6 is formed by thermally curing after application.
  • FIG. 6 is a diagram (AA cross-sectional view) showing another example of a cross section of the ST substrate 103 of FIG. 3 cut along the AA cutting line.
  • the insulating film 705 like the insulating films 703 and 704, is a thin film made of an insulating resin such as polyimide, and is formed using a photolithographic technique.
  • the electrode pads 3 are surrounded by the insulating film 705 , and the side surfaces of the electrode pads 3 are in close contact with the side surfaces of the insulating film 705 . Therefore, the electrode pads 3 are more difficult to peel off than in the case of FIG.
  • the reinforcing film 6 is formed on the regions on the electrode pads 3 adjacent to the edges 301 and 302 and on the region on the insulating film 705 adjacent to the electrode pads 3 so as to straddle the edges 301 and 302 of the electrode pads.
  • the first direction which is the extending direction of the electrode pad rows 31A and 31B and the reinforcing film 6, and the second direction, which is the longitudinal direction of the electrode pads 3, are orthogonal to each other.
  • the two may be in directions intersecting each other, and may not be orthogonal to each other.
  • the extending direction of the beam portion 502 matches the second direction, it does not have to match.
  • the probe row 51 is composed of two types of probes 5A and 5B having different shapes and corresponds to the two electrode pad rows 31A and 31B. It is not limited only to such a case.
  • the present invention can also be applied to a case where the probe row 51 is composed only of probes 5A of the same shape and corresponds to only one electrode pad row 31A. In this case, two or more electrode pads 3 are arranged on the ST substrate 103, and two or more probes 5 are attached.
  • the probe row 51 is made up of a large number of probes 5 and the electrode pad rows 31A and 31B are each made up of a large number of electrode pads 3. It is not limited only to such a case.
  • the present invention can also be applied when the probe row 51 is composed of two or more probes 5 and each of the electrode pad rows 31A and 31B is composed of two or more electrode pads 3 .
  • Probe card 11 External terminal 12
  • Substrate holder 100 Main substrate 101 Reinforcing plate 102
  • Interposer 103 ST substrate 20
  • Semiconductor wafer 21 Electrode 200
  • Stage 201 Card holder 3
  • Electrode pad 300 Probe mounting regions 301, 302 Edges 31A, 31B
  • Electrode pad row 5 , 5A, 5B probe 501 contact portion 502 beam portion 503 base portion 504 joint portion 51 probe rows 6, 60 reinforcing film 71 wiring pattern 72 through holes 701, 702 ceramic substrates 703 to 705 insulating film

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

[Problem] The purpose of this invention is to provide a highly reliable probe card having a probe electrode pad that does not easily peel from a wiring board. [Solution] This probe card comprises: a wiring board 103 having an electrode pad 3 provided thereon; a probe 5 attached to the electrode pad 3; and a reinforcement film 6 that is formed on the electrode pad 3 and in the surrounding area so as to extend over the edges 301, 302 of the electrode pad 3 and cover a portion of the electrode pad 3. The electrode pad 3 comprises a probe attachment area 300 for attaching the probe 5. The reinforcement film 6 is formed on at least a portion of the area on the electrode pad 3 other than the probe attachment area 300.

Description

プローブカードprobe card
　本発明は、プローブカードに係り、更に詳しくは、配線基板上の電極パッドにプローブが取り付けられたプローブカードの改良に関する。 The present invention relates to a probe card, and more particularly to improvement of a probe card in which probes are attached to electrode pads on a wiring board.
　プローブカードは、半導体ウエハ上に形成された半導体デバイスの電気的特性を検査する際に使用される検査装置であり、半導体ウエハ上に形成された２以上の電極にそれぞれ接触させる２以上のプローブが配線基板上に設けられている。半導体デバイスの検査は、プローブカードに半導体ウエハを近づけてプローブの先端を半導体ウエハ上の電極に接触させ、プローブ及び配線基板を介して、テスター装置を半導体デバイスと導通させることにより行われる。 A probe card is an inspection device used for inspecting the electrical characteristics of a semiconductor device formed on a semiconductor wafer. It is provided on the wiring board. A semiconductor device is tested by bringing a semiconductor wafer close to a probe card and bringing the tips of the probes into contact with electrodes on the semiconductor wafer, thereby connecting a tester device to the semiconductor device through the probes and the wiring board.
　プローブカードは、配線基板上に電極パッドが形成され、当該電極パッド上にプローブが取り付けられる。プローブは、検査対象物に接触するたびに、検査対象物から加えられる荷重により弾性変形する。このとき、検査対象物からプローブに加えられる負荷は、プローブを介して電極パッドに伝えられる。プローブは、はんだ付け等により電極パッドに対し強固に接合されているため、プローブの電極パッドからの離脱は比較的生じにくい。 A probe card has electrode pads formed on a wiring substrate, and probes are attached to the electrode pads. The probe elastically deforms due to the load applied from the inspection object each time it contacts the inspection object. At this time, the load applied from the test object to the probe is transmitted to the electrode pad via the probe. Since the probe is firmly joined to the electrode pad by soldering or the like, it is relatively difficult for the probe to come off from the electrode pad.
　ところが、最近のプローブ配置の狭ピッチ化に伴って、電極パッドのサイズが小さくなり、電極パッドの配線基板に対する接合強度が不足し、検査時におけるプローブの弾性変形により、電極パッドが配線基板から剥がれるという問題が生じるようになった。プローブは、電極パッド上にはんだ付けされ、金属同士が強固に結合されている。これに対し、電極パッドは配線基板の樹脂膜上に堆積させた金属膜であることから、電極パッド及び配線基板間の結合力は、プローブ及び電極パッド間の結合力よりも弱い。このため、電極パッドのサイズが小さくなることにより、検査時に電極パッドが配線基板から剥がれ、適切な検査を行うことができなくなるという問題が生じるようになってきた。 However, with the recent narrowing of the probe pitch, the size of the electrode pads is becoming smaller, and the bonding strength of the electrode pads to the wiring substrate is insufficient, and the electrode pads are peeled off from the wiring substrate due to the elastic deformation of the probes during inspection. A problem has arisen. The probes are soldered onto the electrode pads to form a strong metal-to-metal bond. On the other hand, since the electrode pads are metal films deposited on the resin film of the wiring substrate, the bonding force between the electrode pads and the wiring substrate is weaker than the bonding force between the probes and the electrode pads. Therefore, as the size of the electrode pads becomes smaller, the problem arises that the electrode pads are peeled off from the wiring substrate during inspection, making it impossible to carry out appropriate inspections.
　電極パッドが剥がれるのを防止するために、配線基板の内部に電極パッドを埋め込むことにより、電極パッド及び配線基板間の固着力を向上させることが従来から提案されている（例えば、特許文献１、２）。 In order to prevent the electrode pads from coming off, it has been conventionally proposed to improve the adhesion force between the electrode pads and the wiring board by embedding the electrode pads inside the wiring board (for example, Patent Document 1, 2).
　特許文献１では、配線基板上に電極パッド及び高分子層を順に形成し、電極パッドを高分子層内に埋め込んだ後、研磨により電極パッドを露出させている。このため、電極パッドは、側面が高分子層で囲まれ、底面における結合力に加えて、側面における結合力も生じ、配線基板から電極パッドが剥がれるのを抑制している。 In Patent Document 1, an electrode pad and a polymer layer are sequentially formed on a wiring substrate, and after the electrode pad is embedded in the polymer layer, the electrode pad is exposed by polishing. For this reason, the side surfaces of the electrode pads are surrounded by the polymer layer, and in addition to the bonding force on the bottom surface, the bonding force on the side surfaces is generated, thereby suppressing the electrode pads from being peeled off from the wiring board.
　特許文献２では、配線基板上に金属シード膜を形成し、さらに金属シード膜上の周縁部を除く一部の領域に金属めっき層を堆積させ、これらを接着材料内に埋め込んだ後、研磨等により金属めっき層の上面を露出させている。このため、金属シード膜及び金属めっき層の側面が接着材料で囲まれるとともに、金属シード膜の上面周縁部が接着材料により覆われ、配線基板から電極パッドが剥がれるのを抑制している。 In Patent Document 2, a metal seed film is formed on a wiring substrate, a metal plating layer is deposited on a part of the metal seed film excluding a peripheral portion, and these layers are embedded in an adhesive material. The upper surface of the metal plating layer is exposed by . For this reason, the side surfaces of the metal seed film and the metal plating layer are surrounded by the adhesive material, and the peripheral edge portion of the upper surface of the metal seed film is covered with the adhesive material, thereby suppressing the electrode pad from being peeled off from the wiring substrate.
　また、樹脂からなる補強部材を用いて、電極パッド上に形成されたプローブの一部を覆うことにより、プローブが傾いたり、倒れたりするのを防止することが従来から提案されている（例えば、特許文献３）。 Conventionally, it has been proposed to prevent the probe from tilting or falling by covering a part of the probe formed on the electrode pad with a reinforcing member made of resin (for example, Patent document 3).
特開２０１６－１９５２３５号公報JP 2016-195235 A 特表２００７－５３４９４７号公報Japanese Patent Publication No. 2007-534947 特開２０１１－４３４４１号公報JP 2011-43441 A
　特許文献１の方法では、電極パッドの側面と高分子層の壁面との間に十分な結合力を生じさせることができず、電極パッドのサイズが小さくなると結合力が不足し、電極パッドが配線基板から剥がれるのを十分に防ぐことができないという問題があった。 In the method of Patent Document 1, sufficient bonding force cannot be generated between the side surface of the electrode pad and the wall surface of the polymer layer. There is a problem that it is not possible to sufficiently prevent peeling from the substrate.
　特許文献２の方法では、電極パッドの配列ピッチが狭くなれば、高い開口精度が要求されるため、狭ピッチ化のボトルネックになるという問題があった。金属めっき層は、金属シード膜を覆うマスク層に開口部を形成し、当該開口部内に金属材料を堆積させることにより形成される。このようにして形成された金属めっき層の上面がプローブ取付領域になる。このため、電極パッドが狭ピッチ化され、電極パッドの幅が狭くなった場合、プローブ取付領域を確保しつつ、金属シード膜上の周辺部を接着材料で覆うには、高い開口精度が必要になり、開口精度により狭ピッチ化が制約を受けるという問題があった。 In the method of Patent Document 2, if the array pitch of the electrode pads is narrowed, high opening accuracy is required, which poses a problem of becoming a bottleneck in narrowing the pitch. The metal plating layer is formed by forming openings in a mask layer covering the metal seed film and depositing a metal material in the openings. The upper surface of the metal plating layer formed in this way becomes the probe mounting area. Therefore, when the pitch of the electrode pads is narrowed and the width of the electrode pads is narrowed, high opening accuracy is required to cover the peripheral portion on the metal seed film with the adhesive material while securing the probe mounting area. Therefore, there is a problem that narrowing of the pitch is restricted by aperture accuracy.
　特許文献３の方法では、プローブが傾くのを防止するためにプローブの一部を補強部材で覆っているため、プローブに不具合や損傷があった場合に、プローブを交換することができず、配線基板全体の交換が必要になるという問題があった。 In the method of Patent Document 3, a part of the probe is covered with a reinforcing member in order to prevent the probe from tilting. There was a problem that it was necessary to replace the entire board.
　本発明は、上記の事情に鑑みてなされたものであり、プローブ用の電極パッドが配線基板から剥がれにくい信頼性の高いプローブカードを提供することを目的とする。特に、狭ピッチで配列された電極パッドが配線基板から剥がれにくいプローブカードを提供することを目的とする。また、プローブを交換可能にしつつ、電極パッドが配線基板から剥がれにくいプローブカードを提供することを目的とする。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a highly reliable probe card in which electrode pads for probes are difficult to peel off from the wiring substrate. In particular, it is an object of the present invention to provide a probe card in which electrode pads arranged at a narrow pitch are less likely to come off from a wiring substrate. Another object of the present invention is to provide a probe card in which the electrode pads are difficult to peel off from the wiring board while the probes are replaceable.
　第１の本発明の実施態様によるプローブカードは、２以上の電極パッドが設けられた配線基板と、２以上の前記電極パッドにそれぞれ取り付けられた２以上のプローブと、前記電極パッドの端辺を跨ぐように、前記電極パッド上及び前記配線基板上に形成され、前記電極パッドの一部を覆う補強膜と、を備える。前記電極パッドは、前記プローブを取り付けるためのプローブ取付領域を有し、前記補強膜は、前記プローブ取付領域を除く前記電極パッド上の領域の少なくとも一部に形成され、２以上の前記電極パッドは、第１方向に整列して配置され、１つの電極パッド列を形成し、前記補強膜は、前記第１方向に延びる帯状の形状からなり、２以上の前記電極パッド上に形成される。 A probe card according to a first aspect of the present invention comprises a wiring substrate provided with two or more electrode pads, two or more probes attached to the two or more electrode pads, and edges of the electrode pads. a reinforcing film formed on the electrode pad and the wiring substrate so as to straddle the electrode pad and covering a part of the electrode pad. The electrode pad has a probe mounting area for mounting the probe, the reinforcing film is formed on at least part of the area on the electrode pad excluding the probe mounting area, and the two or more electrode pads are , arranged in alignment in a first direction to form one electrode pad row, and the reinforcing film is formed in a band-like shape extending in the first direction and formed on two or more of the electrode pads.
　上記構成を採用することにより、電極パッドの端辺を跨ぐように補強膜が形成され、電極パッドが配線基板から剥がれるのを防止することができる。特に、帯状の形状からなる補強膜が、２以上の電極パッドをそれぞれ覆うことにより、電極パッドの剥がれを効果的に防止することができる。また、隣接する電極パッドのプローブ取付領域によって挟まれる領域に補強膜が形成されず、電極パッドが狭ピッチで配置され、電極パッドの第１方向の幅が狭い場合であってもプローブ取付領域を容易に確保することができる。つまり、補強膜を電極パッド列に沿って延びる帯状の形状にすることにより、プローブ取付領域を確保しつつ、電極パッドの剥がれを防止することができる。さらに、プローブ上に補強膜が形成されないため、電極パッドに取り付けたプローブに不具合や損傷があった場合に、当該プローブを交換することが可能になる。 By adopting the above configuration, the reinforcing film is formed so as to straddle the edge of the electrode pad, and it is possible to prevent the electrode pad from peeling off from the wiring board. In particular, by covering each of the two or more electrode pads with a strip-shaped reinforcing film, it is possible to effectively prevent the electrode pads from being peeled off. In addition, even when the reinforcing film is not formed in the region sandwiched between the probe mounting regions of the adjacent electrode pads, the electrode pads are arranged at a narrow pitch, and the width of the electrode pads in the first direction is narrow, the probe mounting region can be expanded. can be easily secured. In other words, by making the reinforcement film into a belt-like shape extending along the electrode pad rows, it is possible to prevent the electrode pads from being peeled off while securing the probe mounting area. Furthermore, since no reinforcing film is formed on the probe, it becomes possible to replace the probe when it is defective or damaged when it is attached to the electrode pad.
　第２の本発明の実施態様によるプローブカードは、上記構成に加えて、前記プローブが、前記電極パッドに取り付けられるベース部と、検査対象物に接触するコンタクト部と、前記ベース部及び前記コンタクト部を連結し、前記配線基板に沿って延びるビーム部と、を有し、前記補強膜が、前記プローブ取付領域を挟んで前記コンタクト部とは反対側に位置する前記端辺を跨ぐように形成される。 A probe card according to a second aspect of the present invention, in addition to the configuration described above, includes: a base portion to which the probe is attached to the electrode pad; a contact portion to contact an object to be inspected; the base portion and the contact portion; and a beam portion extending along the wiring board, wherein the reinforcing film is formed to straddle the edge located on the opposite side of the probe mounting region from the contact portion. be.
　上記構成を採用することにより、プローブの弾性変形により配線基板から電極パッドを剥がそうとする応力が発生する端辺を跨ぐように補強膜が形成され、電極パッドの剥がれをより効果的に防止することができる。 By adopting the above configuration, the reinforcing film is formed so as to straddle the edge where stress tends to peel off the electrode pad from the wiring board due to the elastic deformation of the probe, thereby more effectively preventing the electrode pad from peeling off. be able to.
　第３の本発明の実施態様によるプローブカードは、上記構成に加えて、前記電極パッドが、前記第１方向と交差する第２方向を長手方向とする細長い形状を有し、前記補強膜が、前記第２方向において前記プローブ取付領域を挟んで対向する前記電極パッドの一対の端辺の一方を跨ぐように形成され、前記プローブ取付領域から前記第１方向において対向する前記電極パッドの一対の端辺までの距離が、前記プローブ取付領域から前記補強膜が形成される前記端辺までの距離よりも短くなるように構成される。 A probe card according to a third embodiment of the present invention, in addition to the above configuration, has an elongated shape in which the electrode pad has a longitudinal direction in a second direction that intersects with the first direction, and the reinforcing film includes: A pair of ends of the electrode pads which are formed to straddle one of a pair of edge sides of the electrode pad facing each other across the probe mounting region in the second direction and which face each other in the first direction from the probe mounting region. The distance to a side is configured to be shorter than the distance from the probe mounting area to the edge on which the reinforcing film is formed.
　上記構成を採用することにより、補強膜によって覆われる電極パッド上の領域を確保することができ、また、プローブ取付領域を確保しつつ、電極パッドを狭ピッチで配列させることができる。 By adopting the above configuration, it is possible to secure the area on the electrode pads covered by the reinforcing film, and it is possible to arrange the electrode pads at a narrow pitch while securing the probe mounting area.
　第４の本発明の実施態様によるプローブカードは、上記構成に加えて、前記一対の端辺をそれぞれ跨ぐ２つの前記補強膜を備える。 The probe card according to the fourth aspect of the present invention includes, in addition to the above configuration, two reinforcing films respectively straddling the pair of edges.
　上記構成を採用することにより、プローブの弾性変形により剥がれやすい電極パッド上の領域に補強膜を形成することができ、電極パッドの剥がれをより効果的に防止することができる。 By adopting the above configuration, it is possible to form a reinforcing film on the area on the electrode pad that is easily peeled off due to the elastic deformation of the probe, so that the peeling of the electrode pad can be prevented more effectively.
　第５の本発明の実施態様によるプローブカードは、上記構成に加えて、前記第１方向に整列して配置された２以上の電極パッドによりそれぞれ構成され、互いに隣接する２つの前記電極パッド列を備え、前記補強膜が、一方の前記電極パッド列に属する前記電極パッドの他方の前記電極パッド列と対向する端辺と、前記他方の電極パッド列に属する前記電極パッドの前記一方の電極パッド列と対向する端辺とをそれぞれ跨ぐように、２以上の前記電極パッド上と、２つの前記電極パッド列に挟まれた前記配線基板上の領域に形成される。 A probe card according to a fifth aspect of the present invention, in addition to the configuration described above, comprises two or more electrode pads arranged in alignment in the first direction, and two electrode pad rows adjacent to each other are formed by: and the reinforcing film includes an end side facing the other electrode pad row of the electrode pad belonging to one of the electrode pad rows and the one electrode pad row of the electrode pad belonging to the other electrode pad row. are formed on the two or more electrode pads and on the region on the wiring substrate sandwiched between the two electrode pad rows so as to straddle the edge side facing the .
　上記構成を採用することにより、互いに隣接する２つの電極パッド列にそれぞれ属する２以上の電極パッドを１つの補強膜で覆うことができ、電極パッドの剥がれをより効果的に防止することができる。 By adopting the above configuration, two or more electrode pads belonging to two electrode pad rows adjacent to each other can be covered with one reinforcing film, and peeling of the electrode pads can be more effectively prevented.
　第６の本発明の実施態様によるプローブカードは、上記構成に加えて、前記２つの電極パッド列に属する前記電極パッドに取り付けられる前記プローブは、検査対象物に接触するコンタクト部が、一列に整列して配置される。 In the probe card according to the sixth aspect of the present invention, in addition to the above configuration, the probes attached to the electrode pads belonging to the two electrode pad rows have contact portions that come into contact with the test object aligned in a row. are placed as follows.
　第７の本発明の実施態様によるプローブカードは、上記構成に加えて、前記補強膜が、塗布後の熱硬化により形成される。 In the probe card according to the seventh embodiment of the present invention, in addition to the above configuration, the reinforcing film is formed by thermal curing after coating.
　第８の本発明の実施態様によるプローブカードは、上記構成に加えて、前記補強膜が、ポリイミドからなる。 In the probe card according to the eighth embodiment of the present invention, in addition to the above configuration, the reinforcing film is made of polyimide.
　本発明によれば、プローブ用の電極パッドが配線基板から剥がれにくい信頼性の高いプローブカードを提供することができる。特に、狭ピッチで配列された電極パッドが配線基板から剥がれにくいプローブカードを提供することができる。また、プローブを交換可能にしつつ、電極パッドが配線基板から剥がれにくいプローブカードを提供することができる。 According to the present invention, it is possible to provide a highly reliable probe card in which electrode pads for probes are difficult to peel off from the wiring board. In particular, it is possible to provide a probe card in which the electrode pads arranged at a narrow pitch are less likely to come off from the wiring substrate. Further, it is possible to provide a probe card in which the electrode pads are difficult to peel off from the wiring board while the probes are replaceable.
本発明の実施の形態によるプローブカード１０の概略構成の一例を示した図である。It is a figure showing an example of a schematic structure of probe card 10 by an embodiment of the invention. 図１のＳＴ基板１０３にプローブ５を取り付ける様子を模式的に示した図である。2 is a diagram schematically showing how probes 5 are attached to the ST substrate 103 of FIG. 1. FIG. プローブ５が取り付けられたＳＴ基板１０３の下面を示した図である。4 is a diagram showing the bottom surface of the ST substrate 103 to which the probes 5 are attached; FIG. 図２の電極パッド３の拡大図である。3 is an enlarged view of an electrode pad 3 of FIG. 2; FIG. 図３のＳＴ基板１０３をＡ－Ａ切断線に沿って切断したときの断面の一例を示した図（Ａ－Ａ断面図）である。FIG. 4 is a view (AA cross-sectional view) showing an example of a cross section of the ST substrate 103 of FIG. 3 taken along the AA cutting line; 図３のＳＴ基板１０３をＡ－Ａ切断線に沿って切断したときの断面の他の例を示した図（Ａ－Ａ断面図）である。FIG. 4 is a view (AA cross-sectional view) showing another example of a cross section when the ST substrate 103 of FIG. 3 is cut along the AA cutting line;
　図１は、本発明の実施の形態によるプローブカード１０の概略構成の一例を示した図であり、プローブカード１０を鉛直面で切断したときの断面が示されている。プローブカード１０は、プローブ設置面を下に向けた状態でウエハプローバーに取り付けられ、ステージ２００上に載置された半導体ウエハ２０と対向し、ステージ２００を上下動することにより、プローブ５を半導体ウエハ２０上の電極２１に接触させることができる。 FIG. 1 is a diagram showing an example of a schematic configuration of a probe card 10 according to an embodiment of the present invention, showing a cross section when the probe card 10 is cut along a vertical plane. The probe card 10 is attached to the wafer prober with the probe installation surface facing downward, faces the semiconductor wafer 20 placed on the stage 200, and moves the probes 5 to the semiconductor wafer by moving the stage 200 up and down. It can be contacted with electrodes 21 on 20 .
　プローブカード１０は、メイン基板１００、補強板１０１、インターポーザー１０２、ＳＴ（Space Transformer）基板１０３及び２以上のプローブ５により構成される。 The probe card 10 is composed of a main substrate 100, a reinforcing plate 101, an interposer 102, an ST (Space Transformer) substrate 103, and two or more probes 5.
　メイン基板１００は、ウエハプローバーに着脱可能に取り付けられる配線基板であり、例えば、円板状のガラスエポキシ基板が用いられる。メイン基板１００は、下面の周縁部がウエハプローバーのカードホルダ２０１により支持され、略水平に配置される。 The main board 100 is a wiring board detachably attached to the wafer prober, and for example, a disk-shaped glass epoxy board is used. The main substrate 100 is supported by a card holder 201 of a wafer prober at the peripheral portion of the lower surface thereof, and is arranged substantially horizontally.
　メイン基板１００の上面の中央部には、メイン基板１００の歪みを抑制するための補強板１０１が取り付けられている。また、メイン基板１００の上面の周縁部には、テスター装置（不図示）の信号端子が接続される２以上の外部端子１１が設けられている。インターポーザー１０２は、メイン基板１００及びＳＴ基板１０３間に配置され、メイン基板１００の配線及びＳＴ基板１０３の配線を導通させる基板間の接続手段である。 A reinforcing plate 101 for suppressing distortion of the main board 100 is attached to the central portion of the upper surface of the main board 100 . Two or more external terminals 11 to which signal terminals of a tester device (not shown) are connected are provided on the periphery of the upper surface of the main board 100 . The interposer 102 is disposed between the main substrate 100 and the ST substrate 103, and is a connection means between the substrates that makes the wiring of the main substrate 100 and the wiring of the ST substrate 103 conductive.
　ＳＴ基板１０３は、絶縁性の多層配線基板、例えば、２以上のセラミック板を貼り合わせた積層板であり、電極ピッチを変換するために使用される。ＳＴ基板１０３は、基板ホルダ１２によりメイン基板１００に取り付けられ、略水平に配置される。基板ホルダ１２は、一端がメイン基板１００の下面に固定され、他端がＳＴ基板１０３の下面の周縁部を支持する。 The ST substrate 103 is an insulating multilayer wiring substrate, for example, a laminated plate in which two or more ceramic plates are pasted together, and is used to convert the electrode pitch. The ST board 103 is attached to the main board 100 by the board holder 12 and arranged substantially horizontally. The substrate holder 12 has one end fixed to the lower surface of the main substrate 100 and the other end supporting the peripheral portion of the lower surface of the ST substrate 103 .
　電極パッド３は、プローブ５を取り付けるための電極であり、ＳＴ基板１０３の下面には、多数の電極パッド３が形成されている。電極パッド３は、インターポーザー１０２を介して、メイン基板１００の外部端子１１と導通する。また、電極パッド３は、電気めっき法又はエッチング法を用いたフォトリソグラフィ処理により形成される導電性金属からなる薄膜である。 The electrode pads 3 are electrodes for attaching the probes 5 , and a large number of electrode pads 3 are formed on the lower surface of the ST substrate 103 . The electrode pads 3 are electrically connected to the external terminals 11 of the main board 100 via the interposer 102 . Moreover, the electrode pad 3 is a thin film made of a conductive metal formed by photolithography using an electroplating method or an etching method.
　プローブ５は、弾性変形可能な導電性金属、例えば、ＮｉＣｏ（ニッケルコバルト合金）からなり、半導体ウエハ２０上の電極２１に接触させるための先端を有する。プローブ５は、はんだ付けにより電極パッド３上に固定される。 The probe 5 is made of an elastically deformable conductive metal such as NiCo (nickel-cobalt alloy) and has a tip for contacting the electrode 21 on the semiconductor wafer 20 . The probes 5 are fixed on the electrode pads 3 by soldering.
　ステージ２００は、半導体ウエハ２０の載置台であり、水平面内における移動及び回転、並びに、上下方向の移動が可能である。ステージ２００を水平移動又は回転させることにより、プローブ５の先端と半導体ウエハ２０の電極２１との位置合わせを行うことができる。位置合わせ後、ステージ２００を上昇させることにより、半導体ウエハ２０をプローブカード１０に近づけ、プローブ５の先端を電極２１に接触させることができる。 The stage 200 is a mounting table for the semiconductor wafer 20, and is capable of moving and rotating in the horizontal plane and moving in the vertical direction. By horizontally moving or rotating the stage 200, the tip of the probe 5 and the electrode 21 of the semiconductor wafer 20 can be aligned. By raising the stage 200 after alignment, the semiconductor wafer 20 can be brought closer to the probe card 10 and the tips of the probes 5 can be brought into contact with the electrodes 21 .
　このとき、プローブ５及び電極２１の高さのばらつきを吸収し、全てのプローブ５を電極２１と接触させるために、オーバードライブが行われる。オーバードライブは、プローブ５の先端と電極２１とが接触し始める状態から、さらに所定の距離だけ両者を近づける処理である。オーバードライブにより、プローブ５及び電極２１の高さのばらつきに応じて各プローブ５が弾性変形し、全てのプローブ５を対応する電極２１に確実に接触させることができる。 At this time, overdrive is performed in order to absorb variations in height of the probes 5 and the electrodes 21 and bring all the probes 5 into contact with the electrodes 21 . Overdrive is a process in which the tip of the probe 5 and the electrode 21 are brought closer to each other by a predetermined distance from the state where they start to come into contact with each other. Due to the overdrive, each probe 5 is elastically deformed according to the height variation of the probes 5 and the electrodes 21 , and all the probes 5 can be reliably brought into contact with the corresponding electrodes 21 .
　図２は、図１のＳＴ基板１０３にプローブ５を取り付ける様子を模式的に示した図であり、図３は、プローブ５が取り付けられたＳＴ基板１０３の下面を示した図である。 FIG. 2 is a diagram schematically showing how the probes 5 are attached to the ST substrate 103 of FIG. 1, and FIG. 3 is a diagram showing the bottom surface of the ST substrate 103 to which the probes 5 are attached.
（１）電極パッド３
　ＳＴ基板１０３の下面には、多数の電極パッド３が形成され、１つの電極パッド３に対し１つのプローブ５が取り付けられている。ＳＴ基板１０３の下面には、絶縁性樹脂からなる絶縁膜が形成され、当該絶縁膜上に電極パッド３が形成される。電極パッド３の中央部には、プローブ５を取り付けるためのプローブ取付領域３００が設けられ、補強膜６は、プローブ取付領域３００と重複しない電極パッド３上の領域に形成されている。 (1) Electrode pad 3
A large number of electrode pads 3 are formed on the lower surface of the ST substrate 103 , and one probe 5 is attached to each electrode pad 3 . An insulating film made of an insulating resin is formed on the lower surface of the ST substrate 103, and the electrode pads 3 are formed on the insulating film. A probe mounting region 300 for mounting the probe 5 is provided in the central portion of the electrode pad 3 , and the reinforcing film 6 is formed in a region on the electrode pad 3 that does not overlap with the probe mounting region 300 .
（２）プローブ列５１
　多数のプローブ５は、図中において縦方向（第１方向）に整列して配置され、プローブ列５１を形成する。同一のプローブ列５１に属するプローブ５には、第１プローブ５Ａ及び第２プローブ５Ｂが含まれる。第１及び第２プローブ５Ａ，５Ｂは、互いに異なる形状を有し、プローブ列５１内において交互に配置されている。 (2) Probe row 51
A large number of probes 5 are aligned in the vertical direction (first direction) in the figure to form a probe row 51 . The probes 5 belonging to the same probe row 51 include a first probe 5A and a second probe 5B. The first and second probes 5A, 5B have shapes different from each other and are alternately arranged in the probe row 51. As shown in FIG.
（３）電極パッド列３１Ａ，３１Ｂ
　多数の電極パッド３は、プローブ５に対応して配置される。同一のプローブ列５１に対応する多数の電極パッド３は、第１電極パッド列３１Ａ及び第２電極パッド列３１Ｂを形成する。第１電極パッド列３１Ａは、第１プローブ５Ａに対応する電極パッド３を図中の縦方向（第１方向）に整列して配置することにより形成される。同様にして、第２電極パッド列３１Ｂは、第２プローブ５Ｂに対応する電極パッド３を図中の第１方向に整列して配置することにより形成される。第１及び第２電極パッド列３１Ａ，３１Ｂは、わずかな隙間を隔てて互いに隣接して配置され、互いに平行に延びる。 (3) Electrode pad rows 31A and 31B
A large number of electrode pads 3 are arranged corresponding to the probes 5 . A large number of electrode pads 3 corresponding to the same probe row 51 form a first electrode pad row 31A and a second electrode pad row 31B. The first electrode pad row 31A is formed by aligning the electrode pads 3 corresponding to the first probes 5A in the vertical direction (first direction) in the figure. Similarly, the second electrode pad row 31B is formed by aligning the electrode pads 3 corresponding to the second probes 5B in the first direction in the figure. The first and second electrode pad rows 31A and 31B are arranged adjacent to each other with a small gap therebetween and extend parallel to each other.
（４）プローブ５
　プローブ５は、コンタクト部５０１、ビーム部５０２及びベース部５０３を有する。コンタクト部５０１は、検査対象物の電極２１と接触するプローブ５の先端部であり、ビーム部５０２の一端に設けられている。ベース部５０３は、電極パッド３に接合する接合部５０４を有する支持部であり、ビーム部５０２の他端に設けられている。ビーム部５０２は、コンタクト部５０１及びベース部５０３を連結する連結部であり、ＳＴ基板１０３に沿って延びる細長い形状を有する。つまり、プローブ５は、片持ち梁構造を有し、コンタクト部５０１が電極２１から受ける荷重によりビーム部５０２が弾性変形することによってオーバードライブを実現している。 (4) Probe 5
The probe 5 has a contact portion 501 , a beam portion 502 and a base portion 503 . The contact portion 501 is the tip portion of the probe 5 that contacts the electrode 21 of the test object, and is provided at one end of the beam portion 502 . The base portion 503 is a support portion having a joint portion 504 joined to the electrode pad 3 and is provided at the other end of the beam portion 502 . The beam portion 502 is a connection portion that connects the contact portion 501 and the base portion 503 and has an elongated shape extending along the ST substrate 103 . That is, the probe 5 has a cantilever beam structure, and achieves overdrive by elastically deforming the beam portion 502 due to the load that the contact portion 501 receives from the electrode 21 .
　第１及び第２プローブ５Ａ，５Ｂは、コンタクト部５０１及びビーム部５０２が略同一の形状からなり、同一の荷重に対し、コンタクト部５０１が略同一の挙動を示すように構成される。一方、第１及び第２プローブ５Ａ，５Ｂは、ベース部５０３の形状が異なっており、水平面内におけるコンタクト部５０１から接合部５０４までの距離が異なる。同一のプローブ列５１に属するプローブ５Ａ，５Ｂは、コンタクト部５０１が、同一の直線上に整列し、接合部５０４が、異なる電極パッド列３１Ａ，３１Ｂ上に整列するように配置される。 The first and second probes 5A and 5B are configured so that the contact portion 501 and the beam portion 502 have substantially the same shape, and the contact portion 501 exhibits substantially the same behavior with respect to the same load. On the other hand, the first and second probes 5A and 5B have different shapes of base portions 503, and different distances from the contact portion 501 to the joint portion 504 in the horizontal plane. The probes 5A and 5B belonging to the same probe row 51 are arranged such that the contact portions 501 are aligned on the same straight line and the joint portions 504 are aligned on different electrode pad rows 31A and 31B.
（５）補強膜６
　補強膜６は、電極パッド３を補強するための絶縁性樹脂膜である。補強膜６は、電極パッド３の端辺３０１又は３０２を跨ぐように、電極パッド３及びその周辺のＳＴ基板１０３上に形成されている。このため、ＳＴ基板１０３に対し電極パッド３が強固に固着され、検査時に電極パッド３がＳＴ基板１０３から剥がれにくくなっている。 (5) Reinforcing film 6
The reinforcement film 6 is an insulating resin film for reinforcing the electrode pad 3 . The reinforcing film 6 is formed on the electrode pad 3 and the surrounding ST substrate 103 so as to straddle the edge 301 or 302 of the electrode pad 3 . Therefore, the electrode pads 3 are firmly fixed to the ST substrate 103, and the electrode pads 3 are less likely to come off from the ST substrate 103 during inspection.
　また、補強膜６は、プローブ取付領域３００を除く電極パッド３上の領域の少なくとも一部を覆うように形成されている。電極パッド３上の周辺領域を覆うように補強膜６を形成することにより、プローブ取付領域３００内には、補強膜６が形成されず、電極パッド３が露出している。このため、補強膜６の形成後であってもプローブ５の着脱が可能であり、例えば、プローブ５に不具合や損傷があった場合に、プローブ５を交換することができる。 Further, the reinforcing film 6 is formed so as to cover at least part of the area on the electrode pad 3 excluding the probe mounting area 300 . By forming the reinforcement film 6 so as to cover the peripheral region on the electrode pad 3 , the reinforcement film 6 is not formed in the probe mounting region 300 and the electrode pad 3 is exposed. Therefore, the probe 5 can be attached and detached even after the reinforcing film 6 is formed. For example, if the probe 5 is defective or damaged, the probe 5 can be replaced.
　また、補強膜６は、電極パッド列３１Ａ又は３１Ｂに沿って延びる帯状の形状を有し、当該電極パッド列３１Ａ又は３１Ｂに属する２以上の電極パッド３上に形成される。このため、電極パッド３ごとに補強膜６を形成する場合に比べ、ＳＴ基板１０３に対し電極パッド３をより強固に固着し、電極パッド３が剥がれにくくなっている。 Further, the reinforcing film 6 has a strip shape extending along the electrode pad row 31A or 31B, and is formed on two or more electrode pads 3 belonging to the electrode pad row 31A or 31B. Therefore, the electrode pads 3 are more strongly fixed to the ST substrate 103 and the electrode pads 3 are less likely to come off, compared to the case where the reinforcing film 6 is formed for each electrode pad 3 .
　また、電極パッド３は、互いに対向する一対の端辺３０１，３０２を有し、一対の端辺３０１，３０２をそれぞれ跨ぐように２つの補強膜６が形成され、プローブ取付領域３００を挟んで対向する電極パッド３上の２つの領域がそれぞれ覆われている。このため、一対の端辺３０１，３０２の一方のみに補強膜６を形成する場合に比べ、ＳＴ基板１０３に対し電極パッド３をより強固に固着し、電極パッド３が剥がれにくくなっている。 Further, the electrode pad 3 has a pair of edges 301 and 302 facing each other, and two reinforcing films 6 are formed so as to straddle the pair of edges 301 and 302, respectively, facing each other with the probe mounting region 300 interposed therebetween. Two areas on the electrode pads 3 to be covered are respectively covered. Therefore, the electrode pad 3 is more firmly fixed to the ST substrate 103 and is less likely to come off, compared to the case where the reinforcing film 6 is formed only on one of the pair of edges 301 and 302 .
　また、補強膜６が形成される一対の端辺３０１，３０２は、当該電極パッド３に対応するプローブ５のビーム部５０２の延伸方向において対向する一対の端辺であることが望ましい。図中では、ビーム部５０２の延伸方向が横方向（第２方向）であるため、電極パッド３の左右の端辺３０１，３０２をそれぞれ跨ぐように２つの補強膜６が形成されている。 Also, the pair of edges 301 and 302 on which the reinforcing film 6 is formed is desirably a pair of edges facing each other in the extension direction of the beam portion 502 of the probe 5 corresponding to the electrode pad 3 . In the drawing, since the extension direction of the beam portion 502 is the horizontal direction (second direction), two reinforcing films 6 are formed so as to straddle the left and right edges 301 and 302 of the electrode pad 3 .
　プローブ５は、片持ち梁構造を有するため、検査時にコンタクト部５０１が検査対象物に接触すれば、ベース部５０３にはコンタクト部５０１側に傾ける方向の力が作用する。このとき、電極パッド３上の領域のうち、プローブ取付領域３００を挟んでコンタクト部５０１とは反対側の領域において、電極パッド３をＳＴ基板１０３から剥がすような応力が発生する。このため、略矩形の電極パッド３が有する４つの端辺のうち、ビーム部５０２の延伸方向において対向する一対の端辺３０１，３０２をそれぞれ跨ぐように２つの補強膜６を形成することにより、電極パッド３が剥がれるのを効果的に抑制することができる。 Since the probe 5 has a cantilever beam structure, if the contact portion 501 contacts the test object during inspection, a force acts on the base portion 503 in a direction that tilts the contact portion 501 side. At this time, a stress is generated in a region on the electrode pad 3 opposite to the contact portion 501 with the probe mounting region 300 interposed therebetween, such that the electrode pad 3 is peeled off from the ST substrate 103 . Therefore, by forming two reinforcing films 6 so as to straddle a pair of opposite sides 301 and 302 in the extending direction of the beam portion 502 among the four sides of the substantially rectangular electrode pad 3, It is possible to effectively suppress peeling of the electrode pad 3 .
　なお、電極パッド３の対向する一対の端辺３０１，３０２の一方に補強膜６が形成され、他方には補強膜６が形成されないように構成することもできる。一対の端辺３０１，３０２のいずれか一方のみに補強膜６を形成する場合、プローブ取付領域３００を挟んでコンタクト部５０１とは反対側の端辺３０１、つまり、コンタクト部５０１から最も遠くに位置する電極パッド３の端辺３０１を跨ぐように補強膜６を形成することにより、電極パッド３が剥がれるのを効果的に抑制することができる。 It should be noted that it is also possible to configure such that the reinforcing film 6 is formed on one of the pair of opposing edges 301 and 302 of the electrode pad 3 and the reinforcing film 6 is not formed on the other. When the reinforcing film 6 is formed only on one of the pair of edges 301 and 302, the edge 301 opposite to the contact portion 501 across the probe mounting region 300, that is, the edge 301 located farthest from the contact portion 501. By forming the reinforcing film 6 so as to straddle the edge 301 of the electrode pad 3 , it is possible to effectively prevent the electrode pad 3 from coming off.
　さらに、電極パッド列３１Ａ及び３１Ｂ間に形成される補強膜６０は、電極パッド列３１Ａに属する電極パッド３上の領域と、電極パッド列３１Ｂに属する電極パッド３上の領域の両方を覆うように形成される。つまり、補強膜６０は、一方の電極パッド列３１Ａに属する電極パッド３の端辺のうち、他方の電極パッド列３１Ｂと対向する端辺３０２と、前記他方の電極パッド列３１Ｂに属する電極パッド３の端辺のうち、前記一方の電極パッド列３１Ａと対向する端辺３０１とをともに跨ぐように形成される。 Furthermore, the reinforcing film 60 formed between the electrode pad rows 31A and 31B covers both the region on the electrode pads 3 belonging to the electrode pad row 31A and the region on the electrode pads 3 belonging to the electrode pad row 31B. It is formed. In other words, the reinforcing film 60 is formed of the edge 302 of the electrode pads 3 belonging to one electrode pad row 31A facing the other electrode pad row 31B and the electrode pad 3 belonging to the other electrode pad row 31B. are formed so as to straddle both the one electrode pad row 31A and the facing edge 301, among the edge sides.
　電極パッド列３１Ａ，３１Ｂは、互いに近接して形成され、両者間には、狭い領域しか残されていない。このため、異なる電極パッド列３１Ａ，３１Ｂにそれぞれ属する２つの電極パッド３をともに覆う１つの補強膜６０を形成することにより、狭い領域であっても、補強膜６を形成し、電極パッド３が剥がれるのを抑制することができる。 The electrode pad rows 31A and 31B are formed close to each other, leaving only a narrow region between them. Therefore, by forming one reinforcing film 60 covering both the two electrode pads 3 belonging to different electrode pad rows 31A and 31B, the reinforcing film 6 can be formed even in a narrow area, and the electrode pads 3 can be It can prevent peeling.
　図４は、電極パッド３の拡大図であり、図２の一部が拡大して示されている。電極パッド３は、４つの端辺３０１～３０４で構成される略矩形であって、第２方向を長手方向とする細長い形状からなる。第２方向において対向する一対の端辺３０１，３０２は補強膜６で覆われている一方、第１方向において対向する一対の端辺３０３，３０４は、両端近傍を除き、補強膜６で覆われていない。 FIG. 4 is an enlarged view of the electrode pad 3, showing an enlarged part of FIG. The electrode pad 3 has a substantially rectangular shape with four edges 301 to 304 and has an elongated shape with the second direction as the longitudinal direction. A pair of edges 301 and 302 facing each other in the second direction are covered with the reinforcement film 6, while a pair of edges 303 and 304 facing each other in the first direction are covered with the reinforcement film 6 except near both ends. not
　プローブ取付領域３００は、電極パッド３の略中央に設けられ、横方向を長手方向とする細長い矩形の領域である。距離Ｌ１～Ｌ４は、プローブ取付領域３００から端辺３０１～３０４までの長さである。第２方向において対向する一対の端辺３０１，３０２に補強膜６を形成し、第２方向の距離Ｌ１，Ｌ２を第１方向の距離Ｌ３，Ｌ４よりも長くすることにより、補強膜６を形成するための所望の領域を電極パッド３上に確保することができる。また、第１方向において対向する一対の端辺３０３，３０４に補強膜６を形成せず、第１方向の距離Ｌ３，Ｌ４を第２方向の距離Ｌ１，Ｌ２をよりも短く、望ましくはゼロにすることにより、電極パッド列３１Ａ，３１Ｂ内における電極パッド３の配列ピッチを狭小化することができる。 The probe mounting area 300 is provided substantially in the center of the electrode pad 3 and is an elongated rectangular area whose longitudinal direction is the lateral direction. The distances L1-L4 are the lengths from the probe mounting area 300 to the edges 301-304. A reinforcing film 6 is formed on a pair of edges 301 and 302 facing each other in the second direction, and the distances L1 and L2 in the second direction are longer than the distances L3 and L4 in the first direction. It is possible to secure a desired area on the electrode pad 3 for this purpose. Further, the reinforcing film 6 is not formed on the pair of edges 303 and 304 facing each other in the first direction, and the distances L3 and L4 in the first direction are set shorter than the distances L1 and L2 in the second direction, preferably zero. By doing so, it is possible to narrow the arrangement pitch of the electrode pads 3 in the electrode pad rows 31A and 31B.
　図５は、図３のＳＴ基板１０３をＡ－Ａ切断線に沿って切断したときの断面の一例を示した図（Ａ－Ａ断面図）である。なお、図５は、鉛直下方向が上になるように示した図であり、図１とは上下方向が逆になっている。 FIG. 5 is a diagram (AA cross-sectional view) showing an example of a cross section of the ST substrate 103 of FIG. 3 cut along the AA cutting line. Note that FIG. 5 is a diagram showing the vertically downward direction upward, and the vertical direction is opposite to that in FIG. 1 .
　ＳＴ基板１０３は、２以上のセラミック基板７０１，７０２を積層した積層板上に１又は２以上の絶縁膜７０３，７０４が積層形成されている。電極パッド３は、最も外側の絶縁膜７０４上に形成される。絶縁膜７０３，７０４には、ポリイミドなどの絶縁性樹脂が用いられ、電極パッド３には、銅などの導電性金属が用いられる。また、絶縁膜７０３，７０４は、エッチング法を用いたフォトリソグラフィ処理により形成される。 The ST substrate 103 is formed by laminating one or more insulating films 703 and 704 on a laminated plate in which two or more ceramic substrates 701 and 702 are laminated. Electrode pads 3 are formed on the outermost insulating film 704 . An insulating resin such as polyimide is used for the insulating films 703 and 704 , and a conductive metal such as copper is used for the electrode pad 3 . Also, the insulating films 703 and 704 are formed by photolithography processing using an etching method.
　ＳＴ基板１０３内には、配線パターン７１やスルーホール７２が設けられている。電極パッド３は、これらを介して、ＳＴ基板１０３の反対側の主面、つまり、下面（図１では上面）に設けられた電極と導通する。 A wiring pattern 71 and a through hole 72 are provided in the ST substrate 103 . Through these electrodes, the electrode pads 3 are electrically connected to electrodes provided on the main surface opposite to the ST substrate 103, ie, the lower surface (upper surface in FIG. 1).
　プローブ５Ａ，５Ｂは、同じプローブ列５１に属するプローブであり、コンタクト部５０１及びビーム部５０２の形状及び位置が重複しているが、ベース部５０３の形状が異なり、接合部５０４の位置が異なっている。 The probes 5A and 5B belong to the same probe row 51, and the contact portion 501 and the beam portion 502 have the same shape and position, but the base portion 503 has a different shape and the joint portion 504 has a different position. there is
　補強膜６は、電極パッド３の対向する一対の端辺３０１，３０２を跨ぐように、端辺３０１，３０２に隣接する電極パッド３上の領域と、電極パッド３に隣接する絶縁膜７０４上の領域に形成される。補強膜６には、ポリイミドなどの絶縁性樹脂が用いられ、エッチング法を用いたフォトリソグラフィ処理により形成される。また、補強膜６は、塗布後に熱硬化させることにより形成される。 The reinforcing film 6 is formed on the region on the electrode pad 3 adjacent to the edges 301 and 302 and on the insulating film 704 adjacent to the electrode pad 3 so as to straddle the pair of opposing edges 301 and 302 of the electrode pad 3 . formed in the area. An insulating resin such as polyimide is used for the reinforcement film 6, and is formed by photolithography processing using an etching method. Further, the reinforcing film 6 is formed by thermally curing after application.
　図６は、図３のＳＴ基板１０３をＡ－Ａ切断線に沿って切断したときの断面の他の例を示した図（Ａ－Ａ断面図）である。図５の断面と比較すれば、電極パッド３が、絶縁膜７０５に埋め込まれている点で異なる。絶縁膜７０５は、絶縁膜７０３，７０４と同様、ポリイミドなどの絶縁性樹脂からなる薄膜であり、フォトリソグラフィ技術を用いて形成される。水平面内において、電極パッド３は、絶縁膜７０５により取り囲まれており、電極パッド３の側面は、絶縁膜７０５の側面と密接している。このため、図５の場合に比べて、電極パッド３は、より剥がれにくくなっている。 FIG. 6 is a diagram (AA cross-sectional view) showing another example of a cross section of the ST substrate 103 of FIG. 3 cut along the AA cutting line. Compared with the cross section of FIG. 5, the difference is that the electrode pads 3 are embedded in the insulating film 705 . The insulating film 705, like the insulating films 703 and 704, is a thin film made of an insulating resin such as polyimide, and is formed using a photolithographic technique. In the horizontal plane, the electrode pads 3 are surrounded by the insulating film 705 , and the side surfaces of the electrode pads 3 are in close contact with the side surfaces of the insulating film 705 . Therefore, the electrode pads 3 are more difficult to peel off than in the case of FIG.
　補強膜６は、電極パッドの端辺３０１，３０２を跨ぐように、端辺３０１，３０２に隣接する電極パッド３上の領域と、電極パッド３に隣接する絶縁膜７０５上の領域に形成されている。 The reinforcing film 6 is formed on the regions on the electrode pads 3 adjacent to the edges 301 and 302 and on the region on the insulating film 705 adjacent to the electrode pads 3 so as to straddle the edges 301 and 302 of the electrode pads. there is
　なお、上記実施の形態では、電極パッド列３１Ａ，３１Ｂ及び補強膜６の延伸方向である第１方向と、電極パッド３の長手方向である第２方向とが、互いに直交する場合の例について説明したが、両者は交差する方向であればよく、直交していなくてもよい。また、ビーム部５０２の延伸方向は、第２方向と一致していることが望ましいが、一致していなくてもよい。 In the above embodiment, an example in which the first direction, which is the extending direction of the electrode pad rows 31A and 31B and the reinforcing film 6, and the second direction, which is the longitudinal direction of the electrode pads 3, are orthogonal to each other will be described. However, the two may be in directions intersecting each other, and may not be orthogonal to each other. Moreover, although it is desirable that the extending direction of the beam portion 502 matches the second direction, it does not have to match.
　また、上記実施の形態では、プローブ列５１が、形状の異なる２種類のプローブ５Ａ，５Ｂにより構成され、２つの電極パッド列３１Ａ，３１Ｂに対応する場合の例について説明したが、本発明は、この様な場合のみに限定されない。例えば、プローブ列５１が、同一形状のプローブ５Ａのみにより構成され、１つの電極パッド列３１Ａのみに対応する場合にも本発明を適用することができる。この場合、ＳＴ基板１０３には、２以上の電極パッド３が配置され、２以上のプローブ５が取り付けられる。 Further, in the above-described embodiment, an example has been described in which the probe row 51 is composed of two types of probes 5A and 5B having different shapes and corresponds to the two electrode pad rows 31A and 31B. It is not limited only to such a case. For example, the present invention can also be applied to a case where the probe row 51 is composed only of probes 5A of the same shape and corresponds to only one electrode pad row 31A. In this case, two or more electrode pads 3 are arranged on the ST substrate 103, and two or more probes 5 are attached.
　また、上記実施の形態では、プローブ列５１が多数のプローブ５により構成され、電極パッド列３１Ａ，３１Ｂが、それぞれ多数の電極パッド３により構成される場合の例について説明したが、本発明は、この様な場合のみに限定されない。例えば、プローブ列５１が２以上のプローブ５により構成され、電極パッド列３１Ａ，３１Ｂがそれぞれ２以上の電極パッド３により構成される場合にも本発明を適用することができる。 Further, in the above-described embodiment, an example has been described in which the probe row 51 is made up of a large number of probes 5 and the electrode pad rows 31A and 31B are each made up of a large number of electrode pads 3. It is not limited only to such a case. For example, the present invention can also be applied when the probe row 51 is composed of two or more probes 5 and each of the electrode pad rows 31A and 31B is composed of two or more electrode pads 3 .
１０　　　　プローブカード
１１　　　　外部端子
１２　　　　基板ホルダ
１００　　　メイン基板
１０１　　　補強板
１０２　　　インターポーザー
１０３　　　ＳＴ基板
２０　　　　半導体ウエハ
２１　　　　電極
２００　　　ステージ
２０１　　　カードホルダ
３　　　　　電極パッド
３００　　　プローブ取付領域
３０１，３０２　　端辺
３１Ａ，３１Ｂ　　電極パッド列
５、５Ａ，５Ｂ　　プローブ
５０１　　　コンタクト部
５０２　　　ビーム部
５０３　　　ベース部
５０４　　　接合部
５１　　　　プローブ列
６，６０　　補強膜
７１　　　　配線パターン
７２　　　　スルーホール
７０１，７０２　　セラミック基板
７０３～７０５　　絶縁膜 10 Probe card 11 External terminal 12 Substrate holder 100 Main substrate 101 Reinforcing plate 102 Interposer 103 ST substrate 20 Semiconductor wafer 21 Electrode 200 Stage 201 Card holder 3 Electrode pad 300 Probe mounting regions 301, 302 Edges 31A, 31B Electrode pad row 5 , 5A, 5B probe 501 contact portion 502 beam portion 503 base portion 504 joint portion 51 probe rows 6, 60 reinforcing film 71 wiring pattern 72 through holes 701, 702 ceramic substrates 703 to 705 insulating film

Claims (8)

  1. 　２以上の電極パッドが設けられた配線基板と、
    　２以上の前記電極パッドにそれぞれ取り付けられた２以上のプローブと、
    　前記電極パッドの端辺を跨ぐように、前記電極パッド上及び前記配線基板上に形成され、前記電極パッドの一部を覆う補強膜と、を備え、
    　前記電極パッドは、前記プローブを取り付けるためのプローブ取付領域を有し、
    　前記補強膜は、前記プローブ取付領域を除く前記電極パッド上の領域の少なくとも一部に形成され、
    　２以上の前記電極パッドは、第１方向に整列して配置され、１つの電極パッド列を形成し、
    　前記補強膜は、前記第１方向に延びる帯状の形状からなり、２以上の前記電極パッド上に形成されることを特徴とするプローブカード。     a wiring board provided with two or more electrode pads;
    two or more probes respectively attached to the two or more electrode pads;
    a reinforcing film formed on the electrode pad and the wiring substrate so as to straddle the edge of the electrode pad and covering a part of the electrode pad;
    The electrode pad has a probe mounting area for mounting the probe,
    the reinforcing film is formed on at least part of the area on the electrode pad excluding the probe mounting area;
    two or more of the electrode pads are aligned in a first direction to form one electrode pad row;
    The probe card, wherein the reinforcement film has a belt-like shape extending in the first direction and is formed on the two or more electrode pads.
  2. 　前記プローブが、前記電極パッドに取り付けられるベース部と、検査対象物に接触するコンタクト部と、前記ベース部及び前記コンタクト部を連結し、前記配線基板に沿って延びるビーム部と、を有し、
    　前記補強膜が、前記プローブ取付領域を挟んで前記コンタクト部とは反対側に位置する前記端辺を跨ぐように形成されることを特徴とする請求項１に記載のプローブカード。     The probe has a base portion attached to the electrode pad, a contact portion that contacts an object to be inspected, and a beam portion that connects the base portion and the contact portion and extends along the wiring substrate,
    2. The probe card according to claim 1, wherein the reinforcing film is formed so as to straddle the edge located on the side opposite to the contact portion with the probe mounting area interposed therebetween.
  3. 　前記電極パッドが、前記第１方向と交差する第２方向を長手方向とする細長い形状を有し、
    　前記補強膜が、前記第２方向において前記プローブ取付領域を挟んで対向する前記電極パッドの一対の端辺の一方を跨ぐように形成され、
    　前記プローブ取付領域から前記第１方向において対向する前記電極パッドの一対の端辺までの距離が、前記プローブ取付領域から前記補強膜が形成される前記端辺までの距離よりも短いことを特徴とする請求項１に記載のプローブカード。     The electrode pad has an elongated shape whose longitudinal direction is a second direction that intersects with the first direction,
    The reinforcing film is formed so as to straddle one of a pair of edge sides of the electrode pad facing each other across the probe mounting region in the second direction,
    A distance from the probe mounting region to a pair of edges of the electrode pad facing each other in the first direction is shorter than a distance from the probe mounting region to the edge on which the reinforcing film is formed. The probe card according to claim 1.
  4. 　前記一対の端辺をそれぞれ跨ぐ２つの前記補強膜を備えることを特徴とする請求項３に記載のプローブカード。 4. The probe card according to claim 3, comprising two reinforcing films respectively straddling the pair of edges.
  5. 　前記第１方向に整列して配置された２以上の電極パッドによりそれぞれ構成され、互いに隣接する２つの前記電極パッド列を備え、
    　前記補強膜が、一方の前記電極パッド列に属する前記電極パッドの他方の前記電極パッド列と対向する端辺と、前記他方の電極パッド列に属する前記電極パッドの前記一方の電極パッド列と対向する端辺とをそれぞれ跨ぐように、２以上の前記電極パッド上と、２つの前記電極パッド列に挟まれた前記配線基板上の領域に形成されることを特徴とする請求項１に記載のプローブカード。     comprising two electrode pad rows adjacent to each other, each composed of two or more electrode pads arranged in alignment in the first direction;
    The reinforcing film faces the end side of the electrode pad belonging to one of the electrode pad rows facing the other electrode pad row and the electrode pad belonging to the other electrode pad row facing the one electrode pad row. 2. The wiring board according to claim 1, wherein the electrode pads are formed on two or more of the electrode pads and on a region on the wiring substrate sandwiched between the two electrode pad rows so as to straddle the edge of the wiring board. probe card.
  6. 　前記２つの電極パッド列に属する前記電極パッドに取り付けられる前記プローブは、検査対象物に接触するコンタクト部が、一列に整列して配置されることを特徴とする請求項５に記載のプローブカード。 6. The probe card according to claim 5, wherein the probes attached to the electrode pads belonging to the two electrode pad rows have contact portions that come into contact with the test object arranged in a row.
  7. 　前記補強膜は、塗布後の熱硬化により形成されることを特徴とする請求項１～６のいずれかに記載のプローブカード。 The probe card according to any one of claims 1 to 6, wherein the reinforcing film is formed by heat curing after application.
  8. 　前記補強膜は、ポリイミドからなることを特徴とする請求項１～７のいずれかに記載のプローブカード。 The probe card according to any one of claims 1 to 7, wherein the reinforcing film is made of polyimide.
PCT/JP2021/013787 2021-03-31 2021-03-31 Probe card WO2022208708A1 (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002257860A (en) * 2001-02-28 2002-09-11 Ibiden Co Ltd Probe card
JP2007534947A (en) * 2004-04-26 2007-11-29 フォームファクター， インコーポレイテッド How to create a robust mechanical structure on a substrate surface
US20080061808A1 (en) * 2006-09-12 2008-03-13 Sammy Mok Compliance partitioning in testing of integrated circuits
JP2011043441A (en) * 2009-08-21 2011-03-03 Japan Electronic Materials Corp Probe card
JP2012021826A (en) * 2010-07-13 2012-02-02 Japan Electronic Materials Corp Electrical connection device and manufacturing method thereof
JP2013083635A (en) * 2011-10-06 2013-05-09 Samsung Electro-Mechanics Co Ltd Probe card and manufacturing method thereof
JP2013083620A (en) * 2011-10-12 2013-05-09 Samsung Electro-Mechanics Co Ltd Probe card and manufacturing method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002257860A (en) * 2001-02-28 2002-09-11 Ibiden Co Ltd Probe card
JP2007534947A (en) * 2004-04-26 2007-11-29 フォームファクター， インコーポレイテッド How to create a robust mechanical structure on a substrate surface
US20080061808A1 (en) * 2006-09-12 2008-03-13 Sammy Mok Compliance partitioning in testing of integrated circuits
JP2011043441A (en) * 2009-08-21 2011-03-03 Japan Electronic Materials Corp Probe card
JP2012021826A (en) * 2010-07-13 2012-02-02 Japan Electronic Materials Corp Electrical connection device and manufacturing method thereof
JP2013083635A (en) * 2011-10-06 2013-05-09 Samsung Electro-Mechanics Co Ltd Probe card and manufacturing method thereof
JP2013083620A (en) * 2011-10-12 2013-05-09 Samsung Electro-Mechanics Co Ltd Probe card and manufacturing method thereof

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