200829921 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種適合使用在半導體IC晶片或集合作 成像半導體晶圓之半導體元件之電氣檢查之電氣連接 及其組裝方法。 【先前技術】 半導體元件等的被檢查體，會進行是否能依照規袼書 動作的通电檢查。此通電檢查，被檢查體係經由具備將針 頭按壓至被檢查體電極之複數個探針（接觸件）之探針卡般 的電氣連接裝置連接於測試器本體。 習知此種電氣連接裝置，具有探針組裝體，該探針組 裝體具備藉由具有彼此隔著間隔保持之底板、中間板、及 頂板之探針支撐體支撐之複數個探針（例如，參照專利文獻 1及2)。在探針支撐體的各板形成允許探針貫通的導孔。 在貫通此導孔而配置之各探針之底板與頂板之間的部分， 形成突出於探針之徑方向外側的制動件。在探針組裝於探 針支撐體的狀態下，藉由底板與頂板之各導孔之緣部與制 動件之卡合，來防止各探針從探針支撐體脫落。 各探針的前端部，係配置成從底板之導孔直線狀突出， 此釗鈿邛的針頭係以接觸於排列在被檢查體之對應電極之 方式按壓至該電極。被檢查體係IC晶片、或由多數個ic 曰曰片所作成的半導體晶圓，隨著晶片電路的微小化，被檢 查體電極排列也變得小間距化。為了對應此小間距化，必 須使設於底板之各探針的導孔彼此更接近配置。然而，將 5 200829921 各導孔對應沿著直線排成之一列電極而排列在一條直線上 時’除了必須確保底板之導孔間的機械強度外，亦必須使 排列形成之導孔之緣部間有既定距離。為了確保此既定距 離’該底板之導孔之排列間距的減少受到嚴格限制，是以， 探針之針頭的小間距化受到嚴格限制。因此，強烈期待能 對應習知被檢查體電極排列之小間距化的電氣連接裝置。200829921 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to an electrical connection and an assembly method suitable for electrical inspection of semiconductor components of semiconductor IC chips or integrated imaging semiconductor wafers. [Prior Art] A test object such as a semiconductor element performs a power-on check as to whether or not it can operate in accordance with the specification. In this energization check, the inspection system is connected to the tester body via an electrical connection device such as a probe card having a plurality of probes (contacts) for pressing the needle to the test subject electrode. Such an electrical connecting device has a probe assembly having a plurality of probes supported by a probe support having a bottom plate, an intermediate plate, and a top plate held at intervals therebetween (for example, Refer to Patent Documents 1 and 2). A guide hole allowing the probe to pass therethrough is formed in each plate of the probe support. A portion protruding between the bottom plate of the probe and the top plate passing through the guide hole is formed to protrude from the outer side in the radial direction of the probe. In a state where the probe is assembled to the probe supporting body, the edge of each of the guide holes of the bottom plate and the top plate is engaged with the stopper to prevent the respective probes from coming off the probe support. The distal end portions of the probes are arranged to linearly protrude from the guide holes of the base plate, and the needles of the respective probes are pressed to the electrodes so as to be in contact with the corresponding electrodes arranged in the test object. The semiconductor wafer to be inspected or the semiconductor wafer made of a plurality of ic dies is miniaturized as the wafer circuit is miniaturized. In order to cope with this small pitch, it is necessary to make the via holes of the probes provided on the substrate closer to each other. However, when the 5 200829921 guide holes are arranged in a straight line along a straight line and arranged in a straight line, in addition to the mechanical strength between the guide holes of the bottom plate, it is necessary to make the edges of the guide holes formed in the array. There is a set distance. In order to ensure that the reduction in the arrangement pitch of the via holes of the substrate is strictly limited, the small pitch of the probe needle is severely limited. Therefore, there is a strong demand for an electrical connection device capable of matching a small pitch of a conventional body array.
專利文獻1國際公開第2004/072661號小冊子 專利文獻2曰本特開2006-003 191號公報 【發明内容】 •因此，本發明之目的在於提供一種能對應被檢查體電 極之小排列間距的電氣連接裝置及其組裝方法。 ^本發明，纟基本構想在於，取代在直線上排列用以收 :各板針的導孔，各導孔的配置係採用此直線位於之間的 ^叉配置，彳文該父又配置之各導孔突出之探針之前端部， 形成用以將該針頭排列於直線上的曲部。 囚此 尽努明之電氣連接裝置，具備探針支撐體與複 :個探針，該探針支撐體具有第i板構件及與該第i板構 牛：距-間隔配置之第2板構件，在該各板構件分別有形 致朝其厚度方向貫通之複數個探針導孔，該線狀探針 :頭係貫通該探針導孔且抵接於被檢查體電極，配置成 二::端所形成之前端部從該第"反構件突出，且在該第 動件· #板構件之間具有可卡止於該探針導孔之緣部之制 係在對庳於：至少該第1板構件的該複數個導孔， …亥電極之排列線之假想直線兩側沿著該假想直線 6 200829921 配置，且兩侧之該導孔係沿著該假想直線彼此錯開配置， 在通過各導孔之該探針的該前端部，形成使該針頭朝向對 應該假想直線之該排列線上之該電極的曲部。 本發明之電氣連接裝置中，形成於該第丨板構件的複 數個導孔係分別配置於該假想直線的兩侧，此兩侧之導孔 列的各導孔位置係沿著該假想直線錯開配置。是以，沿著 該假想直線進行觀察時，在該假想直線的另一側沿著該假 想直線排列的導孔列的各導孔，係位於在該假想直線的一 側沿著該假想直線排列的導孔列的各導孔之間。因此，沿 著该假想直線相鄰的導孔，係沿著該假想直線且交互地位 於其兩側。其結果，在各導孔的口徑不會變更且維持此狀 態下，不會減少朝此假想直線之延伸方向之相鄰導孔之緣 部間的距離，可縮小沿著該假想直線相鄰之導孔之中心間 距離。又，位於假想直線兩側之通過各導孔之該探針之針 頭之對應該假想直線之從直線的偏移，係可藉由形成於各 铋針之該珂端部之比較小的曲部來進行修正。藉由此曲部 可使各針頭容易排列在該直線上。 疋以，依據本發明之電氣連接裝置，由於不會導致設 有導孔之第1板構件的強度降低，且可縮小相鄰探針之排 列間距，因此，可對應被檢查體電極排列的小間距化而謀 求針頭的小間距化。又，在該直線假想線的兩側各導孔分 別保持既定間隔而形成。因此，沿著此導孔而被導引的探 針由於在該導孔附近的制動件之間不會造成干涉，因此 可確貝防止此制動件之間之干涉所引起的電氣短路問題。 7 200829921 譴铋針之針頭，如習知， 向爷箆1 k i 了1^耆该振針之彈性變形朝 n及昂1板構件及朝向離 Λ Λ 開其之方向的縱方向位移。較佳 為，该曲部，當該針頭朝 鄉t ^ ^ + 乐1扳構件以最大距離產生 縱方向位移時，係形成於從 八拉lL x昂1扳構件突出之位置的部 刀。猎此，可防止探針之針頭 橫方縱方向位移所引起的Patent Document 1 International Publication No. 2004/072661 Patent Publication No. 2004-003 191 SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an electrical device capable of responding to a small arrangement pitch of an electrode to be inspected. Connecting device and assembling method thereof. According to the present invention, the basic idea is to replace the guide holes arranged on the straight line for receiving the respective pins, and the arrangement of the guide holes adopts the cross configuration in which the straight line is located, and the parent is configured again. The front end of the probe protruding from the guide hole forms a curved portion for arranging the needle on a straight line. The electrical connection device of the present invention is provided with a probe support body and a plurality of probes, the probe support body having an i-th plate member and a second plate member disposed at a distance from the i-th plate Each of the plate members has a plurality of probe guide holes penetrating in the thickness direction thereof, and the wire probes penetrate the probe guide holes and abut against the test object electrodes, and are arranged in two:: The formed front end protrudes from the first "reverse member, and a system that is engageable with the edge of the probe guide hole between the first mover and the plate member is opposed to: at least the first The plurality of via holes of the 1 plate member are disposed along the imaginary straight line 6 200829921 on both sides of the imaginary straight line of the array line of the sea electrodes, and the guide holes on both sides are arranged along the imaginary straight line to be shifted from each other. The tip end portion of the probe of the guide hole forms a curved portion for directing the needle toward the electrode on the alignment line corresponding to the imaginary straight line. In the electrical connection device of the present invention, the plurality of via holes formed in the second plate member are respectively disposed on both sides of the imaginary straight line, and the positions of the respective guide holes of the guide hole rows on the both sides are staggered along the imaginary straight line. Configuration. Therefore, when viewed along the imaginary straight line, each of the via holes of the via row arranged along the imaginary line on the other side of the imaginary line is arranged along the imaginary line on one side of the imaginary line. Between each of the via holes of the via row. Therefore, the vias adjacent to the imaginary line follow the imaginary line and interact on both sides. As a result, when the diameter of each of the guide holes is not changed and the state is maintained, the distance between the edge portions of the adjacent guide holes extending in the direction in which the imaginary straight line extends is not reduced, and the adjacent line along the imaginary line can be reduced. The distance between the centers of the guide holes. Moreover, the offset of the imaginary straight line from the straight line of the probe passing through the guide holes on both sides of the imaginary straight line can be formed by a relatively small curved portion formed at the end of each of the cymbal needles. To make corrections. By means of this curved portion, the needles can be easily arranged on the straight line. According to the electrical connecting device of the present invention, since the strength of the first plate member provided with the guide hole is not lowered, and the arrangement pitch of the adjacent probes can be reduced, the arrangement of the electrodes of the object to be inspected can be small. The pitch is increased to achieve a small pitch of the needle. Further, the guide holes on both sides of the straight line imaginary line are formed at predetermined intervals. Therefore, the probe guided along the guide hole does not cause interference between the stoppers in the vicinity of the guide hole, so that the problem of electrical short circuit caused by the interference between the brake members can be prevented. 7 200829921 The needle of the scorpion needle, as in the case of the knowledge, is 1 k 了 1 耆 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性Preferably, the curved portion is formed in a blade projecting from a position of the lever member when the needle is displaced in the longitudinal direction by the maximum distance of the thumb member. Hunting this can prevent the needle of the probe from being displaced in the longitudinal direction of the horizontal direction.
Λ二板構件之複數個導孔，可為位於對應該假想 Λ之該直線兩侧，沿著該直線交又配置。 該探針支撐體可使用進一步具備形成收容該各探針之 導孔在》亥第2板構件之與該第i板構件配置侧相反 ，側隔著間隔配置的第3板構件，及組裝該各板構件的螺 :構件的!木針支撐體。該螺桿構件，為了在貫通該第1至 第3板構件之該各探針導孔的該探針，在該第2及第3板 構件之間產生朝相同方向位移之彈性變形之狀態下保持該 各探針，將該第丨至第3板構件結合成彼此可分離❶ 叹於該第2及第3板構件之該導孔，可對應設於該第 1板構件之該導孔的配置交叉配置。特別是，當第2板構 件與第1板構件接近配置時，將第丨及第2導孔配置成該 交叉配置尤佳。 可進一步設置連接板。此連接板，從該第3板構件觀 条日π ’在與該第2板構件配置侧相反之側，係配置成接觸 於該第3板構件。在該連接板支撐有該探針支撐體。又， 可將貫通該連接板而配置之配線之一端連接於該探針的基 端0 8 200829921 可進一步設置具有用以組襄該連接板之在板厚方向貫 通之開π、及對應該各線之複數個連接焊墊的配線美 板’在該配線基板支撐該連接板。此時，該配線的另'一二 係與該連接焊墊連接。 +在本發明之電氣連接I置之組裝，首先，在對應該第 1至第3板構件彼此之導孔係配置成直線狀排列之狀態;， 以該探針之該制動件部位於該第！及第2板構件之間之方 式’將該探針在彈性變形前之直線狀態下插入f ι至第3 板構件之該各導孔來組合該各板構件。 較佳為，在此組合狀態下，在第1及第2板構件，於 與板厚方向呈直角之平面上對㈣3板構件施加位移時， 在該及第3板構件之間對該探針施加對應該位移方向 及位移量之朝向一方向的既定彈性變形。第3板構件，在 對各探針施加既定彈性變形之該位移位置，係藉由該螺桿 構件固定結合於第1及第2板構件。 ^ ^ 可在對多數個該探針施加朝向一方向之均勻適 田：彈性變形之狀態下，適當組裝於該探針支撐體。此彈 二夕田針壓作用於各探針的針頭時，在該針頭允許朝 向則端部之長邊方向之適當的彈性位移。 又，較佳為，在對直線狀之該探針施加該第2及第3 才J十 B Q * S之朝向該一方向之彈性變形之狀態下，將該第 板構件固定結合於第1及第2板構件之後，形成該探針 的曲部。 探針/、要可保持在自由狀態的直線狀態，可允許在該 9 200829921 ，線：圍進订比較自由的旋動。因此，在該前端部形成 疋曲部之後，將各探針裝入於該探針支撐體時，當裝 必須適當保持各探針之曲部的旋轉角《，以使多數^ ’ ::頭=#當的方向。且必須將各探針裝人於該探針！ 牙a r在夕數個錢針導入朝向該既定方向之均 性位移。因此’探針的組裝作業非常須 的淨The plurality of guide holes of the second plate member may be disposed on both sides of the straight line corresponding to the imaginary ,, along the straight line. The probe support body may further include a third plate member disposed on the side opposite to the i-th plate member arrangement side, and a guide hole for accommodating the probes, and disposed on the side of the second plate member. Screw of each plate member: a wooden needle support of the member. The screw member is held in a state in which the probes penetrating through the probe guide holes of the first to third plate members are elastically deformed in the same direction between the second and third plate members. In each of the probes, the second to third plate members are coupled to each other so as to be separable from the guide holes of the second and third plate members, and corresponding to the arrangement of the guide holes provided in the first plate member Cross configuration. In particular, when the second plate member and the first plate member are disposed close to each other, it is particularly preferable to arrange the second and second guide holes in the cross arrangement. The connecting plate can be further set. The connecting plate is disposed in contact with the third plate member on the side opposite to the second plate member arrangement side from the third plate member viewing day π '. The probe support is supported on the connecting plate. Further, one end of the wiring disposed through the connecting plate may be connected to the base end of the probe. The method may further include an opening π for aligning the connecting plate in the thickness direction of the connecting plate, and corresponding lines. A plurality of wiring pads that connect the pads support the connecting plate on the wiring substrate. At this time, the other one of the wirings is connected to the connection pad. In the assembly of the electrical connection I of the present invention, first, the guide hole systems corresponding to the first to third plate members are arranged in a line in a straight line; the brake member portion of the probe is located at the first ! And the method between the second plate members, the probes are inserted into the respective guide holes of the third plate member in a straight state before the elastic deformation to combine the plate members. Preferably, in the combined state, when the (four) three-plate member is displaced on the plane perpendicular to the thickness direction of the first and second plate members, the probe is interposed between the third plate member and the third plate member. A predetermined elastic deformation corresponding to the direction of displacement and the direction of displacement is applied. The third plate member is fixedly coupled to the first and second plate members by the screw member at the displacement position at which the predetermined elastic deformation is applied to each of the probes. ^ ^ can be suitably assembled to the probe support in a state in which a plurality of the probes are applied in a uniform orientation in one direction: elastic deformation. When the needle is applied to the needle of each probe, the needle is allowed to have an appropriate elastic displacement toward the longitudinal direction of the end portion. Further, it is preferable that the first plate member is fixedly coupled to the first and third states in a state in which the second and third J 10 BQ * S are elastically deformed in the one direction. After the second plate member, a curved portion of the probe is formed. The probe /, to be in a straight state that can be kept in a free state, can be allowed to be in the 9 200829921, line: to make a relatively free rotation. Therefore, after the end portions are formed with the warp portions, when the probes are loaded into the probe support body, the rotation angle of the curved portions of the respective probes must be properly held so that the majority of the probes are selected. =#When the direction. And each probe must be attached to the probe! The tooth a r introduces a uniform displacement toward the predetermined direction on the eve of the money needle. Therefore, the assembly work of the probe is very necessary.
然而，如上述，在多數個直線狀之該探μ 適當產生彈性變形之狀態τ裝人於該探針支㈣時 伴隨彎曲之彈性位移可抑制各探針在其㈣周圍自㈣ 動。因此，由於在抑制此旋動的狀態下，在各探針可較= 易形成朝向適當方向的曲部，因此可較容易將針頭適當地 朝向既定方向。 田 【實施方式】 〃本發明之電氣連接裝置，可使用為用於被檢查體之電 風檢查的探針卡。此電氣連接裝置10整體係顯示於圖i 及圖2。圖示之例中，電氣連接裝置1〇，如圖2所示，係 用於集合作成在吸盤12上所保持之半導體晶圓14的多數 们1C(矛貝體電路）晶片區域的電氣檢查。 電氣連接裝置1()，具備裝人對應形成於該晶片區域之 多數個電極（未圖示）之多數個探針16 #探針組裝體18、 結合該探針組裝體的連接板2〇、及保持該連接板之圓形的 配線基板22。配線基板22，如習知，係將導電路（未圖示） 裝入於掺有玻璃之環氧樹脂板或陶变板般的電氣絕緣基板 而形成。 200829921 在配線基板22之中央部形成朝板厚方向貫通之矩形的 開口 24(麥照圖2)。在配線基板22之一側的面22a ,將多 數個連接焊墊26沿著開口 24之一對的對邊排列配置。又， 在側之面22a的外緣部，配置連接於未圖示之測試器電 路之夕數個測s式器焊墊28(參照圖1)。各連接焊墊26，與 習知相同，係經過配線基板22之該導電路連接於對應的 測試器焊墊28。 連接板20係以電氣絕緣材料形成、具備具可收容於開 口 24内之矩形平面形狀的矩形部2〇&、及從該矩形部之一 側面突出至矩形部20a之外緣之矩形的環狀凸緣部2〇b。 連接板2〇，如圖2明確所示，係配置成將矩形部20a收容 於配線基板22之開口 24内且將環狀的凸緣部攝在配線 基板22之-側的面22a上装載於該開〇 24的緣部，且以 圖1所示的複數個螺桿構件3〇㈤定於配線基板22。 在連接板2G之矩形部2Qa，如圖丨所示，形成朝該板 厚方向貫通的多數個貫通孔32阳，似）。貫通孔32(取 32b)，係對應半導體晶圓14之該ic晶片區域的各電極而 被檢查體之半導體晶圓14之各晶片區域…般而言具 有矩形的平面形狀。該各晶片區域之多數個該電極，雖未 圖不’但例如係沿著該各晶片區域之各邊描出矩形般排成 :列。對應該IC晶片區域之各電極形成之連接板2〇的貫 =叫’在圖1所示之例中，係對應8個該晶 形成。然而，在圖示之例中，貫通孔32a及32b， 11 200829921 係沿著該晶片區域之各矩形的電極列，在該矩形排列的内 側及外側描出雙重的矩形環狀般雙重排列，又，在各該晶 片區域，兩貫通孔32a及32b，係以朝該排列方向交互^ 置之方式錯開排列。 探針組裝體18的各探針16，係連接於圖2所示的配 、水 彳朱針1 6，如後述，在其基端電氣連接於對應之配However, as described above, in a state in which a plurality of linear deformations are appropriately elastically deformed, τ is attached to the probe branch (4), and the elastic displacement accompanying the bending suppresses the respective probes from (4) around (4). Therefore, since the curved portion in the appropriate direction can be easily formed in each of the probes in a state where the rotation is suppressed, it is easier to appropriately guide the needle toward a predetermined direction. [Embodiment] The probe of the electric connection device of the present invention can be used as a probe card for electric wind inspection of an object to be inspected. The electrical connection device 10 is shown in its entirety in Figures i and 2. In the illustrated example, the electrical connection device 1A, as shown in Fig. 2, is used to collectively perform electrical inspection of a plurality of 1C (spear body circuit) wafer regions of the semiconductor wafer 14 held on the chuck 12. The electrical connection device 1 () includes a plurality of probes 16 that are attached to a plurality of electrodes (not shown) formed in the wafer region, a probe assembly 18, and a connection plate 2 that is coupled to the probe assembly. And a wiring board 22 that holds the circular shape of the connecting plate. The wiring board 22 is formed by incorporating a conductive circuit (not shown) into an electrically insulating substrate such as a glass epoxy-coated epoxy board or a ceramic board. 200829921 A rectangular opening 24 penetrating in the thickness direction is formed in the central portion of the wiring board 22 (May 2). On the surface 22a on one side of the wiring substrate 22, a plurality of connection pads 26 are arranged side by side along the opposite sides of one of the openings 24. Further, on the outer edge portion of the side surface 22a, a plurality of s-type solder pads 28 (see Fig. 1) connected to a tester circuit (not shown) are disposed. Each of the connection pads 26 is connected to the corresponding tester pad 28 via the conductive circuit of the wiring substrate 22, as is conventional. The connecting plate 20 is formed of an electrically insulating material, and has a rectangular portion 2' with a rectangular planar shape that can be accommodated in the opening 24, and a rectangular ring that protrudes from one side of the rectangular portion to the outer edge of the rectangular portion 20a. The flange portion 2〇b. As shown in FIG. 2, the connecting plate 2A is arranged such that the rectangular portion 20a is housed in the opening 24 of the wiring board 22, and the annular flange portion is mounted on the surface 22a on the side of the wiring board 22 The edge of the opening 24 is set on the wiring board 22 by a plurality of screw members 3 (5) shown in FIG. In the rectangular portion 2Qa of the connecting plate 2G, as shown in Fig. 2, a plurality of through holes 32 penetrating in the thickness direction are formed. The through holes 32 (taken 32b) correspond to the respective electrodes of the ic wafer region of the semiconductor wafer 14 and each of the wafer regions of the semiconductor wafer 14 of the object to be inspected has a rectangular planar shape. A plurality of the electrodes in the respective wafer regions are not shown, but are arranged in a rectangular shape along the sides of the respective wafer regions. In the example shown in Fig. 1, the connection of the connecting plates 2 which are formed for the respective electrodes of the IC wafer region is formed corresponding to eight crystals. However, in the illustrated example, the through holes 32a and 32b, 11 200829921 are arranged along the rectangular electrode rows of the wafer region, and the double rectangular rings are double-arranged on the inner side and the outer side of the rectangular array. In each of the wafer regions, the two through holes 32a and 32b are arranged in a staggered manner in the arrangement direction. Each of the probes 16 of the probe assembly 18 is connected to the fitting and water cymbal pin 6 shown in Fig. 2, and is electrically connected to the corresponding base at its base end as will be described later.
、、泉3 4的鳊，该配線之另一端分別連接於對應的連接焊 墊26。是以，各探針16，係經過對應與其連接之連接焊 墊26的測試器烊墊28連接於該測試器之電路。 裝有多數個探針16之探針組裝體18，如圖3所示， 具備允許各探針16貫通的探針支撐體36。探針支撐體36， 具'第1㈣件之具矩形+面形狀之整體平板狀的底板 4〇,藉由形成於該底板之緣部之矩形框部4〇a之間隔物功 能、在底板40之矩形框部4〇a以外之部分隔著間隔重疊於 該矩形框部之第2板構件的中間板42，及透過具有間隔物 功能之矩形框44重疊於該中間板之第3板構件的頂板粍。 在底板40、中間板42、及頂板46，分別有形成允許各探 針16朝板厚方向貫穿的探針導孔48(48a，… 及52(52a，52b)。在圖3中，從剖面的關係顯示各一側之 導孔 48a，50a 及 52a。 底板40、中間板42、及頂板46之各探針導孔叫術 夠、邓〇a，5〇b)及52(52a，52b)，係在各板構件4〇,仏46 上分別以相等間隔配置，並形成彼此可整合。底才反4〇、中 間板42、矩形框44、及頂板46，係藉由螺桿構件μ的固 12 200829921 定，結合成一體，且藉此整體組裝成矩形之探針支撐體3 6。 在此結合狀態下，中間板42實質上隔著間隔配置於底 板40，又，頂板46，係在中間板42之與底板4〇配置侧 相反之側隔著間隔保持於中間板42。又，底板4〇及中間 板42之各探針導孔48及50，雖彼此整合，但相對於此， 頂板46之探針導孔52，係位於朝該排列方向的一側偏移 的位置。此頂板46之探針導孔52(52a，52b)，係在安裝於The other end of the wiring is connected to the corresponding connection pad 26, respectively. Therefore, each probe 16 is connected to the circuit of the tester via a tester pad 28 corresponding to the connection pad 26 to which it is connected. The probe assembly 18 having a plurality of probes 16 is provided with a probe support 36 that allows the probes 16 to pass therethrough as shown in FIG. The probe support body 36 has a rectangular plate-shaped flat plate-shaped base plate 4' having a rectangular shape and a surface shape of the first (fourth) member, and a spacer function of the rectangular frame portion 4a formed at the edge portion of the bottom plate, and the bottom plate 40 The portion other than the rectangular frame portion 4A is overlapped with the intermediate plate 42 of the second plate member of the rectangular frame portion, and the rectangular frame 44 having the spacer function is superposed on the third plate member of the intermediate plate. Top plate 粍. Probe holes 48 (48a, ..., and 52 (52a, 52b) are formed in the bottom plate 40, the intermediate plate 42, and the top plate 46 to allow the respective probes 16 to penetrate in the thickness direction. In Fig. 3, the cross section is shown. The relationship shows the guide holes 48a, 50a and 52a on each side. The probe guide holes of the bottom plate 40, the intermediate plate 42, and the top plate 46 are called enough, Deng Hao a, 5〇b) and 52 (52a, 52b). It is disposed at equal intervals on each of the plate members 4A and 46, and is formed to be integrated with each other. The bottom plate, the intermediate plate 42, the rectangular frame 44, and the top plate 46 are integrally assembled by a screw member μ, and are integrally assembled into a rectangular probe support 36. In this combined state, the intermediate plates 42 are disposed on the bottom plate 40 at substantially intervals, and the top plate 46 is held by the intermediate plate 42 at intervals on the side opposite to the side on which the bottom plate 4 is disposed on the side of the intermediate plate 42. Further, although the probe guide holes 48 and 50 of the bottom plate 4 and the intermediate plate 42 are integrated with each other, the probe guide holes 52 of the top plate 46 are located at positions offset to one side in the arrangement direction. . The probe guide hole 52 (52a, 52b) of the top plate 46 is attached to
探針支撐體36之連接板20的狀態下，整合於該連接板之 貫通孔 32(32a，32b)。 各探針16,係貫通探針支撐體36之各探針導孔48(48a， 48b) 、50(50a，5013)及 52(52a，52b)而配置。各探針 i6，’ 在底板40及中間板42之間，具有可卡止於各探針導孔48, %之緣部的制動件部56。探針16，在制動件部％抵接於 底板40之上面40b之狀態下，其前端部16&從該底板之下 面40c突出。 在此探針組裝體18之組裝中，如圖4(a)所示，在除去 螺桿構件54的狀態下，以整合探針讀體％之底板4〇、 中間板42、及頂板46之各探針導孔48,5〇,52时式組合 ^板40、中間板42、矩形框44、及頂板牝。在此組合狀 怒下，直線狀之各探針16，係以分別使制動件部％位於 底板40與中間板42之間、且插通整合的探針導孔Μ，W 之方式組裝於探針支撐體36。 之後，如圖4⑻所示，以整合用於螺桿構件54之螺孔 8之方式，使頂板46對底板4〇、中間板〜及矩形框料 13 200829921 在平面上朝圖中箭頭A所示之一方向移動。藉此，將螺桿 構件54螺合於整合之螺孔58，並組裝探針組裝體is。在 此探針組裝體18之組裝狀態下，如上述，探針支撐體％ 之頂板46的探針導孔52，由於相對底板4〇及中間板42 之各探針導孔48及50係偏向一側，因此在所有探針16， 在中間板42及頂板46之間將伴隨彎曲的彈性彎曲變形導 入0In the state of the connecting plate 20 of the probe supporting body 36, it is integrated in the through hole 32 (32a, 32b) of the connecting plate. Each probe 16 is disposed through each of the probe guide holes 48 (48a, 48b), 50 (50a, 5013) and 52 (52a, 52b) of the probe support 36. Each of the probes i6,' has a stopper portion 56 that can be locked between the bottom plate 40 and the intermediate plate 42 at the edge of each of the probe guide holes 48, %. The probe 16 protrudes from the lower surface 40c of the bottom plate in a state where the stopper portion % abuts against the upper surface 40b of the bottom plate 40. In the assembly of the probe assembly 18, as shown in Fig. 4(a), in the state where the screw member 54 is removed, each of the bottom plate 4, the intermediate plate 42, and the top plate 46 of the integrated probe reader% is integrated. The probe guide holes 48, 5, 52 are combined with the plate 40, the intermediate plate 42, the rectangular frame 44, and the top plate. In this combined anger, the linear probes 16 are assembled in such a manner that the brake member portion % is located between the bottom plate 40 and the intermediate plate 42 and is inserted into the integrated probe guide hole Μ, W. Needle support 36. Then, as shown in FIG. 4 (8), the top plate 46 is opposed to the bottom plate 4 〇, the intermediate plate 〜 and the rectangular frame material 13 200829921 in a plane as shown by the arrow A in the figure, so as to integrate the screw holes 8 for the screw member 54. Move in one direction. Thereby, the screw member 54 is screwed to the integrated screw hole 58 and the probe assembly is assembled. In the assembled state of the probe assembly 18, as described above, the probe guide holes 52 of the top plate 46 of the probe support body are biased toward the probe guide holes 48 and 50 of the bottom plate 4 and the intermediate plate 42. One side, therefore, in all the probes 16, the elastic bending deformation accompanying the bending is introduced between the intermediate plate 42 and the top plate 46.
組奴完成之探針組裝體1 8，如圖2所示，係使探針組 I體1 8從配線基板22之另一側的面22b突出，且使探針 Μ的前端部朝向下方的半導體晶圓14，配置於連接板2〇。 又，探針組裝體18,係藉由圖【所示的定位銷6〇之定位 作用如圖5(a)所不，在連接板20，決定對應的探針16 與配線34整合的適合位置，並在此適合位置藉由螺桿 構件62固定於連接板20。 騎千間板42配置於頂板46之nr & 丨土 & i 只做40灸下面46b側，連接板20， 如圖3所示，係配置成在盥 % 邊項板之下面42相反側之上 面4 6 a使矩形部2 〇抵接於頂板4 6。 連接於探針組裝體1 8之夂熘私，< ^ <谷彳木針16之基端的配線34， 在圖5(a)放大顯示之例中， 具備心線34a及由覆蓋該心線 之絕緣材料構成的被覆34b。 立 合配綠34，係以將心線34a ^ 4抵接於用以插通頂板 , 饥之楝針導孔52(52a，52b)的探 对16之基端部16b的方彳 法也> 式’使用適當的接著劑固定在貫 、钆32。各探針16 〒稭由該弹性彎曲變形的導入，以 遠舞力將探針16之該基端 味；的知面按壓至心線34a之該端 14 200829921 部的端面，且將制動件部％朝向底板40按壓。 Α在底板4〇與中間板42之間設置之各探針16的制動件 一 係允序底板40之上面40b與相對向於該上面且隔 者間隔之中間板4 2夕丁 ； /1 〇 下面42a之間的運動。因此，將探針 16之前端冑16a之前端之針頭1㈣對按壓於半導體晶圓 14之對應的該電極0亦，夂_ Μ 4 ^各奴針16將產生如圖5(b)假想線As shown in FIG. 2, the probe assembly 1 body 18 protrudes from the other surface 22b of the wiring board 22, and the tip end portion of the probe cassette faces downward. The semiconductor wafer 14 is disposed on the connection board 2A. Further, the probe assembly 18 is positioned such that the positioning pin 6 is shown in Fig. 5(a), and the corresponding position of the corresponding probe 16 and the wiring 34 is determined in the connecting plate 20. And at this suitable position, it is fixed to the connecting plate 20 by the screw member 62. The riding board 42 is disposed on the top plate 46 nr & 丨土 & i only 40 moxibustion below the 46b side, the connecting plate 20, as shown in Figure 3, is arranged on the opposite side of the lower side of the 盥% side panel 42 The upper portion 4 6 a causes the rectangular portion 2 to abut against the top plate 46. The wiring 34 connected to the probe assembly 18 and the base end of the < ^ < glutinous wood needle 16 is provided with a core 34a and covered by the core in the example shown in Fig. 5(a). A cover 34b made of an insulating material of a wire. The green matching 34 is used to abut the core 34a ^ 4 to the base end portion 16b of the probe 16 for inserting the top plate, and the needle guide hole 52 (52a, 52b) of the hungry needle is also > The formula 'fixed to the 钆, 钆 32 using a suitable adhesive. Each of the probes 16 is introduced by the elastic bending deformation, and the surface of the probe 16 is pressed to the end surface of the end portion 14 200829921 of the core wire 34a with a far-reaching force, and the brake portion is % Pressed toward the bottom plate 40. The brake member of each of the probes 16 disposed between the bottom plate 4 and the intermediate plate 42 is arranged to receive the upper surface 40b of the bottom plate 40 and the intermediate plate 4b which is opposite to the upper surface and spaced apart from each other; The movement between 42a below. Therefore, pressing the needle 1 (four) pair at the front end of the front end 16a of the probe 16 against the corresponding electrode 0 of the semiconductor wafer 14 also produces an imaginary line as shown in Fig. 5(b).
所示之朝一方向的彈性變形。隨著此彈性變形，各探針16 之針頭16C，係以上面杨與下面仏之間的適當既定移 動距離卜沿著前端部16a之長邊方向整體朝縱方向位移。 又以著此位移t，在探針16及設於底板40及中間板42 之各探針導孔48, 50的間隙範圍内，在針頭—產生朝橫 方向之些微滑動w。 各探針16之針頭16c，如上述係對應排列形成於半導 體晶圓14之該各晶片區域的該電極而排列。為了對應於 此電極之小排列間距化’如圖6及圖7所示，在本發明之 電氣連接裝置10中，設於底板4〇之探針導孔48(48a, 4朴）， 係排列成2列。更詳細而言，如圖7所示，在對應於連結 該電極之中心線之電極的排列直線之假想直線L的兩側， 以使各中心位於平行於該假想直線L而延伸的假想直線U 及L1上之方式，將探針導孔48(48a，48b)排列成2列。 當中間板42接近底板40而配置時，如圖6所示，中 間板42之探針導孔50(50a，50b)係對應於底板4〇之探針 導孔48(48a，48b)排成2列。再者，如圖8⑷及（b)所示， 設於頂板46之探針導孔52(52a，52b)，亦可整合於探針導 15 200829921 孔48(48a，48b)及探針導孔50(5〇a，50b)而設置。 參照圖7及圖9來說明有關底板4〇排成2列之導孔的 詳細。如圖9放大顯示，一侧之探針導孔48a係沿著底板 40之一側的假想直線L1以等間隔dl配置，另一側之探針 導孔48b係沿著另一側之假想直線L2以與探針導孔48& 相同等間隔dl配置。又，一側之探針導孔列之各導孔 與另一側之探針導孔列之各導孔48b，係以沿著相對向於 電極之排列直線的假想直線L交互等間隔配置之方式，沿 _ 著假想直線L使排列間距錯開配置。是以，探針導孔48(48a 4 8 b)以在假想直線L兩側沿著該假想直線L交叉配置之方 式規則性排列。又，在圖7及圖9所示之例中，各探針導 孔48(48a，48b)之緣部大致接近於假想直線乙。 在探針導孔48的排列，為了取代交叉配置而採用一列 配置，不須要圖9所示的探針導孔48b，若取代此在相鄰 探針導孔48a，48a間排列以假想線所示之探針導孔48a時， 相鄰探針導孔48a，48a間的距離為d2所示的距離。 _ 然而，如圖9明確所示，由於探針導孔48(48a，48b) 係採用該交叉配置，因此沿著該等之假想直線L相鄰探針 導孔48a，48b之間的距離d3，只要未改變沿著假想直線[ 之排列間距（dl/2)，則可設定成大於該距離ά2。又，與此 相反，不會損傷底板40的機械強度，採用小排列間距 (dl/2)〇 又，插通各探針導孔48(48a，48b)之各探針16之前端 部16a ’雖在圖7觀察時在假想直線L之兩側產生些微偏 16 200829921 移’但如圖6所示’由於在各探針16之前端部心形成曲 部64’因此能以等間距（dl/2)使各探針16之針頭w排列 於該電極排列之直線上。 較佳為，使各探針16之針頭16c朝向該電極排列之直 線的曲部64，當針頭16e朝向底板4Q以該最大移動距離 產生縱方向位移t時’係形成於從底板40突出的位置部分。 藉此，可將伴隨探針16之針頭16c之縱方向位移的橫方向 位移W抑制到最小。 又，在圖不之例中，如上述中間板42及頂板46之各 探針導孔50(50a，50b)及52(52a，52b)，亦採用對應於探針 導孔48(48a，48b)的排列。取代此，至少可將從底板4Q相 隔大於中間板42之位置之頂板46的探針導孔52(52a, 52b) 排成一列。然而，較佳為，除了使朝探針支撐體36之各 板構件4〇，42及46之各導孔48，50及52的探針16之插 通作業容易之外，中間板42及頂板46之各探針導孔5〇 及52亦設為如上述之交叉配置。 依據本發明之電氣連接裝置10，如前所述，不會導致 底板、即第1板構件的強度降低，可使待相對向於被檢查 體電極之小排列間距之相鄰探針16之針頭16c以小排列間 距排列。又’不論針頭丨之小排列間距如何，由於可於 各探針16之制動件部56之間保持充分之間隔，因此可確 實防止制動件部56之間的干涉。 在本發明之電氣連接裝置1 〇的組裝中，如前所述，在 將底板40、中間板42、及頂板46之各探針導孔48，50及 17 200829921 52排列配置之狀態下，以在探針16未產生彈性變形之直 線狀態下、即無負載地將各導孔48, 5〇及52插入=方式 組合於探針支撐體36’以使探針16之制動件部％位於； 板40及中間板42之間。 在此組合狀態下，對各探針16施加朝向一方向之一樣 的彈性變形’將頂板46相對中間板42及底板利朝橫方 向錯開，在此錯開的狀態下將頂板46結合於中間板42及 底板40。 藉此，在對多數個探針16施加朝一方向之均勻適當的 彈性變形之狀n下，可適當裝人於探針支料3卜又，由 於各探針16，係藉由該彈性變形在中間板42及頂板46之 間產生彎曲，因此各探針16可抑制在各導孔48, 5〇及μ 内的自由旋動。 在此探針16之旋動被抑制的狀態下，由於可在各探針 16形成每排朝相反方向之適當的曲部64，因此比較容易 使針頭16c適當位於對應假想直線[的電極排列線上。 —本叙明並不限於上述實施例，只要在不脫離該意圖之 範圍内，可進行各種改變。例如可除去頂板46。又，探針 支撐體36可採用圖示之例以外的各種框的構成。 【圖式簡單說明】 圖1係本發明之電氣連接裝置的俯視圖。 圖2係本發明之電氣連接裝置的前視圖。 圖3係沿圖}之線ΙΠ_ΙΠ所得的截面圖。 圖4係顯示圖3所示之探針組裝體之組裝步驟的圖， 18 200829921 係顯示探針組裝體之朝向探針支撐體之探針的插通步驟，（b) 係顯不將5早性變形導入各振針且結合探針支撐體3 6的结 合步驟。 圖5係顯示探針組裝體之探針之動作的說明圖，（a)係 顯示負載未作用於探針之針頭的狀態，(b)係顯示將探針之 針頭按壓至被檢查體電極的狀態。 圖6係將形成於本發明之探針組裝體之探針之曲部放 大顯示的部分戴面圖。 圖7係顯示設於本發明之探針支撐體之底板之探針導 孔之排列與引導至該各導孔之探針之針頭位置之關係之底 板的部分俯視圖。 圖8係顯示與本發明之探針支撐體之探針的關係，（a) 係顯示形成於頂板之導孔的排列，（b)係顯示頂板之導孔與 探針之關係之頂板的部分截面圖。 圖9係將圖7所示之一部分之導孔放大顯示的俯視圖。 【主要元件符號說明】 電氣連接裝置 14半導體晶圓 16探針 18探針組裝體 2〇連接板 22配線基板 26連接焊墊 34配線 19 200829921 36探針支撐體 40底板（第1板構件） 42中間板（第2板構件） 46頂板（第3板構件） 48, 50, 52探針導孔 54螺桿構件 5 6制動件部 64 曲部The elastic deformation shown in one direction. With this elastic deformation, the needle 16C of each probe 16 is displaced in the longitudinal direction as a whole in the longitudinal direction of the distal end portion 16a by an appropriate predetermined distance between the upper and lower jaws. Further, with this displacement t, the needle 16 is slightly slid in the lateral direction in the gap between the probe 16 and the probe guide holes 48, 50 provided in the bottom plate 40 and the intermediate plate 42. The needles 16c of the respective probes 16 are arranged in such a manner that the electrodes are formed in the respective wafer regions of the semiconductor wafer 14 as described above. In order to correspond to the small arrangement pitch of the electrodes, as shown in FIG. 6 and FIG. 7, in the electrical connection device 10 of the present invention, the probe guide holes 48 (48a, 4) disposed on the bottom plate 4 are arranged. In 2 columns. More specifically, as shown in FIG. 7, on both sides of the imaginary straight line L corresponding to the line connecting the electrodes connecting the center lines of the electrodes, the centers are located on an imaginary straight line U extending parallel to the imaginary straight line L. And in the manner of L1, the probe guide holes 48 (48a, 48b) are arranged in two rows. When the intermediate plate 42 is disposed close to the bottom plate 40, as shown in FIG. 6, the probe guide holes 50 (50a, 50b) of the intermediate plate 42 are arranged corresponding to the probe guide holes 48 (48a, 48b) of the bottom plate 4A. 2 columns. Furthermore, as shown in FIGS. 8(4) and (b), the probe vias 52 (52a, 52b) provided in the top plate 46 may also be integrated in the probe leads 15 200829921 holes 48 (48a, 48b) and the probe vias. 50 (5〇a, 50b) and set. The details of the guide holes in which the bottom plates 4 are arranged in two rows will be described with reference to Figs. 7 and 9 . As shown enlarged in Fig. 9, the probe guide holes 48a on one side are arranged at equal intervals dl along the imaginary straight line L1 on one side of the bottom plate 40, and the probe guide holes 48b on the other side are along the imaginary straight line on the other side. L2 is arranged at the same interval dl as the probe vias 48&. Further, each of the via holes of the probe via array on one side and each of the via holes 48b of the probe via array on the other side are arranged at equal intervals along an imaginary straight line L that is perpendicular to the alignment of the electrodes. In the manner, the arrangement pitch is shifted along the imaginary straight line L. Therefore, the probe guide holes 48 (48a 4 8 b) are regularly arranged in such a manner that they are arranged on both sides of the imaginary straight line L along the imaginary straight line L. Further, in the example shown in Figs. 7 and 9, the edge of each of the probe guide holes 48 (48a, 48b) is substantially close to the imaginary straight line B. In the arrangement of the probe vias 48, in order to replace the cross arrangement, a column arrangement is used, and the probe vias 48b shown in FIG. 9 are not required. If instead of this, the adjacent probe vias 48a, 48a are arranged in an imaginary line. When the probe guide hole 48a is shown, the distance between adjacent probe guide holes 48a, 48a is the distance indicated by d2. _ However, as clearly shown in Fig. 9, since the probe guide holes 48 (48a, 48b) adopt this cross configuration, the distance d3 between the adjacent probe guide holes 48a, 48b along the imaginary straight line L is equal. As long as the arrangement pitch (dl/2) along the imaginary straight line is not changed, it can be set larger than the distance ά2. Further, on the contrary, the mechanical strength of the bottom plate 40 is not damaged, and a small arrangement pitch (dl/2) is used, and the probes 16 are inserted into the front end portions 16a of the respective probe guide holes 48 (48a, 48b). Although a slight deviation 16 is generated on both sides of the imaginary straight line L when viewed in FIG. 7, 200829921 shifts 'but as shown in FIG. 6', since the curved portion 64' is formed at the front end of each probe 16, it can be equally spaced (dl/ 2) The needles w of the respective probes 16 are arranged on a straight line of the electrode array. Preferably, the needle portion 16c of each of the probes 16 is oriented toward the straight curved portion 64 of the electrode, and is formed at a position protruding from the bottom plate 40 when the needle 16e is displaced longitudinally by the maximum moving distance toward the bottom plate 4Q. section. Thereby, the lateral displacement W accompanying the longitudinal displacement of the needle 16c of the probe 16 can be minimized. Moreover, in the example of the figure, the probe via holes 50 (50a, 50b) and 52 (52a, 52b) of the intermediate plate 42 and the top plate 46 are also corresponding to the probe guide holes 48 (48a, 48b). The arrangement of ). Instead of this, at least the probe guide holes 52 (52a, 52b) of the top plate 46 separated from the bottom plate 4Q by a position larger than the intermediate plate 42 may be arranged in a line. However, it is preferable that the intermediate plate 42 and the top plate are provided in addition to the easy insertion work of the probes 16 of the respective guide holes 48, 50 and 52 of the respective plate members 4, 42 and 46 of the probe support body 36. Each of the probe guide holes 5 and 52 of 46 is also disposed as described above. According to the electrical connecting device 10 of the present invention, as described above, the strength of the bottom plate, that is, the first plate member is not lowered, and the needle of the adjacent probe 16 to be opposed to the small arrangement pitch of the electrode to be inspected can be made. 16c is arranged at a small arrangement pitch. Further, regardless of the small arrangement pitch of the needles, since a sufficient interval can be maintained between the stopper portions 56 of the respective probes 16, it is possible to surely prevent interference between the stopper portions 56. In the assembly of the electrical connecting device 1 of the present invention, as described above, in the state in which the probe holes 48, 50 and 17 200829921 52 of the bottom plate 40, the intermediate plate 42, and the top plate 46 are arranged in a row, In a straight state in which the probe 16 is not elastically deformed, that is, the guide holes 48, 5, and 52 are inserted into the probe support body 36' without load so that the brake portion of the probe 16 is located; Between the plate 40 and the intermediate plate 42. In this combined state, the same elastic deformation is applied to each of the probes 16 in one direction. The top plate 46 is offset from the intermediate plate 42 and the bottom plate in the lateral direction, and the top plate 46 is coupled to the intermediate plate 42 in the staggered state. And the bottom plate 40. Thereby, in the case of applying a uniform and appropriate elastic deformation in a direction to the plurality of probes 16, the probe material 3 can be appropriately mounted, and the probes 16 are elastically deformed by the elastic deformation. Since the intermediate plate 42 and the top plate 46 are bent, the probes 16 can suppress free rotation in the respective guide holes 48, 5 and μ. In a state where the rotation of the probe 16 is suppressed, since each of the probes 16 can form an appropriate curved portion 64 in each row in the opposite direction, it is relatively easy to appropriately position the needle 16c on the electrode alignment line corresponding to the imaginary straight line. . The present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit and scope of the invention. For example, the top plate 46 can be removed. Further, the probe support 36 can be configured by various frames other than the illustrated examples. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view of an electrical connecting device of the present invention. Figure 2 is a front elevational view of the electrical connector of the present invention. Figure 3 is a cross-sectional view taken along line ΙΠ_ΙΠ of Figure}. Figure 4 is a view showing the assembly procedure of the probe assembly shown in Figure 3, 18 200829921 showing the insertion step of the probe assembly facing the probe support, and (b) not showing 5 early The deformation is introduced into each of the vibrating needles and combined with the bonding step of the probe support 36. Fig. 5 is an explanatory view showing the operation of the probe of the probe assembly, wherein (a) shows a state in which the load does not act on the probe of the probe, and (b) shows that the needle of the probe is pressed to the electrode of the test object. status. Fig. 6 is a partial perspective view showing a curved portion of a probe formed in the probe assembly of the present invention. Fig. 7 is a partial plan view showing the bottom plate of the arrangement of the probe guide holes provided in the bottom plate of the probe support of the present invention and the position of the needle of the probe guided to the respective guide holes. Figure 8 is a view showing the relationship with the probe of the probe support of the present invention, (a) showing the arrangement of the guide holes formed in the top plate, and (b) showing the portion of the top plate showing the relationship between the guide holes of the top plate and the probe. Sectional view. Fig. 9 is a plan view showing an enlarged view of a guide hole of a portion shown in Fig. 7. [Description of main component symbols] Electrical connection device 14 Semiconductor wafer 16 Probe 18 Probe assembly 2 〇 Connection plate 22 Wiring substrate 26 Connection pad 34 Wiring 19 200829921 36 Probe support 40 bottom plate (first plate member) 42 Intermediate plate (second plate member) 46 top plate (third plate member) 48, 50, 52 probe guide hole 54 screw member 5 6 brake member portion 64 curved portion
2020