CN101256201A - Probe head module group capable of detecting multiple positions - Google Patents
Probe head module group capable of detecting multiple positions Download PDFInfo
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- CN101256201A CN101256201A CNA200710079964XA CN200710079964A CN101256201A CN 101256201 A CN101256201 A CN 101256201A CN A200710079964X A CNA200710079964X A CN A200710079964XA CN 200710079964 A CN200710079964 A CN 200710079964A CN 101256201 A CN101256201 A CN 101256201A
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- probe
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- 239000000523 sample Substances 0.000 title claims abstract description 172
- 238000001514 detection method Methods 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000009966 trimming Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Abstract
A probe head module for multi-part detection mainly comprises a probe head baseplate and a plurality of probe switchover pieces. One surface of the probe head baseplate is provided with a plurality of detection areas arranged in matrix and each detection area are provided with a number of connection pads. Each probe switchover piece has one upper surface and one down surface, wherein the upper surface has a number of probes and the down surface has a number of abutting ends. Each probe switchover piece abuts to the corresponding detection area, therefore the abutting ends are connected with the connection pads. When some probes are in failure and abrasive wear, it is only necessary to replace the probe switchover pieces in failure without changing the whole probe head module, so that the probe head module has features of low cost, heavy industry and increased use expedience.
Description
Technical field
The present invention relates to a kind of probe, particularly relate to the probe module that a kind of multi-section position is surveyed.
Background technology
In the integrated circuit testing field, use probe (probe card) to be loaded in one and survey in the board, probe is provided with probe on the surface of a probe (probe head), touches a to-be-measured integrated circuit (DUT in order to electrical spy, device under test), with as electrical transport interface.In test process, probe has the phenomenon of abrasion, crooked or broken needle, and needs trimming.Trimming mode in the past is to change probe, must all probes are worn, new probe is set again.So for the probe that (multi-site probing) surveyed in the multi-section position, can cause sizable waste with inconvenient.So-called multi-section position is surveyed, be once to visit in the action of pressing, be electrically conducted most to-be-measured integrated circuit simultaneously, single integrated circuit of same type of just testing, the probe that the probe that the multi-section position is surveyed is surveyed than single position has several times to tens times number of probes.
As shown in Figure 1, a kind of probe 100 of existing multi-section position detection mainly comprises a probe 110, a printed circuit board (PCB) 120 and most probes 130.One surface, 111 definition of this probe 110 have the detecting area 112 of most arranged, and each detecting area 112 can correspond to a to-be-measured integrated circuit.Another surface of this probe 110 is arranged on this printed circuit board (PCB) 120.Each probe 130 has a stiff end 131 and an end of probe 132, and those stiff ends 131 are directly welded in those detecting areas 112 of this probe 110, and those end of probe 132 can be visited electrode tip or the testing cushion of touching most to-be-measured integrated circuit simultaneously.In the past when wherein a probe 130 damages, then need to change whole probe 110.The trimming cost and the time of the probe 100 of multi-section position detection have been caused significantly increasing.
This shows that the probe that above-mentioned existing multi-section position is surveyed obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of probe module of multi-section position detection of new structure, just becoming the current industry utmost point needs improved target.
Because the defective that the probe that above-mentioned existing multi-section position is surveyed exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, the probe module of surveying in the hope of the multi-section position of founding a kind of new structure, can improve the probe that general existing multi-section position is surveyed, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Fundamental purpose of the present invention is to provide the probe module of a kind of multi-section position detection, when making it overcome the probe probe damage of surveying existing multi-section position therein, need to change the whole probe head, caused significantly increasing the trimming cost of the probe of surveying the multi-section position and the defective of time.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to the present invention, the probe module that a kind of multi-section position is surveyed mainly comprises a probe substrate and most probe switching pieces.One surface definition of this probe substrate has the detecting area of most arranged, is provided with most connection gaskets in each detecting area.Those probe switching pieces have a upper surface and a lower surface, and this upper surface is provided with most probes, and this lower surface is provided with most abutting ends.Wherein, each probe switching piece is engaged to corresponding detecting area, so that those abutting ends are connected to those connection gaskets.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
In the probe module that aforesaid multi-section position is surveyed, those probe switching pieces can have the thermal expansivity identical with this probe substrate.
In the probe module that aforesaid multi-section position is surveyed, those probe switching pieces can be semiconductor, pottery or film material.
In the probe module that aforesaid multi-section position is surveyed, those probe switching pieces can have most perforations, to engage an end of those probes.
In the probe module that aforesaid multi-section position is surveyed, can insert welding compound in those perforations, to fix those probes.
In the probe module that aforesaid multi-section position is surveyed, this welding compound is lead-free solder or conducting resinl.
In the probe module that aforesaid multi-section position is surveyed, those abutting ends can be soldered ball.
In the probe module that aforesaid multi-section position is surveyed, all probe switching pieces can have the identical size of essence, thickness and circuit and distribute.
The probe module that multi-section of the present invention position is surveyed, probe does not wherein directly weld and is located at single probe, but be bonded on other most probe switching pieces, when part probe fault or abrasion damage, only need replace probe switching piece and need not replace whole probe module, have the effect of saving cost, heavy industry and increasing ease of use with fault probe.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of instructions, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1: the schematic cross-section of the probe that existing multi-section position is surveyed.
Fig. 2: according to a specific embodiment of the present invention, the schematic cross-section of the probe module that the multi-section position is surveyed.
Fig. 3: according to a specific embodiment of the present invention, the schematic perspective view of the probe head mould that the multi-section position is surveyed.
Fig. 4: according to a specific embodiment of the present invention, the schematic perspective view of the probe substrate of the probe head mould that the multi-section position is surveyed.
Fig. 5: according to a specific embodiment of the present invention, the wherein schematic cross-section of a probe switching piece of the probe head mould that the multi-section position is surveyed.
Fig. 6 A and Fig. 6 B: according to a specific embodiment of the present invention, the forward of probe switching piece and reverse schematic perspective view.
Fig. 7 A to Fig. 7 E: according to a specific embodiment of the present invention, the schematic cross-section of a wherein probe switching piece in manufacturing process of the probe head mould that the multi-section position is surveyed.
100; Probe 110: probe
111: surface 112: detecting area
120: printed circuit board (PCB) 130: probe
131: stiff end 132: end of probe
200: probe module 210: the probe substrate
211: surface 212: detecting area
213: connection gasket 220: the probe switching piece
221: upper surface 222: lower surface
223: perforation 224: metal gasket
230: probe 231: stiff end
232: end of probe 233: connecting link
240: abutting end 250: welding compound
310: printed circuit board (PCB)
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, its embodiment of probe module, structure, feature and effect thereof that the multi-section position that foundation the present invention is proposed is surveyed, describe in detail as after.
A specific embodiment of the present invention discloses the probe module that a kind of multi-section position is surveyed.Fig. 2 is the schematic cross-section of this probe module, and Fig. 3 is the schematic perspective view of this probe module, and Fig. 4 is the schematic perspective view of the probe substrate of this probe module.See also shown in Figure 2ly, the probe module 200 that this multi-section position is surveyed can be installed in a multilayer board 310, to form a probe.Cooperate and consult Fig. 3, this probe module 200 mainly comprises a probe substrate 210 and most probe switching pieces 220, wherein most probes 230 are arranged at those probe switching pieces 220, each probe switching piece 220 can be corresponding to a to-be-measured integrated circuit, as a wherein wafer of a wafer or a wherein packaging structure of a winding (figure does not draw).See also shown in Figure 4ly, a surface 211 definition of this probe substrate 210 have the detecting area 212 of most arranged, are provided with most connection gaskets 213 in each detecting area 212.This probe substrate 210 can be provided with most passive devices outside those detecting areas 212, to do electrically protection and voltage stabilizing.
See also shown in Fig. 5, Fig. 6 A and Fig. 6 B, those probe switching pieces 220 have a upper surface 221 and a lower surface 222, and this upper surface 221 is provided with most probes 230, and this lower surface 222 is provided with most abutting ends 240.In the present embodiment, those abutting ends 240 can be soldered ball, can be engaged to those connection gaskets 213 in the reflow mode.Those probe switching pieces 220 can have most perforations 223, to engage a stiff end 231 of those probes 230.In addition, each probe 230 has a unsettled end of probe 232, touches the electrode tip or the testing cushion of semiconductor products such as wafer, BGA, TCP or TCP packaging part in order to spy.Preferably, all probe switching pieces 220 can have the identical size of essence, thickness and circuit and distribute, and have versatility in order to replacement, so each probe switching piece 220 can shared mutually and displacement.
Please consult Fig. 2 and shown in Figure 3 again, wherein, each probe switching piece 220 is engaged to corresponding detecting area 212, so that those abutting ends 240 are connected to those connection gaskets 213.In the present embodiment, those probe switching pieces 220 can have the thermal expansivity identical with this probe substrate 210.For example, those probe switching pieces 220 can be semiconductor, pottery or film material.
Therefore, in the probe module that above-mentioned multi-section position is surveyed, those probes 230 directly do not weld and are located at single probe, but be bonded on other most probe switching pieces 220, when probe 230 partly breaks down or wear away damage, only need replace probe switching piece 220 and need not replace whole probe module 200 (as shown in Figures 2 and 3), have the effect of saving cost, heavy industry and increasing ease of use with fault probe.
Fig. 7 A to Fig. 7 E further discloses the manufacture method that aforementioned probe switching piece 220 is provided with probe 230.At first, see also shown in Fig. 7 A, most probe switching pieces 220 are provided.Each probe switching piece 220 has a upper surface 221, a lower surface 222 and most perforations 223, and wherein this lower surface 222 is provided with most metal gaskets 224, and those metal gaskets 224 are positioned at an end of corresponding those perforations 223.In the present embodiment, those perforations 223 run through this upper surface 221 and this lower surface 222.
Then, see also shown in Fig. 7 B, insert most probes 230 in those perforations 223.Each probe 230 all has a stiff end 231 and an end of probe 232, and those stiff ends 231 are connected to a connecting link 233 and are positioned at those perforations 223, and those end of probe 232 have the consistance height that protrudes in this probe switching piece 220.Then, see also shown in Fig. 7 C, insert a welding compound 250, in order to the stiff end 231 that welds those probes 230 in those perforations 223 and make those probes 230 reach electric connection with those metal gaskets 224.In the present embodiment, this welding compound 250 can be lead-free solder.In different embodiment, this welding compound 250 or can be conducting resinl.
Afterwards, see also shown in Fig. 7 D, cut off being connected of this connecting link 233 and those probes 230.At last, see also shown in Fig. 7 E, the abutting end 240 that most individual for example soldered balls are set just can be made into above-mentioned probe switching piece 220 with probe 230 in this lower surface 222 of those probe switching pieces 220.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (9)
1. the probe module surveyed of a multi-section position is characterized in that comprising:
One probe substrate, the surface thereof definition has the detecting area of most arranged, is provided with most connection gaskets in each detecting area; And
A most probe switching piece, it has a upper surface and a lower surface, and this upper surface is provided with most probes, and this lower surface is provided with most abutting ends;
Wherein, each probe switching piece is engaged to corresponding detecting area, so that those abutting ends are connected to those connection gaskets.
2. the probe module that multi-section according to claim 1 position is surveyed is characterized in that wherein said probe switching piece has the thermal expansivity identical with the probe substrate.
3. the probe module that multi-section according to claim 1 and 2 position is surveyed is characterized in that wherein said probe switching piece is semiconductor, pottery or film material.
4. the probe module that multi-section according to claim 1 position is surveyed is characterized in that wherein said probe switching piece has most perforations, to engage an end of those probes.
5. the probe module that multi-section according to claim 4 position is surveyed is characterized in that having inserted welding compound in the wherein said perforation, with stationary probe.
6. the probe module that multi-section according to claim 5 position is surveyed is characterized in that wherein said welding compound is lead-free solder or conducting resinl.
7. according to the probe module of claim 1 or the detection of 4 described multi-section positions, it is characterized in that wherein said abutting end is a soldered ball.
8. the probe module that multi-section according to claim 1 position is surveyed is characterized in that wherein all probe switching pieces have the identical size of essence, thickness and circuit and distribute.
9. the probe module that multi-section according to claim 1 position is surveyed is characterized in that wherein each probe switching piece can correspond to a to-be-measured integrated circuit chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA200710079964XA CN101256201A (en) | 2007-02-27 | 2007-02-27 | Probe head module group capable of detecting multiple positions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA200710079964XA CN101256201A (en) | 2007-02-27 | 2007-02-27 | Probe head module group capable of detecting multiple positions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101256201A true CN101256201A (en) | 2008-09-03 |
Family
ID=39891173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA200710079964XA Pending CN101256201A (en) | 2007-02-27 | 2007-02-27 | Probe head module group capable of detecting multiple positions |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101256201A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103869108A (en) * | 2014-03-17 | 2014-06-18 | 上海华虹宏力半导体制造有限公司 | Card clamping device and multiple-station testing device |
| CN103941049A (en) * | 2013-01-21 | 2014-07-23 | 华邦电子股份有限公司 | Probe card |
| CN108254676A (en) * | 2018-03-26 | 2018-07-06 | 苏州联讯仪器有限公司 | A kind of high precision laser chip aging clamp |
| CN109253715A (en) * | 2017-07-13 | 2019-01-22 | 株式会社三丰 | Measuring Device Management System and computer-readable medium |
| CN109557444A (en) * | 2017-09-26 | 2019-04-02 | 颖崴科技股份有限公司 | The test method of wafer scale electronic building brick |
| CN112305394A (en) * | 2020-11-06 | 2021-02-02 | 法特迪精密科技（苏州）有限公司 | Probe socket piece and probe assembly |
| CN116840526A (en) * | 2023-09-01 | 2023-10-03 | 江苏协和电子股份有限公司 | Needle head, PCB detection equipment using needle head and use method |
| CN117368545A (en) * | 2023-12-05 | 2024-01-09 | 苏州微飞半导体有限公司 | Plug-injection type conductive adhesive testing module |
-
2007
- 2007-02-27 CN CNA200710079964XA patent/CN101256201A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103941049A (en) * | 2013-01-21 | 2014-07-23 | 华邦电子股份有限公司 | Probe card |
| CN103869108A (en) * | 2014-03-17 | 2014-06-18 | 上海华虹宏力半导体制造有限公司 | Card clamping device and multiple-station testing device |
| CN103869108B (en) * | 2014-03-17 | 2016-08-17 | 上海华虹宏力半导体制造有限公司 | Card holding device device and multi-functional position test device |
| CN109253715A (en) * | 2017-07-13 | 2019-01-22 | 株式会社三丰 | Measuring Device Management System and computer-readable medium |
| CN109557444A (en) * | 2017-09-26 | 2019-04-02 | 颖崴科技股份有限公司 | The test method of wafer scale electronic building brick |
| CN108254676A (en) * | 2018-03-26 | 2018-07-06 | 苏州联讯仪器有限公司 | A kind of high precision laser chip aging clamp |
| CN112305394A (en) * | 2020-11-06 | 2021-02-02 | 法特迪精密科技（苏州）有限公司 | Probe socket piece and probe assembly |
| CN112305394B (en) * | 2020-11-06 | 2021-04-27 | 法特迪精密科技（苏州）有限公司 | Probe socket piece and probe assembly |
| CN116840526A (en) * | 2023-09-01 | 2023-10-03 | 江苏协和电子股份有限公司 | Needle head, PCB detection equipment using needle head and use method |
| CN116840526B (en) * | 2023-09-01 | 2023-10-31 | 江苏协和电子股份有限公司 | Needle head, PCB detection equipment using needle head and use method |
| CN117368545A (en) * | 2023-12-05 | 2024-01-09 | 苏州微飞半导体有限公司 | Plug-injection type conductive adhesive testing module |
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Open date: 20080903 |