CN101452011B - Probe card and circuit board - Google Patents
Probe card and circuit board Download PDFInfo
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- CN101452011B CN101452011B CN2007101967657A CN200710196765A CN101452011B CN 101452011 B CN101452011 B CN 101452011B CN 2007101967657 A CN2007101967657 A CN 2007101967657A CN 200710196765 A CN200710196765 A CN 200710196765A CN 101452011 B CN101452011 B CN 101452011B
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Abstract
The invention provides a probe card, a circuit board of which is divided clockwise into a first area, a second area, a third area and a fourth area, wherein a circuit layout pattern in the first area is corresponding to that in the third area, the circuit layout pattern in the second area is corresponding to that in the fourth area, while the circuit layout pattern in the first area is different from that in the second area. The circuit board design can be used for the probe card of an upper discharge needle, a lower discharge needle and a double discharge needle.
Description
Technical field
The invention relates to the circuit layout of the circuit board of a kind of probe, particularly a kind of probe.
Background technology
Generally speaking, the generation of integrated circuit (IC) products at first through the circuit layout design, enters the making that semiconductor factory carries out semiconductor technology and integrated circuit afterwards, after waiting to finish the making of wafer, then utilizes probe to detect.Have only tube core (die) meeting after section, the carrying out descendant key that test is good or process is repaired to close (bonding) and encapsulation steps such as (packaging); Even still must carry out final test (final testing) at last to be confirmed to be tube core and finished packaged die.
In simple terms, utilize probe test tested object, for example: tube core, employed key instrument comprises: probe, probe (prober), tester (tester).Wherein, " probe " comprises a circuit board and a plurality of probe, and it can be electrically connected measured object and tester; " probe " is responsible for measured object is moved to the tram of probe accurately, make probe on the probe can touch tube core in conjunction with weld pad (bonding pad); " tester " then is responsible for measured object transceiver electronics signal.Except aforesaid three key instruments, in test process, also can use miniature probe (picoprober) to test the whether normal operation of internal circuit of measured object in addition.
Probe can be considered as the interface card between measured object and the tester, and for the measured object with different integrated circuit (IC) design, the circuit layout on the circuit board of probe also must be made different designs.In addition, the probe of probe must have go up to discharge pin, down discharge pin, doublely go out three kinds of different forms of pin, so that the tester uses the zones of different of miniature probe (picoprober) test dies.
Yet existing probe is for identical integrated circuit (IC) design, the circuit board of probe must be at last discharge pin, discharge the pin test down, a kind of circuit layout of design on circuit board, and go out pin test, the another kind of circuit layout of design on circuit board at double.
Shown in Fig. 1 is tube core 10 to be measured, which is provided with first row and arranges in conjunction with weld pad 14 in conjunction with weld pad 12, the second, and arrange in conjunction with weld pad 14 in conjunction with weld pad 12 and second along first row, and tube core 10 to be measured can be divided into zone 16,17,18.Fig. 2 a, 2b illustrate respectively and are used for discharging pin, discharge pin test and the double circuit layout synoptic diagram that goes out the existing probe circuit board of pin test down.Please consult Fig. 2 a and Fig. 1 simultaneously, shown in Fig. 2 a, the circuit layout of the circuit board 21 of probe 20 is divided into two zones, zone 22 and zone 24, wherein regional 22 interior circuit layouts comprise corresponding respectively first row in conjunction with the weld pad 12 and second circuit of arranging in conjunction with weld pad 14, these circuit mixing are arranged in the zone 22, and in addition, the circuit in the circuit in the zone 24 and regional 22 is corresponding mutually.
The test that above-described probe 20 is used to discharge pin in the prior art and discharges pin down, when last discharge pin is tested, will external cable on the zone 22 of probe 20 to connect tester, and because probe can block zone 16,17, therefore miniature probe can only be put and survey zone 18, and when descend discharging the pin test, will external cable on the zone 24 of probe 20 to connect tester, and because probe can block zone 17,18, so miniature probe can only be put survey zone 16.If utilize probe 20 to go out pin mode test zone 17 with double, the zone 22 of probe 20 and zone 24 all must external cables, and like this, cable will occupy the placement space of miniature probe, produce operational problem.
Therefore, according to prior art, must design a probe again comes the double test that goes out pin is carried out in zone 17, please consult Fig. 2 b and Fig. 1 simultaneously, shown in Fig. 2 b, the circuit board 31 of probe 30 is divided into four zones, be respectively zone 32,34,36,38, wherein the circuit layout in the zone 32 comprises the circuit in conjunction with weld pad 12 corresponding to first row, the circuit layouts of zone in 34 comprise the circuit in conjunction with weld pad 14 corresponding to second row, and different with probe 20 is: corresponding to first row in conjunction with the circuit of weld pad 12 and corresponding to second row in conjunction with the circuit of weld pad 14 for being arranged at zones of different respectively.In addition, circuit in the zone 38 and the circuit in the zone 32 are corresponding mutually; Circuit in circuit in the zone 36 and the zone 34 is corresponding mutually, above-described probe 30 is to be used to carry out the double test that goes out pin, when test zone 17 in the prior art, with zone 32,34 external cables, 36,38 its spaces, zone that do not connect cable can be used to miniature probe; Also can be during this external test zone 17 with zone 36,38 external cables, 32,34 its spaces, zone that do not connect cable can be used to miniature probe.
Yet, with regard to existing probe, for identical integrated circuit (IC) design, just must spended time with become at least two kinds of the design to have the circuit board of different circuit layouts.
Summary of the invention
In order to overcome the shortcoming of aforementioned conventional probe, the invention provides a kind of circuit-board laying-out, it can be at last discharge pin, discharge down pin and double go out in the pin test general, for the identical integrated circuit (IC) design of test, needn't be again as prior art at last discharge pin, discharge pin and doublely go out at least two kinds of circuit boards of pin Test Design down.Like this, can save design funds and cost of manufacture.
In addition, test because use to have with a kind of probe of circuit-board laying-out, the signal Transfer Quality is more stable than prior art, therefore the present invention also can improve test analysis quality and stability, and the probe that has with a kind of circuit-board laying-out of the present invention can not have influence on the mode of operation that has miniature probe now.
According to a preferred embodiment of the invention, the invention provides a kind of probe, comprise: circuit board, wherein this circuit board comprises: the first area comprises the first wiring pattern; Second area comprises the second circuit wiring pattern; The 3rd zone comprises the tertiary circuit wiring pattern; The 4th zone comprises the 4th wiring pattern, wherein this first area, this second area, the 3rd zone become arranged clockwise in regular turn with the 4th zone, wherein this first wiring pattern is identical with this tertiary circuit wiring pattern, and this second circuit wiring pattern is identical with the 4th wiring pattern; A plurality of test contacts (connecter) are separately positioned in this first area, this second area, the 3rd zone and the 4th zone, and these test contacts can be electrically connected to tester (tester) via many cables; Perforate is arranged on the center of this circuit board; And a plurality of probes, wherein these probes are electrically connected to this circuit board.
Description of drawings
Fig. 1 shows the position in conjunction with weld pad of existing tube core.
Fig. 2 a shows the circuit layout synoptic diagram of existing probe.
Fig. 2 b shows another circuit layout synoptic diagram of existing probe.
Fig. 3 shows probe device synoptic diagram of the present invention.
The enlarged diagram of the equipment component of Fig. 4 displayed map 3.
The schematic top plan view of tube core in Fig. 5 displayed map 4.
The schematic top plan view of Fig. 6 displayed map 4 middle probe cards.
Fig. 7 to Figure 10 shows the mode of operation of probe of the present invention.
Embodiment
Fig. 3 shows the synoptic diagram of probe device, as shown in Figure 3, probe 40 upper support wafers 42, probe 44 is arranged on the wafer 42, and microscope 46 is arranged on the probe 44, in addition, has cable 48 to be electrically connected to tester 50 on the probe 44 in addition.
The enlarged diagram of the equipment component of Fig. 4 displayed map 3.
As shown in Figure 4, detector 40 upper support wafers 42 wherein comprise a plurality of tube cores 60 in the wafer 42, be provided with a plurality of first rows and arrange in conjunction with weld pad 64 in conjunction with weld pad 62 and a plurality of second on tube core 60.Probe 44, be arranged on the wafer 42, wherein probe 44 comprises circuit board 80 and a plurality of probe 45, a contact first row of probe 45 arranges in conjunction with weld pad 64 in conjunction with weld pad 62 or second, the other end is then by metal pad 47, be electrically connected to circuit board 80, the above discharge of present embodiment pin is an example, but is not limited to discharge the pin test.Under discharge pin, doublely go out pin and also test with same principle.In addition, when testing, miniature probe 52 also can be used to carry out debugging.
The schematic top plan view of tube core 60 in Fig. 5 displayed map 4.As shown in Figure 5, tube core 60 is provided with a plurality of first rows and arranges in conjunction with weld pad 64 in conjunction with weld pad 62 and a plurality of second, by the setting of two rows in conjunction with weld pad, crystal grain 60 can be divided into three zones, be respectively zone 66,68,70, and when carrying out wafer sort, will use miniature probe to put respectively and survey zone 66,68,70.
The schematic top plan view of Fig. 6 displayed map 4 middle probe cards 44.As shown in Figure 6, probe 44 comprises circuit board 80 and a plurality of probe 45, wherein circuit board 80 comprises first area 82, second area 84, the 86 and the 4th zone 88, the 3rd zone, and the opening 90 that is arranged on this circuit board center, can see the probe 45 of electrical ties by opening 90 places to circuit board 80, wherein the upper surface of 82 circuit board 80 is provided with a plurality of first test contacts 92 in the first area, the upper surface of the circuit board 80 of second area 84 is provided with a plurality of second test contacts 94, the upper surface of the circuit board 80 in the 3rd zone 86 is provided with a plurality of the 3rd test contacts 96, the upper surface of the circuit board 80 in the 4th zone 88 is provided with a plurality of the 4th test contacts 88, above-mentioned these test contacts are when follow-up wafer sort, to insert external cable, so that the electrical ties between circuit board 80 and the tester to be provided.
Please consult Fig. 5 simultaneously, other is in above-mentioned zone in circuit board 80, be provided with respectively corresponding to single wiring pattern in conjunction with weld pad, for example in first area 82, setting is corresponding to the first wiring pattern (in Fig. 6 with point-like indicate) of first row in conjunction with weld pad 62, in second area 84, setting is corresponding to single wiring pattern in conjunction with weld pad, its with first area 82 in be provided with different corresponding to single wiring pattern in conjunction with weld pad, for example second row is in conjunction with the second circuit wiring pattern (indicating with white among the 6th figure) of weld pad 64, otherwise, if in the first area 82, setting then is provided with the first wiring pattern in conjunction with weld pad 62 corresponding to first row corresponding to the second circuit wiring pattern of second row in conjunction with weld pad 64 in the second area 84; Similarly, the first wiring pattern (indicating with point-like) in conjunction with weld pad 62 corresponding to first row is set in the 3rd zone 86, the second circuit wiring pattern (indicating with white) in conjunction with weld pad 64 corresponding to second row is set in the 4th zone 88, otherwise, if in the 3rd zone 86, setting is corresponding to the second circuit wiring pattern of second row in conjunction with weld pad 64, the first wiring pattern in conjunction with weld pad 62 corresponding to first row then is set in the 4th zone 88, it should be noted that: the invention is characterized in the first wiring pattern in the first area 82 and the first wiring pattern in the 3rd zone 86 all be corresponding to same row in conjunction with weld pad, for example: first row is in conjunction with weld pad 62, second circuit wiring pattern in second circuit wiring pattern in the second area 84 and the 4th zone 88, all be corresponding to same row in conjunction with weld pad, for example: second row in conjunction with weld pad 64.In addition, according to another preferred embodiment of the invention, wiring pattern in the first area 82 also can be different with the wiring pattern in the 3rd zone 86, if first area 82 in wiring pattern and the wiring pattern in the 3rd zone 86 all be corresponding to same row in conjunction with weld pad; Similarly, wiring pattern in the second area 84 also can be different with the wiring pattern in the 4th zone 88, as long as wiring pattern and the wiring pattern in the 4th zone 88 in the second area 84 all are pairing in conjunction with weld pad corresponding to the wiring pattern that is different from the first area 82, and the wiring pattern in wiring pattern in the second area 84 and the 4th zone 88 must get final product in conjunction with weld pad corresponding to same row.
It should be noted that: though shown probe is last discharge pin type among Fig. 6, discharge pin, discharge pin, the double test that goes out pin down but aforesaid circuit board 80 can be applicable to simultaneously, as long as with the connected mode of probe and circuit board 80 according to needs be arranged to the discharge pin, down discharge pin, doublely go out pin, that is to say according to a preferred embodiment of the invention, no matter be go up to discharge pin, discharge pin, the double probe that goes out pin down, it all is to use circuit board 80.Like this, can save the cost of circuit design and can to keep test mass stable.
Following Fig. 7 to Fig. 9 utilizes probe of the present invention to go up to discharge pin with illustrating respectively, discharges pin, the double test that goes out pin down.
Show that as Fig. 7 going up the discharge pin with probe 44 tests.Please consult Fig. 3, Fig. 5 and Fig. 7 simultaneously, when last discharge pin is tested, cable 48 is connected to first test contacts 92 and second test contacts 94, at this moment, the zone 66,68 on the tube core 60 will be covered by probe, and the miniature probe sniffing then can be used in zone 70.
Show that as Fig. 8 discharging pin for 104 times with probe tests.Probe 104 is identical with the structure of probe 44, all has circuit board 80, and different is that the probe 105 of probe 104 is for discharging the pin type down.Please consult Fig. 3, Fig. 5 and Fig. 8 simultaneously, when following discharge pin is tested, cable 48 is connected to the 3rd test contacts 96 and the 4th test contacts 98, at this moment, the zone 68,70 on the tube core 60 will be covered by probe, and the miniature probe sniffing then can be used in zone 66.
Show with probe 114 as Fig. 9 and to carry out the double pin test that goes out.Probe 114 is identical with the structure of probe 44, all has circuit board 80, and different is, the probe 115 of probe 114 goes out the pin type for double.Please consult Fig. 3, Fig. 5 and Fig. 9 simultaneously, carry out doublely when going out the pin test, cable 48 is connected to first test contacts 92 and the 4th test contacts 98, at this moment, the zone 66,70 on the tube core 60 will be covered by probe, and the miniature probe sniffing then can be used in zone 68.
Figure 10 shows with probe 114 and carries out double another preferred embodiment that goes out the pin test.Probe 114 is identical with the structure of probe 44, all has circuit board 80, and different is, the probe 115 of probe 114 goes out the pin type for double.Please consult Fig. 3, Fig. 5 and Figure 10 simultaneously, carry out doublely when going out the pin test, cable 48 is connected to second test contacts 94 and the 3rd test contacts 96, at this moment, the zone 66,70 on the tube core 60 will be covered by probe, and the miniature probe sniffing then can be used in zone 68.
In sum, circuit board 80 of the present invention can cooperate the needed pin mode that goes out, make and discharge pin, discharge pin, the double probe that goes out pin down, the zones of different of difference test dies, the design cost of its circuit board is low than the circuit board meter design cost of prior art, and more stable test result is provided.
The above only is the preferred embodiments of the present invention, and all equivalent variations and modifications of making according to claim of the present invention all should belong to covering scope of the present invention.
Claims (8)
1. probe comprises:
Circuit board, wherein this circuit board comprises:
The first area comprises the first wiring pattern;
Second area comprises the second circuit wiring pattern;
The 3rd zone comprises the tertiary circuit wiring pattern;
The 4th zone comprises the 4th wiring pattern, wherein this first area, this second area, the 3rd zone become arranged clockwise in regular turn with the 4th zone, wherein this first wiring pattern is corresponding to this tertiary circuit wiring pattern, and this second circuit wiring pattern is corresponding to the 4th wiring pattern;
A plurality of test contacts are separately positioned in this first area, this second area, the 3rd zone and the 4th zone, and these test contacts can be electrically connected to tester via many cables;
Perforate is arranged on the center of this circuit board; With
A plurality of probes, wherein these probes are electrically connected to this circuit board;
Wherein this first wiring pattern and this tertiary circuit wiring pattern all are positioned at the row of first on the tube core and combine weld pad corresponding to a plurality of, and this second circuit wiring pattern and the 4th wiring pattern are positioned at second on this tube core and arrange and combine weld pad corresponding to a plurality of.
2. probe as claimed in claim 1, wherein these probes are last discharge pin type.
3. probe as claimed in claim 1, wherein these probes are for discharging the pin type down.
4. probe as claimed in claim 1, wherein these probes are the double pin type that goes out.
5. probe as claimed in claim 1, wherein these probes are by a plurality of metal pads of the lower surface that is arranged on this circuit board, are electrically connected to this circuit board.
6. circuit board comprises:
The first area comprises the first wiring pattern;
Second area comprises the second circuit wiring pattern;
The 3rd zone comprises the tertiary circuit wiring pattern;
The 4th zone comprises the 4th wiring pattern, wherein this first area, this second area, the 3rd zone become arranged clockwise in regular turn with the 4th zone, wherein this first wiring pattern and this tertiary circuit wiring pattern are all corresponding to first weld pad, and this second circuit wiring pattern and the 4th wiring pattern are all corresponding to second weld pad;
A plurality of test contacts are separately positioned in this first area, this second area, the 3rd zone and the 4th zone, and these test contacts can be electrically connected to tester via many cables; Be arranged on the center of this circuit board with perforate.
7. circuit board as claimed in claim 6, wherein this first weld pad is a plurality ofly to be positioned at first on tube core row in conjunction with weld pad.
8. circuit board as claimed in claim 7, wherein this second weld pad is a plurality ofly to be positioned at second on this tube core row in conjunction with weld pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101967657A CN101452011B (en) | 2007-12-06 | 2007-12-06 | Probe card and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101967657A CN101452011B (en) | 2007-12-06 | 2007-12-06 | Probe card and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101452011A CN101452011A (en) | 2009-06-10 |
| CN101452011B true CN101452011B (en) | 2010-12-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101967657A Active CN101452011B (en) | 2007-12-06 | 2007-12-06 | Probe card and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101452011B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1808128A (en) * | 2005-01-18 | 2006-07-26 | 旺矽科技股份有限公司 | Probe card |
-
2007
- 2007-12-06 CN CN2007101967657A patent/CN101452011B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1808128A (en) * | 2005-01-18 | 2006-07-26 | 旺矽科技股份有限公司 | Probe card |
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| Publication number | Publication date |
|---|---|
| CN101452011A (en) | 2009-06-10 |
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