CN201477114U - Electric property testing module - Google Patents
Electric property testing module Download PDFInfo
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- CN201477114U CN201477114U CN2009201457165U CN200920145716U CN201477114U CN 201477114 U CN201477114 U CN 201477114U CN 2009201457165 U CN2009201457165 U CN 2009201457165U CN 200920145716 U CN200920145716 U CN 200920145716U CN 201477114 U CN201477114 U CN 201477114U
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- assembly welding
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Abstract
The utility model relates to an electric property testing module, which is adaptable to testing electric property functions between an electronic device and a to-be-tested element. The electric property testing module comprises a first substrate, a second substrate, a flexible circuit board and a conductive material, wherein the first substrate is electrically connected with the electronic device; the second substrate with a first group of signal measuring points is electrically connected to the to-be-tested element; and the flexible circuit board is provided with a first group of welding pads, a second group of welding pads, a plurality of through holes and a plurality of lines. The first group of welding pads and the second group of welding pads are respectively positioned at two ends of each line and mutually electrically connected through the lines; the through holes respectively penetrate through the first group of welding pads and the second group of welding pads; the conductive material is filled inside each through hole; the first group of welding pads and the second group of welding pads are respectively electrically connected with the first substrate and the second substrate through the conductive material; and the to-be-tested element is electrically connected with the electronic device through the second substrate, the flexible circuit board and the first substrate so as to conduct a test of the electric property functions.
Description
Technical field
The utility model relates to a kind of test module (test module), particularly relates to a kind of testing electrical property module (electrical test module).
Background technology
In recent years, progress along with development in science and technology, electronic product is towards high-speed, high-effect, compact trend design, and employed main electronic component all is main flow with the semiconductor package in the electronic product, therefore in semiconductor fabrication, high density, dynamical semiconductor package are also just given birth to because of accumulateing, common have a sphere grid array formula (Ball Grid Array, BGA) encapsulation kenel or thin space sphere grid array (Fine-pitch Ball Grid Array, FBGA) encapsulation kenel.
Yet, increase day by day along with the size of electronic product significantly reduces, electronic component distance to each other gets over the lapping number of plies intensive, circuit board, and the density of electronic component internal circuit significantly improves down, is difficult to merely utilize the mode that electrically contacts or stick together to measure the signal of associated electronic components.Therefore, measuring or during the test electronic signal,, thereby causing that research and development are gone up, in the measurement or the difficulty in the debug (debug), even have a strong impact on the listing time-histories of product usually because can't find suitable measurement or test point to provide measures and test.
For instance, at a chip that is welded with sphere grid array formula (BGA) encapsulation kenel (is wafer, this paper all is called chip) electronic installation on during measurement signal, because the mode of bga type attitude causes circuit board must use the technology of blind buried via hole, the signal of required measurement is again usually at the internal layer of multilayer circuit board, so that on electronic installation, can not find the semaphore measuring point that can directly measure, unless destroy or run through circuit board, otherwise can't measure at all.Again for example, the electronic component periphery of required measurement usually tight other electronic components, or the circuit of electronic component is all under electronic component, so can't measure this electronic component signal.
Existing testing electrical property module (for example BGA testing electrical property module) can be divided into two kinds of frameworks: one is the fixed framework of hardboard, is the fixed framework of rigid-flex secondly.Though these two kinds of frameworks can provide the measurement signal point, the fixed framework of hardboard is everlasting when being welded on the electronic product, is subjected to the interference of BGA extension in addition easily, causes the difficulty of locating and welding; And the fixed framework of rigid-flex is when the element of welding BGA part, and also Chang Yinwei BGA needs the high temperature reflow and causes the soft board of testing electrical property module (be module, this paper all is called module) partly to be out of shape or damage.In addition, these two kinds of frameworks also can only measure the particular electronic component on certain specific electronic product usually, so will measure other element the time, must be new testing electrical property module of element design more again.So the practice will significantly increase R﹠D costs, and the cost of manpower.
This shows that above-mentioned existing testing electrical property module obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of novel testing electrical property module, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Summary of the invention
The purpose of this utility model is, overcome the defective that existing testing electrical property module exists, and provide a kind of novel testing electrical property module, technical matters to be solved is to make it need not change circuit layout or need not redesign under the situation of new testing electrical property module, still keep original test function, and the appropriate signals gauge point can be provided,, be very suitable for practicality to reduce testing cost.
The purpose of this utility model and to solve its technical matters be to adopt following technical scheme to realize.A kind of testing electrical property module according to the utility model proposes is suitable for testing the electrical functionality between an electronic installation and the element under test.The testing electrical property module comprises one first substrate, one second substrate, a flexible circuit board and a conductive material.First substrate is electrically connected to electronic installation.Second substrate is electrically connected to element under test.Second substrate has first group of semaphore measuring point.Flexible circuit board has the first assembly welding pad, the second assembly welding pad, a plurality of perforation and many circuits.The first assembly welding pad and the second assembly welding pad lay respectively at the two ends of these circuits, and are electrically connected to each other by these circuits.These perforations run through the first assembly welding pad and the second assembly welding pad respectively.Conductive material is filled in these perforations.The first assembly welding pad and the second assembly welding pad are respectively by conductive material and first substrate and the electric connection of second substrate.Element under test electrically connects with electronic installation by second substrate, flexible circuit board, first substrate.Electronic installation and element under test can be tested to each other electrical functionality by first group of semaphore measuring point or second group of semaphore measuring point.
In an embodiment of the present utility model, above-mentioned electronic installation has a plurality of first connection pads, and first substrate has the 3rd assembly welding pad that is disposed at one first upper surface and the 4th assembly welding pad that is disposed at one first lower surface.The 3rd assembly welding pad is the first assembly welding pad of corresponding flexible circuit board respectively, and electrically connects with the first assembly welding pad.The 4th assembly welding pad is first connection pad of corresponding electronic installation respectively, and electrically connects with first connection pad.The 3rd assembly welding pad and the 4th assembly welding pad are electrically connected to each other.
The 4th assembly welding pad of the first above-mentioned substrate electrically connects by first connection pad of a plurality of soldered balls and electronic installation respectively.
In an embodiment of the present utility model, above-mentioned element under test has a plurality of second connection pads, and second substrate has the 5th assembly welding pad and the 8th assembly welding pad that is disposed at one second upper surface, and the 6th assembly welding pad and the 7th assembly welding pad that are disposed at one second lower surface.The second assembly welding pad of the corresponding flexible circuit board of the 5th assembly welding pad (or the 6th assembly welding pad), and electrically connect with the second assembly welding pad.These second connection pads of the corresponding element under test of the 7th assembly welding pad (or the 8th assembly welding pad), and electrically connect with second connection pad.The 7th assembly welding pad of the second above-mentioned substrate or the 8th assembly welding pad electrically connect by the second winding pad of a plurality of soldered balls and element under test.
The second above-mentioned substrate has more one second group of semaphore measuring point.Wherein, first group of semaphore measuring point, the 5th assembly welding pad and the 8th assembly welding pad are disposed at second upper surface.Second group of semaphore measuring point, the 6th assembly welding pad and the 7th assembly welding pad are disposed at second lower surface.The 5th assembly welding pad, the 6th assembly welding pad, the 7th assembly welding pad, the 8th assembly welding pad, first group of semaphore measuring point and second group of semaphore measuring point are electrically connected to each other.
In an embodiment of the present utility model, the first above-mentioned substrate comprises a printed circuit board (PCB).
In an embodiment of the present utility model, the second above-mentioned substrate comprises a printed circuit board (PCB).
Based on above-mentioned, because testing electrical property module of the present utility model is electrically connected to electronic installation and element under test, and second substrate of testing electrical property module has first group of semaphore measuring point and second group of semaphore measuring point, so electronic installation and element under test can be tested to each other electrical functionality by first group of semaphore measuring point or second group of semaphore measuring point.
By technique scheme, the utility model testing electrical property module has following advantage and beneficial effect at least: testing electrical property module of the present utility model, owing to use rigid-flex separate type framework, can allow the separately high temperature reflow separately of first substrate and electronic installation, second substrate and element under test, compared to known technology, the utility model can be avoided flexible circuit board Yin Gaowen reflow and the distortion even the corrupted that cause, and can avoid causing the difficulty of locating and welding because of being subjected to the interference of extension beyond the BGA.Moreover, second substrate of testing electrical property module of the present utility model and flexible circuit board use the spot welding mode to electrically connect, and therefore convenient disassembly only needs to change second substrate or change the design of second substrate circuit, can measure different element under tests, increase the polytrope and the convenience of this module.
In sum, the utility model testing electrical property module is still kept original test function, and the appropriate signals gauge point can be provided not changing circuit layout or need not redesigning under the situation of new testing electrical property module, to reduce testing cost.The utility model has obvious improvement technically, and has tangible good effect, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of instructions, and for above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic perspective view of a kind of testing electrical property module, electronic installation and the element under test of an embodiment of the present utility model.
Fig. 2 is the schematic side view of testing electrical property module, electronic installation and the element under test of Fig. 1.
Fig. 3 is the schematic top plan view and the partial cutaway schematic of flexible circuit board of the testing electrical property module of Fig. 1.
Fig. 4 is electrically connected to the diagrammatic cross-section of electronic installation and element under test for the testing electrical property module of Fig. 1.
100: 110: the first substrates of testing electrical property module
110a: the first upper surface 110b: first lower surface
114: the four assembly welding pads of 112: the three assembly welding pads
120: the second substrate 120a: second upper surface
120b: 122: the five assembly welding pads of second lower surface
125: the seven assembly welding pads of 124: the six assembly welding pads
126: the first groups of semaphore measuring points of 127: the eight assembly welding pads
128: the second groups of semaphore measuring points 130: flexible circuit board
134: the second assembly welding pads of 132: the first assembly welding pads
136: perforation 138: circuit
140: conductive material 150a, 150b: soldered ball
200: 202: the first connection pads of electronic installation
300: 302: the second connection pads of element under test
Embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, to according to its embodiment of testing electrical property module, structure, feature and the effect thereof that the utility model proposes, describe in detail as after.
Relevant aforementioned and other technology contents, characteristics and effect of the present utility model can clearly present in the following detailed description that cooperates with reference to graphic preferred embodiment.Explanation by embodiment, when can being to reach technological means that predetermined purpose takes and effect to get one more deeply and concrete understanding to the utility model, yet appended graphic only provide with reference to the usefulness of explanation, be not to be used for the utility model is limited.
Fig. 1 is the schematic perspective view of a kind of testing electrical property module, electronic installation and the element under test of an embodiment of the present utility model, Fig. 2 is the schematic side view of testing electrical property module, electronic installation and the element under test of Fig. 1, Fig. 3 is the schematic top plan view and the partial cutaway schematic of flexible circuit board of the testing electrical property module of Fig. 1, and Fig. 4 is electrically connected to the diagrammatic cross-section of electronic installation and element under test for the testing electrical property module of Fig. 1.
Please consult Fig. 1, Fig. 2 and shown in Figure 4 earlier, in the present embodiment, testing electrical property module 100 is suitable for testing the electrical functionality between an electronic installation 200 and the element under test 300, and wherein electronic installation 200 has a plurality of first connection pads 202, and element under test 300 has a plurality of second connection pads 302.Testing electrical property module 100 comprises one first substrate 110, one second substrate 120, a flexible circuit board 130 and a conductive material 140.
Specifically, first substrate 110 for example is a printed circuit board (PCB), it has one first upper surface 110a, first a lower surface 110b with respect to the first upper surface 110a, the 3rd assembly welding pad 112 and the 4th assembly welding pad 114, wherein the 3rd assembly welding pad 112 is disposed on the first upper surface 110a, the 4th assembly welding pad 114 is disposed on the first lower surface 110b, and the 3rd assembly welding pad 112 and the 4th assembly welding pad 114 are electrically connected to each other.In the present embodiment, the 4th assembly welding pad 114 of first substrate 110 is first connection pad 202 of corresponding electronic installation 200 respectively, and electrically connects with first connection pad 202.
What deserves to be mentioned is; the utility model does not limit the kenel of second substrate 120; though being embodied as, second substrate 120 that reaches mentioned herein has two groups of semaphore measuring points (first group of semaphore measuring point 126 and second group of semaphore measuring point 128); but in other embodiments; second substrate 120 also can have single group or two groups of above gauge points; still belong to the adoptable technical scheme of the utility model, do not break away from the scope of the utility model institute desire protection.
Please consult Fig. 3 and shown in Figure 4 simultaneously, flexible circuit board 130 has the first assembly welding pad 132, the second assembly welding pad 134, a plurality of perforation 136, many circuits 138 and conductive material 140, wherein, the first assembly welding pad 132 and the second assembly welding pad 134 lay respectively at the two ends of these circuits 138, and are electrically connected to each other by these circuits 138.Perforation 136 runs through the first assembly welding pad 132 and the second assembly welding pad 134 (among Fig. 3 only schematically local amplify illustrate perforation 136 run through one second assembly welding pad 134) respectively.The first assembly welding pad 132 is the 3rd assembly welding pad 112 of corresponding first substrate 110 respectively, and electrically connects with the 3rd assembly welding pad 112.The second assembly welding pad 134 is the 5th assembly welding pad 122 (or the 6th assembly welding pad 124) of corresponding second substrate 120 respectively, and electrically connects with the 5th assembly welding pad 122 (or the 6th assembly welding pad 124).
What deserves to be mentioned is; the utility model does not limit the kenel of second substrate 120; though mentioned herein and second substrate 120 be embodied as and have two assembly welding pads (the 5th assembly welding pad 122 or the 6th assembly welding pad 124) can be distinguished separately and flexible circuit board 130 electric connections; and have two assembly welding pads (the 7th assembly welding pad 125 or the 8th assembly welding pad 127) and can distinguish separately and element under test 300 electric connections; but in other embodiments; second substrate 120 also can have single group or the weld pad more than two groups and flexible circuit board 130 to electrically connect; also can there be single group or the weld pad more than two groups and element under test 300 to electrically connect; still belong to the adoptable technical scheme of the utility model, do not break away from the scope of this creation institute desire protection.
Below will do an explanation for the process that testing electrical property module 100 is electrically connected to electronic installation 200 and element under test 300.Please consult Fig. 2 and shown in Figure 4 simultaneously, at first, go up a plurality of soldered ball 150a of formation in the mode of planting ball in the first lower surface 110b of first substrate 110, wherein, these soldered balls 150a is positioned on the 4th assembly welding pad 114.Then, first substrate 110 is soldered on the electronic installation 200, so that first substrate 110 electrically connects with electronic installation 200.Offer a piece of advice it, the 4th assembly welding pad 114 of first substrate 110 electrically connects by first connection pad 202 of soldered ball 150a and electronic installation 200 respectively.
Then, a face down bonding of flexible circuit board 130 is connect (for example being the mode of utilizing spot welding) to first substrate 110, so that the flexible circuit board 130 and first substrate 110 electrically connect.Specifically, conductive material 140 is filled in the perforation 136, and the first assembly welding pad 132 of flexible circuit board 130 is by the 3rd assembly welding pad 112 electric connections of the conductive material 140 and first substrate 110.In the present embodiment, owing to flexible circuit board 130 is that mode by spot welding is fixed on first substrate 110, so flexible circuit board 130 need not to bear high temperature, can avoid Yin Gaowen reflow (reflow) and causes flexible circuit board 130 distortion or damage.
Then, element under test 300 is soldered on the second upper surface 120a or the second lower surface 120b of second substrate 120, so that second substrate 120 electrically connects with element under test 300.Specifically, in the present embodiment, element under test 300 for example is a chip packing-body, and soldered ball (or projection) 150b that has a plurality of sphere grid array kenels (BGA) on second connection pad 302 of this element under test 300, and the 7th assembly welding pad 125 of second substrate 120 (or the 8th assembly welding pad 127) electrically connects by second connection pad 302 of these soldered balls 150b and element under test 300 respectively.
At last, the opposite side with flexible circuit board 130 welds (for example being the mode of utilizing spot welding) to second substrate 120 again, so that the flexible circuit board 130 and second substrate 120 electrically connect.Specifically, conductive material 140 is filled in the perforation 136, and the second assembly welding pad 134 of flexible circuit board 130 is by the 5th assembly welding pad 122 (or the 6th assembly welding pad 124) electric connection of the conductive material 140 and second substrate 120.In the present embodiment, be fixed on second substrate 120, so flexible circuit board 130 need not to bear high temperature, can avoid the Yin Gaowen reflow and cause flexible circuit board 130 distortion or damage because flexible circuit board 130 is modes by spot welding.
In brief, in the present embodiment, because electronic installation 200 is to reach electric connection by testing electrical property module 100 with element under test 300, and second substrate 120 of testing electrical property module 100 has first group of semaphore measuring point 126 and second group of semaphore measuring point 128, therefore, electronic installation 200 and element under test 300 can be tested to each other electrical functionality by first group of semaphore measuring point 126 or second group of semaphore measuring point 128, and do not need as known technology, need to change the circuit layout of testing electrical property module or redesign new testing electrical property module and come measurement signal, can effectively reduce manpower, testing cost such as time and money.
In addition, because second substrate 120 of testing electrical property module 100 electrically connects flexible circuit board 130 and element under test 300 by the mode of welding, therefore, can be by changing second substrate 120 or changing the arrangement and the design of the weld pad on second substrate 120, promptly applicable to the different types of element under test 300 of test, so, except the usability and polytrope that can increase testing electrical property module 100, can also enlarge the range of application of testing electrical property module 100.In addition, the size of first substrate 110 also can be designed to the size as element under test 300, location or space problem when being welded in electronic installation 200 to avoid that first substrate 110 takes place.
In sum, because testing electrical property module of the present utility model is electrically connected to electronic installation and element under test, and second substrate of testing electrical property module has the semaphore measuring point, therefore, electronic installation can contact one group of semaphore measuring point with probe or plug by measuring instrument with element under test, to measure electrical functionality to each other.Compared to known technology, the utility model can still be kept original test function, and the appropriate signals gauge point can be provided not changing circuit layout or need not redesigning under the situation of new testing electrical property module, to reduce testing cost.In addition, because the utility model is a mode of utilizing spot welding, the flexible circuit board and first substrate and second substrate are electrically connected, therefore, flexible circuit board need not to bear high temperature, can avoid the Yin Gaowen reflow and cause flexible circuit board distortion or damage, and can avoid because of be subjected to BGA in addition the interference of extension cause the difficulty of locating and welding.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art are not in breaking away from the technical solutions of the utility model scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solutions of the utility model, according to technical spirit of the present utility model to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (9)
1. a testing electrical property module is suitable for testing the electrical functionality between an electronic installation and the element under test, it is characterized in that this testing electrical property module comprises:
One first substrate is electrically connected to this electronic installation;
One second substrate is electrically connected to this element under test, and this second substrate has at least one first group of semaphore measuring point;
One flexible circuit board, have the first assembly welding pad, the second assembly welding pad, a plurality of perforation and many circuits, this first assembly welding pad and this second assembly welding pad lay respectively at the two ends of those circuits, and be electrically connected to each other by those circuits, those perforations run through this first assembly welding pad and this second assembly welding pad respectively; An and conductive material, be filled in those perforations, this first assembly welding pad and this second assembly welding pad are respectively by this conductive material and this first substrate and the electric connection of this second substrate, and this element under test electrically connects with this electronic installation by this second substrate, this flexible circuit board, this first substrate, and this electronic installation and this element under test are tested to each other electrical functionality by this first group of semaphore measuring point.
2. testing electrical property module according to claim 1 is characterized in that wherein said second substrate has one second upper surface and one second lower surface.
3. testing electrical property module according to claim 2, it is characterized in that wherein said electronic installation has a plurality of first connection pads, this first substrate has the 3rd assembly welding pad that is disposed at one first upper surface and the 4th assembly welding pad that is disposed at one first lower surface, the 3rd assembly welding pad is respectively to this first assembly welding pad that should flexible circuit board, and electrically connect with this first assembly welding pad, the 4th assembly welding pad is respectively to this first connection pad that should electronic installation, and electrically connect with this first connection pad, the 3rd assembly welding pad and the 4th assembly welding pad are electrically connected to each other.
4. testing electrical property module according to claim 3 is characterized in that the 4th assembly welding pad of wherein said first substrate electrically connects by those first connection pads of a plurality of soldered balls and this electronic installation respectively.
5. testing electrical property module according to claim 2, it is characterized in that wherein said element under test has a plurality of second connection pads, this second substrate has the 5th assembly welding pad and the 8th assembly welding pad that is disposed at one second upper surface, and the 6th assembly welding pad and the 7th assembly welding pad that are disposed at one second lower surface, the 5th assembly welding pad or the 6th assembly welding pad are respectively to this second assembly welding pad that should flexible circuit board, and electrically connect with this second assembly welding pad, the 7th assembly welding pad or the 8th assembly welding pad be respectively to those second connection pads that should element under test, and electrically connect with those second connection pads.
6. testing electrical property module according to claim 5, it is characterized in that wherein said second substrate has more one second group of semaphore measuring point, this first group of semaphore measuring point is disposed at this second upper surface, and this second group of semaphore measuring point is disposed at this second lower surface, and the 5th assembly welding pad, the 6th assembly welding pad, the 7th assembly welding pad, the 8th assembly welding pad, this first group of semaphore measuring point and this second group of semaphore measuring point are electrically connected to each other.
7. testing electrical property module according to claim 5 is characterized in that the 7th assembly welding pad of wherein said second substrate or the 8th assembly welding pad electrically connect by this second connection pad of a plurality of soldered balls and this element under test respectively.
8. testing electrical property module according to claim 1 is characterized in that wherein said first substrate comprises a printed circuit board (PCB).
9. testing electrical property module according to claim 1 is characterized in that wherein said second substrate comprises a printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201457165U CN201477114U (en) | 2009-03-25 | 2009-03-25 | Electric property testing module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201457165U CN201477114U (en) | 2009-03-25 | 2009-03-25 | Electric property testing module |
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| Publication Number | Publication Date |
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| CN201477114U true CN201477114U (en) | 2010-05-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009201457165U Expired - Fee Related CN201477114U (en) | 2009-03-25 | 2009-03-25 | Electric property testing module |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103018581A (en) * | 2011-09-23 | 2013-04-03 | 丽台科技股份有限公司 | Testing jig of module circuit board |
| CN103338590A (en) * | 2013-06-14 | 2013-10-02 | 业成光电（深圳）有限公司 | Flexible circuit board and manufacturing method thereof |
| CN103675491A (en) * | 2012-09-07 | 2014-03-26 | 神讯电脑(昆山)有限公司 | Debugger for electronic component |
| CN103823149A (en) * | 2013-12-03 | 2014-05-28 | 华为技术有限公司 | Chip detection system and detection method |
| CN106231786A (en) * | 2016-09-07 | 2016-12-14 | 奥英光电（苏州）有限公司 | A kind of flexible PCB |
-
2009
- 2009-03-25 CN CN2009201457165U patent/CN201477114U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103018581A (en) * | 2011-09-23 | 2013-04-03 | 丽台科技股份有限公司 | Testing jig of module circuit board |
| CN103675491A (en) * | 2012-09-07 | 2014-03-26 | 神讯电脑(昆山)有限公司 | Debugger for electronic component |
| CN103675491B (en) * | 2012-09-07 | 2016-05-18 | 神讯电脑(昆山)有限公司 | Electronic devices and components debugger |
| CN103338590A (en) * | 2013-06-14 | 2013-10-02 | 业成光电（深圳）有限公司 | Flexible circuit board and manufacturing method thereof |
| CN103338590B (en) * | 2013-06-14 | 2016-12-28 | 业成光电（深圳）有限公司 | Flexible circuit board and manufacture method thereof |
| CN103823149A (en) * | 2013-12-03 | 2014-05-28 | 华为技术有限公司 | Chip detection system and detection method |
| CN106231786A (en) * | 2016-09-07 | 2016-12-14 | 奥英光电（苏州）有限公司 | A kind of flexible PCB |
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