JP2008139034A - Electric connection device and its assembling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric connection device capable of coping with narrow pitch arrangement of electrodes of an object to be inspected. <P>SOLUTION: The electric connection device comprises a probe support member having a first plate member and a second plate member arranged with an interval from the first plate member wherein a plurality of probe guide holes penetrating in each plate member in a thickness direction, and a plurality of probes arranged by penetrating the probe guide holes and protruding the tip part wherein a needle point is formed so as to be brought into contact with the electrodes of the object to be inspected from the first plate member, and which have stoppers capable of locking at the margin of the hole between the first and the second plate members. Instead of arranging the guiding holes on a straight line, zigzag arrangement is adopted in the arrangement of each guide hole by interposing a zigzag part between a straight line, a bent part is formed at the tip part of the probe protruding from each guide hole having the zigzag arrangement so as to align the needle point on the straight line. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electrical connection apparatus suitable for use in electrical inspection of a semiconductor device such as a semiconductor IC chip or a semiconductor wafer in which the semiconductor IC chip is collectively assembled, and an assembling method thereof.

  An object to be inspected such as a semiconductor device undergoes an energization inspection to determine whether or not it operates according to the specifications. In this energization inspection, the device under test is connected to the tester body through an electrical connection device such as a probe card having a plurality of probes (contacts) whose needle tips are pressed against the electrodes of the device under test.

  A conventional electrical connection device of this type includes a probe assembly including a plurality of probes supported by a probe support including a lower plate, an intermediate plate, and an upper plate held at a distance from each other (for example, a patent) Reference 1 and 2). Each plate of the probe support is formed with a guide hole that allows the probe to pass therethrough. A stopper that protrudes outward in the radial direction of the probe is formed at a portion located between the lower plate and the upper plate of each probe arranged through the guide hole. In the state where the probe is assembled to the probe support, the probing of each probe from the probe support is prevented by the engagement between the edge of each guide hole in the lower plate and the upper plate and the stopper.

  The tip of each probe is arranged so as to protrude linearly from the guide hole in the lower plate, and the tip of this probe is pressed against the corresponding electrode arranged on the object to be inspected. Is done. The object to be inspected is an IC chip or a semiconductor wafer in which a large number of IC chips are fabricated. As the chip circuit is miniaturized, the electrode arrangement of the object to be inspected is also narrowed. In order to cope with this narrow pitch, it is necessary to dispose guide holes for the probes provided on the lower plate closer to each other. However, when arranging each guide hole on one straight line corresponding to one line of electrodes arranged along a straight line, it is aligned in a line to ensure the mechanical strength between the guide holes on the lower plate. A predetermined distance is required between the edges of the guide holes formed in this way. In order to secure this predetermined distance, there is a strong restriction on the reduction of the arrangement pitch of the guide holes in the lower plate, and therefore a strong restriction on the narrowing of the probe tip. For this reason, there has been a strong demand for an electrical connection device that can cope with a narrow pitch of the electrode array of the object to be inspected.

International Publication No. 2004/072661 Pamphlet JP 2006-003191 A

  Accordingly, an object of the present invention is to provide an electrical connection device that can cope with a narrow arrangement pitch of electrodes of an object to be inspected and an assembly method thereof.

  In the present invention, instead of arranging the guide holes for receiving the probes on a straight line, a staggered arrangement with the straight lines in between is adopted as the arrangement of the guide holes, and the staggered guide holes are arranged. This is based on the basic concept of forming a curved portion for aligning the needle tip in a straight line at the tip of the probe protruding from the head.

  Therefore, the present invention includes a first plate member and a second plate member disposed at a distance from the first plate member, and each of the plate members is substantially in the thickness direction thereof. The first plate member includes a probe support having a plurality of probe guide holes formed therethrough, and a tip portion having a tip formed at the tip which is disposed through the probe guide holes and comes into contact with an electrode of an object to be inspected. And a plurality of probes having stoppers that can be locked to an edge of the probe guide hole between the first and second plate members, and at least the first plate The plurality of guide holes of the member are arranged along the virtual straight line on both sides of the virtual line corresponding to the arrangement line of the electrodes, and the guide holes on both sides are arranged with a deviation from each other along the virtual line. And pass the guide through each guide hole. The said distal end portion of the over blanking, wherein the curved portion directed to the electrode of the array line corresponding to the said needle tip to the virtual straight line is formed.

  In the electrical connection device according to the present invention, the plurality of guide holes formed in the first plate member are respectively arranged on both sides of the virtual straight line, and the guide hole positions of the guide hole rows on both sides are set. Arranged with a deviation along the virtual straight line. Therefore, when viewed along the virtual straight line, it is arranged along the virtual straight line on the other side of the virtual straight line between the guide holes of the guide hole array arranged along the virtual straight line on one side of the virtual straight line. Each guide hole in the guide hole row is positioned. Therefore, the guide holes adjacent along the virtual straight line are alternately positioned on both sides along the virtual straight line. As a result, while maintaining this without causing a change in the diameter of each guide hole, along the virtual straight line without reducing the distance between the edges of the guide holes adjacent in the extending direction of the virtual straight line The distance between the centers of adjacent guide holes can be reduced. Further, the deviation of the probe tip of the probe that passes through the guide holes located on both sides of the virtual straight line from the straight line corresponding to the virtual straight line is corrected by a relatively small curved portion formed at the tip of each probe. be able to. By this curved portion, the needle points can be easily aligned on the straight line.

  Therefore, according to the electrical connection device of the present invention, the arrangement pitch of adjacent probes can be reduced without causing a decrease in strength of the first plate member provided with the guide hole. The pitch of the needle tips can be narrowed corresponding to the narrow pitch of the electrode arrangement. In addition, guide holes are formed at predetermined intervals on both sides of the straight virtual line. Therefore, since the probe guided along the guide hole does not cause interference between the stoppers in the vicinity of the guide hole, an electrical short-circuit problem due to the interference between the stoppers can be surely prevented.

  As is well known in the art, the probe tip can be displaced in the vertical direction toward and away from the first plate member as the probe is elastically deformed. The curved portion is preferably formed in a portion where the needle tip protrudes from the first plate member when the needle tip is displaced in the vertical direction at the maximum stroke toward the first plate member. . Thereby, the horizontal displacement accompanying the vertical displacement of the probe tip can be prevented.

  The plurality of guide holes of the first plate member may be in a so-called staggered arrangement along the straight line with the straight line corresponding to the virtual straight line in between.

  Probe guide holes for receiving the probes are further formed as the probe support, and are arranged on the opposite side of the second plate member from the side where the first plate member is arranged. A probe support having a third plate member and a screw member for assembling the plate members can be used. The screw member is in a state in which the probe penetrating each probe guide hole of the first to third plate members is elastically deformed to be displaced in the same direction between the second and third plate members. In order to hold each probe, the first to third plate members can be separated from each other.

  The guide holes provided in the second and third plate members can be staggered corresponding to the arrangement of the guide holes provided in the first plate member. In particular, when the second plate member is disposed close to the first plate member, it is desirable that the first and second guide holes be in the staggered arrangement described above.

  Furthermore, a connection plate can be provided. The connecting plate is disposed in contact with the third plate member on the side opposite to the side on which the second plate member is disposed as viewed from the third plate member. The probe support is supported on the connection plate. Also, one end of the wiring arranged through the connection plate can be connected to the base end of the probe.

  Furthermore, a wiring board having an opening penetrating in the thickness direction for assembling the connection board and a plurality of connection lands corresponding to the wirings can be provided, and the connection board can be supported on the wiring board. In this case, the other end of the wiring is connected to the connection land.

  In assembling the electrical connection device according to the present invention, first, the stopper portion of the probe is placed in a state where the corresponding guide holes of the first to third plate members are arranged in a straight line. The probe is combined with the plate members so as to be inserted between the guide holes of the first to third plate members in a linear state before elastic deformation so as to be positioned between the first and second plate members. .

  In this combined state, when the third plate member is displaced on a plane perpendicular to the plate thickness direction with respect to the first and second plate members, the probe is moved between the second and third plate members. A predetermined elastic deformation in one direction according to the displacement direction and the displacement amount is given. It is desirable that the third plate member is fixedly coupled to the first and second plate members by the screw member at a displacement position that gives predetermined elastic deformation to each probe.

  Accordingly, it is possible to appropriately incorporate the probe support in a state where a uniform and appropriate elastic deformation in one direction is given to a large number of the probes. This elastic deformation allows an appropriate elastic displacement in the length direction of the tip when the needle pressure acts on the needle tip of each probe.

  The third plate member is fixed to the first and second plate members in a state where the linear probe is elastically deformed in the one direction between the second and third plate members. It is desirable to form the curved portion of the probe after being coupled to.

  As long as the probe is held in a linear state in a free state, the probe is allowed to rotate relatively freely around its axis. Therefore, after forming a predetermined curved portion at the tip, if each probe is to be assembled into the probe support, each probe will be oriented so that the probe tips of the multiple probes are oriented in the proper direction. It is necessary to maintain the rotation posture of the curved portion properly. In addition, it is necessary to incorporate each probe into the probe support so as to introduce the uniform elastic displacement in the predetermined direction into a large number of the probes. Therefore, the assembly work of the probe becomes extremely complicated and not easy.

  However, as described above, when a large number of linear probes are incorporated into the probe support in a state where they are appropriately elastically deformed in one direction, each probe is free to move around its axis due to elastic deformation accompanied by warping. Rotation is suppressed. Therefore, a curved portion in an appropriate direction can be formed on each probe relatively easily in a state in which this rotation is suppressed, so that the needle tip can be appropriately directed in a predetermined direction relatively easily. .

  The electrical connection device according to the present invention can be used as a probe card for electrical inspection of an object to be inspected. This electrical connection device 10 is shown generally in FIGS. In the illustrated example, as shown in FIG. 2, the electrical connection device 10 is electrically connected to a large number of IC (integrated circuit) chip regions formed collectively on a semiconductor wafer 14 held on a chuck 12. Used for inspection.

  The electrical connection device 10 includes a probe assembly 18 in which a large number of probes 16 corresponding to a large number of electrodes (not shown) formed in the chip region are incorporated, and a connection plate 20 to which the probe assembly is coupled. And a circular wiring board 22 for holding the connection plate. As is well known in the art, the wiring substrate 22 is formed by incorporating a conductive path (not shown) in an electrically insulating substrate such as a glass-filled epoxy resin plate or a ceramic plate.

  The wiring substrate 22 has a rectangular opening 24 (see FIG. 2) penetrating in the thickness direction at the center thereof. On one surface 22 a of the wiring substrate 22, a large number of connection lands 26 are arranged in alignment along a pair of opposite sides of the opening 24. A large number of tester lands 28 (see FIG. 1) connected to an electric circuit of a tester (not shown) are arranged on the outer edge portion of the one surface 22a. Each connection land 26 is connected to the corresponding tester land 28 through the conductive path of the wiring board 22 as in the prior art.

  The connection plate 20 is made of an electrically insulating material, and has a rectangular portion 20a having a rectangular planar shape that can be accommodated in the opening 24, and a rectangular annular shape that projects from one surface of the rectangular portion to the outer edge of the rectangular portion 20a. And a flange portion 20b. As clearly shown in FIG. 2, the connecting plate 20 has a rectangular portion 20 a received in the opening 24 of the wiring substrate 22 and an annular flange portion 20 b on the one surface 22 a of the wiring substrate 22. 1 and is fixed to the wiring board 22 by a plurality of screw members 30 shown in FIG.

  As shown in FIG. 1, a large number of through holes 32 (32 a, 32 b) are formed in the rectangular portion 20 a of the connection plate 20 so as to penetrate in the plate thickness direction. The through holes 32 (32a, 32b) are formed corresponding to the respective electrodes in the IC chip region of the semiconductor wafer 14.

  Each chip region of the semiconductor wafer 14 that is an object to be inspected generally has a rectangular planar shape. A large number of the electrodes in each chip region are arranged in a line so as to draw a rectangle along each side of each chip region, for example, although not shown. In the example shown in FIG. 1, the through holes 32 (32a and 32b) of the connection plate 20 formed corresponding to the respective electrodes in the IC chip region are formed corresponding to the eight chip regions. However, in the illustrated example, the through holes 32a and 32b are doubled so as to draw a double rectangular ring inside and outside the rectangular array along the rectangular electrode row for each chip region. Furthermore, the through holes 32a and 32b are arranged with a deviation so as to be alternately arranged in the arrangement direction for each chip region.

  Each probe 16 of the probe assembly 18 is connected to the wiring 34 shown in FIG. As will be described later, the probe 16 is electrically connected to one end of a corresponding wiring 34 at its base end, and the other end of the wiring is connected to a corresponding connection land 26. Accordingly, each probe 16 is connected to an electric circuit of the tester via a tester land 28 corresponding to the connection land 26 to which the probe 16 is connected.

  As shown in FIG. 3, the probe assembly 18 in which a large number of probes 16 are incorporated includes a probe support 36 that allows each probe 16 to pass therethrough. The probe support 36 has a rectangular plate shape as a first plate member as a whole and has a flat plate-like lower plate 40 and a spacer function of a rectangular frame portion 40a formed on the edge of the lower plate. The intermediate plate 42, which is a second plate member that is superimposed on the rectangular frame portion with a space between the portions excluding the rectangular frame portion 40a, and the intermediate plate are overlapped via a rectangular frame 44 having a spacer function. And an upper plate 46 which is a third plate member. Each of the lower plate 40, the intermediate plate 42, and the upper plate 46 has probe guide holes 48 (48a, 48b), 50 (50a, 50b) and 52 (52a, 52) that allow the probes 16 to penetrate in the respective plate thickness directions. 52b) is formed. FIG. 3 shows one guide hole 48a, 50a, and 52a from the relationship of the cut surfaces.

  The probe guide holes 48 (48a, 48b), 50 (50a, 50b) and 52 (52a, 52b) of the lower plate 40, the intermediate plate 42, and the upper plate 46 are respectively connected to the plate members 40, 42, 46, respectively. They are arranged at equal intervals and can be aligned with each other. The lower plate 40, the intermediate plate 42, the rectangular frame 44, and the upper plate 46 are integrally coupled by tightening the screw member 54, whereby the rectangular probe support 36 is assembled as a whole.

  In this coupled state, the intermediate plate 42 is substantially spaced from the lower plate 40, and the upper plate 46 is spaced from the intermediate plate 42 on the side opposite to the side where the lower plate 40 is disposed. Is held. Further, the probe guide holes 48 and 50 of the lower plate 40 and the intermediate plate 42 are aligned with each other, whereas the probe guide holes 52 of the upper plate 46 are in a position biased to one side in the arrangement direction. . The probe guide holes 52 (52a, 52b) of the upper plate 46 are aligned with the through holes 32 (32a, 32b) of the connection plate when attached to the connection plate 20 of the probe support 36.

  Each probe 16 is disposed through each probe guide hole 48 (48a, 48b), 50 (50a, 50b) and 52 (52a, 52b) of the probe support 36. Each probe 16 has a stopper 56 that can be locked to the edge of each probe guide hole 48, 50 between the lower plate 40 and the intermediate plate 42. The probe 16 projects its tip 16a from the lower surface 40c of the lower plate in a state where the stopper portion 56 is in contact with the upper surface 40b of the lower plate 40.

  In assembling the probe assembly 18, as shown in FIG. 4A, each probe of the lower plate 40, the intermediate plate 42, and the upper plate 46 of the probe support 36 with the screw member 54 removed. The lower plate 40, the intermediate plate 42, the rectangular frame 44, and the upper plate 46 are combined so that the guide holes 48, 50, 52 are aligned. In this combined state, each of the linear probes 16 passes through the probe guide holes 48, 50, 52 that position and align the respective stopper portions 56 between the lower plate 40 and the intermediate plate 42. It is incorporated in the support 36.

  Thereafter, as shown in FIG. 4B, the upper plate 46 is positioned on the plane with respect to the lower plate 40, the intermediate plate 42 and the rectangular frame 44 so that the screw holes 58 for the screw members 54 are aligned. Is moved in one direction. Thereby, the screw member 54 is screwed into the aligned screw hole 58, and the probe assembly 18 is assembled. In the assembled state of the probe assembly 18, as described above, the probe guide hole 52 of the upper plate 46 of the probe support 36 is set to one side with respect to the probe guide holes 48 and 50 of the lower plate 40 and the intermediate plate 42. Since all the probes 16 are biased, elastic bending deformation accompanied by warpage is introduced between the intermediate plate 42 and the upper plate 46.

  As shown in FIG. 2, the assembled probe assembly 18 projects the probe assembly 18 from the other surface 22b of the wiring board 22 and the tip of the probe 16 faces the lower semiconductor wafer 14, Arranged on the connecting plate 20. Further, the probe assembly 18 determines an appropriate position where the corresponding probe 16 and the wiring 34 are aligned with respect to the connection plate 20, as shown in FIG. 5A, by the positioning action of the positioning pin 60 shown in FIG. At this proper position, it is fixed to the connection plate 20 by the screw member 62.

  The intermediate plate 42 is disposed on the lower surface 46b side of the upper plate 46, and the connection plate 20 is rectangular on the upper plate 46 with the upper surface 46a opposite to the lower surface 42b of the upper plate, as shown in FIG. The part 20a is disposed in contact with the part 20a.

  The wiring 34 connected to the base end of each probe 16 of the probe assembly 18 includes a core wire 34a and a coating 34b made of an insulating material covering the core wire in the example shown in FIG. Prepare. Each wiring 34 uses an appropriate adhesive in the through hole 32 so that the end of the core wire 34a contacts the base end 16b of the probe 16 that passes through the probe guide hole 52 (52a, 52b) of the upper plate 46. It is fixed. By introducing the elastic bending deformation described above, each probe 16 presses the end surface of the base end portion of the probe 16 against the end surface of the end portion of the core wire 34a with its elastic force, and the stopper portion 56 is pressed against the lower plate 40. Press toward.

  A stopper portion 56 of each probe 16 provided between the lower plate 40 and the intermediate plate 42 is formed between an upper surface 40b of the lower plate 40 and a lower surface 42a of the intermediate plate 42 that faces the upper surface and is spaced from the upper surface 40b. Is allowed to exercise between. Therefore, when the probe tip 16c, which is the tip of the tip portion 16a of the probe 16, is relatively pressed against the corresponding electrode of the semiconductor wafer 14, each probe 16 is indicated by a virtual line in FIG. Cause elastic deformation in one direction. Along with this elastic deformation, the needle tips 16c of the probes 16 are displaced in the longitudinal direction as a whole along the longitudinal direction of the distal end portion 16a at an appropriate predetermined stroke t between the upper surface 40b and the lower surface 42a. . Further, with this displacement t, a slight slip w occurs in the lateral direction in the needle tip 16c within the range of play between the probe 16 and the probe guide holes 48, 50 provided in the lower plate 40 and the intermediate plate 42. .

  The needle tips 16c of the probes 16 are arranged corresponding to the electrodes formed in alignment with the chip regions of the semiconductor wafer 14 as described above. In order to cope with this narrow arrangement pitch of the electrodes, as shown in FIGS. 6 and 7, in the electrical connection device 10 according to the present invention, probe guide holes 48 (48 a, 48 b) provided in the lower plate 40 are Arranged in two rows. More specifically, as shown in FIG. 7, the respective centers on virtual straight lines L2 and L1 extending parallel to the virtual straight line L on both sides of the virtual straight line L corresponding to the arrangement line of the electrodes connecting the center lines of the electrodes are shown. The probe guide holes 48 (48a, 48b) are arranged in two rows so as to be positioned.

  When the intermediate plate 42 is disposed close to the lower plate 40, as shown in FIG. 6, the probe guide holes 50 (50a, 50b) of the intermediate plate 42 are replaced with the probe guide holes 48 (48a, 48b) of the lower plate 40. ) Are arranged in two columns. Furthermore, as shown in FIGS. 8A and 8B, the probe guide holes 52 (52a, 52b) provided in the upper plate 46 are also connected to the probe guide holes 48 (48a, 48b) and the probe guide holes 50 (50a, 50b).

  Details of the guide holes arranged in two rows will be described for the lower plate 40 with reference to FIGS. 7 and 9. As shown in an enlarged view in FIG. 9, one probe guide hole 48a is arranged at equal intervals d1 along one virtual straight line L1 of the lower plate 40, and the other probe guide along the other virtual straight line L2. The holes 48b are arranged at the same equidistant intervals d1 as in the probe guide holes 48a. Moreover, each guide hole 48a of one probe guide hole row and each guide hole 48b of the other probe guide row are alternately arranged at equal intervals along a virtual straight line L facing the electrode arrangement straight line. The arrangement pitch is arranged along the virtual straight line L with a deviation. Therefore, the probe guide holes 48 (48a, 48b) are regularly arranged so as to form a so-called staggered arrangement along the virtual straight line L. Moreover, in the example shown in FIGS. 7 and 9, the edge of each probe guide hole 48 (48a, 48b) is substantially in contact with the virtual straight line L.

  In order to adopt a one-row arrangement instead of the staggered arrangement for the arrangement of the probe guide holes 48, the probe guide holes 48b shown in FIG. 9 are not required, and instead, virtual lines are provided between adjacent probe guide holes 48a and 48a. When the probe guide holes 48a shown in FIG. 6 are arranged, the distance between the adjacent probe guide holes 48a and 48a becomes the distance shown by d2.

  However, as clearly shown in FIG. 9, by adopting the staggered arrangement described above for the probe guide holes 48 (48a, 48b), adjacent probe guide holes 48a, 48b along their virtual straight line L The distance d3 can be set larger than the distance d2 described above unless the arrangement pitch (d1 / 2) along the virtual straight line L is changed. On the contrary, a narrow arrangement pitch (d1 / 2) can be adopted without impairing the mechanical strength of the lower plate 40.

  Further, the tip 16a of each probe 16 that passes through each probe guide hole 48 (48a, 48b) is slightly biased on both sides of the virtual straight line L as seen in FIG. 7, but as shown in FIG. By forming the curved portion 64 at the distal end portion 16a of the probe 16, the probe tips 16c of the probes 16 can be aligned on the straight line of the electrode array at an equal pitch (d1 / 2).

  The curved portion 64 that directs the needle tips 16c of the probes 16 toward the straight line of the electrode arrangement is a position that protrudes from the lower plate 40 when the needle tips 16c are displaced toward the lower plate 40 in the longitudinal direction with the maximum stroke. It is desirable to form in the part which exists in. Thereby, the horizontal displacement w accompanying the vertical displacement of the probe tip 16c of the probe 16 can be suppressed to the minimum necessary.

  In the illustrated example, as described above, the probe guide holes 50 (50a, 50b) and 52 (52a, 52b) of the intermediate plate 42 and the upper plate 46 are also arranged corresponding to the probe guide holes 48 (48a, 48b). Is adopted. Alternatively, the probe guide holes 52 (52a, 52b) of the upper plate 46 at least spaced from the intermediate plate 42 from the lower plate 40 can be arranged in a line. However, in order to facilitate the insertion operation of the probe 16 into the guide holes 48, 50 and 52 of the plate members 40, 42 and 46 of the probe support 36, the probe guide holes of the intermediate plate 42 and the upper plate 46 are used. 50 and 52 are also preferably arranged in a staggered manner as described above.

  According to the electrical connection device 10 of the present invention, as described above, adjacent probes are arranged so as to face the narrow arrangement pitch of the electrodes of the object to be inspected without reducing the strength of the lower plate, that is, the first plate member. The 16 needle tips 16c can be aligned with a narrow arrangement pitch. In addition, since a sufficient distance can be maintained between the stopper portions 56 of the probes 16 regardless of the narrow arrangement pitch of the needle tips 16c, interference between the stopper portions 56 can be reliably prevented.

  In assembling the electrical connecting apparatus 10 according to the present invention, as described above, the probe is placed in such a manner that the probe guide holes 48, 50 and 52 of the lower plate 40, the intermediate plate 42 and the upper plate 46 are aligned. 16 so that the stoppers 56 are positioned between the lower plate 40 and the intermediate plate 42, so that the probe 16 is inserted into the guide holes 48, 50 and 52 in a straight line state where no elastic deformation occurs, that is, with no load. Combine with support 36.

  In this combined state, the upper plate 46 is shifted laterally with respect to the intermediate plate 42 and the lower plate 40 in order to give each probe 16 uniform elastic deformation in one direction. Coupled to the plate 42 and the lower plate 40.

  As a result, it is possible to properly incorporate the probe 16 into the probe support 36 in a state where a uniform and appropriate elastic deformation in one direction is given to a large number of probes 16. Further, since each probe 16 is warped between the intermediate plate 42 and the upper plate 46 by the elastic deformation described above, each probe 16 is restrained from freely rotating in each guide hole 48, 50 and 52. .

  In a state in which the rotation of the probe 16 is suppressed, an appropriate curved portion 64 that faces in the reverse direction for each array is formed on each probe 16, so that the needle tip 16 c can be appropriately matched to the virtual straight line L relatively easily. Can be positioned on the electrode array line.

  The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention. For example, the upper plate 46 can be omitted. In addition to the illustrated example, various frame configurations can be adopted as the probe support 36.

It is a top view of the electrical connection apparatus which concerns on this invention. It is a front view of the electrical connection apparatus which concerns on this invention. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 4 is a diagram illustrating an assembly process of the probe assembly illustrated in FIG. 3, wherein (a) illustrates a process of inserting the probe into the probe support of the probe assembly, and (b) is a probe that is elastically introduced into each probe to be probed. A bonding step for bonding the support 36 will be described. It is explanatory drawing which shows the motion of the probe of a probe assembly, (a) shows the state in which the load is not acting on the probe tip, (b) is the probe tip pressed against the electrode of a to-be-inspected object. Indicates the state. It is a fragmentary sectional view which expands and shows the curved part formed in the probe of the probe assembly concerning the present invention. It is a partial top view of the lower board which shows the relationship between the arrangement | sequence of the probe guide hole provided in the lower board of the probe support body which concerns on this invention, and the needle point position of the probe guided by this each guide hole. The relationship between the probe support according to the present invention and the probe is shown, (a) shows the arrangement of guide holes formed in the upper plate, and (b) shows the relationship between the guide holes on the upper plate and the probe. FIG. It is a top view which expands and shows a part of guide hole shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electrical connection apparatus 14 Semiconductor wafer 16 Probe 18 Probe assembly 20 Connection board 22 Wiring board 26 Connection land 34 Wiring 36 Probe support body 40 Lower board (1st board member)
42 Intermediate plate (second plate member)
46 Upper plate (third plate member)
48, 50, 52 Probe guide hole 54 Screw member 56 Stopper part 64 Curved part

Claims (8)

A plurality of probe guide holes each having a first plate member and a second plate member spaced from the first plate member and penetrating substantially in the thickness direction of each of the plate members. And a probe support member formed through the probe guide hole and a tip end formed at the tip of the probe tip that contacts the electrode of the object to be inspected is arranged to protrude from the plate member of 1. A plurality of elastically deformable linear probes each having a stopper that can be locked to an edge of the probe guide hole between the first and second plate members,
At least the plurality of guide holes of the first plate member are arranged along the virtual straight line on both sides of the virtual straight line corresponding to the arrangement line of the electrodes, and the guide holes on both sides are arranged along the virtual straight line. The tip of the probe that passes through each guide hole is formed with a curved portion that directs the needle tip toward the electrode on the array line corresponding to the virtual straight line. A characteristic electrical connection device.   The needle tip of the probe can be displaced toward and away from the first plate member in accordance with elastic deformation of the probe, and the maximum stroke of the needle tip toward the first plate member. The electrical connection device according to claim 1, wherein the curved portion is formed at a position protruding from the first plate member when displaced by.   The electrical connection device according to claim 1, wherein the plurality of guide holes of the first plate member are staggered along the straight line with the straight line corresponding to the virtual straight line in between.   The probe support is further formed with a probe guide hole for receiving each probe, and is arranged on the opposite side of the second plate member from the side where the first plate member is arranged. A third plate member; and a screw member for assembling the plate members. The screw member includes the second and third probes that pass through the probe guide holes of the first to third plate members. 2. The first to third plate members are detachably coupled to each other so as to hold the probes in a state in which the third plate members are elastically deformed to be displaced in the same direction. Electrical connection device.   The electrical connection according to claim 4, wherein the guide holes provided in the second and third plate members are arranged in a staggered manner corresponding to the arrangement of the guide holes provided in the first plate member. apparatus.   Furthermore, a connection plate that is disposed in contact with the third plate member on the side opposite to the side on which the second plate member is disposed as viewed from the third plate member, and that supports the probe support. The electrical connection device according to claim 5, further comprising: a wiring that is disposed through the connection plate and has one end connected to a proximal end of the probe.   Furthermore, it is a wiring board that supports the connection plate, and has an opening penetrating in the thickness direction for assembling the connection plate, and a plurality of connection lands, and each wiring is connected to the corresponding connection land, respectively. The electrical connection device according to claim 6, wherein The stopper portion of the probe is positioned between the first and second plate members in a state where the corresponding guide holes of the first to third plate members are arranged in a straight line. Combining the probes with the plate members so as to insert the guide holes of the first to third plate members in a linear state before elastic deformation,
In this combined state, the third plate member is perpendicular to the plate thickness direction with respect to the first and second plate members so that the probe is elastically deformed in one direction between the second and third plate members. Applying a displacement in one direction on a flat plane, and fixedly coupling the third plate member to the first and second plate members by the screw member at the displacement position;
8. The method of assembling the electrical connection device according to claim 7, wherein the bending portion of the probe is formed in a state where the probe is prevented from rotating around its axis by the elastic deformation.

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