CN103941049A - Probe card - Google Patents
Probe card Download PDFInfo
- Publication number
- CN103941049A CN103941049A CN201310021497.0A CN201310021497A CN103941049A CN 103941049 A CN103941049 A CN 103941049A CN 201310021497 A CN201310021497 A CN 201310021497A CN 103941049 A CN103941049 A CN 103941049A
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- Prior art keywords
- probe
- substrate
- pedestal
- weld pad
- pad
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Abstract
Provided is a probe card, comprising a substrate, at least a welding pad and at least a probe structure. The substrate is provided with a first surface and an opposite second surface, and is provided with at least a through hole passing through the substrate. The welding pad is configured in the substrate. The probe structure is configured on the first surface of the substrate. The probe structure comprises at least a probe, and the probe passes through the through hole and is connected with the welding pad on the second surface of the substrate. In the probe card, the probe passes through the through hole of the substrate and is connected with the welding pad on the second surface of the substrate, and a user can more easily perform connection operation and adjust probe length needed in the connection operation, so as to be beneficial for connection operation, so that the probe card is relatively simple in manufacturing.
Description
Technical field
The present invention relates to a kind of pick-up unit, and be particularly related to a kind of probe.
Background technology
The testing electrical property of integrated circuit (IC) chip (integrated circuit chip, IC chip) is all considerable in each stage of manufacture of semiconductor.Each IC chip must be accepted to detect to guarantee its electrical functionality in wafer and encapsulation kenel.
Wafer sort (wafer test) is tester table and probe (probe card) to be formed detect loop, probe in probe is directly contacted with weld pad (pad) or projection (bump) on wafer, to utilize probe, survey each chip on wafer, thereby draw chip signal, and these chip signal data are sent to and detect board and perform an analysis and judge.Thus, can be before encapsulation step, filtering in advance electrically and the chip of dysfunction, improves encapsulation manufacturing cost to avoid the increase of defective products.
Traditional probe is directly welded in printed circuit board surface by probe, is electrically connected whereby probe and weld pad.Yet this kind of welding method is more not convenient and degree of difficulty is higher in welding operation, and the making of probe is difficult for.
Summary of the invention
The object of this invention is to provide a kind of probe, it is comparatively simple on making.
For achieving the above object, the invention provides a kind of probe, comprise substrate, at least one weld pad and at least one probe structure.Substrate has relative first surface and second surface, and has at least one through hole that runs through substrate.Weld pad is configured in substrate.Probe structure is configured on the first surface of substrate.Probe structure comprises at least one probe, and probe is connected with weld pad on the second surface of substrate through through hole.
Described in one embodiment of the invention, in above-mentioned probe, through hole can run through weld pad.
Described in one embodiment of the invention, in above-mentioned probe, the connected mode of probe and weld pad is for example welding.
Described in one embodiment of the invention, in above-mentioned probe, probe structure more comprises pedestal.Pedestal is configured on the first surface of substrate, and probe is configurable on pedestal.
Described in one embodiment of the invention, in above-mentioned probe, the material of pedestal is for example pottery.
Described in one embodiment of the invention, in above-mentioned probe, probe comprises needle tip.Needle tip is positioned at pedestal top, and the angle of the normal to a surface direction of needle tip and pedestal is for example between 0 ° to 10 °.
Described in one embodiment of the invention, in above-mentioned probe, probe is to be for example fixed on pedestal via sticker.
Described in one embodiment of the invention, above-mentioned probe more comprises bracing or strutting arrangement.Bracing or strutting arrangement comprises back up pad and at least one support column.Support column is configured in back up pad.Back up pad is configured in the second surface below of substrate, and support column passes substrate with bearing base.
Described in one embodiment of the invention, in above-mentioned probe, the material of probe is for example tungsten, rhenium, beallon, gold, silver or platinum.
Described in one embodiment of the invention, in above-mentioned probe, substrate is for example printed circuit board (PCB).
Based on above-mentioned, in probe proposed by the invention, because probe is connected with weld pad on the second surface of substrate through the through hole of substrate, required probe length when therefore user can more easily carry out attended operation and adjust attended operation, be beneficial to the carrying out of attended operation, and then make probe comparatively simple on making.Therefore in addition, when probe structure has many probes, because probe proposed by the invention is on second surface, probe to be connected with weld pad, can make the length of each probe level off to the shortest and isometric, thus promote test signal electrically.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended graphic being described in detail below.
Accompanying drawing explanation
Fig. 1 is the diagrammatic cross-section of the probe of the first embodiment of the present invention.
Fig. 2 is the diagrammatic cross-section of the probe of the second embodiment of the present invention.
Wherein, description of reference numerals is as follows:
10,20: probe
100,200: substrate
102: first surface
104: second surface
106,206: through hole
110,210: weld pad
120: probe structure
122: probe
124: pedestal
126: sticker
128: needle tip
130: scolder
140: bracing or strutting arrangement
142: back up pad
144: support column
D: normal direction
α: angle
Embodiment
Fig. 1 is the diagrammatic cross-section of the probe of the first embodiment of the present invention.
Please refer to Fig. 1, probe 10 comprises substrate 100, at least one weld pad 110 and at least one probe structure 120.Substrate 100 is for example printed circuit board (PCB).Substrate 100 has relative first surface 102 and second surface 104, and has at least one through hole 106 that runs through substrate 100.
In the present embodiment, through hole 106 is for example by running through weld pad 110, to run through substrate 100, so that through hole 106 and weld pad 110 can be used the same area of substrate 100 jointly.Therefore, substrate 100 does not need extra area to configure through hole 110, therefore can promote further the area utilization of substrate 100.That is during circuit pattern in design on substrate 100, the collocation method of the through hole 106 of the present embodiment can make circuit pattern have larger design flexibility.
Weld pad 110 is configured in substrate 100.The material of weld pad 110 is for example copper or aluminium.The formation method of weld pad 110 is for example to electroplate or other applicable methods.Weld pad 110 may extend on the second surface 104 of substrate 100, and then makes the part second surface 104 of weld pad 110 covered substrates 100, yet the present invention is not as limit.In another embodiment, weld pad 110 also can only be formed in substrate 100 and the surface of covered substrate 100 not.In other embodiments, weld pad 110 can only extend on the first surface 102 of substrate 100, or weld pad 110 can extend on the first surface 102 and second surface 104 of substrate 100 simultaneously.
Probe structure 120 is configured on the first surface 102 of substrate 100.Probe structure comprises at least one probe 122, and probe 122 is connected with weld pad 110 on the second surface 104 of substrate 100 through through hole 106.The material of probe 122 is for example tungsten, rhenium, beallon, gold, silver, platinum or other applicable materials.When probe structure 120 has many probes 122, probe 122 can be arranged to single layer structure or multiple-level stack structure.In the present embodiment, probe 122 is that to be arranged to single layer structure be that example describes.When being arranged to the probe 122 of single layer structure and being damaged, can to probe 122, change easily.
In the present embodiment, probe 122 is for example welding with the connected mode of weld pad 110.For instance, can carry out the welding between probe 122 and weld pad 110 by scolder 130.The material of scolder 130 is for example tin, nickel, silver, lead or other applicable materials.Due to weld pad 110 with the circuit pattern of substrate 100 for being electrically connected, so probe structure 120 can utilize probe 122 to be connected to weld pad 110 and be electrically connected with the circuit pattern of substrate 100, and then forms detection loop.
In addition, carrying out the attended operation of linking probe 122 with weld pad 110 when (as welded), user often needs operating space to carry out above-mentioned attended operation.Yet because dispose a plurality of probe structures 120 on the first surface 102 of substrate 100, the existence of probe structure 120 will reduce user's operating space and is unfavorable for that user carries out above-mentioned attended operation.In comparison, owing to not configuring probe structure 120 on the second surface 104 at substrate 100, therefore before linking probe 122 and weld pad 110, can first probe 122 be exposed to second surface 104 through through hole 106, and then make user can on second surface 104, carry out the attended operation between probe 122 and weld pad 110.In other words, if first by probe 122 through through hole 106 and carry out the attended operation between probe 122 and weld pad 110 on the second surface 104 of substrate 100, this kind of method can provide operating space that user is larger with more easily and more accurately linking probe 122 and weld pad 110.In addition, when probe structure 120 has many probes 122, because said method is that probe 122 is passed after through hole 106, then carry out the attended operation between probe 122 and weld pad 110, can make the length of probe 122 level off to the shortest and isometric, thus promote test signal electrically.
In addition, because the probe 122 of the present embodiment is to be connected with weld pad 110 on the second surface 104 of substrate 100 through through hole 106, therefore the present embodiment can utilize the design of through hole 106 to make to have certain distance between each probe 122, and prevents further each probe 122 from contacting with each other and produce the problem of short circuit.In other words, the present embodiment does not need to use insulating sleeve can prevent from producing between probe 122 problem of short circuit, and then can save the cost that uses insulating sleeve to spend.
In the present embodiment, probe structure 120 more can comprise pedestal 124, and pedestal 124 is configured on the first surface 102 of substrate 100, and probe 122 is configured on pedestal 124.Pedestal 124 act as carrying probe 122, and then make in the manufacturing process of probe 10 or at follow-up use probe 122 in the process with detection chip, probe 122 can not be out of shape because of effect of stress.The material of pedestal 124 is for example pottery or other insulating material, therefore can avoid the problem of probe 122 circuit for generating short circuits.Probe 122 is to be for example fixed on pedestal 124 via sticker 126, can avoid whereby probe 122 because being subject to stress, to produce the situations such as distortion or displacement.The material of sticker 126 is for example epoxy resin.Probe 122 comprises needle tip 128, and needle tip 128 is positioned at pedestal 124 tops, and the angle α of the normal to a surface direction D of needle tip 128 and pedestal 124 is between 0 ° to 10 °.
In addition, probe 10 more comprises bracing or strutting arrangement 140.The material of bracing or strutting arrangement 140 is for example the steel through Quenching Treatment.Bracing or strutting arrangement 140 comprises back up pad 142 and at least one support column 144.Support column 144 is configured in back up pad 142.Back up pad 142 and support column 144 are such as for can be one of the forming or be connected to form bracing or strutting arrangement 140 by modes such as welding.Back up pad 142 configuration 140 below the second surface 104 of substrate 100, support column 142 through and outstanding substrate 100 with bearing base 124.Therefore in the process of detection chip, substrate 100 may be for temperature variation produces thermal deformation, so pedestal 124 likely departs from original position because of the thermal deformation of substrate 100.Yet, by bracing or strutting arrangement 140, pedestal 124 can be fixed on to certain position, and can avoid probe structure 120 when detection chip because of the thermal deformation of substrate 100, to produce the problem of position skew.
Known based on above-described embodiment, because probe 122 is to be connected with weld pad 110 on the second surface 104 of substrate 100 through through hole 106, required probe length when therefore user can more easily carry out attended operation and adjustment and connects, and then make probe comparatively simple on making.In addition, when probe structure 120 has many probes 122, because the probe 10 of the present embodiment is on second surface 104, probe 122 to be connected with weld pad 110, therefore can make the length of each probe 122 level off to the shortest and isometric, thereby promote test signal electrically.
Fig. 2 is the diagrammatic cross-section of the probe of the second embodiment of the present invention.Please refer to Fig. 2, the probe 20 of Fig. 2 is with the different part of the probe 10 of Fig. 1: the through hole 206 of probe 20 does not directly run through weld pad 210, but only runs through substrate 200.In other words, weld pad 210 is to be disposed at around through hole 206, and probe 122 is through after through hole 206, on the second surface 104 of substrate 200, is connected with weld pad 210.In addition, in probe 20 and probe 10, identical member is used same numeral to represent, therefore repeat no more in this.
Known based on above-described embodiment, because probe 20 is also that probe 122 is connected with this weld pad on the second surface 104 of substrate 200 through through hole 206, so probe 20 also has comparatively simple advantage in making.
In sum, the probe of above-described embodiment at least has following feature.The probe of above-described embodiment is easier to carry out the attended operation between probe and weld pad, and and then makes probe comparatively simple on making.In addition, when the probe structure of the probe of above-described embodiment has many probes, the length of probe levels off to the shortest and isometric, thus promote test signal electrically.
Although the present invention discloses as above with embodiment; so it is not in order to limit the present invention; any those of ordinary skills; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion depending on the appended claim scope person of defining.
Claims (10)
1. a probe, is characterized in that, comprising:
Substrate, has relative first surface and second surface, and has at least one through hole that runs through this substrate;
At least one weld pad, is configured in this substrate; And
At least one probe structure, is configured on this first surface of this substrate, and wherein this at least one probe structure comprises at least one probe, and this at least one probe is connected with this weld pad on this second surface of this substrate through this through hole.
2. probe as claimed in claim 1, wherein this at least one through hole runs through this weld pad.
3. probe as claimed in claim 1, wherein the connected mode of this at least one probe and this at least one weld pad comprises welding.
4. probe as claimed in claim 1, wherein this probe structure also comprises pedestal, this pedestal is configured on this first surface of this substrate, and this at least one probe configuration is on this pedestal.
5. probe as claimed in claim 4, wherein the material of this pedestal comprises pottery.
6. probe as claimed in claim 4, wherein this at least one probe comprises needle tip, this needle tip is positioned at this pedestal top, and the angle of the normal to a surface direction of this needle tip and this pedestal is between 0 ° to 10 °.
7. probe as claimed in claim 4, wherein this at least one probe is fixed on via sticker on this pedestal.
8. probe as claimed in claim 4, also comprise bracing or strutting arrangement, this bracing or strutting arrangement comprises back up pad and at least one support column, this at least one support column is configured in this back up pad, this back up pad is configured in this second surface below of this substrate, and this at least one support column passes this substrate to carry this pedestal.
9. probe as claimed in claim 1, wherein the material of this at least one probe comprises tungsten, rhenium, beallon, gold, silver or platinum.
10. probe as claimed in claim 1, wherein this substrate comprises printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310021497.0A CN103941049A (en) | 2013-01-21 | 2013-01-21 | Probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310021497.0A CN103941049A (en) | 2013-01-21 | 2013-01-21 | Probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103941049A true CN103941049A (en) | 2014-07-23 |
Family
ID=51188799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310021497.0A Pending CN103941049A (en) | 2013-01-21 | 2013-01-21 | Probe card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103941049A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104459231A (en) * | 2014-12-02 | 2015-03-25 | 上海华岭集成电路技术股份有限公司 | Multi-temperature-zone wafer test probe card |
| CN108427021A (en) * | 2017-02-13 | 2018-08-21 | 华邦电子股份有限公司 | Probe, probe module and preparation method thereof |
| CN109564242A (en) * | 2016-07-28 | 2019-04-02 | 泰克诺探头公司 | Probe card for electronic device |
| WO2024021200A1 (en) * | 2022-07-26 | 2024-02-01 | 上海泽丰半导体科技有限公司 | Probe high-speed testing apparatus and testing system |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03195974A (en) * | 1989-12-25 | 1991-08-27 | Nec Corp | Probe card |
| TW460698B (en) * | 1999-04-16 | 2001-10-21 | Advantest Corp | Probe card and its manufacture |
| TW200829921A (en) * | 2006-11-30 | 2008-07-16 | Nihon Micronics Kk | Electric connection device and its assembling method |
| US20080186042A1 (en) * | 2007-02-07 | 2008-08-07 | Willtechnology Co., Ltd. | Probe card |
| CN101256201A (en) * | 2007-02-27 | 2008-09-03 | 南茂科技股份有限公司 | Probe head module group capable of detecting multiple positions |
| TW201030872A (en) * | 2008-11-21 | 2010-08-16 | Fine Instr Co Ltd | Probe card and manufacturing method thereof |
| JP2010216991A (en) * | 2009-03-17 | 2010-09-30 | Japan Electronic Materials Corp | Probe card |
| CN102193009A (en) * | 2010-03-16 | 2011-09-21 | 台湾积体电路制造股份有限公司 | Vertical probe card |
| CN102466739A (en) * | 2010-11-02 | 2012-05-23 | 旺矽科技股份有限公司 | Probe card |
-
2013
- 2013-01-21 CN CN201310021497.0A patent/CN103941049A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03195974A (en) * | 1989-12-25 | 1991-08-27 | Nec Corp | Probe card |
| TW460698B (en) * | 1999-04-16 | 2001-10-21 | Advantest Corp | Probe card and its manufacture |
| TW200829921A (en) * | 2006-11-30 | 2008-07-16 | Nihon Micronics Kk | Electric connection device and its assembling method |
| US20080186042A1 (en) * | 2007-02-07 | 2008-08-07 | Willtechnology Co., Ltd. | Probe card |
| CN101256201A (en) * | 2007-02-27 | 2008-09-03 | 南茂科技股份有限公司 | Probe head module group capable of detecting multiple positions |
| TW201030872A (en) * | 2008-11-21 | 2010-08-16 | Fine Instr Co Ltd | Probe card and manufacturing method thereof |
| JP2010216991A (en) * | 2009-03-17 | 2010-09-30 | Japan Electronic Materials Corp | Probe card |
| CN102193009A (en) * | 2010-03-16 | 2011-09-21 | 台湾积体电路制造股份有限公司 | Vertical probe card |
| CN102466739A (en) * | 2010-11-02 | 2012-05-23 | 旺矽科技股份有限公司 | Probe card |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104459231A (en) * | 2014-12-02 | 2015-03-25 | 上海华岭集成电路技术股份有限公司 | Multi-temperature-zone wafer test probe card |
| CN109564242A (en) * | 2016-07-28 | 2019-04-02 | 泰克诺探头公司 | Probe card for electronic device |
| CN109564242B (en) * | 2016-07-28 | 2022-10-21 | 泰克诺探头公司 | Probe card for electronic device |
| CN108427021A (en) * | 2017-02-13 | 2018-08-21 | 华邦电子股份有限公司 | Probe, probe module and preparation method thereof |
| CN108427021B (en) * | 2017-02-13 | 2020-08-21 | 华邦电子股份有限公司 | Probe head, probe module and manufacturing method thereof |
| WO2024021200A1 (en) * | 2022-07-26 | 2024-02-01 | 上海泽丰半导体科技有限公司 | Probe high-speed testing apparatus and testing system |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140723 |
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| RJ01 | Rejection of invention patent application after publication |