WO2022208708A1 - Carte sonde - Google Patents

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Publication number
WO2022208708A1
WO2022208708A1 PCT/JP2021/013787 JP2021013787W WO2022208708A1 WO 2022208708 A1 WO2022208708 A1 WO 2022208708A1 JP 2021013787 W JP2021013787 W JP 2021013787W WO 2022208708 A1 WO2022208708 A1 WO 2022208708A1
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WO
WIPO (PCT)
Prior art keywords
electrode pad
probe
electrode
electrode pads
reinforcing film
Prior art date
Application number
PCT/JP2021/013787
Other languages
English (en)
Japanese (ja)
Inventor
敬 吉田
Original Assignee
日本電子材料株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電子材料株式会社 filed Critical 日本電子材料株式会社
Priority to PCT/JP2021/013787 priority Critical patent/WO2022208708A1/fr
Priority to TW111112679A priority patent/TW202242422A/zh
Publication of WO2022208708A1 publication Critical patent/WO2022208708A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes

Definitions

  • the present invention relates to a probe card, and more particularly to improvement of a probe card in which probes are attached to electrode pads on a wiring board.
  • a probe card is an inspection device used for inspecting the electrical characteristics of a semiconductor device formed on a semiconductor wafer. It is provided on the wiring board. A semiconductor device is tested by bringing a semiconductor wafer close to a probe card and bringing the tips of the probes into contact with electrodes on the semiconductor wafer, thereby connecting a tester device to the semiconductor device through the probes and the wiring board.
  • a probe card has electrode pads formed on a wiring substrate, and probes are attached to the electrode pads.
  • the probe elastically deforms due to the load applied from the inspection object each time it contacts the inspection object. At this time, the load applied from the test object to the probe is transmitted to the electrode pad via the probe. Since the probe is firmly joined to the electrode pad by soldering or the like, it is relatively difficult for the probe to come off from the electrode pad.
  • the size of the electrode pads is becoming smaller, and the bonding strength of the electrode pads to the wiring substrate is insufficient, and the electrode pads are peeled off from the wiring substrate due to the elastic deformation of the probes during inspection.
  • a problem has arisen.
  • the probes are soldered onto the electrode pads to form a strong metal-to-metal bond.
  • the electrode pads are metal films deposited on the resin film of the wiring substrate, the bonding force between the electrode pads and the wiring substrate is weaker than the bonding force between the probes and the electrode pads. Therefore, as the size of the electrode pads becomes smaller, the problem arises that the electrode pads are peeled off from the wiring substrate during inspection, making it impossible to carry out appropriate inspections.
  • Patent Document 1 In order to prevent the electrode pads from coming off, it has been conventionally proposed to improve the adhesion force between the electrode pads and the wiring board by embedding the electrode pads inside the wiring board (for example, Patent Document 1, 2).
  • Patent Document 1 an electrode pad and a polymer layer are sequentially formed on a wiring substrate, and after the electrode pad is embedded in the polymer layer, the electrode pad is exposed by polishing. For this reason, the side surfaces of the electrode pads are surrounded by the polymer layer, and in addition to the bonding force on the bottom surface, the bonding force on the side surfaces is generated, thereby suppressing the electrode pads from being peeled off from the wiring board.
  • a metal seed film is formed on a wiring substrate, a metal plating layer is deposited on a part of the metal seed film excluding a peripheral portion, and these layers are embedded in an adhesive material.
  • the upper surface of the metal plating layer is exposed by .
  • the side surfaces of the metal seed film and the metal plating layer are surrounded by the adhesive material, and the peripheral edge portion of the upper surface of the metal seed film is covered with the adhesive material, thereby suppressing the electrode pad from being peeled off from the wiring substrate.
  • JP 2016-195235 A Japanese Patent Publication No. 2007-534947 JP 2011-43441 A
  • the metal plating layer is formed by forming openings in a mask layer covering the metal seed film and depositing a metal material in the openings.
  • the upper surface of the metal plating layer formed in this way becomes the probe mounting area. Therefore, when the pitch of the electrode pads is narrowed and the width of the electrode pads is narrowed, high opening accuracy is required to cover the peripheral portion on the metal seed film with the adhesive material while securing the probe mounting area. Therefore, there is a problem that narrowing of the pitch is restricted by aperture accuracy.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a highly reliable probe card in which electrode pads for probes are difficult to peel off from the wiring substrate.
  • Another object of the present invention is to provide a probe card in which the electrode pads are difficult to peel off from the wiring board while the probes are replaceable.
  • a probe card comprises a wiring substrate provided with two or more electrode pads, two or more probes attached to the two or more electrode pads, and edges of the electrode pads. a reinforcing film formed on the electrode pad and the wiring substrate so as to straddle the electrode pad and covering a part of the electrode pad.
  • the electrode pad has a probe mounting area for mounting the probe, the reinforcing film is formed on at least part of the area on the electrode pad excluding the probe mounting area, and the two or more electrode pads are , arranged in alignment in a first direction to form one electrode pad row, and the reinforcing film is formed in a band-like shape extending in the first direction and formed on two or more of the electrode pads.
  • the reinforcing film is formed so as to straddle the edge of the electrode pad, and it is possible to prevent the electrode pad from peeling off from the wiring board.
  • the electrode pads are arranged at a narrow pitch, and the width of the electrode pads in the first direction is narrow, the probe mounting region can be expanded. can be easily secured.
  • the reinforcement film by making the reinforcement film into a belt-like shape extending along the electrode pad rows, it is possible to prevent the electrode pads from being peeled off while securing the probe mounting area. Furthermore, since no reinforcing film is formed on the probe, it becomes possible to replace the probe when it is defective or damaged when it is attached to the electrode pad.
  • a probe card in addition to the configuration described above, includes: a base portion to which the probe is attached to the electrode pad; a contact portion to contact an object to be inspected; the base portion and the contact portion; and a beam portion extending along the wiring board, wherein the reinforcing film is formed to straddle the edge located on the opposite side of the probe mounting region from the contact portion. be.
  • the reinforcing film is formed so as to straddle the edge where stress tends to peel off the electrode pad from the wiring board due to the elastic deformation of the probe, thereby more effectively preventing the electrode pad from peeling off. be able to.
  • a probe card in addition to the above configuration, has an elongated shape in which the electrode pad has a longitudinal direction in a second direction that intersects with the first direction, and the reinforcing film includes: A pair of ends of the electrode pads which are formed to straddle one of a pair of edge sides of the electrode pad facing each other across the probe mounting region in the second direction and which face each other in the first direction from the probe mounting region.
  • the distance to a side is configured to be shorter than the distance from the probe mounting area to the edge on which the reinforcing film is formed.
  • the probe card according to the fourth aspect of the present invention includes, in addition to the above configuration, two reinforcing films respectively straddling the pair of edges.
  • a probe card in addition to the configuration described above, comprises two or more electrode pads arranged in alignment in the first direction, and two electrode pad rows adjacent to each other are formed by: and the reinforcing film includes an end side facing the other electrode pad row of the electrode pad belonging to one of the electrode pad rows and the one electrode pad row of the electrode pad belonging to the other electrode pad row. are formed on the two or more electrode pads and on the region on the wiring substrate sandwiched between the two electrode pad rows so as to straddle the edge side facing the .
  • two or more electrode pads belonging to two electrode pad rows adjacent to each other can be covered with one reinforcing film, and peeling of the electrode pads can be more effectively prevented.
  • the probes attached to the electrode pads belonging to the two electrode pad rows have contact portions that come into contact with the test object aligned in a row. are placed as follows.
  • the reinforcing film is formed by thermal curing after coating.
  • the reinforcing film is made of polyimide.
  • the present invention it is possible to provide a highly reliable probe card in which electrode pads for probes are difficult to peel off from the wiring board.
  • a probe card in which the electrode pads arranged at a narrow pitch are less likely to come off from the wiring substrate.
  • FIG. 2 is a diagram schematically showing how probes 5 are attached to the ST substrate 103 of FIG. 1.
  • FIG. 4 is a diagram showing the bottom surface of the ST substrate 103 to which the probes 5 are attached;
  • FIG. 3 is an enlarged view of an electrode pad 3 of FIG. 2;
  • FIG. 4 is a view (AA cross-sectional view) showing an example of a cross section of the ST substrate 103 of FIG. 3 taken along the AA cutting line;
  • FIG. 4 is a view (AA cross-sectional view) showing another example of a cross section when the ST substrate 103 of FIG. 3 is cut along the AA cutting line;
  • FIG. 1 is a diagram showing an example of a schematic configuration of a probe card 10 according to an embodiment of the present invention, showing a cross section when the probe card 10 is cut along a vertical plane.
  • the probe card 10 is attached to the wafer prober with the probe installation surface facing downward, faces the semiconductor wafer 20 placed on the stage 200, and moves the probes 5 to the semiconductor wafer by moving the stage 200 up and down. It can be contacted with electrodes 21 on 20 .
  • the probe card 10 is composed of a main substrate 100, a reinforcing plate 101, an interposer 102, an ST (Space Transformer) substrate 103, and two or more probes 5.
  • the main board 100 is a wiring board detachably attached to the wafer prober, and for example, a disk-shaped glass epoxy board is used.
  • the main substrate 100 is supported by a card holder 201 of a wafer prober at the peripheral portion of the lower surface thereof, and is arranged substantially horizontally.
  • a reinforcing plate 101 for suppressing distortion of the main board 100 is attached to the central portion of the upper surface of the main board 100 .
  • Two or more external terminals 11 to which signal terminals of a tester device (not shown) are connected are provided on the periphery of the upper surface of the main board 100 .
  • the interposer 102 is disposed between the main substrate 100 and the ST substrate 103, and is a connection means between the substrates that makes the wiring of the main substrate 100 and the wiring of the ST substrate 103 conductive.
  • the ST substrate 103 is an insulating multilayer wiring substrate, for example, a laminated plate in which two or more ceramic plates are pasted together, and is used to convert the electrode pitch.
  • the ST board 103 is attached to the main board 100 by the board holder 12 and arranged substantially horizontally.
  • the substrate holder 12 has one end fixed to the lower surface of the main substrate 100 and the other end supporting the peripheral portion of the lower surface of the ST substrate 103 .
  • the electrode pads 3 are electrodes for attaching the probes 5 , and a large number of electrode pads 3 are formed on the lower surface of the ST substrate 103 .
  • the electrode pads 3 are electrically connected to the external terminals 11 of the main board 100 via the interposer 102 .
  • the electrode pad 3 is a thin film made of a conductive metal formed by photolithography using an electroplating method or an etching method.
  • the probe 5 is made of an elastically deformable conductive metal such as NiCo (nickel-cobalt alloy) and has a tip for contacting the electrode 21 on the semiconductor wafer 20 .
  • the probes 5 are fixed on the electrode pads 3 by soldering.
  • the stage 200 is a mounting table for the semiconductor wafer 20, and is capable of moving and rotating in the horizontal plane and moving in the vertical direction. By horizontally moving or rotating the stage 200, the tip of the probe 5 and the electrode 21 of the semiconductor wafer 20 can be aligned. By raising the stage 200 after alignment, the semiconductor wafer 20 can be brought closer to the probe card 10 and the tips of the probes 5 can be brought into contact with the electrodes 21 .
  • Overdrive is performed in order to absorb variations in height of the probes 5 and the electrodes 21 and bring all the probes 5 into contact with the electrodes 21 .
  • Overdrive is a process in which the tip of the probe 5 and the electrode 21 are brought closer to each other by a predetermined distance from the state where they start to come into contact with each other. Due to the overdrive, each probe 5 is elastically deformed according to the height variation of the probes 5 and the electrodes 21 , and all the probes 5 can be reliably brought into contact with the corresponding electrodes 21 .
  • FIG. 2 is a diagram schematically showing how the probes 5 are attached to the ST substrate 103 of FIG. 1
  • FIG. 3 is a diagram showing the bottom surface of the ST substrate 103 to which the probes 5 are attached.
  • Electrode pad 3 A large number of electrode pads 3 are formed on the lower surface of the ST substrate 103 , and one probe 5 is attached to each electrode pad 3 .
  • An insulating film made of an insulating resin is formed on the lower surface of the ST substrate 103, and the electrode pads 3 are formed on the insulating film.
  • a probe mounting region 300 for mounting the probe 5 is provided in the central portion of the electrode pad 3 , and the reinforcing film 6 is formed in a region on the electrode pad 3 that does not overlap with the probe mounting region 300 .
  • Probe row 51 A large number of probes 5 are aligned in the vertical direction (first direction) in the figure to form a probe row 51 .
  • the probes 5 belonging to the same probe row 51 include a first probe 5A and a second probe 5B.
  • the first and second probes 5A, 5B have shapes different from each other and are alternately arranged in the probe row 51. As shown in FIG.
  • Electrode pad rows 31A and 31B A large number of electrode pads 3 are arranged corresponding to the probes 5 .
  • a large number of electrode pads 3 corresponding to the same probe row 51 form a first electrode pad row 31A and a second electrode pad row 31B.
  • the first electrode pad row 31A is formed by aligning the electrode pads 3 corresponding to the first probes 5A in the vertical direction (first direction) in the figure.
  • the second electrode pad row 31B is formed by aligning the electrode pads 3 corresponding to the second probes 5B in the first direction in the figure.
  • the first and second electrode pad rows 31A and 31B are arranged adjacent to each other with a small gap therebetween and extend parallel to each other.
  • the probe 5 has a contact portion 501 , a beam portion 502 and a base portion 503 .
  • the contact portion 501 is the tip portion of the probe 5 that contacts the electrode 21 of the test object, and is provided at one end of the beam portion 502 .
  • the base portion 503 is a support portion having a joint portion 504 joined to the electrode pad 3 and is provided at the other end of the beam portion 502 .
  • the beam portion 502 is a connection portion that connects the contact portion 501 and the base portion 503 and has an elongated shape extending along the ST substrate 103 . That is, the probe 5 has a cantilever beam structure, and achieves overdrive by elastically deforming the beam portion 502 due to the load that the contact portion 501 receives from the electrode 21 .
  • the first and second probes 5A and 5B are configured so that the contact portion 501 and the beam portion 502 have substantially the same shape, and the contact portion 501 exhibits substantially the same behavior with respect to the same load.
  • the first and second probes 5A and 5B have different shapes of base portions 503, and different distances from the contact portion 501 to the joint portion 504 in the horizontal plane.
  • the probes 5A and 5B belonging to the same probe row 51 are arranged such that the contact portions 501 are aligned on the same straight line and the joint portions 504 are aligned on different electrode pad rows 31A and 31B.
  • the reinforcement film 6 is an insulating resin film for reinforcing the electrode pad 3 .
  • the reinforcing film 6 is formed on the electrode pad 3 and the surrounding ST substrate 103 so as to straddle the edge 301 or 302 of the electrode pad 3 . Therefore, the electrode pads 3 are firmly fixed to the ST substrate 103, and the electrode pads 3 are less likely to come off from the ST substrate 103 during inspection.
  • the reinforcing film 6 is formed so as to cover at least part of the area on the electrode pad 3 excluding the probe mounting area 300 .
  • the reinforcement film 6 is formed so as to cover the peripheral region on the electrode pad 3 , the reinforcement film 6 is not formed in the probe mounting region 300 and the electrode pad 3 is exposed. Therefore, the probe 5 can be attached and detached even after the reinforcing film 6 is formed. For example, if the probe 5 is defective or damaged, the probe 5 can be replaced.
  • the reinforcing film 6 has a strip shape extending along the electrode pad row 31A or 31B, and is formed on two or more electrode pads 3 belonging to the electrode pad row 31A or 31B. Therefore, the electrode pads 3 are more strongly fixed to the ST substrate 103 and the electrode pads 3 are less likely to come off, compared to the case where the reinforcing film 6 is formed for each electrode pad 3 .
  • the electrode pad 3 has a pair of edges 301 and 302 facing each other, and two reinforcing films 6 are formed so as to straddle the pair of edges 301 and 302, respectively, facing each other with the probe mounting region 300 interposed therebetween. Two areas on the electrode pads 3 to be covered are respectively covered. Therefore, the electrode pad 3 is more firmly fixed to the ST substrate 103 and is less likely to come off, compared to the case where the reinforcing film 6 is formed only on one of the pair of edges 301 and 302 .
  • the pair of edges 301 and 302 on which the reinforcing film 6 is formed is desirably a pair of edges facing each other in the extension direction of the beam portion 502 of the probe 5 corresponding to the electrode pad 3 .
  • the extension direction of the beam portion 502 is the horizontal direction (second direction)
  • two reinforcing films 6 are formed so as to straddle the left and right edges 301 and 302 of the electrode pad 3 .
  • the probe 5 Since the probe 5 has a cantilever beam structure, if the contact portion 501 contacts the test object during inspection, a force acts on the base portion 503 in a direction that tilts the contact portion 501 side. At this time, a stress is generated in a region on the electrode pad 3 opposite to the contact portion 501 with the probe mounting region 300 interposed therebetween, such that the electrode pad 3 is peeled off from the ST substrate 103 . Therefore, by forming two reinforcing films 6 so as to straddle a pair of opposite sides 301 and 302 in the extending direction of the beam portion 502 among the four sides of the substantially rectangular electrode pad 3, It is possible to effectively suppress peeling of the electrode pad 3 .
  • the reinforcing film 6 is formed on one of the pair of opposing edges 301 and 302 of the electrode pad 3 and the reinforcing film 6 is not formed on the other.
  • the reinforcing film 6 is formed only on one of the pair of edges 301 and 302, the edge 301 opposite to the contact portion 501 across the probe mounting region 300, that is, the edge 301 located farthest from the contact portion 501.
  • the reinforcing film 60 formed between the electrode pad rows 31A and 31B covers both the region on the electrode pads 3 belonging to the electrode pad row 31A and the region on the electrode pads 3 belonging to the electrode pad row 31B. It is formed.
  • the reinforcing film 60 is formed of the edge 302 of the electrode pads 3 belonging to one electrode pad row 31A facing the other electrode pad row 31B and the electrode pad 3 belonging to the other electrode pad row 31B. are formed so as to straddle both the one electrode pad row 31A and the facing edge 301, among the edge sides.
  • the electrode pad rows 31A and 31B are formed close to each other, leaving only a narrow region between them. Therefore, by forming one reinforcing film 60 covering both the two electrode pads 3 belonging to different electrode pad rows 31A and 31B, the reinforcing film 6 can be formed even in a narrow area, and the electrode pads 3 can be It can prevent peeling.
  • FIG. 4 is an enlarged view of the electrode pad 3, showing an enlarged part of FIG.
  • the electrode pad 3 has a substantially rectangular shape with four edges 301 to 304 and has an elongated shape with the second direction as the longitudinal direction.
  • a pair of edges 301 and 302 facing each other in the second direction are covered with the reinforcement film 6, while a pair of edges 303 and 304 facing each other in the first direction are covered with the reinforcement film 6 except near both ends.
  • the probe mounting area 300 is provided substantially in the center of the electrode pad 3 and is an elongated rectangular area whose longitudinal direction is the lateral direction.
  • the distances L1-L4 are the lengths from the probe mounting area 300 to the edges 301-304.
  • a reinforcing film 6 is formed on a pair of edges 301 and 302 facing each other in the second direction, and the distances L1 and L2 in the second direction are longer than the distances L3 and L4 in the first direction. It is possible to secure a desired area on the electrode pad 3 for this purpose.
  • the reinforcing film 6 is not formed on the pair of edges 303 and 304 facing each other in the first direction, and the distances L3 and L4 in the first direction are set shorter than the distances L1 and L2 in the second direction, preferably zero. By doing so, it is possible to narrow the arrangement pitch of the electrode pads 3 in the electrode pad rows 31A and 31B.
  • FIG. 5 is a diagram (AA cross-sectional view) showing an example of a cross section of the ST substrate 103 of FIG. 3 cut along the AA cutting line. Note that FIG. 5 is a diagram showing the vertically downward direction upward, and the vertical direction is opposite to that in FIG. 1 .
  • the ST substrate 103 is formed by laminating one or more insulating films 703 and 704 on a laminated plate in which two or more ceramic substrates 701 and 702 are laminated. Electrode pads 3 are formed on the outermost insulating film 704 .
  • An insulating resin such as polyimide is used for the insulating films 703 and 704 , and a conductive metal such as copper is used for the electrode pad 3 .
  • the insulating films 703 and 704 are formed by photolithography processing using an etching method.
  • a wiring pattern 71 and a through hole 72 are provided in the ST substrate 103 .
  • the electrode pads 3 are electrically connected to electrodes provided on the main surface opposite to the ST substrate 103, ie, the lower surface (upper surface in FIG. 1).
  • the probes 5A and 5B belong to the same probe row 51, and the contact portion 501 and the beam portion 502 have the same shape and position, but the base portion 503 has a different shape and the joint portion 504 has a different position.
  • the reinforcing film 6 is formed on the region on the electrode pad 3 adjacent to the edges 301 and 302 and on the insulating film 704 adjacent to the electrode pad 3 so as to straddle the pair of opposing edges 301 and 302 of the electrode pad 3 . formed in the area.
  • An insulating resin such as polyimide is used for the reinforcement film 6, and is formed by photolithography processing using an etching method. Further, the reinforcing film 6 is formed by thermally curing after application.
  • FIG. 6 is a diagram (AA cross-sectional view) showing another example of a cross section of the ST substrate 103 of FIG. 3 cut along the AA cutting line.
  • the insulating film 705 like the insulating films 703 and 704, is a thin film made of an insulating resin such as polyimide, and is formed using a photolithographic technique.
  • the electrode pads 3 are surrounded by the insulating film 705 , and the side surfaces of the electrode pads 3 are in close contact with the side surfaces of the insulating film 705 . Therefore, the electrode pads 3 are more difficult to peel off than in the case of FIG.
  • the reinforcing film 6 is formed on the regions on the electrode pads 3 adjacent to the edges 301 and 302 and on the region on the insulating film 705 adjacent to the electrode pads 3 so as to straddle the edges 301 and 302 of the electrode pads.
  • the first direction which is the extending direction of the electrode pad rows 31A and 31B and the reinforcing film 6, and the second direction, which is the longitudinal direction of the electrode pads 3, are orthogonal to each other.
  • the two may be in directions intersecting each other, and may not be orthogonal to each other.
  • the extending direction of the beam portion 502 matches the second direction, it does not have to match.
  • the probe row 51 is composed of two types of probes 5A and 5B having different shapes and corresponds to the two electrode pad rows 31A and 31B. It is not limited only to such a case.
  • the present invention can also be applied to a case where the probe row 51 is composed only of probes 5A of the same shape and corresponds to only one electrode pad row 31A. In this case, two or more electrode pads 3 are arranged on the ST substrate 103, and two or more probes 5 are attached.
  • the probe row 51 is made up of a large number of probes 5 and the electrode pad rows 31A and 31B are each made up of a large number of electrode pads 3. It is not limited only to such a case.
  • the present invention can also be applied when the probe row 51 is composed of two or more probes 5 and each of the electrode pad rows 31A and 31B is composed of two or more electrode pads 3 .
  • Probe card 11 External terminal 12
  • Substrate holder 100 Main substrate 101 Reinforcing plate 102
  • Interposer 103 ST substrate 20
  • Semiconductor wafer 21 Electrode 200
  • Stage 201 Card holder 3
  • Electrode pad 300 Probe mounting regions 301, 302 Edges 31A, 31B
  • Electrode pad row 5 , 5A, 5B probe 501 contact portion 502 beam portion 503 base portion 504 joint portion 51 probe rows 6, 60 reinforcing film 71 wiring pattern 72 through holes 701, 702 ceramic substrates 703 to 705 insulating film

Abstract

Le problème de la présente invention est de fournir une carte sonde hautement fiable ayant un plot d'électrode de sonde qui ne se détache pas facilement d'une carte de câblage. La solution selon l'invention porte sur une carte sonde qui comprend : une carte de câblage 103 ayant un plot d'électrode 3 disposé sur celle-ci ; une sonde 5 fixée au plot d'électrode 3 ; et un film de renforcement 6 qui est formé sur le plot d'électrode 3 et dans la zone environnante de façon à s'étendre sur les bords 301, 302 du plot d'électrode 3 et recouvrir une partie du plot d'électrode 3. Le plot d'électrode 3 comprend une zone de fixation de sonde 300 pour fixer la sonde 5. Le film de renforcement 6 est formé sur au moins une partie de la zone sur le plot d'électrode 3 autre que la zone de fixation de sonde 300.
PCT/JP2021/013787 2021-03-31 2021-03-31 Carte sonde WO2022208708A1 (fr)

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Application Number Priority Date Filing Date Title
PCT/JP2021/013787 WO2022208708A1 (fr) 2021-03-31 2021-03-31 Carte sonde
TW111112679A TW202242422A (zh) 2021-03-31 2022-03-31 探針卡

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PCT/JP2021/013787 WO2022208708A1 (fr) 2021-03-31 2021-03-31 Carte sonde

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WO2022208708A1 true WO2022208708A1 (fr) 2022-10-06

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002257860A (ja) * 2001-02-28 2002-09-11 Ibiden Co Ltd プローブカード
JP2007534947A (ja) * 2004-04-26 2007-11-29 フォームファクター， インコーポレイテッド 基板表面上に頑強な機械的構造を作成する方法
US20080061808A1 (en) * 2006-09-12 2008-03-13 Sammy Mok Compliance partitioning in testing of integrated circuits
JP2011043441A (ja) * 2009-08-21 2011-03-03 Japan Electronic Materials Corp プローブカード
JP2012021826A (ja) * 2010-07-13 2012-02-02 Japan Electronic Materials Corp 電気的接続装置及びその製造方法
JP2013083635A (ja) * 2011-10-06 2013-05-09 Samsung Electro-Mechanics Co Ltd プローブカード及びその製造方法
JP2013083620A (ja) * 2011-10-12 2013-05-09 Samsung Electro-Mechanics Co Ltd プローブカード及びその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002257860A (ja) * 2001-02-28 2002-09-11 Ibiden Co Ltd プローブカード
JP2007534947A (ja) * 2004-04-26 2007-11-29 フォームファクター， インコーポレイテッド 基板表面上に頑強な機械的構造を作成する方法
US20080061808A1 (en) * 2006-09-12 2008-03-13 Sammy Mok Compliance partitioning in testing of integrated circuits
JP2011043441A (ja) * 2009-08-21 2011-03-03 Japan Electronic Materials Corp プローブカード
JP2012021826A (ja) * 2010-07-13 2012-02-02 Japan Electronic Materials Corp 電気的接続装置及びその製造方法
JP2013083635A (ja) * 2011-10-06 2013-05-09 Samsung Electro-Mechanics Co Ltd プローブカード及びその製造方法
JP2013083620A (ja) * 2011-10-12 2013-05-09 Samsung Electro-Mechanics Co Ltd プローブカード及びその製造方法

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